WO2014073896A1 - Touch panel comprising pad electrode having protective layer - Google Patents

Touch panel comprising pad electrode having protective layer Download PDF

Info

Publication number
WO2014073896A1
WO2014073896A1 PCT/KR2013/010100 KR2013010100W WO2014073896A1 WO 2014073896 A1 WO2014073896 A1 WO 2014073896A1 KR 2013010100 W KR2013010100 W KR 2013010100W WO 2014073896 A1 WO2014073896 A1 WO 2014073896A1
Authority
WO
WIPO (PCT)
Prior art keywords
sensor
substrate
pad electrode
touch panel
layer
Prior art date
Application number
PCT/KR2013/010100
Other languages
French (fr)
Korean (ko)
Inventor
김근호
김현수
고용남
김진서
이재영
Original Assignee
(주)인터플렉스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020120125877A external-priority patent/KR20140059428A/en
Priority claimed from KR1020120147595A external-priority patent/KR20140078332A/en
Application filed by (주)인터플렉스 filed Critical (주)인터플렉스
Publication of WO2014073896A1 publication Critical patent/WO2014073896A1/en

Links

Images

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416Control or interface arrangements specially adapted for digitisers
    • G06F3/04164Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads

Definitions

  • the present invention relates to a touch panel, and more particularly, to a touch panel including a pad electrode having a protective layer which increases the reliability of the pad electrode and increases the productivity of the touch panel using the pad electrode having the protective layer.
  • the touch panel is a device for inputting coordinate data by touching a surface of a display panel included in electronic devices such as a smartphone, a tablet computer, a game machine, a learning aid device, and a camera with a hand or a pen.
  • electronic devices such as a smartphone, a tablet computer, a game machine, a learning aid device, and a camera with a hand or a pen.
  • touch panels are widely used in that they can be easily operated and widely applied to various display devices.
  • the touch panel includes a sensor electrode provided on a substrate made of a light transmissive material, and a pad electrode to which the sensor electrode is connected.
  • the pad electrode is connected to the sensor electrode and is a part for connecting the touch panel with other driving means.
  • the pad electrode is formed of a conductive material such as metal, and due to the characteristics of the metal, corrosion and the like occur during storage, causing the pad electrode to be defective. Therefore, in order to protect the pad electrode, a protective layer may be formed on the pad electrode. In this case, since the protective layer is mostly an insulating material, there is a problem that the electrical conductivity of the pad electrode is lowered.
  • an adhesive film is used to connect the pad electrode and other driving means.
  • An anisotropic conductive film (ACF) is generally used.
  • the anisotropic conductive film is a typical material that is widely used in semiconductor mounting as an adhesive and a conductive material.
  • Example 2 of the present invention after the pressure-sensitive adhesive film is pressed, a touch panel having improved pad electrode reliability and increased productivity without an additional process is proposed.
  • the protective layer may include a gold (Au) layer.
  • the plurality of sensor electrodes may include: a plurality of first sensor electrodes arranged along a first direction on the substrate; And a plurality of second sensor electrodes spaced apart from the plurality of first sensor electrodes on the substrate.
  • the plurality of first sensor electrodes and the plurality of second sensor electrodes may cross each other in an electrically insulated state.
  • the conductor layer may include at least one of a transparent conductive oxide layer and a metal layer.
  • the transparent conductive oxide layer may include any one of indium tin oxide (ITO), indium zinc oxide (IZO), al-doped znO (AZO), and transparent conductive oxide (TCO).
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • AZO al-doped znO
  • TCO transparent conductive oxide
  • the metal layer may include any one of Al, Mo, Cu, Cr, Nd, and alloys thereof.
  • a sensor unit including a plurality of sensor electrodes and a pad electrode formed on a substrate; And a driving unit electrically connected to the sensor unit, wherein the pad electrode comprises: a conductor layer formed on the substrate; And a protective layer formed on the conductor layer.
  • the protective layer may include an insulating layer.
  • the sensor unit and the driving unit may be connected via an adhesive film.
  • the adhesive film may include an adhesive matrix; And conductive particles dispersed in the adhesive matrix.
  • the pressure sensitive adhesive matrix may include any one of an acrylic pressure sensitive adhesive, a silicone pressure sensitive adhesive, a urethane pressure sensitive adhesive and a rubber pressure sensitive adhesive.
  • the conductive particles may include any one of Cu, Ni, Co, Au, Ag, Cr, Pd, and alloys thereof.
  • the conductive particles may have an average diameter of 5 ⁇ 500 ⁇ m.
  • the driving unit may include a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • a sensor unit including a plurality of sensor electrodes formed on a substrate
  • the touch panel according to the first exemplary embodiment of the present invention may prevent corrosion of the pad electrode and improve electrical conductivity of the pad electrode.
  • the pad electrode can be driven without coating the insulating film.
  • the touch panel according to the second embodiment of the present invention may prevent corrosion of the pad electrode and improve electrical conductivity of the pad electrode.
  • the pad electrode can be driven without coating the insulating film.
  • FIG. 1 is a cross-sectional view of a pad electrode including a protective layer according to an embodiment of the present invention.
  • FIG. 2 is a plan view of a touch panel according to an exemplary embodiment of the present invention.
  • FIG. 3 is a cross-sectional view taken along the line II of FIG. 2.
  • FIG. 4 is a cross-sectional view of a pad electrode according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a pad electrode according to another embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a pad electrode according to another embodiment of the present invention.
  • FIG. 7 is a view showing a process of coupling the sensor unit and the driving unit according to an embodiment of the present invention.
  • FIG. 8 is a cross-sectional view of a pad electrode according to an embodiment of the present invention.
  • FIG. 9 is a cross-sectional view of the pad electrode, the pressure-sensitive adhesive film and the driving unit before pressing according to an embodiment of the present invention.
  • FIG. 10 is a cross-sectional view of the pad electrode, the pressure-sensitive adhesive film and the driving unit after the compression according to an embodiment of the present invention.
  • FIG. 11 is a cross-sectional view of a portion A shown in FIG. 10 according to another embodiment of the present invention.
  • Terminology used herein is a term used to express an embodiment of the present invention, which may vary according to a user, an operator's intention, or a custom in the field to which the present invention belongs. Therefore, the definition of the terms should be made based on the contents throughout the specification.
  • a layer or component is described as being on another layer or 'on' of a component, not only when the layer or component is disposed in direct contact with the other layer or component, It means including all until the case where a 3rd layer is interposed.
  • FIG. 1 is a cross-sectional view of a pad electrode including a protective layer according to an embodiment of the present invention.
  • a protective layer 440 is disposed on the pad electrode 400.
  • the protective layer includes a gold layer or an insulating layer.
  • the protective layer 440 includes a gold layer
  • the protective layer 440 includes an insulating layer. Detailed description of each embodiment is described in detail below.
  • the first direction is determined in a direction from left to right in the drawing
  • the second direction is determined in a direction from top to bottom in the drawing.
  • the direction illustrated in FIG. 2 is an example of the first direction and the second direction, and the first direction and the second direction may be determined to be different from those of the example of FIG. 2.
  • the touch panel 10 is a substrate 100; A plurality of sensor electrodes 200 formed on the substrate 100; And a plurality of pad electrodes 400 connected to the plurality of sensor electrodes 200, wherein the plurality of pad electrodes 400 are formed on the conductor layer 430 and the conductor layer on the substrate 100.
  • Gold (Au) layer 440 formed on the (430).
  • the substrate 100 may be formed of any one of a polymer film, plastic, or glass.
  • the substrate 100 is described using an example of using a polymer film.
  • the polymer film used in this example is PET.
  • the plurality of sensor electrodes 200 are arranged on the substrate 100 in a first direction, and a plurality of first sensor electrodes 210 and the plurality of first sensor electrodes 210 on the substrate 100. And a plurality of second sensor electrodes 220 arranged to be spaced apart from each other, and the first bridge 230 may connect the plurality of first sensor electrodes 210, and the second bridge 240 may include the plurality of second sensors.
  • the sensor electrode 220 may be connected.
  • the shapes of the first sensor electrode 210 and the second sensor electrode 220 are illustrated in a rhombus shape in FIG. 2, the shapes of the first sensor electrode 210 and the second sensor electrode 220 are not necessarily limited to the rhombus shape, but may be formed in various shapes such as triangle, square, rectangle, and circle.
  • the number and size of the first sensor electrode 210 and the second sensor electrode 220 may vary depending on the resolution of the touch panel 100 and the type and size of the display to which the touch panel is applied.
  • the first sensor electrode 210, the second sensor electrode 221, the first bridge 230, and the second bridge 240 may be formed of a metal or a transparent material having conductivity.
  • Transparent conductive oxide (TCO) can be used as the transparent material having such conductivity.
  • TCO transparent conductive oxide
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • ZnO zinc oxide
  • the first sensor electrode 210, the second sensor electrode 221, the first bridge 230, and the second bridge 240 may be formed of the same material or may be formed of different materials. In consideration of manufacturing convenience, the first sensor electrode 210, the second sensor electrode 221, the first bridge 230, and the second bridge 240 may be formed of the same material.
