WO2013156325A1

WO2013156325A1 - Transparent body, optoelectronic component having a transparent body, and method for producing a transparent body

Info

Publication number: WO2013156325A1
Application number: PCT/EP2013/057224
Authority: WO
Inventors: Kathy SCHMIDTKE; Bert Braune
Original assignee: Osram Opto Semiconductors Gmbh
Priority date: 2012-04-18
Filing date: 2013-04-05
Publication date: 2013-10-24
Also published as: DE102012103393A1

Abstract

The invention relates to a transparent body, which comprises a polymer matrix (3) and at least one filler (1), wherein the filler (1) is chemically functionalised, and wherein the functionalised filler (1) is chemically integrated in the polymer matrix (3). Also specified are an optoelectronic component, comprising the transparent body according to the invention, and a method for producing a transparent body.

Description

description

Transparent body, optoelectronic component with a transparent body and method for producing a transparent body

The present invention relates to a transparent

Body, an optoelectronic device with a

transparent body and a method of producing a transparent body.

A polymer matrix, which may be part of a transparent body of an optoelectronic component, for example, usually has a very low

Thermal conductivity. Thus, the problem often arises that during operation of an optoelectronic device

arising heat can not be sufficiently dissipated. Aging of the polymer matrix, for example, yellowing and cracking of the polymer matrix and, in the worst case, failure of the optoelectronic device may be the result of insufficient thermal conductivity of the polymer matrix.

An object to be solved is to use an optoelectronic component, for example a device that can be used therein

transparent body, and to provide a method for producing a transparent body having an improved thermal conductivity.

This object is solved by the subject matters with the features of the independent claims. advantageous

Embodiments and developments of the objects are specified in the dependent claims and go from the

following description and the drawings. A transparent body comprises a polymer matrix and at least one filler, wherein the filler is chemically functionalized, and wherein the functionalized

Filler is chemically incorporated into the polymer matrix.

By chemically functionalizing the filler and chemically incorporating the filler into the polymer matrix, good binding and homogeneous distribution of the filler in the polymer matrix can be achieved. A degree of filling of the polymer matrix which determines the amount of filler in the polymer matrix

can be described by the chemical involvement of the

Filler be improved. Thus, for example, a higher amount of filler can be introduced into the polymer matrix. An increased thermal conductivity can be generated. For example, in an application of the transparent body in optoelectronic devices that during the

Operation of the optoelectronic device heat now be better dissipated by the transparent body. This increases both the life of the transparent body and that of the optoelectronic component.

Filler here and in the following denotes an additional chemical substance which comprises at least one atom and / or molecule or a combination of atoms and / or molecules, for example an aggregation of molecules to a highly ordered structural unit, and which itself is thermally conductive and by the chemical functionalization and chemical incorporation of the filler into the polymer matrix transfers the heat-conducting properties to the polymer matrix, the thermal conductivity of the polymer matrix

improves and thus increases the thermal conductivity of the transparent body. According to one embodiment, the filler comprises particles or is configured in the form of particles. The particles have a size of 1 to 5000 nm, preferably 1 to 200 nm, particularly preferably a size smaller than 100 nm,

for example, 80 nm. The size of the particles makes it possible to maintain the transparency of the transparent body or to set it to a certain value. In particular, the electromagnetic radiation, for example that emitted by an optoelectronic component

electromagnetic radiation, not scattered by particles having a size of less than or equal to 100 nm and thus obtain the transparency of the transparent body.

Transparency means that a transmission of greater than or equal to 70%, in particular greater than or equal to 80%,

beispielswe.LSG 85% at a corresponding wavelength of the electromagnetic radiation is present.

Electromagnetic radiation here and below preferably comprises electromagnetic radiation with one or more

multiple wavelengths or wavelength ranges from an ultraviolet to infrared spectral range. In particular, the electromagnetic radiation is visible light having wavelengths or wavelength ranges from a visible spectral range between about 350 nm and about 800 nm.

