WO2014057846A1 - Solvent composition for manufacturing electric device - Google Patents

Solvent composition for manufacturing electric device Download PDF

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Publication number
WO2014057846A1
WO2014057846A1 PCT/JP2013/076792 JP2013076792W WO2014057846A1 WO 2014057846 A1 WO2014057846 A1 WO 2014057846A1 JP 2013076792 W JP2013076792 W JP 2013076792W WO 2014057846 A1 WO2014057846 A1 WO 2014057846A1
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Prior art keywords
ether
electronic device
solvent
acid
acetate
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PCT/JP2013/076792
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French (fr)
Japanese (ja)
Inventor
鈴木陽二
赤井泰之
横尾健
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株式会社ダイセル
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Publication of WO2014057846A1 publication Critical patent/WO2014057846A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/033—Printing inks characterised by features other than the chemical nature of the binder characterised by the solvent

Definitions

  • the present invention relates to a solvent composition that forms a paste composition by melting with heating.
  • the paste composition is applied to a member having a surface to be coated (hereinafter sometimes referred to as a “surface to be coated”) using a printing method to form a wiring or a coating film. Used for applications.
  • Electronic devices manufactured using the printing method include capacitors, inductors, varistors, thermistors, transistors, speakers, actuators, antennas, solid oxide fuel cells (SOFC), and the like.
  • capacitors inductors, varistors, thermistors, transistors, speakers, actuators, antennas, solid oxide fuel cells (SOFC), and the like.
  • SOFC solid oxide fuel cells
  • a multilayer capacitor is generally manufactured through the following processes.
  • a ceramic sheet is dispersed in a polyvinyl acetal resin such as polyvinyl butyral or a binder resin such as an acrylic resin and a solvent to form a slurry, which is then formed into a sheet to obtain a green sheet.
  • a paste composition mainly composed of a conductive metal material (for example, nickel, palladium), a binder resin (for example, ethyl cellulose), and an organic solvent (for example, terpineol) is applied on a green sheet by a printing method or the like. Wiring and coating film are formed (application process). 3.
  • the organic solvent in the paste composition is dried (drying step). 4).
  • the laminated sheet on which the wiring and coating film are formed is cut into a predetermined size, and a plurality of sheets are stacked and thermocompression bonded to obtain a laminated body. 5.
  • a multilayer capacitor is obtained (firing step).
  • the binder resin has a function of fixing the conductive metal material or the insulating material.
  • ethyl cellulose resin has been mainly used because it has excellent coatability and can easily form a coating film with a precise shape.
  • the carbon component remains as ash after firing, which reduces electrical properties and causes volatiles to form voids in the process of thermal decomposition, resulting in wiring and coating films. It has been a problem to reduce the yield due to poor formation or delamination.
  • Patent Document 1 discloses that using a polyvinyl acetal resin instead of an ethyl cellulose resin improves adhesion with a green sheet and reduces ash content.
  • the polyvinyl acetal resin it has been difficult to completely prevent the decrease in conductivity, the poor wiring / coating film formation, and the occurrence of delamination.
  • an object of the present invention is a solvent composition which is a raw material of a paste composition for performing wiring or coating film formation of an electronic device by being applied to a surface member to be coated by a printing method.
  • -It is providing the solvent composition which can suppress the defect of coating-film formation and generation
  • a low molecular gelling agent having a specific structure forms a string-like aggregate by self-organization in a solvent when heated and melted. It has been found that it exhibits such a viscosity, volatilizes at a low temperature as compared with a high molecular compound such as ethyl cellulose, is excellent in thermal decomposability, and can significantly reduce the residue of ash and the generation of volatile components by baking.
  • the coating process has a viscosity suitable for the formation of wiring and coating films by the printing method, and is capable of forming a highly accurate wiring pattern that is difficult to drip, in the drying process and firing process. It is not necessary to heat at a high temperature for a long time, it can be quickly dried and fired at a low temperature, the coated surface member can be prevented from being softened and deformed by being exposed to a high temperature for a long time, and through a firing process. As a result, the generation of residual ash and volatile components in the wiring and coating film can be significantly reduced. It found that it is possible to suppress defects and the occurrence of delamination. The present invention has been completed based on these findings.
  • this invention is a solvent composition for manufacturing an electronic device by a printing method, Comprising: A solvent and following formula (1) R 1 —CH 2 —R 2 (1) (In the formula, R 1 represents a monohydroxyalkyl group, and R 2 represents a carboxyl group (C ( ⁇ O) OH) or an amide group (C ( ⁇ O) NH 2 )).
  • R 1 represents a monohydroxyalkyl group
  • R 2 represents a carboxyl group (C ( ⁇ O) OH) or an amide group (C ( ⁇ O) NH 2 )
  • the solvent composition for electronic device manufacture containing the compound (however, except monohydroxystearic acid) represented by these is provided.
  • the compound represented by the formula (1) is preferably a compound in which R 1 is a monohydroxy C 8-14 alkyl group, and particularly selected from hydroxydecanoic acid, hydroxydodecanoic acid, hydroxytetradecanoic acid, and hydroxyhexadecanoic acid.
  • R 1 is a monohydroxy C 8-14 alkyl group, and particularly selected from hydroxydecanoic acid, hydroxydodecanoic acid, hydroxytetradecanoic acid, and hydroxyhexadecanoic acid.
  • R 1 is a monohydroxy C 8-14 alkyl group, and particularly selected from hydroxydecanoic acid, hydroxydodecanoic acid, hydroxytetradecanoic acid, and hydroxyhexadecanoic acid.
  • the SP value of the solvent is preferably 7.8 to 11.8.
  • solvent examples include propylene glycol methyl-n-propyl ether, propylene glycol methyl-n-butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl-n-propyl ether, dipropylene glycol methyl-n-butyl ether, 3-methoxybutyl.
  • the content of the compound represented by the formula (1) is preferably 0.1 to 50% by weight of the whole solvent composition for producing an electronic device.
  • the present invention also provides a method for producing a paste composition for producing an electronic device, wherein the solvent composition for producing an electronic device is dissolved by heating at 30 to 90 ° C.
  • the present invention further provides an electronic device manufacturing paste composition obtained by the method for manufacturing an electronic device manufacturing paste composition.
  • the electronic device manufacturing paste composition preferably further includes a conductive metal material, a semiconductor material, a magnetic material, a dielectric material, or an insulating material.
  • the electronic device manufacturing paste composition preferably has a binder resin content of 10% by weight or less.
  • the solvent composition for producing an electronic device of the present invention contains a low-molecular gelling agent having the above specific structure, it has a viscosity suitable for forming a wiring / coating film by a printing method by dissolving it by heating.
  • a paste composition can be formed. And if the said paste composition is used, it will be hard to drip and a highly accurate wiring pattern can be formed. Moreover, in a drying process and a baking process, it can dry and bake at low temperature, and it can prevent softening and a deformation
  • the solvent composition for producing an electronic device of the present invention is extremely useful as a raw material for a paste composition for forming a fine pattern of an electric device by each printing method.
  • Fig. 1 shows the gelling agent used in the examples (3HDA, 3HDDA, 3HTDA, 3HHexDA) and the polymer binder resin (ETHOCEL) used in the comparative example when the temperature was raised from 20 ° C to 400 ° C at 10 ° C / min. It is a figure which shows the weight reduction
  • the solvent composition for manufacturing an electronic device includes a solvent and a compound represented by the formula (1).
  • the gelling agent of the present invention has the following formula (1) R 1 —CH 2 —R 2 (1) (In the formula, R 1 represents a monohydroxyalkyl group, and R 2 represents a carboxyl group (C ( ⁇ O) OH) or an amide group (C ( ⁇ O) NH 2 )). (Except for monohydroxystearic acid).
  • R 1 represents a monohydroxyalkyl group, and has a structure in which one hydroxyl group is substituted on the alkyl group.
  • alkyl group include linear alkyl groups having 8 to 14 carbon atoms such as n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, and n-tetradecyl groups. Can be mentioned.
  • R 2 is a carboxyl group
  • Specific examples of the compound represented by the above formula (1) when R 2 is a carboxyl group include 3-hydroxydecanoic acid, 4-hydroxydecanoic acid, 5-hydroxydecanoic acid, 6- Hydroxydecanoic acid, 7-hydroxydecanoic acid, 8-hydroxydecanoic acid, 9-hydroxydecanoic acid, 10-hydroxydecanoic acid, 3-hydroxydodecanoic acid, 4-hydroxydodecanoic acid, 5-hydroxydodecanoic acid, 6-hydroxydodecane Acid, 7-hydroxydodecanoic acid, 8-hydroxydodecanoic acid, 9-hydroxydodecanoic acid, 10-hydroxydodecanoic acid, 11-hydroxydodecanoic acid, 3-hydroxytridecanoic acid, 4-hydroxytridecanoic acid, 5-hydroxytridecanoic acid Decanoic acid, 6-hydroxytridecanoic acid, 7-hydroxy Tridecanoic acid, 8-hydroxytridecanoic acid
  • R 2 in the compound represented by the above formula (1) being an amide group include 3-hydroxydecanamide, 4-hydroxydecanamide, 5-hydroxydecanamide, 6- Hydroxydecanamide, 7-hydroxydecanamide, 8-hydroxydecanamide, 9-hydroxydecanamide, 10-hydroxydecanamide, 3-hydroxydodecanamide, 4-hydroxydodecanamide, 5-hydroxydodecanamide, 6-hydroxydodecanamide Amide, 7-hydroxydodecanamide, 8-hydroxydodecanamide, 9-hydroxydodecanamide, 10-hydroxydodecanamide, 11-hydroxydodecanamide, 3-hydroxytridecanamide, 4-hydroxytridecanamide 5-hydroxytridecanamide, 6-hydroxytridecanamide, 7-hydroxytridecanamide, 8-hydroxytridecanamide, 9-hydroxytridecanamide, 10-hydroxytridecanamide, 11-hydroxytridecanamide, 12 -Hydroxytridecanamide, 3-hydroxytetradecanamide, 4-hydroxytetradecanamide, 5-hydroxy
  • those having an evaporation temperature of 120 to 380 ° C. (preferably 150 to 330 ° C., particularly preferably 150 to 280 ° C., most preferably 150 to 270 ° C.) preferable.
  • the evaporation temperature exceeds the above range, it is difficult to quickly vaporize under low temperature conditions, and it becomes difficult to prevent the coated surface member from being softened and deformed by being exposed to a high temperature for a long time. is there.
  • the evaporation temperature is lower than the above range, the composition may change due to vaporization at the time of preparing the paste composition or at the time of printing, so that stable wiring / coating film formation tends to be difficult.
  • the “evaporation temperature” is a weight of 0.1 when a temperature rise measurement is performed at 10 ° C./min from 20 ° C. to 400 ° C. using a differential thermothermal gravimetric simultaneous measurement device (TG / DTA). It is the temperature when it decreases to less than%.
  • R 1 in the formula (1) such as hydroxydecanoic acid, hydroxydodecanoic acid, hydroxytetradecanoic acid, hydroxyhexadecanoic acid is monohydroxy C 8.
  • Hydroxy fatty acids which are -14 alkyl groups (more preferably monohydroxy C 10-14 alkyl groups, particularly preferably monohydroxy C 12-14 alkyl groups), especially 3-hydroxydecanoic acid, 3-hydroxydodecanoic acid, R 1 in the formula (1) such as 3-hydroxytetradecanoic acid and 3-hydroxyhexadecanoic acid is a 3-hydroxy C 8-14 alkyl group (more preferably a 3-hydroxy C 10-14 alkyl group, particularly preferably 3 3-hydroxy fatty acids which are -hydroxy C 12-14 alkyl groups) are preferred. These can be used alone or in combination of two or more.
  • the content of the compound represented by the formula (1) in the solvent composition for producing an electronic device is, for example, about 0.1 to 50% by weight, preferably 1 to 40%. % By weight, more preferably 3 to 30% by weight, particularly preferably 5 to 20% by weight, and most preferably 7 to 15% by weight.
  • the content of the compound represented by the formula (1) is below the above range, it becomes difficult to obtain a paste composition having a stable gel state such as a solution by temperature change. May be difficult to form.
  • the content of the compound represented by the formula (1) exceeds the above range, the viscosity of the paste composition becomes too high, and it may be difficult to form a wiring or a coating film by a printing method. .
  • solvent As the solvent contained in the solvent composition for producing an electronic device of the present invention, it is preferable to use a solvent having a property of forming a gel by heating and melting with the compound represented by the above formula (1).
  • the solvent include a solubility parameter (SP value: Fedors calculated value) at 25 ° C. of about 7.8 to 11.8, preferably 8.0 to 11.0, particularly preferably 9.0 to 10.0. It is preferable to use the solvent.
  • SP value Fedors calculated value
  • the solvent When a solvent having a solubility parameter exceeding the above value is used, the compound represented by the above formula (1) is solvated and the intermolecular hydrogen bond serving as a driving force for forming a string-like aggregate is cleaved. Tends to be difficult.
  • a solvent having a solubility parameter lower than the above value is used, the compound represented by the above formula (1) is difficult to be solvated, and thus tends to aggregate and recrystallize, and gelation tends to be difficult.
  • Examples of the solvent of the present invention include n-propanol (SP value: 11.8), 1,2,5,6-tetrahydrobenzyl alcohol (SP value: 11.3), diethylene glycol ethyl ether (SP value: 10. 9), 3-methoxybutanol (SP value: 10.9), triacetin (SP value: 10.2), propylene glycol monomethyl ether (SP value: 10.2), cyclopentanone (SP value: 10.0) , ⁇ -butyrolactone (SP value: 9.9), cyclohexanone (SP value: 9.9), propylene glycol-n-propyl ether (SP value: 9.8), propylene glycol-n-butyl ether (SP value: 9) .7), dipropylene glycol methyl ether (SP value: 9.7), 1,4-butanediol diacetate (SP value: .6), 3-methoxybutyl acetate (SP value: 8.7), propylene glycol diacetate
  • propylene glycol methyl-n-propyl ether propylene glycol methyl-n-butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl-n-propyl ether, dipropylene glycol methyl-n-butyl ether , 3-methoxybutyl acetate, dipropylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanol acetate, ethyl lactate acetate, propylene glycol diacetate, 1,4-butanediol diacetate, propylene glycol monomethyl ether, 3-methoxy At least selected from butanol and 1,2,5,6-tetrahydrobenzyl alcohol It is preferred to use one.
