WO2013092535A1

WO2013092535A1 - A heat bus

Info

Publication number: WO2013092535A1
Application number: PCT/EP2012/075868
Authority: WO
Inventors: Iver Munk
Original assignee: Tyst Design Ved Iver Munk
Priority date: 2011-12-21
Filing date: 2012-12-17
Publication date: 2013-06-27

Abstract

A heat bus for cooling electronic devices by transferring heat away from heat producing units to one or more different points on the heat bus, at varying distances from the heat producing units and depending on configuration, from where the heat can be further transported away wherein that said heat bus comprising at least two parallel lamellae and one or more adjustably interconnected structures, said one or more interconnected structures are adapted to be adjustable attached in the gaps between the lamellae, where-by the said one or more interconnected structures can be positioned on or adjacent one or more heat producing units by adjusting the position of the interconnected structures in a plane substantially parallel to the surfaces of the parallel lamellae.

Description

A heat bus

The present invention relates to a heat bus for cooling electronic devices by transferring heat away from heat producing units to one or more points, at varying distances from the heat producing units and depending on configuration, from where the heat can be further transported away.

Background Heat busses or heat sinks are used for cooling purposes in e.g. computer or other electronic devices. One engineering application of heat busses is in the thermal management of electronics, often the computer central processing unit (CPU) or graphics processors. It is difficult to effectively remove heat from these components since non- standardized position of components and height variations of components create one or more thermal gaps in ordinary arrangements. These gaps must be compensated for by utilizing some adjustable mechanism or expensively machined bespoke heat sinks.

These problems are being addressed by flexible contact members.

UK patent no. 2310321 discloses a heat sink for electrical or electronic components comprising a deformable casing, which is filled with a heat transfer medium.

US patent no. 6064573 discloses a heat sink which can change in size to accommodate a board and electronic parts having different sizes by having a plurality of heat-conducting compressible button contacts between a heat sink and an electronic part. Different sized compressible button contacts are used to accommodate disparate heights between the heat sink and surfaces on components of the electronic parts.

JP 10189836 A discloses a heat sink whose thermal resistance is reduced and whose heat dissipating efficiency is increased. The heat sink comprises a base part and fins which fins are mounted on and attached to the base part at the heat sink. The fins are provided with plugs for mounting and attaching. A plurality of holes is provided in the base part and the plugs are mounted and attached in said holes. The plugs and mounting and attaching holes are formed in such a way that the plugs are fitted tightly.

US20080151501 A1 discloses an electronic apparatus including a circuit board, a plurality of circuit elements mounted on the circuit board, and a cooling structure for cooling the circuit elements. The apparatus is said to effec- tively cool a heat generating element mounted on the circuit board and a peripheral element mounted on the circuit board.

When constructing heat busses for use in e.g. a computer it is desirable that the heat bus is as flexible as possible in terms of allowing the heat bus to be adapted to the specific configuration of the heat generation components inside the computer casing.

An example in this regard is that the position of heat generating central processing unit (CPU) varies from design to design.

Another example in this regard is that heat producing components often dissipate some of their heat via the circuit board they are mounted on. A sufficiently flexible heat bus can also interface directly with exposed surface area of the circuit board, i.e. an area of the circuit board which is not populated with components, and remove heat from it, while at the same time interfacing directly with components of varying height and location elsewhere on the same circuit board.

Brief description of the invention

The invention is set forth and characterized in the main claims, while the dependent claims describe other characteristics of the invention.

The present invention seeks to provide a heat bus according to the specific use.

This is achieved by a heat bus comprising at least two parallel lamellae and one or more adjustable interconnected structures, said one or more interconnected structures are adapted to be adjustably attached in the gaps between the lamellae, whereby the said one or more interconnected structures can be positioned on or adjacent one or more heat producing units by adjusting the position of the interconnected structures in a plane substantially parallel to the surfaces of the parallel lamellae. An advantage in this respect is flexibility in assembly and individual adjustment is possible.

In one embodiment the lamellae have an extension. An advantage in this respect is further improvement of the cooling efficiency, since this removes at least one thermal interface between two discrete parts by extending one of the parts in the desired direction, making the other part unnecessary.