According to one embodiment, the geometry of the particles is arbitrary. The particle is for example

formanisotrop. In this context, form anisotropic means that the particle has a different geometric shape depending on the direction or is irregularly shaped.

Form anisotropic means, for example, that the height, width and depth of the particle are different. In particular, the particles are in the form of a sphere, a tube, a Wired or a stick designed. The size of the

Particle is in the nanometer range.

In one embodiment, the filler is crystalline or liquid crystalline.

In one embodiment, the filler is one

Group selected, the liquid crystals, ceramic

Fillers, A1N, Si ₃ N _4, SiC, BN, A1 ₂ 0 _3, nanoparticles,

Nanowires, carbon nanowires, boehmite rods, AIO (OH), nanotubes, Ta-organyl containing compounds, Ce organyl containing compounds, Ti organyl containing compounds, Ti alkoxide containing compounds, Al alkoxide containing compounds, Si alkoxide containing compounds, Zr-alkoxide-containing

Compounds, oxidic fillers, Al-organyl-containing

Compounds and combinations thereof.

Liquid crystals here and below designate a chemical substance which comprises or consists of, for example, monomers, oligomers or polymers, and which has both properties of a crystal, for example the

Directional dependence of physical properties

(Anisotropie), as well as properties of a liquid, such as electrical and optical properties or flow behavior, show in a particular

Temperature range both phases (liquid and crystalline) are present next to each other (mesophases).

In particular, A1N, S1 ₃ N ₄ , SiC, BN, Al ₂ O _{3 are} to be understood as meaning ceramic fillers. In particular, ceramic fillers are inorganic and / or crystalline materials. Nanoparticles here and in the following designates an association of atoms and / or molecules which have a size in the nanometer range, for example 1 to 1000 nm, the nanoparticles being direction-dependent

(anisotropic) physical properties may have.

Nanowire is a fine elongated piece of metal,

Semi-metal or compound semiconductors with a diameter of a few hundred nanometers down to a few

Nanometers. The length of the nanowires can be several

Reach micrometers. In particular, have nanowires

Semiconductor materials of the fourth main group, e.g.

Carbon (carbon nanowires), silicon or germanium, or III / V or II / VI compound semiconductor materials.

An I I / V compound semiconductor material comprises at least one element of the third main group such as B, Al, Ga, In, and a fifth main group element such as N, P, As. In particular, the

The term "I I / V compound semiconductor material" means the group of binary, ternary or quaternary compounds which

at least one element from the third main group and at least one element from the fifth main group, for example, nitride and phosphide compound semiconductors. Such a binary, ternary or quaternary compound may also have, for example, one or more dopants and additional constituents.

Accordingly, an II / VI compound semiconductor material has at least one element of the second main group such as Be, Mg, Ca, Sr, and a sixth main group element such as 0, S, Se.

In particular, an II / VI compound semiconductor material comprises a binary, ternary or quaternary compound that

at least one element from the second main group and at least one element from the sixth main group. Such a binary, ternary or quaternary compound may additionally have, for example, one or more dopants and additional constituents. For example, the II / VI compound semiconductor materials include: ZnO, ZnMgO, CdS, ZnCdS, MgBeO. Boehmite rods in this context means a substance with the chemical composition AIO (OH) or γ-AlOOH, which has a rod-shaped geometry.

Nanotubes refers in this context tubes whose diameter is smaller than 100 nanometers. Typically, the diameter is only a few nanometers, and the inner tubes in multiwall nanotubes can be as thin as 0.3 nm. In particular, nanutubes have carbon atoms, the carbon atoms occupying a honeycomb-like structure with hexagons and three binding partners each. The carbon atom has an sp ² hybridization in nanotubes. The diameter of the tubes is usually in the range of 0.4 to 50 nm. The length is several millimeters to a few centimeters for individual tubes, for example, up to 20 cm.

A Ce organyl-containing compound is, for example

(Cp) ₃ μe (Cp = C ₅ H ₅ ), where Cp is cyclopentadienyl anion. A Ti-organyl-containing compound is, for example

Cp ₂ TiCl ₂ , where Cp is cyclopentadienyl anion.

