WO2010063173A1

WO2010063173A1 - Led package structure

Info

Publication number: WO2010063173A1
Application number: PCT/CN2009/072415
Authority: WO
Inventors: 黄建中
Original assignee: 弘凯光电(深圳)有限公司
Priority date: 2008-12-05
Filing date: 2009-06-24
Publication date: 2010-06-10
Also published as: JP3155112U; CN201307605Y

Abstract

A light emitting diode (LED) package structure is provided. The structure (10) comprises a carrier (11) and a light emitting chip (12) arranged on the carrier (11), the carrier (11) has a reflecting cup (14) surrounding the light emitting chip (12), and the reflecting cup (14) has concave-convex structures, the concave-convex structures surround the light emitting chip(12). The structure can enhance adhesiveness between glue and the reflecting cup, protect effectively the light emitting chip from moisture, and increase its lifetime.

Description

Instruction manual

LED package structure

Technical field

[1] The utility model relates to a light-emitting component, in particular to an LED package structure.

Background technique

[2] LED (Light Emitting

Diode), a light-emitting diode, is a semiconductor solid-state light-emitting device. It uses a solid semiconductor chip as a luminescent material. When a forward voltage is applied to both ends, a small number of interceptors in the semiconductor recombine with the majority of the interceptors, releasing excess energy to cause photon emission, directly emitting red, orange, yellow, green, cyan, blue, purple, white light. . LED light sources are widely used due to their high energy efficiency, long life and environmental protection. In fact, since the advent of LEDs, LEDs have become more and more widely used. The advantages of environmental protection and energy saving make LEDs one of the main lighting sources in the 21st century.

[3] In order to gain a foothold in the lighting market, white LEDs of different package types are constantly appearing on the market.

. With the large number of LED applications, the demand for LEDs is increasing, and LED displays are receiving more and more attention as applications meet. However, how to improve the moisture resistance of LEDs and how to solve them becomes an important issue.

[4] The conventional LED lighting structure includes a bracket and a light emitting chip, and the bracket has a reflecting cup, and the light emitting chip is disposed in the reflecting cup of the bracket. Usually, after the light-emitting diode of this structure is used as a display screen or an illumination source, the environment of the display or the illumination source may be relatively humid, such as an outdoor display or an illumination source, especially in a harsh environment such as rain. In this way, moisture will invade the inside of the LED along the curved surface of the reflector cup, affecting the service life of the LED and even causing the LED to fail.

Disclosure of invention

technical problem

[5] In view of the above, it is necessary to provide an LED package structure that can effectively prevent moisture from intruding into the light-emitting chip.

Technical solution

[6] An LED package structure comprising a carrier and a light-emitting chip disposed on the carrier, the carrier having a reflective cup surrounding the light-emitting chip, the reflective cup having a concave-convex structure, the concave-convex structure surrounding The periphery of the light emitting chip.

Beneficial effect

Compared with the prior art, the LED package structure is provided with a concave-convex structure in the reflective cup, and the concave-convex structure surrounds the periphery of the light-emitting chip, thereby effectively preventing moisture from invading into the vicinity of the light-emitting chip. Moreover, the relief structure increases the path of moisture entering the interior of the LED, and also enhances the bonding force of the glue and the reflector cup, i.e., increases the resistance of moisture entering the interior of the LED, so that the LED package structure has an excellent moisture barrier function. DRAWINGS

1 is a schematic cross-sectional view showing an LED package structure according to a first embodiment of the present invention.

2 is a top plan view of the LED package structure of FIG. 1.

3 is a bottom view of the LED package structure of FIG. 1.

4 is a cross-sectional view showing the structure of an LED package provided by a second embodiment of the present invention.

Fig. 5 is a schematic cross-sectional view showing an LED package structure having a similar structure of Fig. 4, showing a square groove.

Fig. 6 is a schematic cross-sectional view showing an LED package structure having a similar structure of Fig. 4, showing a V-shaped groove.

7 is a schematic cross-sectional view showing an LED package structure according to a third embodiment of the present invention.

Figure 8 is a schematic cross-sectional view of an LED package structure having a similar structure of Figure 7, showing two square slots. Figure 9 is a schematic cross-sectional view of an LED package structure having a similar structure of Figure 7, showing two V-shaped grooves.

FIG. 10 is a cross-sectional view showing the LED package structure according to the fourth embodiment of the present invention.

