WO2011142333A1 - Capacitive input device - Google Patents

Capacitive input device Download PDF

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Publication number
WO2011142333A1
WO2011142333A1 PCT/JP2011/060703 JP2011060703W WO2011142333A1 WO 2011142333 A1 WO2011142333 A1 WO 2011142333A1 JP 2011060703 W JP2011060703 W JP 2011060703W WO 2011142333 A1 WO2011142333 A1 WO 2011142333A1
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WO
WIPO (PCT)
Prior art keywords
electrode
operation surface
patterns
pattern
electrode pattern
Prior art date
Application number
PCT/JP2011/060703
Other languages
French (fr)
Japanese (ja)
Inventor
幸治 塚本
厚志 松田
潔 小林
Original Assignee
アルプス電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アルプス電気株式会社 filed Critical アルプス電気株式会社
Priority to CN201180023853.1A priority Critical patent/CN102893244B/en
Priority to KR1020127027376A priority patent/KR101451493B1/en
Priority to JP2012514796A priority patent/JP5390019B2/en
Publication of WO2011142333A1 publication Critical patent/WO2011142333A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Definitions

  • the present invention relates to an electrostatic capacitance type input device capable of detecting an input coordinate position, and more particularly to an input device in which an operation surface is formed in a curved surface shape.
  • FIG. 8 is a partial longitudinal sectional view schematically showing a conventional capacitance type input device
  • FIG. 9 is a partial plan view of a lower electrode pattern and an upper electrode pattern provided in a sensor portion of the conventional input device. .
  • the capacitive input device 1 includes a sensor unit 5 in which a plurality of lower electrode patterns 6 and a plurality of upper electrode patterns 7 shown in FIG. And a surface member 4 having an operation surface 4a on the surface.
  • the surface member 4 is provided on the upper surface side of the sensor unit 5, and the surface member 4 and the sensor unit 5 are joined via an adhesive layer 8.
  • the operation surface 4a of the surface member 4 is formed as a convex curved surface.
  • the sensor unit 5 is formed in a planar shape (flat plate shape). Therefore, the distance L1 in the height direction (Z) between the finger F and the sensor unit 5 when the finger F is brought into contact with the operation surface 4a varies depending on the contact position of the finger F on the operation surface 4a. Yes.
  • the finger F shown in FIG. 8 is in contact with the operation surface 4a at the position where the distance L1 is the largest.
  • a plurality of lower electrode patterns 6 and upper electrode patterns 7 are provided. As shown in FIG. 9, the plurality of lower electrode patterns 6 are arranged at intervals in the Y direction. Each lower electrode pattern 6 has a plurality of first electrode portions 6a connected in series in the X direction via connecting portions 6b thinner than the first electrode portions 6a. The electrode areas of the first electrode portions 6a are all the same size.
  • each upper electrode pattern 7 has a plurality of second electrode portions 7a connected in the Y direction via connecting portions 7b thinner than the second electrode portions 7a.
  • the electrode areas of the second electrode portions 7a are all the same size.
  • the first electrode portions 6a and the second electrode portions 7a are arranged so as not to overlap each other.
  • each lower electrode pattern 6 and each upper electrode pattern 7 are detection electrodes.
  • the second of the finger F and the first electrode portion 6a of the lower electrode pattern 6 close to the finger F and the second of the upper electrode pattern 7 close to the finger F and the finger F is obtained.
  • An electrostatic capacitance is generated between the electrode portion 7a.
  • the contact position of the finger F is detected from the lower electrode pattern 6 and the upper electrode pattern 7 in which the electrical characteristics change based on the capacitance change between when the finger F is brought into contact with the operation surface 4a and when it is not brought into contact. Can do.
  • the curved sensor portion 5 it is very difficult to form the curved sensor portion 5 appropriately and stably.
  • the portion 5 cannot be bent neatly (without wrinkles) into a curved shape. Or even if it uses the base material shape
  • the structure of the input device described in Patent Documents 1 to 3 is the conventional structure shown in FIG. Note that the input devices described in Patent Documents 2 and 3 constitute a resistance-type input device instead of an electrostatic capacitance type ([0002] column of Patent Document 2 and [0003] column of Patent Document 3).
  • the present invention is for solving the above conventional problems, and in particular, by adjusting the electrode area of each first electrode part and each second electrode part based on the distance from the operation surface to the sensor part, It is an object of the present invention to provide a capacitance type input device in which uniformity of sensor sensitivity over the entire operation surface is improved easily and appropriately.
  • the input device in the present invention is A plurality of lower electrode patterns formed with a space in the first direction out of a first direction and a second direction intersecting in a plane, and formed with a space in the second direction.
  • a plurality of upper electrode patterns spaced apart in the height direction, and a surface member disposed opposite to the sensor portion in the height direction and having an operation surface on the surface.
  • Each of the lower electrode patterns has a plurality of first electrode portions connected in series in the second direction via a connecting portion that is thinner than the first electrode portion
  • Each upper electrode pattern has a plurality of second electrode portions connected in series in the first direction via a connecting portion that is thinner than the second electrode portion
  • the first electrode part and the second electrode part are arranged so as not to overlap in plan view
  • the operation surface is curved so that a distance in a height direction between the operation body and the sensor unit when the operation body is brought into contact with the operation surface varies depending on a contact position of the operation body on the operation surface.
  • Each electrode area of the first electrode portion and the second electrode portion is formed so as to increase as the distance between the operation surface and the sensor portion increases.
  • the sensor portion can be formed in a planar shape (flat plate shape) by adjusting the electrode area of each electrode pattern as described above, so the sensor portion is formed in a curved surface shape as shown in FIG.
  • the sensor unit can be formed easily and appropriately. Therefore, it is possible to easily and stably manufacture an input device having excellent uniformity of sensor sensitivity over the entire operation surface.
  • the ratio of the electrode area in each first electrode part and the ratio of the electrode area in each second electrode part are preferably proportional to the ratio of the distance between each electrode part and the operation surface. . Thereby, uniform sensor sensitivity can be obtained more effectively.
  • the operation surface of the surface member can be preferably applied to a form in which a convex curved surface or a concave curved surface is formed toward at least one of the first direction and the second direction.
  • the input device of the present invention it is possible to improve the uniformity of sensor sensitivity over the entire operation surface as compared with the conventional case.
  • FIG. 2 is an exploded perspective view of a capacitance type input device (touch panel) 10 according to the present embodiment; It is a figure for demonstrating the surface member in this embodiment, a lower electrode pattern, and an upper electrode pattern, (a) is a partial top view of a surface member, and a surface member is taken along an AA line and a BB line. (B) is a partial plan view of the lower electrode pattern, (c) is a partial plan view of the upper electrode pattern, (d) is a lower electrode pattern of (b) and (c). A partial plan view in a state where the upper electrode pattern is overlaid, 2A and 2B are diagrams for explaining a surface member, a lower electrode pattern, and an upper electrode pattern in another embodiment different from FIG.
  • FIGS. 2A and 2B are diagrams for explaining the surface member, the lower electrode pattern, and the upper electrode pattern in an embodiment different from FIGS. 2 and 3 (a) is a partial plan view and partial sectional view, and FIGS. Partial plan view), FIGS. 2A to 2D are views for explaining a surface member, a lower electrode pattern, and an upper electrode pattern in an embodiment different from FIGS. 2 to 4 (a) is a partial plan view and partial sectional view, and FIGS. Partial plan view), FIG. 1 is a partial longitudinal sectional view when the input device of the present embodiment shown in FIG.
  • FIG. 1 is cut along the X1-X2 direction;
  • the fragmentary longitudinal cross-section of the input device of this embodiment using the surface member different from FIG. 6, A partial longitudinal sectional view schematically showing a conventional capacitance type input device, A partial plan view of a lower electrode pattern and an upper electrode pattern provided in a sensor unit of a conventional input device,
  • FIG. 9 is a partial longitudinal sectional view schematically showing a conventional capacitance type input device having a different form from FIG. 8.
  • FIG. 1 is an exploded perspective view of a capacitance-type input device (touch panel) 10 according to the present embodiment
  • FIG. 2 is a diagram for explaining a surface member, a lower electrode pattern, and an upper electrode pattern in the present embodiment.
  • A is a partial plan view of the surface member, and a partial cross-sectional view when the surface member is cut along the lines AA and BB.
  • B is a partial plan view of the lower electrode pattern.
  • (c) is a partial plan view of the upper electrode pattern, and (d) is a partial plan view of the state in which the lower electrode pattern of (b) and the upper electrode pattern of (c) are overlapped.
  • 3 to 5 show an embodiment different from that shown in FIG.
  • FIG. 6 is a partial longitudinal sectional view of the input device of this embodiment shown in FIG. 1 cut along the X1-X2 direction
  • FIG. 7 is a portion of the input device of this embodiment using a surface member different from FIG. It is a longitudinal cross-sectional view.
  • the input device 10 includes a lower substrate 22 having a plurality of lower electrode patterns formed on the surface of the base material, an adhesive layer 30, and an upper portion having a plurality of upper electrode patterns formed on the surface of the base material.
  • the substrate 21, the adhesive layer 31, and the surface member 20 having the operation surface 20a on the surface are laminated in this order.
  • Each lower electrode pattern and each upper electrode pattern are formed in a region facing the operation surface 20a in the height direction, and each electrode pattern is a wiring portion at the outer peripheral portion 12 of each substrate 21, 22 from the region facing the operation surface 20a. It is connected to the.
  • a flexible printed circuit board 23 is provided in the input device 10 of the present embodiment.
  • the tip of the flexible printed circuit board 23 (the connection side with the connection parts 15 and 17) is separated into a central part 23 a and both side end parts 23 b and 23 b.
  • a plurality of first connection portions (not shown) are formed in the central portion 23a of the flexible printed circuit board 23, and the central portion 23a is overlaid on the upper connection portion 15 so that each first connection portion and each upper connection portion is overlapped. 15 is electrically connected.
  • a plurality of second connection portions are formed on both side end portions 23b of the flexible printed circuit board 23, and both side end portions 23b, 23b are overlapped on the lower connection portion 17 of the input device 10, Each 2nd connection part and each lower connection part 17 are electrically connected.
  • each first connection part and each second connection part are electrically connected to a connector 35 installed on the surface of the flexible printed circuit board 23 via a wiring pattern (not shown).
  • the surface of the surface member 20 is an operation surface 20a by an operation body such as a finger F or a pen.
  • the decorative layer 24 is provided on the outer peripheral portion of the operation surface 20 a and on the lower surface of the surface member 20.
  • the operation surface 20a is a light-transmitting region, and the outer peripheral portion of the operation surface 20a on which the decoration layer 24 is formed is a non-light-transmitting region.
  • FIG. 6 is a partial longitudinal sectional view when the input device 1 shown in FIG. 1 is cut in the height direction along the X1-X2 direction.
  • the lower substrate 22 includes a planar lower base material 32 and a plurality of lower electrode patterns 14 formed on the surface of the lower base material 32.
  • the upper substrate 21 includes a planar upper base material 33 and a plurality of upper electrode patterns 13 formed on the surface of the upper base material 33.
  • the plurality of lower electrode patterns 14 and the plurality of upper electrode patterns 13 intersect in plan view.
  • Both the lower electrode pattern 14 and the upper electrode pattern 13 constitute a detection electrode.
  • the lower substrate 22 and the upper substrate 21 are bonded via an adhesive layer 30.
  • the lower substrate 22, the adhesive layer 30 and the upper substrate 21 constitute a sensor unit 25.
  • the configuration of the sensor unit 25 is not limited to the structure shown in FIG.
  • the structure etc. which formed the lower electrode pattern 14 and the upper electrode pattern 13 in the upper and lower surfaces of a planar base material may be sufficient.
  • the lower substrate 22 and the upper substrate 21 may be bonded with the upper electrode pattern 13 facing the adhesive layer 30 side.
  • the electrode patterns 13 and 14 are both formed on the surface of the substrate by sputtering or vapor deposition with a transparent conductive material such as ITO (IndiumInTin ⁇ Oxide).
  • the base materials 32 and 33 are formed of a film-like transparent base material such as polyethylene terephthalate (PET) or a glass base material.
  • PET polyethylene terephthalate
  • the lower substrate 22 and the upper substrate 21 are formed in a planar shape and are not formed into a three-dimensional shape as shown in FIG. 10, so that the base materials 32 and 33 include not only a soft film but also a planar glass or the like. Can be used.
  • the surface member 20 is bonded to the upper surface side of the sensor unit 25 via the adhesive layer 31.
  • the adhesive layers 30 and 31 are an acrylic adhesive, a double-sided adhesive tape, or the like.
  • the surface member 20 is not particularly limited in material, but is formed of glass, plastic or the like.
  • the surface member 20 shown in FIG. 6 is formed such that the operation surface 20a has a convex curved surface shape.
  • the surface shape of the surface member 20 shown in FIG. 1 is shown in FIG. 3A in order to make it easy to see that it is a curved surface in a perspective view.
  • FIG. 2 shows the shapes of the surface member 20, the lower electrode pattern, and the upper electrode pattern in the first embodiment.