A Ti-alkoxide-containing compound is, for example

Ti (OiPr) ₄ , where iPr is isopropyl radical. An AI Organyl-containing compound is, for example A1-C (CH3) 2 ^_ C (CH ₃₎ ₂ -H.

Si-alkoxide-containing compounds are, for example

Tetramethoxysilane and its analogues.

Oxidic fillers may be selected from a group comprising alumina, silica, zirconia, magnesia and mica. According to one embodiment, the filler comprises particles, wherein a multiplicity of first compounds which have a functional group are chemically and / or physically attached to each particle. According to one embodiment, a particle is present on each particle

Variety of first compounds by adsorption and / or by formation of covalent bonds and / or

Tied to hydrogen bonds. The formation of at least one covalent bond between at least one particle and a first compound can be carried out by a spacer, a vinyl group and / or Si-H bond. Spacer here and below refers to molecules which create a spatial distance between the first compound and the particle. First compound and particles are not directly connected by an atom-atom bond

connected. Spacers are, in particular, phosphonate groups with organosilicone chains, for example R-PO (OH) ₂ , where R is -CH ₂ -Si (CH ₃ ) ₂ H. According to a further embodiment, the transparent body has a thermal conductivity which is anisotropic. Particles which have a large ratio of the depth and / or height of the particle compared to the width of the particle chemically incorporated in the polymer matrix produce a high thermal conductivity parallel to the longer dimension. In particular, chemically functionalized fillers in the form of a tube, a wire or a rod produce

chemically bound in the polymer matrix a high

Thermal conductivity compared to a conventional one

Polymer matrix, which is normally not chemically

contains functionalized filler.

According to one embodiment, the polymer matrix is selected from a group comprising silicone and its derivatives, epoxy resin and its derivatives, polyacrylic resin and derivatives thereof,

Polyurethane and its derivatives, polycarbonate and their

Derivatives, hybrid polymers and their derivatives (ORMOCER ^® e) and combinations thereof.

The polymer matrix may in particular be a methyl-substituted silicone, for example poly (dimethylsiloxane) and / or

Polymethylphenylsiloxane, a cyclohexyl substituted

Silicone, for example poly (dicyclohexyl) siloxane, or a combination thereof, or consist thereof.

According to another embodiment, the filler has a higher thermal conductivity than the polymer matrix. The thermal conductivity of the pure polymer matrix is

typically between 0.1 and 0.3 W / mK. For example, silicone has a thermal conductivity of about 0.2 W / mK. The filler, however, has a thermal conductivity of greater than or equal to 1 W / mK, in particular greater than or equal to 10 W / mK.

According to a further embodiment, the transparent body has a thermal conductivity of greater than or equal to 1 W / mK, in particular between 1 W / mK and 2 W / mK, for example 1.4 W / mK. The combination of polymer matrix and chemically bonded filler has a higher thermal conductivity than the pure polymer matrix.

In one embodiment, a filler which is normally non-functionalized is hydrophilic and thereby incompatible with a hydrophobic polymer matrix

Functionalization hydrophobized. Or it is usually hydrophilized without functionalization and thus hydrophilized with the filler incompatible with a hydrophilic polymer matrix by functionalization. This allows the functionalized filler in the polymer matrix to be fine

distributed, a separation of the filler avoided and the transparency of the transparent body can be obtained.

Hydrophilic means in this context that the filler or the polymer matrix is water-loving, that interacts with and is compatible with polar substances. Hydrophobic in this context means that the filler or the polymer matrix is water-repellent, that is interacts with non-polar substances and is compatible with them. Hydrophilic and hydrophobic substances are usually incompatible with each other and can not be mixed homogeneously, since separation and conglomeration takes place.

According to one embodiment, the first compound is selected from a group comprising organosilicon compounds, Silanes and their derivatives, siloxanes and their derivatives, ethers containing compounds, esters of carbonic acid with diols, esters of acrylic acid and acrylic acid derivatives, phosphonates and their derivatives, and combinations thereof.