  • the content of the solvent in the solvent composition for producing an electronic device is, for example, about 10 to 99.9% by weight, preferably 20 to 99% by weight, more preferably 30 to 30%. It is 95% by weight, particularly preferably 40 to 93% by weight.
  • the content of the solvent is below the above range, the viscosity of the paste composition becomes too high, and it may be difficult to apply to the printing method.
  • the content of the solvent exceeds the above range, it becomes difficult to obtain a paste composition having a stable gel state such as a solution by temperature change, and a highly accurate wiring pattern can be formed by dripping. It can be difficult.
  • the solvent composition for manufacturing an electronic device of the present invention other organic solvents may be added in addition to the above solvent as long as the effect is not impaired.
  • the physical properties can be adjusted to suit the application.
  • the amount of the other organic solvent added is, for example, less than 50% by weight, preferably 30% by weight or less, particularly preferably 20% by weight or less, based on the total amount of the solvent composition for manufacturing an electronic device.
  • Examples of other organic solvents include cycloalkyl alcohol, cycloalkyl acetate, alkylene glycol, alkylene glycol diacetate, alkylene glycol monoether, alkylene glycol dialkyl ether, alkylene glycol monoether acetate, dialkylene glycol monoether, dialkylene glycol.
  • Dialkyl ether, dialkylene glycol monoalkyl ether acetate, trialkylene glycol monoether, trialkylene glycol monoether acetate, 3-methoxybutanol, 3-methoxybutanol acetate, tetrahydrofurfuryl alcohol, tetrahydrofurfuryl acetate, terpene compounds and their Derivatives and the like can be mentioned.
  • cycloalkyl alcohol examples include cyclopentanol, cyclohexanol, cyclooctyl alcohol, methyl cyclohexyl alcohol, ethyl cyclohexyl alcohol, propyl cyclohexyl alcohol, isopropyl cyclohexyl alcohol, butyl cyclohexyl alcohol, isobutyl cyclohexyl alcohol, s-butyl cyclohexyl alcohol, Examples thereof include a 3- to 15-membered cycloalkyl alcohol optionally having a substituent such as a C 1-5 alkyl group such as t-butylcyclohexyl alcohol and pentylcyclohexyl alcohol.
  • cycloalkyl acetate examples include cyclohexyl acetate, cyclopentyl acetate, cyclooctyl acetate, methyl cyclohexyl acetate, ethyl cyclohexyl acetate, propyl cyclohexyl acetate, isopropyl cyclohexyl acetate, butyl cyclohexyl acetate, isobutyl cyclohexyl acetate, s-butyl cyclohexyl acetate, t
  • Examples thereof include a 3- to 15-membered cycloalkyl acetate which may have a substituent such as a C 1-5 alkyl group such as butylcyclohexyl acetate and pentylcyclohexyl acetate.
  • alkylene glycol examples include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, and the like. Can be mentioned.
  • alkylene glycol diacetate examples include ethylene glycol diacetate, 1,3-propanediol diacetate, and 1,5-pentanediol diacetate.
  • alkylene glycol monoether examples include ethylene glycol mono C 1-5 alkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, and ethylene glycol monopentyl ether; propylene Examples thereof include propylene glycol mono C 1-5 alkyl ethers such as glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, and propylene glycol monopentyl ether.
  • alkylene glycol dialkyl ether examples include ethylene glycol C 1-5 alkyl (straight chain) C 1- such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether, ethylene glycol dibutyl ether, and ethylene glycol dipentyl ether.
  • alkyl (straight chain) ether terminal alkyl group symmetrical
  • Ethylene glycol propyl pentyl ether ethylene glycol C 1-5 alkyl such as ethylene glycol butyl pentyl ether (linear) C 1-5 alkyl (linear) ether (terminal alkyl group asymmetric); propylene glycol dimethyl ether, propylene glycol diethyl ether, Propylene glycol C 1-5 alkyl (straight chain) C 1-5 alkyl (straight chain) ether (symmetrical
  • alkylene glycol monoalkyl ether acetate examples include ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, and ethylene glycol monopentyl ether acetate. 1-5 alkyl ether acetate; propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, propylene glycol mono C 1-5 alkyl ether acetate such as propylene glycol monopentyl ether acetate, etc. Can (the isomer No).
  • dialkylene glycol monoether examples include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol mono C 1-5 alkyl ether such as diethylene glycol monopentyl ether; dipropylene glycol monomethyl ether, Dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol mono C 1-5 alkyl ethers such as dipropylene glycol monopentyl ether, etc. can be mentioned (including isomers). .
  • dialkylene glycol dialkyl ether examples include diethylene glycol C 1-5 alkyl (straight chain) C 1-5 alkyl (straight chain) such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, and diethylene glycol dipentyl ether.
  • Ether (symmetrical terminal alkyl group); diethylene glycol ethyl methyl ether, diethylene glycol methyl propyl ether, diethylene glycol butyl methyl ether, diethylene glycol methyl pentyl ether, diethylene glycol ethyl propyl ether, diethylene glycol butyl ethyl ether, diethylene glycol ethyl pentyl ether, diethylene glycol Call butyl propyl ether, diethylene glycol propyl pentyl ether, diethylene glycol C 1-5 alkyl (straight chain) C 1-5 alkyl ethers such as diethylene glycol butyl pentyl ether (linear) (terminal alkyl group asymmetric); dipropylene glycol dimethyl ether, dipropylene Dipropylene glycol C 1-5 alkyl (straight chain) C 1-5 alkyl (straight chain) ether (terminal alkyl group) such as glycol diethyl ether
  • dialkylene glycol monoalkyl ether acetate examples include diethylene glycol mono C 1-5 alkyl ether acetates such as diethylene glycol monomethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monopentyl ether acetate;
  • dipropylene glycol mono C 1-5 alkyl ether acetates such as ethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl ether acetate, and dipropylene glycol monopentyl ether acetate (including isomers). ).
  • trialkylene glycol monoether examples include triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monopropyl ether, triethylene glycol monobutyl ether, triethylene glycol monopentyl ether, and the like. 1-5 alkyl ether; tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, tripropylene glycol monopropyl ether, tripropylene glycol monobutyl ether, tripropylene glycol mono C 1-5 alkyl ether and tripropylene glycol mono-pentyl ether (Including isomers).
  • trialkylene glycol monoether acetate examples include triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, triethylene glycol monopropyl ether acetate, triethylene glycol monobutyl ether acetate, and triethylene glycol monopentyl ether acetate.
  • Triethylene glycol mono C 1-5 alkyl ether acetate Triethylene glycol mono C 1-5 alkyl ether acetate; tripropylene glycol monomethyl ether acetate, tripropylene glycol monoethyl ether acetate, tripropylene glycol monopropyl ether acetate, tripropylene glycol monobutyl ether acetate, tripropylene glycol monopentyl ether acetate etc And tripropylene glycol mono C 1-5 alkyl ether acetate (including isomers).
  • terpene compound and derivatives thereof examples include terpineol, terpineol acetate, dihydroterpineol, dihydroterpinyl acetate, dihydroterpinyl propionate, limonene, menthane, and menthol.
  • the solvent composition for producing an electronic device is heated at 30 to 90 ° C. (preferably 40 to 80 ° C.), for example, for about 3 to 60 minutes (preferably 10 to 30 minutes). It can be manufactured by dissolving.
  • the paste composition for manufacturing an electronic device of the present invention further contains a conductive metal material, a semiconductor material, a magnetic material, a dielectric material, or an insulating material from the viewpoint of imparting electrical characteristics.
  • the content of the conductive metal material, semiconductor material, magnetic material, dielectric material, or insulating material is about 0.1 to 90% by weight of the electronic device manufacturing paste composition.
  • conductive metal material and magnetic material well-known and commonly used materials can be used.
  • semiconductor materials can be used, such as pentacene, fullerene derivatives, polythiophene derivatives, metals (copper, indium, gallium, selenium, arsenic, cadmium, tellurium, and alloys thereof), silicon fine particles, etc. Can be mentioned.
  • dielectric material and the insulating material well-known and customary materials can be used, and examples thereof include cycloolefin polymer, fluororesin, butyral resin, glass, paper, Teflon (registered trademark) and the like. These can be used alone or in combination of two or more.
  • a binder resin such as an alkyl cellulose resin, a polyvinyl acetal resin, or an acrylic resin can be added to the electronic device manufacturing paste composition of the present invention. Is preferably about 10% by weight or less, particularly preferably 5% by weight or less. When the content of the binder resin exceeds the above range, it tends to be difficult to suppress the deterioration of electrical characteristics, poor wiring / coating film formation, and the occurrence of delamination.
  • the paste composition for manufacturing an electronic device of the present invention has the above-described configuration, it has a viscosity suitable for manufacturing an electronic device by a printing method.
  • it can be dried and fired at a lower temperature than conventional paste compositions to which viscosity is imparted by a polymer binder resin such as ethyl cellulose, and can prevent softening and deformation of the coated surface member in the drying process. it can.
  • no ash remains in the wiring / coating film even after the firing step, and it is possible to suppress deterioration of electrical characteristics, poor wiring / coating film formation, and delamination.
  • the paste composition for manufacturing an electronic device of the present invention can be applied to a surface member to be coated (for example, a ceramic substrate, a green sheet, etc.) by a screen printing method, and a wiring and a coating film can be formed through a drying and firing process. .
  • an electronic device excellent in conductivity or insulation while preventing a decrease in yield due to generation of delamination due to poor wiring and coating film formation by a printing method. Can be manufactured.
  • the electronic device manufacturing paste composition of the present invention is particularly useful for manufacturing capacitors, inductors, varistors, thermistors, speakers, actuators, antennas, solid oxide fuel cells (SOFC), etc. (especially multilayer ceramic capacitors). It is.
  • Example 1 3-hydroxydecanoic acid (manufactured by Wako Pure Chemical Industries, Ltd.) as a gelling agent was added to ethyl lactate acetate (manufactured by Daicel Corporation) as a solvent so that the gelling agent concentration was 30% by weight. Thus, a solvent composition (1) was obtained. The obtained solvent composition (1) was dissolved by heating at a liquid temperature of 65 ° C. for 0.5 hours and allowed to cool to room temperature (25 ° C.) to obtain a gelled paste composition (1).
  • Examples 2-8 Solvent compositions (2) to (8) were obtained in the same manner as in Example 1 except that the composition (unit: weight ratio) shown in Table 1 below was changed, and paste compositions (2) to (8) were obtained. It was.
  • Comparative Example 1 Dipropylene glycol methyl n-propyl ether (Daicel Co., Ltd.) using ethyl cellulose (trade name “Etocel STD”, manufactured by Dow Chemical Co.) as a solvent as a polymer binder resin so that the resin concentration becomes 10% by weight. To obtain a solvent composition (9). The obtained solvent composition (9) was dissolved by heating at a liquid temperature of 65 ° C. for 3 hours and allowed to cool to room temperature (25 ° C.) to obtain a highly viscous solution.
  • ethyl cellulose trade name “Etocel STD”, manufactured by Dow Chemical Co.
  • Comparative Example 1 remained as ash in an amount of 6.3% by weight of the entire resin solution even when heated at 350 ° C., whereas most of the gelling agents used in the Examples were Before the temperature was raised to 350 ° C., it was completely vaporized, leaving no ash.
  • the solvent composition for producing an electronic device of the present invention can form a paste composition having a viscosity suitable for formation of a wiring / coating film by a printing method by heating and dissolving. And if the said paste composition is used, it will be hard to drip and a highly accurate wiring pattern can be formed. Moreover, in a drying process and a baking process, it can dry and bake at low temperature, and it can prevent softening and a deformation
  • the solvent composition for producing an electronic device of the present invention is extremely useful as a raw material for a paste composition for forming a fine pattern of an electric device by each printing method.

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Abstract

Provided is a solvent composition capable of inhibiting a reduction in electrical characteristics, defects in wiring and coating film formation, and the occurrence of delamination, the solvent composition serving as a raw material of a paste composition for forming a coating film or wiring of an electronic device by coating on a coating surface member by printing. This solvent composition for manufacturing an electronic device is used for manufacturing an electronic device by printing, wherein the solvent composition comprises a solvent and a compound (excluding monohydroxy steric acid) expressed by the following formula (1) R1-CH2-R2 (1) (where R1 represents a monohydroxyalkyl group, and R2 represents a carboxyl group (C(=O)OH) or an amide group (C(=O)NH2).

Description

電気デバイス製造用溶剤組成物Solvent composition for manufacturing electrical devices
　本発明は、加熱溶解することによってペースト組成物を形成する溶剤組成物に関する。前記ペースト組成物は電子デバイスの製造工程において、被塗布面を有する部材（以後、「被塗布面部材」と称する場合がある）に印刷法を用いて塗布することにより配線又は塗膜を形成する用途に用いられる。 The present invention relates to a solvent composition that forms a paste composition by melting with heating. In the electronic device manufacturing process, the paste composition is applied to a member having a surface to be coated (hereinafter sometimes referred to as a “surface to be coated”) using a printing method to form a wiring or a coating film. Used for applications.
　印刷法を用いて製造する電子デバイスにはコンデンサ、インダクタ、バリスタ、サーミスタ、トランジスタ、スピーカ、アクチュエータ、アンテナ、固体酸化物燃料電池（SOFC）などがある。 Electronic devices manufactured using the printing method include capacitors, inductors, varistors, thermistors, transistors, speakers, actuators, antennas, solid oxide fuel cells (SOFC), and the like.