  • the first sensor electrode 210, the second sensor electrode 221, the first bridge 230, and the second bridge 240 are formed by sputtering or depositing a transparent conductive oxide on the substrate 100.
  • the touch panel 300 according to the exemplary embodiment of the present invention illustrated in FIG. 2 includes a wiring 300.
  • the wiring 300 includes a first wiring 310 and a second wiring 320.
  • the wire 300 may connect the plurality of sensor electrodes 200 and the plurality of pad electrodes 400.
  • the plurality of pad electrodes 400 may be divided into a first pad electrode 420 and a second pad electrode 430.
  • the first wire 310 connects the plurality of first sensor electrodes 210 and the first pad electrode 410
  • the second wires 320 connect the plurality of second sensor electrodes 220 and the second pad electrode ( 420 may be connected.
  • the first wires 311, 312, 313, 314, and 315 are connected to one end of the first sensor electrode 210 and electrically connected to the first pad electrodes 411, 412, 413, 414, and 415.
  • the second wires 321, 322, 323, 324 and 325 are connected to one end of the second sensor electrode 220 and electrically connected to the second pad electrodes 421, 422, 423, 424 and 425.
  • FIG. 3 is a cross-sectional view taken along the line II of FIG. 2.
  • the plurality of first sensor electrodes 210 and the plurality of second sensor electrodes 220 may be arranged on the substrate 100 while crossing each other while being electrically insulated from each other.
  • first bridge 230 is positioned on the second bridge, the first bridge 230 and the second bridge 240 may be formed on the same plane.
  • the plurality of second sensor electrodes 220 and the second bridge 240 may be formed on the same plane, and are simultaneously formed so that the second sensor electrode 220 and the second bridge 240 may be integrally manufactured. have.
  • a plurality of pad electrodes 400 may include a conductor layer 430 formed on the substrate 100 and a gold (AU) layer formed on the conductor layer 430. 444.
  • the conductor layer 430 includes a transparent conductive oxide layer 431 and a metal layer 432.
  • the transparent conductive oxide layer 431 may be formed on a substrate using any one of a spin coating process, a printing process, a sputtering process, a chemical vapor deposition process, an atomic layer deposition process, and a vacuum deposition process.
  • the transparent conductive oxide layer 431 may include any one of indium tin oxide (ITO), indium zinc oxide (IZO), al-doped znO (AZO), and transparent conductive oxide (TCO).
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • AZO al-doped znO
  • TCO transparent conductive oxide
  • the metal layer 432 may be formed on the transparent conductive oxide layer 431 using any one of a spin coating process, a printing process, a sputtering process, a chemical vapor deposition process, an atomic layer deposition process, and a vacuum deposition process. .
  • the metal layer 432 may facilitate adhesion of the transparent conductive oxide layer 431 to the gold layer 441.
  • the metal layer 432 may include any one of Al, Mo, Cu, Cr, Nd, and alloys thereof.
  • a gold layer 441 may be formed on the metal layer 432 using any one of a sputtering process, a deposition process, and a photolithography process.
  • the gold layer 441 protects the pad electrode 400 to prevent corrosion and extend life.
  • the gold layer 441 improves electrical conductivity of the pad electrode 400.
  • FIG. 5 is a cross-sectional view of a pad electrode according to another embodiment of the present invention.
  • a transparent conductive oxide layer 431 may be formed on the substrate 100, and a gold layer 441 may be formed on the transparent conductive oxide layer 431.
  • FIG. 6 is a cross-sectional view of a pad electrode according to another embodiment of the present invention.
  • a metal layer 432 may be formed on a substrate 100, and a gold layer 441 may be formed on the metal layer 432.
  • the pad electrode 400 may use a flexible printed circuit board (FPCB) when connected to the driving means.
  • FPCB flexible printed circuit board
  • Au gold
  • the touch panel 10 according to the exemplary embodiment of the present invention includes a sensor unit 20 and a driver 30.
  • the sensor unit 20 includes a substrate 100, a sensor electrode 200, and a pad electrode 400, and the sensor electrode 200 and the pad electrode 400 are formed on the substrate 100.
  • the driving unit 30 includes a driving substrate 31, a driving circuit 32, and a driving electrode 33, and is electrically connected to the sensor unit 20.
  • the driving unit 30 may include a flexible printed circuit board (FPCB).
  • FPCB flexible printed circuit board
  • the sensor unit 20 and the driving unit 30 are connected via the pad electrode 400 and the driving electrode 33.
  • the driving unit 30 is positioned near the sensor unit 20 and the driving unit 30 is rotated 180 degrees to compress the pad electrode 400 and the driving electrode 300
  • the sensor electrode 200 is the pad electrode 400.
  • the driving electrode 33 are electrically connected to the driving circuit 330.
  • the shape of the sensor electrode 200, the pad electrode 400, and the driving electrode 33 is illustrated in a rectangular shape, but the shape of the sensor electrode 200, the pad electrode 400, and the driving electrode 33 is not necessarily limited to the rectangular shape and may be formed in various shapes such as a triangle, a square, and a circle.
  • the number and size of the sensor electrode 200, the pad electrode 400, and the driving electrode 33 may vary depending on the resolution of the touch panel 10 and the type and size of the display to which the touch panel is applied.
  • the pad electrode 400 includes a conductor layer 430 and an insulating layer 442.
  • the pad electrode 400 is formed on the substrate 100.
  • the conductor layer 430 is formed on the substrate 100, and may be formed of a transparent conductive oxide layer, a metal layer, and a combination thereof.
  • the transparent conductive oxide layer may be formed on the substrate 100 using any one of a spin coating process, a printing process, a sputtering process, a chemical vapor deposition process, an atomic layer deposition process, and a vacuum deposition process.
  • the transparent conductive oxide layer may include any one of indium tin oxide (ITO), indium zinc oxide (IZO), al-doped znO (AZO), and transparent conductive oxide (TCO).
  • ITO indium tin oxide
  • IZO indium zinc oxide
  • AZO al-doped znO
  • TCO transparent conductive oxide
  • the metal layer may be formed on the substrate 100 or on the transparent conductive oxide layer using any one of a spin coating process, a printing process, a sputtering process, a chemical vapor deposition process, an atomic layer deposition process, and a vacuum deposition process. .
  • the insulating layer 442 is formed on the conductor layer 430 and prevents corrosion of the pad electrode 400. In addition, through the insulating layer 442, the pad electrode 400 well withstands temperature changes and improves reliability. Since the pad electrode 400 including the insulating layer 442 is formed before the sensor unit 20 and the driving unit 30 are compressed, no additional process is required after the pressing and the productivity of the touch panel 10 is reduced. This is improved.
  • the adhesive film 500 includes an adhesive matrix 510 and conductive particles 520, and the sensor unit 20 and the driving unit 30 are connected through the adhesive film 500.
  • the adhesive matrix 510 may include any one of an acrylic adhesive, a silicone adhesive, a urethane adhesive, and a rubber adhesive.
  • the conductive particles 520 are dispersed in the adhesive matrix 510 and serve as a medium for electrically connecting the pad electrode 400 and the driving electrode 33.
  • the conductive particles 520 may include any one of Cu, Ni, Co, Au, Ag, Cr, Pd, and alloys thereof, and may have an average diameter of about 5 ⁇ m to about 500 ⁇ m.
  • FIG. 10 is a cross-sectional view of the pad electrode, the pressure-sensitive adhesive film and the driving unit after the compression according to an embodiment of the present invention.
  • the pad electrode 400 and the driving electrode 33 are adhered to each other through an adhesive film 500 and are electrically connected to each other.
  • the adhesive matrix 510 abuts on and adheres to the substrate 100, the pad electrode 400, the driving substrate 31, and the driving electrode 33.
  • a portion of the conductive particles 520 is in direct contact with the pad electrode 400 and the driving electrode 33 in a compressed state, and electrically connects the pad electrode 400 and the driving electrode 33 to each other.
  • the conductive particles 520 may be partially embedded in the insulating layer 442 of the pad electrode 400. The remaining conductive particles 520 are still dispersed in the adhesive matrix 510.
  • FIG. 11 is a cross-sectional view of a portion A shown in FIG. 10 according to another embodiment of the present invention.
  • the conductive particles 520 are compressed between the insulating layer 442 and the driving electrode 33.
  • the conductive particles 520 may have various sizes, and the conductive particles 520 of various sizes may be compressed between the pad electrode 400 and the driving electrode 33. Since the insulating layer 442 is formed at about 0.05 to 0.3 ⁇ m, the conductive particles 520 have no obstacle in contact with the conductor layer 430, and electrically connect the conductor layer 430 and the driving electrode 33 to each other. Connect it.
  • a plurality of sensor electrodes 200 are formed on the substrate 100, and the sensor unit 20 is prepared.
  • a pad electrode 400 including an insulating layer 231 is formed on the substrate 100.
  • the conductor layer 430 is formed on the substrate 100, and the insulating layer 231 is formed on the conductor layer 430.
  • the driver 30 is electrically connected to the sensor unit 20.
  • a driving circuit 32 is formed on the driving substrate 31, and a driving electrode 33 connected to the driving circuit 32 is formed on the driving substrate 31.
  • the adhesive film 500 is disposed between the sensor unit 20 and the driving unit 30.
  • the sensor unit 20, the adhesive film 500, and the driving unit 30 are attached.
  • the attached sensor unit 20, the adhesive film 500, and the driving unit 30 are compressed.
  • the sensor unit 20 and the driving unit 30 are electrically connected, and due to the pad electrode 400 including the insulating layer 442, the touch panel 10 may be produced without an additional insulation coating process. Can be.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)

Abstract

Provided is a touch panel comprising: a substrate; a plurality of sensor electrodes formed on the substrate; and a plurality of pad electrodes connected to the plurality of sensor electrodes, wherein the plurality of pad electrodes comprises a conductive layer formed on the substrate and a protective layer formed on the conductive layer.