In one embodiment, the functional group is selected from a group comprising vinyl and its derivatives, as well as hydrogen-containing compounds. In particular, the hydrogen-containing compounds are capable of

To split off the hydrogen atom.

According to one embodiment, the first compound comprises at least one functional group which is terminally and remotely from a respective particle of the filler disposed on the first compound.

In particular, the chemical incorporation of the filler, for example of Ta-organyl-containing compounds, Ce organyl-containing compounds, Ti-organyl-containing compounds or liquid crystals, in the main or side chains of

Polymer matrix, for example, in the main or side chains of the silicone, the thermal conductivity of the polymer matrix and thus the thermal conductivity of the transparent body. By selecting the filler and adjusting it

Filling degree in the polymer matrix, the transparency of the transparent body can be adjusted.

According to one embodiment, the chemical incorporation of the functionalized filler increases, for example

vinyl-containing functionalized Ti-alkoxide-containing

Compounds, Al-alkoxide-containing compounds, Al-organyl-containing compounds, Si-alkoxide-containing compounds or Zr-alkoxide-containing compounds, in the polymer matrix, for example, in inorganic-organic hybrid polymers

(ORMOCER ^® e), the thermal conductivity of the polymer matrix and thus the thermal conductivity of the transparent body. Additionally or alternatively, functionalized oxidic fillers can be added to the polymer matrix which

also increase the thermal conductivity of the polymer matrix and thus the thermal conductivity of the transparent body. Due to the low production temperatures of a

Polymer matrix of inorganic-organic hybrid polymers (ORMOCER ^® s) of less than 200 ° C can also

temperature-sensitive fillers chemically in the

Polymer matrix are involved. According to one embodiment, the filler is characterized by co

Polymerization integrated in the polymer matrix. This results in a separation of the polymer matrix, for example silicone, from the filler and the emergence of scattering centers

prevented, so that the transparency of the transparent body is maintained.

The co-polymerization proceeds depending on the polymer matrix according to different mechanisms:

Polyaddition, for example with silicone as

polymer matrix

- Polycondensation, for example, polyurethane as a polymer matrix

- Anionic polymerization, for example in polystyrene as a polymer matrix

- Cationic polymerization, for example in

Polyisobutene as polymer matrix

- Radical polymerization, for example at

Polymethyl methacrylate as polymer matrix According to one embodiment is by the chemical

Incorporation of the functionalized filler in the

Polymer matrix produces a copolymer. In one embodiment, the filler is chemically and / or physically attached to the first compound and the first compound chemically attached to the polymer matrix.

This will increase the thermal conductivity of the

transparent body, a good connection of the filler to the polymer matrix and at the same time maintain the transparency of the transparent body. Due to the chemical bonding of the filler in the polymer matrix, a separation of the filler is avoided. Alternatively, the filler is already available from home

be functionalized. This means that the filler by itself already has functional groups which are capable of the functionalized filler in the

Chemically integrate polymer matrix. The functionalization of such a filler with a first compound is not required.

Furthermore, an optoelectronic component with a transparent body is specified, wherein the optoelectronic component has a beam path of the electromagnetic

Radiation provides, with the transparent body in the

Beam path is arranged.

For the optoelectronic component with a transparent body, the same definitions and embodiments of a transparent body apply as in the above

Description for a transparent body were given. According to one embodiment, the transparent body in the optoelectronic component, for example a

Light-emitting diode (LED) as a lens, encapsulation and / or housing

be formed. This can be used during operation of the

Optoelectronic component resulting heat due to the improved thermal conductivity of the transparent body are easily dissipated and the life of the

optoelectronic component can be increased. Yellowing and cracks in the transparent body are caused by the

improved thermal conductivity of the transparent body in the optoelectronic device avoided.