  • FIG. 2A shows a partial plan view of the surface member 20 and a cross section taken along line AA and BB passing through the center O of the surface member 20. A part of the adhesive layer 31 under the surface member 20 as well as the surface member 20 is shown in the AA line cross section and the BB line cross section.
  • the operation surface (surface) 20a of the surface member 20 is formed with a convex curved surface in the Y1-Y2 direction (first direction) and the X1-X2 direction (second direction).
  • the operation surface 20a in this embodiment has a 3D shape in which the center O protrudes most upward and is gradually curved downward as the distance from the center O increases.
  • FIG. 2B is a partial plan view of the lower electrode pattern 14. As shown in FIG. 2B, a plurality of lower electrode patterns 14a to 14d are formed.
  • each lower electrode pattern and each upper electrode pattern is denoted by “reference numerals 14 a, 14 b... 13b, ... ".
  • the lower electrode patterns 14a to 14d are arranged with a space in the Y1-Y2 direction and are formed to extend in the X1-X2 direction, respectively.
  • Each of the lower electrode patterns 14a to 14d has a configuration in which a plurality of first electrode portions 40a to 40p are connected in the X1-X2 direction via a connecting portion 41 that is narrower than the first electrode portions 40a to 40p.
  • the shape of the first electrode portions 40a to 40p is not limited to the approximately rhombus shape shown in FIG. 2B, but an approximately rhombus shape may be used to make it difficult to see the electrode shape from the operation surface 20a. The same applies to the second electrode section described later.
  • FIG. 2B the connecting portion 41 is shown only at one location of each of the lower electrode patterns 14a to 14d.
  • FIG. 2B also shows the center O of the operation surface 20a of the surface member 20 in plan view.
  • the lower electrode patterns 14a and 14b and the lower electrode patterns 14c and 14d are formed point-symmetrically with respect to the center O. That is, the lower electrode pattern 14a and the lower electrode pattern 14d are formed in the same shape, and the lower electrode pattern 14b and the lower electrode pattern 14c are formed in the same shape.
  • the pattern shapes of the lower electrode patterns 14a to 14d will be described in more detail.
  • the first electrode portions 40f, 40g, 40j, and 40k that are equidistant from the center O of the lower electrode patterns 14b and 14c are each formed with the largest electrode area.
  • the remaining first electrode portions 40e, 40h, 40i, 40l of the lower electrode patterns 14b, 14c are formed with an electrode area smaller than the first electrode portions 40f, 40g, 40j, 40k.
  • the first electrode portions 40b, 40c, 40n, and 40o that are equidistant from the center O are more distant from the center O than the first electrode portions 40e, 40h, 40i, and 40l.
  • the electrode areas of the first electrode portions 40b, 40c, 40n, and 40o are smaller than those of the first electrode portions 40e, 40h, 40i, and 40l.
  • the remaining first electrode portions 40a, 40d, 40m, and 40p of the lower electrode patterns 14a and 14d are located farthest from the center O among all the first electrode portions shown in FIG.
  • the electrode area of one electrode part 40a, 40d, 40m, 40p is formed the smallest.
  • FIG. 2C is a partial plan view of the upper electrode pattern 13. As shown in FIG. 2C, a plurality of upper electrode patterns 13a to 13c are formed. As shown in FIG. 2C, each of the upper electrode patterns 13a to 13c is arranged with an interval in the X1-X2 direction, and is formed to extend in the Y1-Y2 direction.
  • Each of the upper electrode patterns 13a to 13c has a configuration in which a plurality of second electrode portions 42a to 42o are connected in the X1-X2 direction via a connecting portion 43 that is narrower than the second electrode portions 42a to 42o.
  • the connecting portion 43 is shown only at one location of each of the upper electrode patterns 13a to 13d.
  • FIG. 2C also shows the center O of the operation surface 20a of the surface member 20 in plan view.
  • the upper electrode pattern 13a and the upper electrode pattern 13c are formed symmetrically with respect to the center O and have the same shape.
  • the pattern shapes of the upper electrode patterns 13a to 13c will be described in more detail.
  • the second electrode portion 42h located at the center O of the upper electrode pattern 13b is formed with the largest electrode area.
  • the electrode areas of the second electrode portions 42g and 42i constituting the upper electrode pattern 13b are smaller than the second electrode portion 42h, but are formed larger than the second electrode portions 42f and 42j, and the second electrode portions 42f and 42j are smaller. It is formed.
  • the second electrode portions 42c and 42m close to the center O are formed larger, but are formed smaller than the second electrode portion 42h.
  • the electrode areas of the second electrode portions 42b, 42d, 42l and 42n constituting the upper electrode patterns 13a and 13c are smaller than the second electrode portions 42c and 42m, but larger than the second electrode portions 42a, 42e, 42k and 42o.
  • the second electrode portions 42a, 42e, 42k, 42o are formed to be the smallest.
  • the second electrode portions 42a, 42e, 42k, 42o are formed smaller than the second electrode portions 42f, 42j.
  • FIG. 2D is a partial plan view in which the plurality of lower electrode patterns 14a to 14d shown in FIG. 2B and the plurality of upper electrode patterns 13a to 13c shown in FIG. .
  • an adhesive layer 30 and a base material 33 are interposed between the lower electrode patterns 14a to 14d and the upper electrode patterns 13a to 13c, and the lower electrode patterns 14a to 14d and the upper electrode patterns 13a to 13c are interposed.
  • the first electrode portions 40a to 40p constituting the lower electrode patterns 14a to 14d and the second electrode portions 42a to 42o constituting the upper electrode patterns 13a to 13c are in plan view. Are arranged so that they do not overlap.
  • FIG. 6 is a cross-sectional view cut at the center position of the second electrode portion.
  • the portion visible as the upper electrode pattern 13 is “second electrode portion 42” (in FIG. 2, reference numerals 42a to 42o are attached). Here, it is denoted by reference numeral 42 for convenience.
  • FIG. 6 when the second electrode portion 42 is cut along the center in the X1-X2 direction, the lower electrode pattern 14 does not appear on the cut surface, but in FIG. Is a lower electrode pattern 14 having a first electrode portion 40 (here also denoted by reference numeral 40 for convenience) existing on the rear side or the near side which cannot be seen.
  • a distance L ⁇ b> 3 with the first electrode part 40 close to the finger F and a distance L ⁇ b> 2 with the second electrode part 42 are shown.
  • the distances L2 and L3 between the finger F and each electrode pattern differ depending on the contact position of the finger F on the operation surface 20a, but the size of the capacitance is inversely proportional to the distance and the area. Since it is proportional, when the finger F is brought into contact with a different position on the operation surface 20a by increasing the electrode area as the distances L2 and L3 between the operation surface 20a and the sensor unit 25 are larger as in this embodiment. The variation of the capacitance change can be suppressed as compared with the conventional case, and the uniformity of the sensor sensitivity over the entire operation surface 20a can be improved.
  • the input device 10 in which the operation surface 20a is formed in a curved shape can be appropriately and easily manufactured as compared with the conventional case. It is possible to effectively improve the uniformity of sensor sensitivity throughout 20a.
  • each lower electrode pattern and each upper electrode pattern are detection electrodes, and each of the lower electrode pattern and each upper electrode pattern is separately provided in the X1-X2 direction or the Y1-Y2 direction of the finger F.
  • the electrode area between each lower electrode pattern and each upper electrode pattern, and the first electrode portions 40a to 40p or the second electrode portions 42a to 42o may be adjusted with respect to the distances L2 and L3, respectively.
  • the first electrode portion and the second electrode portion which are adjacent to each other in plan view are formed so as to have substantially the same size, so that the first electrode portion and the second electrode portion having different sizes can be arranged on the XY plane. This is preferable because it can be arranged appropriately and it is difficult to see through the shape of each electrode portion from the operation surface 20a.
  • FIG. 3 shows the shapes of the surface member 20, the lower electrode pattern, and the upper electrode pattern in the second embodiment.
  • FIG. 3A shows a partial plan view of the surface member 20 and a cross section taken along line AA and BB passing through the center O of the surface member 20. A part of the adhesive layer 31 under the surface member 20 as well as the surface member 20 is shown in the AA line cross section and the BB line cross section.
  • the operation surface (surface) 20a of the surface member 20 is formed as a convex curved surface in the X1-X2 direction and linearly formed in the Y1-Y2 direction.
  • the line in the Y1-Y2 direction passing through the center O of the operation surface 20a protrudes most upward, and gradually moves downward as it moves away from the line in the Y1-Y2 direction passing through the center O in the X1-X2 direction. It is formed in a curved shape.
  • FIG. 3B is a partial plan view of the lower electrode pattern 14. All the lower electrode patterns 14e to 14h shown in FIG. 3B are formed in the same shape.
  • the electrode areas of the first electrode portions 44b, 44c, 44f, 44g, 44j, 44k, 44n, and 44o that are close to the line in the Y1-Y2 direction passing through the center O of the operation surface 20a are Y1-passing through the center O of the operation surface 20a. It is formed larger than the first electrode portions 44a, 44d, 44e, 44h, 44i, 44l, 44m, and 44p far from the line in the Y2 direction.
  • FIG. 3C is a partial plan view of the upper electrode pattern 13. As shown in FIG. 3C, a plurality of upper electrode patterns 13d to 13f are formed. As shown in FIG. 3C, each of the upper electrode patterns 13d to 13f is arranged with an interval in the X1-X2 direction and is formed to extend in the Y1-Y2 direction. In plan view, the electrode area of the second electrode portions 45f, 45g, 45h, 45i, and 45j of the upper electrode pattern 13f located on the line in the Y1-Y2 direction passing through the center O of the operation surface 20a is the center of the operation surface 20a.
  • FIG. 3D is a partial plan view in which the plurality of lower electrode patterns 14e to 14h shown in FIG. 3B and the plurality of upper electrode patterns 13d to 13f shown in FIG. . As shown in FIG. 3D, the first electrode portions 44a to 44p and the second electrode portions 45a to 45o are arranged so as not to overlap each other in plan view.
  • the electrode area of each electrode portion can be set between the operation surface 20a and the sensor portion 25.
  • the distance can be increased as the distances L2 and L3 in the height direction (Z) are increased.
  • FIG. 4 shows the shapes of the surface member 20, the lower electrode pattern, and the upper electrode pattern in the third embodiment.
  • FIG. 4 (a) shows a partial plan view of the surface member 20, and a cross section taken along the line AA and a line BB passing through the center O of the operation surface 20a of the surface member 20.
  • FIG. A part of the adhesive layer 31 under the surface member 20 as well as the surface member 20 is shown in the AA line cross section and the BB line cross section.
  • the operation surface (surface) 20a of the surface member 20 is formed as a concave curved surface in the Y1-Y2 direction (first direction) and the X1-X2 direction (second direction).
  • the In this embodiment, the center O of the operation surface 20a is recessed most downward, and is formed in a 3D shape that gradually curves upward as the distance from the center O increases.
  • FIG. 4B is a partial plan view of the lower electrode pattern 14. As shown in FIG. 4B, a plurality of lower electrode patterns 14i to 14l are formed. As shown in FIG. 4B, the lower electrode patterns 14i to 14l are arranged with an interval in the Y1-Y2 direction and are formed to extend in the X1-X2 direction, respectively.
  • Each of the lower electrode patterns 14i to 14l has a configuration in which a plurality of first electrode portions 46a to 46p are connected in the X1-X2 direction via a connecting portion 41 that is narrower than the first electrode portions 46a to 46p.
  • the connecting portion 41 is shown only at one location of each of the lower electrode patterns 14i to 14l.
  • FIG. 4B also shows the center O of the operation surface 20a of the surface member 20 in plan view.
  • the lower electrode patterns 14i and 14j and the lower electrode patterns 14k and 14l are formed point-symmetrically with respect to the center O. That is, the lower electrode pattern 14i and the lower electrode pattern 141 are formed in the same shape, and the lower electrode pattern 14j and the lower electrode pattern 14k are formed in the same shape.
  • the pattern shapes of the lower electrode patterns 14i to 14l will be described in more detail.
  • the first electrode portions 46f, 46g, 46j, and 46k that are equidistant from the center O of the lower electrode patterns 14j and 14k are all formed with the smallest electrode area.
  • the remaining first electrode portions 46e, 46h, 46i, 46l of the lower electrode patterns 14j, 14k are formed with a larger electrode area than the first electrode portions 46f, 46g, 46j, 46k.
  • the first electrode portions 46b, 46c, 46n, and 46o that are equidistant from the center O are formed with a smaller electrode area than the first electrode portions 46a, 46d, 46m, and 46p. .
  • FIG. 4C is a partial plan view of the upper electrode pattern 13. As shown in FIG. 4C, a plurality of upper electrode patterns 13h to 13j are formed. As shown in FIG. 4C, each of the upper electrode patterns 13h to 13j is arranged with an interval in the X1-X2 direction and is formed to extend in the Y1-Y2 direction.
  • Each of the upper electrode patterns 13h to 13j has a configuration in which a plurality of second electrode portions 47a to 47o are connected in the X1-X2 direction via a connecting portion 43 that is narrower than the second electrode portions 47a to 47o.
  • the connecting portion 43 is shown only at one location of each of the upper electrode patterns 13h to 13j.