Description

보호층을 갖는 패드 전극을 구비하는 터치 패널 Touch Panel With Pad Electrode With Protective Layer
본 발명은 터치 패널에 관한 것으로, 보다 상세하게는, 보호층을 갖는 패드 전극을 사용하여 패드 전극의 신뢰성을 높이고 터치패널의 생산성을 높이도록 한 보호층을 갖는 패드 전극을 포함하는 터치 패널에 관한 것이다.The present invention relates to a touch panel, and more particularly, to a touch panel including a pad electrode having a protective layer which increases the reliability of the pad electrode and increases the productivity of the touch panel using the pad electrode having the protective layer. will be.
터치 패널은 스마트폰, 태블릿 컴퓨터, 게임기, 학습보조장치 및 카메라 등의 전자 장치에 구비된 표시 패널의 표면을 손이나 펜 등으로 터치함으로써, 좌표 데이터를 입력하는 장치이다. 이러한 터치 패널은 조작이 용이하고 각종 디스플레이 장치에 폭넓게 응용될 수 있다는 점에서 널리 사용되고 있다. The touch panel is a device for inputting coordinate data by touching a surface of a display panel included in electronic devices such as a smartphone, a tablet computer, a game machine, a learning aid device, and a camera with a hand or a pen. Such touch panels are widely used in that they can be easily operated and widely applied to various display devices.
일반적으로 터치 패널은 광 투과성 소재로 된 기판 상에 구비된 센서전극, 상기 센서전극이 연결된 패드전극을 포함한다.In general, the touch panel includes a sensor electrode provided on a substrate made of a light transmissive material, and a pad electrode to which the sensor electrode is connected.
상기 패드전극은 상기 센서전극과 연결되어 있으며, 터치패널을 다른 구동수단과 연결하기 위한 부분이다. 상기 패드전극은 금속 등의 도전재에 의하여 형성되는데, 금속의 특성상 보관 중에 부식 등이 일어나 상기 패드전극의 불량을 유발한다. 따라서 상기 패드전극을 보호하기 위하여 상기 패드전극 상에 보호층을 형성할 수 있는데, 이 경우 보호층이 대부분 절연재인 관계로 상기 패드전극의 전기전도성이 낮아지는 문제점이 있었다.The pad electrode is connected to the sensor electrode and is a part for connecting the touch panel with other driving means. The pad electrode is formed of a conductive material such as metal, and due to the characteristics of the metal, corrosion and the like occur during storage, causing the pad electrode to be defective. Therefore, in order to protect the pad electrode, a protective layer may be formed on the pad electrode. In this case, since the protective layer is mostly an insulating material, there is a problem that the electrical conductivity of the pad electrode is lowered.
한편, 상기 패드전극과 다른 구동수단을 연결하기 위해 점착필름이 쓰이는 바, 일반적으로 이방성 도전필름(Anisotropic Conductive Film, ACF)이 사용된다. 상기 이방성 도전 필름은 접착 및 통전(通電)재료로 반도체 실장에 많이 사용되는 대표적인 재료이다. 상기 이방성 도전 필름을 이용하여 상기 패드전극과 다른 구동수단을 연결한 후, 점착되지 않고 외부로 드러난 패드전극 일부의 부식을 방지하기 위해 별도로 절연 코팅을 하는 공정이 추가되어 생산성이 낮아지는 문제점이 있었다.Meanwhile, an adhesive film is used to connect the pad electrode and other driving means. An anisotropic conductive film (ACF) is generally used. The anisotropic conductive film is a typical material that is widely used in semiconductor mounting as an adhesive and a conductive material. After connecting the pad electrode and the other driving means using the anisotropic conductive film, there was a problem in that the productivity was lowered by adding a separate insulating coating process to prevent corrosion of a part of the pad electrode which is not adhered to the outside without adhesion. .
이에 본 발명의 실시예 1에서는 패드전극의 부식을 방지하고 패드전극의 전기전도성을 향상시킨 터치패널을 제안하고자 한다.In the first embodiment of the present invention to prevent the corrosion of the pad electrode and to improve the electrical conductivity of the pad electrode to propose a touch panel.
이에 본 발명의 실시예 2에서는 점착필름 압착 후에 별도의 추가 공정 없이 패드전극의 신뢰성을 향상시키고 생산성을 높인 터치패널을 제안하고자 한다.Accordingly, in Example 2 of the present invention, after the pressure-sensitive adhesive film is pressed, a touch panel having improved pad electrode reliability and increased productivity without an additional process is proposed.
본 발명의 일예에서는 기판; 상기 기판 상에 형성된 복수개의 센서전극; 상기 복수개의 센서전극과 연결된 복수개의 패드전극;을 포함하며, 상기 복수개의 패드전극은, 상기 기판 상에 형성된 도전체층; 및 상기 도전체층상에 형성된 보호층;을 포함하는 터치패널을 제공한다.In one embodiment of the present invention; A plurality of sensor electrodes formed on the substrate; And a plurality of pad electrodes connected to the plurality of sensor electrodes, wherein the plurality of pad electrodes include: a conductor layer formed on the substrate; And a protective layer formed on the conductor layer.
본 발명의 일예에 따르면 상기 보호층은 금(Au)층을 포함할 수 있다.According to an embodiment of the present invention, the protective layer may include a gold (Au) layer.
본 발명의 일예에 따르면 상기 복수개의 센서전극은, 상기 기판 상에 제 1 방향을 따라 배열되는 복수개의 제 1 센서전극; 및 상기 기판 상에 상기 복수개의 제 1 센서전극과 이격되어 배열되는 복수개의 제 2 센서전극;을 포함할 수 있다.According to an embodiment of the present invention, the plurality of sensor electrodes may include: a plurality of first sensor electrodes arranged along a first direction on the substrate; And a plurality of second sensor electrodes spaced apart from the plurality of first sensor electrodes on the substrate.
본 발명의 일예에 따르면 상기 복수개의 제 1 센서전극과 상기 복수개의 제 2 센서전극은 서로 전기적으로 절연된 상태에서 서로 교차할 수 있다.According to an embodiment of the present invention, the plurality of first sensor electrodes and the plurality of second sensor electrodes may cross each other in an electrically insulated state.
본 발명의 일예에 따르면 상기 도전체층은 투명 전도성 산화물층 및 금속층 중 적어도 하나를 포함할 수 있다.According to an embodiment of the present invention, the conductor layer may include at least one of a transparent conductive oxide layer and a metal layer.
본 발명의 일예에 따르면 상기 투명 전도성 산화물층은 ITO(Indium Tin Oxide), IZO(Indium Zinc Oxide), AZO(Al-doped ZnO) 및 TCO(Transparent conductive oxide) 중 어느 하나를 포함할 수 있다.According to an embodiment of the present invention, the transparent conductive oxide layer may include any one of indium tin oxide (ITO), indium zinc oxide (IZO), al-doped znO (AZO), and transparent conductive oxide (TCO).
본 발명의 일예에 따르면 상기 금속층은 Al, Mo, Cu, Cr, Nd 및 이들의 합금 중 어느 하나를 포함할 수 있다.According to one embodiment of the present invention, the metal layer may include any one of Al, Mo, Cu, Cr, Nd, and alloys thereof.
본 발명의 일예에서는 기판 상에 형성된 복수개의 센서전극 및 패드전극을 포함하는 센서부; 및 상기 센서부와 전기적으로 연결되는 구동부를 포함하며, 상기 패드 전극은,상기 기판 상에 형성된 도전체층; 및 상기 도전체층상에 형성된 보호층;을 포함하는 터치패널을 제공한다.In one embodiment of the present invention, a sensor unit including a plurality of sensor electrodes and a pad electrode formed on a substrate; And a driving unit electrically connected to the sensor unit, wherein the pad electrode comprises: a conductor layer formed on the substrate; And a protective layer formed on the conductor layer.
본 발명의 일예에 따르면 상기 보호층은 절연층을 포함할 수 있다.According to an embodiment of the present invention, the protective layer may include an insulating layer.
본 발명의 일예에 따르면 상기 센서부와 상기 구동부는 접착필름을 매개로 접속될 수 있다.According to an embodiment of the present invention, the sensor unit and the driving unit may be connected via an adhesive film.
본 발명의 일예에 따르면 상기 접착필름은, 점착매트릭스; 및 상기 점착매트릭스에 분산되어 있는 도전입자;를 포함할 수 있다.According to one embodiment of the present invention, the adhesive film may include an adhesive matrix; And conductive particles dispersed in the adhesive matrix.
본 발명의 일예에 따르면 상기 점착매트리스는 아크릴계 점착제, 실리콘계 점착제, 우레탄계 점착제 및 고무계 점착제 중 어느 하나를 포함할 수 있다.According to one embodiment of the present invention, the pressure sensitive adhesive matrix may include any one of an acrylic pressure sensitive adhesive, a silicone pressure sensitive adhesive, a urethane pressure sensitive adhesive and a rubber pressure sensitive adhesive.
본 발명의 일예에 따르면 상기 도전입자는 Cu, Ni, Co, Au, Ag, Cr, Pd, 및 이들의 합금 중 어느 하나를 포함할 수 있다.According to one embodiment of the present invention, the conductive particles may include any one of Cu, Ni, Co, Au, Ag, Cr, Pd, and alloys thereof.
본 발명의 일예에 따르면 상기 도전입자는 평균 직경이 5~500㎛일 수 있다.According to one embodiment of the invention the conductive particles may have an average diameter of 5 ~ 500㎛.
본 발명의 일예에 따르면 상기 구동부는 FPCB(Flexible Printed Circuit Board)를 포함할 수 있다.According to an embodiment of the present invention, the driving unit may include a flexible printed circuit board (FPCB).
본 발명의 일예에서는 기판 상에 형성된 복수개의 센서전극을 포함하는 센서부를 준비하는 단계;In one embodiment of the present invention comprises the steps of preparing a sensor unit including a plurality of sensor electrodes formed on a substrate;
상기 기판 상에 절연층이 포함된 패드전극을 형성하는 단계; 상기 센서부와 전기적으로 연결되는 구동부를 준비하는 단계; 상기 센서부와 상기 구동부 사이에 점착필름을 배치하는 단계; 상기 센서부, 상기 점착필름 및 상기 구동부를 부착하는 단계; 및 부착된 상기 센서부, 상기 점착필름 및 상기 구동부를 압착하는 단계를 포함하는 터치패널 형성 방법을 제공한다.Forming a pad electrode including an insulating layer on the substrate; Preparing a driving unit electrically connected to the sensor unit; Disposing an adhesive film between the sensor unit and the driving unit; Attaching the sensor unit, the adhesive film, and the driving unit; And compressing the attached sensor unit, the adhesive film, and the driving unit.
본 발명의 실시예1에 따른 터치 패널은 패드전극의 부식을 방지하고, 패드전극의 전기전도성을 개선할 수 있다. 또한, 절연막 코팅 없이도 패드전극이 구동할 수 있다.The touch panel according to the first exemplary embodiment of the present invention may prevent corrosion of the pad electrode and improve electrical conductivity of the pad electrode. In addition, the pad electrode can be driven without coating the insulating film.
