WO2012091410A2 - Touch panel using a metal thin film, and method for manufacturing same - Google Patents

Touch panel using a metal thin film, and method for manufacturing same Download PDF

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Publication number
WO2012091410A2
WO2012091410A2 PCT/KR2011/010155 KR2011010155W WO2012091410A2 WO 2012091410 A2 WO2012091410 A2 WO 2012091410A2 KR 2011010155 W KR2011010155 W KR 2011010155W WO 2012091410 A2 WO2012091410 A2 WO 2012091410A2
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WO
WIPO (PCT)
Prior art keywords
pattern
pattern electrode
electrode
touch panel
thin film
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PCT/KR2011/010155
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French (fr)
Korean (ko)
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WO2012091410A3 (en
Inventor
곽민기
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전자부품연구원
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Publication of WO2012091410A2 publication Critical patent/WO2012091410A2/en
Publication of WO2012091410A3 publication Critical patent/WO2012091410A3/en

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

Definitions

  • the present invention relates to a touch panel and a manufacturing method thereof, and more particularly, to a touch panel using a metal thin film and a manufacturing method thereof.
  • a touch panel is an input device that is mounted on the display surface and converts a physical contact such as a user's finger into an electrical signal to operate the product.
  • the touch panel can be widely applied to various display devices. It is growing rapidly.
  • Such touch panels may be classified into resistive, capacitive, ultrasonic (SAW), infrared (IR), and the like according to the operation principle.
  • SAW resistive, capacitive, ultrasonic
  • IR infrared
  • Conventional touch panels basically include a substrate, a metal wiring layer, and a pattern layer.
  • the pattern layer is composed of a plurality of pattern electrodes (touch patterns), and each pattern electrode generates an electrical signal in response to external physical contact.
  • the generated electrical signal is transmitted to the controller of the product through metal wires connected to the pattern electrode to operate the product.
  • the surface resistance of the transparent conductive film (ITO), which is a conductive material constituting the pattern electrodes, is larger than that of the metal thin film, the resistance between the pattern electrodes is increased when manufacturing a touch panel having a large area and excellent performance. There was a problem that the sensitivity is somewhat reduced. In addition, there is a problem in that a patterning mark is visible in a region where the pattern electrode exists due to a difference in transmittance between a region where the pattern electrode exists and a region that does not exist.
  • Embodiments of the present invention reduce the resistance between the pattern electrodes or between the pattern electrodes and the wiring electrodes by forming the pattern electrode in the shape of a mesh using a metal, the touch panel having an improved performance in terms of conductivity, detection sensitivity and transmittance and It is intended to provide a method of manufacturing the same.
  • the glass substrate A pattern electrode part formed on the glass substrate, and having a first pattern electrode arranged in a first direction and a second pattern electrode arranged in a second direction crossing the first pattern electrode and formed in a mesh shape and the pattern
  • a metal pattern part including a wiring electrode part connected to the electrode part;
  • An insulating layer formed on the metal pattern portion;
  • a bridge electrode part formed on the insulating layer and electrically connecting the first pattern electrode or the second pattern electrode to each other.
  • the pattern electrode may have a line width of 1 to 20 ⁇ m, and may have a mesh shape formed of fine lines having a spacing between lines of 200 ⁇ m or more.
  • the glass substrate is disposed between the glass substrate and the metal pattern portion, it may be characterized in that it further comprises a first dielectric thin film layer having a dielectric constant higher than the dielectric constant of the glass substrate.
  • the insulation layer 150 may be made of a material having a dielectric constant higher than that of air, and the material may be selected from SiO 2, SiN, Al 2 O 3, MgF 2, BN, Li 2 O, and CuO.
  • the metal pattern portion 130 and the insulating layer 150 are disposed between the metal pattern portion 130 and the insulating layer 150, and may further include a second dielectric thin film layer having a dielectric constant higher than that of air.
  • the refractive index of the second dielectric thin film layer may be lower than the first dielectric thin film layer.
  • a pattern electrode formed in a mesh shape is provided with a first pattern electrode disposed in a first direction on the glass substrate and a second pattern electrode disposed in a second direction crossing the first pattern electrode.
  • the metal pattern part may simultaneously form the pattern electrode part and the wiring electrode part.
  • Embodiments of the present invention can improve the conductivity and detection strength of the touch panel by reducing the resistance between the pattern electrodes or between the pattern electrodes and the wiring electrodes by forming a pattern electrode in a mesh shape using a metal.
  • the pattern electrode in a mesh shape, the permeability of the large area touch panel can be improved, and the price competitiveness of the product can be improved by forming the pattern electrode without using ITO.
  • the pattern electrode and the wiring electrode can be formed at the same time, a touch panel with a simple work process can be manufactured.
  • FIG. 1 is an exploded perspective view of a touch panel according to an embodiment of the present invention.
  • FIG. 2 is a front view of the metal pattern part of FIG. 1.
  • FIG. 3 is a front view of the touch panel of FIG. 1.
  • FIG. 4 is a cross-sectional view of a touch panel on which a metal pattern part is formed according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of the touch panel in which the insulating layer is formed in FIG. 4.
  • FIG. 6 is a cross-sectional view of a touch panel in which a bridge electrode part is formed in FIG. 5.
  • FIG. 1 is an exploded perspective view of a touch panel 100 according to an embodiment of the present invention.
  • the touch panel 100 may include a glass substrate 110, a metal pattern portion 130 formed on the glass substrate 110, and an insulating layer 150 formed on the metal pattern portion 130. ) And a bridge electrode part 190 formed on the insulating layer 150.
  • a first dielectric thin film layer (not shown) disposed between the glass substrate 110 and the metal pattern portion 130 and a second dielectric thin film layer (not shown) disposed on the metal pattern portion 130 may be further included. have.
  • the glass substrate 110 supports the metal pattern part 130, the insulating layer 150, and the bridge electrode part 190.
  • the glass substrate 110 may be a glass substrate based on SiO 2 or a tempered glass substrate.
  • the metal pattern part 130 is formed on the glass substrate 110.
  • the metal pattern portion 130 includes a patterned electrode portion 132 having a mesh shape formed of thin wires, and a wiring electrode portion 134 connected to the patterned electrode portion 132.
  • a first dielectric thin film layer (not shown) may be interposed between the glass substrate 110 and the metal pattern portion 130.
  • the first dielectric thin film layer may be made of a material having a dielectric constant higher than that of the glass substrate 110.
  • the first dielectric thin film layer is an inorganic metal oxide selected from Al 2 O 3 , TiO 3 , Ta 2 O 5 , Y 2 O 3, and TiO 2 , or PbZr x Ti 1-x O 3 (PZT), Bi.
  • ferroelectric insulators selected from 4 Ti 3 O 12 , BaMgF 4 , SrBi 2 (Ta 1-x Nb x ) 2 O 9 , Ba (Zr 1-x Ti x ) O 3 (BZT), BaTiO 3 and SrTiO 3 Can be.
  • a second dielectric thin film layer (not shown) may be interposed between the metal pattern part 130 and the insulating layer 150.
  • the second dielectric thin film layer may be made of a material having a dielectric constant higher than that of air.
  • the second dielectric thin film layer may be made of a material selected from SiO 2 , SiN, Al 2 O 3 , MgF 2 , BN, Li 2 O, and CuO.
  • the insulating layer 150 may replace the role of the second dielectric thin film layer.
  • the insulating layer 150 may be made of a material having a dielectric constant higher than that of air, for example, selected from SiO 2 , SiN, Al 2 O 3 , MgF 2 , BN, Li 2 O, and CuO. It can be prepared from the material.
  • the capacitance of the metal pattern part 130 is increased, thereby improving touch sensitivity.
  • the second dielectric thin film layer may be manufactured using materials such as SnO 2 , Y 2 O 3 , MgO, SiO 2 , and ZnO having a lower refractive index than the first dielectric thin film layer.
  • FIG. 2 is a front view of the metal pattern part 130 of FIG. 1.