　例えば積層コンデンサは、一般的に、次のような工程を経て製造される。
　１．セラミックスの粉末をポリビニルブチラール等のポリビニルアセタール樹脂又はアクリル樹脂等のバインダー樹脂と溶剤で分散させてスラリーとし、シート状に成形してグリーンシートを得る。
　２．導電性金属材料（例えば、ニッケル、パラジウム等）、バインダー樹脂（例えば、エチルセルロース等）、及び有機溶剤（例えば、ターピネオール等）を主成分とするペースト組成物を、グリーンシート上に印刷法等により塗布し配線、塗膜を形成する（塗布工程）。
　３．上記ペースト組成物中の有機溶剤を乾燥させる（乾燥工程）。
　４．配線、塗膜が形成された積層シートを所定寸法に切断し、複数枚積み重ねて加熱圧着して積層体とする。
　５．該積層体に電極等を取り付け、高温で焼成させると積層コンデンサが得られる（焼成工程）。 For example, a multilayer capacitor is generally manufactured through the following processes.
1. A ceramic sheet is dispersed in a polyvinyl acetal resin such as polyvinyl butyral or a binder resin such as an acrylic resin and a solvent to form a slurry, which is then formed into a sheet to obtain a green sheet.
2. A paste composition mainly composed of a conductive metal material (for example, nickel, palladium), a binder resin (for example, ethyl cellulose), and an organic solvent (for example, terpineol) is applied on a green sheet by a printing method or the like. Wiring and coating film are formed (application process).
3. The organic solvent in the paste composition is dried (drying step).
4). The laminated sheet on which the wiring and coating film are formed is cut into a predetermined size, and a plurality of sheets are stacked and thermocompression bonded to obtain a laminated body.
5. When an electrode or the like is attached to the multilayer body and fired at a high temperature, a multilayer capacitor is obtained (firing step).
　上記バインダー樹脂は導電性金属材料又は絶縁材料を固定する働きを有する。従来、塗工性に優れ、精密な形状の塗膜を容易に形成することができるという理由から、エチルセルロース樹脂が主に用いられてきた。しかし、エチルセルロース樹脂は熱分解性が低いため焼成後にカーボン成分が灰分として残留し、それにより電気特性が低下したり、熱分解する過程で揮発分となり空隙（ボイド）を発生させ、配線・塗膜形成の不良や層間剥離（デラミネーション）等により歩留まりを低下させたりすることが問題であった。 The binder resin has a function of fixing the conductive metal material or the insulating material. Conventionally, ethyl cellulose resin has been mainly used because it has excellent coatability and can easily form a coating film with a precise shape. However, since ethylcellulose resin has low thermal decomposability, the carbon component remains as ash after firing, which reduces electrical properties and causes volatiles to form voids in the process of thermal decomposition, resulting in wiring and coating films. It has been a problem to reduce the yield due to poor formation or delamination.
　従来は各層の膜厚が厚かったためにこれらの問題はそれほど大きくなかったが、近年、電子デバイスの高性能化、小型化に伴い、装置を構成する配線、塗膜、セラミック層の薄層化が求められる結果、このような問題が顕著に認められるようになった。 Conventionally, these problems were not so great because the thickness of each layer was large, but in recent years, with the improvement in performance and miniaturization of electronic devices, the wiring, coating film, and ceramic layer constituting the device have become thinner. As a result, such a problem has been recognized remarkably.
　そこで、電気特性の低下、配線・塗膜形成の不良、及びデラミネーションの発生を改善する方法として、ペースト組成物に含まれるバインダー樹脂の改善が種々検討された。例えば、特許文献１には、エチルセルロース樹脂に代えてポリビニルアセタール樹脂を用いることでグリーンシートとの密着性向上や灰分を低減することが開示されている。しかしながら、上記ポリビニルアセタール樹脂を使用しても導電性の低下、配線・塗膜形成の不良、及びデラミネーションの発生を完全に防ぐことは困難であった。 Therefore, various improvements of the binder resin contained in the paste composition have been studied as methods for improving the deterioration of electrical characteristics, the poor wiring / coating film formation, and the occurrence of delamination. For example, Patent Document 1 discloses that using a polyvinyl acetal resin instead of an ethyl cellulose resin improves adhesion with a green sheet and reduces ash content. However, even if the polyvinyl acetal resin is used, it has been difficult to completely prevent the decrease in conductivity, the poor wiring / coating film formation, and the occurrence of delamination.
特開２００６－２９９０３０号公報JP 2006-299030 A
　従って、本発明の目的は、印刷法により被塗布面部材に塗布することにより電子デバイスの配線又は塗膜形成を行うペースト組成物の原料となる溶剤組成物であって、電気特性の低下、配線・塗膜形成の不良、及びデラミネーションの発生を抑制することができる溶剤組成物を提供することにある。 Accordingly, an object of the present invention is a solvent composition which is a raw material of a paste composition for performing wiring or coating film formation of an electronic device by being applied to a surface member to be coated by a printing method. -It is providing the solvent composition which can suppress the defect of coating-film formation and generation | occurrence | production of delamination.
　本発明者等は上記課題を解決するため鋭意検討した結果、特定の構造を有する低分子のゲル化剤は、加熱溶融すると溶剤中において自己組織化によりひも状会合体を形成して高分子のような粘性を示すこと、エチルセルロース等の高分子化合物に比べ低温で揮発すること、熱分解性に優れ、焼成による灰分の残留や揮発分の発生を著しく低減することができることを見いだした。 As a result of intensive studies to solve the above problems, the present inventors have found that a low molecular gelling agent having a specific structure forms a string-like aggregate by self-organization in a solvent when heated and melted. It has been found that it exhibits such a viscosity, volatilizes at a low temperature as compared with a high molecular compound such as ethyl cellulose, is excellent in thermal decomposability, and can significantly reduce the residue of ash and the generation of volatile components by baking.
　そして、印刷法による電子デバイス製造において、エチルセルロース等のバインダー樹脂を溶剤と混合して得られたペースト組成物に代えて前記低分子のゲル化剤と溶剤との混合物を加熱溶解して得られるペースト組成物を使用すると、塗布工程においては印刷法による配線・塗膜の形成に適した粘度を有し、液ダレしにくく高精度の配線パターンを形成することができること、乾燥工程及び焼成工程においては、長時間高温で加熱する必要が無く、低温で速やかに乾燥・焼成することができ、被塗布面部材が長時間高温に曝されることにより軟化、変形することを防止できること、焼成工程を経ても配線・塗膜中に灰分の残留や揮発分の発生を著しく低減することができ、これらにより引き起こされていた電気特性の低下、配線・塗膜形成の不良、及びデラミネーションの発生を抑制することができることを見いだした。本発明はこれらの知見に基づいて完成させたものである。 And in electronic device manufacturing by printing method, instead of paste composition obtained by mixing binder resin such as ethyl cellulose with solvent, paste obtained by heating and dissolving the mixture of low molecular weight gelling agent and solvent When the composition is used, the coating process has a viscosity suitable for the formation of wiring and coating films by the printing method, and is capable of forming a highly accurate wiring pattern that is difficult to drip, in the drying process and firing process. It is not necessary to heat at a high temperature for a long time, it can be quickly dried and fired at a low temperature, the coated surface member can be prevented from being softened and deformed by being exposed to a high temperature for a long time, and through a firing process. As a result, the generation of residual ash and volatile components in the wiring and coating film can be significantly reduced. It found that it is possible to suppress defects and the occurrence of delamination. The present invention has been completed based on these findings.
　すなわち、本発明は、印刷法により電子デバイスを製造するための溶剤組成物であって、溶剤と下記式（１）
　　　Ｒ1－ＣＨ2－Ｒ2　　　（１）
（式中、Ｒ1はモノヒドロキシアルキル基を示し、Ｒ2はカルボキシル基（Ｃ（＝Ｏ）ＯＨ）又はアミド基（Ｃ（＝Ｏ）ＮＨ2）を示す）
で表される化合物（但し、モノヒドロキシステアリン酸を除く）を含む電子デバイス製造用溶剤組成物を提供する。 That is, this invention is a solvent composition for manufacturing an electronic device by a printing method, Comprising: A solvent and following formula (1)
R 1 —CH 2 —R 2 (1)
(In the formula, R 1 represents a monohydroxyalkyl group, and R 2 represents a carboxyl group (C (═O) OH) or an amide group (C (═O) NH 2 )).
The solvent composition for electronic device manufacture containing the compound (however, except monohydroxystearic acid) represented by these is provided.
　前記式（１）で表される化合物としては、Ｒ1がモノヒドロキシＣ8-14アルキル基である化合物が好ましく、特に、ヒドロキシデカン酸、ヒドロキシドデカン酸、ヒドロキシテトラデカン酸、及びヒドロキシヘキサデカン酸から選択される少なくとも１つであることが好ましい。 The compound represented by the formula (1) is preferably a compound in which R 1 is a monohydroxy C 8-14 alkyl group, and particularly selected from hydroxydecanoic acid, hydroxydodecanoic acid, hydroxytetradecanoic acid, and hydroxyhexadecanoic acid. Preferably at least one of
　前記溶剤のＳＰ値は７．８～１１．８が好ましい。 The SP value of the solvent is preferably 7.8 to 11.8.
　前記溶剤としては、プロピレングリコールメチル－ｎ－プロピルエーテル、プロピレングリコールメチル－ｎ－ブチルエーテル、ジプロピレングリコールジメチルエーテル、ジプロピレングリコールメチル－ｎ－プロピルエーテル、ジプロピレングリコールメチル－ｎ－ブチルエーテル、３－メトキシブチルアセテート、ジプロピレングリコールメチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、シクロヘキサノールアセテート、乳酸エチルアセテート、プロピレングリコールジアセテート、１，４－ブタンジオールジアセテート、プロピレングリコールモノメチルエーテル、３－メトキシブタノール、及び１，２，５，６－テトラヒドロベンジルアルコールから選択される少なくとも１つが好ましい。 Examples of the solvent include propylene glycol methyl-n-propyl ether, propylene glycol methyl-n-butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl-n-propyl ether, dipropylene glycol methyl-n-butyl ether, 3-methoxybutyl. Acetate, dipropylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanol acetate, ethyl lactate acetate, propylene glycol diacetate, 1,4-butanediol diacetate, propylene glycol monomethyl ether, 3-methoxybutanol, and 1, At least one selected from 2,5,6-tetrahydrobenzyl alcohol is preferred.
　式（１）で表される化合物の含有量としては、電子デバイス製造用溶剤組成物全体の０．１～５０重量％が好ましい。 The content of the compound represented by the formula (1) is preferably 0.1 to 50% by weight of the whole solvent composition for producing an electronic device.
　本発明は、また、前記電子デバイス製造用溶剤組成物を３０～９０℃で加熱溶解することを特徴とする電子デバイス製造用ペースト組成物の製造方法を提供する。 The present invention also provides a method for producing a paste composition for producing an electronic device, wherein the solvent composition for producing an electronic device is dissolved by heating at 30 to 90 ° C.
　本発明は、更に、前記電子デバイス製造用ペースト組成物の製造方法により得られる電子デバイス製造用ペースト組成物を提供する。 The present invention further provides an electronic device manufacturing paste composition obtained by the method for manufacturing an electronic device manufacturing paste composition.
　前記電子デバイス製造用ペースト組成物は、更に、導電性金属材料、半導体材料、磁性材料、誘電材料、又は絶縁材料を含むことが好ましい。 The electronic device manufacturing paste composition preferably further includes a conductive metal material, a semiconductor material, a magnetic material, a dielectric material, or an insulating material.
　前記電子デバイス製造用ペースト組成物は、バインダー樹脂含有量が１０重量％以下であることが好ましい。 The electronic device manufacturing paste composition preferably has a binder resin content of 10% by weight or less.
　本発明の電子デバイス製造用溶剤組成物は、上記特定の構造を有する低分子のゲル化剤を含有するため、加熱溶解することにより、印刷法による配線・塗膜の形成に適した粘度を有するペースト組成物を形成することができる。
　そして、前記ペースト組成物を使用すると、液ダレしにくく高精度の配線パターンを形成することができる。また、乾燥工程及び焼成工程において、低温で乾燥・焼成することができ、被塗布面部材が長時間高温に曝されることにより軟化、変形することを防止できる。更に、焼成工程を経ても配線・塗膜中に灰分の残留や揮発分の発生を著しく低減することができ、これらにより引き起こされていた電気特性の低下、配線・塗膜形成の不良、及びデラミネーションの発生を抑制することができ、配線・塗膜形成の不良やデラミネーション等による歩留まりの低下を解消し、電気特性に優れた配線、塗膜を形成することができる。
　従って、本発明の電子デバイス製造用溶剤組成物は、各印刷法により電気デバイスの微細パターンを形成するペースト組成物の原料として極めて有用である。 Since the solvent composition for producing an electronic device of the present invention contains a low-molecular gelling agent having the above specific structure, it has a viscosity suitable for forming a wiring / coating film by a printing method by dissolving it by heating. A paste composition can be formed.
And if the said paste composition is used, it will be hard to drip and a highly accurate wiring pattern can be formed. Moreover, in a drying process and a baking process, it can dry and bake at low temperature, and it can prevent softening and a deformation | transformation when a to-be-coated surface member is exposed to high temperature for a long time. Furthermore, the ash residue and volatile matter in the wiring / coating film can be significantly reduced even after the firing process, resulting in the deterioration of electrical characteristics, poor wiring / coating film formation, and degeneration. Generation of lamination can be suppressed, and a decrease in yield due to poor wiring / coating film formation or delamination can be eliminated, and wiring and coating films having excellent electrical characteristics can be formed.
Therefore, the solvent composition for producing an electronic device of the present invention is extremely useful as a raw material for a paste composition for forming a fine pattern of an electric device by each printing method.