본 발명의 실시예2에 따른 터치 패널은 패드전극의 부식을 방지하고, 패드전극의 전기전도성을 개선할 수 있다. 또한, 절연막 코팅 없이도 패드전극이 구동할 수 있다.The touch panel according to the second embodiment of the present invention may prevent corrosion of the pad electrode and improve electrical conductivity of the pad electrode. In addition, the pad electrode can be driven without coating the insulating film.
도 1은 본 발명의 일실시예에 따른 보호층을 포함하는 패드전극의 단면도이다.1 is a cross-sectional view of a pad electrode including a protective layer according to an embodiment of the present invention.
도 2는 본 발명의 일실시예에 따른 터치 패널의 평면도이다.2 is a plan view of a touch panel according to an exemplary embodiment of the present invention.
도 3은 도 2에서 Ⅰ-Ⅱ를 따라 절단한 단면도이다.3 is a cross-sectional view taken along the line II of FIG. 2.
도 4는 본 발명의 일실시예에 따른 패드전극의 단면도이다.4 is a cross-sectional view of a pad electrode according to an embodiment of the present invention.
도 5는 본 발명의 다른 실시예에 따른 패드전극의 단면도이다.5 is a cross-sectional view of a pad electrode according to another embodiment of the present invention.
도 6은 본 발명의 또 다른 실시예에 따른 패드전극의 단면도이다.6 is a cross-sectional view of a pad electrode according to another embodiment of the present invention.
도 7은 본 발명의 일실시예에 따른 센서부와 구동부가 결합하는 과정을 보여주는 도면이다.7 is a view showing a process of coupling the sensor unit and the driving unit according to an embodiment of the present invention.
도 8은 본 발명의 일실시예에 따른 패드전극의 단면도이다.8 is a cross-sectional view of a pad electrode according to an embodiment of the present invention.
도 9는 본 발명의 일실시예에 따른 압착 전 패드전극, 점착필름 및 구동부의 단면도이다.9 is a cross-sectional view of the pad electrode, the pressure-sensitive adhesive film and the driving unit before pressing according to an embodiment of the present invention.
도 10은 본 발명의 일실시예에 따른 압착 후 패드전극, 점착필름 및 구동부의 단면도이다.10 is a cross-sectional view of the pad electrode, the pressure-sensitive adhesive film and the driving unit after the compression according to an embodiment of the present invention.
도 11은 본 발명의 다른 실시예에 따른 도 10에 도시된 A 부분에 대한 단면도이다.11 is a cross-sectional view of a portion A shown in FIG. 10 according to another embodiment of the present invention.
이하, 구체적인 도면을 참조하여 본 발명의 예들을 보다 상세히 설명한다. 그러나, 본 발명의 범위가 하기 설명하는 실시예나 도면들로 한정되는 것은 아니다. 이하에서 설명되는 내용과 도면에 도시된 실시예들로부터 다양한 균등물과 변형예들이 있을 수 있다.Hereinafter, examples of the present invention will be described in more detail with reference to specific drawings. However, the scope of the present invention is not limited to the embodiments or drawings described below. There may be various equivalents and modifications from the embodiments described below and the embodiments shown in the drawings.
본 명세서에서 사용되는 용어(terminology)들은 본 발명의 실시예를 표현하기 위해 사용된 용어들로써, 이는 사용자, 운용자의 의도 또는 본 발명이 속하는 분야의 관례 등에 따라 달라질 수 있다. 따라서 본 용어들에 대한 정의는 본 명세서 전반에 걸친 내용을 토대로 내려져야 할 것이다.Terminology used herein is a term used to express an embodiment of the present invention, which may vary according to a user, an operator's intention, or a custom in the field to which the present invention belongs. Therefore, the definition of the terms should be made based on the contents throughout the specification.
참고로, 상기 도면에서는, 이해를 돕기 위하여 각 구성요소와 그 형상 등이 간략하게 그려지거나 또는 과장되어 그려지기도 하였다. 도면상에서 동일한 부호로 표시된 요소는 동일한 요소를 의미한다.For reference, in the drawing, each component and its shape, etc. are simply drawn or exaggerated for clarity. Elements denoted by the same reference numerals in the drawings means the same element.
또한, 어떤 층이나 구성요소가 다른 층이나 또는 구성요소의 '상'에 있다 라고 기재되는 경우에는, 상기 어떤 층이나 구성요소가 상기 다른 층이나 구성요소와 직접 접촉하여 배치된 경우뿐만 아니라, 그 사이에 제3의 층이 개재되어 배치된 경우까지 모두 포함하는 의미이다.In addition, where a layer or component is described as being on another layer or 'on' of a component, not only when the layer or component is disposed in direct contact with the other layer or component, It means including all until the case where a 3rd layer is interposed.
도 1은 본 발명의 일실시예에 따른 보호층을 포함하는 패드전극의 단면도이다.1 is a cross-sectional view of a pad electrode including a protective layer according to an embodiment of the present invention.
도 1을 참조하면, 패드전극(400) 상에는 보호층(440)이 배치된다. 상기 보호층은 금층 또는 절연층을 포함한다. 본 발명의 실시예 1은 보호층(440)이 금층을 포함하는 경우이고, 본 발명의 실시예 2는 보호층(440)이 절연층을 포함하는 경우이다. 각각의 실시예에 대한 자세한 설명은 아래에서 상세히 설명한다.Referring to FIG. 1, a protective layer 440 is disposed on the pad electrode 400. The protective layer includes a gold layer or an insulating layer. In Embodiment 1 of the present invention, the protective layer 440 includes a gold layer, and in Embodiment 2 of the present invention, the protective layer 440 includes an insulating layer. Detailed description of each embodiment is described in detail below.
실시예 1Example 1
도 2에 도시된 본 발명의 일실시예에서는 설명의 간략화를 위하여, 제 1 방향은 도면의 좌측에서 우측으로 향하는 방향으로 정하고, 제 2 방향은 도면의 위에서 아래로 향하는 방향으로 정하였다. 도 2에서 예시된 방향은 제 1 방향과 제 2 방향에 대한 일례로써 상기 제 1 방향과 제 2 방향은 도 2의 일례에서와 다른 방향으로 결정할 수도 있음은 물론이다.In the embodiment of the present invention shown in FIG. 2, for the sake of simplicity, the first direction is determined in a direction from left to right in the drawing, and the second direction is determined in a direction from top to bottom in the drawing. The direction illustrated in FIG. 2 is an example of the first direction and the second direction, and the first direction and the second direction may be determined to be different from those of the example of FIG. 2.
도 2은 본 발명의 일실시예에 따른 터치 패널의 평면도이다. 도 2을 참조하면, 본 발명의 일실시예에 따른 터치패널(10)은 기판(100); 상기 기판(100) 상에 형성된 복수개의 센서전극(200); 상기 복수개의 센서전극(200)과 연결된 복수개의 패드전극(400);을 포함하며, 상기 복수개의 패드전극(400)은, 상기 기판(100) 상에 형성된 도전체층(430) 및 상기 도전체층상(430)에 형성된 금(Au)층(440)을 포함한다.2 is a plan view of a touch panel according to an exemplary embodiment of the present invention. 2, the touch panel 10 according to an embodiment of the present invention is a substrate 100; A plurality of sensor electrodes 200 formed on the substrate 100; And a plurality of pad electrodes 400 connected to the plurality of sensor electrodes 200, wherein the plurality of pad electrodes 400 are formed on the conductor layer 430 and the conductor layer on the substrate 100. Gold (Au) layer 440 formed on the (430).
상기 기판(100)은 고분자 필름, 플라스틱 또는 유리 중 어느 하나에 의하여 형성될 수 있다. 본 실시예에서 상기 기판(100)은 고분자 필름을 사용하는 것을 예로 들어 설명한다. 본 실시예에서 사용한 고분자 필름은 PET이다.The substrate 100 may be formed of any one of a polymer film, plastic, or glass. In this embodiment, the substrate 100 is described using an example of using a polymer film. The polymer film used in this example is PET.
상기 복수개의 센서전극(200)은 상기 기판(100) 상에 제 1 방향을 따라 배열되는 복수개의 제 1 센서전극(210) 및 상기 기판(100) 상에 상기 복수개의 제 1 센서전극(210)과 이격되어 배열되는 복수개의 제 2 센서전극(220)을 포함하며, 제 1 브릿지(230)는 복수개의 제 1 센서전극(210)을 연결할 수 있고, 제 2 브릿지(240)는 복수개의 제 2 센서전극(220)을 연결할 수 있다.The plurality of sensor electrodes 200 are arranged on the substrate 100 in a first direction, and a plurality of first sensor electrodes 210 and the plurality of first sensor electrodes 210 on the substrate 100. And a plurality of second sensor electrodes 220 arranged to be spaced apart from each other, and the first bridge 230 may connect the plurality of first sensor electrodes 210, and the second bridge 240 may include the plurality of second sensors. The sensor electrode 220 may be connected.
도 2에서 상기 제 1 센서전극(210) 및 제 2 센서전극(220)의 모양은 마름모 형상으로 도시하였으나, 반드시 마름모 형태로 한정되는 것은 아니며 삼각형, 정사각형, 직사각형 및 원형과 같이 다양한 형태로 형성될 수 있고, 상기 제 1 센서전극(210) 및 제 2 센서전극(220)의 개수 및 크기는 터치 패널(100)의 해상도 및 상기 터치 패널이 적용되는 디스플레이의 종류와 크기에 따라 달라질 수 있다.Although the shapes of the first sensor electrode 210 and the second sensor electrode 220 are illustrated in a rhombus shape in FIG. 2, the shapes of the first sensor electrode 210 and the second sensor electrode 220 are not necessarily limited to the rhombus shape, but may be formed in various shapes such as triangle, square, rectangle, and circle. The number and size of the first sensor electrode 210 and the second sensor electrode 220 may vary depending on the resolution of the touch panel 100 and the type and size of the display to which the touch panel is applied.
상기 제 1 센서전극(210), 제 2 센서전극(221), 제 1 브릿지(230) 및 제 2 브릿지(240)는 금속 또는 도전성을 갖는 투명재료로 형성될 수 있다. 이러한 도전성을 갖는 투명 재료로서 투명 전도성 산화물(TCO:Transparent Conductive Oxide)을 사용할 수 있다. 이러한 투명 전도성 산화물(TCO)로는 산화인듐-산화주석(ITO:Indium Tin Oxide), 산화인듐-산화아연(IZO:Indium Zinc Oxide), AZO, 산화아연(ZnO) 등을 사용할 수 있다.The first sensor electrode 210, the second sensor electrode 221, the first bridge 230, and the second bridge 240 may be formed of a metal or a transparent material having conductivity. Transparent conductive oxide (TCO) can be used as the transparent material having such conductivity. As the transparent conductive oxide (TCO), indium tin oxide (ITO), indium zinc oxide (IZO: indium zinc oxide), AZO, and zinc oxide (ZnO) may be used.
상기 제 1 센서전극(210), 제 2 센서전극(221), 제 1 브릿지(230) 및 제 2 브릿지(240)는 동일한 재료에 의하여 형성될 수도 있고, 서로 다른 재료에 의하여 형성될 수도 있다. 제조상 편의성을 고려할 때 상기 제 1 센서전극(210), 제 2 센서전극(221), 제 1 브릿지(230) 및 제 2 브릿지(240)는 동일한 재료로 형성되는 것이 바람직하다.The first sensor electrode 210, the second sensor electrode 221, the first bridge 230, and the second bridge 240 may be formed of the same material or may be formed of different materials. In consideration of manufacturing convenience, the first sensor electrode 210, the second sensor electrode 221, the first bridge 230, and the second bridge 240 may be formed of the same material.