Figure 11 is a top plan view of the LED package structure of Figure 10.

Figure 12 is a bottom plan view of the LED package structure of Figure 10.

Figure 13 is a schematic cross-sectional view showing an LED package structure having a similar structure of Figure 10, showing a groove which is inclined toward the outer wall of the light-emitting chip.

Figure 14 is a cross-sectional view showing the structure of the LED package having the similar structure of Figure 13, showing the groove as a V-shaped groove. Figure 15 is a schematic cross-sectional view showing an LED package structure having a similar structure as that of Figure 13, showing a concave-convex structure having two trapezoidal grooves.

Figure 16 is a schematic cross-sectional view showing an LED package structure having a similar structure of Figure 15, showing a concave structure having two square grooves.

Figure 17 is a cross-sectional view showing the LED package structure having a similar structure of Figure 15, showing the concave-convex structure of two V-shaped grooves. FIG. 18 is a cross-sectional view showing the LED package structure according to a fifth embodiment of the present invention.

Figure 19 is a schematic cross-sectional view of an LED package structure having a similar structure of Figure 18, showing the relief structure including steps and two recesses respectively on the outer and inner sidewalls of the reflector cup, and the phosphor chip is covered with a fluorescent gel.

20 is a schematic cross-sectional view of an LED package structure having a similar structure of FIG. 18, showing that the uneven structure includes steps and a recess respectively on the outer side wall and the inner side wall of the reflective cup, and the fluorescent chip is not covered on the light emitting chip.

Figure 21 is a schematic cross-sectional view of an ED package structure having a similar structure of Figure 20, showing the relief structure including steps and two recesses respectively on the outer and inner sidewalls of the reflector cup.

22 is a schematic cross-sectional view of an LED package structure having a similar structure of FIG. 9, showing that the package is a lens formed by molding or molding.

23 is a schematic cross-sectional view of an LED package structure having a similar structure of FIG. 21, showing the package being a lens formed by molding or molding.

BEST MODE FOR CARRYING OUT THE INVENTION

The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It is understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

Referring to Figures 1, 2 and 3, an LED package structure 10 according to a first embodiment of the present invention is shown. The LED package structure 10 includes a carrier 11, a light emitting chip 12, and a reflective cup 14 disposed on the carrier 11. The carrier 11 and the reflector cup 14 are separate structures which can be joined, for example, by a high temperature glue. The light-emitting chip 12 is disposed at an intermediate portion of the surface of the carrier 11, and the reflective cup 14 surrounds the light-emitting chip 12. Concave cup 14 has a concave-convex structure

The concave-convex structure surrounds the periphery of the light-emitting chip 12, that is, the concave-convex structure has an annular structure.

[33] The carrier 11 has a wiring layer for electrically connecting to the light-emitting chip 12. The material of the carrier 11 may be selected from a metal, a metal alloy or a ceramic material. The material of the reflector cup 14 may be selected from metals, metal alloys, high thermoplastic materials or ceramic materials.

The concave-convex structure of the embodiment is disposed on the inner side surface of the reflector cup 14, and includes two steps 16 surrounding the periphery of the light-emitting chip 12, wherein the upper step is provided with a lens 18, and the lens 18 The light-emitting chip 12 is packaged together with the reflective cup 14 and the carrier 11. The lens 18 shown in Fig. 1 is in the shape of a convex lens to have a good illumination angle and to adjust the angle according to different requirements. Lens 18 can be used as a luminescent core The package of the sheet 12, the lens 18 can be separately fabricated, and then the formed lens 18 is placed on the step 16. The connecting wall 162 between the two steps 16 is an inclined wall having a sloped surface, which may be a bright surface that is brightened to make it a bright surface to improve light extraction efficiency. When part of the light emitted by the light-emitting chip 12 is incident on or reflected to the inclined surface, it can be reflected through the inclined surface to effectively guide the light emitted by the light-emitting chip 12 to the reflecting cup, improve the light-emitting efficiency, and change the light-emitting angle. The bevels mentioned below can be treated with similar glossy surfaces and have the same effect.

[35] A white light ray is formed, and the light-emitting chip 12 is covered with a fluorescent gel 17, which covers at least the entire light-emitting chip 12. A layer of transparent glue 182 is also filled between the fluorescent glue 17 and the lens 18 to bond the two.