  • the pattern electrode part 132 crosses the first pattern electrode 132a disposed in the first direction and the second pattern electrode 132b intersecting with the first pattern electrode 132a. It includes.
  • the first direction and the second direction may be, for example, the X-axis direction and the Y-axis direction based on the front surface of the touch panel 100, respectively.
  • the direction of the pattern electrode is not limited to this, but other directions are possible, but for the convenience of description, the first direction is the X-axis direction and the second direction is Y based on the front of the touch panel 100. The case in the axial direction will be described below.
  • the first pattern electrodes 132a may be disposed on the X axis while being connected to each other, and the second pattern electrodes 132b may be disposed on the Y axis independently of each other.
  • the shapes of the first pattern electrode 132a and the second pattern electrode 132b are not limited.
  • the first pattern electrode 132a and the second pattern electrode 132b may be disposed so as not to overlap each other, and the shape may be a rhombus, a square, a rectangle, a circle, or an unshaped shape (for example, a dendrite structure). Tree branches are entangled)
  • the first pattern electrode 132a and the second pattern electrode 132b will be described with reference to a case where a rhombus is formed. As shown in FIG. 2, the first pattern electrode 132a and the second pattern electrode 132b are disposed in a rhombus so as not to overlap each other. In this case, the first pattern electrode 132a is connected to the wiring electrode part 134, and the second pattern electrode 132b is not connected to the wiring electrode part 134. The connection between the second pattern electrode 132b and the wiring electrode unit 134 will be described in detail later.
  • the pattern electrode part 132 and the wiring electrode part 134 are electrically connected to each other, and the wiring electrode part 134 controls an electrical signal generated from the pattern electrode part 132 when the user makes physical contact from the outside. It serves to deliver to the flexible circuit board (not shown) or not shown.
  • the control unit or the flexible circuit board may be connected to the wiring electrode unit 132 through a separate connection unit (not shown).
  • the metal pattern part 130 may be made of any one of Ag, Al, Cr, Ni, Mo, or an alloy thereof. Since the metal pattern part 130 is made of metal, it serves to reduce the resistance between the pattern electrode parts 132 provided in the metal pattern part 130 or between the pattern electrode part 132 and the wiring electrode part 134. This improves the conductivity and detection sensitivity of the touch panel 100.
  • the manufacturing process of the touch panel 100 may be simplified.
  • the pattern electrode part 132 is formed in a mesh shape composed of fine wires. Since the pattern electrode part 132 is formed in a mesh shape formed of thin wires, the pattern electrode may be reduced in a region where the pattern electrode is present, thereby improving the transmittance of the touch panel 100. .
  • the thin lines may have a line width of about 1 ⁇ m to about 20 ⁇ m.
  • the line width is narrower than 1 ⁇ m, the defective rate of the touch panel 100 may increase, and when the line width is larger than 20 ⁇ m, the effect of improving the transmittance of the touch panel 100 may be slightly reduced.
  • an interval between the lines of the thin lines in the pattern electrode part 132 may be 200 ⁇ m or more.
  • the transmittance of the touch panel 100 may be reduced than desired.
  • the insulating layer 150 is formed on the metal pattern part 130 to form a bridge electrode part 170 that electrically connects the second pattern electrode 132b to the first pattern electrode 132a and the second. Insulate the pattern electrode 132b from each other.
  • the insulating layer 150 may be formed on the pattern electrode part 132 and the wiring electrode part 134.
  • the insulating layer 150 may be formed by not removing the photoresist composition used when forming the metal pattern portion 130. That is, the photoresist composition may make up the insulating layer 150.
  • the insulating layer 150 may be formed of an organic material such as polyethylene, which may be a photo process or a printing process, or may be formed of an insulating material such as ceramic.
  • the bridge electrode part 170 is formed on the insulating layer 150 and is formed to electrically connect the second pattern electrode 132b of the pattern electrode part 132.
  • the bridge electrode unit 170 electrically connects the second pattern electrode 132b to detect an electrical signal generated when the user makes a physical contact and connect the second pattern electrode 132b to recognize it. do.
  • the bridge electrode unit 170 may be made of any one of Ag, Al, Cr, Ni, Mo, or an alloy thereof. On the other hand, at least one of the position, size or shape of the bridge electrode unit 170 is not limited.
  • the bridge electrode part 190 may be manufactured in a rod shape or a strip shape.
  • FIG. 4 is a cross-sectional view of the touch panel 100 in which the metal pattern part 130 is formed
  • FIG. 5 is a cross-sectional view of the touch panel 100 in which the insulating layer 150 is formed in FIG. 4.
  • 6 is a cross-sectional view of the touch panel 100 in which the bridge electrode unit 170 is formed in FIG. 5.
  • 4 to 6 are cross-sectional views taken along the line IV-IV of FIG. 3.
  • a mesh-shaped pattern electrode part formed of fine wires on the glass substrate 110 made of glass or tempered glass and the pattern electrode part are formed.
  • the metal pattern part 130 having the wiring electrode part connected to the metal is formed.
  • a metal film is formed on the glass substrate 100 using a sputter system, an E-Beam system, or a thermal system. At this time, it is also possible to use a printing process to omit the above process.
  • the metal film is formed of any one of Ag, Al, Cr, Ni, Mo, or an alloy thereof.
  • the photoresist composition is coated on the metal film, and the pattern electrode part 132 and the wiring electrode part 134 are formed using an exposure process.
  • the pattern electrode portion and the wiring electrode portion can be formed at one time.
  • the pattern electrode part 132 may be formed by being divided into a first pattern electrode 132a disposed in a first direction and a second pattern electrode 132b disposed in a second direction crossing the first pattern electrode 132a. Can be.
  • the first pattern electrodes 132a may be formed in the X-axis direction while being connected to each other, and the second pattern electrodes 132b may be formed in the Y-axis direction independently of each other.
  • the first pattern electrode 132a and the second pattern electrode 132b are the same as or similar to those described above, and thus a detailed description thereof will be omitted (see FIG. 4).
  • an insulating layer 150 is formed on the metal pattern part 130.
  • the method of forming the insulating layer 150 may be a method of coating an organic material such as polyethylene or an insulating material such as ceramic, which is capable of a photo process or a printing process, using a sputter system, an E-Beam system, a thermal system, or an atmospheric pressure coating system. Can be used.
  • the photoresist composition itself may be used as the insulating layer 150 by not removing the photoresist composition formed on the metal film (see FIG. 5).
  • a plurality of via holes 175 are formed on the insulating layer 150. This is for electrically connecting the bridge electrode 170 and the second pattern electrode 132b, and a plurality of via holes 175 may be formed as necessary.
  • a method of forming the via hole 175 a method of removing the insulating layer 150 in a portion where the via hole 175 is to be formed using an etching process or the like may be used.
  • the bridge electrode part 170 is correspondingly formed on the via hole 175 to electrically connect the bridge electrode part 170 and the second pattern electrode 132b of the metal pattern part 130. That is, when the user physically contacts the bridge electrode unit 170, the generated electrical signal is transmitted to the metal pattern unit 130 through the via hole 175 to operate the touch panel.
  • the method of forming the bridge electrode unit 170 may be formed by coating a metal film made of any one of Ag, Al, Cr, Ni, Mo, or an alloy thereof and through a photoresist process (see FIG. 6 above).
  • embodiments of the present invention form a pattern electrode in a mesh shape using metal to reduce the resistance between the pattern electrodes or between the pattern electrodes and the wiring electrodes, thereby improving the conductivity and detection strength of the touch panel. Can be.
  • the transmittance of the touch panel can be improved, and the price competitiveness of the product can be improved by forming the pattern electrode without using ITO.
  • the pattern electrode and the wiring electrode can be formed at the same time, a touch panel with a simple work process can be manufactured.

