WO2010034820A1 - Rfid transponder antenna - Google Patents

Rfid transponder antenna Download PDF

Info

Publication number
WO2010034820A1
WO2010034820A1 PCT/EP2009/062463 EP2009062463W WO2010034820A1 WO 2010034820 A1 WO2010034820 A1 WO 2010034820A1 EP 2009062463 W EP2009062463 W EP 2009062463W WO 2010034820 A1 WO2010034820 A1 WO 2010034820A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
carrier substrate
conductor
transponder antenna
rfid transponder
Prior art date
Application number
PCT/EP2009/062463
Other languages
German (de)
French (fr)
Inventor
Robert Semar
Michael Schaefer
Marco Wagner
Henry Prescher
Original Assignee
Ksw Microtec Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ksw Microtec Ag filed Critical Ksw Microtec Ag
Priority to MX2011003156A priority Critical patent/MX2011003156A/en
Priority to EP09783437.8A priority patent/EP2338207B1/en
Priority to US13/120,726 priority patent/US8917219B2/en
Priority to BRPI0919849-0A priority patent/BRPI0919849B1/en
Publication of WO2010034820A1 publication Critical patent/WO2010034820A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar

Definitions

  • the invention relates to a transponder antenna, in particular for use in RFID (Radio Frequency Identification) transponders, which usually have an antenna arranged on a carrier substrate or in a housing and an integrated circuit connected to the antenna, usually in the form of a semiconductor component.
  • RFID Radio Frequency Identification
  • a battery is additionally provided for the power supply.
  • Transponders wherein for RF transponders usually flat coil antennas (so-called loop antennas) are used.
  • antenna structures through additive process (eg, by printing) or by subtractive process (for example, selectively etching a metal layer) on a non-conductive carrier substrate manufacturing, the antenna is, however, usually two parts being ⁇ leads.
  • the coil turns can be arranged on a first side of the carrier substrate and a bridge crossing the coil turns, the two ends of the bridge passing through the carrier substrate with one end of the conductor track forming the coil turns on the one hand and a contact terminal for the bridge
  • the connection of the integrated circuit can be electrically connected. This can be done for example by vias or by mechanical bonding, eg embossing. In mechanical bonding (embossing) the non-conductive carrier substrate is perforated locally so that an electrical contact between the two on each side of the support substrate in this area is formed on ⁇ parent conductor track structures.
  • the bridge can also be arranged on the same side of the Suvbs ⁇ trats as the conductor turns forming the conductor track. If the bridge is to be applied directly in an additive process, the electrical insulation between the coil windings and the bridge must also be ensured here. This can be done, for example, that the area in which the bridge is to cross the coil turns, is first overprinted with an insulating paste and only then a the conductor forming path forming the bridge is printed.
  • the bridge can also be produced with the aid of an additional auxiliary substrate.
  • a conductor which is to form the bridge later, applied to the auxiliary substrate, for example by printing with a conductive paste.
  • the auxiliary substrate is placed upside down on the carrier substrate, so that the conductor path forming the bridge crosses the coil turns.
  • the two ends of the bridge with one end of the coil turns forming trace on the one hand and a contact terminal for the connection of the integrated circuit ⁇ circuit on the other hand electrically connected. This can be done crizspielswei ⁇ se by ultrasonic welding.
  • an insulating layer must be provided between the interconnect forming the bridge on the auxiliary substrate and the interconnect forming the coil turns on the carrier substrate, which insulation layer can be produced, for example, by printing with an insulating paste.
  • the insulating layer can be arranged on the carrier substrate, either on the auxiliary substrate or on the carrier substrate, before application of the auxiliary substrate, for example by printing with an insulating paste.
  • an RFID transponder antenna with a carrier substrate and an auxiliary substrate, wherein on the carrier substrate, a contact pad for a first terminal of an integrated circuit and at least two Spulenwin ⁇ tions forming first interconnect structure are arranged, the first end of a contact terminal for a second terminal of the integrated circuit forms and the other end forms a connection point for electrical connection to a second conductor track, and wherein on the auxiliary substrate, a second conductor track is arranged, which forms a bridge over the Spulenwindun ⁇ gen and whose one end to the contact pad and their the other end is electrically connected to the junction, proposed at least one between the two ends of the
  • Auxiliary substrate lying location a permanent connection between auxiliary substrate and / or first conductor on the one hand and support ⁇ substrate and / or second conductor to provide the other.
  • a contact island in the above sense is to be understood as meaning a conductive housing which on the one hand has a contact terminal for the first connection of the integrated circuit and, on the other hand, a connection point for the second interconnect.
  • splits Accordingly, by this term both embodiments includes, where a compact material island simultaneously allow the connection of the integrated circuit and the second conductor track, as well as conductor tracks having two ends, one of which as a contact terminal for the first terminal of the inte ⁇ th circuit and the other serves as a connection point for acting as a bridge second conductor.
  • a larger distance between the bridge and the integrated circuit can be realized than in the first-mentioned embodiment.
  • the chip landing pad is thus not coupled to the proximity to the bridge.
  • Cohesive compounds are compounds in which the connection partners are held together by atomic or molecular forces. They are at the same time non-releasable compounds that can be separated only by destruction of the connecting means, and can be produced, for example, by soldering, welding, gluing, vulcanization, etc.
  • the proposed RFID transponder antenna is characterized in that the auxiliary substrate is also mechanically connected to the carrier substrate between the two electrical connections to the contact pad and to the connection point.
  • this connection which is arranged in the region between the two electrical connection points of the auxiliary substrate to the carrier substrate and may be point ⁇ shaped or flat, it is forced that both substrates behave similarly in the case of bending stresses, so that a detachment of the bridge and so that the damage or destruction of the antenna is prevented.
  • At least one support structure is arranged on the carrier substrate, wel ⁇ che is materially connected to the second conductor track.