図１は実施例で使用したゲル化剤（3HDA,3HDDA,3HTDA,3HHexDA）、及び比較例で使用した高分子バインダー樹脂（ETHOCEL）について２０℃から４００℃まで１０℃／分で昇温した際の重量減少態様と、３５０℃における残留灰分量を示す図である。Fig. 1 shows the gelling agent used in the examples (3HDA, 3HDDA, 3HTDA, 3HHexDA) and the polymer binder resin (ETHOCEL) used in the comparative example when the temperature was raised from 20 ° C to 400 ° C at 10 ° C / min. It is a figure which shows the weight reduction | decrease aspect of this, and the residual ash content in 350 degreeC.
　［電子デバイス製造用溶剤組成物］
　本発明の電子デバイス製造用溶剤組成物は、溶剤と式（１）で表される化合物を含むことを特徴とする。 [Solvent composition for manufacturing electronic devices]
The solvent composition for manufacturing an electronic device according to the present invention includes a solvent and a compound represented by the formula (1).
　（式（１）で表される化合物：ゲル化剤）
　本発明のゲル化剤は、下記式（１）
　　　Ｒ1－ＣＨ2－Ｒ2　　　（１）
（式中、Ｒ1はモノヒドロキシアルキル基を示し、Ｒ2はカルボキシル基（Ｃ（＝Ｏ）ＯＨ）又はアミド基（Ｃ（＝Ｏ）ＮＨ2）を示す）
で表される化合物（但し、モノヒドロキシステアリン酸を除く）である。 (Compound represented by formula (1): gelling agent)
The gelling agent of the present invention has the following formula (1)
R 1 —CH 2 —R 2 (1)
(In the formula, R 1 represents a monohydroxyalkyl group, and R 2 represents a carboxyl group (C (═O) OH) or an amide group (C (═O) NH 2 )).
(Except for monohydroxystearic acid).
　式（１）中、Ｒ1はモノヒドロキシアルキル基を示し、アルキル基にヒドロキシル基が１つ置換した構造を有する。前記アルキル基としては、例えば、ｎ－オクチル、ｎ－ノニル、ｎ－デシル、ｎ－ウンデシル、ｎ－ドデシル、ｎ－トリデシル、ｎ－テトラデシル基などの炭素数８～１４の直鎖状アルキル基等を挙げることができる。 In Formula (1), R 1 represents a monohydroxyalkyl group, and has a structure in which one hydroxyl group is substituted on the alkyl group. Examples of the alkyl group include linear alkyl groups having 8 to 14 carbon atoms such as n-octyl, n-nonyl, n-decyl, n-undecyl, n-dodecyl, n-tridecyl, and n-tetradecyl groups. Can be mentioned.
　上記式（１）で表される化合物におけるＲ2がカルボキシル基の場合（すなわち、ヒドロキシ脂肪酸）の具体例としては、３－ヒドロキシデカン酸、４－ヒドロキシデカン酸、５－ヒドロキシデカン酸、６－ヒドロキシデカン酸、７－ヒドロキシデカン酸、８－ヒドロキシデカン酸、９－ヒドロキシデカン酸、１０－ヒドロキシデカン酸、３－ヒドロキシドデカン酸、４－ヒドロキシドデカン酸、５－ヒドロキシドデカン酸、６－ヒドロキシドデカン酸、７－ヒドロキシドデカン酸、８－ヒドロキシドデカン酸、９－ヒドロキシドデカン酸、１０－ヒドロキシドデカン酸、１１－ヒドロキシドデカン酸、３－ヒドロキシトリデカン酸、４－ヒドロキシトリデカン酸、５－ヒドロキシトリデカン酸、６－ヒドロキシトリデカン酸、７－ヒドロキシトリデカン酸、８－ヒドロキシトリデカン酸、９－ヒドロキシトリデカン酸、１０－ヒドロキシトリデカン酸、１１－ヒドロキシトリデカン酸、１２－ヒドロキシトリデカン酸、３－ヒドロキシテトラデカン酸、４－ヒドロキシテトラデカン酸、５－ヒドロキシテトラデカン酸、６－ヒドロキシテトラデカン酸、７－ヒドロキシテトラデカン酸、８－ヒドロキシテトラデカン酸、９－ヒドロキシテトラデカン酸、１０－ヒドロキシテトラデカン酸、１１－ヒドロキシテトラデカン酸、１２－ヒドロキシテトラデカン酸、１３－ヒドロキシテトラデカン酸、３－ヒドロキシペンタデカン酸、４－ヒドロキシペンタデカン酸、５－ヒドロキシペンタデカン酸、６－ヒドロキシペンタデカン酸、７－ヒドロキシペンタデカン酸、８－ヒドロキシペンタデカン酸、９－ヒドロキシペンタデカン酸、１０－ヒドロキシペンタデカン酸、１１－ヒドロキシペンタデカン酸、１２－ヒドロキシペンタデカン酸、１３－ヒドロキシペンタデカン酸、１４－ヒドロキシペンタデカン酸、３－ヒドロキシヘキサデカン酸、４－ヒドロキシヘキサデカン酸、５－ヒドロキシヘキサデカン酸、６－ヒドロキシヘキサデカン酸、７－ヒドロキシヘキサデカン酸、８－ヒドロキシヘキサデカン酸、９－ヒドロキシヘキサデカン酸、１０－ヒドロキシヘキサデカン酸、１１－ヒドロキシヘキサデカン酸、１２－ヒドロキシヘキサデカン酸、１３－ヒドロキシヘキサデカン酸、１４－ヒドロキシヘキサデカン酸、１５－ヒドロキシヘキサデカン酸等を挙げることができる。これらは１種を単独で、又は２種以上を組み合わせて使用することができる。 Specific examples of the compound represented by the above formula (1) when R 2 is a carboxyl group (that is, hydroxy fatty acid) include 3-hydroxydecanoic acid, 4-hydroxydecanoic acid, 5-hydroxydecanoic acid, 6- Hydroxydecanoic acid, 7-hydroxydecanoic acid, 8-hydroxydecanoic acid, 9-hydroxydecanoic acid, 10-hydroxydecanoic acid, 3-hydroxydodecanoic acid, 4-hydroxydodecanoic acid, 5-hydroxydodecanoic acid, 6-hydroxydodecane Acid, 7-hydroxydodecanoic acid, 8-hydroxydodecanoic acid, 9-hydroxydodecanoic acid, 10-hydroxydodecanoic acid, 11-hydroxydodecanoic acid, 3-hydroxytridecanoic acid, 4-hydroxytridecanoic acid, 5-hydroxytridecanoic acid Decanoic acid, 6-hydroxytridecanoic acid, 7-hydroxy Tridecanoic acid, 8-hydroxytridecanoic acid, 9-hydroxytridecanoic acid, 10-hydroxytridecanoic acid, 11-hydroxytridecanoic acid, 12-hydroxytridecanoic acid, 3-hydroxytetradecanoic acid, 4-hydroxytetradecanoic acid, 5-hydroxytetradecanoic acid, 6-hydroxytetradecanoic acid, 7-hydroxytetradecanoic acid, 8-hydroxytetradecanoic acid, 9-hydroxytetradecanoic acid, 10-hydroxytetradecanoic acid, 11-hydroxytetradecanoic acid, 12-hydroxytetradecanoic acid, 13- Hydroxytetradecanoic acid, 3-hydroxypentadecanoic acid, 4-hydroxypentadecanoic acid, 5-hydroxypentadecanoic acid, 6-hydroxypentadecanoic acid, 7-hydroxypentadecanoic acid, 8-hydroxypen Tadecanoic acid, 9-hydroxypentadecanoic acid, 10-hydroxypentadecanoic acid, 11-hydroxypentadecanoic acid, 12-hydroxypentadecanoic acid, 13-hydroxypentadecanoic acid, 14-hydroxypentadecanoic acid, 3-hydroxyhexadecanoic acid, 4-hydroxyhexadecanoic acid 5-hydroxyhexadecanoic acid, 6-hydroxyhexadecanoic acid, 7-hydroxyhexadecanoic acid, 8-hydroxyhexadecanoic acid, 9-hydroxyhexadecanoic acid, 10-hydroxyhexadecanoic acid, 11-hydroxyhexadecanoic acid, 12-hydroxyhexadecanoic acid, 13 -Hydroxyhexadecanoic acid, 14-hydroxyhexadecanoic acid, 15-hydroxyhexadecanoic acid and the like can be mentioned. These can be used alone or in combination of two or more.
　上記式（１）で表される化合物におけるＲ2がアミド基の場合（すなわち、ヒドロキシアミド）の具体例としては、３－ヒドロキシデカンアミド、４－ヒドロキシデカンアミド、５－ヒドロキシデカンアミド、６－ヒドロキシデカンアミド、７－ヒドロキシデカンアミド、８－ヒドロキシデカンアミド、９－ヒドロキシデカンアミド、１０－ヒドロキシデカンアミド、３－ヒドロキシドデカンアミド、４－ヒドロキシドデカンアミド、５－ヒドロキシドデカンアミド、６－ヒドロキシドデカンアミド、７－ヒドロキシドデカンアミド、８－ヒドロキシドデカンアミド、９－ヒドロキシドデカンアミド、１０－ヒドロキシドデカンアミド、１１－ヒドロキシドデカンアミド、３－ヒドロキシトリデカンアミド、４－ヒドロキシトリデカンアミド、５－ヒドロキシトリデカンアミド、６－ヒドロキシトリデカンアミド、７－ヒドロキシトリデカンアミド、８－ヒドロキシトリデカンアミド、９－ヒドロキシトリデカンアミド、１０－ヒドロキシトリデカンアミド、１１－ヒドロキシトリデカンアミド、１２－ヒドロキシトリデカンアミド、３－ヒドロキシテトラデカンアミド、４－ヒドロキシテトラデカンアミド、５－ヒドロキシテトラデカンアミド、６－ヒドロキシテトラデカンアミド、７－ヒドロキシテトラデカンアミド、８－ヒドロキシテトラデカンアミド、９－ヒドロキシテトラデカンアミド、１０－ヒドロキシテトラデカンアミド、１１－ヒドロキシテトラデカンアミド、１２－ヒドロキシテトラデカンアミド、１３－ヒドロキシテトラデカンアミド、３－ヒドロキシペンタデカンアミド、４－ヒドロキシペンタデカンアミド、５－ヒドロキシペンタデカンアミド、６－ヒドロキシペンタデカンアミド、７－ヒドロキシペンタデカンアミド、８－ヒドロキシペンタデカンアミド、９－ヒドロキシペンタデカンアミド、１０－ヒドロキシペンタデカンアミド、１１－ヒドロキシペンタデカンアミド、１２－ヒドロキシペンタデカンアミド、１３－ヒドロキシペンタデカンアミド、１４－ヒドロキシペンタデカンアミド、３－ヒドロキシヘキサデカンアミド、４－ヒドロキシヘキサデカンアミド、５－ヒドロキシヘキサデカンアミド、６－ヒドロキシヘキサデカンアミド、７－ヒドロキシヘキサデカンアミド、８－ヒドロキシヘキサデカンアミド、９－ヒドロキシヘキサデカンアミド、１０－ヒドロキシヘキサデカンアミド、１１－ヒドロキシヘキサデカンアミド、１２－ヒドロキシヘキサデカンアミド、１３－ヒドロキシヘキサデカンアミド、１４－ヒドロキシヘキサデカンアミド、１５－ヒドロキシヘキサデカンアミド等を挙げることができる。これらは１種を単独で、又は２種以上を組み合わせて使用することができる。 Specific examples of R 2 in the compound represented by the above formula (1) being an amide group (ie, hydroxyamide) include 3-hydroxydecanamide, 4-hydroxydecanamide, 5-hydroxydecanamide, 6- Hydroxydecanamide, 7-hydroxydecanamide, 8-hydroxydecanamide, 9-hydroxydecanamide, 10-hydroxydecanamide, 3-hydroxydodecanamide, 4-hydroxydodecanamide, 5-hydroxydodecanamide, 6-hydroxydodecanamide Amide, 7-hydroxydodecanamide, 8-hydroxydodecanamide, 9-hydroxydodecanamide, 10-hydroxydodecanamide, 11-hydroxydodecanamide, 3-hydroxytridecanamide, 4-hydroxytridecanamide 5-hydroxytridecanamide, 6-hydroxytridecanamide, 7-hydroxytridecanamide, 8-hydroxytridecanamide, 9-hydroxytridecanamide, 10-hydroxytridecanamide, 11-hydroxytridecanamide, 12 -Hydroxytridecanamide, 3-hydroxytetradecanamide, 4-hydroxytetradecanamide, 5-hydroxytetradecanamide, 6-hydroxytetradecanamide, 7-hydroxytetradecanamide, 8-hydroxytetradecanamide, 9-hydroxytetradecanamide, 10- Hydroxytetradecanamide, 11-hydroxytetradecanamide, 12-hydroxytetradecanamide, 13-hydroxytetradecanamide, 3-hydroxypentadecane Canamide, 4-hydroxypentadecanamide, 5-hydroxypentadecanamide, 6-hydroxypentadecanamide, 7-hydroxypentadecanamide, 8-hydroxypentadecanamide, 9-hydroxypentadecanamide, 10-hydroxypentadecanamide, 11-hydroxypentadecanamide, 12-hydroxypentadecanamide, 13-hydroxypentadecanamide, 14-hydroxypentadecanamide, 3-hydroxyhexadecanamide, 4-hydroxyhexadecanamide, 5-hydroxyhexadecanamide, 6-hydroxyhexadecanamide, 7-hydroxyhexadecanamide, 8- Hydroxyhexadecanamide, 9-hydroxyhexadecanamide, 10-hydroxyhexadecanami , 11-hydroxy hexadecanoic amide, 12-hydroxystearic hexadecanamide, 13-hydroxy hexadecanoic amide, 14-hydroxy hexadecanoic amide, can be mentioned 15-hydroxy hexadecanoic amide. These can be used alone or in combination of two or more.