[36] As shown in FIG. 2, the outer dimension of the reflector cup 14 is smaller than the outer dimension of the carrier 11, that is, at least two end portions of the carrier 11 protrude outside the reflector cup 14 without being covered by the reflector cup 14, at the both ends. The positive and negative pins 13 are respectively provided in the part. As shown in FIG. 3, positive and negative electrode lead pads 15 are provided on the bottom surface 110 of the carrier 11 corresponding to the positive and negative electrode pins 13, and the positive and negative electrode pins 13 are respectively electrically connected to the positive and negative electrode lead pads 15, for example, The vias are electrically connected through the carrier 11. In addition, a heat dissipation pad 19 is further disposed on the bottom surface 110 of the carrier 11 for soldering with the heat sink to derive heat and heat generated by the light emitting chip 12.

[37] In the LED package structure 10, when it is in a wet or rainy environment, the uneven structure, the two-stage step 16 in FIG. 1 can increase the bonding force between the lens 18 and the transparent adhesive layer 182 and the reflective cup 44, and The extended moisture can be invaded into the vicinity of the light-emitting chip 12 by the external bonding surface of the colloid and the reflective cup, thereby effectively preventing moisture from entering the vicinity of the light-emitting chip 12, thereby improving the service life of the light-emitting diode.

Please refer to FIG. 4, which shows an LED package structure 20 according to a second embodiment of the present invention. The LED package structure 20 has substantially the same structural composition as the LED package structure 10 of the first embodiment, except that the uneven structure of the L ED package structure 20 includes at least one step 26 and at least one recess 28. The same structures in Fig. 4 and those in Figs. 1-3 are denoted by the same reference numerals and will not be described again. The relief structure shown in Fig. 4 includes a step 26 and a recess 28. Of course, two or more steps 26 and/or two or more recesses 28 can be used in practical applications. The step 26 is located above the recess 28 on which the lens 18 is supported.

As shown in FIG. 4, the groove 28 can be regarded as a trapezoidal groove, and the inner side surface 281 of the groove 28 facing the central axis of the reflector cup 14 is a sloped surface, which can reflect light, improve light extraction efficiency, and change the light exit angle. The groove wall 282 near the light-emitting chip 12 is a straight wall. The upright groove wall 282 can also be regarded as a convex ring extending axially along the reflective cup 14. The groove wall 282 defines a filling gel or transparent colloid. Space. Making white In the aperture defined by the groove wall 282 of the convex ring, the fluorescent glue 17 is filled, and the fluorescent glue 17 can effectively cover the light-emitting chip 12 through the groove wall 282, so that the phosphor is effectively excited and the light spot is uniform. Moreover, in the production of the white light enamel, since the fluorescent rubber 17 is covered only in the groove wall 282, the entire inner space of the reflective cup 14 is prevented from covering the fluorescent rubber 17, thereby reducing the amount of the phosphor, and the cost can be saved. Of course, other colors such as a monochromatic light source can also be fabricated. Therefore, the space defined by the groove wall 282 is filled with a transparent colloid, and the transparent colloid can further extend to fill the inner space of the entire reflective cup 14.

[40] The groove 28 may be square or V-shaped in addition to the trapezoidal shape of the trapezoid. Fig. 5 shows a square groove 28a, that is, the groove walls on both sides of the square groove 28a are straight walls, wherein the straight wall 282a near the light-emitting chip 12 can be regarded as a convex ring. This collar has the same function as the slot wall 282 of the second embodiment. Fig. 6 shows a V-shaped groove 28b, that is, the inner side surface of the V-shaped groove 28b is a sloped surface, and the V-shaped groove 28b is inclined toward the central axis of the reflecting cup 14 or the groove outer side surface 282b of the light-emitting chip 12, and these inclined surfaces are It can reflect light, improve light extraction efficiency, and change the angle of light.

Please refer to FIG. 7, which is an LED package structure 30 according to a third embodiment of the present invention. The LED package structure ₃₀ has substantially the same structural composition as the LED package structure 20 of the second embodiment, except that the uneven structure of the L ED package structure 30 includes a step 36, a first recess 38, and a second recess 39. The same structures in Fig. 7 and Fig. 4 are denoted by the same reference numerals and will not be described again.