According to one embodiment, the transparent body of the optoelectronic component is provided with converter materials, which extend the electromagnetic primary radiation emitted by a semiconductor layer sequence into an electromagnetic secondary radiation of usually longer duration

Wavelength converts. The transparent body can

for example, together with the converter material

Be produced potting, the potting compound a

Recess for the optoelectronic device completely or partially encloses. The converter material is at least partially in direct contact with the filler.

According to one embodiment, the transparent body is in direct contact with the radiation source. If the transparent body additionally comprises converter materials, then the conversion of the electromagnetic primary radiation into the electromagnetic secondary radiation may be at least partially close to the radiation source, for example at a distance

Converter material and radiation source of less than or equal to 200 ym, preferably less than or equal to 50 ym done (so-called "chip-level conversion"). According to one embodiment, the transparent body is spaced from the radiation source. If the transparent body additionally comprises converter materials, then the conversion of the electromagnetic energy can at least partly take place

Primary radiation in the electromagnetic secondary radiation at a large distance from the radiation source, for example, at a distance converter material and

Radiation source of greater than or equal to 200 ym, preferably greater than or equal to 750 ym, more preferably greater than or equal to 900 ym (so-called "remote phosphor conversion").

The radiation source of the optoelectronic component has a semiconductor layer sequence which is referred to as

Epitaxial layer sequence or as a radiation-emitting semiconductor chip with Epitaxieschichtenfolge, can be designed as epitaxially grown semiconductor layer sequence. The occurring in the semiconductor layer sequence

Semiconductor materials are not limited, provided that they can at least partially have electroluminescence. There are, for example, compounds from the elements

used, which consists of indium, gallium, aluminum, nitrogen, phosphorus, arsenic, oxygen, silicon, carbon and

Combination of this can be chosen. However, other elements and additions may be used. The

An active region layer sequence may be based, for example, on nitride compound semiconductor materials. "Based on nitride compound semiconductor material" in the present context means that the semiconductor layer sequence or at least a part thereof, a nitride compound semiconductor material, preferably comprises or consists of Al _n Ga _m In _n - _m N, where 0 ^ n <1, 0 ^ m <1 and n + m <1. Here, this material does not necessarily have a mathematically exact composition according to the above formula exhibit. Rather, it may, for example, have one or more dopants and additional constituents. For the sake of simplicity, however, the above formula contains only the essential constituents of the crystal lattice (Al, Ga, In, N), even if these can be partially replaced and / or supplemented by small amounts of further substances.

The semiconductor layer sequence can be used as active region

for example, a conventional pn junction, a

Double heterostructure, a single quantum well structure (SQW structure) or a multiple quantum well structure (MQW structure) have. The semiconductor layer sequence may comprise, in addition to the active region, further functional layers and functional regions, for example p-doped or n-doped ones

Charge carrier transport layers, ie electron or

Hole transport layers, p- or n-doped confinement or cladding layers, buffer layers and / or electrodes and combinations thereof. Such structures include the active region or the further functional layers and

Areas relating to those skilled in particular

in terms of structure, function and structure known and are therefore not explained in detail here.

According to one embodiment, the transparent body in the optoelectronic component forms a lens. The lens may fill an opening of the recess or be arranged in this. The lens may have a cavity that may be filled with other materials. This material may include or consist of, for example, gas, a gas mixture, a plastic or polymeric material, a glass or other material, or a combination of multiple materials. Alternatively, it is possible to select an organic light emitting diode (OLED) as optoelectronic component, wherein

For example, the transparent body is used as encapsulation and / or potting.

It will continue a process for producing a

transparent body indicated, the following

Process step includes:

Functionalization of the filler and simultaneous chemical incorporation of the filler in the polymer matrix or

Functionalizing the filler, then mixing the functionalized filler with the polymer matrix and chemically incorporating the functionalized filler into the polymer matrix.

For the method of manufacturing a transparent body, the same definitions and embodiments of a transparent body as stated above in the description for a transparent body apply.

According to one embodiment, the functionalized filler and the polymer matrix are mixed, the mixing preferably taking place by stirring, dispersing, ultrasonication, extrusion and / or milling.