  • FIG. 4C also shows the center O of the operation surface 20a of the surface member 20 in plan view.
  • the upper electrode pattern 13h and the upper electrode pattern 13j are formed symmetrically with respect to the center O and have the same shape.
  • the pattern shapes of the upper electrode patterns 13h to 13j will be described in more detail.
  • the second electrode portion 47h located at the center O of the upper electrode pattern 13i is formed with the smallest electrode area.
  • the electrode areas of the other second electrode portions 47g and 47i constituting the upper electrode pattern 13i are larger than the second electrode portion 47h, but smaller than the second electrode portions 47f and 47j, and the second electrode portions 47f and 47j are formed. Formed larger.
  • the second electrode portions 47c and 47m close to the center O are formed smaller, but larger than the second electrode portion 47h.
  • the electrode areas of the remaining second electrode portions 42b, 42d, 42l, and 42n constituting the upper electrode patterns 13h and 13j are larger than the second electrode portions 42c and 42m, but smaller than the second electrode portions 47a, 47e, 47k, and 47o.
  • the second electrode portions 47a, 47e, 47k, and 47o are formed to be the largest.
  • FIG. 4D is a partial plan view in which the plurality of lower electrode patterns 14i to 141 shown in FIG. 4B and the plurality of upper electrode patterns 13h to 13j shown in FIG. .
  • the first electrode portions 46a to 46p constituting the lower electrode patterns 14i to 14l and the second electrode portions 47a to 47o constituting the upper electrode patterns 13h to 13j are in plan view. Are arranged so that they do not overlap. Then, as shown in FIGS. 4B and 4C, by forming the electrode patterns 14i to 14l and 13h to 13j, the electrode areas of the electrode portions 46a to 46p and 47a to 47o The larger the distance in the height direction (Z) between 20a and the sensor unit 25, the larger the distance.
  • FIG. 5 shows the shapes of the surface member 20, the lower electrode pattern, and the upper electrode pattern in the fourth embodiment.
  • FIG. 5A shows a partial plan view of the surface member 20 and a cross section taken along line AA and BB passing through the center O of the surface member 20. A part of the adhesive layer 31 under the surface member 20 as well as the surface member 20 is shown in the AA line cross section and the BB line cross section.
  • the operation surface (surface) 20a of the surface member 20 is formed as a concave curved surface in the X1-X2 direction and linearly formed in the Y1-Y2 direction.
  • the line in the Y1-Y2 direction passing through the center O of the operation surface 20a is recessed most downward, and gradually increases upward from the line in the Y1-Y2 direction passing through the center O in the X1-X2 direction. It is formed in a curved shape.
  • FIG. 5B is a partial plan view of the lower electrode pattern 14.
  • the lower electrode patterns 14m to 14p shown in FIG. 5B are all formed in the same shape.
  • the electrode areas of the first electrode portions 48b, 48c, 48f, 48g, 48j, 48k, 48n, and 48o close to the line in the Y1-Y2 direction passing through the center O of the operation surface 20a are Y1-passing through the center O of the operation surface 20a. It is formed smaller than the first electrode portions 48a, 48d, 48e, 48h, 48i, 48l, 48m, 48p far from the line in the Y2 direction.
  • FIG. 5C is a partial plan view of the upper electrode pattern 13.
  • a plurality of upper electrode patterns 13k to 13m are formed.
  • each of the upper electrode patterns 13k to 13m is arranged with an interval in the X1-X2 direction and is formed to extend in the Y1-Y2 direction.
  • the electrode areas of the second electrode portions 49f, 49g, 49h, 49i, and 49j of the upper electrode pattern 13l located on the line in the Y1-Y2 direction passing through the center O of the operation surface 20a are Y1-passed through the center O of the operation surface 20a. It is formed smaller than the electrode area of the second electrode portions 49a, 49b, 49c, 49d, 49e, 49k, 49l, 49m, 49n, 49o of the upper electrode patterns 13k, 13m separated from the line in the Y2 direction.
  • FIG. 5D is a partial plan view in which the plurality of lower electrode patterns 14n to 14p shown in FIG. 5B and the plurality of upper electrode patterns 13k to 13m shown in FIG. .
  • the first electrode portions 48a to 48p and the second electrode portions 49a to 49o are arranged so as not to overlap each other in plan view.
  • the electrode areas of the first electrode portions 48a to 48p of the lower electrode patterns 14m to 14p and the second electrode portions 49a to 49o of the upper electrode patterns 13k to 13m are as follows.
  • the distance between the operation surface 20a and the sensor unit 25 in the height direction (Z) increases as the distance increases.
  • each lower electrode increases as the distance in the height direction between the operation surface 20a and the sensor unit 25 increases.
  • the electrode area of each first electrode portion of the pattern 13 and the electrode area of each second electrode portion of each upper electrode pattern are respectively increased, and thereby the sensor sensitivity in the entire operation surface 20a is compared with the conventional case. It can be made uniform.
  • the ratio of the electrode area in each first electrode part and the ratio of the electrode area in each second electrode part are each proportional to the ratio of the distance between each electrode part and the operation surface. It is preferable to adjust the electrode area of the part.
  • the magnitude of the capacitance is inversely proportional to the distance and proportional to the area. Therefore, for example, if the distance is doubled, the uniformity of sensor sensitivity in the entire operation surface 20a can be more effectively improved by adjusting the area of each electrode so that the area is doubled.
  • the surface member 20 is formed not only on the operation surface 20a but also on the back surface 20b facing the operation surface 20a in a curved shape following the shape of the operation surface 20a, as shown in FIG. Further, the back surface 20b may be formed as a flat surface.

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Abstract

Disclosed is a capacitive input device which can easily and appropriately improve the uniformity of sensor sensitivity in a whole operation panel by regulating the electrode surface of first electrode units and second electrode units on the basis of the distance between an operation surface and a sensor unit. The capacitive input device comprises: a sensor unit in which a plurality of lower electrode patterns and a plurality of upper electrode patterns are arranged so as to leave gaps therebetween in the height direction; and a surface member which is arranged so as to face the sensor unit in the height direction, and which has an operation surface on the surface thereof. In each lower electrode pattern, a plurality of first electrode sections are contiguously provided via thin connection sections. In each upper electrode pattern, a plurality of second electrode sections are contiguously provided via thin connection sections. The first electrode sections and second electrode sections are arranged so as no to overlap in planar view. The operation surface is formed having a curved surface. The electrode surfaces of the first electrode sections and the second electrode sections are formed so as to be larger as the distance between the operation surface and the sensor unit is larger.

Description

静電容量式の入力装置Capacitive input device
 本発明は、入力座標位置を検出可能な静電容量式の入力装置に係り、特に、操作面が曲面状で形成されてなる入力装置に関する。 The present invention relates to an electrostatic capacitance type input device capable of detecting an input coordinate position, and more particularly to an input device in which an operation surface is formed in a curved surface shape.
 図8は従来における静電容量式の入力装置を模式的に示した部分縦断面図、図9は、従来における入力装置のセンサ部に設けられる下部電極パターンと上部電極パターンの部分平面図である。 FIG. 8 is a partial longitudinal sectional view schematically showing a conventional capacitance type input device, and FIG. 9 is a partial plan view of a lower electrode pattern and an upper electrode pattern provided in a sensor portion of the conventional input device. .
 図8に示すように静電容量式の入力装置1は、図9に示す複数本の下部電極パターン6と複数本の上部電極パターン7とが高さ方向に対向して配置されたセンサ部5と、表面に操作面4aを備える表面部材4とを備えて構成される。 As shown in FIG. 8, the capacitive input device 1 includes a sensor unit 5 in which a plurality of lower electrode patterns 6 and a plurality of upper electrode patterns 7 shown in FIG. And a surface member 4 having an operation surface 4a on the surface.
 図8に示すように表面部材4はセンサ部5の上面側に設けられ、表面部材4とセンサ部5間が粘着層8を介して接合されている。 As shown in FIG. 8, the surface member 4 is provided on the upper surface side of the sensor unit 5, and the surface member 4 and the sensor unit 5 are joined via an adhesive layer 8.
 図8に示す形態では、例えば、表面部材4の操作面4aが凸曲面で形成されている。一方、センサ部5は平面状(平板状)で形成されている。このため指Fを操作面4a上に接触させたときの指Fとセンサ部5間の高さ方向(Z)への距離L1は、前記指Fの操作面4a上での接触位置により異なっている。図8に示す指Fは、距離L1が最も大きくなる位置の操作面4a上に接触している。 In the form shown in FIG. 8, for example, the operation surface 4a of the surface member 4 is formed as a convex curved surface. On the other hand, the sensor unit 5 is formed in a planar shape (flat plate shape). Therefore, the distance L1 in the height direction (Z) between the finger F and the sensor unit 5 when the finger F is brought into contact with the operation surface 4a varies depending on the contact position of the finger F on the operation surface 4a. Yes. The finger F shown in FIG. 8 is in contact with the operation surface 4a at the position where the distance L1 is the largest.
 図9に示すように下部電極パターン6及び上部電極パターン7は夫々、複数本、設けられる。図9に示すように複数本の下部電極パターン6は、Y方向に間隔を空けて配置されている。また各下部電極パターン6は夫々、複数の第1電極部6aがX方向に第1電極部6aよりも細い連結部6bを介して連設されている。各第1電極部6aの電極面積は全て同じ大きさである。 As shown in FIG. 9, a plurality of lower electrode patterns 6 and upper electrode patterns 7 are provided. As shown in FIG. 9, the plurality of lower electrode patterns 6 are arranged at intervals in the Y direction. Each lower electrode pattern 6 has a plurality of first electrode portions 6a connected in series in the X direction via connecting portions 6b thinner than the first electrode portions 6a. The electrode areas of the first electrode portions 6a are all the same size.
 また図9に示すように複数本の上部電極パターン7は、X方向に間隔を空けて配置される。また各上部電極パターン7は夫々、複数の第2電極部7aがY方向に第2電極部7aよりも細い連結部7bを介して連設されている。各第2電極部7aの電極面積は全て同じ大きさである。 Further, as shown in FIG. 9, the plurality of upper electrode patterns 7 are arranged at intervals in the X direction. Each upper electrode pattern 7 has a plurality of second electrode portions 7a connected in the Y direction via connecting portions 7b thinner than the second electrode portions 7a. The electrode areas of the second electrode portions 7a are all the same size.
 図9に示すように、各第1電極部6aと各第2電極部7aは互いに重ならないように配置されている。 As shown in FIG. 9, the first electrode portions 6a and the second electrode portions 7a are arranged so as not to overlap each other.
 図8に示す入力装置1では、各下部電極パターン6及び各上部電極パターン7はいずれも検出電極である。指Fを操作面4a上に接触させると、指Fと、指Fに近い下部電極パターン6の第1電極部6aとの間、及び指Fと、指Fに近い上部電極パターン7の第2電極部7aとの間に静電容量が生じる。そして、指Fを操作面4a上に接触させたときと接触させないときとの容量変化に基づく電気特性変化が生じた下部電極パターン6及び上部電極パターン7から、指Fの接触位置を検出することができる。 In the input device 1 shown in FIG. 8, each lower electrode pattern 6 and each upper electrode pattern 7 are detection electrodes. When the finger F is brought into contact with the operation surface 4a, the second of the finger F and the first electrode portion 6a of the lower electrode pattern 6 close to the finger F and the second of the upper electrode pattern 7 close to the finger F and the finger F is obtained. An electrostatic capacitance is generated between the electrode portion 7a. Then, the contact position of the finger F is detected from the lower electrode pattern 6 and the upper electrode pattern 7 in which the electrical characteristics change based on the capacitance change between when the finger F is brought into contact with the operation surface 4a and when it is not brought into contact. Can do.
 しかしながら、図8に示すように、指Fを曲面の操作面4a上に接触させたとき、指Fの操作面4a上での接触位置により指Fとセンサ部5間の距離L1が異なるが、各電極部6a,7aの電極面積は同じ大きさであるため、指Fを操作面4a上に当接させたときに生じる容量変化が指Fの接触位置によりばらつき、均一なセンサ感度を得ることができない問題があった。 However, as shown in FIG. 8, when the finger F is brought into contact with the curved operation surface 4a, the distance L1 between the finger F and the sensor unit 5 varies depending on the contact position of the finger F on the operation surface 4a. Since the electrode areas of the electrode portions 6a and 7a are the same size, the capacitance change that occurs when the finger F is brought into contact with the operation surface 4a varies depending on the contact position of the finger F, and uniform sensor sensitivity is obtained. There was a problem that could not be.
 上記したセンサ感度のばらつきを抑制すべく、図10に示すように、表面部材4の操作面4aの曲面形状に倣ってセンサ部5も曲面状に形成する構成が考えられる。これにより図8に示す従来の構造に比べて操作面4a全体でのセンサ感度を均一化しやすいと考えられた。 In order to suppress the above-described variation in sensor sensitivity, a configuration in which the sensor unit 5 is also formed in a curved shape following the curved shape of the operation surface 4a of the surface member 4 as shown in FIG. Accordingly, it was considered that the sensor sensitivity on the entire operation surface 4a can be easily equalized as compared with the conventional structure shown in FIG.
