WO2013127128A1

WO2013127128A1 - Antenna device

Info

Publication number: WO2013127128A1
Application number: PCT/CN2012/075701
Authority: WO
Inventors: 刘若鹏; 徐冠雄; 邓存喜; 尹柳中; 岳艳涛
Original assignee: 深圳光启高等理工研究院; 深圳光启创新技术有限公司
Priority date: 2012-03-01
Filing date: 2012-05-18
Publication date: 2013-09-06

Abstract

Disclosed is an antenna device. The device comprises: a dielectric substrate, comprising a first surface and a second surface opposite the first surface; and an antenna unit, comprising a first resonance frequency band unit and a second resonance frequency band unit, and disposed on the surface of the dielectric substrate. Compared with the prior art, the dual-band antenna resonates at frequency bands of 880-960 MHz and 1710-1880 MHz, and the dielectric constant and dielectric loss of the dielectric substrate are lowered by introducing polar and non-polar polymers, so as to reduce the power loss and improve the energy conversion efficiency of the antenna device. In addition, comprehensive performance such as the gain of the antenna device is further improved by antenna selection and optimizing the antenna selection design.

Description

Antenna device

[Technical Field]

The present invention relates to an antenna device, and more particularly to a GPRS dual band antenna device. 【Background technique】

General Packet Radio Service (GPRS) is a packet data bearer service. Since GPRS communication is not limited by the working distance, it is especially suitable for operation in complex areas where urban and mountainous areas are severely blocked by electrical signals. The GPRS communication working frequency range is 880~960MHz and 1710~1880MHz.

The existing GPRS antenna basically adopts a whip antenna, so the antenna has a relatively long length when it is in use, and is not suitable for use as an antenna component of a consumer electronic product. On the other hand, in the field of radio frequency antenna technology, the design of the antenna based on the copper-clad laminate has advantages such as a plate shape, and it is also widely used in various electronic devices. Foil laminate related parameters such as dielectric constant, dielectric loss and other related parameters have a great influence on the antenna radiation efficiency and even the overall antenna efficiency.

At the same time, for antenna designers, antenna size, size, length, resonant frequency band, harmonic bandwidth, applicable equipment environment, gain efficiency, field and other factors restrict antenna development and design. For example, the antenna radiation field type and the antenna require high gain performance are a prominent contradiction. Antenna selection has an important impact on the design and development of the antenna. Therefore, considering how to make the overall performance of the antenna meet the requirements of the corresponding electronic equipment under the limited size conditions, and save the cost of antenna development, design and manufacture, it is a comprehensive problem faced by the antenna developers, such as GPRS dual frequency. Antenna design, etc.

[Summary of the Invention]

The technical problem to be solved by the present invention is to improve an antenna device which is low in cost, small in size, and high in efficiency. Accordingly, the present invention provides an antenna device based on a composite dielectric substrate.

The present invention provides an antenna device, including: a dielectric substrate including a first surface and a second surface opposite to the first surface; an antenna unit including a first harmonic And a second resonant frequency band unit and a surface of the dielectric substrate.

The first resonant frequency band unit and the second resonant frequency band unit share a feeding portion; the antenna unit further includes a microstrip feed line, a first choke portion, a second choke portion, and a grounding unit; The tape feed line includes a feed line disposed on the first surface, a first outer conductor distributing the two sides of the feed line, and a second outer conductor disposed on the second surface; the first outer conductor is opened through the dielectric substrate The metallized via is electrically connected to the second outer conductor; the feed portion is connected to one end of the feed line; the first choke portion and the second choke portion are disposed on two sides of the second outer conductor; the second outer conductor One end is electrically connected to one end of the first choke portion and one end of the second choke portion.

The feed line and the first outer conductor are disposed in the first surface projection area of the second outer conductor. The first choke portion is a gamma stream line of a frequency band of 880 MHz to 960 MHz, and the second choke portion is a choke line of a frequency band of 1710 MHz to 1880 MHz.

The grounding unit includes a first grounding portion disposed on the first surface and a second grounding portion disposed on the second surface, and the other end of the second outer conductor extends to the second grounding portion, the first grounding The first ground portion is electrically connected to the second ground portion through a plurality of metallized via holes formed in the dielectric substrate.

The first choke portion and the second choke portion are symmetrically and parallelly disposed on both sides of the second outer conductor. The first resonant frequency band unit and the second resonant frequency band unit are disposed on the same surface and are integrated.

The other end of the microstrip feed line extends into a conductive connection portion. The conductive connection portion has a circular shape and a through hole is formed in the center. The conductive connection portion is oppositely insulated from the first ground portion.

The first resonant frequency band unit and the second resonant frequency band unit share a feeding portion; the antenna unit further includes a microstrip feed line, a choke portion and a grounding unit; the microstrip feed line is disposed on the first surface a feed line, a first outer conductor on both sides of the feed line, and a second outer conductor disposed on the second surface; the first outer conductor passes through the plurality of metallized vias and the second outer conductor formed on the dielectric substrate The electrical connection is connected to one end of the feeding line; the choke portion is symmetrically disposed on two sides of the second outer conductor; and one end of the second outer conductor is electrically connected to one end of the choke portion. The feed line and the first outer conductor are disposed in the first surface projection area of the second outer conductor. Wherein, the choke portion is a 扼 stream line of a frequency band of 880 MHz to 960 MHz or a choke line of a band of 1710 MHz ^ 1880 MHz.