The present invention concerns a device which obtains the effect of cooling of components, without having to dissipate all heat to the surrounding media immediately. Instead the heat bus transports a certain amount of this heat to one or more points along the heat bus from where it is further removed. Brief description of the figures

In the following, the invention will be described in greater detail with refer- ence to embodiments shown in the enclosed figures;

Figure 1 illustrates, in perspective, a heat bus according to the present invention, Figure 2 illustrates, in perspective, a mounted interconnected structure according to the present invention,

Figure 3 illustrates a side view of a lamellae and an interconnected structure according to the present invention,

Figures 4a-g illustrate, in a side view, embodiments of interconnected structures according to the present invention,

Figure 5 illustrates, in a top view, a heat bus according to the present inven- tion,

Figure 6 illustrates, in perspective, a heat bus according to the present invention, Figure 7 illustrates a specific embodiment of a heat bus mounted on a typical discrete graphics adapter for PC's.

It should be emphasized that the embodiments shown are used for example purposes only and should not be used to limit the scope of the invention.

Detailed description with reference to the figures The present invention relates to a heat conduction bus, as illustrated in figure 1 . The heat bus is configured for collecting heat from heat producing parts in electrical or electronic components, including those components that are not equally distanced from the heat bus.

The heat bus is adapted to cooling electronics by transferring heat away from heat producing units to one or more points, from where the heat can be further transported away.

A heat bus according to the present invention provides evacuation of the thermal energy produced by the electrical or electronic components.

As can be seen in figure 1 , the heat bus 1 comprises a plurality of lamellae, at least two lamellae 10. The lamella 10 is substantially rectangular and has a longitudinal side surface 13, and two narrow side surfaces, respectively a longitudinal narrow side surface 15 and a short narrow side surface 16.

The lamellae 10 are positioned substantially parallel with the side surfaces adjacent to each other.

Two adjacent parallel lamellae define a gap 30 by the lamellae side surfaces 13. The heat bus 1 is configured to accommodate a circuit board and electric parts having different sizes by having one or more heat conductive interconnected structures 20. As illustrated in figure 2, the interconnected structures 20 are positioned in the gap 30 to create a connection between the heat producing parts and the heat bus. The interconnected structures 20 thermally couple the heat bus and the heat producing units.

On top of the heat bus a conventional heat pipe, such as a phase-shift heat pipe, can be attached for further enhancement of the heat conductive properties.

The interconnected structures are individually placed and paired with components of different heights to accommodate the varying distances between the components and the heat bus.

The invention allows heat to be removed from the top of the surface mount components and a high thermal conductivity is easily obtainable. The heat producing parts can vary in configuration and in the structural height.

The interconnected structures are slidable mounted in the gaps between the lamellae allowing the interconnected structures to be moved along the sur- face of the lamellae while maintaining smooth continuous contact.

The interconnected structures 20 are adjustably attached in the gap 30 between the lamellae in a slidable manner. Thereby the interconnected structures 20 can be moved in two directions, along the longitudinal extend of the lamellae towards the short narrow surfaces 16 of the lamellae and in a direction substantially perpendicular to the first direction transversely towards the longitudinal narrow surfaces.

Thereby it is possible to adjust the position of the interconnected structures 20 in both a horizontal and vertical direction between two or more lamellae 10 by sliding the interconnected structures 20. Thus, the position of at least a part of the interconnected structures 20 can be adjusted to any position between at least two lamellae in the plane parallel to the side surface 13 of the lamellae.

Hereby, it is possible to position the interconnected structures adjoining said heat producing units.

The movement of the interconnected structures 20 are restricted - in the di- rection perpendicular to the plane of the lamellae - by the lamellae 10. By this is meant movement in the third plane, or in depth relative to the horizontal and vertical mentioned above. In this plane the interconnected structure 20 can move in increments, or steps, corresponding to the thickness of each lamella 20.

The interconnected structures 20 can have a U, T, L or comb-shaped cross- section or similar configurations. Figure 4 illustrates different embodiments of interconnected structures. Preferably the interconnected structures have an L-shaped cross-section.

The interconnected structures 20 comprising at least one stem 18 and a base 19. The one or more stems are adapted to be pushed completely or partly in between at least two lamellae. The base 19 is positioned at the extremity of the interconnected structure, and is adapted to be positioned adjoining the heat producing parts 50.