상기 제 1 센서전극(210), 제 2 센서전극(221), 제 1 브릿지(230) 및 제 2 브릿지(240)는 상기 기판(100) 상에 투명 도전성 산화물을 스퍼터(sputerring)하거나 증착하여 형성될 수 있다. 또한 마스크를 이용한 포토 리소그라피(photo lithograpy) 방식을 사용하여 형성될 수도 있다.The first sensor electrode 210, the second sensor electrode 221, the first bridge 230, and the second bridge 240 are formed by sputtering or depositing a transparent conductive oxide on the substrate 100. Can be. It may also be formed using a photo lithograpy method using a mask.
한편, 도 2에 도시된 본 발명의 일실시예에 따른 터치 패널(300)은 배선(300)을 포함한다. 배선(300)은 제 1 배선(310)과 제 2 배선(320)을 포함한다.Meanwhile, the touch panel 300 according to the exemplary embodiment of the present invention illustrated in FIG. 2 includes a wiring 300. The wiring 300 includes a first wiring 310 and a second wiring 320.
상기 배선(300)은 상기 복수개의 센서전극(200)과 상기 복수개의 패드전극(400)을 연결할 수 있다. 상기 복수개의 패드전극(400)은 제 1 패드전극(420)과 제 2 패드전극(430)으로 나뉠 수 있다. 제 1 배선(310)은 복수개의 제 1 센서전극(210)과 제 1 패드전극(410)을 연결하고, 제 2 배선(320)들은 복수개의 제 2 센서전극(220)과 제 2 패드전극(420)을 연결할 수 있다. 예를 들면, 제 1 배선(311,312,313,314,315)들은 제 1 센서전극(210)의 일단에 연결되며, 제 1 패드전극(411,412,413,414,415)들과 전기적으로 접속된다. 제 2 배선(321,322,323,324,325)들은 제 2 센서전극(220)의 일단에 연결되며, 제 2 패드전극(421,422,423,424,425)들과 전기적으로 접속된다.The wire 300 may connect the plurality of sensor electrodes 200 and the plurality of pad electrodes 400. The plurality of pad electrodes 400 may be divided into a first pad electrode 420 and a second pad electrode 430. The first wire 310 connects the plurality of first sensor electrodes 210 and the first pad electrode 410, and the second wires 320 connect the plurality of second sensor electrodes 220 and the second pad electrode ( 420 may be connected. For example, the first wires 311, 312, 313, 314, and 315 are connected to one end of the first sensor electrode 210 and electrically connected to the first pad electrodes 411, 412, 413, 414, and 415. The second wires 321, 322, 323, 324 and 325 are connected to one end of the second sensor electrode 220 and electrically connected to the second pad electrodes 421, 422, 423, 424 and 425.
도 3는 도 2에서 Ⅰ-Ⅱ를 따라 절단한 단면도이다. 도 3를 참조하면, 상기 복수개의 제 1 센서전극(210)과 상기 복수개의 제 2 센서전극(220)은 서로 전기적으로 절연된 상태에서 서로 교차하면서 상기 기판(100) 상에 배열될 수 있다.3 is a cross-sectional view taken along the line II of FIG. 2. Referring to FIG. 3, the plurality of first sensor electrodes 210 and the plurality of second sensor electrodes 220 may be arranged on the substrate 100 while crossing each other while being electrically insulated from each other.
상기 제 1 브릿지(230)는 상기 제 2 브릿지 위에 위치하므로 상기 제 1 브릿지(230)와 제 2 브릿지(240)는 동일 평면상에 형성될 수 있다.Since the first bridge 230 is positioned on the second bridge, the first bridge 230 and the second bridge 240 may be formed on the same plane.
상기 복수개의 제 2 센서전극(220)와 제 2 브릿지(240)는 동일 평면상에 형성될 수 있고, 동시에 형성되어 제 2 센서전극(220)과 제 2 브릿지(240)가 일체로 제조될 수 있다. The plurality of second sensor electrodes 220 and the second bridge 240 may be formed on the same plane, and are simultaneously formed so that the second sensor electrode 220 and the second bridge 240 may be integrally manufactured. have.
도 4은 본 발명의 일실시예에 따른 패드전극의 단면도이다. 도 4을 참조하면, 본 발명의 일실시예에 따른 복수개의 패드전극(400)은, 상기 기판(100)상에 형성된 도전체층(430) 및 상기 도전체층(430)에 형성된 금(AU)층(441)을 포함한다. 상기 도전체층(430)은 투명 전도성 산화물층(431) 및 금속층(432)을 포함한다.4 is a cross-sectional view of a pad electrode according to an embodiment of the present invention. Referring to FIG. 4, a plurality of pad electrodes 400 according to an embodiment of the present invention may include a conductor layer 430 formed on the substrate 100 and a gold (AU) layer formed on the conductor layer 430. 444. The conductor layer 430 includes a transparent conductive oxide layer 431 and a metal layer 432.
상기 투명 전도성 산화물층(431)은 스핀 코팅 공정, 프린팅 공정, 스퍼터링 공정, 화학 기상 증착 공정, 원자층 적층 공정 및 진공 증착 공정 중 어느 하나의 공정을 이용하여 기판 상에 형성될 수 있다.The transparent conductive oxide layer 431 may be formed on a substrate using any one of a spin coating process, a printing process, a sputtering process, a chemical vapor deposition process, an atomic layer deposition process, and a vacuum deposition process.
상기 투명 전도성 산화물층(431)은 ITO(Indium Tin Oxide), IZO(Indium Zinc Oxide), AZO(Al-doped ZnO) 및 TCO(Transparent conductive oxide) 중 어느 하나를 포함할 수 있다.The transparent conductive oxide layer 431 may include any one of indium tin oxide (ITO), indium zinc oxide (IZO), al-doped znO (AZO), and transparent conductive oxide (TCO).
상기 금속층(432)은 스핀 코팅 공정, 프린팅 공정, 스퍼터링 공정, 화학 기상 증착 공정, 원자층 적층 공정 및 진공 증착 공정 중 어느 하나의 공정을 이용하여 상기 투명 전도성 산화물층(431)에 형성될 수 있다. 상기 금속층(432)은 투명 전도성 산화물층(431)과 금층(441)의 접착을 용이하게 할 수 있다.The metal layer 432 may be formed on the transparent conductive oxide layer 431 using any one of a spin coating process, a printing process, a sputtering process, a chemical vapor deposition process, an atomic layer deposition process, and a vacuum deposition process. . The metal layer 432 may facilitate adhesion of the transparent conductive oxide layer 431 to the gold layer 441.
상기 금속층(432)은 Al, Mo, Cu, Cr, Nd 및 이들의 합금 중 어느 하나를 포함할 수 있다.The metal layer 432 may include any one of Al, Mo, Cu, Cr, Nd, and alloys thereof.
금(Au)층(441)은 스퍼터링 공정, 증착 공정 및 포토리소그래피 공정중 어느 하나의 공정을 이용하여 상기 금속층(432)에 형성될 수 있다. 금(Au)층(441)은 패드전극(400)을 보호함으로써 부식을 방지하며 수명을 연장시킨다. 또한, 금(Au)층(441)은 패드전극(400)의 전기전도성을 향상시킨다.A gold layer 441 may be formed on the metal layer 432 using any one of a sputtering process, a deposition process, and a photolithography process. The gold layer 441 protects the pad electrode 400 to prevent corrosion and extend life. In addition, the gold layer 441 improves electrical conductivity of the pad electrode 400.
도 5는 본 발명의 다른 실시예에 따른 패드전극의 단면도이다. 도 5를 참조하면, 기판(100)상에 투명 전도성 산화물층(431)이 형성되고, 상기 투명 전도성 산화물층(431)상에 금층(441)이 형성될 수 있다.5 is a cross-sectional view of a pad electrode according to another embodiment of the present invention. Referring to FIG. 5, a transparent conductive oxide layer 431 may be formed on the substrate 100, and a gold layer 441 may be formed on the transparent conductive oxide layer 431.
도 6는 본 발명의 또 다른 실시예에 따른 패드전극의 단면도이다. 도 6를 참조하면, 기판(100)상에 금속층(432)이 형성되며, 상기 금속층(432)상에 금층(441)이 형성될 수 있다.6 is a cross-sectional view of a pad electrode according to another embodiment of the present invention. Referring to FIG. 6, a metal layer 432 may be formed on a substrate 100, and a gold layer 441 may be formed on the metal layer 432.
한편, 본 발명의 일실시예에 따른 패드전극(400)은 구동수단과 연결될 때 FPCB(Flexible Printed Circuit Board)를 사용가능하다. 패드전극(400)과 FPCB가 연결될 때, 패드전극(400)에 포함된 금(Au)층으로 인하여 패드전극(400)과 FPCB의 전기적 접속이 원활해진다.Meanwhile, the pad electrode 400 according to the embodiment of the present invention may use a flexible printed circuit board (FPCB) when connected to the driving means. When the pad electrode 400 and the FPCB are connected, the gold (Au) layer included in the pad electrode 400 facilitates the electrical connection between the pad electrode 400 and the FPCB.
실시예 2Example 2
도 7은 본 발명의 일실시예에 따른 센서부와 구동부가 결합하는 과정을 보여주는 도면이다. 본 발명의 일실시예에 따른 터치패널(10)은 센서부(20) 및 구동부(30)를 포함한다.7 is a view showing a process of coupling the sensor unit and the driving unit according to an embodiment of the present invention. The touch panel 10 according to the exemplary embodiment of the present invention includes a sensor unit 20 and a driver 30.
상기 센서부(20)는 기판(100), 센서전극(200) 및 패드전극(400)을 포함하고, 센서전극(200) 및 패드전극(400)은 기판(100)상에 형성된다.The sensor unit 20 includes a substrate 100, a sensor electrode 200, and a pad electrode 400, and the sensor electrode 200 and the pad electrode 400 are formed on the substrate 100.
상기 구동부(30)는 구동기판(31), 구동회로(32) 및 구동전극(33)을 포함하며, 센서부(20)와 전기적으로 연결된다.The driving unit 30 includes a driving substrate 31, a driving circuit 32, and a driving electrode 33, and is electrically connected to the sensor unit 20.
상기 구동부(30)는 FPCB(Flexible Printed Circuit Board)를 포함할 수 있다.The driving unit 30 may include a flexible printed circuit board (FPCB).
도 7을 참조하면, 상기 센서부(20)와 상기 구동부(30)는 상기 패드전극(400)과 상기 구동전극(33)을 매개로 하여 연결된다. 구동부(30)를 센서부(20) 근처로 위치한 후, 구동부(30)를 180도 회전하여 패드전극(400)과 구동전극(300)을 압착하게 되면, 센서전극(200)은 패드전극(400) 및 구동전극(33)을 통하여 구동회로(330)와 전기적으로 연결된다.Referring to FIG. 7, the sensor unit 20 and the driving unit 30 are connected via the pad electrode 400 and the driving electrode 33. After the driving unit 30 is positioned near the sensor unit 20 and the driving unit 30 is rotated 180 degrees to compress the pad electrode 400 and the driving electrode 300, the sensor electrode 200 is the pad electrode 400. And the driving electrode 33 are electrically connected to the driving circuit 330.
도 7에서 상기 센서전극(200), 패드전극(400) 및 구동전극(33)의 모양은 직사각형 형상으로 도시하였으나, 반드시 직사각형 형태로 한정되는 것은 아니며 삼각형, 정사각형 및 원형과 같이 다양한 형태로 형성될 수 있고, 센서전극(200), 패드전극(400) 및 구동전극(33)의 개수 및 크기는 터치패널(10)의 해상도 및 상기 터치 패널이 적용되는 디스플레이의 종류와 크기에 따라 달라질 수 있다.In FIG. 7, the shape of the sensor electrode 200, the pad electrode 400, and the driving electrode 33 is illustrated in a rectangular shape, but the shape of the sensor electrode 200, the pad electrode 400, and the driving electrode 33 is not necessarily limited to the rectangular shape and may be formed in various shapes such as a triangle, a square, and a circle. The number and size of the sensor electrode 200, the pad electrode 400, and the driving electrode 33 may vary depending on the resolution of the touch panel 10 and the type and size of the display to which the touch panel is applied.
도 8는 본 발명의 일실시예에 따른 패드전극의 단면도이다. 도 8를 참조하면, 패드전극(400)은 도전체층(430) 및 절연층(442)을 포함한다. 상기 패드전극(400)은 기판(100) 상에 형성된다.8 is a cross-sectional view of a pad electrode according to an embodiment of the present invention. Referring to FIG. 8, the pad electrode 400 includes a conductor layer 430 and an insulating layer 442. The pad electrode 400 is formed on the substrate 100.
상기 도전체층(430)은 상기 기판(100)상에 형성되며, 투명 전도성 산화물층,금속층 및 이들의 조합으로 형성될 수 있다.The conductor layer 430 is formed on the substrate 100, and may be formed of a transparent conductive oxide layer, a metal layer, and a combination thereof.
상기 투명 전도성 산화물층은 스핀 코팅 공정, 프린팅 공정, 스퍼터링 공정, 화학 기상 증착 공정, 원자층 적층 공정 및 진공 증착 공정 중 어느 하나의 공정을 이용하여 상기 기판(100) 상에 형성될 수 있다.The transparent conductive oxide layer may be formed on the substrate 100 using any one of a spin coating process, a printing process, a sputtering process, a chemical vapor deposition process, an atomic layer deposition process, and a vacuum deposition process.
상기 투명 전도성 산화물층은 ITO(Indium Tin Oxide), IZO(Indium Zinc Oxide), AZO(Al-doped ZnO) 및 TCO(Transparent conductive oxide) 중 어느 하나를 포함할 수 있다.The transparent conductive oxide layer may include any one of indium tin oxide (ITO), indium zinc oxide (IZO), al-doped znO (AZO), and transparent conductive oxide (TCO).
상기 금속층은 스핀 코팅 공정, 프린팅 공정, 스퍼터링 공정, 화학 기상 증착 공정, 원자층 적층 공정 및 진공 증착 공정 중 어느 하나의 공정을 이용하여 상기 기판(100)상 또는 투명 전도성 산화물층상에 형성될 수 있다.The metal layer may be formed on the substrate 100 or on the transparent conductive oxide layer using any one of a spin coating process, a printing process, a sputtering process, a chemical vapor deposition process, an atomic layer deposition process, and a vacuum deposition process. .
상기 절연층(442)은 상기 도전체층(430)상에 형성되고, 패드전극(400)의 부식을 방지한다. 또한, 절연층(442)을 통하여 패드전극(400)은 온도변화에 잘 견디고 신뢰성이 향상된다. 상기 센서부(20)와 상기 구동부(30)의 압착전에 절연층(442)을 포함하여 패드전극(400)이 형성되므로, 압착 후에 별도의 추가공정이 필요없어지고, 터치패널(10)의 생산성이 향상된다.The insulating layer 442 is formed on the conductor layer 430 and prevents corrosion of the pad electrode 400. In addition, through the insulating layer 442, the pad electrode 400 well withstands temperature changes and improves reliability. Since the pad electrode 400 including the insulating layer 442 is formed before the sensor unit 20 and the driving unit 30 are compressed, no additional process is required after the pressing and the productivity of the touch panel 10 is reduced. This is improved.
도 9은 본 발명의 일실시예에 따른 압착 전 패드전극, 점착필름 및 구동부의 단면도이다. 점착필름(500)은 점착 매트릭스(510) 및 도전 입자(520)를 포함하며, 상기 센서부(20)와 상기 구동부(30)는 상기 점착필름(500)을 매개로 접속된다.9 is a cross-sectional view of the pad electrode, the pressure-sensitive adhesive film and the driving unit before pressing according to an embodiment of the present invention. The adhesive film 500 includes an adhesive matrix 510 and conductive particles 520, and the sensor unit 20 and the driving unit 30 are connected through the adhesive film 500.
상기 점착 매트릭스(510)는 아크릴계 점착제, 실리콘계 점착제, 우레탄계 점착제 및 고무계 점착제 중 어느 하나를 포함할 수 있다.The adhesive matrix 510 may include any one of an acrylic adhesive, a silicone adhesive, a urethane adhesive, and a rubber adhesive.
상기 도전 입자(520)는 상기 점착 매트릭스(510)에 분산되며, 상기 패드전극(400)과 상기 구동전극(33)을 전기적으로 연결하는 매개체가 된다.The conductive particles 520 are dispersed in the adhesive matrix 510 and serve as a medium for electrically connecting the pad electrode 400 and the driving electrode 33.
상기 도전 입자(520)는 Cu, Ni, Co, Au, Ag, Cr, Pd, 및 이들의 합금 중 어느 하나를 포함할 수 있고, 평균 직경이 5~500㎛으로 제조될 수 있다.The conductive particles 520 may include any one of Cu, Ni, Co, Au, Ag, Cr, Pd, and alloys thereof, and may have an average diameter of about 5 μm to about 500 μm.
도 10는 본 발명의 일실시예에 따른 압착 후 패드전극, 점착필름 및 구동부의 단면도이다. 도 10를 참조하면, 상기 패드전극(400)과 상기 구동전극(33)은 점착필름(500)을 매개로 접착되며 전기적으로 연결된다.10 is a cross-sectional view of the pad electrode, the pressure-sensitive adhesive film and the driving unit after the compression according to an embodiment of the present invention. Referring to FIG. 10, the pad electrode 400 and the driving electrode 33 are adhered to each other through an adhesive film 500 and are electrically connected to each other.
상기 점착 매트릭스(510)는 기판(100), 패드전극(400), 구동기판(31) 및 구동전극(33)과 맞닿으며 서로 접착시킨다.The adhesive matrix 510 abuts on and adheres to the substrate 100, the pad electrode 400, the driving substrate 31, and the driving electrode 33.
상기 도전 입자(520)의 일부는 상기 패드전극(400)과 상기 구동전극(33)과 압착된 상태로 직접 맞닿으며, 상기 패드전극(400)과 상기 구동전극(33)을 전기적으로 연결시킨다. 상기 도전 입자(520)는 상기 패드전극(400)의 절연층(442)에 몸체 일부가 파묻힐 수 있다. 나머지 도전 입자(520)들은 여전히 점착 매트릭스(510)에 분산되어 있다.A portion of the conductive particles 520 is in direct contact with the pad electrode 400 and the driving electrode 33 in a compressed state, and electrically connects the pad electrode 400 and the driving electrode 33 to each other. The conductive particles 520 may be partially embedded in the insulating layer 442 of the pad electrode 400. The remaining conductive particles 520 are still dispersed in the adhesive matrix 510.
도 11는 본 발명의 다른 실시예에 따른 도 10에 도시된 A 부분에 대한 단면도이다. 도 11를 참조하면, 도전 입자(520)는 절연층(442)과 구동전극(33) 사이에서 압착된다. 도 10와 달리 도전 입자(520)는 여러 크기를 가질 수 있고, 다양한 크기의 도전 입자(520)가 상기 패드전극(400) 및 구동전극(33) 사이에 압착될 수 있다. 상기 절연층(442)은 0.05~0.3㎛ 정도로 형성되기 때문에, 상기 도전 입자(520)는 상기 도전체층(430)과 접촉하는 데 아무런 장애가 없고, 도전체층(430)과 구동전극(33)을 전기적으로 연결시킨다. 11 is a cross-sectional view of a portion A shown in FIG. 10 according to another embodiment of the present invention. Referring to FIG. 11, the conductive particles 520 are compressed between the insulating layer 442 and the driving electrode 33. Unlike FIG. 10, the conductive particles 520 may have various sizes, and the conductive particles 520 of various sizes may be compressed between the pad electrode 400 and the driving electrode 33. Since the insulating layer 442 is formed at about 0.05 to 0.3 μm, the conductive particles 520 have no obstacle in contact with the conductor layer 430, and electrically connect the conductor layer 430 and the driving electrode 33 to each other. Connect it.
이하 본 발명의 일례에 따른 터치패널의 제조방법을 설명한다. 상기 터치패널의 제조방법은 도면을 참고하여 단계적으로 설명한다.Hereinafter, a method of manufacturing a touch panel according to an example of the present invention will be described. The manufacturing method of the touch panel will be described step by step with reference to the drawings.
먼저, 기판(100) 상에 복수개의 센서전극(200)을 형성하고, 센서부(20)를 준비한다.First, a plurality of sensor electrodes 200 are formed on the substrate 100, and the sensor unit 20 is prepared.
이어서, 상기 기판(100) 상에 절연층(231)이 포함된 패드전극(400)을 형성한다. 예컨대, 상기 기판(100)상에 도전체층(430)을 형성하고, 상기 도전체층(430)상에 상기 절연층(231)을 형성한다.Subsequently, a pad electrode 400 including an insulating layer 231 is formed on the substrate 100. For example, the conductor layer 430 is formed on the substrate 100, and the insulating layer 231 is formed on the conductor layer 430.
상기 센서부(20)와 전기적으로 연결되는 구동부(30)를 준비한다. 예컨대, 구동기판(31)에 구동회로(32)를 형성하고, 상기 구동회로(32)와 연결되는 구동전극(33)을 상기 구동기판(31)상에 형성한다.The driver 30 is electrically connected to the sensor unit 20. For example, a driving circuit 32 is formed on the driving substrate 31, and a driving electrode 33 connected to the driving circuit 32 is formed on the driving substrate 31.
상기 센서부(20)와 상기 구동부(30) 사이에 점착필름(500)을 배치한다.The adhesive film 500 is disposed between the sensor unit 20 and the driving unit 30.
이어서, 상기 센서부(20), 상기 점착필름(500) 및 상기 구동부(30)를 부착한다.Subsequently, the sensor unit 20, the adhesive film 500, and the driving unit 30 are attached.
이어서, 부착된 상기 센서부(20), 상기 점착필름(500) 및 상기 구동부(30)를 압착한다.Subsequently, the attached sensor unit 20, the adhesive film 500, and the driving unit 30 are compressed.
상기 과정을 거쳐서, 상기 센서부(20)와 상기 구동부(30)가 전기적으로 연결되고, 절연층(442)이 포함된 패드전극(400)으로 인하여 추가 절연 코팅 공정 없이 터치패널(10)을 생산할 수 있다.Through the above process, the sensor unit 20 and the driving unit 30 are electrically connected, and due to the pad electrode 400 including the insulating layer 442, the touch panel 10 may be produced without an additional insulation coating process. Can be.
이상에서 설명된 터치 패널의 실시예는 예시적인 것에 불과하며, 본 발명의 보호범위는 본 발명 기술분야의 통상의 지식을 가진 자라면 이로부터 다양한 변형 및 균등예를 포함할 수 있다.Embodiments of the touch panel described above are merely exemplary, and the protection scope of the present invention may include various modifications and equivalents from those skilled in the art.