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Position Input By Displaying (AREA)
  • Manufacture Of Switches (AREA)

Abstract

Disclosed is a touch panel using a metal thin film, and a method for manufacturing same. The touch panel according to one embodiment of the present invention comprises: a glass substrate; a metal pattern unit which is formed on the glass substrate, and which includes a pattern electrode unit and a wiring electrode unit connected to the pattern electrode unit, wherein the pattern electrode unit includes a first pattern electrode arranged in a first direction and a second pattern electrode arranged in a second direction such that the second pattern electrode intersects the first pattern electrode, and the pattern electrode unit has a mesh shape; an insulation layer formed on the upper surface of the metal pattern unit; and a bridge electrode unit which is formed on the upper surface of the insulation layer, and which electrically connects the first pattern electrode or the second pattern electrode.

Description

금속박막을 이용한 터치패널 및 그 제조방법Touch panel using metal thin film and manufacturing method thereof
본 발명은 터치패널 및 그 제조방법에 관한 것으로, 보다 상세하게는 금속박막을 이용한 터치패널 및 그 제조방법에 관한 것이다.The present invention relates to a touch panel and a manufacturing method thereof, and more particularly, to a touch panel using a metal thin film and a manufacturing method thereof.
터치패널(touch panel)은 디스플레이 표면에 장착되어 사용자의 손가락등의 물리적 접촉을 전기적 신호로 변환하여 제품을 작동시키는 입력장치로서, 각종 디스플레이 장치에 폭넓게 응용될 수 있으며, 근래에 와서는 그 수요가 비약적으로 성장하고 있다. A touch panel is an input device that is mounted on the display surface and converts a physical contact such as a user's finger into an electrical signal to operate the product. The touch panel can be widely applied to various display devices. It is growing rapidly.
이러한 터치패널은 동작원리에 따라 저항막 방식(Resistive), 정전용량 방식(Capacitive), 초음파 방식(SAW), 적외선 방식(IR)등으로 구분될 수 있다. Such touch panels may be classified into resistive, capacitive, ultrasonic (SAW), infrared (IR), and the like according to the operation principle.
종래 터치패널은 기본적으로 기판, 금속배선층, 패턴층을 구비한다. 패턴층은 복수개의 패턴 전극(터치패턴)들로 구성되어 있으며, 각각의 패턴 전극은 외부의 물리적 접촉에 대응해 전기적 신호를 발생시킨다. 그리고 발생된 전기적 신호는 패턴 전극과 연결된 금속배선들을 통해 제품의 제어부로 전달되어 제품을 작동시킨다.Conventional touch panels basically include a substrate, a metal wiring layer, and a pattern layer. The pattern layer is composed of a plurality of pattern electrodes (touch patterns), and each pattern electrode generates an electrical signal in response to external physical contact. The generated electrical signal is transmitted to the controller of the product through metal wires connected to the pattern electrode to operate the product.
그러나 종래에는 패턴 전극들을 구성하는 전도성 물질인 투명 전도막(ITO)의 표면저항이 금속박막과 비교하여 크므로, 대면적 및 우수한 성능을 가지는 터치패널 제조시 패턴 전극간 저항이 커져 신호 감도, 검출 감도가 다소 떨어지는 문제점이 있었다. 그리고 패턴전극이 존재하는 영역과 존재하지 않는 영역 사이의 투과율등의 차이로, 패턴전극이 존재하는 영역에서는 패터닝 자국이 보이는 문제점이 있었다. However, in the related art, since the surface resistance of the transparent conductive film (ITO), which is a conductive material constituting the pattern electrodes, is larger than that of the metal thin film, the resistance between the pattern electrodes is increased when manufacturing a touch panel having a large area and excellent performance. There was a problem that the sensitivity is somewhat reduced. In addition, there is a problem in that a patterning mark is visible in a region where the pattern electrode exists due to a difference in transmittance between a region where the pattern electrode exists and a region that does not exist.
따라서, 패턴 전극들간의 저항을 감소시켜, 전도성 및 검출감도면에서 향상된 성능을 가질 뿐만 아니라, 투과성도 높일 수 있는 터치패널에 관한 기술개발이 요청된다.Accordingly, there is a need for a technology development for a touch panel that can reduce resistance between pattern electrodes, improve performance in terms of conductivity and detection sensitivity, and increase transmittance.
본 발명의 실시예들은 패턴 전극을 금속을 사용하여 그물망 형상으로 형성함으로써 패턴 전극들간 또는 패턴 전극들 및 배선 전극들간의 저항을 감소시켜, 전도성, 검출감도 및 투과성면에서 향상된 성능을 가지는 터치패널 및 그 제조방법을 제공하고자 한다.Embodiments of the present invention reduce the resistance between the pattern electrodes or between the pattern electrodes and the wiring electrodes by forming the pattern electrode in the shape of a mesh using a metal, the touch panel having an improved performance in terms of conductivity, detection sensitivity and transmittance and It is intended to provide a method of manufacturing the same.
본 발명의 일 측면에 따르면, 유리 기판; 상기 유리 기판 상부에 형성되고, 제 1 방향으로 배치되는 제 1 패턴 전극과 상기 제 1 패턴 전극과 교차하여 제 2 방향으로 배치되는 제 2 패턴 전극으로 구성되어 그물망 형상으로 형성된 패턴 전극부와 상기 패턴 전극부와 연결되는 배선 전극부를 구비하는 금속패턴부; 상기 금속패턴부 상부에 형성되는 절연층; 및 상기 절연층 상부에 형성되고, 상기 제 1 패턴 전극 또는 상기 제 2 패턴 전극을 전기적으로 연결시키는 브릿지 전극부를 포함하는 터치패널이 제공될 수 있다. According to an aspect of the invention, the glass substrate; A pattern electrode part formed on the glass substrate, and having a first pattern electrode arranged in a first direction and a second pattern electrode arranged in a second direction crossing the first pattern electrode and formed in a mesh shape and the pattern A metal pattern part including a wiring electrode part connected to the electrode part; An insulating layer formed on the metal pattern portion; And a bridge electrode part formed on the insulating layer and electrically connecting the first pattern electrode or the second pattern electrode to each other.
또한, 상기 패턴 전극부는 1 내지 20㎛의 선폭을 가지고, 선들 사이의 간격이 200㎛ 이상인 세선(細線)들로 형성된 그물망 형상일 수 있다.In addition, the pattern electrode may have a line width of 1 to 20 μm, and may have a mesh shape formed of fine lines having a spacing between lines of 200 μm or more.
또한, 상기 유리 기판 및 상기 금속패턴부 사이에 배치되는 것으로, 상기 유리 기판의 유전율보다 높은 유전율을 갖는 제1 유전체 박막층을 더 포함하는 것을 특징으로 할 수 있다. In addition, it is disposed between the glass substrate and the metal pattern portion, it may be characterized in that it further comprises a first dielectric thin film layer having a dielectric constant higher than the dielectric constant of the glass substrate.
이 때, 상기 제1 유전체 박막층은 Al2O3, TiO3, Ta2O5, Y2O3 및 TiO2에서 선택되는 무기금속산화물 또는 PbZrxTi1-xO3(PZT), Bi4Ti3O12, BaMgF4, SrBi2(Ta1-xNbx)2O9, Ba(Zr1-xTix)O3(BZT), BaTiO3 및 SrTiO3에서 선택되는 강유전성 절연체로 제조되는 것을 특징으로 할 수 있다. At this time, the first dielectric thin film layer is an inorganic metal oxide selected from Al2O3, TiO3, Ta2O5, Y2O3 and TiO2 or PbZrxTi1-xO3 (PZT), Bi4Ti3O12, BaMgF4, SrBi2 (Ta1-xNbx) 2O9, Ba (Zr1-xTix) It may be characterized in that it is made of a ferroelectric insulator selected from O 3 (BZT), BaTiO 3 and SrTiO 3.
한편, 상기 절연층(150)은 공기의 유전율보다 높은 유전율을 가지는 물질로 제조되고, 상기 물질은 SiO2, SiN, Al2O3, MgF2, BN, Li2O 및 CuO에서 선택되는 것을 특징으로 할 수 있다. Meanwhile, the insulation layer 150 may be made of a material having a dielectric constant higher than that of air, and the material may be selected from SiO 2, SiN, Al 2 O 3, MgF 2, BN, Li 2 O, and CuO.