  • a support structure is intended to each alleged on the carrier substrate avenge be understood structure that is adapted to receive a material ⁇ positive connection between auxiliary substrate and / or the first Lei ⁇ terbahn one hand and the carrier substrate and / or second conductor track on the other hand.
  • the support structure can be a material island arranged between two adjacent coil windings, which consists of the same material as the first conductor track and was produced at the same time.
  • a material island that is, a sheet-like structure from the same metallic conductive paste printed become.
  • the distance of the adjacent coil turns to each other may be larger than usual to make the space required for the material island.
  • several such islands of material can be arranged to increase the strength of the permanent connection.
  • the connection between the material island and the second conductor can be carried out by known methods, for example by ultrasonic welding, bonding with a non-conductive adhesive, etc., so that a permanent connection is created at the location of the material island.
  • At least one Verbin ⁇ extension element is disposed between the support substrate and the auxiliary substrate cohesively on the one hand with the carrier ⁇ substrate and / or the first conductor track and on the other hand, with the auxiliary substrate and / or the second conductor track ver ⁇ is bound.
  • each Zvi ⁇ rule auxiliary substrate and the carrier substrate arranged structure ver ⁇ were should in this case be suitable to simultaneously enter into a stoffschlüssi ⁇ ge connection with the auxiliary substrate and / or the first conductor track on the one hand and the carrier substrate and / or the second conductor track on the other hand ,
  • the connection element unlike the above-described support structure, not a fixed manner to the carrier substrate composites ⁇ nes element but an element disposed between the carrier substrate with the first interconnect and the auxiliary substrate with the second conductor track introduced and then materially connected to these.
  • the connecting element may in turn be punctiform, as the material island described above.
  • an adhesive may be applied point-like, then placed the auxiliary substrate on the carrier substrate and the first conductive pattern of the auxiliary substrate are electrically connected at their both ends to the junction of the first conductor track and the contact pad.
  • the spacing of the adjacent coil windings from one another may be greater than usual in order to provide the space required for the point-shaped connection element. If at least one of the two tracks is not covered by an insulating layer in any other way, then a non-conductive adhesive must be used.
  • the connecting element can be made flat.
  • the planar connection element is placed between the auxiliary substrate and the carrier substrate and then the first conductor track of the auxiliary substrate is electrically connected at its two ends to the connection point of the first conductor track and the contact pad. If at least one of the two strip conductors is not already covered in any other way with an insulating layer, the flat connection element must be nonconductive.
  • the planar connecting element may be, for example, a thermop ⁇ elastic plastic film.
  • the connecting element is only so large that it electrically insulates the covering area between the carrier substrate and auxiliary substrate, for example by placing a plastic film between the auxiliary substrate and the carrier substrate whose size approximately corresponds to that of the auxiliary substrate.
  • the connecting element is larger than the carrier substrate, wherein the carrier substrate protruding portions of the connecting element with two reinforcing layers are materially ⁇ conclusively covering the carrier substrate with the auxiliary substrate and the connecting element of one side, and wherein the two Ends of the second conductor are electrically connected to the first end of the first conductor and the contact pad through the connecting element.
  • the carrier substrate protruding portions of the connecting element with two reinforcing layers are materially ⁇ conclusively covering the carrier substrate with the auxiliary substrate and the connecting element of one side, and wherein the two Ends of the second conductor are electrically connected to the first end of the first conductor and the contact pad through the connecting element.
  • this antenna has the connecting element credit card format and thus projects beyond the carrier substrate, so that via the carrier ⁇ substrate protruding portions of the connecting member may be the same ⁇ time serve to connect the outer card layers together, for example by placing in a laminating a cohesive connection between the Connecting element and two outer card layers is made.
  • FIG. 3 shows an RFID transponder antenna according to exemplary embodiment 2.
  • FIG. 4 shows an RFID transponder antenna according to exemplary embodiment 3.
  • a known RFID transponder antenna is shown in which on a carrier substrate 11, a first conductor 12 with a connection point 14 which forms a plurality of coil turns, and a contact pad 15, one end of a Wegsstel ⁇ le 14 forms and the other end a contact terminal 13 forms an integrated circuit, are arranged. Between the two connection points 14, the arranged on an auxiliary substrate 21 second conductor 22, the ends of which is electrically connected to the two connection points 14 extends.
  • the cross-sectional illustration shows the welding elements 5 of a device for ultrasonic welding, which generate the electrical contact at these points.
  • an insulating ⁇ layer 23 is arranged so that the coil turns of the first Lei ⁇ terbahn 12 are not shorted by the second conductor 22.
  • a support structure 31 in the form of a metal island is arranged between these adjacent coil windings, which is connected to the second conductor track 22 by ultrasonic welding by means of additional welding elements 5. Since the support structure 31 has no connection to the first conductor track 12 and the second conductor track 22 is covered by insulating layers 23 in the region between the connections to the connection point 14 of the first conductor track 12 and the contact island 15 and the support structure 31, no short circuiting of the coil windings can occur ⁇ hen.
  • auxiliary substrate 21 and the carrier substrate 11 are arranged together between two reinforcing layers 4, which are provided at their inwardly facing sides with an adhesive.
  • the electrical ⁇ cal contact between the connecting point 14 and the contact in ⁇ sel 15 with the first wiring 12 is achieved in that the carrier substrate 11 and the auxiliary substrate 21 are pressed together by the effect were reinforce-. 4
  • the additional material ⁇ positive connection between the carrier substrate 11 and the auxiliary substrate 21 is produced in that a sheet-like connection ⁇ element 32 is provided, which is applied in the form of a layer of pronouncelei ⁇ tendem adhesive on the second conductor track 21st
  • the embodiment 3, shown in Fig. 4, shows an RFID tag antenna in which the auxiliary substrate 21 and the support substrate 11 laminated together by heat ⁇ the.
  • the auxiliary substrate 21 and the carrier substrate 11 are the same size, that is, the auxiliary substrate 21 completely covers the carrier substrate 11.