Claims (16)

  1. 기판;Board;
    상기 기판 상에 형성된 복수개의 센서전극;A plurality of sensor electrodes formed on the substrate;
    상기 복수개의 센서전극과 연결된 복수개의 패드전극;을 포함하며,And a plurality of pad electrodes connected to the plurality of sensor electrodes.
    상기 복수개의 패드전극은,The plurality of pad electrodes,
    상기 기판 상에 형성된 도전체층; 및A conductor layer formed on the substrate; And
    상기 도전체층상에 형성된 보호층;A protective layer formed on the conductor layer;
    을 포함하는 터치패널.Touch panel comprising a.
  2. 제 1 항에 있어서,The method of claim 1,
    상기 보호층은 금(Au)층을 포함하는 터치패널. The protective layer includes a gold (Au) layer.
  3. 제 1항에 있어서,The method of claim 1,
    상기 복수개의 센서전극은,The plurality of sensor electrodes,
    상기 기판 상에 제 1 방향을 따라 배열되는 복수개의 제 1 센서전극; 및A plurality of first sensor electrodes arranged on the substrate in a first direction; And
    상기 기판 상에 상기 복수개의 제 1 센서전극과 이격되어 배열되는 복수개의 제 2 센서전극;A plurality of second sensor electrodes arranged on the substrate and spaced apart from the plurality of first sensor electrodes;
    을 포함하는 터치패널.Touch panel comprising a.
  4. 제 3항에 있어서,The method of claim 3, wherein
    상기 복수개의 제 1 센서전극과 상기 복수개의 제 2 센서전극은 서로 전기적으로 절연된 상태에서 서로 교차하는 터치패널.And the plurality of first sensor electrodes and the plurality of second sensor electrodes cross each other in an electrically insulated state.
  5. 제 1항에 있어서,The method of claim 1,
    상기 도전체층은 투명 전도성 산화물층 및 금속층 중 적어도 하나를 포함하는 터치패널.The conductor layer includes at least one of a transparent conductive oxide layer and a metal layer.
  6. 제 5항에 있어서,The method of claim 5,
    상기 투명 전도성 산화물층은 ITO(Indium Tin Oxide), IZO(Indium Zinc Oxide), AZO(Al-doped ZnO) 및 TCO(Transparent conductive oxide) 중 어느 하나를 포함하는 터치패널.The transparent conductive oxide layer may include any one of indium tin oxide (ITO), indium zinc oxide (IZO), al-doped znO (AZO), and transparent conductive oxide (TCO).
  7. 제 5항에 있어서,The method of claim 5,
    상기 금속층은 Al, Mo, Cu, Cr, Nd 및 이들의 합금 중 어느 하나를 포함하는 터치패널.The metal layer is any one of Al, Mo, Cu, Cr, Nd and alloys thereof.
  8. 기판 상에 형성된 복수개의 센서전극 및 패드전극을 포함하는 센서부; 및A sensor unit including a plurality of sensor electrodes and a pad electrode formed on the substrate; And
    상기 센서부와 전기적으로 연결되는 구동부를 포함하며,It includes a drive unit electrically connected to the sensor unit,
    상기 패드 전극은,The pad electrode,
    상기 기판 상에 형성된 도전체층; 및A conductor layer formed on the substrate; And
    상기 도전체층상에 형성된 보호층;A protective layer formed on the conductor layer;
    을 포함하는 터치패널. Touch panel comprising a.
  9. 제 8항에 있어서,The method of claim 8,
    상기 보호층은 절연층을 포함하는 터치패널.The protective layer includes an insulating layer.
  10. 제 8항에 있어서,The method of claim 8,
    상기 센서부와 상기 구동부는 접착필름을 매개로 접속된 터치패널.The sensor unit and the driving unit is a touch panel connected via an adhesive film.
  11. 제 10항에 있어서,The method of claim 10,
    상기 접착필름은,The adhesive film,
    점착매트릭스; 및Adhesive matrix; And
    상기 점착매트릭스에 분산되어 있는 도전입자;Conductive particles dispersed in the adhesive matrix;
    를 포함하는 터치패널.Touch panel comprising a.
  12. 제 11항에 있어서,The method of claim 11,
    상기 점착매트리스는 아크릴계 점착제, 실리콘계 점착제, 우레탄계 점착제 및 고무계 점착제 중 어느 하나를 포함하는 터치패널.The adhesive mattress is a touch panel comprising any one of an acrylic pressure sensitive adhesive, a silicone pressure sensitive adhesive, a urethane pressure sensitive adhesive and a rubber pressure sensitive adhesive.
  13. 제 11항에 있어서,The method of claim 11,
    상기 도전입자는 Cu, Ni, Co, Au, Ag, Cr, Pd, 및 이들의 합금 중 어느 하나를 포함하는 터치패널.The conductive particles are any one of Cu, Ni, Co, Au, Ag, Cr, Pd, and alloys thereof.
  14. 제 11항에 있어서,The method of claim 11,
    상기 도전입자는 평균 직경이 5~500㎛인 터치패널.The conductive particles have an average diameter of 5 ~ 500㎛ touch panel.
  15. 제 8항에 있어서,The method of claim 8,
    상기 구동부는 FPCB(Flexible Printed Circuit Board)를 포함하는 터치패널.The driving unit includes a flexible printed circuit board (FPCB).
  16. 기판 상에 형성된 복수개의 센서전극을 포함하는 센서부를 준비하는 단계;Preparing a sensor unit including a plurality of sensor electrodes formed on a substrate;
    상기 기판 상에 절연층이 포함된 패드전극을 형성하는 단계;Forming a pad electrode including an insulating layer on the substrate;
    상기 센서부와 전기적으로 연결되는 구동부를 준비하는 단계;Preparing a driving unit electrically connected to the sensor unit;
    상기 센서부와 상기 구동부 사이에 점착필름을 배치하는 단계;Disposing an adhesive film between the sensor unit and the driving unit;
    상기 센서부, 상기 점착필름 및 상기 구동부를 부착하는 단계; 및Attaching the sensor unit, the adhesive film, and the driving unit; And
    부착된 상기 센서부, 상기 점착필름 및 상기 구동부를 압착하는 단계를 포함하는 터치패널 형성 방법.And a step of pressing the sensor unit, the adhesive film, and the driving unit attached thereto.
PCT/KR2013/010100 2012-11-08 2013-11-08 Touch panel comprising pad electrode having protective layer WO2014073896A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2012-0125877 2012-11-08
KR1020120125877A KR20140059428A (en) 2012-11-08 2012-11-08 Touch panel with pad electrode having gold layer
KR10-2012-0147595 2012-12-17
KR1020120147595A KR20140078332A (en) 2012-12-17 2012-12-17 Touch panel with pad electrode having insulation layer

Publications (1)

Publication Number Publication Date
WO2014073896A1 true WO2014073896A1 (en) 2014-05-15

Family

ID=50684922

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2013/010100 WO2014073896A1 (en) 2012-11-08 2013-11-08 Touch panel comprising pad electrode having protective layer

Country Status (1)

Country Link
WO (1) WO2014073896A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017142189A1 (en) * 2016-02-19 2017-08-24 동우화인켐 주식회사 Touch sensor and manufacturing method therefor

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100118681A (en) * 2009-04-29 2010-11-08 남동식 Menufacthuring method of touch panel sensor and touch panel sensor
KR20110107449A (en) * 2010-03-25 2011-10-04 (주)티메이 Pad for touch panel and touch panel using the same
KR20110111826A (en) * 2010-04-05 2011-10-12 (주)엘지하우시스 Pressure-sensitive adhesive composition for touch panel, pressure-sensitive adhesive film and touch panel
US20110310053A1 (en) * 2010-06-17 2011-12-22 Samsung Electro-Mechanics Co., Ltd. Conductive polymer composition for transparent electrode and touch panel using the same
WO2012015177A2 (en) * 2010-07-30 2012-02-02 일진디스플레이(주) Electrode line structure and capacitive touch sensor using same

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100118681A (en) * 2009-04-29 2010-11-08 남동식 Menufacthuring method of touch panel sensor and touch panel sensor
KR20110107449A (en) * 2010-03-25 2011-10-04 (주)티메이 Pad for touch panel and touch panel using the same
KR20110111826A (en) * 2010-04-05 2011-10-12 (주)엘지하우시스 Pressure-sensitive adhesive composition for touch panel, pressure-sensitive adhesive film and touch panel
US20110310053A1 (en) * 2010-06-17 2011-12-22 Samsung Electro-Mechanics Co., Ltd. Conductive polymer composition for transparent electrode and touch panel using the same
WO2012015177A2 (en) * 2010-07-30 2012-02-02 일진디스플레이(주) Electrode line structure and capacitive touch sensor using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017142189A1 (en) * 2016-02-19 2017-08-24 동우화인켐 주식회사 Touch sensor and manufacturing method therefor

Similar Documents

Publication Publication Date Title
WO2013062385A1 (en) Touch panel
WO2015141966A1 (en) Touch device
WO2012043978A1 (en) Touch screen panel and touch screen assembly including the same
WO2013187591A1 (en) Touch screen having mesh electrode pattern
WO2013032302A2 (en) Touch panel and liquid crystal display comprising the same
WO2010024542A2 (en) Touch-sensing panel including electrode-integrated window, and manufacturing method thereof
WO2011149199A2 (en) Touch panel using a metal thin film, and method for manufacturing same
WO2014178542A1 (en) Method for manufacturing touch screen panel
WO2015008933A1 (en) Touch window
WO2014059824A1 (en) Touch panel and manufacturing method thereof
WO2015174688A1 (en) Touch window
WO2013170684A1 (en) Touch panel and touch display device using same
WO2015026076A1 (en) Touch sensor electrode integrated with polarizing plate
WO2013097628A1 (en) Touch panel and manufacturing method thereof
WO2013162241A1 (en) Touch panel and method of manufacturing the same
WO2012008725A2 (en) Touch sensing panel for delivering sensing signal to touch sensor chip by using circuit board, and touch sensing device
WO2015008934A1 (en) Touch window
WO2020159152A1 (en) Touch sensor, window laminate comprising same, and image display device comprising same
WO2015178726A1 (en) Touch window
WO2016008135A1 (en) Colour filter substrate and display device
EP3987758A1 (en) Electronic device including camera module
EP3193243A1 (en) Display device and method of manufacturing the same
WO2012008704A2 (en) Capacitative touch sensor and capacitative touch panel integerated into a window panel and including same
WO2013077578A1 (en) Touch panel sensor
WO2015069048A1 (en) Touch panel for implementing touch sensor using one sheet of film and method for manufacturing same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 13852497

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 13852497

Country of ref document: EP

Kind code of ref document: A1