　上記式（１）で表される化合物としては、なかでも、蒸発温度が１２０～３８０℃（好ましくは１５０～３３０℃、特に好ましくは１５０～２８０℃、最も好ましくは１５０～２７０℃）のものが好ましい。蒸発温度が上記範囲を上回ると、低温条件において速やかに気化することが困難となり、被塗布面部材が長時間高温に曝されることにより軟化、変形することを防止することが困難となる傾向がある。一方、蒸発温度が上記範囲を下回ると、ペースト組成物調整時若しくは印刷時に気化して組成が変動する恐れがあり、安定した配線・塗膜形成が困難となる傾向がある。尚、本発明において「蒸発温度」は、示差熱熱重量同時測定装置（ＴＧ／ＤＴＡ）を使用して２０℃から４００℃まで１０℃／分で昇温測定した場合に、重量が０．１％以下に減少した時点の温度である。 Among the compounds represented by the above formula (1), those having an evaporation temperature of 120 to 380 ° C. (preferably 150 to 330 ° C., particularly preferably 150 to 280 ° C., most preferably 150 to 270 ° C.) preferable. When the evaporation temperature exceeds the above range, it is difficult to quickly vaporize under low temperature conditions, and it becomes difficult to prevent the coated surface member from being softened and deformed by being exposed to a high temperature for a long time. is there. On the other hand, if the evaporation temperature is lower than the above range, the composition may change due to vaporization at the time of preparing the paste composition or at the time of printing, so that stable wiring / coating film formation tends to be difficult. In the present invention, the “evaporation temperature” is a weight of 0.1 when a temperature rise measurement is performed at 10 ° C./min from 20 ° C. to 400 ° C. using a differential thermothermal gravimetric simultaneous measurement device (TG / DTA). It is the temperature when it decreases to less than%.
　本発明における上記式（１）で表される化合物としては、なかでも、ヒドロキシデカン酸、ヒドロキシドデカン酸、ヒドロキシテトラデカン酸、ヒドロキシヘキサデカン酸等の、式（１）中のＲ1がモノヒドロキシＣ8-14アルキル基（より好ましくはモノヒドロキシＣ10-14アルキル基、特に好ましくはモノヒドロキシＣ12-14アルキル基）であるヒドロキシ脂肪酸が好ましく、特に、３－ヒドロキシデカン酸、３－ヒドロキシドデカン酸、３－ヒドロキシテトラデカン酸、３－ヒドロキシヘキサデカン酸等の、式（１）中のＲ1が３－ヒドロキシＣ8-14アルキル基（より好ましくは３－ヒドロキシＣ10-14アルキル基、特に好ましくは３－ヒドロキシＣ12-14アルキル基）である３－ヒドロキシ脂肪酸が好ましい。これらは１種を単独で、又は２種以上を組み合わせて使用することができる。 Among the compounds represented by the above formula (1) in the present invention, among them, R 1 in the formula (1) such as hydroxydecanoic acid, hydroxydodecanoic acid, hydroxytetradecanoic acid, hydroxyhexadecanoic acid is monohydroxy C 8. Hydroxy fatty acids which are -14 alkyl groups (more preferably monohydroxy C 10-14 alkyl groups, particularly preferably monohydroxy C 12-14 alkyl groups), especially 3-hydroxydecanoic acid, 3-hydroxydodecanoic acid, R 1 in the formula (1) such as 3-hydroxytetradecanoic acid and 3-hydroxyhexadecanoic acid is a 3-hydroxy C 8-14 alkyl group (more preferably a 3-hydroxy C 10-14 alkyl group, particularly preferably 3 3-hydroxy fatty acids which are -hydroxy C 12-14 alkyl groups) are preferred. These can be used alone or in combination of two or more.
　電子デバイス製造用溶剤組成物中の式（１）で表される化合物の含有量（２種以上含有する場合は合計含有量）は、例えば０．１～５０重量％程度、好ましくは１～４０重量％、より好ましくは３～３０重量％、特に好ましくは５～２０重量％、最も好ましくは７～１５重量％である。式（１）で表される化合物の含有量が上記範囲を下回ると温度変化によって溶液化する等、安定なゲル状態を有するペースト組成物を得ることが困難となり、液ダレにより高精度の配線パターンを形成することが困難となる場合がある。一方、式（１）で表される化合物の含有量が上記範囲を上回ると、ペースト組成物の粘度が高くなりすぎ、印刷法により配線又は塗膜の形成を行うことが困難となる場合がある。 The content of the compound represented by the formula (1) in the solvent composition for producing an electronic device (the total content when two or more compounds are contained) is, for example, about 0.1 to 50% by weight, preferably 1 to 40%. % By weight, more preferably 3 to 30% by weight, particularly preferably 5 to 20% by weight, and most preferably 7 to 15% by weight. When the content of the compound represented by the formula (1) is below the above range, it becomes difficult to obtain a paste composition having a stable gel state such as a solution by temperature change. May be difficult to form. On the other hand, when the content of the compound represented by the formula (1) exceeds the above range, the viscosity of the paste composition becomes too high, and it may be difficult to form a wiring or a coating film by a printing method. .
　（溶剤）
　本発明の電子デバイス製造用溶剤組成物に含まれる溶剤としては、上記式（１）で表される化合物と加熱溶融することによりゲルを形成する性質を有する溶剤を使用することが好ましい。前記溶剤としては、例えば、２５℃における溶解パラメーター（ＳＰ値：Ｆｅｄｏｒｓ計算値）が７．８～１１．８程度、好ましくは８．０～１１．０、特に好ましくは９．０～１０．０の溶剤を使用することが好ましい。溶解パラメーターが上記の値を上回る溶剤を使用すると、上記式（１）で表される化合物が溶媒和され、ひも状会合体を形成する駆動力となる分子間水素結合が切断されるため、ゲル化が困難となる傾向がある。一方、溶解パラメーターが上記の値を下回る溶剤を使用すると、上記式（１）で表される化合物が溶媒和され難いため凝集して再結晶し易く、やはりゲル化が困難となる傾向がある。 (solvent)
As the solvent contained in the solvent composition for producing an electronic device of the present invention, it is preferable to use a solvent having a property of forming a gel by heating and melting with the compound represented by the above formula (1). Examples of the solvent include a solubility parameter (SP value: Fedors calculated value) at 25 ° C. of about 7.8 to 11.8, preferably 8.0 to 11.0, particularly preferably 9.0 to 10.0. It is preferable to use the solvent. When a solvent having a solubility parameter exceeding the above value is used, the compound represented by the above formula (1) is solvated and the intermolecular hydrogen bond serving as a driving force for forming a string-like aggregate is cleaved. Tends to be difficult. On the other hand, when a solvent having a solubility parameter lower than the above value is used, the compound represented by the above formula (1) is difficult to be solvated, and thus tends to aggregate and recrystallize, and gelation tends to be difficult.
　本発明の溶剤としては、例えば、ｎ－プロパノール（ＳＰ値：１１．８）、１，２，５，６－テトラヒドロベンジルアルコール（ＳＰ値：１１．３）、ジエチレングリコールエチルエーテル（ＳＰ値：１０．９）、３－メトキシブタノール（ＳＰ値：１０．９）、トリアセチン（ＳＰ値：１０．２）、プロピレングリコールモノメチルエーテル（ＳＰ値：１０．２）、シクロペンタノン（ＳＰ値：１０．０）、γ－ブチロラクトン（ＳＰ値：９．９）、シクロヘキサノン（ＳＰ値：９．９）、プロピレングリコール－ｎ－プロピルエーテル（ＳＰ値：９．８）、プロピレングリコール－ｎ－ブチルエーテル（ＳＰ値：９．７）、ジプロピレングリコールメチルエーテル（ＳＰ値：９．７）、１，４－ブタンジオールジアセテート（ＳＰ値：９．６）、３－メトキシブチルアセテート（ＳＰ値：８．７）、プロピレングリコールジアセテート（ＳＰ値：９．６）、乳酸エチルアセテート（ＳＰ値：９．６）、ε－カプロラクトン（ＳＰ値：９．６）、１，３－ブチレングリコールジアセテート（ＳＰ値：９．５）、ジプロピレングリコール－ｎ－プロピルエーテル（ＳＰ値：９．５）、１，６－ヘキサンジオールジアセテート（ＳＰ値：９．５）、ジプロピレングリコール－ｎ－ブチルエーテル（ＳＰ値：９．４）、トリプロピレングリコールメチルエーテル（ＳＰ値：９．４）、トリプロピレングリコール－ｎ－ブチルエーテル（ＳＰ値：９．３）、シクロヘキサノールアセテート（ＳＰ値：９．２）、ジエチレングリコールエチルエーテルアセテート（ＳＰ値：９．０）、エチレングリコールメチルエーテルアセテート（ＳＰ値：９．０）、ジエチレングリコールモノブチルエーテルアセテート（ＳＰ値：８．９）、エチレングリコールモノブチルエーテルアセテート（ＳＰ値：８．９）、メチルアセテート（ＳＰ値：８．８）、エチルアセテート（ＳＰ値：８．７）、プロピレングリコールモノメチルエーテルアセテート（ＳＰ値：８．７）、ｎ－プロピルアセテート（ＳＰ値：８．７）、ジプロピレングリコールメチルエーテルアセテート（ＳＰ値：８．７）、３－メトキシブタノールアセテート（ＳＰ値：８．７）、ブチルアセテート（ＳＰ値：８．７）、イソプロピルアセテート（ＳＰ値：８．５）、テトラヒドロフラン（ＳＰ値：８．３）、ジプロピレングリコールメチル－ｎ－ブチルエーテル（ＳＰ値：８．０）、ジプロピレングリコールメチル－ｎ－プロピルエーテル（ＳＰ値：８．０）、ジプロピレングリコールジメチルエーテル（ＳＰ値：７．９）、プロピレングリコールメチル－ｎ－ブチルエーテル（ＳＰ値：７．８）、プロピレングリコールメチル－ｎ－プロピルエーテル（ＳＰ値：７．８）等を挙げることができる。これらは１種を単独で、又は２種以上を組み合わせて使用することができる。 Examples of the solvent of the present invention include n-propanol (SP value: 11.8), 1,2,5,6-tetrahydrobenzyl alcohol (SP value: 11.3), diethylene glycol ethyl ether (SP value: 10. 9), 3-methoxybutanol (SP value: 10.9), triacetin (SP value: 10.2), propylene glycol monomethyl ether (SP value: 10.2), cyclopentanone (SP value: 10.0) , Γ-butyrolactone (SP value: 9.9), cyclohexanone (SP value: 9.9), propylene glycol-n-propyl ether (SP value: 9.8), propylene glycol-n-butyl ether (SP value: 9) .7), dipropylene glycol methyl ether (SP value: 9.7), 1,4-butanediol diacetate (SP value: .6), 3-methoxybutyl acetate (SP value: 8.7), propylene glycol diacetate (SP value: 9.6), ethyl lactate acetate (SP value: 9.6), ε-caprolactone (SP value: 9.6), 1,3-butylene glycol diacetate (SP value: 9.5), dipropylene glycol-n-propyl ether (SP value: 9.5), 1,6-hexanediol diacetate (SP value) : 9.5), dipropylene glycol-n-butyl ether (SP value: 9.4), tripropylene glycol methyl ether (SP value: 9.4), tripropylene glycol-n-butyl ether (SP value: 9.3) ), Cyclohexanol acetate (SP value: 9.2), diethylene glycol ethyl ether acetate (SP value: 9.0), ethyl Glycol methyl ether acetate (SP value: 9.0), diethylene glycol monobutyl ether acetate (SP value: 8.9), ethylene glycol monobutyl ether acetate (SP value: 8.9), methyl acetate (SP value: 8.8) Ethyl acetate (SP value: 8.7), propylene glycol monomethyl ether acetate (SP value: 8.7), n-propyl acetate (SP value: 8.7), dipropylene glycol methyl ether acetate (SP value: 8) 7), 3-methoxybutanol acetate (SP value: 8.7), butyl acetate (SP value: 8.7), isopropyl acetate (SP value: 8.5), tetrahydrofuran (SP value: 8.3), Dipropylene glycol methyl-n-butyl ether (SP value: 8 0), dipropylene glycol methyl-n-propyl ether (SP value: 8.0), dipropylene glycol dimethyl ether (SP value: 7.9), propylene glycol methyl-n-butyl ether (SP value: 7.8), And propylene glycol methyl-n-propyl ether (SP value: 7.8). These can be used alone or in combination of two or more.
　本発明においては、なかでも、溶剤としてプロピレングリコールメチル－ｎ－プロピルエーテル、プロピレングリコールメチル－ｎ－ブチルエーテル、ジプロピレングリコールジメチルエーテル、ジプロピレングリコールメチル－ｎ－プロピルエーテル、ジプロピレングリコールメチル－ｎ－ブチルエーテル、３－メトキシブチルアセテート、ジプロピレングリコールメチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、シクロヘキサノールアセテート、乳酸エチルアセテート、プロピレングリコールジアセテート、１，４－ブタンジオールジアセテート、プロピレングリコールモノメチルエーテル、３－メトキシブタノール、及び１，２，５，６－テトラヒドロベンジルアルコールから選択される少なくとも１つを使用することが好ましい。 In the present invention, among them, as a solvent, propylene glycol methyl-n-propyl ether, propylene glycol methyl-n-butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl-n-propyl ether, dipropylene glycol methyl-n-butyl ether , 3-methoxybutyl acetate, dipropylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanol acetate, ethyl lactate acetate, propylene glycol diacetate, 1,4-butanediol diacetate, propylene glycol monomethyl ether, 3-methoxy At least selected from butanol and 1,2,5,6-tetrahydrobenzyl alcohol It is preferred to use one.