  • Carrier substrate 11 is a flat connecting element 32 angeord ⁇ net, which in this case is a thermoplastic film, which has the same size as the auxiliary substrate 21 and the carrier substrate 11 and in those areas in which an electrical contact of the second conductor 22 to the connection point 14th the first conductor 12 and the contact pad 15 is to be produced, from ⁇ sections. Is formed by laminating a Stoffschlüs ⁇ fitting connection between the connecting member 14 and the carrier Substrate 11 and between the connecting element 14 and the auxiliary substrate 21. The electrical contact of the connection point 14 and the contact pad 15 with the first conductor 12 is achieved in that the carrier substrate 11 and the auxiliary substrate 21 are pressed against each other by the lamination.
  • the connecting element 32 simultaneously forms an insulating layer between the first printed conductor 12 and the second printed conductor 22.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)
  • Near-Field Transmission Systems (AREA)

Abstract

For an RFID transponder antenna, comprising a support substrate (11) and an auxiliary substrate (21), wherein a contact island (15) for a first connection of an integrated circuit and a first conduction path structure (12) forming at least two coil windings are disposed on the support substrate (11), the first end of said structure forming a contact terminal (13) for a second connection of the integrated circuit and the other end of said structure forming a connection point (14) for electrically connecting to a second conduction path (22), and wherein a second conduction path is disposed on the auxiliary substrate, said second conduction path forming a bridge over the coil windings, one end of said second path being electrically connected to the contact island and the other end of the second path being connected to the connection point, it is proposed that a permanent connection be made between the auxiliary substrate and/or the second conduction path, and the support substrate and/or the first conduction path at at least one point lying between the two ends of the auxiliary substrate.

Description

RFID-Transponderantenne RFID transponder antenna
Die Erfindung betrifft eine Transponderantenne, insbesondere zur Verwendung in RFID (Radio Frequency Identification) Transpondern, welche üblicherweise eine auf einem Trägersubstrat oder in einem Gehäuse angeordnete Antenne sowie eine mit der Antenne verbundene integrierte Schaltung, meist in Form eines Halbleiterbauelements, aufweisen. In einigen Fällen ist zusätzlich eine Batterie zur Energieversorgung vorgesehen.The invention relates to a transponder antenna, in particular for use in RFID (Radio Frequency Identification) transponders, which usually have an antenna arranged on a carrier substrate or in a housing and an integrated circuit connected to the antenna, usually in the form of a semiconductor component. In some cases, a battery is additionally provided for the power supply.
Nach der Frequenz der Datenübertragung vom und zum integrierten Schaltkreis unterscheidet man prinzipiell zwischen HF- und UHF-According to the frequency of the data transmission to and from the integrated circuit, a distinction is in principle made between HF and UHF
Transpondern, wobei für HF-Transponder üblicherweise ebene Spulenantennen (sogenannte Rahmenantennen) verwendet werden.Transponders, wherein for RF transponders usually flat coil antennas (so-called loop antennas) are used.
Bei derartigen Spulenantennen gibt es stets einen Bereich, in welchem die die Antenne bildende Leiterbahn die durch sie selbst gebildeten Spulenwindungen kreuzt, damit die beiden Enden der Leiterbahn mit den Anschlüssen des integrierten Schaltkreises verbunden werden können. Zur Vermeidung von Kurzschlüssen müssen die sich kreuzenden Leiterbahnabschnitte elektrisch voneinander isoliert werden. Handelt es sich um eine in Drahtlegetechnik her- gestellte Antenne, so kann dies beispielsweise durch Verwendung eines Lackdrahts erreicht werden.In such coil antennas, there is always a region in which the conductor forming the antenna crosses the coil turns formed by itself, so that the two ends of the conductor can be connected to the terminals of the integrated circuit. To avoid short circuits, the intersecting conductor sections must be electrically isolated from each other. If it is an antenna manufactured in wire laying technology, this can be achieved, for example, by using an enameled wire.
Bei Antennenstrukturen, die durch additive Verfahren (z.B. durch Drucken) oder durch subtraktive Verfahren (z.B. selektives Ätzen einer Metallschicht) auf einem nichtleitenden Trägersubstrat her- gestellt werden, wird die Antenne hingegen meist zweiteilig ausge¬ führt.Are provided in antenna structures through additive process (eg, by printing) or by subtractive process (for example, selectively etching a metal layer) on a non-conductive carrier substrate manufacturing, the antenna is, however, usually two parts being ¬ leads.
Beispielsweise können die Spulenwindungen auf einer ersten Seite des Trägersubstrats und eine die Spulenwindungen kreuzende Brücke angeordnet sein, wobei die beiden Enden der Brücke durch das Trä- gersubstrat hindurch mit einem Ende der die Spulenwindungen bildenden Leiterbahn einerseits und einem Kontaktterminal für den Anschluss des integrierten Schaltkreises andererseits elektrisch verbunden werden. Dies kann beispielsweise durch Vias oder durch mechanisches Verbinden, z.B. Prägen erfolgen. Beim mechanischen Verbinden (Prägen) wird das nichtleitende Trägersubstrat lokal durchbrochen, so dass in diesem Bereich ein elektrischer Kontakt zwischen den beiden auf je einer Seite des Trägersubstrats an¬ geordneten Leiterbahnstrukturen hergestellt wird.For example, the coil turns can be arranged on a first side of the carrier substrate and a bridge crossing the coil turns, the two ends of the bridge passing through the carrier substrate with one end of the conductor track forming the coil turns on the one hand and a contact terminal for the bridge On the other hand, the connection of the integrated circuit can be electrically connected. This can be done for example by vias or by mechanical bonding, eg embossing. In mechanical bonding (embossing) the non-conductive carrier substrate is perforated locally so that an electrical contact between the two on each side of the support substrate in this area is formed on ¬ parent conductor track structures.