[42] The step 36, the first groove 38 and the second groove 39 are sequentially disposed from the outside to the inside, or sequentially arranged from the top to the bottom in the order of the inner side of the reflecting cup 14. A lens 18 enclosing the light-emitting chip 12 is supported on the step 36. The two grooves 38 and 39 are engaged with each other. The two grooves 38 and 39 shown in Fig. 7 are trapezoidal grooves, and the grooves 38 and 39 face the inner side of the central axis of the reflecting cup 14 are inclined surfaces, and the light can be appropriately reflected. , improve light extraction efficiency, and change the angle of light. The groove 39 of the second groove 39 adjacent to the light-emitting chip 12 is a straight wall, and the up-and-down groove wall 392 can also be regarded as a convex ring extending along the axial direction of the reflector cup 14. This convex ring has the same function as the groove wall 282 of the second embodiment.

[43] The grooves 38 and 39 may be square or V-shaped in addition to the trapezoidal shape of the trapezoid. 8 shows square grooves 38a and 39a, that is, the groove walls on both sides of the square grooves 38a and 39a are straight walls, wherein the straight walls of the square grooves 38a and 39a adjacent to the light-emitting chip 12 can be regarded as a convex ring, respectively. Thus there are two convex rings 382a and 392a in Figure 8. Each of the collars has the same function as the slot wall 282 of the second embodiment. Figure 9 shows the V-shaped grooves 38b and 39b, i.e., the inner sides of the grooves of the V-shaped grooves 38b and 39b are both inclined, and the V-shaped groove 39b faces the central axis of the reflecting cup 14. Alternatively, the groove outer side surface 392b of the light-emitting chip 12 is a sloped surface, thereby reflecting light, improving light extraction efficiency, and changing the light exit angle. The two V-shaped grooves 38b and 39b are engaged to form a zigzag groove structure, or may be two or more grooves, and form a multi-toothed zigzag groove structure, which has better moisture-proof effect.

Referring to FIG. 10, an LED package structure 40 according to a fourth embodiment of the present invention is shown. The LED package structure 40 includes a light-emitting chip 12, a carrier 41 as an integral structure, and a reflective cup 44. The carrier 41 and the reflector cup 44 are integrally formed. The light-emitting chip 12 is disposed at an intermediate portion of the carrier 41, and the reflective cup 44 surrounds the light-emitting chip 12, and the reflective cup 44 has a concave-convex structure. The relief structure in Fig. 10 is a groove 48, such as a square groove. That is, the groove wall 482 of the groove 48 adjacent to the light-emitting chip 12 is a straight wall, and the upright groove wall 482 can also be regarded as a convex ring extending axially along the reflection cup 44. This collar has the same function as the slot wall 282 of the second embodiment.

[45] There are two slots 43 on the carrier 41, which are respectively located at two sides of the light-emitting chip 12 and extend to the side of the carrier 41. Each slot ₄₃ receives a pin ₄₅ , which is terminated at 45-end. The chip 12 is electrically connected, and the other end extends to the bottom surface of the carrier 41. As shown in Figs. 11 and 12, a portion exposed outside the carrier 41 is covered with a pad 42 for electrically connecting the pin 45 to an external circuit. The carrier 41 has an opening 46 corresponding to the light-emitting chip 12, and a heat sink 47 is disposed therein. The light-emitting chip 12 is disposed on the top surface of the heat sink 47. The bottom surface of the heat sink 47 is provided with a heat dissipation pad 49 for connection with the secondary heat sink to dissipate heat.

[46] The middle hole of the reflector cup ₄₄ is filled with a colloid. When a white light source is fabricated, the colloid is a fluorescent glue; when a color or monochromatic light source is produced, the colloid is a transparent glue. The colloid may be filled in the intermediate hole of the reflector cup 44 by dispensing, or may be formed by molding or molding.

The groove 48 shown in Fig. 10 is square, and the groove wall is also a straight wall. In other embodiments, a trapezoidal groove or a V-shaped groove may be used, and the groove wall may be a straight wall or an inclined wall. For example, Fig. 13 shows that the groove wall is a groove 48a having a slanted wall, and other structures are the same as those of Fig. 10. Specifically, the groove 48a of Fig. 13 is inclined toward the central axis of the reflecting cup 44 or the groove outer side surface 482a of the light-emitting chip 12, thereby reflecting light, improving light-emitting efficiency, and changing the light-emitting angle.