In one embodiment, the method may additionally comprise substances added in functionalizing or chemically binding and selected from a group comprising catalysts, inhibitors, coupling agents, and combinations thereof.

The catalysts may in particular be platinum catalysts, for example chloroplatinic acid H ₂ PtCl 6 or Chloroplatinic acid hexahydrate H ₂ PtCl6 x 6H ₂ O, complexes of platinum with vinyl-containing organosiloxanes, as they are

For example, in US 3,419,593, US 3,715,334 and / or US 3,814,730 complexes of platinum and an organic product, as described for example in US 3,220,972, EP 0057459, EP 0188978 and / or EP 0190530.

The inhibitors may be selected from the group consisting of polyorganosiloxanes which are preferably ring-shaped and / or wherein at least one Si atom is substituted by at least one alkenyl radical

Tetramethylvinyl tetrasiloxane is particularly preferred,

Pyridine, phosphine, organic phosphites, unsaturated amides, alkyl-containing maleates, and acetylenic alcohols.

For example, inhibitors are acetylenic alcohols, such as

Ethynyl-1-cyclohexanol, methyl-3-dodecyn-1-ol-3, trimethyl-3,7,11-dodecyn-1-ol-3, diphenyl-1,1-propyn-2-ol-1, ethyl-3-ethyl-6-nonyno 1 ol-3 and / or methyl-3 pentadecyn-1 ol-3. Primer may alkoxy organosilane, in particular vinyltrimethoxysilane (VTMS) or

Methacyrloxypropyltrimethoxysilane be. For example, the coupling agent may be 3-glycidoxypropyltrimethoxysilane. Below are more advantages as well as advantageous ones

Embodiments and developments of the subject invention with reference to figures and embodiments explained in more detail. The figures show:

Figure 1 schematically the chemical functionalization of a

filler, Figure 2 schematically shows the chemical functionalization of a filler and the chemical integration of a functionalized filler in the

Polymer matrix,

Figure 3 schematically shows the chemical integration of a

functionalized filler in the

Polymer matrix, and

Figure 4 schematically an optoelectronic device with a transparent body in the beam path.

In the embodiments and figures are the same or equivalent components each with the same

Provided with reference numerals. The illustrated elements and their proportions with each other are basically not to be considered as true to scale. FIG. 1 schematically shows the chemical

Functionalization of a filler 1 according to step A, while Figure 2 additionally in step B, the chemical incorporation of a functionalized filler in the

Polymer matrix 3 shows. Nanoparticles 1-1, formanistropic particles 1-2 and / or nanotubes 1-3, for example carbon nanotubes, can be used as filler 1 (FIG. 1). Particularly preferred as particles are nanoparticles which are inorganic and crystalline, such as AlN, Si ₃ N ₄ or SiC. The filler may be spherical or formanisotropic. Under formanisotropic becomes in this

Context understood that the geometry of the filler is directional. The filler comprises particles having a size of 1 to 5000 nm, preferably 1 to 200 nm, more preferably less than 100 nm, for example 80 nm. Particles having a size of, in particular, less than or equal to 100 nm do not act as scattering centers for the electromagnetic radiation emitted by a radiation source

Radiation of an optoelectronic device, so that increased transparency of the transparent body is the result.

On each particle of the filler 1, a multiplicity of first compounds 2, which have a functional group 2-1, are then bound in step A. First compounds 2 may be, for example, silanes functionalized with vinyl groups and / or siloxanes functionalized with vinyl groups and derivatives thereof. The connection can be done chemically and / or physically. Thus, the first compound 2, whose functional group 2-1 is terminal and remote from a respective particle of the filler 1 is disposed on the first compound 2, adsorbed on the surface of the particles of the filler 1 and / or by formation of covalent bonds and / or hydrogen bonds are connected. An example hydrophilic surface of the particles of the filler 1 is hydrophobized by the first compound 2, or the hydrophobic surface of the