Die Brücke kann jedoch auch auf derselben Seite des Trägersubs¬ trats angeordnet werden wie die die Spulenwindungen bildende Lei- terbahn. Soll die Brücke in einem additiven Verfahren direkt aufgebracht werden, so muss auch hier die elektrische Isolierung zwischen den Spulenwindungen und der Brücke sichergestellt sein. Dies kann beispielsweise dadurch erfolgen, dass der Bereich, in welchem die Brücke die Spulenwindungen kreuzen soll, zunächst mit einer Isolationspaste überdruckt wird und erst anschließend eine die Brücke bildende Leiterbahn aufgedruckt wird.However, the bridge can also be arranged on the same side of the Trägerubs ¬ trats as the conductor turns forming the conductor track. If the bridge is to be applied directly in an additive process, the electrical insulation between the coil windings and the bridge must also be ensured here. This can be done, for example, that the area in which the bridge is to cross the coil turns, is first overprinted with an insulating paste and only then a the conductor forming path forming the bridge is printed.
Alternativ kann die Brücke auch mit Hilfe eines zusätzlichen Hilfssubstrats hergestellt werden. Dabei wird ein Leiterzug, der später die Brücke bilden soll, auf das Hilfssubstrat aufgebracht, beispielsweise durch Bedrucken mit einer Leitpaste. Anschließend wird das Hilfssubstrat kopfüber auf das Trägersubstrat gelegt, so dass die die Brücke bildende Leiterbahn die Spulenwindungen kreuzt. Anschließend werden die beiden Enden der Brücke mit einem Ende der die Spulenwindungen bildenden Leiterbahn einerseits und einem Kontaktterminal für den Anschluss des integrierten Schalt¬ kreises andererseits elektrisch verbunden. Dies kann beispielswei¬ se durch Ultraschallschweißen geschehen. Auch hier muss zwischen der die Brücke bildenden Leiterbahn auf dem Hilfssubstrat und der die Spulenwindungen bildenden Leiterbahn auf dem Trägersubstrat eine Isolationsschicht vorgesehen sein, welche beispielsweise durch Bedrucken mit einer Isolationspaste hergestellt werden kann. Dabei kann die Isolationsschicht vor dem Auflegen des Hilfssubs- trats auf das Trägersubstrat entweder auf dem Hilfssubstrat oder auf dem Trägersubstrat angeordnet werden, beispielsweise durch Bedrucken mit einer Isolationspaste.Alternatively, the bridge can also be produced with the aid of an additional auxiliary substrate. In this case, a conductor, which is to form the bridge later, applied to the auxiliary substrate, for example by printing with a conductive paste. Subsequently, the auxiliary substrate is placed upside down on the carrier substrate, so that the conductor path forming the bridge crosses the coil turns. Subsequently, the two ends of the bridge with one end of the coil turns forming trace on the one hand and a contact terminal for the connection of the integrated circuit ¬ circuit on the other hand electrically connected. This can be done beispielswei ¬ se by ultrasonic welding. Here too, an insulating layer must be provided between the interconnect forming the bridge on the auxiliary substrate and the interconnect forming the coil turns on the carrier substrate, which insulation layer can be produced, for example, by printing with an insulating paste. In this case, the insulating layer can be arranged on the carrier substrate, either on the auxiliary substrate or on the carrier substrate, before application of the auxiliary substrate, for example by printing with an insulating paste.
Bei dem letztgenannten Typ von RFID-Transponderantennen stellt sich das Problem, dass diese für viele Anwendungsfälle nicht hin- reichend flexibel sind. Wird ein derartiger Transponder, der in ein Etikett oder eine Karte eingefügt ist, stark gebogen, so wer¬ den das Trägersubstrat und das Hilfssubstrat unterschiedlich stark gedehnt. Dadurch kann es zum Ablösen der Brücke kommen, wodurch der Transponder beschädigt und damit unbrauchbar wird. Eine Be¬ schädigung oder Beeinträchtigung des Transponders entsteht auch hinsichtlich der Veränderung seiner elektrischen Eigenschaften infolge der mechanischen Beanspruchung derart, dass sich durch die Belastung die isolierende Brücke in ihrer elektrischen Wirkung als Kapazität ändert.In the last-mentioned type of RFID transponder antenna, the problem arises that for many applications this is not possible. are flexible enough. If such a transponder, which is inserted in a label or a card, strongly bent, so ¬ the carrier substrate and the auxiliary substrate stretched to different degrees. This may cause the bridge to come off, causing damage to the transponder and rendering it unusable. A Be ¬ damage or deterioration of the transponder arises relating to the change of its electrical properties as a result of mechanical stress such that the stress is changed by the insulating bridge in their electrical effect as a capacitance.
Es besteht daher ein Bedürfnis nach einer technischen Lösung für diesen Typ von RFID-Transpondern, welche die mechanische Beständigkeit insbesondere hinsichtlich Biegebeanspruchungen verbessert.There is therefore a need for a technical solution for this type of RFID transponders, which improves the mechanical resistance, in particular with regard to bending stresses.
Diese Aufgabe wird gelöst durch eine RFID-Transponderantenne mit den Merkmalen des unabhängigen Anspruchs 1. Vorteilhafte Ausges¬ taltungen und Weiterbildungen sind in den abhängigen Ansprüchen beschrieben .This object is achieved by an RFID transponder antenna with the features of independent claim 1. Advantageous Ausges ¬ taltungen and developments are described in the dependent claims.
Zur Lösung dieser Aufgabe wird bei einer RFID-Transponderantenne mit einem Trägersubstrat und einem Hilfssubstrat, wobei auf dem Trägersubstrat eine Kontaktinsel für einen ersten Anschluss eines integrierten Schaltkreises sowie eine mindestens zwei Spulenwin¬ dungen bildende erste Leiterbahnstruktur angeordnet sind, deren erstes Ende ein Kontaktterminal für einen zweiten Anschluss des integrierten Schaltkreises bildet und deren anderes Ende eine Verbindungsstelle zur elektrischen Verbindung mit einer zweiten Leiterbahn bildet, und wobei auf dem Hilfssubstrat eine zweite Leiterbahn angeordnet ist, die eine Brücke über die Spulenwindun¬ gen bildet und deren eines Ende mit der Kontaktinsel und deren anderes Ende mit der Verbindungsstelle elektrisch verbunden ist, vorgeschlagen, an mindestens einer zwischen den beiden Enden desTo achieve this object is in an RFID transponder antenna with a carrier substrate and an auxiliary substrate, wherein on the carrier substrate, a contact pad for a first terminal of an integrated circuit and at least two Spulenwin ¬ tions forming first interconnect structure are arranged, the first end of a contact terminal for a second terminal of the integrated circuit forms and the other end forms a connection point for electrical connection to a second conductor track, and wherein on the auxiliary substrate, a second conductor track is arranged, which forms a bridge over the Spulenwindun ¬ gen and whose one end to the contact pad and their the other end is electrically connected to the junction, proposed at least one between the two ends of the
Hilfssubstrats liegenden Stelle eine unlösbare Verbindung zwischen Hilfssubstrat oder/und erster Leiterbahn einerseits und Träger¬ substrat oder/und zweiter Leiterbahn andererseits vorzusehen.Auxiliary substrate lying location a permanent connection between auxiliary substrate and / or first conductor on the one hand and support ¬ substrate and / or second conductor to provide the other.
Unter einer Kontaktinsel im obigen Sinne soll ein leitendes Gebil- de verstanden werden, welches einerseits ein Kontaktterminal für den ersten Anschluss des integrierten Schaltkreises und andererseits eine Verbindungsstelle für die zweite Leiterbahn bereits- teilt. Demgemäß sind von diesem Begriff sowohl Ausgestaltungen umfasst, bei denen eine kompakte Materialinsel gleichzeitig den Anschluss des integrierten Schaltkreises und der zweiten Leiterbahn ermöglichen, als auch Leiterbahnen mit zwei Enden, von denen eines als Kontaktterminal für den ersten Anschluss des integrier¬ ten Schaltkreises und das andere als Verbindungsstelle für die als Brücke wirkende zweite Leiterbahn dient. Bei der letztgenannten Ausführung ist ein größerer Abstand zwischen der Brücke und dem integrierten Schaltkreis realisierbar als bei der zuerst genannten Ausgestaltung. Der Chiplandeplatz ist damit nicht an die Nähe zur Brücke gekoppelt.A contact island in the above sense is to be understood as meaning a conductive housing which on the one hand has a contact terminal for the first connection of the integrated circuit and, on the other hand, a connection point for the second interconnect. Splits. Accordingly, by this term both embodiments includes, where a compact material island simultaneously allow the connection of the integrated circuit and the second conductor track, as well as conductor tracks having two ends, one of which as a contact terminal for the first terminal of the inte ¬ th circuit and the other serves as a connection point for acting as a bridge second conductor. In the latter embodiment, a larger distance between the bridge and the integrated circuit can be realized than in the first-mentioned embodiment. The chip landing pad is thus not coupled to the proximity to the bridge.
Stoffschlüssige Verbindungen sind Verbindungen, bei denen die Verbindungspartner durch atomare oder molekulare Kräfte zusammengehalten werden. Sie sind gleichzeitig nicht lösbare Verbindungen, die sich nur durch Zerstörung der Verbindungsmittel trennen lassen, und die beispielsweise durch Löten, Schweißen, Kleben, Vulkanisieren usw. herstellen lassen.Cohesive compounds are compounds in which the connection partners are held together by atomic or molecular forces. They are at the same time non-releasable compounds that can be separated only by destruction of the connecting means, and can be produced, for example, by soldering, welding, gluing, vulcanization, etc.
Die vorgeschlagene RFID-Transponderantenne zeichnet sich dadurch aus, dass das Hilfssubstrat auch zwischen den beiden elektrischen Verbindungen zur Kontaktinsel und zur Verbindungsstelle mechanisch mit dem Trägersubstrat verbunden wird. Durch diese Verbindung, die im Bereich zwischen den beiden elektrischen Anschlusspunkten des Hilfssubstrats an das Trägersubstrat angeordnet ist und die punkt¬ förmig oder flächig sein kann, wird erzwungen, dass sich beide Substrate im Falle von Biegebeanspruchungen ähnlich verhalten, so dass ein Ablösen der Brücke und damit die Beschädigung oder Zerstörung der Antenne verhindert wird.The proposed RFID transponder antenna is characterized in that the auxiliary substrate is also mechanically connected to the carrier substrate between the two electrical connections to the contact pad and to the connection point. By this connection, which is arranged in the region between the two electrical connection points of the auxiliary substrate to the carrier substrate and may be point ¬ shaped or flat, it is forced that both substrates behave similarly in the case of bending stresses, so that a detachment of the bridge and so that the damage or destruction of the antenna is prevented.
Zur Herstellung dieser unlösbaren Verbindung zwischen Hilfssubs- trat und Trägersubstrat werden nachfolgend mehrere technische Lösungen erläutert.In order to produce this permanent connection between auxiliary substrate and carrier substrate, several technical solutions will be explained below.
In einer ersten Ausgestaltung kann vorgesehen sein, dass auf dem Trägersubstrat mindestens eine Stützstruktur angeordnet ist, wel¬ che mit der zweiten Leiterbahn stoffschlüssig verbunden ist. Unter einer Stützstruktur soll dabei jede auf dem Trägersubstrat angeb- rächte Struktur verstanden werden, die geeignet ist, eine stoff¬ schlüssige Verbindung zwischen Hilfssubstrat oder/und erster Lei¬ terbahn einerseits und Trägersubstrat oder/und zweiter Leiterbahn andererseits zu ermöglichen.In a first embodiment it can be provided that at least one support structure is arranged on the carrier substrate, wel ¬ che is materially connected to the second conductor track. Under a support structure is intended to each alleged on the carrier substrate avenge be understood structure that is adapted to receive a material ¬ positive connection between auxiliary substrate and / or the first Lei ¬ terbahn one hand and the carrier substrate and / or second conductor track on the other hand.