[48] The structure of FIG. 14 is again substantially similar to the structure of FIG. 13, except that the concave-convex structure uses a V-shaped groove 48b, that is, the two opposite groove inner sides of the V-shaped groove 48b are inclined, and The V-shaped groove 48b faces the central axis of the reflector cup 44 or the groove outer side surface 482b of the light-emitting chip 12 is also a sloped surface, thereby reflecting light together

, improve light extraction efficiency, and change the angle of light. [15] Figure 15-17 shows the concave and convex structure using two grooves. The other structures are basically similar to the structure of Figure 10. The same structures in the figures are labeled with the same reference numerals. . As shown in FIG. 15, the two grooves are a square groove 57a and a trapezoidal groove 57b, respectively, wherein the two grooves 57 are close to the light-emitting chip 12, which faces the central axis of the reflective cup 44 or the groove inner side surface 571b of the light-emitting chip 12 and the outside of the groove. The side surface 572b is also a beveled surface, thereby reflecting light together, improving light extraction efficiency, and changing the light exit angle.

[50] As shown in FIG. 16, both grooves are square grooves 58a and 58b, and the groove walls of the square grooves 58a and 58b are straight walls, which can be regarded as a convex ring extending along the axial direction of the reflection cup 44. . This convex ring has the same function as the groove wall 2 82 of the second embodiment.

[51] As shown in Fig. 17, both grooves are V-shaped grooves 59a and 59b, and the inner side faces of each of the V-shaped grooves 59a and 59b are inclined, and the V-shaped grooves 59a and 59b are directed toward the reflecting cup 44. The central axis or the inner and outer sides of the groove of the light-emitting chip 12 are inclined surfaces, thereby reflecting light together, improving light extraction efficiency, and changing the light exit angle.

Referring to FIG. 18, an LED package structure 60 according to a fifth embodiment of the present invention is shown. The LED package structure 60 is substantially similar to the LED package structure 40 of the fourth embodiment, except that the concave and convex structure of the LED package structure 60 is disposed on the outer side surface of the reflective cup 44, and the reflective cup 44 is covered with the encapsulant 62, colloid. 62 The material can be transparent glue. The same structures in Fig. 18 and Fig. 10 are denoted by the same reference numerals and will not be described again. The concave-convex structure in Fig. 18 is a step 68. Of course, it may be a step of two steps or more, depending on actual needs. Moreover, the concave-convex structure disposed on the outer side wall of the reflector cup 44 may also be a groove, such as a square groove, a trapezoidal groove, a V-shaped groove, or may be two grooves or more grooves. The colloid 62 covers not only the entire reflector cup 44 but also the intermediate hole of the reflector cup 44. If it is necessary to make a white light source, it is necessary to first cover the light-emitting chip 12 with a fluorescent glue, for example, by dispensing. Among them, the uneven structure provided on the outer side wall can increase the bonding force between the colloid 62 and the reflective cup 44, and can lengthen the path from the outside to the light-emitting chip 12, thereby effectively preventing moisture from entering the vicinity of the light-emitting chip 12. Moreover, by the outer covering of the glue 62, the light-emitting chip 12 and the reflective cup 44 can be further isolated from the wet or humid environment.

Referring to FIG. 19, an LED package structure 70 according to a sixth embodiment of the present invention is shown. The LED package structure 70 is substantially similar to the LED package structure 60 of the fifth embodiment, except that the relief structure of the LED package structure 70 includes steps 75 and two recesses respectively disposed on the outer and inner sides of the reflective cup 44. In the grooves 78a and 78b, the fluorescent material 76 is accommodated in the middle hole of the reflecting cup 44. Figure 19 and Figure 18 are the same structure used in Figure 18 The same reference numerals are not mentioned here. The two grooves 78a and 78b in Fig. 19 are similar to the square groove 57a and the trapezoidal groove 57b in Fig. 15. The phosphor 76 is filled to the top surface of the reflector cup 44. The phosphor 76 is covered with an encapsulant 72 that encapsulates the reflector cup 44 therein, similar to the encapsulant 62 of FIG. Through the inner and outer steps and grooves, the path of moisture to the vicinity of the vicinity of the light-emitting chip 12 can be further increased, and the moisture-proof function of the LED can be enhanced.

In addition, the concave-convex structure may be disposed on the top surface of the reflective cup 44 in addition to the inner and outer side surfaces of the reflective cup 44, for example, directly forming a groove on the top surface.