The grounding unit includes a first grounding portion disposed on the first surface and a second grounding portion disposed on the second surface, and the other end of the second outer conductor extends to the second grounding portion, the first A grounding portion is disposed in the projection area of the second grounding portion in the first surface; the first grounding portion is electrically connected to the second grounding portion through a plurality of metallized via holes formed in the dielectric substrate.

The first resonant frequency band unit and the second resonant frequency band unit are disposed on the same surface and are integrated.

The first resonant frequency band unit and the second resonant frequency band unit are coupled to each other and share a feeding portion; a through hole is formed in the dielectric substrate corresponding to the feeding portion; a grounding unit is disposed in the through hole On the edge of the dielectric substrate.

The first resonant frequency band unit is disposed on the first surface; the second resonant frequency band unit is disposed on the second surface, and a metallized via is disposed on the dielectric substrate corresponding to the feeding portion, A resonant frequency band unit is electrically connected to the second resonant frequency band unit through the metallization via.

Wherein the first conductive branch, the second conductive branch, the short arm, the loading element and the resonant arm constitute a first resonant unit; the first conductive branch, the second conductive branch and the short arm constitute a second resonant unit.

Wherein, the loading component is an inductor.

Wherein, the feeding portion, the first conductive branch, the second conductive branch and the short arm surround each other to form a rectangular pattern with a notch.

Compared with the prior art, the above-mentioned dual-frequency antenna resonance is used in 88 (Γ960ΜΗζ frequency band and 171 (Tl880MHz frequency band, and the dielectric of the dielectric substrate is reduced by introducing a form of polar and non-polar polymer copolymer). The number and dielectric loss make the antenna device less loss, and the energy conversion rate is improved. At the same time, the overall performance of the antenna device is further improved by antenna selection and optimized antenna selection design.

[Description of the Drawings]

Figure 1 is a perspective perspective view of a first embodiment of an antenna device of the present invention;

Figure 2 is a schematic view of the first surface of the antenna device shown in Figure 1;

3 is a schematic diagram of a through hole on a dielectric substrate of a first embodiment of an antenna device according to the present invention;

4 is a schematic view of a second surface on a dielectric substrate according to a first embodiment of the antenna device of the present invention; FIG. 5 is a schematic view showing a metallized via hole on a dielectric substrate according to a first embodiment of the antenna device of the present invention;

6 is a simulation parameter diagram of the antenna device S11 shown in FIG. 1;

Figure 7 is a Smith chart of the antenna device shown in Figure 1 at 88 (Γ960ΜΗζ band and 171 (Γΐ880ΜΗζ band;

Figure 8 is a simulation field diagram of the antenna device shown in Figure 1 operating in the 900 MHz band;

Figure 9 is a plan view of the E plane of the field pattern shown in Figure 8;

Figure 10 is a simulation field diagram of the antenna device shown in Figure 1 operating in the 1800 MHz band;

Figure 11 is a plan view of the E plane of the field pattern shown in Figure 10;

Figure 12 is a perspective perspective view of a second embodiment of the antenna device of the present invention;

Figure 13 is a schematic view showing the first surface of the antenna device shown in Figure 12;

Figure 14 is a schematic view showing a through hole of the dielectric substrate of the antenna device shown in Figure 12;

Figure 15 is a schematic rear view of the dielectric substrate of the antenna device shown in Figure 12;

16 is a schematic diagram of a via hole of a dielectric substrate of the antenna device shown in FIG. 12;

17 is a simulation parameter diagram of the antenna device S11 shown in FIG. 12;

18 is a Schmitt chart of the antenna device of FIG. 12 in the SDCT band of the 88CT960 and the z-band of the 1710 to 1880;

19 is a parameter table corresponding to each frequency point on the Smith chart shown in FIG. 18; 20 is a schematic diagram of the simulated field type E plane of the antenna device shown in FIG. 12 operating in the 920 MHz band; FIG. 21 is a schematic diagram of the simulated field type E plane of the antenna device shown in FIG. 12 operating in the 1800 MHz band; A first surface schematic diagram of a third embodiment of the inventive antenna device;

Figure 23 is a second schematic view showing the second embodiment of the antenna device of the present invention;

Figure 24 is a perspective perspective view of the antenna device shown in Figures 22 and 23;

Figure 25 is a simulation parameter diagram of the antenna device S11 shown in Figures 22 and 23;

Figure 26 is a simulation diagram of the antenna device shown in Figures 22 and 23 operating in the 920 MHz band; Figure 27 is a simulation pattern of the antenna device shown in Figures 22 and 23 operating in the 1800 MHz band; Figure 28 is Figure 22 and Figure 23 Smith chart of the antenna device shown;

Figure 29 is a perspective perspective view of an embodiment of an antenna device according to the present invention;

Figure 30 is a simulation parameter diagram of the antenna device S 11 shown in Figure 29;

Figure 31 is a Smith chart of the antenna device shown in Figure 29.

【detailed description】

The invention will now be described in detail in conjunction with the drawings and embodiments.

Please refer to FIG. 1, which is a perspective perspective view of a first embodiment of an antenna device according to the present invention. The antenna device includes a dielectric substrate 1 and an antenna unit 13 disposed on both surfaces of the dielectric substrate 1. The dielectric substrate 1 includes a first surface 12 (refer to FIG. 2) and opposite the first surface 12. A second surface 11. The antenna unit 13 includes a first resonant frequency band unit 133 and a second resonant frequency band unit 135, wherein the first resonant frequency band unit 133 is connected by a point EFGHJ, and the second resonant frequency band unit 135 is connected by a point EI; The first resonant frequency band unit 133 and the second resonant frequency band unit 135 are coupled to each other and share a feeding portion E. In the present embodiment, the first resonant frequency band unit 133 and a second resonant frequency band unit 135 are both disposed on the second surface 11 of the dielectric substrate 1. In other embodiments, the first resonant frequency band unit 133 and the second resonant frequency band unit 135 are respectively disposed on the first surface 12 and the second surface 11 of the dielectric substrate 1.

