WO2010081137A3 - Methods and applications of non-planar imaging arrays - Google Patents

Methods and applications of non-planar imaging arrays Download PDF

Info

Publication number
WO2010081137A3
WO2010081137A3 PCT/US2010/020742 US2010020742W WO2010081137A3 WO 2010081137 A3 WO2010081137 A3 WO 2010081137A3 US 2010020742 W US2010020742 W US 2010020742W WO 2010081137 A3 WO2010081137 A3 WO 2010081137A3
Authority
WO
WIPO (PCT)
Prior art keywords
methods
applications
planar imaging
imaging arrays
array
Prior art date
Application number
PCT/US2010/020742
Other languages
French (fr)
Other versions
WO2010081137A2 (en
Inventor
Bassel De Graff
Gilman Callsen
William J. Arora
Roozbeh Ghaffari
Original Assignee
Mc10, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/575,008 external-priority patent/US9289132B2/en
Priority claimed from US12/616,922 external-priority patent/US8389862B2/en
Priority claimed from US12/636,071 external-priority patent/US8886334B2/en
Application filed by Mc10, Inc. filed Critical Mc10, Inc.
Priority to JP2011545508A priority Critical patent/JP2012515436A/en
Priority to EP10729657.6A priority patent/EP2386117A4/en
Publication of WO2010081137A2 publication Critical patent/WO2010081137A2/en
Publication of WO2010081137A3 publication Critical patent/WO2010081137A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
    • H01L25/042—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L2224/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L2224/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
    • H01L2224/241—Disposition
    • H01L2224/24135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/24137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Computer Hardware Design (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Light Receiving Elements (AREA)

Abstract

System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.
PCT/US2010/020742 2009-01-12 2010-01-12 Methods and applications of non-planar imaging arrays WO2010081137A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011545508A JP2012515436A (en) 2009-01-12 2010-01-12 Non-planar imaging array methods and applications
EP10729657.6A EP2386117A4 (en) 2009-01-12 2010-01-12 Methods and applications of non-planar imaging arrays

Applications Claiming Priority (10)

Application Number Priority Date Filing Date Title
US14414909P 2009-01-12 2009-01-12
US61/144,149 2009-01-12
US15690609P 2009-03-03 2009-03-03
US61/156,906 2009-03-03
US12/575,008 2009-10-07
US12/575,008 US9289132B2 (en) 2008-10-07 2009-10-07 Catheter balloon having stretchable integrated circuitry and sensor array
US12/616,922 2009-11-12
US12/616,922 US8389862B2 (en) 2008-10-07 2009-11-12 Extremely stretchable electronics
US12/636,071 US8886334B2 (en) 2008-10-07 2009-12-11 Systems, methods, and devices using stretchable or flexible electronics for medical applications
US12/636,071 2009-12-11

Publications (2)

Publication Number Publication Date
WO2010081137A2 WO2010081137A2 (en) 2010-07-15
WO2010081137A3 true WO2010081137A3 (en) 2010-11-04

Family

ID=42317209

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2010/020742 WO2010081137A2 (en) 2009-01-12 2010-01-12 Methods and applications of non-planar imaging arrays

Country Status (3)

Country Link
EP (1) EP2386117A4 (en)
JP (2) JP2012515436A (en)
WO (1) WO2010081137A2 (en)