Particles of the filler 1 is hydrophilized by the first compound 2 and can chemically in the next step, as shown in Figure 2 in step B, in the

Polymer matrix 3 are involved. The polymer matrix 3 is in particular a silicone, for example a

Methyl-substituted silicone, such as vinylated

Poly (dimethylsiloxane) B-1 and / or poly (dimethyl) (methyl-hydrogen) siloxane B-2. The indices n, r and q stand for the number of corresponding monomer units. The chemical integration of the functionalized filler in the

Polymer matrix 3 can be obtained by linking the functional Groups 2-1, for example, the vinyl-containing groups 2-1 of the first compound 2 with the polymer matrix 3. Thereby, the filler 1, for example in the form of nanoparticles 1-1, formanisotropic particles 1-2, nanowires 1-3 or

Carbon nanotubes are homogeneously distributed in the polymer matrix 3, whereby an aggregation of the filler is prevented and the transparency of the transparent body is obtained.

In addition to the already described physical and / or chemical attachment of the functional groups 2-1 of the first compound 2 to the particles of the filler 1, it is also possible to functionalize this by direct attachment of polymers with at least one reactive group to the filler 1 (so-called "grafting onto").

FIG. 3 schematically shows the chemical incorporation of a functionalized filler 1-4, in this case using the example of a vinyl group-functionalized liquid crystal in the polymer matrix 3. In this case, the functionalized filler 1- 4 is already functionalized from the start. As polymer matrix 3, vinylated poly (dimethylsiloxane) B-1 and / or

Poly (dimethyl) (methyl hydrogen) siloxane B-2 and / or

Poly (dimethyl) (methylphenyl) siloxane B-3 can be used. The indices n, r, q, p, and t stand for the number of

corresponding monomer units. The filler 1, here in

Form of a liquid crystal 1-4 is incorporated as a side chain in the polymer matrix 3. Vinyl group 2-1 of the

Liquid crystal is chemically incorporated into the polymer matrix 3 by co-polymerization. By varying the proportion of the liquid crystal component can directly

Transparency of the transparent body can be influenced. By the integration of the liquid crystal 1-4 in the

Side chains of the polymer matrix 3 becomes the thermal conductivity increased while maintaining the transparency of the transparent body.

FIG. 4 shows a schematic side view of a

Optoelectronic component on the embodiment of a light emitting diode (LED). The optoelectronic component has a layer sequence 1 with an active region (not explicitly shown), a first electrical connection 2, a second electrical connection 3, a bonding wire 4, a transparent body 5, a recess 6, a

Housing wall 7 and a housing 8.

In the beam path of the electromagnetic radiation, a transparent body 5 is arranged. The transparent body 5 comprises a polymer matrix and at least one filler. The filler is chemically functionalized and in the

Polymer matrix chemically bound. The transparent body 5 is directly in direct mechanical and / or

electrical contact on the layer sequence 1 with an active region.

Alternatively, the transparent body 5 is of the

Layer sequence 1 with an active area spaced. The good bonding and homogeneous distribution of the filler in the polymer matrix in the transparent body allows better dissipation during operation of the polymer

Optoelectronic device generated heat. This increases both the life of the transparent body and that of the optoelectronic component.

Production of a transparent body A filler configured as a particle, for example A1N, BN and / or Al ₂ O ₃ particles, is mixed with a first compound, for example vinylated siloxane, and chemically functionalized. The filler is with the

Polymer matrix or with mono- or oligomers

Polymer matrix components mixed prior to co-polymerization. Subsequently, the chemical binding takes place by co-polymerization of the functionalized filler in the

Polymer matrix, for example silicone, wherein a copolymer is produced. The chemical incorporation of the functionalized filler can be initiated thermally or UV. The

Thermal conductivity of the transparent body is reduced by chemical integration of the filler from approx. 0.2 W / mK (pure silicone) to 1 to 2 W / mK, depending on the filling content of the

Filler, increased.