The U-shaped interconnected structure has two stems and a base, where the base extends beneath or passes the longitudinal side surface 15 of the lamellae. The position of the extremity of the interconnected structures, the base portion 19, can be varied by sliding the interconnected structures along the lamellae or in the transverse direction. Thereby the position of the extremity of the interconnected structures can be adjusted according to the heat produc- ing components, to accommodate different designs, such as position or height between the components.

Furthermore, the base of an L-shaped interconnected structure, as illustrated in figure 4a, can extend to a secluded component.

The interconnected structures 20 can be moved both in the horizontal and vertical direction. Furthermore, the base 19 of the interconnected structures extending perpendicular to the plane and the stem of the interconnected structures, and thereby the bases of the interconnected structures, are able to cover the entire area under the heat bus without any blind spots.

The interconnected structures can be created by combining two or more interconnected structures as embodiments illustrated in figures 4e, 4f and 4g. In order to secure interconnection between a heat producing unit and the base of the interconnected structures, the interconnected structure may by springy.

Before being placed in assembly, interconnected structures can extend from the gap of the lamellae being ready to be pressed in to an operational position.

The stem 18 of the interconnected structures 20 has a thickness that corresponds to the gap between the lamellae. The stem 18 is located wholly or partly interposed between said lamellae whereby the interconnected structures 20 are attached by friction. The width and the thickness of the stem can be the same, whereby the cross section of the stem is square, and then the interconnected structure can be placed such that the base extends in the direction parallel to the longitudinal extension of the lamellae. It is preferable to enhance the friction between the lamellae and the interconnected structures and to have a base portion of the interconnecting structures which extend transversely of the longitudinal lamellae, thus the width of the stem may be larger than the distance between two lamellae. In an embodiment the lamellae can have a varying height in the longitudinal direction of the lamellae.

As seen in figure 1 the lamellae comprise an even upper surface and a lower surface comprising an extension, which extends in the same plane as the lamellae.

As illustrated in figure 3, the extended portion 17 can function as a direct contact surface. The extension is positioned asymmetrically along the side surface of the lamellae, depending on application.

The extension can function as a primary contact surface, hence be located in contact with the main heat producing unit, if there exists such a main heat producing unit in the specific application. Discrete graphics adapters and their associated GPUs are examples of this. The interconnected structures can then be positioned according to other heat producing parts.

In an embodiment an interconnected structure 20, such as a comb-shaped interconnecting structure, can be an alternative construction and have same functionality as the extended portion, as illustrated in figure 5 and 6. It is preferable to use variants of the L-shaped interconnected structures, having wider bases and stems, for the same purpose as the comb-shaped interconnecting structure. This height variation of the lamellae can extend to leave gaps in the lamellae where lamellae are not needed. As seen in figure 1 or figure 3 the lamellae include one or more slots or apertures 32.

These apertures or notches 31 may be adapted for mounting purposes to accommodate mounting elements, such as a bolt or the like for fastening the heat bus.

The interconnected structures can also function as mounting elements or distance pieces, hence positioning the lamellae in the substantially parallel configuration. For mounting purpose the interconnected structures can be placed at the short narrow surface or the longitudinal narrow surface of the lamellae or between the heat producing units and the lamellae.

In figure 6 is illustrated an embodiment of the invention, in perspective, dis- closing different types of interconnected structures 20 positioned adjacent to heat producing units.

The heat bus, the lamellae and the interconnected structures may be composed of any suitable material having good heat conducting characteristics such as copper, aluminium or a carbon composite. Preferably, the lamellae and the interconnected structures are made from aluminium.

The lamellae may be made of flat heat pipes, such as flat phase-shift heat pipes. In one embodiment the lamellae comprises one or more flat heat pipes. The lamellae may be made of phase-shift heat pipes, such as heat pipes having a rectangular cross-section. In one embodiment the lamellae comprises one or more flat heat pipes. As seen in figure 1 the heat bus consists of a plurality of lamellae. In one embodiment all the lamellae have the same configuration. By using a lamella having the configuration as disclosed in figure 3, wherein the lamella has an extended portion, and by rotating approximately half of the lamellae, the heat bus comprises, or reaches, two extended discrete areas defined by the ex- tended portion of the lamellae without using interconnected structures.