Please refer to Figure 2, Figure 3, Figure 4 and Figure 5 together. 2 is a first surface of the antenna device shown in FIG. 1. Schematic diagram. 3 is a schematic view of a through hole on a dielectric substrate of a first embodiment of the antenna device of the present invention. 4 is a schematic view showing a second surface on a dielectric substrate of the first embodiment of the antenna device of the present invention. FIG. 5 is a schematic view showing a metallized via hole on a dielectric substrate according to a first embodiment of the antenna device of the present invention. The antenna unit 13 further includes a microstrip feed line 134, a first choke portion 137, a second choke portion 136, and a grounding unit 141/142. The first choke portion 137 is connected by a point AB. The second choke portion 136 is formed by connecting dots CD. In the present embodiment, the first choke portion 137 is a gamma stream line of 880 MHz to 960 MHz, and the second choke portion 136 is a choke line of a frequency band of 1710 MHz to 1880 MHz.

The grounding unit 141\142 includes a first grounding portion 141 disposed on the first surface 12 and a second grounding portion 142 disposed on the second surface 11. The first grounding portion 141 is disposed on the second grounding portion 142. The first ground portion 141 is electrically connected to the second ground portion 142 through the metallized via 138 in a projected area within the surface 12.

The microstrip feed line 134 includes a feed line 1341 disposed on the first surface 12, a first outer conductor 1342 distributing the two sides of the feed line 1341, and a second outer conductor 1343 disposed on the second surface 11. The feed line 1341 and the first outer conductor 1342 are disposed in the second outer conductor 1343 in the projected area of the first surface 12. The other end (M end) of the second outer conductor 1343 extends into the second ground portion 142.

The feed line 1341 is electrically connected to the feed portion E and the other end (M end) is extended to a conductive connection portion 15. In the present embodiment, the conductive connecting portion 15 has a circular shape and a through hole 151 is formed in the center. The conductive connecting portion 15 is oppositely insulated from the first ground portion 141. The first choke portion 137 and the second choke portion 136 are symmetrically disposed on both sides of the second outer conductor 1343 and parallel to each other. One end (N end) of the second outer conductor 1343 is electrically connected to one end (B end) of the first choke portion 137 and one end (D end) of the second choke portion 136.

In the present embodiment, a plurality of through holes 18 of arbitrary shapes are provided on the dielectric substrate 1 of the antenna device. In the present embodiment, the through hole 18 has a rectangular shape. A plurality of metallization vias 138 are defined in the dielectric substrate 1 corresponding to the first outer conductor 1342. The metallization vias 138 are used to electrically connect the first outer conductor 1342 at the first surface 12 and the second outer conductor 1343 of the second surface 11. The metallization via 138 is also used to connect the first ground portion 141 of the first surface 12 and the second ground of the second surface 11 Portion 142 is electrically connected.

In this embodiment, the antenna device further includes a microwave high frequency connector 17, and the conductive connecting portion 15 is electrically connected to an inner conductor (not shown) of the microwave high frequency connector 17. The second ground portion 142 is electrically connected to the outer conductor of the microwave high frequency connector 17. The microwave high frequency connector 17 is also referred to as an SMA signal connector (see Fig. 1). In this embodiment, the resonant frequency band of the first resonant frequency band unit 133 is 880 MHz to 960 MHz; and the resonant frequency band of the second resonant frequency band unit 135 is 1710 MHz to 1880 MHz. The inner conductor of the microwave high frequency connector 17 is electrically connected to the conductive connecting portion 15 through the through hole 151.

In other implementations, the first resonant frequency band unit 133 and the second resonant frequency band unit 135 are respectively disposed on a first surface 12 and a second surface 11 and on the dielectric substrate 1 corresponding to the feeding portion E. a plurality of metallized vias (not shown) are disposed, and the first resonant frequency band unit 133 is electrically connected to the second resonant frequency band unit 135 through the metallization vias, so that the coaxial signal lines (not shown) are electrically connected. It can be simultaneously conducted to the first resonant frequency band unit 133 and the second resonant frequency band unit 135.

In other alternative embodiments, the first resonant frequency band unit 133 and the second resonant frequency band unit 135 are etched into two separate electrical conductors and connected by an associated conductor.

The simulation test results of the antenna device of this embodiment are as follows:

Please refer to Figure 6, the simulation parameter diagram of the antenna device S 11 . The antenna device has good gain performance in the 880-960 display z-band and the 171CT1880 display z-band. The following table: Sl l parameter values corresponding to 880MHz (ml), 960MHz (m2), 908MHz (m6), 1710MHz (m3), 1810MHz (m5) and 1880MHz (m4): Frequency point X Y

Ml 0. 8800 2. 0803 m2 0. 9600 3. 0899 m3 1. 7100 1. 4627 m4 1. 8800 2. 4113 m5 1. 8100 2. 9244 M6 0. 9080 1. 1025 Please refer to Figure 7. The antenna device is in the 88CT960 display z-band and the 171CT1880 z-band Schmidt chart.