Beispielsweise kann die Stützstruktur eine zwischen zwei benachbarten Spulenwindungen angeordnete Materialinsel sein, die aus demselben Material wie die erste Leiterbahn besteht und gleichzei- tig mit dieser hergestellt wurde. Wird die erste Leiterbahn, wel¬ che die Spulenwindungen bildet, in einem additiven Verfahren erzeugt, so kann in demselben Verfahren, beispielsweise beim Drucken mit einer metallischen Leitpaste, zwischen zwei benachbarte Spu¬ lenwindungen eine Materialinsel, d.h. ein flächiges Gebilde aus derselben metallischen Leitpaste gedruckt werden. Der Abstand der benachbarten Spulenwindungen zueinander ist gegebenenfalls größer als üblich auszuführen, um den für die Materialinsel benötigten Platz zu schaffen. Selbstverständlich können zwischen den beiden elektrischen Anschlusspunkten der Brücke auch mehrere derartige Materialinseln angeordnet werden, um die Festigkeit der unlösbaren Verbindung zu erhöhen. Die Verbindung zwischen der Materialinsel und der zweiten Leiterbahn kann mit bekannten Verfahren, beispielsweise durch Ultraschall-Schweißen, Kleben mit einem nichtleitenden Kleber usw. durchgeführt werden, so dass an der Stelle der Materialinsel eine unlösbare Verbindung entsteht.By way of example, the support structure can be a material island arranged between two adjacent coil windings, which consists of the same material as the first conductor track and was produced at the same time. In the same process, for example, when printing with a metallic conductive paste between two adjacent Spu ¬ lenwindungen, the first conductor track, wel ¬ che the coil turns forming, generated in an additive process, then a material island, that is, a sheet-like structure from the same metallic conductive paste printed become. The distance of the adjacent coil turns to each other may be larger than usual to make the space required for the material island. Of course, between the two electrical connection points of the bridge, several such islands of material can be arranged to increase the strength of the permanent connection. The connection between the material island and the second conductor can be carried out by known methods, for example by ultrasonic welding, bonding with a non-conductive adhesive, etc., so that a permanent connection is created at the location of the material island.
In einer ersten Ausgestaltung kann vorgesehen sein, dass zwischen dem Trägersubstrat und dem Hilfssubstrat mindestens ein Verbin¬ dungselement angeordnet ist, welches einerseits mit dem Träger¬ substrat oder/und der ersten Leiterbahn und andererseits mit dem Hilfssubstrat oder/und der zweiten Leiterbahn stoffschlüssig ver¬ bunden ist. Unter einem Verbindungselement soll dabei jede zwi¬ schen Hilfssubstrat und Trägersubstrat angeordnete Struktur ver¬ standen werden, die geeignet ist, gleichzeitig eine stoffschlüssi¬ ge Verbindung mit dem Hilfssubstrat oder/und der ersten Leiterbahn einerseits und dem Trägersubstrat oder/und der zweiten Leiterbahn andererseits einzugehen. Mit anderen Worten handelt es sich bei dem Verbindungselement, anders als bei der oben beschriebenen Stützstruktur, nicht um ein fest mit dem Trägersubstrat verbunde¬ nes Element, sondern um ein Element, welches zwischen das Träger- Substrat mit der ersten Leiterbahn und das Hilfssubstrat mit der zweiten Leiterbahn eingebracht und anschließend stoffschlüssig mit diesen verbunden wird. Das Verbindungselement kann wiederum punktförmig ausgeführt sein, wie die oben beschriebene Materialinsel. Beispielsweise kann zwi¬ schen zwei benachbarten Spulenwindungen ein Kleber punktförmig aufgetragen werden, anschließend das Hilfssubstrat auf das Träger- Substrat aufgelegt und die erste Leiterbahn des Hilfssubstrats an ihren beiden Enden elektrisch mit der Verbindungsstelle der ersten Leiterbahn und der Kontaktinsel verbunden werden. Der Abstand der benachbarten Spulenwindungen zueinander ist gegebenenfalls größer als üblich auszuführen, um den für das punktförmige Verbindungs- element benötigten Platz zu schaffen. Wenn von den beiden Leiterbahnen nicht mindestens eine bereits auf andere Weise mit einer isolierenden Schicht abgedeckt ist, so muss ein nichtleitender Kleber verwendet werden.In a first embodiment it can be provided that at least one Verbin ¬ extension element is disposed between the support substrate and the auxiliary substrate cohesively on the one hand with the carrier ¬ substrate and / or the first conductor track and on the other hand, with the auxiliary substrate and / or the second conductor track ver ¬ is bound. Under a connecting element each Zvi ¬ rule auxiliary substrate and the carrier substrate arranged structure ver ¬ were should in this case be suitable to simultaneously enter into a stoffschlüssi ¬ ge connection with the auxiliary substrate and / or the first conductor track on the one hand and the carrier substrate and / or the second conductor track on the other hand , In other words, it is at the connection element, unlike the above-described support structure, not a fixed manner to the carrier substrate composites ¬ nes element but an element disposed between the carrier substrate with the first interconnect and the auxiliary substrate with the second conductor track introduced and then materially connected to these. The connecting element may in turn be punctiform, as the material island described above. For example, Zvi ¬ rule two adjacent coil windings an adhesive may be applied point-like, then placed the auxiliary substrate on the carrier substrate and the first conductive pattern of the auxiliary substrate are electrically connected at their both ends to the junction of the first conductor track and the contact pad. The spacing of the adjacent coil windings from one another may be greater than usual in order to provide the space required for the point-shaped connection element. If at least one of the two tracks is not covered by an insulating layer in any other way, then a non-conductive adhesive must be used.