또한, 상기 금속패턴부(130) 및 상기 절연층(150) 사이에 배치되는 것으로, 공기의 유전율보다 높은 유전율을 갖는 제2 유전체 박막층을 더 포함하는 것을 특징으로 할 수 있다. In addition, it is disposed between the metal pattern portion 130 and the insulating layer 150, and may further include a second dielectric thin film layer having a dielectric constant higher than that of air.
이 때, 상기 제2 유전체 박막층은 SiO2, SiN, Al2O3, MgF2, BN, Li2O 및 CuO에서 선택되는 물질로 제조되는 것을 특징으로 할 수 있다. In this case, the second dielectric thin film layer may be made of a material selected from SiO 2, SiN, Al 2 O 3, MgF 2, BN, Li 2 O and CuO.
또한, 상기 제1 유전체 박막층보다 상기 제2 유전체 박막층의 굴절율이 더 낮은 것을 특징으로 할 수 있다. In addition, the refractive index of the second dielectric thin film layer may be lower than the first dielectric thin film layer.
본 발명의 다른 측면에 따르면, 유리 기판 상부에 제 1 방향으로 배치되는 제 1 패턴 전극과 상기 제 1 패턴 전극과 교차하여 제 2 방향으로 배치되는 제 2 패턴 전극이 구비되어 그물망 형상으로 형성된 패턴 전극부와 상기 패턴 전극부와 연결되는 배선 전극부를 구비하는 금속패턴부를 형성하는 단계; 상기 금속패턴부 상부에 포토레지스트 조성물을 도포하여 절연층을 형성하는 단계; 상기 절연층 상부에 복수 개의 비아홀(via hole)을 형성하는 단계; 및 상기 비아홀 위에 브릿지 전극부를 대응 형성하여 상기 제 1 패턴 전극 또는 상기 제 2 패턴 전극을 전기적으로 연결시키는 단계를 포함하는 터치패널 제조방법이 제공될 수 있다. According to another aspect of the present invention, a pattern electrode formed in a mesh shape is provided with a first pattern electrode disposed in a first direction on the glass substrate and a second pattern electrode disposed in a second direction crossing the first pattern electrode. Forming a metal pattern portion having a portion and a wiring electrode portion connected to the pattern electrode portion; Forming an insulating layer by applying a photoresist composition on the metal pattern portion; Forming a plurality of via holes on the insulating layer; And forming a bridge electrode part on the via hole to electrically connect the first pattern electrode or the second pattern electrode to each other.
또한, 상기 금속패턴부는 상기 패턴 전극부 및 상기 배선 전극부를 동시에 형성할 수 있다.The metal pattern part may simultaneously form the pattern electrode part and the wiring electrode part.
본 발명의 실시예들은 패턴 전극을 금속을 사용하여 그물망 형상으로 형성하여 패턴 전극들간 또는 패턴 전극들 및 배선 전극들간의 저항을 감소시킴으로써, 터치패널의 전도성 및 검출강도를 향상시킬 수 있다. Embodiments of the present invention can improve the conductivity and detection strength of the touch panel by reducing the resistance between the pattern electrodes or between the pattern electrodes and the wiring electrodes by forming a pattern electrode in a mesh shape using a metal.
또한, 패턴 전극을 그물망 형상으로 형성함으로써 대면적 터치패널의 투과성을 향상시킬 수 있고, ITO를 사용하지 않고 패턴 전극을 형성함으로써 제품의 가격 경쟁력을 향상시킬 수 있다.In addition, by forming the pattern electrode in a mesh shape, the permeability of the large area touch panel can be improved, and the price competitiveness of the product can be improved by forming the pattern electrode without using ITO.
또한, 금속패턴부 상하면에 유전체 박막층을 형성함으로써 패턴 전극의 센싱 감도를 향상시킬 수 있다.In addition, by forming a dielectric thin film layer on the upper and lower surfaces of the metal pattern portion, it is possible to improve the sensing sensitivity of the pattern electrode.
또한, 패턴 전극 및 배선 전극을 동시에 형성 가능하므로, 작업 공정이 단순한 터치패널을 제조할 수 있다.In addition, since the pattern electrode and the wiring electrode can be formed at the same time, a touch panel with a simple work process can be manufactured.
도 1은 본 발명의 일 실시예에 따른 터치패널의 분해 사시도이다. 1 is an exploded perspective view of a touch panel according to an embodiment of the present invention.
도 2는 도 1의 금속패턴부의 정면도이다. FIG. 2 is a front view of the metal pattern part of FIG. 1.
도 3은 도 1의 터치패널의 정면도이다. 3 is a front view of the touch panel of FIG. 1.
도 4는 본 발명의 일 실시예에 따라 금속패턴부를 형성한 터치패널의 단면도이다. 4 is a cross-sectional view of a touch panel on which a metal pattern part is formed according to an embodiment of the present invention.
도 5는 도 4에서 절연층을 형성한 터치패널의 단면도이다. FIG. 5 is a cross-sectional view of the touch panel in which the insulating layer is formed in FIG. 4.
도 6은 도 5에서 브릿지 전극부를 형성한 터치패널의 단면도이다.6 is a cross-sectional view of a touch panel in which a bridge electrode part is formed in FIG. 5.
(부호의 설명)(Explanation of the sign)
100 : 터치패널100: touch panel
110 : 투명성 기판110: transparency substrate
130 : 금속패턴부130: metal pattern portion
132 : 패턴 전극부132 pattern electrode
132a : 제 1 패턴 전극132a: first pattern electrode
132b : 제 2 패턴 전극132b: second pattern electrode
134 : 배선 전극부134: wiring electrode portion
150 : 절연층150: insulation layer
170 : 브릿지 전극부170: bridge electrode portion
175 : 비아홀175: via hole
이하에서는 첨부된 도면을 참조하여 본 발명의 실시예들에 대하여 상세히 설명하기로 한다. Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
도 1은 본 발명의 일 실시예에 따른 터치패널(100)의 분해 사시도이다.  1 is an exploded perspective view of a touch panel 100 according to an embodiment of the present invention.
도 1을 참조하면, 터치패널(100)은 유리 기판(110)과, 유리 기판(110) 상부에 형성되는 금속패턴부(130)와, 금속패턴부(130) 상부에 형성되는 절연층(150) 및 절연층(150) 상부에 형성되는 브릿지 전극부(190)를 포함한다.  Referring to FIG. 1, the touch panel 100 may include a glass substrate 110, a metal pattern portion 130 formed on the glass substrate 110, and an insulating layer 150 formed on the metal pattern portion 130. ) And a bridge electrode part 190 formed on the insulating layer 150.
또한, 유리 기판(110) 및 금속패턴부(130) 사이에 배치되는 제1 유전체 박막층(미도시) 및 금속패턴부(130) 상부에 배치되는 제2 유전체 박막층(미도시)을 더 포함할 수 있다. In addition, a first dielectric thin film layer (not shown) disposed between the glass substrate 110 and the metal pattern portion 130 and a second dielectric thin film layer (not shown) disposed on the metal pattern portion 130 may be further included. have.
유리 기판(110)은 금속패턴부(130), 절연층(150) 및 브릿지 전극부(190)를 지지하는 역할을 수행한다. 예를 들면, 유리 기판(110)은 SiO2를 주성분으로 하는 유리기판, 또는 강화유리기판이 사용될 수 있다. The glass substrate 110 supports the metal pattern part 130, the insulating layer 150, and the bridge electrode part 190. For example, the glass substrate 110 may be a glass substrate based on SiO 2 or a tempered glass substrate.
금속패턴부(130)는 유리 기판(110) 상부에 형성된다. 금속패턴부(130)는 세선(細線)들로 구성된 그물망 형상의 패턴 전극부(132)와, 패턴 전극부(132)와 연결되는 배선 전극부(134)를 구비한다.  The metal pattern part 130 is formed on the glass substrate 110. The metal pattern portion 130 includes a patterned electrode portion 132 having a mesh shape formed of thin wires, and a wiring electrode portion 134 connected to the patterned electrode portion 132.