In a typical layout in discrete graphics adapters, the GPU is placed centrally, and therefore the extended portion will in the above mentioned configuration often be able to cover the GPU, either by shifting the heat bus around in the horizontal plane or rotating the heat bus 180 degrees. Hereby is optimized one uniformed heat bus with a primary extended portion able to cover the primary heat producing unit, in this instance a GPU.

When mounting the heat bus at least two lamellae are mounted above a cir- cuit board 60. Thereafter one or more interconnected structures are mounted wholly or partially in a gap between at least two adjacent lamellae.

The one or more interconnected structures slide in a plane parallel to the side surface of the lamellae to a position corresponding to the position of a heat producing unit. The heat bus is mounted such that the narrow side surface of the lamellae and/or the interconnected structures are adjacent the heat producing units. Finally the heat bus is fastened.

The interconnected structure is functioning as a thermal element of contact among the heat bus and the heat producing units. The lamellae are positioned such that the plane defined by the gap between the lamellae is substantially perpendicular to the plane defined by the extent of the circuit board. In one embodiment the heat bus is mounted with a clearance beneath the lamellae allowing the interconnected structures to be slid into position after fastening of the heat bus above the circuit board and in turn allowing the interconnected structures to be further adjusted. During assembly the interconnected structures are pressed towards the heat producing units to ensure that good contact is made.

The thermal contact can be enhanced by providing thermally-conductive resin or thermally-conductive fats and fatty oils, or variants of silicone, some- times mixed with powdered heat-conduction metals.

The lamellae and the interconnected structures are made of coppered aluminium, aluminium sheet or similar suitable material. The lamellae can be made of flat phase-shift heat pipes.

In figure 7 an example of a specific embodiment of a heat bus mounted on a typical discrete graphics adapter for PC's is shown. A ninety degree bent phase-shift heat pipe having a rectangular cross-section and a typical bending radius is shown in 61 . This heat pipe functions as the heat removing component in this embodiment. Various typical components of a discrete graphics adapter, such as capacitors 62, memory chips 63 and display connectors 64 are shown. Additionally, example functions of the interconnected structures are shown. In 65 an interconnecting structure reaching a secluded component (a memory chip 63) is shown. In 66 one stem or base of an inter- connecting structure functions as a filler structure between lamellae bolted together thus preventing deformation of the lamellae. In a further aspect, the present invention relates to a kit of parts for a Heat Bus system comprising:

a) a heat removing component which removes heat from a system formed by the Heat Bus mounted on electrical or electronic components,

b) a sufficient number of elongated lamellae, optionally bonded together at an elongated part and using inserts,

c) a sufficient number of interconnecting structures,

d) optionally, a paste for improving heat-transfer between the heat removing component, the interconnecting structures and the elongated lamellae, e) optionally fastening means for parallel assembly and fastening-together of lamellae and interconnecting structures, and for mounting and fastening the assembled lamellae and interconnecting structures to the on electrical or electronic components, and

f) optionally, plates for fastening the lamellae and the interconnecting structures to the electrical or electronic components.

In an embodiment the heat removing component removes heat from a system formed by the Heat Bus mounted on discrete graphics adapters (dGPU) for PC's. Typically, such heat removing component is selected from a flat heat pipe or a flat rectangular water block.

In a further embodiment the sufficient number of elongated lamellae, is selected from at least two elongated rectangular lamellae. Typically, from 4 to 50 pieces of similar lamellae, such as from 10-30 pieces, preferably from 15- 25 pieces. Each elongated rectangular lamellae is typically from 10 to 30 cm long, such as from 15-20 cm long, from 5 to 30 mm tall, such as from 10-20 mm tall and from 0.5 to 5 mm thick, such as from 1 -2 mm thick. The elongated lamellae are typically made of aluminium. Preferably bore holes are pre- made in the elongated lamellae, and such bore holes may have a diameter of from 2-6 mm, such as from 3-4 mm. Typically, each elongated lamellae has from 5 to 40 bore holes, such as from 10-20 bore holes.

In a still further embodiment the elongated lamellae are partly bonded to- gether in one place, such as with glue or solder or any other binding means, utilizing the elongated area (see figure 3, 17) for applying the bonding agent. In this embodiment rectangular inserts fitting the elongated area of the lamellae and having the same stem thickness as the interconnecting structures are used thus obtaining a gap (see figure 2, 30) between the lamellae corre- sponding to the stem thickness of the interconnecting structures. In this embodiment fewer bolts are used for fastening the heat bus together as one part is bonded instead. The resulting uneven surface formed by bonding inserts and lamellae together is typically grinded and polished to obtain the smoothness and flatness necessary for sufficient heat transfer. The bonded area of the elongated lamellae of this embodiment of the heat bus is similar to the well-known Bonded Fin Heat Sinks used widely for cooling in industry, although the herein described heat bus otherwise fundamentally differs from a simple heat sink. In a still further embodiment the sufficient number of interconnecting structures is selected from at least two interconnecting structures. Typically, the sufficient number of interconnecting structures is selected from 20-50 pieces, such as from 30-40 pieces. Typically the interconnecting structures are selected from L-shaped fittings and rectangular plates, such as from 25-35 L- shaped fittings and 5-10 rectangular plates. Such L-shaped fittings typically have a base length of from 25-40mm, a stem height of from 15-25mm, a width of from 3-50mm and thickness of from 1 -3mm. Such rectangular plates typically have a length of 50-100mm, a width of 1 -30mm and a thickness of 0.2-3mm. In a further embodiment the paste is present in the kit. The paste is typically selected from a tube of a non-electrically conducting heat transfer paste.

In a still further embodiment the fastening means is present in the kit. The fastening means is selected from bolts, nuts, and springs. Typically, the fastening means is selected from 5-30 bolts, such as 5-15 bolts having a length of from 50-100mm and a diameter of 2-5mm, and 5-10 bolts having a length of 40-80mm and a diameter of 2-5mm. The fastening means may also be selected from 5-20 nuts, such as 5-15 wingnuts having a diameter of 2-5mm and 5-10 nuts having a diameter of 2-5mm. The fastening means may also be selected from 5-20 wire springs, such as spiral wire springs having a minimum diameter of 2mm, an un-compacted height of 6-12mm and a compacted height of 2-5mm. In a further embodiment the plates are present in the kit. Typically, the plates are selected from hard plastic plates. Such plates may be selected from 1 -5 plates, e.g. 2-3 square hard plastic plates. The square plastic plates typically are of a size 40x40mm to 80x80 mm, and from 4-10 mm thick. A typical Heat Bus kit made for discrete graphics adapters (dGPU) for PC's comprises the following components:

a) a component which removes heat from the system formed by the Heat Bus and dGPU on which the Heat Bus is mounted, e.g: Either a flat heatpipe or a flat rectangular water block.

b) a sufficient number of rectangular lamellae, e.g: 20 pieces of similar lamellae, each 17 cm long, 15 mm tall and 1 ,5 mm thick made of aluminium having each 10 3,5mm bore holes.

c) a sufficient number of interconnecting fittings to provide heat-transporting mechanical connections between components mounted on the dGPU circuit board and the heat bus lamellae, e.g: 10 pieces of L-shaped fittings having a base length of 30mm, a stem height of 20mm, a width of 5mm and thickness of 1 ,5mm.

10 pieces of L-shaped fittings having a base length of 30mm, a stem height of 20mm, a width of 15mm and thickness of 1 ,5mm.

10 pieces of L-shaped fittings having a base length of 30mm, a stem height of 20mm, a width of 40mm and thickness of 1 ,5mm.

3 Rectangular plates having a length of 70mm, with of 20mm and a thickness of 0,3mm.

Rectangular plates having a length of 70mm, with of 20mm and a thickness of 1 mm.

d) a paste for improving heat-transfer between components, fittings and lamellae, e.g:

A tube of non-electrically conducting heat transfer paste.

A tube of electrically conducting heat transfer paste.

e) bolts, nuts, springs for parallel assembly and fastening-together of lamellae and fitting stems, plus for mounting and fastening the assembled lamellae and fittings to the dGPU circuit board, e.g:

10 bolts having a length of 75mm and a diameter of 3mm.

6 bolts having a length of 60mm and a diameter of 3mm.

10 wingnuts having a diameter of 3mm.

6 nuts having a diameter of 3mm.

10 spiral wire springs having a minimum diameter of 3mm, uncompacted height of 9mm and compacted height of 3mm.

f) plates for fastening lamellae plus fittings onto dGPU circuit board, plus a softening mat on circuit backside, e.g:

2 square hard plastic plates 70x70mm, 6mm thick.

1 square rubber mat, 40x40mm, 5mm thick.

List of embodiments

1 . A heat bus for cooling electronic devices by transferring heat away from heat producing units to one or more points, at varying distances from the heat producing units and depending on configuration, from where the heat can be further transported away, characterized in that said heat bus comprising at least two parallel lamellae and one or more adjustably interconnected structures, said one or more interconnected structures are adapted to be adjustably attached in the gaps between the lamellae, whereby the said one or more interconnected structures can be positioned on or adjacent one or more heat producing units by adjusting the position of the interconnected structures in a plane substantially parallel to the surfaces of the parallel lamellae.

2. A heat bus according to embodiment 1 , wherein said at least two lamellae comprise one or more flat heat pipes.

3. A heat bus according to embodiment 1 , wherein said at least two lamellae constituting flat heat pipes.

4. A heat bus according to one or more of the preceding embodiments, wherein said one or more interconnected structures comprising at least one stem and a base; said at least one stem being adapted to be positioned ad- jacent the side surface of said lamellae; said base being adapted to be positioned adjacent to the surface of at least one lamellae and/or adjoining a heat producing unit.

5. A heat bus according to one or more of the preceding embodiments, whereby the interconnected structures have a U, T, L or comb-shaped cross- section.

6. A heat bus according to one or more of the preceding embodiments, whereby said interconnected structures are created by combining at least two or more interconnected structures. 7. A heat bus according to one or more of the preceding embodiments, wherein said stem has a thickness corresponding to the distance between two substantially parallel lamellae, whereby said stem are located interposed between said lamellae whereby the interconnected structures are attached by friction.

8. A heat bus according to one or more of the preceding embodiments, wherein said one or more lamellae comprising an extended portion in the same plane as said lamellae.

9. A heat bus according to one or more of the preceding embodiments, wherein said extended portion is positioned asymmetrically along the length of the lamellae. 10. A heat bus according to one or more of the preceding embodiments, wherein said one or more lamellae comprising one or more apertures and/or one or more notches.

1 1 . A heat bus according to one or more of the preceding embodiments, wherein said heat bus comprising lamellae all having the same configuration.

12. A heat bus according to one or more of the embodiments 8-10, wherein approximately half of the lamellae are rotated 180 degree before assembly, whereby the lamellae defining two extended areas.

13. A method of cooling electronic devices by transferring heat away from heat producing units, characterized in that the method comprising the steps of:

- mounting at least two lamellae above a circuit board;

- mounting one or more interconnected structures wholly or partially in a gap between the at least two adjacent lamellae; - sliding the one or more interconnected structures in a plane parallel to the side surface of the lamellae to a position correspond to the position of a heat producing unit;

- mounting the heat bus such that the narrow side surface of the lamel- lae and/or the interconnected structures are adjacent to the heat producing units;

- fastening of the heat bus.

14. A method according to embodiment 13, wherein the method comprising the successive steps of:

- mounting at least two lamellae above a circuit board;

- mounting one or more interconnected structures wholly or partially in a gap between the at least two adjacent lamellae;

- sliding the one or more interconnected structures in a plane parallel to the side surface of the lamellae to a position correspond to the position of a heat producing unit;

- mounting the heat bus such that the narrow side surface of the lamellae and/or the interconnected structures are adjacent to the heat producing units;

- fastening of the heat bus.

15. The method according to any one of the embodiments 13-14, wherein the method further comprises the step of:

- said at least two lamellae are positioned such that the plane defined by the gap between the lamellae is substantially perpendicular to the plane defined by the extent of the circuit board.

16. The method according to one or more of the embodiments 13-15, wherein the method further comprises the step of:

adjusting the interconnected structures by sliding the interconnected structures into position. It is to be noted that the figures and the above description have shown the example embodiments in a simple and schematic manner. Some details have not been shown since the person skilled in the art should be familiar with these details and they would unnecessarily complicate this description.