Families Citing this family (53)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9119533B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
JP5646492B2 (en) 2008-10-07 2014-12-24 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． Stretchable integrated circuit and device with sensor array
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
US9123614B2 (en) 2008-10-07 2015-09-01 Mc10, Inc. Methods and applications of non-planar imaging arrays
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
EP2681538B1 (en) 2011-03-11 2019-03-06 Mc10, Inc. Integrated devices to facilitate quantitative assays and diagnostics
US9968300B2 (en) * 2011-04-07 2018-05-15 Sanovas Intellectual Property, Llc Anatomical visualization with electrically conductive balloon catheter
WO2012166686A2 (en) 2011-05-27 2012-12-06 Mc10, Inc. Electronic, optical and/or mechanical apparatus and systems and methods for fabricating same
DE112012003250T5 (en) 2011-08-05 2014-04-30 Mc10, Inc. Catheter Balloon method and apparatus using sensing elements
US9757050B2 (en) 2011-08-05 2017-09-12 Mc10, Inc. Catheter balloon employing force sensing elements
US9579040B2 (en) 2011-09-01 2017-02-28 Mc10, Inc. Electronics for detection of a condition of tissue
JP6277130B2 (en) 2011-10-05 2018-02-14 エムシーテン、インコーポレイテッド Medical device and method of manufacturing the same
US9226402B2 (en) 2012-06-11 2015-12-29 Mc10, Inc. Strain isolation structures for stretchable electronics
US9247637B2 (en) 2012-06-11 2016-01-26 Mc10, Inc. Strain relief structures for stretchable interconnects
US9295842B2 (en) 2012-07-05 2016-03-29 Mc10, Inc. Catheter or guidewire device including flow sensing and use thereof
JP2015521894A (en) 2012-07-05 2015-08-03 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． Catheter device including flow sensing
KR20150072415A (en) 2012-10-09 2015-06-29 엠씨10, 인크 Conformal electronics integrated with apparel
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
US9706647B2 (en) 2013-05-14 2017-07-11 Mc10, Inc. Conformal electronics including nested serpentine interconnects
KR20160040670A (en) 2013-08-05 2016-04-14 엠씨10, 인크 Flexible temperature sensor including conformable electronics
JP2016532468A (en) 2013-10-07 2016-10-20 エムシー１０ インコーポレイテッドＭｃ１０，Ｉｎｃ． Conformal sensor system for detection and analysis
KR102365120B1 (en) 2013-11-22 2022-02-18 메디데이타 솔루션즈, 인코포레이티드 Conformal sensor systems for sensing and analysis of cardiac activity
CN105874606B (en) 2014-01-06 2021-01-12 Mc10股份有限公司 Encapsulated conformal electronic systems and devices and methods of making and using the same
WO2015134588A1 (en) 2014-03-04 2015-09-11 Mc10, Inc. Multi-part flexible encapsulation housing for electronic devices
US9810623B2 (en) 2014-03-12 2017-11-07 Mc10, Inc. Quantification of a change in assay
US9591758B2 (en) 2014-03-27 2017-03-07 Intel Corporation Flexible electronic system with wire bonds
US20160093600A1 (en) * 2014-09-25 2016-03-31 X-Celeprint Limited Compound micro-assembly strategies and devices
US9899330B2 (en) 2014-10-03 2018-02-20 Mc10, Inc. Flexible electronic circuits with embedded integrated circuit die
US10297572B2 (en) 2014-10-06 2019-05-21 Mc10, Inc. Discrete flexible interconnects for modules of integrated circuits
USD781270S1 (en) 2014-10-15 2017-03-14 Mc10, Inc. Electronic device having antenna
US10477354B2 (en) 2015-02-20 2019-11-12 Mc10, Inc. Automated detection and configuration of wearable devices based on on-body status, location, and/or orientation
WO2016140961A1 (en) 2015-03-02 2016-09-09 Mc10, Inc. Perspiration sensor
JP6491556B2 (en) * 2015-07-09 2019-03-27 日東電工株式会社 Printed circuit board
JP6484133B2 (en) 2015-07-09 2019-03-13 日東電工株式会社 Method for manufacturing printed circuit board
US10653332B2 (en) 2015-07-17 2020-05-19 Mc10, Inc. Conductive stiffener, method of making a conductive stiffener, and conductive adhesive and encapsulation layers
US10709384B2 (en) 2015-08-19 2020-07-14 Mc10, Inc. Wearable heat flux devices and methods of use
WO2017059215A1 (en) 2015-10-01 2017-04-06 Mc10, Inc. Method and system for interacting with a virtual environment
WO2017062508A1 (en) 2015-10-05 2017-04-13 Mc10, Inc. Method and System for Neuromodulation and Stimulation
JP2017134276A (en) 2016-01-28 2017-08-03 オリンパス株式会社 Imaging device and capsule endoscope
CN108781313B (en) 2016-02-22 2022-04-08 美谛达解决方案公司 System, apparatus and method for a coupled hub and sensor node to obtain sensor information on-body
WO2017147052A1 (en) 2016-02-22 2017-08-31 Mc10, Inc. System, devices, and method for on-body data and power transmission
US10109784B2 (en) * 2016-03-01 2018-10-23 Qualcomm Incorporated Sensor device
US11154235B2 (en) 2016-04-19 2021-10-26 Medidata Solutions, Inc. Method and system for measuring perspiration
JP6630639B2 (en) 2016-07-11 2020-01-15 富士フイルム株式会社 Endoscope
US10447347B2 (en) 2016-08-12 2019-10-15 Mc10, Inc. Wireless charger and high speed data off-loader
WO2018131638A1 (en) * 2017-01-15 2018-07-19 一般財団法人 総合研究奨励会 Photodetector array
CN106901702B (en) * 2017-01-25 2020-01-03 巴龙 Quantitative pulse wave monitoring device based on flexible force sensitive sensing element
US11798901B1 (en) 2018-10-31 2023-10-24 Avery Dennison Retail Information Services Llc Wafer-scale integration with alternative technology wafer processes that can be folded into three-dimensional packaging
CN111243966B (en) * 2020-01-14 2021-11-05 联合微电子中心有限责任公司 Flexible sensor manufacturing process and flexible sensor
US11123011B1 (en) 2020-03-23 2021-09-21 Nix, Inc. Wearable systems, devices, and methods for measurement and analysis of body fluids
EP3893611A1 (en) 2020-04-07 2021-10-13 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Controlled deposition method of a donor material onto a target surface and plate therefor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060169989A1 (en) * 2003-03-28 2006-08-03 Rabin Bhattacharya Deformable organic devices
KR20070100617A (en) * 2006-04-07 2007-10-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 A stretchable form of single crystal silicon for high performance electronics on rubber substrates
WO2008143635A1 (en) * 2007-01-17 2008-11-27 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4156154B2 (en) * 1999-11-26 2008-09-24 富士フイルム株式会社 Solid-state imaging device
US6743982B2 (en) * 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
JP2002190971A (en) * 2000-12-21 2002-07-05 Olympus Optical Co Ltd Optical unit
AU2002330718A1 (en) * 2001-09-03 2003-03-18 National Microelectronic Research Centre University College Cork - National University Of Ireland Co Integrated circuit structure and a method of making an integrated circuit structure
JP2005278133A (en) * 2003-07-03 2005-10-06 Fuji Photo Film Co Ltd Solid state imaging device and optical device
EP2650907A3 (en) * 2004-06-04 2014-10-08 The Board of Trustees of the University of Illinois Methods and devices for fabricating and assembling printable semiconductor elements
JP2007266380A (en) * 2006-03-29 2007-10-11 Matsushita Electric Ind Co Ltd Semiconductor image pickup device and its manufacturing method
DE602007007201D1 (en) * 2006-04-07 2010-07-29 Koninkl Philips Electronics Nv ELASTICALLY DEFORMABLE INTEGRATED CIRCUIT
JP5578509B2 (en) * 2006-09-06 2014-08-27 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ Method for bonding stretchable components to an elastomeric substrate
JP4344760B2 (en) * 2007-06-15 2009-10-14 シャープ株式会社 Solid-state imaging device and electronic apparatus including the same
EP2255378B1 (en) * 2008-03-05 2015-08-05 The Board of Trustees of the University of Illinois Stretchable and foldable electronic devices