한편, 유리 기판(110) 및 금속패턴부(130) 사이에는 제1 유전체 박막층(미도시)이 개재될 수 있다. 상기 제1 유전체 박막층은 유리 기판(110)의 유전율보다 높은 유전율을 갖는 물질로 제조될 수 있다. 예를 들면, 상기 제1 유전체 박막층은 Al2O3, TiO3, Ta2O5, Y2O3 및 TiO2에서 선택되는 무기금속산화물 또는 PbZrxTi1-xO3(PZT), Bi4Ti3O12, BaMgF4, SrBi2(Ta1-xNbx)2O9, Ba(Zr1-xTix)O3(BZT), BaTiO3 및 SrTiO3에서 선택되는 강유전성 절연체로 제조될 수 있다. Meanwhile, a first dielectric thin film layer (not shown) may be interposed between the glass substrate 110 and the metal pattern portion 130. The first dielectric thin film layer may be made of a material having a dielectric constant higher than that of the glass substrate 110. For example, the first dielectric thin film layer is an inorganic metal oxide selected from Al 2 O 3 , TiO 3 , Ta 2 O 5 , Y 2 O 3, and TiO 2 , or PbZr x Ti 1-x O 3 (PZT), Bi. Manufactured with ferroelectric insulators selected from 4 Ti 3 O 12 , BaMgF 4 , SrBi 2 (Ta 1-x Nb x ) 2 O 9 , Ba (Zr 1-x Ti x ) O 3 (BZT), BaTiO 3 and SrTiO 3 Can be.
또한, 금속패턴부(130) 및 절연층(150) 사이에는 제2 유전체 박막층(미도시)이 개재될 수 있다. 상기 제2 유전체 박막층은 공기의 유전율보다 높은 유전율을 갖는 물질로 제조될 수 있다. 예를 들면, 상기 제2 유전체 박막층은 SiO2, SiN, Al2O3, MgF2, BN, Li2O 및 CuO에서 선택되는 물질로 제조될 수 있다. In addition, a second dielectric thin film layer (not shown) may be interposed between the metal pattern part 130 and the insulating layer 150. The second dielectric thin film layer may be made of a material having a dielectric constant higher than that of air. For example, the second dielectric thin film layer may be made of a material selected from SiO 2 , SiN, Al 2 O 3 , MgF 2 , BN, Li 2 O, and CuO.
이 때, 상기 제2 유전체 박막층의 역할을 절연층(150)이 대체하는 것도 가능하다. 이 경우, 절연층(150)은 공기의 유전율보다 높은 유전율을 갖는 물질로 제조될 수 있으며, 예를 들면, SiO2, SiN, Al2O3, MgF2, BN, Li2O 및 CuO에서 선택되는 물질로 제조될 수 있다.In this case, the insulating layer 150 may replace the role of the second dielectric thin film layer. In this case, the insulating layer 150 may be made of a material having a dielectric constant higher than that of air, for example, selected from SiO 2 , SiN, Al 2 O 3 , MgF 2 , BN, Li 2 O, and CuO. It can be prepared from the material.
상술한 바와 같이, 금속패턴부(130) 상하부에 유전율이 높은 물질로 제조되는 제1,2 유전체 박막층을 개재함으로써, 금속패턴부(130)의 캐패시턴스가 상승하여 터치감도가 개선되는 효과가 있다. As described above, by interposing the first and second dielectric thin film layers made of a material having a high dielectric constant above and below the metal pattern part 130, the capacitance of the metal pattern part 130 is increased, thereby improving touch sensitivity.
한편, 상기 제1 유전체 박막층과 상기 제2 유전체 박막층의 굴절율을 제어함으로써, 터치패널(100)의 투명성을 향상시킬 수 있다. 이를 위해, 상기 제2 유전체 박막층은 상기 제1 유전체 박막층보다 굴절율이 낮은 SnO2, Y2O3, MgO, SiO2, ZnO 등의 물질을 사용하여 제조하는 것이 가능하다. Meanwhile, transparency of the touch panel 100 may be improved by controlling the refractive indices of the first dielectric thin film layer and the second dielectric thin film layer. To this end, the second dielectric thin film layer may be manufactured using materials such as SnO 2 , Y 2 O 3 , MgO, SiO 2 , and ZnO having a lower refractive index than the first dielectric thin film layer.
도 2는 도 1의 금속패턴부(130)의 정면도이다. 도 2를 참조하면, 패턴 전극부(132)는 제 1 방향으로 배치되는 제 1 패턴 전극(132a)과 제 1 패턴 전극(132a)와 교차하여 제 2 방향으로 배치되는 제 2 패턴 전극(132b)을 포함한다.  FIG. 2 is a front view of the metal pattern part 130 of FIG. 1. Referring to FIG. 2, the pattern electrode part 132 crosses the first pattern electrode 132a disposed in the first direction and the second pattern electrode 132b intersecting with the first pattern electrode 132a. It includes.
여기서 상기 제 1 방향 및 상기 제 2 방향은 예를 들면, 터치패널(100)의 정면을 기준으로 각각 X축 방향 및 Y축 방향일 수 있다. Here, the first direction and the second direction may be, for example, the X-axis direction and the Y-axis direction based on the front surface of the touch panel 100, respectively.
한편, 패턴 전극들의 방향은 이에 한정되지 아니하고 다른 방향도 가능하나, 이하에서는 설명의 편의를 위해서 터치패널(100)의 정면을 기준으로 상기 제 1 방향이 X축 방향이고, 상기 제 2 방향이 Y축 방향인 경우를 중심으로 설명하기로 한다. On the other hand, the direction of the pattern electrode is not limited to this, but other directions are possible, but for the convenience of description, the first direction is the X-axis direction and the second direction is Y based on the front of the touch panel 100. The case in the axial direction will be described below.
예를 들어, 제 1 패턴 전극(132a)는 서로 연결된 채로 X축으로 배치되고, 제 2 패턴 전극(132b)는 서로 연결되지 아니하고, 독립적으로 Y축으로 배치될 수 있다. 한편, 제 1 패턴 전극(132a) 및 제 2 패턴 전극(132b)의 형상은 한정되지 아니한다. 제 1 패턴 전극(132a) 및 제 2 패턴 전극(132b)는 서로 겹치지 않도록 배치되면 되고, 형상은 마름모, 정사각형, 직사각형, 원 또는 정형화되지 않은 모양(예를 들면, 덴드라이트(dendrite) 구조와 같이 나뭇가지들이 얽혀 있는 모양)등으로 다양하게 형성 가능하다.  For example, the first pattern electrodes 132a may be disposed on the X axis while being connected to each other, and the second pattern electrodes 132b may be disposed on the Y axis independently of each other. Meanwhile, the shapes of the first pattern electrode 132a and the second pattern electrode 132b are not limited. The first pattern electrode 132a and the second pattern electrode 132b may be disposed so as not to overlap each other, and the shape may be a rhombus, a square, a rectangle, a circle, or an unshaped shape (for example, a dendrite structure). Tree branches are entangled)
다만, 설명의 편의를 위하여 이하에서는 제 1 패턴 전극(132a) 및 제 2 패턴 전극(132b)이 마름모꼴로 형성된 경우를 중심으로 설명하기로 한다. 도 2에 도시된 바와 같이, 제 1 패턴 전극(132a) 및 제 2 패턴 전극(132b)는 마름모꼴로 서로 겹치지 않도록 배치된다. 이 경우, 제 1 패턴 전극(132a)는 배선전극부(134)와 연결된 상태이고, 제 2 패턴 전극(132b)는 배선전극부(134)와 연결되지 않은 상태가 된다. 제 2 패턴 전극(132b)와 배선전극부(134)의 연결에 대하여는 추후 상세히 설명하기로 한다.  However, for convenience of description, hereinafter, the first pattern electrode 132a and the second pattern electrode 132b will be described with reference to a case where a rhombus is formed. As shown in FIG. 2, the first pattern electrode 132a and the second pattern electrode 132b are disposed in a rhombus so as not to overlap each other. In this case, the first pattern electrode 132a is connected to the wiring electrode part 134, and the second pattern electrode 132b is not connected to the wiring electrode part 134. The connection between the second pattern electrode 132b and the wiring electrode unit 134 will be described in detail later.