Please refer to Figure 8 and Figure 9, for the simulated field diagram and E-plane pattern of the antenna device operating in the 900MHz band. It can be seen from the field pattern that the antenna device is an omnidirectional antenna around the 900MHz band and the gain is up to 1. 9dB, which is close to the theoretical value.

Please refer to Figure 10 and Figure 11, for the simulated field diagram and E-plane pattern of the antenna device operating in the 1800MHz band. As can be seen from the field pattern, the antenna device is an omnidirectional antenna around the 1800MHz band with a gain of 3.38dB.

Referring to FIG. 12 to FIG. 16 , the antenna device of the second embodiment of the present invention includes a dielectric substrate 2 and an antenna unit 23 disposed on both surfaces of the dielectric substrate 2 . The dielectric substrate 2 includes a first surface 22 . (Refer to FIG. 13) and a second surface 21 opposite the first surface 22. The antenna unit 23 includes a first resonant frequency band unit 233 and a second resonant frequency band unit 235, wherein the first resonant frequency band unit 233 is composed of a point EFGHJ, and the second resonant frequency band unit 235 is composed of a point EC; The resonant frequency band unit 233 and the second resonant frequency band unit 235 are coupled to each other and share a feeding portion E. In the present embodiment, the first resonant frequency band unit 233 and the second resonant frequency band unit 235 are both disposed on the first surface 22 of the dielectric substrate 2. In other embodiments, the first resonant frequency band unit 233 and the second resonant frequency band unit 235 are respectively disposed on the first surface 22 and the second surface 21 of the dielectric substrate 2.

The first surface of the antenna device of the present invention, the through hole on the dielectric substrate, the second surface, and a planar view of the metallized via hole on the dielectric substrate. The antenna unit 23 further includes a microstrip feed line 234, a choke portion 237, and a grounding unit 241/242, wherein the choke portion 237 is formed by a point AB connection. The microstrip feed line 234 includes a feed line 2341 disposed on the first surface 22 and connected to the feed portion E, a first outer conductor 2342 distributing the two sides of the feed line 2341, and a second outer surface 21 disposed on the second surface 21 Second outer conductor 2343. The feed line 2341 and the first outer conductor 2342 are disposed on the first surface of the second outer conductor 2343 22 within the projection area. The other end (N end) of the second outer conductor 2342 extends into the second ground portion 242.

In the present embodiment, the choke portion 237 is a 1710 MHz to 1880 MHz band choke line. In other embodiments, the choke portion 237 is a gamma stream line in the 880 MHz to 960 MHz band.

The grounding unit 241 / 242 includes a first ground portion 241 disposed on the first surface 22 and a second ground portion 242 disposed on the second surface 21 . The first ground portion 241 is disposed on the second ground portion 242 at the second portion a plurality of metallized vias 238 formed in the dielectric substrate 2 in the projection area in a projection area in a surface 22, the first grounding portion 241 passing through the plurality of metallization vias 238 and the second grounding portion 242 Electrical connection.

The microstrip feed line 234 is electrically connected to the feed portion E and the other end (N end) is extended to a conductive connection portion 25. In the present embodiment, the conductive connecting portion 25 has a circular shape and a through hole 251 is formed in the center. The conductive connecting portion 25 is oppositely insulated from the first ground portion 241. The choke portion 237 is symmetrically and parallel to both sides of the second outer conductor 2343. One end (M end) of the second outer conductor 2343 is electrically connected to one end (B end) of the choke portion 237.

In the present embodiment, a plurality of through holes 238 of arbitrary shapes are provided on the dielectric substrate 2 of the antenna device. In the present embodiment, the through hole 238 is rectangular to reduce the width of the antenna device of the present invention. A plurality of metallized vias 238 are formed in the dielectric substrate 2 corresponding to the first outer conductor 2342. The metallization vias 238 are used to electrically connect the first outer conductor 2342 at the first surface 22 and the second outer conductor 2343 of the second surface 21.

In this embodiment, the antenna device further includes a microwave high frequency connector 27 through which the conductive connection portion 25 is electrically connected to the inner conductor (not shown) of the microwave high frequency connector 27. connection. The second ground portion 242 is electrically connected to the outer conductor of the microwave high frequency connector 27. The microwave high frequency connector 27 uses a microwave high frequency connector, also known as an SMA signal connector 27 (see Fig. 12). In this embodiment, the resonant frequency band of the first resonant frequency band unit 233 is 880 MHz to 960 MHz _{; and} the resonant frequency band of the second resonant frequency band unit 235 is 1710 MHz to 1880 MHz. The inner conductor of the microwave high frequency connector 27 is in electrical contact with the conductive connection portion 25 through the through hole 251. In other implementations, the first resonant frequency band unit 233 and the second resonant frequency band unit 235 are respectively disposed on a first surface 22 and a second surface 21, and on the dielectric substrate 2 corresponding to the feeding portion E. a plurality of metallized vias (not shown) are disposed, and the first resonant frequency band unit 233 is electrically connected to the second resonant frequency band unit 235 through the metallized via holes, so that the coaxial signal lines (not shown) The electrical signal can be simultaneously conducted to the first resonant frequency band unit 233 and the second resonant frequency band unit 235.

In other alternative embodiments, the first resonant frequency band unit 233 and the second resonant frequency band unit 235 are etched into two separate electrical conductors and connected by an associated conductor.

