WO2012091316A3 - Laser processing apparatus - Google Patents

Laser processing apparatus Download PDF

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Publication number
WO2012091316A3
WO2012091316A3 PCT/KR2011/009451 KR2011009451W WO2012091316A3 WO 2012091316 A3 WO2012091316 A3 WO 2012091316A3 KR 2011009451 W KR2011009451 W KR 2011009451W WO 2012091316 A3 WO2012091316 A3 WO 2012091316A3
Authority
WO
WIPO (PCT)
Prior art keywords
laser beam
processing apparatus
laser processing
optical unit
laser
Prior art date
Application number
PCT/KR2011/009451
Other languages
French (fr)
Korean (ko)
Other versions
WO2012091316A2 (en
Inventor
유병소
Original Assignee
(주)큐엠씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)큐엠씨 filed Critical (주)큐엠씨
Publication of WO2012091316A2 publication Critical patent/WO2012091316A2/en
Publication of WO2012091316A3 publication Critical patent/WO2012091316A3/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/0944—Diffractive optical elements, e.g. gratings, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
    • G02B27/0938—Using specific optical elements
    • G02B27/095—Refractive optical elements
    • G02B27/0955—Lenses

Abstract

The present invention relates to a laser processing apparatus including: a laser beam source for generating a laser beam; and an optical unit for inducing the laser beam to an inside of an object, wherein the optical unit includes: a beam shaping module for correcting the divergence angle of the laser beam; a diffraction grating for diffracting the laser beam; and a focusing lens for forming a spot by focusing the laser beam to the inside of the object.
PCT/KR2011/009451 2010-12-28 2011-12-08 Laser processing apparatus WO2012091316A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020100136368A KR101298019B1 (en) 2010-12-28 2010-12-28 Laser processing apparatus
KR10-2010-0136368 2010-12-28

Publications (2)

Publication Number Publication Date
WO2012091316A2 WO2012091316A2 (en) 2012-07-05
WO2012091316A3 true WO2012091316A3 (en) 2012-09-07

Family

ID=46383620

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/009451 WO2012091316A2 (en) 2010-12-28 2011-12-08 Laser processing apparatus

Country Status (3)

Country Link
KR (1) KR101298019B1 (en)
TW (1) TWI466748B (en)
WO (1) WO2012091316A2 (en)

Families Citing this family (48)