The LED package structure of FIG. 20 is similar to the structure of FIG. 18 except that the uneven structure of the LED package structure of FIG. 20 includes steps 86 and recesses respectively provided on the inner side and the outer side of the reflective cup 44. The groove 88, the groove 88 is illustrated as a square groove, and may of course be a V-shaped or trapezoidal groove or the like. The groove 88 faces the central axis of the reflector cup 44 or the groove outer side surface 882 of the light-emitting chip 12 is a sloped surface, thereby reflecting light and improving luminous efficiency.

The LED package structure in FIG. 21 is similar to the structure of FIG. 20, except that the concave-convex structure of the LED package structure in FIG. 21 includes two grooves 88a and 88b in addition to the side steps. They are all square grooves, and of course they can also be V-shaped or trapezoidal grooves. The groove wall of the groove 88b adjacent to the light-emitting chip 12 is a straight wall, and the straight wall can also be regarded as a convex ring extending axially along the reflection cup 44. This convex ring has the same function as the groove wall 282 of the second embodiment.

Figure 22 shows an LED package structure according to a seventh embodiment of the present invention. The LED package structure has a structure similar to that of Figure 9, wherein the package of the light-emitting chip 12 is a lens 18, except that the lens 18 is The fluorescent colloid 17 is in contact. The same structures in Fig. 22 and Fig. 9 are denoted by the same reference numerals and will not be described again. In addition, the lens 18 can be formed by molding or molding. For example, after the two V-shaped grooves 38b and 39b are formed, the fluorescent colloid is covered on the light-emitting chip 12 by dispensing, and then These semi-finished structures are transferred into a mold, and the lens 18 is encapsulated on the light-emitting chip 12 by molding or molding. Of course, it is also possible to use the previously separately molded lens 18, and then place the formed lens 18 on the light emitting chip 12.

23 shows an LED package structure according to an eighth embodiment of the present invention. The LED package structure has a structure similar to that of FIG. 21, except that in FIG. 23, the package of the light-emitting chip 12 is in the shape of a lens. The encapsulant 72a, the encapsulant 72a is overlaid on the light-emitting chip 12, and is also formed by molding or molding. The encapsulant 72a further encapsulates the reflective cup 44 therein to further extend moisture to the hair The path near the optical chip 12 enhances the moisture-proof function of the LED.

The LED package structure of the above embodiments of the present invention is provided with a concave-convex structure on the reflective cup, and the concave-convex structure surrounds the periphery of the light-emitting chip 12, thereby effectively preventing moisture from entering the vicinity of the light-emitting chip 12. Moreover, the relief structure increases the path of moisture entering the interior of the LED, and also enhances the bonding force of the glue and the reflector cup, i.e., increases the resistance of moisture entering the interior of the LED, so that the LED package structure has an excellent moisture barrier function.

The above is only the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalents, and improvements made within the spirit and principles of the present invention should be It is included in the scope of protection of the present invention.

Claims

Claim

An LED package structure comprising a carrier and a light-emitting chip disposed on the carrier, the carrier having a reflective cup surrounding the light-emitting chip, wherein the reflective cup has a concave-convex structure, and the concave-convex structure surrounds The periphery of the light emitting chip.

The LED package structure according to claim 1, wherein said uneven structure comprises a plurality of stages.

The LED package structure according to claim 1, wherein the uneven structure comprises a groove. The LED package structure according to claim 3, wherein the groove comprises a square groove, a V-shaped groove, a zigzag groove or a trapezoidal groove.

The LED package structure according to claim 3, wherein the groove comprises one, two or more grooves.

The LED package structure according to claim 3, wherein the groove inner side surface and/or the groove outer side surface are inclined surfaces.

The LED package structure according to claim 3, wherein the groove wall of the groove adjacent to the light emitting chip is a straight wall or an inclined wall, and the groove is adjacent to the groove wall of the light emitting chip to define a fluorescent glue or a transparent The space of the colloid, the fluorescent glue or transparent colloid covers the light emitting chip.

The LED package structure according to claim 1, wherein the uneven structure is provided on an inner side surface, a top surface or an outer side surface of the reflecting cup.

The LED package structure according to claim 1, wherein the uneven structure is provided on an inner side surface of the reflecting cup, and the inner side surface is a sloped surface.

The LED package structure according to claim 1, wherein the carrier has a through hole corresponding to a position of the light emitting chip, a heat sink is accommodated in the opening, and the light emitting chip is disposed on a top of the heat sink The carrier has a slot, and the slot receives a pin electrically connected to the light emitting chip.