 しかしながら図10に示すように、曲面状のセンサ部5を適切且つ安定して形成することは非常に難しい。表面部材4の操作面4aが平面内にて直交する2方向のどちらに対しても曲面状で形成される3D形状の場合や曲率によっては、図8に示すように平面形態で形成されたセンサ部5をきれいに(皺なく)曲面形状に折り曲げることができない。あるいは最初から曲面状に成形された基材を用いても、その基材の表面に電極パターンを所定幅にてパターン形成することが困難である。 However, as shown in FIG. 10, it is very difficult to form the curved sensor portion 5 appropriately and stably. A sensor formed in a planar form as shown in FIG. 8 depending on the case or the curvature of the 3D shape in which the operation surface 4a of the surface member 4 is formed in a curved surface shape in both directions orthogonal to each other in the plane. The portion 5 cannot be bent neatly (without wrinkles) into a curved shape. Or even if it uses the base material shape | molded by the curved surface from the beginning, it is difficult to pattern-form an electrode pattern by the predetermined width on the surface of the base material.
 したがって図10に示すように表面部材4とともにセンサ部5も曲面状にする形態では、簡単且つ安定して、均一なセンサ感度を有する入力装置を製造することができなかった。 Therefore, as shown in FIG. 10, in the form in which the sensor unit 5 is curved as well as the surface member 4, an input device having a uniform sensor sensitivity could not be manufactured easily and stably.
特開2003-91360号公報JP 2003-91360 A 特開2008-47026号公報JP 2008-47026 A 特開2004-252676号公報JP 2004-252676 A 特開2010-20443号公報JP 2010-20443 A 特開2008-97283号公報JP 2008-97283 A
 特許文献1~3に記載された入力装置の構造は、図10に示す従来構造である。なお特許文献2,3に記載された入力装置は静電容量式でなく抵抗式の入力装置を構成する(特許文献2の[0002]欄、特許文献3の[0003]欄)。 The structure of the input device described in Patent Documents 1 to 3 is the conventional structure shown in FIG. Note that the input devices described in Patent Documents 2 and 3 constitute a resistance-type input device instead of an electrostatic capacitance type ([0002] column of Patent Document 2 and [0003] column of Patent Document 3).
 特許文献4,5に記載された入力装置では、表面部材の操作面が曲面状である形態においてセンサ感度の均一性を向上させるための構造は一切、記載されていない。 In the input devices described in Patent Documents 4 and 5, there is no description of any structure for improving the uniformity of sensor sensitivity when the operation surface of the surface member is a curved surface.
 そこで本発明は上記従来の課題を解決するためのものであり、特に、各第1電極部及び各第2電極部の電極面積を操作面からセンサ部までの距離に基づいて調整することで、操作面全体におけるセンサ感度の均一性を簡単且つ適切に向上させた静電容量式の入力装置を提供することを目的としている。 Therefore, the present invention is for solving the above conventional problems, and in particular, by adjusting the electrode area of each first electrode part and each second electrode part based on the distance from the operation surface to the sensor part, It is an object of the present invention to provide a capacitance type input device in which uniformity of sensor sensitivity over the entire operation surface is improved easily and appropriately.
 本発明における入力装置は、
 平面内にて交差する第1の方向と第2の方向のうち前記第1の方向に間隔を空けて形成された複数本の下部電極パターンと、前記第2の方向に間隔を空けて形成された複数本の上部電極パターンとが高さ方向に間隔を空けて配置されたセンサ部と、前記センサ部と高さ方向に対向して配置され、表面に操作面を有する表面部材と、を有して構成され、
 各下部電極パターンは夫々、複数の第1電極部が前記第2の方向に前記第1電極部よりも細い連結部を介して連設されており、
 各上部電極パターンは夫々、複数の第2電極部が前記第1の方向に前記第2電極部よりも細い連結部を介して連設されており、
 前記第1電極部と前記第2電極部とは平面視にて重ならないように配置されており、
 前記操作面は、操作体を操作面上に接触させたときの前記操作体と前記センサ部間の高さ方向への距離が前記操作体の前記操作面上での接触位置により異なるように曲面を有して形成されており、
 前記第1電極部及び前記第2電極部の各電極面積は、前記操作面と前記センサ部間の距離が大きいほど大きく形成されていることを特徴とするものである。
The input device in the present invention is
A plurality of lower electrode patterns formed with a space in the first direction out of a first direction and a second direction intersecting in a plane, and formed with a space in the second direction. A plurality of upper electrode patterns spaced apart in the height direction, and a surface member disposed opposite to the sensor portion in the height direction and having an operation surface on the surface. Configured,
Each of the lower electrode patterns has a plurality of first electrode portions connected in series in the second direction via a connecting portion that is thinner than the first electrode portion,
Each upper electrode pattern has a plurality of second electrode portions connected in series in the first direction via a connecting portion that is thinner than the second electrode portion,
The first electrode part and the second electrode part are arranged so as not to overlap in plan view,
The operation surface is curved so that a distance in a height direction between the operation body and the sensor unit when the operation body is brought into contact with the operation surface varies depending on a contact position of the operation body on the operation surface. Formed with
Each electrode area of the first electrode portion and the second electrode portion is formed so as to increase as the distance between the operation surface and the sensor portion increases.
 指等の操作体を操作面上に接触させると、操作体と、操作体に近い各電極パターンの電極部との間で静電容量が生じる。本発明では、操作体の操作面上での接触位置により操作体と各電極パターンとの間の距離が異なるが、本発明のように、操作面とセンサ部間の距離が大きいほど電極面積を大きくしたことで、操作体を操作面上の異なる場所に接触させた際の容量変化のばらつきを従来に比べて抑制でき、操作面全体でのセンサ感度の均一性を簡単且つ適切に向上させることが可能になる。本発明では、各電極パターンの電極面積を上記のように調整することでセンサ部を平面形状(平板状)で形成することができるため、図10に示すようにセンサ部を曲面状に形成する場合等に比べてセンサ部を簡単且つ適切に形成することができ、よって、操作面全体におけるセンサ感度の均一性に優れた入力装置を簡単且つ安定して製造することが可能である。 When an operation body such as a finger is brought into contact with the operation surface, capacitance is generated between the operation body and the electrode portion of each electrode pattern close to the operation body. In the present invention, the distance between the operating body and each electrode pattern varies depending on the contact position on the operating surface of the operating body, but as the distance between the operating surface and the sensor unit increases as in the present invention, the electrode area increases. By making it larger, it is possible to suppress variation in capacitance change when the operating body is brought into contact with a different location on the operation surface, and to improve the uniformity of sensor sensitivity across the entire operation surface easily and appropriately. Is possible. In the present invention, the sensor portion can be formed in a planar shape (flat plate shape) by adjusting the electrode area of each electrode pattern as described above, so the sensor portion is formed in a curved surface shape as shown in FIG. As compared with the case, the sensor unit can be formed easily and appropriately. Therefore, it is possible to easily and stably manufacture an input device having excellent uniformity of sensor sensitivity over the entire operation surface.
 本発明では、各第1電極部における電極面積の比率、及び、各第2電極部における電極面積の比率は夫々、各電極部と前記操作面間の距離の比率に比例していることが好ましい。これにより、より効果的に、均一なセンサ感度を得ることができる。 In the present invention, the ratio of the electrode area in each first electrode part and the ratio of the electrode area in each second electrode part are preferably proportional to the ratio of the distance between each electrode part and the operation surface. . Thereby, uniform sensor sensitivity can be obtained more effectively.
 また本発明では、前記表面部材の操作面が、前記第1の方向及び前記第2の方向の少なくともどちらか一方に向けて凸曲面状あるいは凹曲面状で形成されている形態に好ましく適用できる。 In the present invention, the operation surface of the surface member can be preferably applied to a form in which a convex curved surface or a concave curved surface is formed toward at least one of the first direction and the second direction.
 本発明の入力装置によれば、従来に比べて、操作面全体でのセンサ感度の均一性を向上させることができる。 According to the input device of the present invention, it is possible to improve the uniformity of sensor sensitivity over the entire operation surface as compared with the conventional case.
本実施形態の静電容量式の入力装置(タッチパネル)10の分解斜視図、FIG. 2 is an exploded perspective view of a capacitance type input device (touch panel) 10 according to the present embodiment; 本実施形態における表面部材、下部電極パターン及び上部電極パターンを説明するための図であり、(a)は、表面部材の部分平面図及び、表面部材をA-A線及びB-B線に沿って切断した際の部分断面図、(b)は下部電極パターンの部分平面図、(c)は上部電極パターンの部分平面図、(d)は、(b)の下部電極パターンと(c)の上部電極パターンとを重ねた状態の部分平面図、It is a figure for demonstrating the surface member in this embodiment, a lower electrode pattern, and an upper electrode pattern, (a) is a partial top view of a surface member, and a surface member is taken along an AA line and a BB line. (B) is a partial plan view of the lower electrode pattern, (c) is a partial plan view of the upper electrode pattern, (d) is a lower electrode pattern of (b) and (c). A partial plan view in a state where the upper electrode pattern is overlaid, 図2とは別の実施形態における表面部材、下部電極パターン及び上部電極パターンを説明するための図((a)は、部分平面図及び部分断面図、(b)~(d)は部分平面図)、2A and 2B are diagrams for explaining a surface member, a lower electrode pattern, and an upper electrode pattern in another embodiment different from FIG. 2 (a) is a partial plan view and partial sectional view, and (b) to (d) are partial plan views. ), 図2、図3とは別の実施形態における表面部材、下部電極パターン及び上部電極パターンを説明するための図((a)は、部分平面図及び部分断面図、(b)~(d)は部分平面図)、FIGS. 2A and 2B are diagrams for explaining the surface member, the lower electrode pattern, and the upper electrode pattern in an embodiment different from FIGS. 2 and 3 (a) is a partial plan view and partial sectional view, and FIGS. Partial plan view), 図2~図4とは別の実施形態における表面部材、下部電極パターン及び上部電極パターンを説明するための図((a)は、部分平面図及び部分断面図、(b)~(d)は部分平面図)、FIGS. 2A to 2D are views for explaining a surface member, a lower electrode pattern, and an upper electrode pattern in an embodiment different from FIGS. 2 to 4 (a) is a partial plan view and partial sectional view, and FIGS. Partial plan view), 図1に示す本実施形態の入力装置をX1-X2方向に沿って切断したときの部分縦断面図、FIG. 1 is a partial longitudinal sectional view when the input device of the present embodiment shown in FIG. 1 is cut along the X1-X2 direction; 図6と異なる表面部材を用いた本実施形態の入力装置の部分縦断面図、The fragmentary longitudinal cross-section of the input device of this embodiment using the surface member different from FIG. 6, 従来における静電容量式の入力装置を模式的に示した部分縦断面図、A partial longitudinal sectional view schematically showing a conventional capacitance type input device, 従来における入力装置のセンサ部に設けられる下部電極パターンと上部電極パターンの部分平面図、A partial plan view of a lower electrode pattern and an upper electrode pattern provided in a sensor unit of a conventional input device, 図8と異なる形態の従来における静電容量式の入力装置を模式的に示した部分縦断面図。FIG. 9 is a partial longitudinal sectional view schematically showing a conventional capacitance type input device having a different form from FIG. 8.
 図1は、本実施形態の静電容量式の入力装置(タッチパネル)10の分解斜視図、図2は、本実施形態における表面部材、下部電極パターン及び上部電極パターンを説明するための図であり、(a)は、表面部材の部分平面図及び、表面部材をA-A線及びB-B線に沿って切断した際の部分断面図、(b)は下部電極パターンの部分平面図、(c)は上部電極パターンの部分平面図、(d)は、(b)の下部電極パターンと(c)の上部電極パターンとを重ねた状態の部分平面図である。図3~図5は図2とは別の実施形態を示す。図6は図1に示す本実施形態の入力装置をX1-X2方向に沿って切断したときの部分縦断面図、図7は図6と異なる表面部材を用いた本実施形態の入力装置の部分縦断面図である。 FIG. 1 is an exploded perspective view of a capacitance-type input device (touch panel) 10 according to the present embodiment, and FIG. 2 is a diagram for explaining a surface member, a lower electrode pattern, and an upper electrode pattern in the present embodiment. (A) is a partial plan view of the surface member, and a partial cross-sectional view when the surface member is cut along the lines AA and BB. (B) is a partial plan view of the lower electrode pattern. (c) is a partial plan view of the upper electrode pattern, and (d) is a partial plan view of the state in which the lower electrode pattern of (b) and the upper electrode pattern of (c) are overlapped. 3 to 5 show an embodiment different from that shown in FIG. 6 is a partial longitudinal sectional view of the input device of this embodiment shown in FIG. 1 cut along the X1-X2 direction, and FIG. 7 is a portion of the input device of this embodiment using a surface member different from FIG. It is a longitudinal cross-sectional view.
 図1に示すように入力装置10は、下から基材表面に複数本の下部電極パターンが形成された下部基板22、粘着層30、基材表面に複数本の上部電極パターンが形成された上部基板21、粘着層31、及び、表面に操作面20aを備えた表面部材20の順に積層されている。 As shown in FIG. 1, the input device 10 includes a lower substrate 22 having a plurality of lower electrode patterns formed on the surface of the base material, an adhesive layer 30, and an upper portion having a plurality of upper electrode patterns formed on the surface of the base material. The substrate 21, the adhesive layer 31, and the surface member 20 having the operation surface 20a on the surface are laminated in this order.