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WO2014079478A1 (en) 2012-11-20 2014-05-30 Light In Light Srl High speed laser processing of transparent materials
EP2754524B1 (en) 2013-01-15 2015-11-25 Corning Laser Technologies GmbH Method of and apparatus for laser based processing of flat substrates being wafer or glass element using a laser beam line
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
US9291825B2 (en) 2013-03-22 2016-03-22 Applied Materials Israel, Ltd. Calibratable beam shaping system and method
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US20150165560A1 (en) 2013-12-17 2015-06-18 Corning Incorporated Laser processing of slots and holes
US9517963B2 (en) 2013-12-17 2016-12-13 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
CN103846547A (en) * 2014-02-12 2014-06-11 苏州兰叶光电科技有限公司 Multi-beam shaping laser processing system
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
CN107073642B (en) 2014-07-14 2020-07-28 康宁股份有限公司 System and method for processing transparent materials using laser beam focal lines with adjustable length and diameter
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
CN107073641B (en) 2014-07-14 2020-11-10 康宁股份有限公司 An interface block; system and method for cutting substrates transparent in the wavelength range using such an interface block
EP3536440A1 (en) 2014-07-14 2019-09-11 Corning Incorporated Glass article with a defect pattern
DE102014213775B4 (en) * 2014-07-15 2018-02-15 Innolas Solutions Gmbh Method and device for laser-based processing of flat, crystalline substrates, in particular of semiconductor substrates
CN104148802B (en) * 2014-08-04 2017-01-25 北京万恒镭特机电设备有限公司 Beam forming device and method
TWI576186B (en) * 2014-08-20 2017-04-01 Lever focusing module for laser processing
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
EP3245166B1 (en) 2015-01-12 2020-05-27 Corning Incorporated Laser cutting of thermally tempered substrates using the multi photon absorption method
HUE055461T2 (en) 2015-03-24 2021-11-29 Corning Inc Laser cutting and processing of display glass compositions
CN107666983B (en) 2015-03-27 2020-10-02 康宁股份有限公司 Venetian window and method for manufacturing the same
WO2017011296A1 (en) 2015-07-10 2017-01-19 Corning Incorporated Methods of continuous fabrication of holes in flexible substrate sheets and products relating to the same
KR101789185B1 (en) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 Laser processing method using an angle of inclination of laser beam
SG11201809797PA (en) 2016-05-06 2018-12-28 Corning Inc Laser cutting and removal of contoured shapes from transparent substrates
JP6632467B2 (en) * 2016-05-18 2020-01-22 株式会社ディスコ Laser processing apparatus and laser processing method
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
WO2018022476A1 (en) 2016-07-29 2018-02-01 Corning Incorporated Apparatuses and methods for laser processing
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
KR102078294B1 (en) 2016-09-30 2020-02-17 코닝 인코포레이티드 Apparatus and method for laser machining transparent workpieces using non-axisymmetric beam spots
KR102428350B1 (en) 2016-10-24 2022-08-02 코닝 인코포레이티드 Substrate processing station for laser-based machining of sheet-like glass substrates
US10752534B2 (en) 2016-11-01 2020-08-25 Corning Incorporated Apparatuses and methods for laser processing laminate workpiece stacks
CN106425112B (en) * 2016-11-02 2018-11-06 国神光电科技（上海）有限公司 A kind of method and system of laser scribing
KR102582652B1 (en) * 2016-12-21 2023-09-25 삼성디스플레이 주식회사 Laser polycrystallization apparatus
US10688599B2 (en) 2017-02-09 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
KR102636043B1 (en) 2019-01-21 2024-02-14 삼성디스플레이 주식회사 Laser etching apparatus and laser etching method using the same
JP2022014651A (en) * 2020-07-07 2022-01-20 住友重機械工業株式会社 Beam forming optical device and circularity adjustment method
CN113459678B (en) * 2021-07-28 2022-06-07 杭州爱新凯科技有限公司 Laser 3D printer edge light spot area compensation method
CN114152194B (en) * 2021-11-16 2022-10-04 华中科技大学 Micro-displacement measuring device and method based on reflection grating
CN114309923A (en) * 2021-12-17 2022-04-12 深圳市大族数控科技股份有限公司 Light beam interval adjusting module and processing equipment
KR102654348B1 (en) * 2022-04-07 2024-04-04 (주)이오테크닉스 Apparatus of forming groove and method for forming groove

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JP2002113711A (en) * 2000-10-11 2002-04-16 Murata Mfg Co Ltd Method for processing ceramic green sheet and apparatus for laser processing used in the method
KR20040110434A (en) * 2003-06-19 2004-12-31 엘지전자 주식회사 Apparatus for optical pick-up with blazed reflection grating
JP2005014050A (en) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd Laser beam machining device
KR100984726B1 (en) * 2010-04-28 2010-10-01 유병소 Method, apparatus, and system for processing workpiece using laser

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TW475334B (en) * 2000-07-14 2002-02-01 Light Opto Electronics Co Ltd High light-sensing efficiency image sensor apparatus and method of making the same
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002113711A (en) * 2000-10-11 2002-04-16 Murata Mfg Co Ltd Method for processing ceramic green sheet and apparatus for laser processing used in the method
KR20040110434A (en) * 2003-06-19 2004-12-31 엘지전자 주식회사 Apparatus for optical pick-up with blazed reflection grating
JP2005014050A (en) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd Laser beam machining device
KR100984726B1 (en) * 2010-04-28 2010-10-01 유병소 Method, apparatus, and system for processing workpiece using laser

Also Published As

Publication number Publication date
KR20120074508A (en) 2012-07-06
WO2012091316A2 (en) 2012-07-05
TW201228762A (en) 2012-07-16
KR101298019B1 (en) 2013-08-26
TWI466748B (en) 2015-01-01

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