패턴 전극부(132) 및 배선 전극부(134)는 서로 전기적으로 연결되며, 배선 전극부(134)는 사용자가 외부에서 물리적 접촉을 했을 때, 패턴 전극부(132)에서 발생한 전기적 신호를 제어부(미도시) 또는 연성회로기판(미도시)에 전달하는 역할을 수행한다. 상기 제어부 또는 상기 연성회로기판은 배선 전극부(132)와 별도의 접속부(미도시)를 통해 연결될 수 있다.  The pattern electrode part 132 and the wiring electrode part 134 are electrically connected to each other, and the wiring electrode part 134 controls an electrical signal generated from the pattern electrode part 132 when the user makes physical contact from the outside. It serves to deliver to the flexible circuit board (not shown) or not shown. The control unit or the flexible circuit board may be connected to the wiring electrode unit 132 through a separate connection unit (not shown).
금속패턴부(130)는 Ag, Al, Cr, Ni, Mo 중 어느 하나 또는 이들의 합금으로 제조될 수 있다. 금속패턴부(130)가 금속으로 제조됨으로써, 금속패턴부(130)에 구비되는 패턴 전극부(132)끼리 또는 패턴 전극부(132) 및 배선 전극부(134)간의 저항을 감소시키는 역할을 수행하며, 이는 터치패널(100)의 전도성 및 검출감도를 향상시킨다.  The metal pattern part 130 may be made of any one of Ag, Al, Cr, Ni, Mo, or an alloy thereof. Since the metal pattern part 130 is made of metal, it serves to reduce the resistance between the pattern electrode parts 132 provided in the metal pattern part 130 or between the pattern electrode part 132 and the wiring electrode part 134. This improves the conductivity and detection sensitivity of the touch panel 100.
또한, 패턴 전극부(132) 및 배선 전극부(134)가 동일한 금속 물질로 이루어지는 경우에는, 터치패널(100)의 제조공정을 보다 단순화 시킬 수 있다. In addition, when the pattern electrode part 132 and the wiring electrode part 134 are made of the same metal material, the manufacturing process of the touch panel 100 may be simplified.
패턴 전극부(132)는 세선(細線)들로 구성된 그물망(mesh) 형상으로 형성된다. 패턴 전극부(132)가 세선들로 구성된 그물망 형상으로 형성됨으로써, 종래 패턴 전극이 존재하는 영역에서 패터닝 자국이 보이던 현상을 감소시키는 효과를 구현할 수 있으며, 이는 터치패널(100)의 투과성을 향상시킨다.  The pattern electrode part 132 is formed in a mesh shape composed of fine wires. Since the pattern electrode part 132 is formed in a mesh shape formed of thin wires, the pattern electrode may be reduced in a region where the pattern electrode is present, thereby improving the transmittance of the touch panel 100. .
패턴 전극부(132)에서 상기 세선들은 선폭이 1 내지 20㎛일 수 있다. 선폭이 1㎛보다 좁을 때에는 터치패널(100)의 불량률이 증가할 수 있고, 선폭이 20㎛보다 넓을 때에는 터치패널(100)의 투과성 향상 효과가 다소 떨어질 수 있다.  In the pattern electrode unit 132, the thin lines may have a line width of about 1 μm to about 20 μm. When the line width is narrower than 1 μm, the defective rate of the touch panel 100 may increase, and when the line width is larger than 20 μm, the effect of improving the transmittance of the touch panel 100 may be slightly reduced.
또한, 패턴 전극부(132)에서 상기 세선들의 선들 사이의 간격은 200㎛ 이상일 수 있다. 선들 사이의 간격이 200㎛ 미만인 경우에는 터치패널(100)의 투과율이 목적한 것 보다 감소할 수 있다.  In addition, an interval between the lines of the thin lines in the pattern electrode part 132 may be 200 μm or more. When the distance between the lines is less than 200 μm, the transmittance of the touch panel 100 may be reduced than desired.
절연층(150)은 금속패턴부(130) 상부에 형성되어 제 2 패턴 전극(132b)를 전기적으로 연결시키는 브릿지 전극부(170)가 형성될 시에, 제 1 패턴 전극(132a) 및 제 2 패턴 전극(132b)를 상호 절연시키는 역할을 수행한다. 절연층(150)은 패턴 전극부(132) 및 배선 전극부(134) 상부에 형성될 수 있다.  The insulating layer 150 is formed on the metal pattern part 130 to form a bridge electrode part 170 that electrically connects the second pattern electrode 132b to the first pattern electrode 132a and the second. Insulate the pattern electrode 132b from each other. The insulating layer 150 may be formed on the pattern electrode part 132 and the wiring electrode part 134.
절연층(150)은 금속패턴부(130)를 형성할 때 사용되는 포토레지스트 조성물을 제거하지 않음으로써 형성 가능하다. 즉, 상기 포토레지스트 조성물이 절연층(150)을 구성하게 할 수 있다. The insulating layer 150 may be formed by not removing the photoresist composition used when forming the metal pattern portion 130. That is, the photoresist composition may make up the insulating layer 150.
또한, 절연층(150)은 포토 공정, 프린팅 공정이 가능한 폴리에틸렌 등의 유기물질로 형성될 수 있고, 세라믹 등의 절연물질로 형성될 수도 있다.  In addition, the insulating layer 150 may be formed of an organic material such as polyethylene, which may be a photo process or a printing process, or may be formed of an insulating material such as ceramic.
도 3은 도 1의 터치패널(100)의 정면도이다. 도 3을 참조하면, 브릿지 전극부(170)는 절연층(150) 상부에 형성되고, 패턴 전극부(132)의 제 2 패턴 전극(132b)를 전기적으로 연결시키도록 형성된다.  3 is a front view of the touch panel 100 of FIG. 1. Referring to FIG. 3, the bridge electrode part 170 is formed on the insulating layer 150 and is formed to electrically connect the second pattern electrode 132b of the pattern electrode part 132.
브릿지 전극부(170)는 제 2 패턴 전극(132b)를 전기적으로 연결시킴으로써, 사용자가 물리적 접촉을 할 때 발생하는 전기적 신호를 감지하고 이를 제 2 패턴 전극(132b)에서 인식하도록 연결해주는 역할을 수행한다.  The bridge electrode unit 170 electrically connects the second pattern electrode 132b to detect an electrical signal generated when the user makes a physical contact and connect the second pattern electrode 132b to recognize it. do.
브릿지 전극부(170)를 제 2 패턴 전극(132b)과 연결하는 방법으로는 예를 들어, 브릿지 전극부(170) 하부에 절연층(150)을 관통하도록 비아홀(via hole)을 형성하는 방법이 있다.  As a method of connecting the bridge electrode unit 170 to the second pattern electrode 132b, for example, a method of forming a via hole to penetrate the insulating layer 150 under the bridge electrode unit 170 may be used. have.
브릿지 전극부(170)는 Ag, Al, Cr, Ni, Mo 중 어느 하나 또는 이들의 합금으로 제조될 수 있다. 한편, 브릿지 전극부(170)의 위치, 크기 또는 형상 중 적어도 하나는 한정되지 아니한다. 예를 들면, 브릿지 전극부(190)는 막대 형상 또는 스트립 형상으로 제조될 수 있다. The bridge electrode unit 170 may be made of any one of Ag, Al, Cr, Ni, Mo, or an alloy thereof. On the other hand, at least one of the position, size or shape of the bridge electrode unit 170 is not limited. For example, the bridge electrode part 190 may be manufactured in a rod shape or a strip shape.
이하에서는, 터치패널(100)의 제조방법에 대하여 설명하기로 한다.  Hereinafter, a manufacturing method of the touch panel 100 will be described.