　電子デバイス製造用溶剤組成物中の溶剤の含有量（２種以上含有する場合は合計含有量）は、例えば１０～９９．９重量％程度、好ましくは２０～９９重量％、より好ましくは３０～９５重量％、特に好ましくは４０～９３重量％である。溶剤の含有量が上記範囲を下回ると、ペースト組成物の粘度が高くなりすぎ、印刷法への適用が困難となる場合がある。一方、溶剤の含有量が上記範囲を上回ると、温度変化によって溶液化する等、安定なゲル状態を有するペースト組成物を得ることが困難となり、液ダレにより高精度の配線パターンを形成することが困難となる場合がある。 The content of the solvent in the solvent composition for producing an electronic device (the total content when two or more are contained) is, for example, about 10 to 99.9% by weight, preferably 20 to 99% by weight, more preferably 30 to 30%. It is 95% by weight, particularly preferably 40 to 93% by weight. When the content of the solvent is below the above range, the viscosity of the paste composition becomes too high, and it may be difficult to apply to the printing method. On the other hand, when the content of the solvent exceeds the above range, it becomes difficult to obtain a paste composition having a stable gel state such as a solution by temperature change, and a highly accurate wiring pattern can be formed by dripping. It can be difficult.
　また、本発明の電子デバイス製造用溶剤組成物には、その効果を損なわない範囲であれば、上記溶剤以外に他の有機溶剤を添加していてもよい。他の有機溶剤を添加することにより用途に合わせた物性に調整することができる。他の有機溶剤の添加量としては、電子デバイス製造用溶剤組成物全量の、例えば５０重量％未満、好ましくは３０重量％以下、特に好ましくは２０重量％以下である。 In addition, in the solvent composition for manufacturing an electronic device of the present invention, other organic solvents may be added in addition to the above solvent as long as the effect is not impaired. By adding other organic solvents, the physical properties can be adjusted to suit the application. The amount of the other organic solvent added is, for example, less than 50% by weight, preferably 30% by weight or less, particularly preferably 20% by weight or less, based on the total amount of the solvent composition for manufacturing an electronic device.
　他の有機溶剤としては、例えば、シクロアルキルアルコール、シクロアルキルアセテート、アルキレングリコール、アルキレングリコールジアセテート、アルキレングリコールモノエーテル、アルキレングリコールジアルキルエーテル、アルキレングリコールモノエーテルアセテート、ジアルキレングリコールモノエーテル、ジアルキレングリコールジアルキルエーテル、ジアルキレングリコールモノアルキルエーテルアセテート、トリアルキレングリコールモノエーテル、トリアルキレングリコールモノエーテルアセテート、３－メトキシブタノール、３－メトキシブタノールアセテート、テトラヒドロフルフリルアルコール、テトラヒドロフルフリルアセテート、テルペン系化合物とその誘導体等を挙げることができる。 Examples of other organic solvents include cycloalkyl alcohol, cycloalkyl acetate, alkylene glycol, alkylene glycol diacetate, alkylene glycol monoether, alkylene glycol dialkyl ether, alkylene glycol monoether acetate, dialkylene glycol monoether, dialkylene glycol. Dialkyl ether, dialkylene glycol monoalkyl ether acetate, trialkylene glycol monoether, trialkylene glycol monoether acetate, 3-methoxybutanol, 3-methoxybutanol acetate, tetrahydrofurfuryl alcohol, tetrahydrofurfuryl acetate, terpene compounds and their Derivatives and the like can be mentioned.
　前記シクロアルキルアルコールとしては、例えば、シクロペンタノール、シクロヘキサノール、シクロオクチルアルコール、メチルシクロヘキシルアルコール、エチルシクロヘキシルアルコール、プロピルシクロヘキシルアルコール、イソプロピルシクロヘキシルアルコール、ブチルシクロヘキシルアルコール、イソブチルシクロヘキシルアルコール、s－ブチルシクロヘキシルアルコール、t－ブチルシクロヘキシルアルコール、ペンチルシクロヘキシルアルコール等のＣ1-5アルキル基等の置換基を有していてもよい３員～１５員のシクロアルキルアルコール等を挙げることができる。 Examples of the cycloalkyl alcohol include cyclopentanol, cyclohexanol, cyclooctyl alcohol, methyl cyclohexyl alcohol, ethyl cyclohexyl alcohol, propyl cyclohexyl alcohol, isopropyl cyclohexyl alcohol, butyl cyclohexyl alcohol, isobutyl cyclohexyl alcohol, s-butyl cyclohexyl alcohol, Examples thereof include a 3- to 15-membered cycloalkyl alcohol optionally having a substituent such as a C 1-5 alkyl group such as t-butylcyclohexyl alcohol and pentylcyclohexyl alcohol.
　前記シクロアルキルアセテートとしては、例えば、シクロヘキシルアセテート、シクロペンチルアセテート、シクロオクチルアセテート、メチルシクロヘキシルアセテート、エチルシクロヘキシルアセテート、プロピルシクロヘキシルアセテート、イソプロピルシクロヘキシルアセテート、ブチルシクロヘキシルアセテート、イソブチルシクロヘキシルアセテート、ｓ－ブチルシクロヘキシルアセテート、ｔ－ブチルシクロヘキシルアセテート、ペンチルシクロヘキシルアセテート等のＣ1-5アルキル基等の置換基を有していてもよい３員～１５員のシクロアルキルアセテート等を挙げることができる。 Examples of the cycloalkyl acetate include cyclohexyl acetate, cyclopentyl acetate, cyclooctyl acetate, methyl cyclohexyl acetate, ethyl cyclohexyl acetate, propyl cyclohexyl acetate, isopropyl cyclohexyl acetate, butyl cyclohexyl acetate, isobutyl cyclohexyl acetate, s-butyl cyclohexyl acetate, t Examples thereof include a 3- to 15-membered cycloalkyl acetate which may have a substituent such as a C 1-5 alkyl group such as butylcyclohexyl acetate and pentylcyclohexyl acetate.
　前記アルキレングリコールとしては、例えば、エチレングリコール、プロピレングリコール、１，３－プロパンジオール、１，３－ブタンジオール、１，４－ブタンジオール、１，５－ペンタンジオール、１，６－ヘキサンジオール等を挙げることができる。 Examples of the alkylene glycol include ethylene glycol, propylene glycol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, 1,5-pentanediol, 1,6-hexanediol, and the like. Can be mentioned.
　前記アルキレングリコールジアセテートとしては、例えば、エチレングリコールジアセテート、１，３－プロパンジオールジアセテート、１，５－ペンタンジオールジアセテート等を挙げることができる。 Examples of the alkylene glycol diacetate include ethylene glycol diacetate, 1,3-propanediol diacetate, and 1,5-pentanediol diacetate.
　前記アルキレングリコールモノエーテルとしては、例えば、エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテル、エチレングリコールモノプロピルエーテル、エチレングリコールモノブチルエーテル、エチレングリコールモノペンチルエーテル等のエチレングリコールモノＣ1-5アルキルエーテル；プロピレングリコールモノメチルエーテル、プロピレングリコールモノエチルエーテル、プロピレングリコールモノプロピルエーテル、プロピレングリコールモノブチルエーテル、プロピレングリコールモノペンチルエーテル等のプロピレングリコールモノＣ1-5アルキルエーテル等を挙げることができる。 Examples of the alkylene glycol monoether include ethylene glycol mono C 1-5 alkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether, and ethylene glycol monopentyl ether; propylene Examples thereof include propylene glycol mono C 1-5 alkyl ethers such as glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, and propylene glycol monopentyl ether.
　前記アルキレングリコールジアルキルエーテルとしては、例えば、エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、エチレングリコールジプロピルエーテル、エチレングリコールジブチルエーテル、エチレングリコールジペンチルエーテル等のエチレングリコールＣ1-5アルキル（直鎖）Ｃ1-5アルキル（直鎖）エーテル（末端アルキル基対称）；エチレングリコールエチルメチルエーテル、エチレングリコールメチルプロピルエーテル、エチレングリコールブチルメチルエーテル、エチレングリコールメチルペンチルエーテル、エチレングリコールエチルプロピルエーテル、エチレングリコールブチルエチルエーテル、エチレングリコールエチルペンチルエーテル、エチレングリコールブチルプロピルエーテル、エチレングリコールプロピルペンチルエーテル、エチレングリコールブチルペンチルエーテル等のエチレングリコールＣ1-5アルキル（直鎖）Ｃ1-5アルキル（直鎖）エーテル（末端アルキル基非対称）；プロピレングリコールジメチルエーテル、プロピレングリコールジエチルエーテル、プロピレングリコールジプロピルエーテル、プロピレングリコールジブチルエーテル、プロピレングリコールジペンチルエーテル等のプロピレングリコールＣ1-5アルキル（直鎖）Ｃ1-5アルキル（直鎖）エーテル（末端アルキル基対称）；プロピレングリコールエチルメチルエーテル、プロピレングリコールメチルプロピルエーテル、プロピレングリコールブチルメチルエーテル、プロピレングリコールメチルペンチルエーテル、プロピレングリコールエチルプロピルエーテル、プロピレングリコールブチルエチルエーテル、プロピレングリコールエチルペンチルエーテル、プロピレングリコールブチルプロピルエーテル、プロピレングリコールプロピルペンチルエーテル、プロピレングリコールブチルペンチルエーテル等のプロピレングリコールＣ1-5アルキル（直鎖）Ｃ1-5アルキル（直鎖）エーテル（末端アルキル基非対称）等を挙げることができる。 Examples of the alkylene glycol dialkyl ether include ethylene glycol C 1-5 alkyl (straight chain) C 1- such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether, ethylene glycol dibutyl ether, and ethylene glycol dipentyl ether. 5 alkyl (straight chain) ether (terminal alkyl group symmetrical); ethylene glycol ethyl methyl ether, ethylene glycol methyl propyl ether, ethylene glycol butyl methyl ether, ethylene glycol methyl pentyl ether, ethylene glycol ethyl propyl ether, ethylene glycol butyl ethyl ether, Ethylene glycol ethyl pentyl ether, ethylene glycol butyl propyl ether Ethylene glycol propyl pentyl ether, ethylene glycol C 1-5 alkyl such as ethylene glycol butyl pentyl ether (linear) C 1-5 alkyl (linear) ether (terminal alkyl group asymmetric); propylene glycol dimethyl ether, propylene glycol diethyl ether, Propylene glycol C 1-5 alkyl (straight chain) C 1-5 alkyl (straight chain) ether (symmetrical terminal alkyl group) such as propylene glycol dipropyl ether, propylene glycol dibutyl ether, propylene glycol dipentyl ether; propylene glycol ethyl methyl ether , Propylene glycol methyl propyl ether, propylene glycol butyl methyl ether, propylene glycol methyl pentyl ether, propylene glycol ether Le propyl ether, propylene glycol butyl ether, propylene glycol ethyl pentyl ether, propylene glycol butyl ether, propylene glycol propyl pentyl ether, propylene glycol C 1-5 alkyl such as propylene glycol butyl pentyl ether (linear) C 1-5 Examples thereof include alkyl (straight chain) ether (terminal alkyl group asymmetric).
　前記アルキレングリコールモノアルキルエーテルアセテートとしては、例えば、エチレングリコールモノメチルエーテルアセテート、エチレングリコールモノエチルエーテルアセテート、エチレングリコールモノプロピルエーテルアセテート、エチレングリコールモノブチルエーテルアセテート、エチレングリコールモノペンチルエーテルアセテート等のエチレングリコールモノＣ1-5アルキルエーテルアセテート；プロピレングリコールモノエチルエーテルアセテート、プロピレングリコールモノプロピルエーテルアセテート、プロピレングリコールモノブチルエーテルアセテート、プロピレングリコールモノペンチルエーテルアセテート等のプロピレングリコールモノＣ1-5アルキルエーテルアセテート等を挙げることができる（異性体を含む）。 Examples of the alkylene glycol monoalkyl ether acetate include ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, and ethylene glycol monopentyl ether acetate. 1-5 alkyl ether acetate; propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, propylene glycol mono C 1-5 alkyl ether acetate such as propylene glycol monopentyl ether acetate, etc. Can (the isomer No).
　前記ジアルキレングリコールモノエーテルとしては、例えば、ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールモノプロピルエーテル、ジエチレングリコールモノブチルエーテル、ジエチレングリコールモノペンチルエーテル等のジエチレングリコールモノＣ1-5アルキルエーテル；ジプロピレングリコールモノメチルエーテル、ジプロピレングリコールモノエチルエーテル、ジプロピレングリコールモノプロピルエーテル、ジプロピレングリコールモノブチルエーテル、ジプロピレングリコールモノペンチルエーテル等のジプロピレングリコールモノＣ1-5アルキルエーテル等を挙げることができる（異性体を含む）。 Examples of the dialkylene glycol monoether include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol mono C 1-5 alkyl ether such as diethylene glycol monopentyl ether; dipropylene glycol monomethyl ether, Dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol mono C 1-5 alkyl ethers such as dipropylene glycol monopentyl ether, etc. can be mentioned (including isomers). .