Claims

1 . A heat bus for cooling electronic devices by transferring heat away from heat producing units to one or more points, at varying distances from the heat producing units and depending on configuration, from where the heat can be further transported away, characterized in that said heat bus comprising at least two parallel lamellae and one or more adjustably interconnected structures, said one or more interconnected structures are adapted to be ad- justably attached in the gaps between the lamellae, whereby the said one or more interconnected structures can be positioned on or adjacent one or more heat producing units by adjusting the position of the interconnected structures in a plane substantially parallel to the surfaces of the parallel lamellae, and wherein said one or more interconnected structures thermally couple the heat bus and the heat producing units.

2. The heat bus according to claim 1 , wherein said at least two lamellae comprising one or more heat pipes having rectangular cross-sections.

3. The heat bus according to claim 1 , wherein said at least two lamellae constituting heat pipes having rectangular cross-sections.

4. The heat bus according to one or more of the preceding claims, wherein said one or more interconnected structures comprising at least one stem and a base; said at least one stem being adapted to be positioned adjacent to the side surface of said lamellae; said base being adapted to be positioned adjacent to the surface of a heat producing unit.

5. The heat bus according to one or more of the preceding claims, wherein the said one or more interconnected structures can be adjusted in both a hor- izontal and vertical direction between two or more lamellae by sliding the interconnected structures.

6. The heat bus according to one or more of the preceding claims, wherein the lamellae are positioned such that the plane defined by the gap between the lamellae is substantially perpendicular to the plane defined by the extent of the circuit board.

7. The heat bus according to one or more of the preceding claims, whereby the interconnected structures have a U, T, L or comb-shaped cross-section.

8. The heat bus according to one or more of the preceding claims, whereby said interconnected structures are created by combining at least two or more interconnected structures.

9. The heat bus according to one or more of the preceding claims, wherein said stem has a thickness corresponding to the distance between two substantially parallel lamellae, whereby said stem are located interposed between said lamellae whereby the interconnected structures are attached by friction.

10. The heat bus according to one or more of the preceding claims, wherein said one or more lamellae comprising an extended portion in the same plane as said lamellae.

1 1 . The heat bus according to one or more of the preceding claims, wherein said extended portion is positioned asymmetrically along the length of the lamellae.

12. The heat bus according to one or more of the preceding claims, wherein said one or more lamellae comprising one or more apertures and/or one or more notches.

13. The heat bus according to one or more of the preceding claims, wherein said heat bus comprising lamellae all having the same configuration.

14. The heat bus according to one or more of the claims 10-12, wherein approximately half of the lamellae are rotated 180 degree before assembly, whereby the lamellae define two extended areas.

15. A method of cooling electronic devices by transferring heat away from heat producing units, characterized in that the method comprising the steps of:

- positioning at least two lamellae above a circuit board;

- sliding the one or more interconnected structures in a plane parallel to the side surface of the lamellae to a position corresponding to the po- sition of a heat producing unit;

- fastening of the heat bus; so that the one or more interconnected

structures thermally couple the heat bus and the heat producing units.

16. The method according to claim 15 wherein the said one or more interconnected structures are adjusted in both a horizontal and vertical direction between two or more lamellae by sliding the interconnected structures.

17. The method according to claim 15 or 16, wherein the lamellae are positioned such that the plane defined by the gap between the lamellae is substantially perpendicular to the plane defined by the extent of the circuit board.

18. The method according to any one of claims 15-17 wherein the method comprising the successive steps of:

- positioning at least two lamellae above a circuit board;

- fastening of the heat bus.

19. The method according to any one of the claims 15-18, wherein the method further comprises the step of:

20. The method according to one or more of the claims 15-19, wherein the method further comprises the step of:

- adjusting the interconnected structures by sliding the interconnected structures into position.

21 . A kit of parts for a Heat Bus system comprising:

a) a heat removing component which removes heat from a system formed by the Heat Bus mounted on electrical or electronic components, b) a sufficient number of elongated lamellae, optionally bonded together at an elongated part and using inserts,

c) a sufficient number of interconnecting structures,

d) optionally, a paste for improving heat-transfer between the heat removing component, the interconnecting structures and the elongated lamellae, e) optionally, fastening means for parallel assembly and fastening-together of lamellae and interconnecting structures, and for mounting and fastening the assembled lamellae and interconnecting structures to the on electrical or electronic components, and

f) optionally, plates for fastening the lamellae and the interconnecting structures to the on electrical or electronic components.