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060169989A1 (en) * 2003-03-28 2006-08-03 Rabin Bhattacharya Deformable organic devices
KR20070100617A (en) * 2006-04-07 2007-10-11 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 A stretchable form of single crystal silicon for high performance electronics on rubber substrates
WO2008143635A1 (en) * 2007-01-17 2008-11-27 The Board Of Trustees Of The University Of Illinois Optical systems fabricated by printing-based assembly

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2386117A4 *

Also Published As

Publication number Publication date
EP2386117A2 (en) 2011-11-16
EP2386117A4 (en) 2017-12-27
WO2010081137A2 (en) 2010-07-15
JP2016006880A (en) 2016-01-14
JP2012515436A (en) 2012-07-05

Similar Documents

Publication Publication Date Title
WO2010081137A3 (en) Methods and applications of non-planar imaging arrays
WO2010135213A3 (en) Optical members and devices employing the same
WO2011063058A3 (en) Selective wireless power transfer
GB2523933A (en) Perpendicular spin transfer torque memory (STTM) device having offset cells and method to form same
MX336050B (en) Image sensor with tolerance optimizing interconnects.
WO2010051355A3 (en) Photovoltaic cell module and method of forming
WO2012012108A3 (en) Galvanic isolation transformer
WO2008093127A3 (en) Photovoltaic cell arrays
WO2009097627A3 (en) Thin-film photovoltaic devices and related manufacturing methods
EP2682986A4 (en) Power semiconductor module, power semiconductor module manufacturing method, and power conversion apparatus
WO2015085275A3 (en) Fabrication of patterned arrays
WO2013032664A3 (en) Laminated heat sinks
WO2009081113A3 (en) Image processing
WO2011043610A3 (en) Photovoltaic power-generating apparatus and method for manufacturing same
WO2011099693A3 (en) Antenna using a ground radiator
WO2010015310A3 (en) Solar cell and method for producing a solar cell
WO2010124059A3 (en) Crystalline thin-film photovoltaic structures and methods for forming the same
EP3552242A4 (en) High performance solar cells, arrays and manufacturing processes therefor
EP2273564A3 (en) Photovoltaic device and manufacturing method thereof
WO2011028957A3 (en) Methods and devices for processing a precursor layer in a group via environment
WO2007041595A3 (en) Iii-nitride semiconductor fabrication
EP3723145A4 (en) Insulating heat-transfer substrate, thermoelectric conversion module, and method for manufacturing insulating heat-transfer substrate
WO2011032768A3 (en) Spectral purity filter, lithographic apparatus, method for manufacturing a spectral purity filter and method of manufacturing a device using lithographic apparatus
WO2008102866A1 (en) Process for producing organic electroluminescence device and organic electroluminescence device
WO2012094165A3 (en) Imaging devices, methods of forming same, and methods of forming semiconductor device structures

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 10729657

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2011545508

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 2010729657

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE