WO2014072681A3 - Component temperature control - Google Patents

Component temperature control Download PDF

Info

Publication number
WO2014072681A3
WO2014072681A3 PCT/GB2013/052790 GB2013052790W WO2014072681A3 WO 2014072681 A3 WO2014072681 A3 WO 2014072681A3 GB 2013052790 W GB2013052790 W GB 2013052790W WO 2014072681 A3 WO2014072681 A3 WO 2014072681A3
Authority
WO
WIPO (PCT)
Prior art keywords
temperature control
component temperature
electronic device
temperature
heater
Prior art date
Application number
PCT/GB2013/052790
Other languages
French (fr)
Other versions
WO2014072681A2 (en
Inventor
Nadhum Kadhum Zayer
Original Assignee
Oclaro Technology Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oclaro Technology Limited filed Critical Oclaro Technology Limited
Priority to GB1507631.8A priority Critical patent/GB2522151B/en
Publication of WO2014072681A2 publication Critical patent/WO2014072681A2/en
Publication of WO2014072681A3 publication Critical patent/WO2014072681A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/345—Arrangements for heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
    • H01S5/02415—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling by using a thermo-electric cooler [TEC], e.g. Peltier element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02453—Heating, e.g. the laser is heated for stabilisation against temperature fluctuations of the environment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/02208—Mountings; Housings characterised by the shape of the housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
    • H01S5/068—Stabilisation of laser output parameters
    • H01S5/06804—Stabilisation of laser output parameters by monitoring an external parameter, e.g. temperature

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Control Of Temperature (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Semiconductor Lasers (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

There is disclosed an electronic assembly comprising an electronic device mounted on a carrier and configured to operate within a predetermined range of temperatures. A temperature sensor is thermally coupled to the device for monitoring the temperature of the device. A heater is located in or on the carrier proximate to the electronic device for heating the electronic device. A control system is operatively connected to the temperature sensor and the heater so as to prevent the temperature of the device, when in use, dropping below the predetermined range of temperatures.
PCT/GB2013/052790 2012-11-07 2013-10-25 Component temperature control WO2014072681A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1507631.8A GB2522151B (en) 2012-11-07 2013-10-25 Component temperature control

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB1220004.4A GB2507732A (en) 2012-11-07 2012-11-07 Laser temperature control
GB1220004.4 2012-11-07

Publications (2)

Publication Number Publication Date
WO2014072681A2 WO2014072681A2 (en) 2014-05-15
WO2014072681A3 true WO2014072681A3 (en) 2014-08-14

Family

ID=47429275

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2013/052790 WO2014072681A2 (en) 2012-11-07 2013-10-25 Component temperature control

Country Status (2)

Country Link
GB (2) GB2507732A (en)
WO (1) WO2014072681A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9368941B1 (en) 2014-08-14 2016-06-14 Google Inc. Temperature compensation in an optical transmitter
GB2531261A (en) * 2014-10-13 2016-04-20 Bae Systems Plc Optical transmitter
EP3059760A1 (en) * 2015-02-18 2016-08-24 Siemens Aktiengesellschaft Electronic device
US10826270B2 (en) * 2016-01-04 2020-11-03 Automotive Coalition For Traffic Safety, Inc. Heater-on-heatspreader
CN105698151A (en) * 2016-01-11 2016-06-22 中国科学院上海光学精密机械研究所 Controllable low-temperature mercury vapor source for ultrahigh vacuum system
CN108227350B (en) * 2016-12-14 2021-06-08 台达电子工业股份有限公司 Digital miniature reflective projector
EP3675295A1 (en) * 2018-12-28 2020-07-01 Nokia Solutions and Networks Oy Laser assemblies
WO2021038803A1 (en) * 2019-08-29 2021-03-04 三菱電機株式会社 Optical module and optical module control method
CN112578510B (en) * 2020-12-01 2022-03-04 四川华拓光通信股份有限公司 Circuit compatible with TEC and Heater in optical module and application method
CN116124728A (en) * 2023-02-24 2023-05-16 上海烨映微电子科技股份有限公司 Thermopile infrared detector, preparation method thereof and NDIR detection system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148681A (en) * 1995-11-17 1997-06-06 Sumitomo Electric Ind Ltd Semiconductor module
JP2001102674A (en) * 1999-09-30 2001-04-13 Kyocera Corp Board for mounting semiconductor laser element and semiconductor laser module
US20090059979A1 (en) * 2007-09-04 2009-03-05 Hiromasa Tanaka Optical transmission module and optical transmission system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148581A (en) * 1995-11-17 1997-06-06 Sharp Corp Manufacture of thin film semiconductor device
WO1998046059A1 (en) * 1997-04-04 1998-10-15 Unisys Corporation Temperature control system for an electronic device
US7492798B2 (en) * 2005-12-20 2009-02-17 Finisar Corporation Modular transistor outline can with internal components
JP2007180378A (en) * 2005-12-28 2007-07-12 Sumitomo Electric Ind Ltd Laser module and control method therefor
US7655553B2 (en) * 2006-01-11 2010-02-02 Texas Instruments Incorporated Microstructure sealing tool and methods of using the same
US20080080575A1 (en) * 2006-09-28 2008-04-03 Applied Optoelectronics, Inc. Laser with heater to reduce operating temperature range and method of using same
JP5360226B2 (en) * 2009-11-19 2013-12-04 富士通株式会社 Loop heat pipe system and information processing apparatus
DE102010014100A1 (en) * 2010-04-07 2011-10-13 Osram Opto Semiconductors Gmbh Semiconductor laser element, has laser diode and positive temperature co-efficient resistor that are thermally connected with one another and arranged on heat sink and thermal conductive intermediate medium

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148681A (en) * 1995-11-17 1997-06-06 Sumitomo Electric Ind Ltd Semiconductor module
JP2001102674A (en) * 1999-09-30 2001-04-13 Kyocera Corp Board for mounting semiconductor laser element and semiconductor laser module
US20090059979A1 (en) * 2007-09-04 2009-03-05 Hiromasa Tanaka Optical transmission module and optical transmission system

Also Published As

Publication number Publication date
GB201507631D0 (en) 2015-06-17
GB2522151A (en) 2015-07-15
GB2507732A (en) 2014-05-14
GB2522151B (en) 2017-02-08
WO2014072681A2 (en) 2014-05-15
GB201220004D0 (en) 2012-12-19

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