Refer to the simulation parameter diagram of antenna device S11 shown in Figure 17. The antenna device has good gain performance in the 880-960 display z-band and the 171CT1880 display z-band. The following table: SI 1 corresponding to 880MHz (ml), 920 MHz (m2), 960 MHz (m3), 1710MHz (m4), 1800MHz (m5), 1880MHz (m6), 1733MHz (m7) and 1854MHz (m8) Parameter gain value:

Referring to Figure 18 and Figure 19, the antenna device is in the 880~960ΜΗζ band and 171 (Tl880MHz band Schmidt chart. It is shown at 1810MHz (ml), 1727.5 MHz (m2), 1865MHz (m3), 875MHz (m4), Standing wave values corresponding to 902.5MHz (m5) and 957.5MHz (m6). Please refer to FIG. 20, which shows the pattern of the simulated field type E plane of the antenna device operating in the 920 MHz band. As can be seen from the field pattern, the antenna device is an omnidirectional antenna around the 900MHz band and the gain is up to

1. 56dBi o

Please refer to Figure 21 for the pattern of the simulated field E plane of the antenna device operating in the 1800MHz band. As can be seen from the field pattern, the antenna device is an omnidirectional antenna around the 1800MHz band and the gain is up to

2. 28dBi o

Referring to Figures 22 and 23, there are schematic views of the first surface and the second surface of the third embodiment of the antenna device. The antenna device includes a dielectric substrate 3 and an antenna unit 33. The dielectric substrate 3 includes a first surface 31 and a second surface 32 opposite to the first surface 31. The antenna unit 33 includes a first resonant frequency band unit. 333 and a second resonant frequency band unit 335 and disposed on the first surface 31 of the dielectric substrate 3, wherein the first resonant frequency band unit 233 is composed of a point EFGHJ, and the second resonant frequency band unit 235 is composed of a point EC; A resonant frequency band unit 333 and a second resonant frequency band unit 335 are coupled to each other and share a feeding portion E. A through hole 34 is defined in the dielectric substrate 3 corresponding to the feeding portion E. The antenna device further includes a grounding unit 35 disposed around the edge of the dielectric substrate 3 of the through hole 34.

In the present embodiment, please refer to Fig. 24, which is a perspective perspective view of the antenna device shown. The antenna device further includes a copper shaft signal line 36 through which the power feeding portion E is electrically connected to an inner conductor (not shown) of the copper shaft signal line 36. The grounding unit 35 is electrically connected to the outer conductor of the copper shaft signal line 36. The copper shaft signal line 36 uses a microwave high frequency connector, also known as an SMA signal connector.

The planar view of the first resonant frequency band unit 333 has a shape of a substantially "G" shape, and the resonant frequency band is 88 (Γ960ΜΗζ; the planar view of the second resonant frequency band unit 335 has a substantially inverted "L" shape. , and the resonant frequency band is 171 (Γΐ88 (ΜΗζ.

In other implementations, the first resonant frequency band unit 333 and the second resonant frequency band unit 335 are respectively disposed on a first surface 31 and a second surface 32, and on the corresponding dielectric substrate 3 of the feeding portion Ε A metal via is disposed (not shown), and the first resonant frequency band unit 333 is electrically connected to the second resonant frequency band unit 335 through the metallized via, so that the electrical signal of the coaxial signal line 36 can be simultaneously transmitted. Up to the first resonant frequency band unit 333 and the second resonant frequency band unit 335.

In other optional implementations, the first resonant frequency band unit 333 and the second resonant frequency band unit 335 are etched into two separate electrical conductors and connected by an associated conductor, the associated conductor being fed unit.

Please refer to Figure 25, which is a simulation parameter diagram of the antenna device S11. The antenna device has high gain values in the 880 to 960 display z-band and 171 (Γΐ880ΜΗζ band. The following table shows the S11 parameter values corresponding to 920 MHz and 1800 MHz, respectively:

Refer to Figure 26 and Figure 27 for the antenna setup at 920MHz and the 1800MHz simulation pattern. The gain of the antenna device at 920 is 1.56dbi, and the gain of the antenna device at 1800 is 2. 2dbi.

Figure 28 is a Smith chart of the antenna device shown in Figure 1. The VSWR parameters of the antenna device are as follows:

From the above table data, the VSWR of the antenna device at 920 MHz is as low as 1. 8. The standing wave ratio at 1810 MHz is as low as 1. 1. It can be seen that the GPRS dual-frequency antenna has a very high frequency at 920 MHz and 1810 MHz. Good standing wave ratio, fully meet the needs of the corresponding electronic equipment.

Referring to FIG. 29, a perspective view of an embodiment of an antenna device of the present invention is shown. The main parameter performance correlation of the antenna device is the antenna selection and the antenna dependent medium after the selection, that is, the dielectric loss of the medium. The antenna device of the present invention includes a dielectric substrate 4 and a monopole antenna conductor 43 disposed on the surface of the dielectric substrate 4. The dielectric substrate 4 includes a first surface 41 (refer to FIG. 13) and a second surface opposite the first surface 41. The antenna device of the invention is used in a GPRS communication system, and Used in related systems such as remote charging, people, objects and other positioning devices. The antenna device of the present invention will be described in two parts below.

Antenna device selection design:

The monopole antenna conductor 43 includes a power feeding portion A, a first conductive branch AC and a short arm F extending from the power feeding portion A, and a second conductive branch at a middle position of the first conductive branch AC. BH, a resonant arm DE is disposed in the first conductive branch AC and a loading element 42 for connecting the first conductive branch AC and the resonant arm DE.

