WO2013054327A3 - Cooling system and method - Google Patents
Cooling system and method Download PDFInfo
- Publication number
- WO2013054327A3 WO2013054327A3 PCT/IL2012/050388 IL2012050388W WO2013054327A3 WO 2013054327 A3 WO2013054327 A3 WO 2013054327A3 IL 2012050388 W IL2012050388 W IL 2012050388W WO 2013054327 A3 WO2013054327 A3 WO 2013054327A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat transfer
- thermal contact
- heat
- contact surface
- transfer body
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
Landscapes
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A heat sink device configured for conduction cooling of at least one heat generating component that is mounted to a first face of a substrate is disclosed. The heat sink device includes a heat transfer body configured for being mounted with respect to the substrate and at least one heat transfer unit that includes a heat transfer element configured for providing a heat transfer path between the heat generating component and the heat transfer body. The heat transfer unit includes a first thermal contact surface configured for providing thermal contact between the heat transfer unit and the heat generating component in operation of the heat sink device. The heat transfer element includes a second thermal contact surface different the first thermal contact surface and in thermal communication with the first thermal contact surface. The heat transfer element is movably mounted with respect to the heat transfer body for selective displacement in at least a first direction with respect to the heat transfer body while concurrently providing thermal contact between the second thermal contact surface and the heat transfer body. Also disclosed are a corresponding conduction cooled module and a corresponding method for assembling a conduction cooled module.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL215700 | 2011-10-11 | ||
| IL215700A IL215700A (en) | 2011-10-11 | 2011-10-11 | Cooling system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2013054327A2 WO2013054327A2 (en) | 2013-04-18 |
| WO2013054327A3 true WO2013054327A3 (en) | 2013-06-06 |
Family
ID=45768396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IL2012/050388 WO2013054327A2 (en) | 2011-10-11 | 2012-09-24 | Cooling system and method |
Country Status (2)
| Country | Link |
|---|---|
| IL (1) | IL215700A (en) |
| WO (1) | WO2013054327A2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10809747B2 (en) * | 2013-06-10 | 2020-10-20 | Hamilton Sundstrand Corporation | Thermal conductivity control devices |
| US9909823B2 (en) * | 2013-06-10 | 2018-03-06 | Hamilton Sundstrand Corporation | Thermal conductivity control devices |
| FR3060939B1 (en) * | 2016-12-15 | 2019-07-12 | Thales | THERMAL DRAINAGE SYSTEM |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090101324A1 (en) * | 2007-10-19 | 2009-04-23 | Chung-Jun Chu | Heat conducting apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IL130775A (en) | 1999-07-02 | 2007-03-08 | Elta Systems Ltd | Conduction cooled electronic card module and method of producing the same utilizing an electronic circuit card originally designed for convection cooling |
| KR100555546B1 (en) | 2004-01-08 | 2006-03-03 | 삼성전자주식회사 | IC cooling device and disc drive using the same |
| US7031167B1 (en) | 2004-11-24 | 2006-04-18 | Elta Systems Ltd. | Wedgelock for electronic circuit card module |
-
2011
- 2011-10-11 IL IL215700A patent/IL215700A/en active IP Right Grant
-
2012
- 2012-09-24 WO PCT/IL2012/050388 patent/WO2013054327A2/en active Application Filing
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090101324A1 (en) * | 2007-10-19 | 2009-04-23 | Chung-Jun Chu | Heat conducting apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| IL215700A (en) | 2015-08-31 |
| WO2013054327A2 (en) | 2013-04-18 |
| IL215700A0 (en) | 2011-12-29 |
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| Date | Code | Title | Description |
|---|---|---|---|
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application |
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