Alternativ kann das Verbindungselement flächig ausgeführt sein. Das flächige Verbindungselement wird zwischen Hilfssubstrat und Trägersubstrat gelegt und anschließend die erste Leiterbahn des Hilfssubstrats an seinen beiden Enden elektrisch mit der Verbindungsstelle der ersten Leiterbahn und der Kontaktinsel verbunden werden. Wenn von den beiden Leiterbahnen nicht mindestens eine bereits auf andere Weise mit einer isolierenden Schicht abgedeckt ist, so muss das flächige Verbindungselement nichtleitend sein. Das flächige Verbindungselement kann beispielsweise eine thermop¬ lastische Kunststofffolie sein.Alternatively, the connecting element can be made flat. The planar connection element is placed between the auxiliary substrate and the carrier substrate and then the first conductor track of the auxiliary substrate is electrically connected at its two ends to the connection point of the first conductor track and the contact pad. If at least one of the two strip conductors is not already covered in any other way with an insulating layer, the flat connection element must be nonconductive. The planar connecting element may be, for example, a thermop ¬ elastic plastic film.
In einer weiteren Ausgestaltung ist das Verbindungselement nur so groß, dass es den Überdeckungsbereich zwischen Trägersubstrat und Hilfssubstrat elektrisch isoliert, beispielsweise indem zwischen Hilfssubstrat und Trägersubstrat eine Kunststofffolie gelegt wird, deren Größe in etwa der des Hilfssubstrats entspricht.In another embodiment, the connecting element is only so large that it electrically insulates the covering area between the carrier substrate and auxiliary substrate, for example by placing a plastic film between the auxiliary substrate and the carrier substrate whose size approximately corresponds to that of the auxiliary substrate.
In einer anderen Ausgestaltung ist das Verbindungselement größer als das Trägersubstrat, wobei die das Trägersubstrat überragenden Bereiche des Verbindungselements mit zwei Verstärkungslagen stoff¬ schlüssig verbunden sind, welche das Trägersubstrat mit dem Hilfs- substrat und dem Verbindungselement von je einer Seite bedecken, und wobei die beiden Enden der zweiten Leiterbahn mit dem ersten Ende der ersten Leiterbahn und der Kontaktinsel durch das Verbindungselement hindurch elektrisch verbunden sind. Beispielsweise kann bei einer Transponderkarte im Scheckkartenformat ein RFID- Inlay zwischen den beiden äußeren Kartenschichten (Verstärkungslagen) angeordnet werden, dessen Antenne und damit auch das Träger¬ substrat kleiner ist als das Scheckkartenformat. Wenn aber bei dieser Antenne das Verbindungselement Scheckkartenformat hat und damit das Trägersubstrat überragt, so können die über das Träger¬ substrat hinausragenden Bereiche des Verbindungselements gleich¬ zeitig dazu dienen, die äußeren Kartenschichten miteinander zu verbinden, beispielsweise indem in einem Laminierprozess eine Stoffschlüssige Verbindung zwischen dem Verbindungselement und beiden äußeren Kartenschichten hergestellt wird.In another embodiment, the connecting element is larger than the carrier substrate, wherein the carrier substrate protruding portions of the connecting element with two reinforcing layers are materially ¬ conclusively covering the carrier substrate with the auxiliary substrate and the connecting element of one side, and wherein the two Ends of the second conductor are electrically connected to the first end of the first conductor and the contact pad through the connecting element. For example, in the case of a transponder card in credit card format, an RFID Inlay between the two outer card layers (reinforcing layers) are arranged, the antenna and thus also the carrier ¬ substrate is smaller than the credit card format. If, however, in this antenna has the connecting element credit card format and thus projects beyond the carrier substrate, so that via the carrier ¬ substrate protruding portions of the connecting member may be the same ¬ time serve to connect the outer card layers together, for example by placing in a laminating a cohesive connection between the Connecting element and two outer card layers is made.
Nachfolgend wird de vorgeschlagene RFID-Transponderantenne anhand von Ausführungsbeispielen und zugehörigen Zeichnungen näher erläutert. Dabei zeigenHereinafter, the proposed RFID transponder antenna will be explained in more detail with reference to embodiments and accompanying drawings. Show
Fig. 1 eine RFID-Transponderantenne nach dem Stand der Technik,1 shows a RFID transponder antenna according to the prior art,
Fig. 2 eine RFID-Transponderantenne gemäß Ausführungsbeispiel 1,2 an RFID transponder antenna according to embodiment 1,
Fig. 3eine RFID-Transponderantenne gemäß Ausführungsbeispiel 2.3 shows an RFID transponder antenna according to exemplary embodiment 2.
Fig. 4 eine RFID-Transponderantenne gemäß Ausführungsbeispiel 3.4 shows an RFID transponder antenna according to exemplary embodiment 3.
In Fig. 1 ist eine bekannte RFID-Transponderantenne dargestellt, bei der auf einem Trägersubstrat 11 eine erste Leiterbahn 12 mit einer Verbindungsstelle 14, die mehrere Spulenwindungen bildet, sowie eine Kontaktinsel 15, deren eines Ende eine Verbindungsstel¬ le 14 bildet und deren anderes Ende ein Kontaktterminal 13 für einen integrierte Schaltkreis bildet, angeordnet sind. Zwischen den beiden Verbindungsstellen 14 erstreckt sich die auf einem Hilfssubstrat 21 angeordnete zweite Leiterbahn 22, deren Enden mit den beiden Verbindungsstellen 14 elektrisch verbunden ist. In der Querschnittsdarstellung sind die Schweißorgane 5 einer Einrichtung zum Ultraschallschweißen dargestellt, welche den elektrischen Kontakt an diesen Stellen erzeugen. Auf der zweiten Leiterbahn 22, die auf dem Hilfssubstrat 21 angeordnet ist, ist eine Isolier¬ schicht 23 angeordnet, damit die Spulenwindungen der ersten Lei¬ terbahn 12 nicht durch die zweite Leiterbahn 22 kurzgeschlossen werden .In Fig. 1, a known RFID transponder antenna is shown in which on a carrier substrate 11, a first conductor 12 with a connection point 14 which forms a plurality of coil turns, and a contact pad 15, one end of a Verbindungsstel ¬ le 14 forms and the other end a contact terminal 13 forms an integrated circuit, are arranged. Between the two connection points 14, the arranged on an auxiliary substrate 21 second conductor 22, the ends of which is electrically connected to the two connection points 14 extends. The cross-sectional illustration shows the welding elements 5 of a device for ultrasonic welding, which generate the electrical contact at these points. On the second conductor 22, which is arranged on the auxiliary substrate 21, an insulating ¬ layer 23 is arranged so that the coil turns of the first Lei ¬ terbahn 12 are not shorted by the second conductor 22.