 各下部電極パターン及び各上部電極パターンは操作面20aと高さ方向に対向する領域に形成され、各電極パターンは操作面20aとの対向領域から各基板21,22の外周部12にて配線部に接続されている。 Each lower electrode pattern and each upper electrode pattern are formed in a region facing the operation surface 20a in the height direction, and each electrode pattern is a wiring portion at the outer peripheral portion 12 of each substrate 21, 22 from the region facing the operation surface 20a. It is connected to the.
 そして各配線部の先端に下部接続部17や上部接続部15が形成されている。図1に示すように、本実施形態の入力装置10には、フレキシブルプリント基板23が設けられる。図1に示すように、例えば、フレキシブルプリント基板23の先端(接続部15,17との接続側)は、中央部23aと、両側端部23b,23bとに分離している。フレキシブルプリント基板23の中央部23aには複数の第1接続部(図示しない)が形成されており、中央部23aが上部接続部15上に重ねられて、各第1接続部と各上部接続部15とが電気的に接続されている。また、フレキシブルプリント基板23の両側端部23bには複数の第2接続部(図示しない)が形成されており、両側端部23b,23bが入力装置10の下部接続部17上に重ねられて、各第2接続部と各下部接続部17とが電気的に接続されている。 And the lower connection part 17 and the upper connection part 15 are formed in the front-end | tip of each wiring part. As shown in FIG. 1, a flexible printed circuit board 23 is provided in the input device 10 of the present embodiment. As shown in FIG. 1, for example, the tip of the flexible printed circuit board 23 (the connection side with the connection parts 15 and 17) is separated into a central part 23 a and both side end parts 23 b and 23 b. A plurality of first connection portions (not shown) are formed in the central portion 23a of the flexible printed circuit board 23, and the central portion 23a is overlaid on the upper connection portion 15 so that each first connection portion and each upper connection portion is overlapped. 15 is electrically connected. Further, a plurality of second connection portions (not shown) are formed on both side end portions 23b of the flexible printed circuit board 23, and both side end portions 23b, 23b are overlapped on the lower connection portion 17 of the input device 10, Each 2nd connection part and each lower connection part 17 are electrically connected.
 またフレキシブルプリント基板23では、各第1接続部及び各第2接続部が、フレキシブルプリント基板23の表面に設置されたコネクタ35と、図示しない配線パターンを介して電気的に接続されている。 In the flexible printed circuit board 23, each first connection part and each second connection part are electrically connected to a connector 35 installed on the surface of the flexible printed circuit board 23 via a wiring pattern (not shown).
 図1及び図2(a)に示すように、表面部材20の表面は指Fやペン等の操作体による操作面20aである。この実施形態では、操作面20aの外周部であって表面部材20の下面に加飾層24が設けられている。操作面20aは透光領域であり、加飾層24が形成された操作面20aの外周部は非透光領域である。 1 and 2A, the surface of the surface member 20 is an operation surface 20a by an operation body such as a finger F or a pen. In this embodiment, the decorative layer 24 is provided on the outer peripheral portion of the operation surface 20 a and on the lower surface of the surface member 20. The operation surface 20a is a light-transmitting region, and the outer peripheral portion of the operation surface 20a on which the decoration layer 24 is formed is a non-light-transmitting region.
 図6は図1に示す入力装置1をX1-X2方向に沿って高さ方向に切断したときの部分縦断面図である。 FIG. 6 is a partial longitudinal sectional view when the input device 1 shown in FIG. 1 is cut in the height direction along the X1-X2 direction.
 図6に示すように、下部基板22は、平面状の下部基材32と下部基材32の表面に形成された複数本の下部電極パターン14とを有して構成される。また上部基板21は、平面状の上部基材33と上部基材33の表面に形成された複数本の上部電極パターン13とを有して構成される。複数本の下部電極パターン14と複数本の上部電極パターン13は平面視にて交差している。 As shown in FIG. 6, the lower substrate 22 includes a planar lower base material 32 and a plurality of lower electrode patterns 14 formed on the surface of the lower base material 32. The upper substrate 21 includes a planar upper base material 33 and a plurality of upper electrode patterns 13 formed on the surface of the upper base material 33. The plurality of lower electrode patterns 14 and the plurality of upper electrode patterns 13 intersect in plan view.
 下部電極パターン14及び上部電極パターン13は共に検出電極を構成している。
 図6に示すように下部基板22と上部基板21との間は粘着層30を介して接合されている。下部基板22,粘着層30及び上部基板21にてセンサ部25が構成される。なおセンサ部25の構成は図6に示す構造に限定されるものではない。平面状の基材の上下面に下部電極パターン14及び上部電極パターン13を形成した構成等であってもよい。また図6と異なって上部電極パターン13を粘着層30側に向けて下部基板22と上部基板21間を接合してもよい。
Both the lower electrode pattern 14 and the upper electrode pattern 13 constitute a detection electrode.
As shown in FIG. 6, the lower substrate 22 and the upper substrate 21 are bonded via an adhesive layer 30. The lower substrate 22, the adhesive layer 30 and the upper substrate 21 constitute a sensor unit 25. The configuration of the sensor unit 25 is not limited to the structure shown in FIG. The structure etc. which formed the lower electrode pattern 14 and the upper electrode pattern 13 in the upper and lower surfaces of a planar base material may be sufficient. Unlike FIG. 6, the lower substrate 22 and the upper substrate 21 may be bonded with the upper electrode pattern 13 facing the adhesive layer 30 side.
 各電極パターン13,14はいずれも基材表面にITO(Indium Tin Oxide)等の透明導電材料でスパッタや蒸着により成膜される。また基材32,33は、ポリエチレンテレフタレート(PET)等のフィルム状の透明基材やガラス基材等で形成される。本実施形態では下部基板22及び上部基板21を平面状に形成し、図10で示したような立体状に成形しないため、基材32,33には軟質なフィルムのみならず平面状のガラス等を用いることが可能である。 The electrode patterns 13 and 14 are both formed on the surface of the substrate by sputtering or vapor deposition with a transparent conductive material such as ITO (IndiumInTin に Oxide). The base materials 32 and 33 are formed of a film-like transparent base material such as polyethylene terephthalate (PET) or a glass base material. In the present embodiment, the lower substrate 22 and the upper substrate 21 are formed in a planar shape and are not formed into a three-dimensional shape as shown in FIG. 10, so that the base materials 32 and 33 include not only a soft film but also a planar glass or the like. Can be used.
 図6に示すように、センサ部25の上面側に粘着層31を介して表面部材20が接合されている。粘着層30,31はアクリル系粘着剤、両面粘着テープ等である。表面部材20は特に材質を限定するものではないが、ガラス、プラスチック等で形成される。図6に示す表面部材20は、操作面20aが凸曲面状となるように形成されている。なお図1に示す表面部材20の表面形状には、曲面であることが斜視図で見やすくするために図3(a)の形状を図示することとした。 As shown in FIG. 6, the surface member 20 is bonded to the upper surface side of the sensor unit 25 via the adhesive layer 31. The adhesive layers 30 and 31 are an acrylic adhesive, a double-sided adhesive tape, or the like. The surface member 20 is not particularly limited in material, but is formed of glass, plastic or the like. The surface member 20 shown in FIG. 6 is formed such that the operation surface 20a has a convex curved surface shape. The surface shape of the surface member 20 shown in FIG. 1 is shown in FIG. 3A in order to make it easy to see that it is a curved surface in a perspective view.
 図2は第1実施形態における表面部材20、下部電極パターン及び上部電極パターンの形状を示す。 FIG. 2 shows the shapes of the surface member 20, the lower electrode pattern, and the upper electrode pattern in the first embodiment.
 図2(a)は表面部材20の部分平面図と、表面部材20の中心Oを通るA-A線断面及びB-B線断面を示す。なおA-A線断面及びB-B線断面には表面部材20のみならず表面部材20下の粘着層31についても一部図示した。 FIG. 2A shows a partial plan view of the surface member 20 and a cross section taken along line AA and BB passing through the center O of the surface member 20. A part of the adhesive layer 31 under the surface member 20 as well as the surface member 20 is shown in the AA line cross section and the BB line cross section.
 図2(a)に示すように表面部材20の操作面(表面)20aは、Y1-Y2方向(第1の方向)及びX1-X2方向(第2の方向)に向って凸曲面で形成される。この実施形態での操作面20aは、その中心Oが最も上方に突出しており、中心Oから離れるにしたがって徐々に下方に向けて湾曲する3D形状で形成されている。 As shown in FIG. 2A, the operation surface (surface) 20a of the surface member 20 is formed with a convex curved surface in the Y1-Y2 direction (first direction) and the X1-X2 direction (second direction). The The operation surface 20a in this embodiment has a 3D shape in which the center O protrudes most upward and is gradually curved downward as the distance from the center O increases.
 図2(b)は下部電極パターン14の部分平面図である。図2(b)に示すように下部電極パターン14a~14dは複数本形成される。ここで、図2~図5においては各下部電極パターンや上部電極パターンを個別に説明する必要性から、各下部電極パターンや各上部電極パターンに「符号14a,14b・・・・,符号13a,13b,・・・」と付した。 FIG. 2B is a partial plan view of the lower electrode pattern 14. As shown in FIG. 2B, a plurality of lower electrode patterns 14a to 14d are formed. Here, in FIGS. 2 to 5, since it is necessary to individually explain each lower electrode pattern and upper electrode pattern, each lower electrode pattern and each upper electrode pattern is denoted by “ reference numerals 14 a, 14 b... 13b, ... ".
 図2(b)に示すように、各下部電極パターン14a~14dは、Y1-Y2方向に間隔を空けて配置されるとともに、夫々、X1-X2方向に向けて延出して形成されている。 As shown in FIG. 2B, the lower electrode patterns 14a to 14d are arranged with a space in the Y1-Y2 direction and are formed to extend in the X1-X2 direction, respectively.
 各下部電極パターン14a~14dはいずれも複数の第1電極部40a~40pがX1-X2方向に、前記第1電極部40a~40pより細い連結部41を介して連設された形態である。第1電極部40a~40pの形状は図2(b)に示す略菱形状等に限定するものではないが、操作面20aから電極形状を見えづらくするためには略菱形状を用いるとよい。後述する第2電極部においても同様である。 Each of the lower electrode patterns 14a to 14d has a configuration in which a plurality of first electrode portions 40a to 40p are connected in the X1-X2 direction via a connecting portion 41 that is narrower than the first electrode portions 40a to 40p. The shape of the first electrode portions 40a to 40p is not limited to the approximately rhombus shape shown in FIG. 2B, but an approximately rhombus shape may be used to make it difficult to see the electrode shape from the operation surface 20a. The same applies to the second electrode section described later.
 なお図2(b)では連結部41を各下部電極パターン14a~14dの一箇所にのみ図示した。図2(b)には平面視にて、表面部材20の操作面20aの中心Oも図示した。そして図2(b)に示す実施形態では、下部電極パターン14a,14bと下部電極パターン14c,14dとが中心Oに対して点対称に形成されている。すなわち下部電極パターン14aと下部電極パターン14dとは同形状で形成され、下部電極パターン14bと下部電極パターン14cとは同形状で形成される。 In FIG. 2B, the connecting portion 41 is shown only at one location of each of the lower electrode patterns 14a to 14d. FIG. 2B also shows the center O of the operation surface 20a of the surface member 20 in plan view. In the embodiment shown in FIG. 2B, the lower electrode patterns 14a and 14b and the lower electrode patterns 14c and 14d are formed point-symmetrically with respect to the center O. That is, the lower electrode pattern 14a and the lower electrode pattern 14d are formed in the same shape, and the lower electrode pattern 14b and the lower electrode pattern 14c are formed in the same shape.
 各下部電極パターン14a~14dのパターン形状について更に詳しく説明する。
 下部電極パターン14b,14cの中心Oに近く等位置にある第1電極部40f,40g,40j,40kは、いずれも最も大きい電極面積で形成される。下部電極パターン14b,14cの残りの第1電極部40e,40h,40i,40lは、第1電極部40f,40g,40j,40kよりも小さい電極面積で形成される。
The pattern shapes of the lower electrode patterns 14a to 14d will be described in more detail.
The first electrode portions 40f, 40g, 40j, and 40k that are equidistant from the center O of the lower electrode patterns 14b and 14c are each formed with the largest electrode area. The remaining first electrode portions 40e, 40h, 40i, 40l of the lower electrode patterns 14b, 14c are formed with an electrode area smaller than the first electrode portions 40f, 40g, 40j, 40k.