　前記ジアルキレングリコールジアルキルエーテルとしては、例えば、ジエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールジプロピルエーテル、ジエチレングリコールジブチルエーテル、ジエチレングリコールジペンチルエーテル等のジエチレングリコールＣ1-5アルキル（直鎖）Ｃ1-5アルキル（直鎖）エーテル（末端アルキル基対称）；ジエチレングリコールエチルメチルエーテル、ジエチレングリコールメチルプロピルエーテル、ジエチレングリコールブチルメチルエーテル、ジエチレングリコールメチルペンチルエーテル、ジエチレングリコールエチルプロピルエーテル、ジエチレングリコールブチルエチルエーテル、ジエチレングリコールエチルペンチルエーテル、ジエチレングリコールブチルプロピルエーテル、ジエチレングリコールプロピルペンチルエーテル、ジエチレングリコールブチルペンチルエーテル等のジエチレングリコールＣ1-5アルキル（直鎖）Ｃ1-5アルキルエーテル（直鎖）（末端アルキル基非対称）；ジプロピレングリコールジメチルエーテル、ジプロピレングリコールジエチルエーテル、ジプロピレングリコールジプロピルエーテル、ジプロピレングリコールジブチルエーテル、ジプロピレングリコールジペンチルエーテル等のジプロピレングリコールＣ1-5アルキル（直鎖）Ｃ1-5アルキル（直鎖）エーテル（末端アルキル基対称）；ジプロピレングリコールエチルメチルエーテル、ジプロピレングリコールメチルプロピルエーテル、ジプロピレングリコールブチルメチルエーテル、ジプロピレングリコールメチルペンチルエーテル、ジプロピレングリコールエチルプロピルエーテル、ジプロピレングリコールブチルエチルエーテル、ジプロピレングリコールエチルペンチルエーテル、ジプロピレングリコールブチルプロピルエーテル、ジプロピレングリコールブチルプロピルエーテル、ジプロピレングリコールプロピルペンチルエーテルなどのジプロピレングリコールＣ1-5アルキル（直鎖）Ｃ1-5アルキル（直鎖）エーテル（末端アルキル基非対称、異性体を含む）等を挙げることができる。 Examples of the dialkylene glycol dialkyl ether include diethylene glycol C 1-5 alkyl (straight chain) C 1-5 alkyl (straight chain) such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, and diethylene glycol dipentyl ether. ) Ether (symmetrical terminal alkyl group); diethylene glycol ethyl methyl ether, diethylene glycol methyl propyl ether, diethylene glycol butyl methyl ether, diethylene glycol methyl pentyl ether, diethylene glycol ethyl propyl ether, diethylene glycol butyl ethyl ether, diethylene glycol ethyl pentyl ether, diethylene glycol Call butyl propyl ether, diethylene glycol propyl pentyl ether, diethylene glycol C 1-5 alkyl (straight chain) C 1-5 alkyl ethers such as diethylene glycol butyl pentyl ether (linear) (terminal alkyl group asymmetric); dipropylene glycol dimethyl ether, dipropylene Dipropylene glycol C 1-5 alkyl (straight chain) C 1-5 alkyl (straight chain) ether (terminal alkyl group) such as glycol diethyl ether, dipropylene glycol dipropyl ether, dipropylene glycol dibutyl ether, dipropylene glycol dipentyl ether Symmetry); dipropylene glycol ethyl methyl ether, dipropylene glycol methyl propyl ether, dipropylene glycol butyl methyl ether, dipropylene Dipropylene such as recall methyl pentyl ether, dipropylene glycol ethyl propyl ether, dipropylene glycol butyl ethyl ether, dipropylene glycol ethyl pentyl ether, dipropylene glycol butyl propyl ether, dipropylene glycol butyl propyl ether, dipropylene glycol propyl pentyl ether Examples include glycol C 1-5 alkyl (linear) C 1-5 alkyl (linear) ether (terminal alkyl group asymmetric, including isomers) and the like.
　前記ジアルキレングリコールモノアルキルエーテルアセテートとしては、例えば、ジエチレングリコールモノメチルエーテルアセテート、ジエチレングリコールモノプロピルエーテルアセテート、ジエチレングリコールモノブチルエーテルアセテート、ジエチレングリコールモノペンチルエーテルアセテート等のジエチレングリコールモノＣ1-5アルキルエーテルアセテート；ジプロピレングリコールモノエチルエーテルアセテート、ジプロピレングリコールモノプロピルエーテルアセテート、ジプロピレングリコールモノブチルエーテルアセテート、ジプロピレングリコールモノペンチルエーテルアセテート等のジプロピレングリコールモノＣ1-5アルキルエーテルアセテート等を挙げることができる（異性体を含む）。 Examples of the dialkylene glycol monoalkyl ether acetate include diethylene glycol mono C 1-5 alkyl ether acetates such as diethylene glycol monomethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol monopentyl ether acetate; Examples include dipropylene glycol mono C 1-5 alkyl ether acetates such as ethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl ether acetate, and dipropylene glycol monopentyl ether acetate (including isomers). ).
　前記トリアルキレングリコールモノエーテルとしては、例えば、トリエチレングリコールモノメチルエーテル、トリエチレングリコールモノエチルエーテル、トリエチレングリコールモノプロピルエーテル、トリエチレングリコールモノブチルエーテル、トリエチレングリコールモノペンチルエーテル等のトリエチレングリコールモノＣ1-5アルキルエーテル；トリプロピレングリコールモノメチルエーテル、トリプロピレングリコールモノエチルエーテル、トリプロピレングリコールモノプロピルエーテル、トリプロピレングリコールモノブチルエーテル、トリプロピレングリコールモノペンチルエーテル等のトリプロピレングリコールモノＣ1-5アルキルエーテル等を挙げることができる（異性体を含む）。 Examples of the trialkylene glycol monoether include triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monopropyl ether, triethylene glycol monobutyl ether, triethylene glycol monopentyl ether, and the like. 1-5 alkyl ether; tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, tripropylene glycol monopropyl ether, tripropylene glycol monobutyl ether, tripropylene glycol mono C 1-5 alkyl ether and tripropylene glycol mono-pentyl ether (Including isomers).
　前記トリアルキレングリコールモノエーテルアセテートとしては、例えば、トリエチレングリコールモノメチルエーテルアセテート、トリエチレングリコールモノエチルエーテルアセテート、トリエチレングリコールモノプロピルエーテルアセテート、トリエチレングリコールモノブチルエーテルアセテート、トリエチレングリコールモノペンチルエーテルアセテート等のトリエチレングリコールモノＣ1-5アルキルエーテルアセテート；トリプロピレングリコールモノメチルエーテルアセテート、トリプロピレングリコールモノエチルエーテルアセテート、トリプロピレングリコールモノプロピルエーテルアセテート、トリプロピレングリコールモノブチルエーテルアセテート、トリプロピレングリコールモノペンチルエーテルアセテート等のトリプロピレングリコールモノＣ1-5アルキルエーテルアセテート等を挙げることができる（異性体を含む）。 Examples of the trialkylene glycol monoether acetate include triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, triethylene glycol monopropyl ether acetate, triethylene glycol monobutyl ether acetate, and triethylene glycol monopentyl ether acetate. Triethylene glycol mono C 1-5 alkyl ether acetate; tripropylene glycol monomethyl ether acetate, tripropylene glycol monoethyl ether acetate, tripropylene glycol monopropyl ether acetate, tripropylene glycol monobutyl ether acetate, tripropylene glycol monopentyl ether acetate etc And tripropylene glycol mono C 1-5 alkyl ether acetate (including isomers).
　前記テルペン系化合物とその誘導体としては、例えば、ターピネオール、ターピネオールアセテート、ジヒドロターピネオール、ジヒドロターピニルアセテート、ジヒドロターピニルプロピオネート、リモネン、メンタン、メントール等を挙げることができる。 Examples of the terpene compound and derivatives thereof include terpineol, terpineol acetate, dihydroterpineol, dihydroterpinyl acetate, dihydroterpinyl propionate, limonene, menthane, and menthol.
　［電子デバイス製造用ペースト組成物の製造方法］
　本発明の電子デバイス製造用ペース組成物は、上記電子デバイス製造用溶剤組成物を３０～９０℃（好ましくは４０～８０℃）で、例えば３～６０分間程度（好ましくは１０～３０分間）加熱溶解することにより製造することができる。 [Method for producing paste composition for producing electronic devices]
In the pace composition for producing an electronic device of the present invention, the solvent composition for producing an electronic device is heated at 30 to 90 ° C. (preferably 40 to 80 ° C.), for example, for about 3 to 60 minutes (preferably 10 to 30 minutes). It can be manufactured by dissolving.
　本発明の電子デバイス製造用ペースト組成物には、更に、導電性金属材料、半導体材料、磁性材料、誘電材料、又は絶縁材料を含有することが、電気特性を付与することができる点で好ましい。導電性金属材料、半導体材料、磁性材料、誘電材料、又は絶縁材料の含有量としては、電子デバイス製造用ペースト組成物の０．１～９０重量％程度である。 It is preferable that the paste composition for manufacturing an electronic device of the present invention further contains a conductive metal material, a semiconductor material, a magnetic material, a dielectric material, or an insulating material from the viewpoint of imparting electrical characteristics. The content of the conductive metal material, semiconductor material, magnetic material, dielectric material, or insulating material is about 0.1 to 90% by weight of the electronic device manufacturing paste composition.
　前記導電性金属材料、磁性材料としては周知慣用のものを使用することができ、例えば、金、銀、銅、ニッケル、パラジウム、アルミニウム、鉄、白金、モリブデン、タングステン、亜鉛、鉛、コバルト、酸化鉄、酸化クロム、フェライト、及びこれらの合金等を挙げることができる。半導体材料としては周知慣用のものを使用することができ、例えば、ペンタセン、フラーレン誘導体、ポリチオフェン誘導体、金属（銅、インジウム、ガリウム、セレン、砒素、カドミウム、テルル、及びこれらの合金）、シリコン微粒子等を挙げることができる。誘電材料、絶縁材料としては周知慣用のものを使用することができ、例えば、シクロオレフィンポリマー、フッ素樹脂、ブチラール樹脂、ガラス、紙、テフロン（登録商標）等を挙げることができる。これらは１種を単独で、又は２種以上を組み合わせて使用することができる。 As the conductive metal material and magnetic material, well-known and commonly used materials can be used. For example, gold, silver, copper, nickel, palladium, aluminum, iron, platinum, molybdenum, tungsten, zinc, lead, cobalt, oxidation Examples thereof include iron, chromium oxide, ferrite, and alloys thereof. Known and commonly used semiconductor materials can be used, such as pentacene, fullerene derivatives, polythiophene derivatives, metals (copper, indium, gallium, selenium, arsenic, cadmium, tellurium, and alloys thereof), silicon fine particles, etc. Can be mentioned. As the dielectric material and the insulating material, well-known and customary materials can be used, and examples thereof include cycloolefin polymer, fluororesin, butyral resin, glass, paper, Teflon (registered trademark) and the like. These can be used alone or in combination of two or more.
　本発明の電子デバイス製造用ペースト組成物には、例えば、アルキルセルロース樹脂、ポリビニルアセタール樹脂、アクリル樹脂等のバインダー樹脂を添加することができるが、その添加量としては、電子デバイス製造用ペースト組成物の１０重量％以下程度が好ましく、特に好ましくは５重量％以下である。バインダー樹脂の含有量が上記範囲を上回ると、電気特性の低下、配線・塗膜形成の不良、及びデラミネーションの発生を抑制することが困難となる傾向がある。 For example, a binder resin such as an alkyl cellulose resin, a polyvinyl acetal resin, or an acrylic resin can be added to the electronic device manufacturing paste composition of the present invention. Is preferably about 10% by weight or less, particularly preferably 5% by weight or less. When the content of the binder resin exceeds the above range, it tends to be difficult to suppress the deterioration of electrical characteristics, poor wiring / coating film formation, and the occurrence of delamination.
　本発明の電子デバイス製造用ペースト組成物は上記構成を有するため、印刷法による電子デバイス製造に好適な粘度を有する。また、従来のエチルセルロース等の高分子バインダー樹脂により粘度が付与されたペースト組成物に比べて、低温で乾燥、焼成することができ、乾燥工程における被塗布面部材の軟化、変形を防止することができる。更に、焼成工程を経ても配線・塗膜の中に灰分を残さず、電気特性の低下、配線・塗膜形成の不良、及びデラミネーションの発生を抑制することができる。 Since the paste composition for manufacturing an electronic device of the present invention has the above-described configuration, it has a viscosity suitable for manufacturing an electronic device by a printing method. In addition, it can be dried and fired at a lower temperature than conventional paste compositions to which viscosity is imparted by a polymer binder resin such as ethyl cellulose, and can prevent softening and deformation of the coated surface member in the drying process. it can. Furthermore, no ash remains in the wiring / coating film even after the firing step, and it is possible to suppress deterioration of electrical characteristics, poor wiring / coating film formation, and delamination.
　本発明の電子デバイス製造用ペースト組成物は、スクリーン印刷法により被塗布面部材（例えば、セラミック基板、グリーンシート等）に塗布し、乾燥、焼成工程を経て配線、塗膜を形成することができる。 The paste composition for manufacturing an electronic device of the present invention can be applied to a surface member to be coated (for example, a ceramic substrate, a green sheet, etc.) by a screen printing method, and a wiring and a coating film can be formed through a drying and firing process. .
　本発明の電子デバイス製造用ペースト組成物によれば、印刷法により、配線・塗膜形成の不良、及びデラミネーションの発生による歩留まりの低下を防止しつつ、導電性又は絶縁性に優れた電子デバイスを製造することができる。本発明の電子デバイス製造用ペースト組成物は、例えば、コンデンサ、インダクタ、バリスタ、サーミスタ、スピーカ、アクチュエータ、アンテナ、固体酸化物燃料電池（SOFC）等（特に、積層セラミックコンデンサ）の製造用に特に有用である。 According to the paste composition for manufacturing an electronic device of the present invention, an electronic device excellent in conductivity or insulation while preventing a decrease in yield due to generation of delamination due to poor wiring and coating film formation by a printing method. Can be manufactured. The electronic device manufacturing paste composition of the present invention is particularly useful for manufacturing capacitors, inductors, varistors, thermistors, speakers, actuators, antennas, solid oxide fuel cells (SOFC), etc. (especially multilayer ceramic capacitors). It is.
　以下に、実施例に基づいて本発明をより詳細に説明するが、本発明はこれらの実施例によって限定されるものではない。 Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples.
　実施例１
　ゲル化剤としての３－ヒドロキシデカン酸（和光純薬工業（株）製）を、溶剤としての乳酸エチルアセテート（（株）ダイセル製）にゲル化剤濃度が３０重量％になるように添加して溶剤組成物（１）を得た。
　得られた溶剤組成物（１）を液温６５℃で０．５時間加熱溶解し、室温（２５℃）まで放冷して、ゲル化したペースト組成物（１）を得た。 Example 1
3-hydroxydecanoic acid (manufactured by Wako Pure Chemical Industries, Ltd.) as a gelling agent was added to ethyl lactate acetate (manufactured by Daicel Corporation) as a solvent so that the gelling agent concentration was 30% by weight. Thus, a solvent composition (1) was obtained.