도 4는 본 발명의 일 실시예에 따라 금속패턴부(130)를 형성한 터치패널(100)의 단면도이고, 도 5는 도 4에서 절연층(150)을 형성한 터치패널(100)의 단면도이고, 도 6는 도 5에서 브릿지 전극부(170)를 형성한 터치패널(100)의 단면도이다. 도 4 내지 도 6은 도3의 Ⅳ-Ⅳ를 따라 절단한 단면을 나타낸다.  4 is a cross-sectional view of the touch panel 100 in which the metal pattern part 130 is formed, and FIG. 5 is a cross-sectional view of the touch panel 100 in which the insulating layer 150 is formed in FIG. 4. 6 is a cross-sectional view of the touch panel 100 in which the bridge electrode unit 170 is formed in FIG. 5. 4 to 6 are cross-sectional views taken along the line IV-IV of FIG. 3.
도 4 내지 도 6을 참조하면, 터치패널(100)을 제조하기 위해서 우선 유리 또는 강화 유리로 이루어지는 유리 기판(110) 상부에 세선(細線)들로 구성된 그물망 형상의 패턴 전극부와 상기 패턴 전극부와 연결되는 배선 전극부를 구비하는 금속패턴부(130)을 형성한다.  4 to 6, in order to manufacture the touch panel 100, first, a mesh-shaped pattern electrode part formed of fine wires on the glass substrate 110 made of glass or tempered glass and the pattern electrode part are formed. The metal pattern part 130 having the wiring electrode part connected to the metal is formed.
금속패턴부(130)를 형성하는 방법은 유리 기판(100) 상에 sputter system, E-Beam system 또는 Thermal system을 이용하여 금속 막을 형성한다. 이 때, 상기 과정을 생략하기 위해 프린팅 공정을 사용하는 것도 가능하다. 상기 금속 막은 Ag, Al, Cr, Ni, Mo 중 어느 하나 또는 이들의 합금으로 형성된다.  In the method of forming the metal pattern portion 130, a metal film is formed on the glass substrate 100 using a sputter system, an E-Beam system, or a thermal system. At this time, it is also possible to use a printing process to omit the above process. The metal film is formed of any one of Ag, Al, Cr, Ni, Mo, or an alloy thereof.
상기 금속 막을 형성한 다음에는 상기 금속 막 상부에 포토레지스트 조성물을 코팅하고, 노광 공정을 이용하여 패턴 전극부(132) 및 배선 전극부(134)를 형성한다. 상기 패턴 전극부 및 배선 전극부는 한번에 형성하는 것이 가능하다.  After forming the metal film, the photoresist composition is coated on the metal film, and the pattern electrode part 132 and the wiring electrode part 134 are formed using an exposure process. The pattern electrode portion and the wiring electrode portion can be formed at one time.
패턴 전극부(132)는 제 1 방향으로 배치되는 제 1 패턴 전극(132a)과 상기 제 1 패턴 전극(132a)과 교차하여 제 2 방향으로 배치되는 제 2 패턴 전극(132b)으로 구분하여 형성할 수 있다. 이 경우, 제 1 패턴 전극(132a)는 서로 연결된 채로 X축 방향으로 배치하여 형성하고, 제 2 패턴 전극(132b)는 서로 연결되지 아니하고, 독립적으로 Y축 방향으로 배치하여 형성할 수 있다. 한편, 제 1 패턴 전극(132a) 및 제 2 패턴 전극(132b)은 상기에서 설명한 바와 동일 또는 유사한 바, 상세한 설명은 생략하기로 한다(이상 도 4 참조). The pattern electrode part 132 may be formed by being divided into a first pattern electrode 132a disposed in a first direction and a second pattern electrode 132b disposed in a second direction crossing the first pattern electrode 132a. Can be. In this case, the first pattern electrodes 132a may be formed in the X-axis direction while being connected to each other, and the second pattern electrodes 132b may be formed in the Y-axis direction independently of each other. Meanwhile, the first pattern electrode 132a and the second pattern electrode 132b are the same as or similar to those described above, and thus a detailed description thereof will be omitted (see FIG. 4).
다음으로, 금속패턴부(130) 상부에 절연층(150)을 형성한다. 절연층(150)을 형성하는 방법은 포토 공정, 프린팅 공정이 가능한 폴리에틸렌 등의 유기물질 또는 세라믹 등의 절연물질을 sputter system, E-Beam system, Thermal system 또는 상압 코팅 시스템을 이용하여 코팅하는 방법을 사용할 수 있다.  Next, an insulating layer 150 is formed on the metal pattern part 130. The method of forming the insulating layer 150 may be a method of coating an organic material such as polyethylene or an insulating material such as ceramic, which is capable of a photo process or a printing process, using a sputter system, an E-Beam system, a thermal system, or an atmospheric pressure coating system. Can be used.
또한, 상기 금속 막 상부에 형성된 상기 포토레지스트 조성물을 제거하지 않음으로써 상기 포토레지스트 조성물 자체를 절연층(150)으로 사용하는 것도 가능하다(이상 도 5 참조).  In addition, the photoresist composition itself may be used as the insulating layer 150 by not removing the photoresist composition formed on the metal film (see FIG. 5).
다음으로, 절연층(150) 상부에 복수 개의 비아홀(175)를 형성한다. 이는 브릿지 전극(170)과 제 2 패턴 전극(132b)을 전기적으로 연결시키기 위한 것이며, 비아홀(175)은 필요에 따라 복수 개 형성하는 것이 가능하다. 비아홀(175)을 형성하는 방법으로 식각공정 등을 이용하여 비아홀(175)을 형성하고자 하는 부분의 절연층(150)을 제거하는 방법을 사용할 수 있다.  Next, a plurality of via holes 175 are formed on the insulating layer 150. This is for electrically connecting the bridge electrode 170 and the second pattern electrode 132b, and a plurality of via holes 175 may be formed as necessary. As a method of forming the via hole 175, a method of removing the insulating layer 150 in a portion where the via hole 175 is to be formed using an etching process or the like may be used.
다음으로, 비아홀(175) 위에 브릿지 전극부(170)를 대응 형성하여 브릿지 전극부(170)와 금속패턴부(130)의 제 2 패턴 전극(132b)들을 전기적으로 연결시킨다. 즉, 사용자가 브릿지 전극부(170)를 물리적으로 접촉하면 발생된 전기적 신호가 비아홀(175)을 통해 금속패턴부(130)로 전달되어 터치패널이 작동하게 된다.  Next, the bridge electrode part 170 is correspondingly formed on the via hole 175 to electrically connect the bridge electrode part 170 and the second pattern electrode 132b of the metal pattern part 130. That is, when the user physically contacts the bridge electrode unit 170, the generated electrical signal is transmitted to the metal pattern unit 130 through the via hole 175 to operate the touch panel.
브릿지 전극부(170)를 형성하는 방법은 Ag, Al, Cr, Ni, Mo 중 어느 하나 또는 이들의 합금으로 이루어진 금속 막을 코팅하고, 포토레지스트 공정을 통하여 형성할 수 있다(이상 도 6 참조).  The method of forming the bridge electrode unit 170 may be formed by coating a metal film made of any one of Ag, Al, Cr, Ni, Mo, or an alloy thereof and through a photoresist process (see FIG. 6 above).
상술한 바와 같이, 본 발명의 실시예들은 패턴 전극을 금속을 사용하여 그물망 형상으로 형성하여 패턴 전극들간 또는 패턴 전극들 및 배선 전극들간의 저항을 감소시킴으로써, 터치패널의 전도성 및 검출강도가 향상시킬 수 있다.  As described above, embodiments of the present invention form a pattern electrode in a mesh shape using metal to reduce the resistance between the pattern electrodes or between the pattern electrodes and the wiring electrodes, thereby improving the conductivity and detection strength of the touch panel. Can be.
또한, 패턴 전극을 그물망 형상으로 형성함으로써 터치패널의 투과성을 향상시킬 수 있고, ITO를 사용하지 않고 패턴 전극을 형성함으로써 제품의 가격 경쟁력을 향상시킬 수 있다.  In addition, by forming the pattern electrode in a mesh shape, the transmittance of the touch panel can be improved, and the price competitiveness of the product can be improved by forming the pattern electrode without using ITO.
또한, 패턴 전극 및 배선 전극을 동시에 형성 가능하므로, 작업 공정이 단순한 터치패널을 제조할 수 있다.  In addition, since the pattern electrode and the wiring electrode can be formed at the same time, a touch panel with a simple work process can be manufactured.
이상, 본 발명의 실시예들에 대하여 설명하였으나, 해당 기술 분야에서 통상의 지식을 가진 자라면 특허청구범위에 기재된 본 발명의 사상으로부터 벗어나지 않는 범위 내에서, 구성 요소의 부가, 변경, 삭제 또는 추가 등에 의해 본 발명을 다양하게 수정 및 변경시킬 수 있을 것이며, 이 또한 본 발명의 권리범위 내에 포함된다고 할 것이다.As described above, embodiments of the present invention have been described, but those skilled in the art may add, change, delete, or add elements within the scope not departing from the spirit of the present invention described in the claims. The present invention may be modified and changed in various ways, etc., which will also be included within the scope of the present invention.

Claims (10)

  1. 유리 기판(110);Glass substrate 110;
    상기 유리 기판(110) 상부에 형성되고, 제 1 방향으로 배치되는 제 1 패턴 전극(132a)과 상기 제 1 패턴 전극(132a)과 교차하여 제 2 방향으로 배치되는 제 2 패턴 전극(132b)으로 구성되어 그물망 형상(mesh)으로 형성된 패턴 전극부(132)와 상기 패턴 전극부(132)와 연결되는 배선 전극부(134)를 구비하는 금속패턴부(130);The first pattern electrode 132a formed on the glass substrate 110 and disposed in the first direction and the second pattern electrode 132b intersecting the first pattern electrode 132a and disposed in the second direction. A metal pattern part 130 having a pattern electrode part 132 formed in a mesh shape and a wiring electrode part 134 connected to the pattern electrode part 132;
    상기 금속패턴부(130) 상부에 형성되는 절연층(150); 및An insulating layer 150 formed on the metal pattern part 130; And
    상기 절연층(150) 상부에 형성되고, 상기 제 1 패턴 전극(132a) 또는 상기 제 2 패턴 전극(132b)을 전기적으로 연결시키는 브릿지 전극부(170)를 포함하는 터치패널.A touch panel formed on the insulating layer (150) and including a bridge electrode portion (170) for electrically connecting the first pattern electrode (132a) or the second pattern electrode (132b).
  2. 제 1 항에 있어서,The method of claim 1,
    상기 패턴 전극부(132)는 1 내지 20㎛의 선폭을 가지고, 선들 사이의 간격이 200㎛ 이상인 세선(細線)들로 형성된 그물망 형상인 터치패널.The pattern electrode unit 132 has a line width of 1 to 20 μm, and a mesh-shaped touch panel formed of fine lines having a spacing between lines of 200 μm or more.
  3. 제 1항에 있어서, The method of claim 1,
    상기 유리 기판(110) 및 상기 금속패턴부(130) 사이에 배치되는 것으로, 상기 유리 기판(110)의 유전율보다 높은 유전율을 갖는 제1 유전체 박막층을 더 포함하는 것을 특징으로 하는 터치패널. The touch panel, which is disposed between the glass substrate 110 and the metal pattern portion 130, further includes a first dielectric thin film layer having a dielectric constant higher than that of the glass substrate 110.
  4. 제 3항에 있어서, The method of claim 3, wherein
    상기 제1 유전체 박막층은 Al2O3, TiO3, Ta2O5, Y2O3 및 TiO2에서 선택되는 무기금속산화물 또는 PbZrxTi1-xO3(PZT), Bi4Ti3O12, BaMgF4, SrBi2(Ta1-xNbx)2O9, Ba(Zr1-xTix)O3(BZT), BaTiO3 및 SrTiO3에서 선택되는 강유전성 절연체로 제조되는 것을 특징으로 하는 터치패널.The first dielectric thin film layer is an inorganic metal oxide selected from Al 2 O 3 , TiO 3 , Ta 2 O 5 , Y 2 O 3, and TiO 2 , or PbZr x Ti 1-x O 3 (PZT), Bi 4 Ti 3 O 12 , BaMgF 4 , SrBi 2 (Ta 1-x Nb x ) 2 O 9 , Ba (Zr 1-x Ti x ) O 3 (BZT), BaTiO 3 and SrTiO 3 characterized in that it is made of a ferroelectric insulator Touch panel.
  5. 제 1항에 있어서, The method of claim 1,
    상기 절연층(150)은 공기의 유전율보다 높은 유전율을 가지는 물질로 제조되고, 상기 물질은 SiO2, SiN, Al2O3, MgF2, BN, Li2O 및 CuO에서 선택되는 것을 특징으로 하는 터치패널.The insulating layer 150 is made of a material having a dielectric constant higher than that of air, and the material is selected from SiO 2 , SiN, Al 2 O 3 , MgF 2 , BN, Li 2 O, and CuO. Touch panel.
  6. 제 1항 또는 제 3항에 있어서,The method according to claim 1 or 3,
    상기 금속패턴부(130) 및 상기 절연층(150) 사이에 배치되는 것으로, 공기의 유전율보다 높은 유전율을 갖는 제2 유전체 박막층을 더 포함하는 것을 특징으로 하는 터치패널. The touch panel, which is disposed between the metal pattern part 130 and the insulating layer 150, further includes a second dielectric thin film layer having a dielectric constant higher than that of air.
  7. 제 6항에 있어서, The method of claim 6,
    상기 제2 유전체 박막층은 SiO2, SiN, Al2O3, MgF2, BN, Li2O 및 CuO에서 선택되는 물질로 제조되는 것을 특징으로 하는 터치패널.The second dielectric thin film layer is made of a material selected from SiO 2 , SiN, Al 2 O 3 , MgF 2 , BN, Li 2 O and CuO.
  8. 제 6항에 있어서,The method of claim 6,
    상기 제1 유전체 박막층보다 상기 제2 유전체 박막층의 굴절율이 더 낮은 것을 특징으로 하는 터치패널. And a refractive index of the second dielectric thin film layer is lower than that of the first dielectric thin film layer.
  9. 터치패널의 제조방법에 있어서,In the manufacturing method of the touch panel,
    유리 기판 상부에 제 1 방향으로 배치되는 제 1 패턴 전극과 상기 제 1 패턴 전극과 교차하여 제 2 방향으로 배치되는 제 2 패턴 전극이 구비되어 그물망 형상으로 형성된 패턴 전극부와 상기 패턴 전극부와 연결되는 배선 전극부를 구비하는 금속패턴부를 형성하는 단계;A first pattern electrode disposed in a first direction on the glass substrate and a second pattern electrode disposed in a second direction crossing the first pattern electrode are provided to connect the pattern electrode portion formed in a mesh shape and the pattern electrode portion. Forming a metal pattern portion having a wiring electrode portion;
    상기 금속패턴부 상부에 포토레지스트 조성물을 도포하여 절연층을 형성하는 단계;Forming an insulating layer by applying a photoresist composition on the metal pattern portion;
    상기 절연층 상부에 복수 개의 비아홀(via hole)을 형성하는 단계; 및Forming a plurality of via holes on the insulating layer; And
    상기 비아홀 위에 브릿지 전극부를 대응 형성하여 상기 제 1 패턴 전극 또는 상기 제 2 패턴 전극을 전기적으로 연결시키는 단계를 포함하는 터치패널 제조방법. And forming a bridge electrode portion on the via hole to electrically connect the first pattern electrode or the second pattern electrode.
  10. 제 9 항에 있어서, The method of claim 9,
    상기 금속패턴부는 상기 패턴 전극부 및 상기 배선 전극부를 동시에 형성하는 터치패널 제조방법.And the metal pattern part simultaneously forming the pattern electrode part and the wiring electrode part.
PCT/KR2011/010155 2010-12-27 2011-12-27 Touch panel using a metal thin film, and method for manufacturing same WO2012091410A2 (en)

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