 下部電極パターン14a,14dでは、中心Oから等位置にある第1電極部40b,40c,40n,40oは、第1電極部40e,40h,40i,40lよりも中心Oから離れているため、第1電極部40b,40c,40n,40oの電極面積は、第1電極部40e,40h,40i,40lよりも小さく形成される。下部電極パターン14a,14dの残りの第1電極部40a,40d,40m,40pは、図2(b)に示す全ての第1電極部の中で最も中心Oから離れた位置にあり、よって第1電極部40a,40d,40m,40pの電極面積は最も小さく形成される。 In the lower electrode patterns 14a and 14d, the first electrode portions 40b, 40c, 40n, and 40o that are equidistant from the center O are more distant from the center O than the first electrode portions 40e, 40h, 40i, and 40l. The electrode areas of the first electrode portions 40b, 40c, 40n, and 40o are smaller than those of the first electrode portions 40e, 40h, 40i, and 40l. The remaining first electrode portions 40a, 40d, 40m, and 40p of the lower electrode patterns 14a and 14d are located farthest from the center O among all the first electrode portions shown in FIG. The electrode area of one electrode part 40a, 40d, 40m, 40p is formed the smallest.
 図2(c)は上部電極パターン13の部分平面図である。図2(c)に示すように上部電極パターン13a~13cは複数本形成される。図2(c)に示すように、各上部電極パターン13a~13cは、X1-X2方向に間隔を空けて配置されるとともに、夫々、Y1-Y2方向に向けて延出して形成されている。 FIG. 2C is a partial plan view of the upper electrode pattern 13. As shown in FIG. 2C, a plurality of upper electrode patterns 13a to 13c are formed. As shown in FIG. 2C, each of the upper electrode patterns 13a to 13c is arranged with an interval in the X1-X2 direction, and is formed to extend in the Y1-Y2 direction.
 各上部電極パターン13a~13cはいずれも複数の第2電極部42a~42oがX1-X2方向に、前記第2電極部42a~42oより細い連結部43を介して連設された形態である。なお図2(c)では連結部43を各上部電極パターン13a~13dの一箇所にのみ図示した。 Each of the upper electrode patterns 13a to 13c has a configuration in which a plurality of second electrode portions 42a to 42o are connected in the X1-X2 direction via a connecting portion 43 that is narrower than the second electrode portions 42a to 42o. In FIG. 2C, the connecting portion 43 is shown only at one location of each of the upper electrode patterns 13a to 13d.
 図2(c)には平面視にて、表面部材20の操作面20aの中心Oも図示した。図2(c)に示す実施形態では、上部電極パターン13aと上部電極パターン13cとが中心Oに対して点対称に形成され同形状となっている。 FIG. 2C also shows the center O of the operation surface 20a of the surface member 20 in plan view. In the embodiment shown in FIG. 2C, the upper electrode pattern 13a and the upper electrode pattern 13c are formed symmetrically with respect to the center O and have the same shape.
 各上部電極パターン13a~13cのパターン形状について更に詳しく説明する。
 上部電極パターン13bの中心Oに位置する第2電極部42hは最も大きい電極面積で形成される。上部電極パターン13bを構成する第2電極部42g,42iの電極面積は、第2電極部42hより小さいが、第2電極部42f,42jより大きく形成され、第2電極部42f,42jがより小さく形成される。
The pattern shapes of the upper electrode patterns 13a to 13c will be described in more detail.
The second electrode portion 42h located at the center O of the upper electrode pattern 13b is formed with the largest electrode area. The electrode areas of the second electrode portions 42g and 42i constituting the upper electrode pattern 13b are smaller than the second electrode portion 42h, but are formed larger than the second electrode portions 42f and 42j, and the second electrode portions 42f and 42j are smaller. It is formed.
 上部電極パターン13a,13cでは、中心Oに近い第2電極部42c,42mが大きく形成されるが、第2電極部42hより小さく形成される。上部電極パターン13a,13cを構成する第2電極部42b,42d,42l,42nの電極面積は、第2電極部42c,42mより小さいが第2電極部42a,42e,42k,42oより大きく形成され、第2電極部42a,42e,42k,42oが最も小さく形成される。第2電極部42a,42e,42k,42oは、第2電極部42f,42jより小さく形成される。 In the upper electrode patterns 13a and 13c, the second electrode portions 42c and 42m close to the center O are formed larger, but are formed smaller than the second electrode portion 42h. The electrode areas of the second electrode portions 42b, 42d, 42l and 42n constituting the upper electrode patterns 13a and 13c are smaller than the second electrode portions 42c and 42m, but larger than the second electrode portions 42a, 42e, 42k and 42o. The second electrode portions 42a, 42e, 42k, 42o are formed to be the smallest. The second electrode portions 42a, 42e, 42k, 42o are formed smaller than the second electrode portions 42f, 42j.
 図2(d)は、図2(b)に示す複数本の下部電極パターン14a~14dと図2(c)に示す複数本の上部電極パターン13a~13cとを重ね合わせた部分平面図である。なお下部電極パターン14a~14dと上部電極パターン13a~13cとの間には図6に示すように、粘着層30や基材33等が介在し、下部電極パターン14a~14dと上部電極パターン13a~13c間には高さ方向に所定の間隔が空いている。 FIG. 2D is a partial plan view in which the plurality of lower electrode patterns 14a to 14d shown in FIG. 2B and the plurality of upper electrode patterns 13a to 13c shown in FIG. . As shown in FIG. 6, an adhesive layer 30 and a base material 33 are interposed between the lower electrode patterns 14a to 14d and the upper electrode patterns 13a to 13c, and the lower electrode patterns 14a to 14d and the upper electrode patterns 13a to 13c are interposed. There is a predetermined gap in the height direction between 13c.
 図2(d)に示すように、下部電極パターン14a~14dを構成する各第1電極部40a~40pと、上部電極パターン13a~13cを構成する第2電極部42a~42oとは平面視にて重ならないように配置されている。 As shown in FIG. 2D, the first electrode portions 40a to 40p constituting the lower electrode patterns 14a to 14d and the second electrode portions 42a to 42o constituting the upper electrode patterns 13a to 13c are in plan view. Are arranged so that they do not overlap.
 表面部材20での操作面20aの中心Oでは、図6に示すセンサ部25との間の高さ方向への距離が最も大きくなっている。ここで操作面20aとセンサ部25間の距離とは、操作面20aと各第1電極部との間の距離L3、及び、操作面20aと各第2電極部との間の距離L2を指す。なお図6は、ちょうど第2電極部の中心位置で切断した断面図であり、上部電極パターン13として見えている部分は「第2電極部42」(図2では符号42a~42oと付したがここでは便宜上、符号42とした)である。また図2(d)からもわかるように、第2電極部42のX1-X2方向の中心に沿って切断すると、その切断面に下部電極パターン14は現れないが、図6では、切断面には見えない奥側あるいは手前側に存在する第1電極部40(ここでも便宜的に符号40とした)を有する下部電極パターン14を示すこととした。図6では指Fに近い第1電極部40との距離L3及び第2電極部42との距離L2が示されている。 At the center O of the operation surface 20a of the surface member 20, the distance in the height direction from the sensor unit 25 shown in FIG. 6 is the largest. Here, the distance between the operation surface 20a and the sensor unit 25 refers to the distance L3 between the operation surface 20a and each first electrode unit and the distance L2 between the operation surface 20a and each second electrode unit. . FIG. 6 is a cross-sectional view cut at the center position of the second electrode portion. The portion visible as the upper electrode pattern 13 is “second electrode portion 42” (in FIG. 2, reference numerals 42a to 42o are attached). Here, it is denoted by reference numeral 42 for convenience. As can be seen from FIG. 2D, when the second electrode portion 42 is cut along the center in the X1-X2 direction, the lower electrode pattern 14 does not appear on the cut surface, but in FIG. Is a lower electrode pattern 14 having a first electrode portion 40 (here also denoted by reference numeral 40 for convenience) existing on the rear side or the near side which cannot be seen. In FIG. 6, a distance L <b> 3 with the first electrode part 40 close to the finger F and a distance L <b> 2 with the second electrode part 42 are shown.
 図6に示すように指Fを操作面20a上に接触させると、指Fと、指Fに近い各電極パターン13,14の電極部40,42との間で静電容量C2,C3が生じる。このように、指Fを操作面20a上に接触させたときと接触させないときとで容量変化が生じる。例えば、検出電極である各下部電極パターン13にパルス状の電圧を順番に与え、このとき、各下部電極パターン13の電気特性(例えば時定数)を指Fを触れる前と触れた後で比較すれば、変化が見られた下部電極パターン14の上方付近に指Fが存在することがわかる。同様に、各上部電極パターン13においても容量変化に基づく電気特性変化を検知することで、検出電極である各下部電極パターン14及び各上部電極パターン13の検出結果から、指Fの接触位置を算出することが可能である。 As shown in FIG. 6, when the finger F is brought into contact with the operation surface 20a, capacitances C2 and C3 are generated between the finger F and the electrode portions 40 and 42 of the electrode patterns 13 and 14 close to the finger F. . As described above, the capacitance changes between when the finger F is brought into contact with the operation surface 20a and when the finger F is not brought into contact therewith. For example, a pulse voltage is sequentially applied to each lower electrode pattern 13 that is a detection electrode, and at this time, the electrical characteristics (eg, time constant) of each lower electrode pattern 13 are compared before and after touching the finger F. For example, it can be seen that the finger F exists near the upper part of the lower electrode pattern 14 where the change is observed. Similarly, in each upper electrode pattern 13, the contact position of the finger F is calculated from the detection results of the lower electrode patterns 14 and the upper electrode patterns 13 that are detection electrodes by detecting a change in electrical characteristics based on the capacitance change. Is possible.
 本実施形態では、指Fの操作面20a上での接触位置により指Fと各電極パターンとの間の距離L2,L3が異なるが、静電容量の大きさは、距離に反比例し、面積に比例するため、本実施形態のように、操作面20aとセンサ部25間の距離L2,L3が大きいほど電極面積を大きくしたことで、指Fを操作面20a上の異なる位置に接触させたときの容量変化のばらつきを従来に比べて抑制でき、操作面20a全体でのセンサ感度の均一性を向上させることが可能になる。 In the present embodiment, the distances L2 and L3 between the finger F and each electrode pattern differ depending on the contact position of the finger F on the operation surface 20a, but the size of the capacitance is inversely proportional to the distance and the area. Since it is proportional, when the finger F is brought into contact with a different position on the operation surface 20a by increasing the electrode area as the distances L2 and L3 between the operation surface 20a and the sensor unit 25 are larger as in this embodiment. The variation of the capacitance change can be suppressed as compared with the conventional case, and the uniformity of the sensor sensitivity over the entire operation surface 20a can be improved.
 そして本実施形態では、平面形状(平板状)のセンサ部25を用いることができるから、従来に比べて操作面20aが曲面状に形成された入力装置10を適切且つ容易に製造できるとともに操作面20a全体でのセンサ感度の均一性を効果的に向上させることが可能である。 In this embodiment, since the sensor unit 25 having a planar shape (flat plate shape) can be used, the input device 10 in which the operation surface 20a is formed in a curved shape can be appropriately and easily manufactured as compared with the conventional case. It is possible to effectively improve the uniformity of sensor sensitivity throughout 20a.
 ここで、図2(b)に示す各下部電極パターン14a~14dの第1電極部40a~40pと、図2(c)に示す各上部電極パターン13a~13cの第2電極部42a~42oとの間での電極面積の調整は必要でない。例えば、図6のように、距離L3は距離L2より大きくなる。しかしながら、距離L3にある第1電極部を、距離L2にある電極部より大きくすることは必要でない。本実施形態では、各下部電極パターン及び各上部電極パターンがいずれも検出電極であり、各下部電極パターン、及び各上部電極パターンの夫々において、別々に指FのX1-X2方向あるいはY1-Y2方向の接触位置を検知するため、各下部電極パターンと各上部電極パターンとの間で電極面積の調整は必要でなく、各第1電極部40a~40p、あるいは、各第2電極部42a~42oにおいて、夫々、距離L2,L3に対して電極面積を調整すればよい。図3~図5における実施形態でも同様である。ただし、平面視において隣接する第1電極部及び第2電極部同士を、ほぼ同じ大きさとなるように形成することが、大きさの異なる第1電極部及び第2電極部をX-Y平面に適切に配列させることができ、また操作面20aから各電極部の形状を透視して見えづらくでき好ましい。 Here, the first electrode portions 40a to 40p of the lower electrode patterns 14a to 14d shown in FIG. 2B, and the second electrode portions 42a to 42o of the upper electrode patterns 13a to 13c shown in FIG. It is not necessary to adjust the electrode area between. For example, as shown in FIG. 6, the distance L3 is larger than the distance L2. However, it is not necessary to make the first electrode portion at the distance L3 larger than the electrode portion at the distance L2. In the present embodiment, each lower electrode pattern and each upper electrode pattern are detection electrodes, and each of the lower electrode pattern and each upper electrode pattern is separately provided in the X1-X2 direction or the Y1-Y2 direction of the finger F. Therefore, it is not necessary to adjust the electrode area between each lower electrode pattern and each upper electrode pattern, and the first electrode portions 40a to 40p or the second electrode portions 42a to 42o The electrode area may be adjusted with respect to the distances L2 and L3, respectively. The same applies to the embodiments in FIGS. However, the first electrode portion and the second electrode portion which are adjacent to each other in plan view are formed so as to have substantially the same size, so that the first electrode portion and the second electrode portion having different sizes can be arranged on the XY plane. This is preferable because it can be arranged appropriately and it is difficult to see through the shape of each electrode portion from the operation surface 20a.
 図3は第2実施形態における表面部材20、下部電極パターン及び上部電極パターンの形状を示す。 FIG. 3 shows the shapes of the surface member 20, the lower electrode pattern, and the upper electrode pattern in the second embodiment.
 図3(a)は表面部材20の部分平面図と、表面部材20の中心Oを通るA-A線断面及びB-B線断面を示す。なおA-A線断面及びB-B線断面には表面部材20のみならず表面部材20下の粘着層31についても一部図示した。 FIG. 3A shows a partial plan view of the surface member 20 and a cross section taken along line AA and BB passing through the center O of the surface member 20. A part of the adhesive layer 31 under the surface member 20 as well as the surface member 20 is shown in the AA line cross section and the BB line cross section.
 図3(a)に示すように表面部材20の操作面(表面)20aはX1-X2方向に向って凸曲面で形成され、Y1-Y2方向に向けて直線状で形成される。この実施形態では操作面20aの中心Oを通るY1-Y2方向の線上が最も上方に突出しており、中心Oを通るY1-Y2方向の線上からX1-X2方向に離れるにしたがって徐々に下方に向けて湾曲する形状で形成されている。 As shown in FIG. 3 (a), the operation surface (surface) 20a of the surface member 20 is formed as a convex curved surface in the X1-X2 direction and linearly formed in the Y1-Y2 direction. In this embodiment, the line in the Y1-Y2 direction passing through the center O of the operation surface 20a protrudes most upward, and gradually moves downward as it moves away from the line in the Y1-Y2 direction passing through the center O in the X1-X2 direction. It is formed in a curved shape.
 図3(b)は下部電極パターン14の部分平面図である。図3(b)に示す各下部電極パターン14e~14hはいずれも同形状で形成される。操作面20aの中心Oを通るY1-Y2方向の線上に近い第1電極部44b,44c,44f,44g、44j,44k,44n,44oの電極面積は、操作面20aの中心Oを通るY1-Y2方向の線上から遠い第1電極部44a,44d,44e,44h、44i,44l,44m,44pよりも大きく形成されている。 FIG. 3B is a partial plan view of the lower electrode pattern 14. All the lower electrode patterns 14e to 14h shown in FIG. 3B are formed in the same shape. The electrode areas of the first electrode portions 44b, 44c, 44f, 44g, 44j, 44k, 44n, and 44o that are close to the line in the Y1-Y2 direction passing through the center O of the operation surface 20a are Y1-passing through the center O of the operation surface 20a. It is formed larger than the first electrode portions 44a, 44d, 44e, 44h, 44i, 44l, 44m, and 44p far from the line in the Y2 direction.
 図3(c)は上部電極パターン13の部分平面図である。図3(c)に示すように上部電極パターン13d~13fは複数本形成される。図3(c)に示すように、各上部電極パターン13d~13fは、X1-X2方向に間隔を空けて配置されるとともに、夫々、Y1-Y2方向に向けて延出して形成されている。平面視にて、操作面20aの中心Oを通るY1-Y2方向の線上に位置する上部電極パターン13fの第2電極部45f,45g,45h,45i,45jの電極面積は、操作面20aの中心Oを通るY1-Y2方向の線上から離れた上部電極パターン13d,13fの第2電極部45a,45b,45c,45d,45e,45k,45l,45m,45n,45oよりも大きく形成されている。 FIG. 3C is a partial plan view of the upper electrode pattern 13. As shown in FIG. 3C, a plurality of upper electrode patterns 13d to 13f are formed. As shown in FIG. 3C, each of the upper electrode patterns 13d to 13f is arranged with an interval in the X1-X2 direction and is formed to extend in the Y1-Y2 direction. In plan view, the electrode area of the second electrode portions 45f, 45g, 45h, 45i, and 45j of the upper electrode pattern 13f located on the line in the Y1-Y2 direction passing through the center O of the operation surface 20a is the center of the operation surface 20a. It is formed larger than the second electrode portions 45a, 45b, 45c, 45d, 45e, 45k, 45l, 45m, 45n, and 45o of the upper electrode patterns 13d and 13f separated from the line in the Y1-Y2 direction passing through O.
 図3(d)は、図3(b)に示す複数本の下部電極パターン14e~14hと図3(c)に示す複数本の上部電極パターン13d~13fとを重ね合わせた部分平面図である。図3(d)に示すように、各第1電極部44a~44pと各第2電極部45a~45oとは平面視にて重ならないように配置されている。 FIG. 3D is a partial plan view in which the plurality of lower electrode patterns 14e to 14h shown in FIG. 3B and the plurality of upper electrode patterns 13d to 13f shown in FIG. . As shown in FIG. 3D, the first electrode portions 44a to 44p and the second electrode portions 45a to 45o are arranged so as not to overlap each other in plan view.
 そして、図3(b)及び図3(c)に示すように各電極パターン14e~14h,13d~13fを形成することで、各電極部の電極面積を、操作面20aとセンサ部25間の高さ方向(Z)への距離L2,L3が大きいほど大きくできる。 Then, as shown in FIGS. 3B and 3C, by forming the electrode patterns 14e to 14h and 13d to 13f, the electrode area of each electrode portion can be set between the operation surface 20a and the sensor portion 25. The distance can be increased as the distances L2 and L3 in the height direction (Z) are increased.
 図4は第3実施形態における表面部材20、下部電極パターン及び上部電極パターンの形状を示す。 FIG. 4 shows the shapes of the surface member 20, the lower electrode pattern, and the upper electrode pattern in the third embodiment.
 図4(a)は表面部材20の部分平面図と、表面部材20の操作面20aの中心Oを通るA-A線断面及びB-B線断面を示す。なおA-A線断面及びB-B線断面には表面部材20のみならず表面部材20下の粘着層31についても一部図示した。 FIG. 4 (a) shows a partial plan view of the surface member 20, and a cross section taken along the line AA and a line BB passing through the center O of the operation surface 20a of the surface member 20. FIG. A part of the adhesive layer 31 under the surface member 20 as well as the surface member 20 is shown in the AA line cross section and the BB line cross section.
 図4(a)に示すように表面部材20の操作面(表面)20aは、Y1-Y2方向(第1の方向)及びX1-X2方向(第2の方向)に向って凹曲面で形成される。この実施形態では操作面20aの中心Oが最も下方に凹んでおり、中心Oから離れるにしたがって徐々に上方に向けて湾曲する3D形状で形成されている。 As shown in FIG. 4A, the operation surface (surface) 20a of the surface member 20 is formed as a concave curved surface in the Y1-Y2 direction (first direction) and the X1-X2 direction (second direction). The In this embodiment, the center O of the operation surface 20a is recessed most downward, and is formed in a 3D shape that gradually curves upward as the distance from the center O increases.
 図4(b)は下部電極パターン14の部分平面図である。図4(b)に示すように下部電極パターン14i~14lは複数本形成される。図4(b)に示すように、各下部電極パターン14i~14lは、Y1-Y2方向に間隔を空けて配置されるとともに、夫々、X1-X2方向に向けて延出して形成されている。 FIG. 4B is a partial plan view of the lower electrode pattern 14. As shown in FIG. 4B, a plurality of lower electrode patterns 14i to 14l are formed. As shown in FIG. 4B, the lower electrode patterns 14i to 14l are arranged with an interval in the Y1-Y2 direction and are formed to extend in the X1-X2 direction, respectively.
 各下部電極パターン14i~14lはいずれも複数の第1電極部46a~46pがX1-X2方向に、前記第1電極部46a~46pより細い連結部41を介して連設された形態である。なお図4(b)では連結部41を各下部電極パターン14i~14lの一箇所にのみ図示した。図4(b)には平面視にて、表面部材20の操作面20aの中心Oも図示した。そして図4(b)に示す実施形態では、下部電極パターン14i,14jと下部電極パターン14k,14lとが中心Oに対して点対称に形成されている。すなわち下部電極パターン14iと下部電極パターン14lとは同形状で形成され、下部電極パターン14jと下部電極パターン14kとは同形状で形成される。 Each of the lower electrode patterns 14i to 14l has a configuration in which a plurality of first electrode portions 46a to 46p are connected in the X1-X2 direction via a connecting portion 41 that is narrower than the first electrode portions 46a to 46p. In FIG. 4B, the connecting portion 41 is shown only at one location of each of the lower electrode patterns 14i to 14l. FIG. 4B also shows the center O of the operation surface 20a of the surface member 20 in plan view. In the embodiment shown in FIG. 4B, the lower electrode patterns 14i and 14j and the lower electrode patterns 14k and 14l are formed point-symmetrically with respect to the center O. That is, the lower electrode pattern 14i and the lower electrode pattern 141 are formed in the same shape, and the lower electrode pattern 14j and the lower electrode pattern 14k are formed in the same shape.
 各下部電極パターン14i~14lのパターン形状について更に詳しく説明する。
 下部電極パターン14j,14kの中心Oに近く等位置にある第1電極部46f,46g,46j,46kは、いずれも最も小さい電極面積で形成される。下部電極パターン14j,14kの残りの第1電極部46e,46h,46i,46lは、第1電極部46f,46g,46j,46kよりも大きい電極面積で形成される。
The pattern shapes of the lower electrode patterns 14i to 14l will be described in more detail.
The first electrode portions 46f, 46g, 46j, and 46k that are equidistant from the center O of the lower electrode patterns 14j and 14k are all formed with the smallest electrode area. The remaining first electrode portions 46e, 46h, 46i, 46l of the lower electrode patterns 14j, 14k are formed with a larger electrode area than the first electrode portions 46f, 46g, 46j, 46k.
 下部電極パターン14i,14lでは、中心Oに近く等位置にある第1電極部46b,46c,46n,46oは、第1電極部46a,46d,46m,46pよりも小さい電極面積で形成されている。 In the lower electrode patterns 14i and 14l, the first electrode portions 46b, 46c, 46n, and 46o that are equidistant from the center O are formed with a smaller electrode area than the first electrode portions 46a, 46d, 46m, and 46p. .
 図4(c)は上部電極パターン13の部分平面図である。図4(c)に示すように上部電極パターン13h~13jは複数本形成される。図4(c)に示すように、各上部電極パターン13h~13jは、X1-X2方向に間隔を空けて配置されるとともに、夫々、Y1-Y2方向に向けて延出して形成されている。 FIG. 4C is a partial plan view of the upper electrode pattern 13. As shown in FIG. 4C, a plurality of upper electrode patterns 13h to 13j are formed. As shown in FIG. 4C, each of the upper electrode patterns 13h to 13j is arranged with an interval in the X1-X2 direction and is formed to extend in the Y1-Y2 direction.
 各上部電極パターン13h~13jはいずれも複数の第2電極部47a~47oがX1-X2方向に、前記第2電極部47a~47oより細い連結部43を介して連設された形態である。なお図4(c)では連結部43を各上部電極パターン13h~13jの一箇所にのみ図示した。 Each of the upper electrode patterns 13h to 13j has a configuration in which a plurality of second electrode portions 47a to 47o are connected in the X1-X2 direction via a connecting portion 43 that is narrower than the second electrode portions 47a to 47o. In FIG. 4C, the connecting portion 43 is shown only at one location of each of the upper electrode patterns 13h to 13j.
 図4(c)には平面視にて表面部材20の操作面20aの中心Oも図示した。図4(c)に示す実施形態では、上部電極パターン13hと上部電極パターン13jとが中心Oに対して点対称に形成され同形状となっている。 FIG. 4C also shows the center O of the operation surface 20a of the surface member 20 in plan view. In the embodiment shown in FIG. 4C, the upper electrode pattern 13h and the upper electrode pattern 13j are formed symmetrically with respect to the center O and have the same shape.
 各上部電極パターン13h~13jのパターン形状について更に詳しく説明する。
 上部電極パターン13iの中心Oに位置する第2電極部47hは最も小さい電極面積で形成される。上部電極パターン13iを構成する他の第2電極部47g,47iの電極面積は、第2電極部47hより大きいが、第2電極部47f,47jより小さく形成され、第2電極部47f,47jがより大きく形成される。
The pattern shapes of the upper electrode patterns 13h to 13j will be described in more detail.
The second electrode portion 47h located at the center O of the upper electrode pattern 13i is formed with the smallest electrode area. The electrode areas of the other second electrode portions 47g and 47i constituting the upper electrode pattern 13i are larger than the second electrode portion 47h, but smaller than the second electrode portions 47f and 47j, and the second electrode portions 47f and 47j are formed. Formed larger.
 上部電極パターン13h,13jでは、中心Oに近い第2電極部47c,47mが小さく形成されるが、第2電極部47hより大きく形成される。上部電極パターン13h,13jを構成する残りの第2電極部42b,42d,42l,42nの電極面積は、第2電極部42c,42mより大きいが第2電極部47a,47e,47k,47oより小さく形成され、第2電極部47a,47e,47k,47oが最も大きく形成される。 In the upper electrode patterns 13h and 13j, the second electrode portions 47c and 47m close to the center O are formed smaller, but larger than the second electrode portion 47h. The electrode areas of the remaining second electrode portions 42b, 42d, 42l, and 42n constituting the upper electrode patterns 13h and 13j are larger than the second electrode portions 42c and 42m, but smaller than the second electrode portions 47a, 47e, 47k, and 47o. The second electrode portions 47a, 47e, 47k, and 47o are formed to be the largest.
 図4(d)は、図4(b)に示す複数本の下部電極パターン14i~14lと図4(c)に示す複数本の上部電極パターン13h~13jとを重ね合わせた部分平面図である。 FIG. 4D is a partial plan view in which the plurality of lower electrode patterns 14i to 141 shown in FIG. 4B and the plurality of upper electrode patterns 13h to 13j shown in FIG. .
 図4(d)に示すように、下部電極パターン14i~14lを構成する各第1電極部46a~46pと、上部電極パターン13h~13jを構成する第2電極部47a~47oとは平面視にて重ならないように配置されている。そして、図4(b)及び図4(c)に示すように各電極パターン14i~14l,13h~13jを形成することで、各電極部46a~46p,47a~47oの電極面積を、操作面20aとセンサ部25間の高さ方向(Z)への距離が大きいほど大きくすることができる。 As shown in FIG. 4D, the first electrode portions 46a to 46p constituting the lower electrode patterns 14i to 14l and the second electrode portions 47a to 47o constituting the upper electrode patterns 13h to 13j are in plan view. Are arranged so that they do not overlap. Then, as shown in FIGS. 4B and 4C, by forming the electrode patterns 14i to 14l and 13h to 13j, the electrode areas of the electrode portions 46a to 46p and 47a to 47o The larger the distance in the height direction (Z) between 20a and the sensor unit 25, the larger the distance.
 図5は第4実施形態における表面部材20、下部電極パターン及び上部電極パターンの形状を示す。 FIG. 5 shows the shapes of the surface member 20, the lower electrode pattern, and the upper electrode pattern in the fourth embodiment.
 図5(a)は表面部材20の部分平面図と、表面部材20の中心Oを通るA-A線断面及びB-B線断面を示す。なおA-A線断面及びB-B線断面には表面部材20のみならず表面部材20下の粘着層31についても一部図示した。 FIG. 5A shows a partial plan view of the surface member 20 and a cross section taken along line AA and BB passing through the center O of the surface member 20. A part of the adhesive layer 31 under the surface member 20 as well as the surface member 20 is shown in the AA line cross section and the BB line cross section.
 図5(a)に示すように表面部材20の操作面(表面)20aはX1-X2方向に向って凹曲面で形成され、Y1-Y2方向に向けて直線状で形成される。この実施形態では操作面20aの中心Oを通るY1-Y2方向の線上が最も下方に凹んでおり、中心Oを通るY1-Y2方向の線上からX1-X2方向に離れるにしたがって徐々に上方に向けて湾曲する形状で形成されている。 As shown in FIG. 5A, the operation surface (surface) 20a of the surface member 20 is formed as a concave curved surface in the X1-X2 direction and linearly formed in the Y1-Y2 direction. In this embodiment, the line in the Y1-Y2 direction passing through the center O of the operation surface 20a is recessed most downward, and gradually increases upward from the line in the Y1-Y2 direction passing through the center O in the X1-X2 direction. It is formed in a curved shape.
 図5(b)は下部電極パターン14の部分平面図である。図5(b)に示す各下部電極パターン14m~14pはいずれも同形状で形成される。操作面20aの中心Oを通るY1-Y2方向の線上に近い第1電極部48b,48c,48f,48g、48j,48k,48n,48oの電極面積は、操作面20aの中心Oを通るY1-Y2方向の線上から遠い第1電極部48a,48d,48e,48h、48i,48l,48m,48pよりも小さく形成されている。 FIG. 5B is a partial plan view of the lower electrode pattern 14. The lower electrode patterns 14m to 14p shown in FIG. 5B are all formed in the same shape. The electrode areas of the first electrode portions 48b, 48c, 48f, 48g, 48j, 48k, 48n, and 48o close to the line in the Y1-Y2 direction passing through the center O of the operation surface 20a are Y1-passing through the center O of the operation surface 20a. It is formed smaller than the first electrode portions 48a, 48d, 48e, 48h, 48i, 48l, 48m, 48p far from the line in the Y2 direction.
 図5(c)は上部電極パターン13の部分平面図である。図5(c)に示すように上部電極パターン13k~13mは複数本形成される。図5(c)に示すように、各上部電極パターン13k~13mは、X1-X2方向に間隔を空けて配置されるとともに、夫々、Y1-Y2方向に向けて延出して形成されている。操作面20aの中心Oを通るY1-Y2方向の線上に位置する上部電極パターン13lの第2電極部49f,49g,49h,49i,49jの電極面積は、操作面20aの中心Oを通るY1-Y2方向の線上から離れた上部電極パターン13k,13mの第2電極部49a,49b,49c,49d,49e,49k,49l,49m,49n,49oの電極面積よりも小さく形成されている。 FIG. 5C is a partial plan view of the upper electrode pattern 13. As shown in FIG. 5C, a plurality of upper electrode patterns 13k to 13m are formed. As shown in FIG. 5C, each of the upper electrode patterns 13k to 13m is arranged with an interval in the X1-X2 direction and is formed to extend in the Y1-Y2 direction. The electrode areas of the second electrode portions 49f, 49g, 49h, 49i, and 49j of the upper electrode pattern 13l located on the line in the Y1-Y2 direction passing through the center O of the operation surface 20a are Y1-passed through the center O of the operation surface 20a. It is formed smaller than the electrode area of the second electrode portions 49a, 49b, 49c, 49d, 49e, 49k, 49l, 49m, 49n, 49o of the upper electrode patterns 13k, 13m separated from the line in the Y2 direction.
 図5(d)は、図5(b)に示す複数本の下部電極パターン14n~14pと図5(c)に示す複数本の上部電極パターン13k~13mとを重ね合わせた部分平面図である。図5(d)に示すように、各第1電極部48a~48pと各第2電極部49a~49oとは平面視にて重ならないように配置されている。そして、図5(d)では、各下部電極パターン14m~14pの各第1電極部48a~48p、及び各上部電極パターン13k~13mの各第2電極部49a~49oの電極面積は、夫々、操作面20aとセンサ部25間の高さ方向(Z)への距離が大きいほど大きくなっている。 FIG. 5D is a partial plan view in which the plurality of lower electrode patterns 14n to 14p shown in FIG. 5B and the plurality of upper electrode patterns 13k to 13m shown in FIG. . As shown in FIG. 5D, the first electrode portions 48a to 48p and the second electrode portions 49a to 49o are arranged so as not to overlap each other in plan view. In FIG. 5D, the electrode areas of the first electrode portions 48a to 48p of the lower electrode patterns 14m to 14p and the second electrode portions 49a to 49o of the upper electrode patterns 13k to 13m are as follows. The distance between the operation surface 20a and the sensor unit 25 in the height direction (Z) increases as the distance increases.
 上記の図2~図5に示したように、操作面20aが凸曲面や凹曲面で形成されても、操作面20aとセンサ部25間の高さ方向への距離が大きくなるほど、各下部電極パターン13の各第1電極部の電極面積、及び各上部電極パターンの各第2電極部の電極面積が、夫々、大きくなっており、これにより、操作面20a全体におけるセンサ感度を従来に比べて均一化することができる。 As shown in FIGS. 2 to 5, even if the operation surface 20a is formed as a convex curved surface or a concave curved surface, each lower electrode increases as the distance in the height direction between the operation surface 20a and the sensor unit 25 increases. The electrode area of each first electrode portion of the pattern 13 and the electrode area of each second electrode portion of each upper electrode pattern are respectively increased, and thereby the sensor sensitivity in the entire operation surface 20a is compared with the conventional case. It can be made uniform.
 本実施形態では、各第1電極部における電極面積の比率、及び、各第2電極部における電極面積の比率は夫々、各電極部と前記操作面間の距離の比率に比例するように各電極部の電極面積を調整することが好適である。静電容量の大きさは、距離に反比例し、面積に比例する。よって例えば距離が2倍になれば、面積を2倍とするように各電極面積を調整することで、操作面20a全体におけるセンサ感度の均一性をより効果的に向上させることができる。 In the present embodiment, the ratio of the electrode area in each first electrode part and the ratio of the electrode area in each second electrode part are each proportional to the ratio of the distance between each electrode part and the operation surface. It is preferable to adjust the electrode area of the part. The magnitude of the capacitance is inversely proportional to the distance and proportional to the area. Therefore, for example, if the distance is doubled, the uniformity of sensor sensitivity in the entire operation surface 20a can be more effectively improved by adjusting the area of each electrode so that the area is doubled.
 また図6に示す実施形態では、表面部材20は操作面20aのみならず操作面20aと対向する裏面20bも操作面20aの形状に倣って曲面状で形成されているが、図7に示すように裏面20bは平坦面で形成されてもよい。 In the embodiment shown in FIG. 6, the surface member 20 is formed not only on the operation surface 20a but also on the back surface 20b facing the operation surface 20a in a curved shape following the shape of the operation surface 20a, as shown in FIG. Further, the back surface 20b may be formed as a flat surface.
C2、C3 静電容量
F 指
L2、L3 距離
10 入力装置
13、13a~13m 上部電極パターン
14、14a~14p 下部電極パターン
20 表面部材
20a 操作面
20b 裏面
21 上部基板
22 下部基板
25 センサ部
40、40a~40p、44a~44p、46a~46p、48a~48p 第1電極部
41、43 連結部
42、42a~42o、45a~45o、47a~47o、49a~49o 第2電極部
C2, C3 Capacitance F Finger L2, L3 Distance 10 Input device 13, 13a-13m Upper electrode pattern 14, 14a-14p Lower electrode pattern 20 Surface member 20a Operation surface 20b Back surface 21 Upper substrate 22 Lower substrate 25 Sensor unit 40, 40a-40p, 44a-44p, 46a-46p, 48a-48p First electrode portion 41, 43 Connecting portion 42, 42a-42o, 45a-45o, 47a-47o, 49a-49o Second electrode portion

Claims (3)

  1.  平面内にて交差する第1の方向と第2の方向のうち前記第1の方向に間隔を空けて形成された複数本の下部電極パターンと、前記第2の方向に間隔を空けて形成された複数本の上部電極パターンとが高さ方向に間隔を空けて配置されたセンサ部と、前記センサ部と高さ方向に対向して配置され、表面に操作面を有する表面部材と、を有して構成され、
     各下部電極パターンは夫々、複数の第1電極部が前記第2の方向に前記第1電極部よりも細い連結部を介して連設されており、
     各上部電極パターンは夫々、複数の第2電極部が前記第1の方向に前記第2電極部よりも細い連結部を介して連設されており、
     前記第1電極部と前記第2電極部とは平面視にて重ならないように配置されており、
     前記操作面は、操作体を操作面上に接触させたときの前記操作体と前記センサ部間の高さ方向への距離が前記操作体の前記操作面上での接触位置により異なるように曲面を有して形成されており、
     前記第1電極部及び前記第2電極部の各電極面積は、前記操作面と前記センサ部間の距離が大きいほど大きく形成されていることを特徴とする静電容量式の入力装置。
    A plurality of lower electrode patterns formed with a space in the first direction out of a first direction and a second direction intersecting in a plane, and formed with a space in the second direction. A plurality of upper electrode patterns spaced apart in the height direction, and a surface member disposed opposite to the sensor portion in the height direction and having an operation surface on the surface. Configured,
    Each of the lower electrode patterns has a plurality of first electrode portions connected in series in the second direction via a connecting portion that is thinner than the first electrode portion,
    Each upper electrode pattern includes a plurality of second electrode portions that are connected in the first direction via a connecting portion that is thinner than the second electrode portion,
    The first electrode part and the second electrode part are arranged so as not to overlap in plan view,
    The operation surface is curved so that a distance in a height direction between the operation body and the sensor unit when the operation body is brought into contact with the operation surface varies depending on a contact position of the operation body on the operation surface. Formed with
    The capacitance type input device, wherein each electrode area of the first electrode part and the second electrode part is formed to be larger as a distance between the operation surface and the sensor part is larger.
  2.  各第1電極部における電極面積の比率、及び、各第2電極部における電極面積の比率は夫々、各電極部と前記操作面間の距離の比率に比例している請求項1記載の静電容量式の入力装置。 The ratio of the electrode area in each 1st electrode part and the ratio of the electrode area in each 2nd electrode part are respectively proportional to the ratio of the distance between each electrode part and the said operation surface. Capacitive input device.
  3.  前記表面部材の操作面は前記第1の方向及び前記第2の方向の少なくともどちらか一方に向けて凸曲面状あるいは凹曲面状で形成されている請求項1又は2に記載の静電容量式の入力装置。 The capacitance type according to claim 1 or 2, wherein the operation surface of the surface member is formed in a convex curved surface shape or a concave curved surface shape toward at least one of the first direction and the second direction. Input device.
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CN102893244B (en) 2015-05-27
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JPWO2011142333A1 (en) 2013-07-22
KR20130018781A (en) 2013-02-25
KR101451493B1 (en) 2014-10-15

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