In the present embodiment, the loading element 42 is an inductor. The first conductive branch AC is disposed on the same line as the resonant arm DE. The second conductive branch BH is bent into the inverted "L" shape toward the first conductive branch AC. The feeding portion A, the first conductive branch AC, the second conductive branch BH, and the short arm F surround each other to form a rectangular pattern with a notch 46.

In the present embodiment, a through hole 44 is defined in the power feeding portion A and the corresponding position for fixing a high frequency connector (SMA connecting male connector).

The monopole antenna conductor 43 is used to resonate between 880 MHz to 960 MHz and 1710 MHz to 1880 MHz. The first conductive branch AC, the second conductive branch BH, the short arm F, the loading component 42 and the resonant arm DE constitute a first resonant unit 433 for determining each parameter value of the 880 MHz to 960 MHz resonant frequency band; the first conductive branch AC, The second conductive branch BH and the short arm F constitute a second resonating unit 435 for determining various parameter values of the 1710 MHz to 1880 MHz resonant frequency band.

The simulation test results of the antenna device of the present invention are as follows:

Referring to Figure 30, the antenna device S11 is shown as a simulation parameter map. The antenna device has good gain performance at 88 (Γ960ΜΗζ frequency band and 171 (Tl880MHz frequency band. The following table: respectively at 880ΜΗζ(1), 920ΜΗζ(2), 960MHz(3), 1710MHz(4), 1800MHz (5 And 1880MHz (6) corresponding Sl 1 parameter gain value:

960 MHz 2. 8

1710 MHz 2. 2

1800 MHz 1. 5

1880 MHz 2. 8

Please refer to Figure 31, which shows the antenna device in the 880-960 display z-band and 1710~1880 z-band Schmitt chart. The antenna device is in the 88 (Γ960ΜΗζ band and 171 (Γΐ880ΜΗζ band corresponding to the standing wave value is:

From the overall test results, it is seen that the dielectric constant and the dielectric loss of the dielectric base substrate are reduced by introducing a form of a polar and a non-polar polymer copolymer, so that the antenna device has less loss and an energy conversion rate is improved; The antenna selection and optimized antenna selection design further improve the overall performance of the antenna device.

The design of the dielectric substrate of the antenna device:

In the case of a low dielectric constant, a low-loss dielectric substrate, the antenna dielectric substrate is required to operate at a frequency of 1 GHz, having a nominal dielectric constant of 4.0 and a value of 008. Electrical loss tangent. The dielectric substrate includes a fiberglass cloth, an epoxy resin, and a compound containing a crosslinking reaction with the epoxy resin. The first type of embodiment of the dielectric substrate is as follows: The manufacturing process of the dielectric substrate is as follows: First, providing a immersion solution comprises: a first component comprising an epoxy resin; and a second component comprising the epoxy resin a compound in which a crosslinking reaction occurs; and one Kind or multiple solvents. The first component and the second component are mixed according to a certain proportion. After the infiltrating solution is stirred, the glass fiber cloth is infiltrated into the infiltrating solution to adsorb the first component and the second component in the fiberglass cloth or on the surface; and then the fiberglass cloth is baked The one or more solvents are volatilized, and the first component and the second component are mutually crosslinked to form a prepreg or a cured tablet. The prepreg refers to the adsorption of the first component and the second component of the fiberglass cloth in a relatively low drying temperature environment, the first component comprising the epoxy resin and the second component comprising the compound portion undergoing a compound crosslinking reaction. Soft mixture. The cured product means that the first component and the second component of the fiberglass cloth are adsorbed in a relatively high drying temperature environment, and the first component comprises an epoxy resin and the second component comprises a compound moiety. a relatively hard mixture.

In this embodiment, the infiltrated fiberglass cloth is formed into a semi-cured material (in the form of a sheet) by low-temperature baking, and then the semi-cured material is cut into a cut piece, and the plurality of pieces are cut according to the thickness. The multilayer dielectric substrate (i.e., multilayer laminate or sheet) described in the heat treatment is combined.

In a specific embodiment, the compound of the second component may optionally comprise a copolymer of a polar polymer and a non-polar polymer, such as a styrene maleic anhydride copolymer. It is to be understood that a copolymer which can be subjected to a compound crosslinking reaction with an epoxy resin can be used for the formulation component of the present embodiment. The styrene maleic anhydride copolymer of the present embodiment has the following molecular formula:

The above styrene maleic anhydride copolymer contains 4 styrenes in the formula. In other embodiments, the corresponding molecular weight may be selected, such as styrene maleic anhydride copolymer containing 6, 8 styrene or any number in the formula. An epoxy resin is generally an organic polymer compound containing two or more epoxy groups in a molecule.

In other embodiments, the second component of the compound may also be a cyanate prepolymer or a mixture of a styrene maleic anhydride copolymer and a cyanate prepolymer in any ratio. In a specific embodiment, the epoxy resin and the styrene maleic anhydride copolymer are formulated in a ratio of functional values, and then a certain amount of solvent is added to form a solution. The mixing process of the epoxy resin and the styrene maleic anhydride copolymer is processed by a conventional apparatus, such as a common mixing tank and a reaction kettle to uniformly mix the epoxy resin and the styrene maleic anhydride copolymer, thereby making the solution The epoxy resin is uniformly mixed with the styrene maleic anhydride copolymer.

In a specific embodiment, the infiltrating solution is gelled by adding a certain accelerator for 200-400 seconds (the gelatinization temperature is 17 ΓΟ, wherein the gelation time of the infiltrating solution is promoted for about 260 seconds (eg, 258-260 seconds). , or 250-270 seconds, etc.) The effect is better. The accelerator may include any one of the tertiary amines, the imidazoles and the boron trifluoride monoethylamine or a mixture thereof.