The invention is not limited by the description with reference to the embodiments. Rather, the includes

Invention every new feature as well as every combination of

Features, which includes in particular any combination of features in the claims, even if this feature or this combination itself is not explicitly in the

Claims or embodiments is given. This patent application claims the priority of German Patent Application 10 2012 103393.5, the disclosure of which is hereby incorporated by reference.

Claims

claims

1. Transparent body,

comprising a polymer matrix (3), and

at least one filler (1),

wherein the filler (1) is chemically functionalized, and

wherein the functionalized filler in the

Polymer matrix (3) is chemically bound.

A transparent body according to the preceding claim, wherein the filler (1) is selected from the group consisting of liquid crystals, ceramic fillers, AlN, Si ₃ N ₄ , SiC, BN, Al ₂ O ₃ , nanoparticles, nanowires, carbon nanowires , Boehmite rods, AIO (OH), nanotubes, Ta organyl-containing

Compounds, Ce-organyl-containing compounds, Ti-organyl-containing compounds, Ti-alkoxide-containing compounds, Al-alkoxide-containing compounds, Si-alkoxide-containing

Compounds, Zr-alkoxide-containing compounds, oxidic fillers, Al-organyl-containing compounds and combinations thereof.

3. Transparent body after one of the previous ones

Claims, wherein the filler (1) comprises particles, wherein on each particle a plurality of first compounds (2) having a functional group (2-1) is chemically and / or physically attached.

4. Transparent body according to claim 3, wherein on each particle a plurality of first compounds (2)

Adsorption and / or by formation of covalent bonds and / or hydrogen bonds is attached.

5. Transparent body after one of the previous ones

Claims, wherein the transparent body a

Having thermal conductivity which is anisotropic.

6. Transparent body after one of the previous ones

Claims in which a filler (1) which is normally non-functional and thus hydrophilic and which is incompatible with a hydrophobic polymer matrix (3) is rendered hydrophobic by functionalization or in which a non-functionalized one is normally more hydrophobic and thus with one

hydrophilic polymer matrix (3) incompatible filler (1) is hydrophilized by functionalization.

7. Transparent body after one of the previous ones

Claims wherein the first compound (2) is selected from the group consisting of organosilicon compounds, silanes and their derivatives, siloxanes and their derivatives, ether-containing compounds, carbonic acid esters with diols, esters of acrylic acid and acrylic acid derivatives, phosphonates and their derivatives, and Combinations thereof.

8. Transparent body after one of the previous ones

Claims, wherein the functional group (2-1) is selected from a group comprising vinyl and its derivatives, as well as hydrogen-containing compounds.

9. Transparent body after one of the previous ones

Claims, wherein the first compound (2) comprises at least one functional group (2-1) which is terminally and remotely from a respective particle of the filler disposed on the first compound (2).

10. Transparent body after one of the previous ones

Claims, wherein the polymer matrix (3) is selected from the group consisting of silicone and its derivatives, epoxy resin and its derivatives, polyacrylic resin and derivatives thereof,

Polyurethane and its derivatives, polycarbonate and their

11. Transparent body after one of the previous ones

Claims, wherein the filler (1) is incorporated by co-polymerization in the polymer matrix (3).

12. Transparent body after one of the previous

Claims, wherein the filler (1) chemically and / or

physically to the first compound (2) and the first one

Compound (2) is chemically bonded to the polymer matrix (3).

13. Optoelectronic component with a transparent body according to claims 1 to 12, wherein the

optoelectronic component a beam path of the

provides electromagnetic radiation, wherein the

transparent body is arranged in the beam path.

14. A process for producing a transparent body according to claims 1 to 12, comprising the following process step:

Functionalization of the filler and simultaneous chemical incorporation of the filler in the polymer matrix (3) or

Functionalizing the filler, then mixing the functionalized filler with the polymer matrix (3) and chemically incorporating the functionalized filler into the polymer matrix (3).

15. The method of claim 14, further comprising substances added in functionalizing or chemically binding and selected from a group comprising catalysts, inhibitors, coupling agents and combinations thereof.