The obtained solvent composition (1) was dissolved by heating at a liquid temperature of 65 ° C. for 0.5 hours and allowed to cool to room temperature (25 ° C.) to obtain a gelled paste composition (1).
　実施例２～８
　下記表１に記載の組成（単位：重量比）に変更した以外は実施例１と同様にして溶剤組成物（２）～（８）を得、ペースト組成物（２）～（８）を得た。 Examples 2-8
Solvent compositions (2) to (8) were obtained in the same manner as in Example 1 except that the composition (unit: weight ratio) shown in Table 1 below was changed, and paste compositions (2) to (8) were obtained. It was.
　比較例１
　高分子バインダー樹脂であるエチルセルロース（商品名「エトセルＳＴＤ」、ダウ・ケミカル製）を溶剤としてのジプロピレングリコールメチル－ｎ－プロピルエーテル（（株）ダイセル製）に樹脂濃度が１０重量％になるように添加して溶剤組成物（９）を得た。
　得られた溶剤組成物（９）を液温６５℃で３時間加熱溶解し、室温（２５℃）まで放冷して、高粘性の溶液を得た。 Comparative Example 1
Dipropylene glycol methyl n-propyl ether (Daicel Co., Ltd.) using ethyl cellulose (trade name “Etocel STD”, manufactured by Dow Chemical Co.) as a solvent as a polymer binder resin so that the resin concentration becomes 10% by weight. To obtain a solvent composition (9).
The obtained solvent composition (9) was dissolved by heating at a liquid temperature of 65 ° C. for 3 hours and allowed to cool to room temperature (25 ° C.) to obtain a highly viscous solution.
　＜評価＞
　実施例１～８で得られたペースト組成物、及び比較例１で得られた高粘性の溶液について、各２０ｍｇを、ＴＧ－ＤＴＡにて２０℃から４００℃まで１０℃／分で昇温して温度毎の重量を測定し、蒸発温度（重量が０．１％以下に減少した時点の温度）と３５０℃における残留灰分量（ペースト組成物又は高粘性の溶液全量に対する残留灰分の割合）を求めた。結果を下記表にまとめて示す。 <Evaluation>
For the paste compositions obtained in Examples 1 to 8 and the highly viscous solution obtained in Comparative Example 1, 20 mg each was heated from 20 ° C. to 400 ° C. at 10 ° C./min with TG-DTA. Measure the weight for each temperature, and determine the evaporation temperature (the temperature at which the weight decreased to 0.1% or less) and the residual ash content at 350 ° C (the ratio of the residual ash content to the total amount of the paste composition or highly viscous solution). Asked. The results are summarized in the following table.
Figure JPOXMLDOC01-appb-T000001
 ＊測定条件に未到
Figure JPOXMLDOC01-appb-T000001
 * Measurement conditions not yet reached
　表１中の略号は以下の通りである。
　＜ゲル化剤＞
　３ＨＤＡ：３－ヒドロキシデカン酸（和光純薬工業（株）製）
　３ＨＤＤＡ：３－ヒドロキシドデカン酸（和光純薬工業（株）製）
　３ＨＴＤＡ：３－ヒドロキシテトラデカン酸（和光純薬工業（株）製）
　３ＨＨｅｘＤＡ：３－ヒドロキシヘキサデカン酸（和光純薬工業（株）製）
　＜溶剤＞
　ＤＰＭＮＰ：ジプロピレングリコールメチル－ｎ－プロピルエーテル（ＳＰ値：８．０、（株）ダイセル製）
　ＥＬＡ：乳酸エチルアセテート（ＳＰ値：９．６、（株）ダイセル製）
　１，４－ＢＤＤＡ：１，４－ブタンジオールジアセテート（ＳＰ値：９．６、（株）ダイセル製）
　ＴＨＢＡ：１，２，５，６－テトラヒドロベンジルアルコール（ＳＰ値：１１．３、（株）ダイセル製）
　＜樹脂＞
　ＥＴＨＯＣＥＬ：エチルセルロース、商品名「エトセルＳＴＤ２００」（日新化成（株）製） Abbreviations in Table 1 are as follows.
<Gelling agent>
3HDA: 3-hydroxydecanoic acid (manufactured by Wako Pure Chemical Industries, Ltd.)
3HDDA: 3-hydroxydodecanoic acid (manufactured by Wako Pure Chemical Industries, Ltd.)
3HTDA: 3-hydroxytetradecanoic acid (manufactured by Wako Pure Chemical Industries, Ltd.)
3HHexDA: 3-hydroxyhexadecanoic acid (manufactured by Wako Pure Chemical Industries, Ltd.)
<Solvent>
DPMNP: Dipropylene glycol methyl-n-propyl ether (SP value: 8.0, manufactured by Daicel Corporation)
ELA: ethyl lactate acetate (SP value: 9.6, manufactured by Daicel Corporation)
1,4-BDDA: 1,4-butanediol diacetate (SP value: 9.6, manufactured by Daicel Corporation)
THBA: 1,2,5,6-tetrahydrobenzyl alcohol (SP value: 11.3, manufactured by Daicel Corporation)
<Resin>
ETHOCEL: Ethylcellulose, trade name “Etocel STD200” (manufactured by Nisshin Kasei Co., Ltd.)
　また、実施例で使用したゲル化剤、及び比較例で使用した高分子バインダー樹脂について、各２０ｍｇをＴＧ－ＤＴＡにて２０℃から４００℃まで１０℃／分で昇温して温度毎の減少重量を測定し、蒸発温度（重量が０．１％以下に減少した時点の温度）と３５０℃における残留灰分量を求めた（図１参照）。
　その結果、実施例で使用したゲル化剤は何れも、比較例で使用した高分子バインダー樹脂より低温で気化した。さらに、比較例１で使用した高分子バインダー樹脂は３５０℃の加熱を行っても樹脂溶液全体の６．３重量％が灰分として残ったのに対し、実施例で使用したゲル化剤のほとんどは３５０℃まで昇温する前に完全に気化し、灰分を残さなかった。 In addition, for the gelling agent used in the examples and the polymer binder resin used in the comparative example, 20 mg each was increased from 20 ° C. to 400 ° C. at 10 ° C./min with TG-DTA, and decreased at each temperature. The weight was measured, and the evaporation temperature (the temperature when the weight decreased to 0.1% or less) and the residual ash content at 350 ° C. were determined (see FIG. 1).
As a result, all the gelling agents used in the examples were vaporized at a lower temperature than the polymer binder resin used in the comparative examples. Furthermore, the polymer binder resin used in Comparative Example 1 remained as ash in an amount of 6.3% by weight of the entire resin solution even when heated at 350 ° C., whereas most of the gelling agents used in the Examples were Before the temperature was raised to 350 ° C., it was completely vaporized, leaving no ash.
　本発明の電子デバイス製造用溶剤組成物は、加熱溶解することにより、印刷法による配線・塗膜の形成に適した粘度を有するペースト組成物を形成することができる。
　そして、前記ペースト組成物を使用すると、液ダレしにくく高精度の配線パターンを形成することができる。また、乾燥工程及び焼成工程において、低温で乾燥・焼成することができ、被塗布面部材が長時間高温に曝されることにより軟化、変形することを防止できる。更に、焼成工程を経ても配線・塗膜中に灰分の残留や揮発分の発生を著しく低減することができ、これらにより引き起こされていた電気特性の低下、配線・塗膜形成の不良、及びデラミネーションの発生を抑制することができ、配線・塗膜形成の不良やデラミネーション等による歩留まりの低下を解消し、電気特性に優れた配線、塗膜を形成することができる。
　従って、本発明の電子デバイス製造用溶剤組成物は、各印刷法により電気デバイスの微細パターンを形成するペースト組成物の原料として極めて有用である。 The solvent composition for producing an electronic device of the present invention can form a paste composition having a viscosity suitable for formation of a wiring / coating film by a printing method by heating and dissolving.
And if the said paste composition is used, it will be hard to drip and a highly accurate wiring pattern can be formed. Moreover, in a drying process and a baking process, it can dry and bake at low temperature, and it can prevent softening and a deformation | transformation when a to-be-coated surface member is exposed to high temperature for a long time. Furthermore, the ash residue and volatile matter in the wiring / coating film can be significantly reduced even after the firing process, resulting in the deterioration of electrical characteristics, poor wiring / coating film formation, and degeneration. Generation of lamination can be suppressed, and a decrease in yield due to poor wiring / coating film formation or delamination can be eliminated, and wiring and coating films having excellent electrical characteristics can be formed.
Therefore, the solvent composition for producing an electronic device of the present invention is extremely useful as a raw material for a paste composition for forming a fine pattern of an electric device by each printing method.

Claims (10)

  1. 　印刷法により電子デバイスを製造するための溶剤組成物であって、溶剤と下記式（１）
    　　　Ｒ1－ＣＨ2－Ｒ2　　　（１）
    （式中、Ｒ1はモノヒドロキシアルキル基を示し、Ｒ2はカルボキシル基（Ｃ（＝Ｏ）ＯＨ）又はアミド基（Ｃ（＝Ｏ）ＮＨ2）を示す）
    で表される化合物（但し、モノヒドロキシステアリン酸を除く）を含む電子デバイス製造用溶剤組成物。     A solvent composition for producing an electronic device by a printing method, wherein the solvent and the following formula (1)
    R 1 —CH 2 —R 2 (1)
    (In the formula, R 1 represents a monohydroxyalkyl group, and R 2 represents a carboxyl group (C (═O) OH) or an amide group (C (═O) NH 2 )).
    The solvent composition for electronic device manufacture containing the compound (however, except monohydroxystearic acid) represented by these.
  2. 　Ｒ1がモノヒドロキシＣ8-14アルキル基である請求項１に記載の電子デバイス製造用溶剤組成物。 The solvent composition for producing an electronic device according to claim 1, wherein R 1 is a monohydroxy C 8-14 alkyl group.
  3. 　式（１）で表される化合物がヒドロキシデカン酸、ヒドロキシドデカン酸、ヒドロキシテトラデカン酸、及びヒドロキシヘキサデカン酸から選択される少なくとも１つである請求項１又は２記載の電子デバイス製造用溶剤組成物。 The solvent composition for producing an electronic device according to claim 1 or 2, wherein the compound represented by the formula (1) is at least one selected from hydroxydecanoic acid, hydroxydodecanoic acid, hydroxytetradecanoic acid, and hydroxyhexadecanoic acid.
  4. 　溶剤のＳＰ値が７．８～１１．８である請求項１～３の何れか１項に記載の電子デバイス製造用溶剤組成物。 4. The solvent composition for producing an electronic device according to claim 1, wherein the solvent has an SP value of 7.8 to 11.8.
  5. 　溶剤がプロピレングリコールメチル－ｎ－プロピルエーテル、プロピレングリコールメチル－ｎ－ブチルエーテル、ジプロピレングリコールジメチルエーテル、ジプロピレングリコールメチル－ｎ－プロピルエーテル、ジプロピレングリコールメチル－ｎ－ブチルエーテル、３－メトキシブチルアセテート、ジプロピレングリコールメチルエーテルアセテート、プロピレングリコールモノメチルエーテルアセテート、シクロヘキサノールアセテート、乳酸エチルアセテート、プロピレングリコールジアセテート、１，４－ブタンジオールジアセテート、プロピレングリコールモノメチルエーテル、３－メトキシブタノール、及び１，２，５，６－テトラヒドロベンジルアルコールから選択される少なくとも１つである請求項１～４の何れか１項に記載の電子デバイス製造用溶剤組成物。 Solvent is propylene glycol methyl-n-propyl ether, propylene glycol methyl-n-butyl ether, dipropylene glycol dimethyl ether, dipropylene glycol methyl-n-propyl ether, dipropylene glycol methyl-n-butyl ether, 3-methoxybutyl acetate, di Propylene glycol methyl ether acetate, propylene glycol monomethyl ether acetate, cyclohexanol acetate, ethyl lactate acetate, propylene glycol diacetate, 1,4-butanediol diacetate, propylene glycol monomethyl ether, 3-methoxybutanol, and 1,2,5 The compound according to any one of claims 1 to 4, which is at least one selected from 1,6-tetrahydrobenzyl alcohol. Electronic device manufacturing solvent composition according to item.
  6. 　式（１）で表される化合物の含有量が、電子デバイス製造用溶剤組成物全体の０．１～５０重量％である請求項１～５の何れか１項に記載の電子デバイス製造用溶剤組成物。 The solvent for producing an electronic device according to any one of claims 1 to 5, wherein the content of the compound represented by the formula (1) is 0.1 to 50% by weight of the whole solvent composition for producing an electronic device. Composition.
  7. 　請求項１～６の何れか１項に記載の電子デバイス製造用溶剤組成物を３０～９０℃で加熱溶解することを特徴とする電子デバイス製造用ペースト組成物の製造方法。 7. A method for producing a paste composition for producing an electronic device, comprising: dissolving the solvent composition for producing an electronic device according to claim 1 at 30 to 90 ° C. by heating.
  8. 　請求項７に記載の電子デバイス製造用ペースト組成物の製造方法により得られる電子デバイス製造用ペースト組成物。 The paste composition for electronic device manufacture obtained by the manufacturing method of the paste composition for electronic device manufacture of Claim 7.
  9. 　更に、導電性金属材料、半導体材料、磁性材料、誘電材料、又は絶縁材料を含む請求項８に記載の電子デバイス製造用ペースト組成物。 The paste composition for manufacturing an electronic device according to claim 8, further comprising a conductive metal material, a semiconductor material, a magnetic material, a dielectric material, or an insulating material.
  10. 　バインダー樹脂含有量が１０重量％以下である請求項８又は９に記載の電子デバイス製造用ペースト組成物。 The paste composition for manufacturing an electronic device according to claim 8 or 9, wherein the binder resin content is 10% by weight or less.
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