The one or more solvents may be selected from, but not limited to, acetone, butanone, N, N-dimethylformamide, ethylene glycol methyl ether, toluene or a mixture of two or more solvents. Mixed solvent.

In another embodiment, the wetting solution comprises: a first component comprising an epoxy resin; a second component comprising a compound that crosslinks with the epoxy resin; and one or more solvents. The second component compound is a mixture of a styrene maleic anhydride copolymer and a cyanate ester prepolymer in any ratio. Wherein the cyanate ester prepolymer has a concentration of 75%. The promoter is selected from dimethylimidazole; the solvent is selected from butanone. The specific formulation of the infiltration solution of this embodiment is as follows:

In the above formulation, a styrene maleic anhydride copolymer and a cyanate ester prepolymer are simultaneously added, and both of them can be combined with an epoxy resin to form a crosslinking reaction.

The second type of implementation is as follows:

In a second type of embodiment of the present invention, the low dielectric constant low loss dielectric substrate manufacturing process further includes the following process: First, the second component comprises a reaction of crosslinking with the epoxy resin. The epoxy resin is formulated in a ratio of functional values to the epoxy resin, and then a certain amount of solvent is added to prepare a solution. In a specific embodiment, the compound comprises a copolymer of a polar polymer and a non-polar polymer, and the copolymer of the preferred embodiment may be a styrene maleic anhydride copolymer. The mixing process of the epoxy resin and the styrene maleic anhydride copolymer is processed by conventional equipment, such as a common mixing tank and a reaction kettle to uniformly mix the epoxy resin with the styrene maleic anhydride copolymer. The styrene maleic anhydride copolymer of the present embodiment has the following molecular formula:

In the above formula of the styrene maleic anhydride copolymer, four styrenes are contained. In other embodiments, the corresponding molecular weight may be selected, such as styrene maleic anhydride copolymer containing 6, or 8 styrene in the formula. Epoxy resin is generally referred to as an organic polymer having two or more epoxy groups in a molecule. In other embodiments, the second component of the compound may also be a cyanate prepolymer or an optional one. A mixture of a styrene maleic anhydride copolymer and a cyanate ester prepolymer in any ratio.

In a specific embodiment, the epoxy resin in the solution and the styrene maleic anhydride copolymer can be subjected to a compound crosslinking reaction under certain conditions, and the compounding crosslinking reaction occurs after being attached to the fiberglass cloth, thereby The dielectric substrate of the present invention is formed.

The one or more solvents may be selected from, but not limited to, acetone, butanone, hydrazine, hydrazine-dimethylformamide, ethylene glycol methyl ether, toluene or a mixed solvent of the above.

The ratio of various components of the solution to a specific embodiment is as follows:

Epoxy resin copolymer cyanate ester prepolymer dimethylimidazole butanone 3, liquefaction content solid content 100.0% 100.0% 75.0% 100.0% 0.0% 0.0 equivalent 233 490 139 0.0 0.0 0.0

60.23% solid resin 100.0 139.8 20.0 0.2000 0.0 260.0 liquid resin 100.0 139.8 26.7 0.2000 165.0 431.7 Design Addition Amount 100.0 139.8 26.7 0.200 165.0 431.7 The above solution formulation includes an epoxy resin, a styrene maleic anhydride copolymer, a cyanate ester prepolymer, a promoter dimethylimidazole, and a solvent butanone. A styrene maleic anhydride copolymer and a cyanate prepolymer are simultaneously added to the above formulation, and both of them are capable of being crosslinked with an epoxy resin.

Then, the small amount of the test sample is extracted from the above solution, and the gelation time of the solution is tested at a specific temperature environment, and the gelation time of the solution at the constant temperature environment is adjusted by adding a promoter. The solution may be gelled in 200-400 seconds by the addition of one or more promoters, wherein the particular temperature environment may be a single temperature value or a selected specific temperature range, in this embodiment The gelation time is set by setting the environment at 171 degrees Celsius, so that the above solution is better in the gelation time of about 260 seconds (such as 258-260 seconds, or 250-270 seconds, etc.). The promoter may optionally include, but is not limited to, any one of a tertiary amine, an imidazole, and a boron trifluoride monoethylamine or a mixture thereof.

In the third step, when the test sample is gelled in a time range of 200 to 400 seconds, the fiberglass cloth is infiltrated in the solution, taken out and dried to form a composition. In this specific step, the glass cloth is immersed in the solution and fully wetted to ensure that the epoxy resin and the styrene maleic anhydride copolymer are adsorbed in the fiberglass cloth or on the surface, and then the glass cloth immersed in the solution is suspended by the blast. The drying oven is baked at 180 ° C for about 5 minutes, the purpose is to fully volatilize the solvent butanone, and the epoxy resin and the styrene maleic anhydride copolymer are combined and cross-linked, and the glass cloth is cross-linked with the compound. The product produced a semi-cured composition. It will be appreciated that the curing composition can be formed by extending the baking time and or increasing the baking temperature. A large number of industrial productions are generally carried out using a dip system and a drying box system in a vertical gluing machine.

Finally, the dried composition is pressed together with a conductive foil. In this specific step, the dried composition (precured or prepreg) is pressed together with the conductive foil in a vacuum hot press. The conductive foil is made of a conductive material made of copper, silver, gold, aluminum or an alloy material of the above materials. Since the price of copper material is relatively low, the conductive foil made of copper is suitable for industrialization. Finally, the copper-clad dielectric substrate is etched by the etching process to the antenna device corresponding to the invention.

The embodiments of the present invention have been described above with reference to the drawings, but the present invention is not limited to the specific embodiments described above, and the specific embodiments described above are merely illustrative and not restrictive. It will be apparent to those skilled in the art that many forms may be made without departing from the spirit and scope of the invention as claimed.

Claims

Rights request

An antenna device, comprising:

a dielectric substrate includes a first surface and a second surface opposite to the first surface; an antenna unit including a first resonant frequency band unit and a second resonant frequency band unit and a surface of the dielectric substrate on.

2. The antenna device according to claim 1, wherein

The first resonant frequency band unit and the second resonant frequency band unit share a feeding portion;

The antenna unit further includes a microstrip feed line, a first choke portion, a second choke portion, and a grounding unit; the microstrip feed line includes a feed line disposed on the first surface, and the two sides of the feed line are distributed An outer conductor and a second outer conductor disposed on the second surface; the first outer conductor is electrically connected to the second outer conductor through a plurality of metallized vias formed in the dielectric substrate; and the feeding portion is connected to one end of the feeding line ;

The first choke portion and the second choke portion are disposed on two sides of the second outer conductor; one end of the second outer conductor is electrically connected to one end of the first choke portion and one end of the second choke portion As one.

The antenna device according to claim 2, wherein the feed line and the first outer conductor are disposed in the first surface projection area of the second outer conductor.

The antenna device according to claim 3, wherein the first choke portion is a gamma stream line of a frequency band of 880 MHz to 960 MHz, and the second choke portion is a choke line of a frequency band of 1710 MHz to 1880 MHz.

The antenna device according to claim 4, wherein the grounding unit includes a first ground portion disposed on the first surface and a second ground portion disposed on the second surface, the second outer conductor The other end extends into the second ground portion, and the first ground portion is disposed in the projection area of the second ground portion in the first surface; the first ground portion passes through a plurality of metallizations opened on the dielectric substrate The hole is electrically connected to the second ground.

The antenna device according to claim 5, wherein the first choke portion and the second choke portion are symmetrically and parallelly disposed on both sides of the second outer conductor.

The antenna device according to claim 6, wherein the first resonant frequency band unit And the second resonant frequency band unit is disposed on the same surface and integrated.

The antenna device according to claim 7, wherein the other end of the microstrip feed line extends into a conductive connection portion, and the conductive connection portion has a circular shape and a through hole is formed in the center, and the conductive connection portion is The first ground portion is disposed opposite to the insulation.

The antenna device according to claim 1, wherein the first resonant frequency band unit and the second resonant frequency band unit share a feeding portion;

The antenna unit further includes a microstrip feed line, a choke portion and a grounding unit; the microstrip feed line includes a feed line disposed on the first surface, a first outer conductor distributing the two sides of the feed line, and a second outer surface a second outer conductor; the first outer conductor is electrically connected to the second outer conductor through a plurality of metallized vias formed in the dielectric substrate; the power feeding portion is connected to one end of the feeding line;

The choke portion is symmetrically disposed on two sides of the second outer conductor; one end of the second outer conductor is electrically connected to one end of the choke portion.

10. The antenna device according to claim 9, wherein the feed line and the first outer conductor are disposed in the first surface projection area of the second outer conductor.

The antenna device according to claim 10, wherein the choke portion is a gamma line of a frequency band of 880 MHz to 960 MHz or a choke line of a frequency band of 1710 MHz to 1880 MHz.

The antenna device according to claim 11, wherein the grounding unit includes a first ground portion disposed on the first surface and a second ground portion disposed on the second surface, the second outer conductor The other end extends into the second grounding portion, the first grounding portion is disposed in the projection area of the second grounding portion in the first surface; the first grounding portion is metallized through the plurality of metal substrates The hole is electrically connected to the second ground.

The antenna device according to claim 12, wherein the first resonant frequency band unit and the second resonant frequency band unit are disposed on the same surface and are integrally connected.

The antenna device according to claim 13, wherein the other end of the microstrip feed line extends into a conductive connection portion, and the conductive connection portion has a circular shape and a through hole is formed in the center, and the conductive connection portion is The first ground portion is disposed opposite to the insulation.

The antenna device according to claim 1, wherein the first resonant frequency band unit and the second resonant frequency band unit are coupled to each other and share a feeding portion; a through hole; a grounding unit disposed on an edge of the dielectric substrate of the through hole.

The antenna device according to claim 15, wherein the first resonant frequency band unit and the second resonant frequency band unit are disposed on the same surface and are integrally connected.

The antenna device according to claim 15, wherein the first resonant frequency band unit is disposed on the first surface; the second resonant frequency band unit is disposed on the second surface, and corresponding to the feeding portion A metallized via is disposed on the dielectric substrate, and the first resonant frequency band unit is electrically connected to the second resonant frequency band unit through the metallized via.

The antenna device according to claim 1, wherein the first conductive branch, the second conductive branch, the short arm, the loading element, and the resonant arm constitute a first resonant unit; the first conductive branch, the second The conductive branch and the short arm constitute a second resonant unit.

The antenna device according to claim 18, wherein the loading element is an inductive sensation.

The antenna device according to claim 19, wherein the power feeding portion, the first conductive branch, the second conductive branch, and the short arm are surrounded by each other to form a rectangular pattern with a notch.