Bei dem in Fig. 2 dargestellten Ausführungsbeispiel 1 ist der Abstand zwischen zwei benachbarten Spulenwindungen vergrößert ausgeführt, so dass Platz für eine zusätzliche Stoffschlüssige Verbindung entsteht. Hierzu ist zwischen diesen benachbarten Spulenwindungen eine Stützstruktur 31 in Form einer Metallinsel an- geordnet, welche durch Ultraschallschweißen mittels zusätzlicher Schweißorgane 5 mit der zweiten Leiterbahn 22 verbunden wird. Da die Stützstruktur 31 keine Verbindung zur ersten Leiterbahn 12 hat und die zweite Leiterbahn 22 im Bereich zwischen den Verbindungen zur Verbindungsstelle 14 der ersten Leiterbahn 12 und der Kontakt- insel 15 sowie der Stützstruktur 31 durch Isolierschichten 23 abgedeckt ist, kann kein Kurzschluss der Spulenwindungen entste¬ hen .In the embodiment 1 shown in Fig. 2 is the Distance between two adjacent coil turns made larger, so that space for an additional cohesive connection is formed. For this purpose, a support structure 31 in the form of a metal island is arranged between these adjacent coil windings, which is connected to the second conductor track 22 by ultrasonic welding by means of additional welding elements 5. Since the support structure 31 has no connection to the first conductor track 12 and the second conductor track 22 is covered by insulating layers 23 in the region between the connections to the connection point 14 of the first conductor track 12 and the contact island 15 and the support structure 31, no short circuiting of the coil windings can occur ¬ hen.
In Fig. 3 ist ein Ausführungsbeispiel 2 dargestellt, bei dem das Hilfssubstrat 21 und das Trägersubstrat 11 gemeinsam zwischen zwei Verstärkungslagen 4 angeordnet sind, die an ihren nach innen gewandten Seiten mit einem Klebstoff ausgestattet sind. Der elektri¬ sche Kontakt zwischen der Verbindungsstelle 14 und der Kontaktin¬ sel 15 mit der ersten Leiterbahn 12 wird dadurch erreicht, dass das Trägersubstrat 11 und das Hilfssubstrat 21 durch die Verstär- kungslagen 4 aufeinander gepresst werden. Die zusätzliche stoff¬ schlüssige Verbindung zwischen Trägersubstrat 11 und das Hilfs- substrat 21 wird dadurch erzeugt, dass ein flächiges Verbindungs¬ element 32 vorgesehen ist, das in Form einer Schicht aus nichtlei¬ tendem Kleber auf die zweite Leiterbahn 21 aufgebracht ist.In Fig. 3, an embodiment 2 is shown, in which the auxiliary substrate 21 and the carrier substrate 11 are arranged together between two reinforcing layers 4, which are provided at their inwardly facing sides with an adhesive. The electrical ¬ cal contact between the connecting point 14 and the contact in ¬ sel 15 with the first wiring 12 is achieved in that the carrier substrate 11 and the auxiliary substrate 21 are pressed together by the effect were reinforce-. 4 The additional material ¬ positive connection between the carrier substrate 11 and the auxiliary substrate 21 is produced in that a sheet-like connection ¬ element 32 is provided, which is applied in the form of a layer of nichtlei ¬ tendem adhesive on the second conductor track 21st
Das Ausführungsbeispiel 3, welches in Fig. 4 dargestellt ist, zeigt eine RFID-Transponderantenne, bei der das Hilfssubstrat 21 und das Trägersubstrat 11 miteinander durch Hitze laminiert wer¬ den. Bei diesem Ausführungsbeispiel sind Hilfssubstrat 21 und Trägersubstrat 11 gleich groß, d.h. das Hilfssubstrat 21 bedeckt das Trägersubstrat 11 vollständig. Zwischen Hilfssubstrat 21 undThe embodiment 3, shown in Fig. 4, shows an RFID tag antenna in which the auxiliary substrate 21 and the support substrate 11 laminated together by heat ¬ the. In this embodiment, the auxiliary substrate 21 and the carrier substrate 11 are the same size, that is, the auxiliary substrate 21 completely covers the carrier substrate 11. Between auxiliary substrate 21 and
Trägersubstrat 11 ist ein flächiges Verbindungselement 32 angeord¬ net, welches in diesem Fall eine thermoplastische Folie ist, die dieselbe Größe hat wie das Hilfssubstrat 21 und das Trägersubstrat 11 und die in den Bereichen, in denen ein elektrischer Kontakt der zweiten Leiterbahn 22 zur Verbindungsstelle 14 der ersten Leiterbahn 12 und der Kontaktinsel 15 hergestellt werden soll, Aus¬ schnitte aufweist. Durch das Laminieren entsteht eine Stoffschlüs¬ sige Verbindung zwischen dem Verbindungselement 14 und dem Träger- Substrat 11 sowie zwischen dem Verbindungselement 14 und dem Hilfssubstrat 21. Der elektrische Kontakt der Verbindungsstelle 14 und der Kontaktinsel 15 mit der ersten Leiterbahn 12 wird dadurch erreicht, dass das Trägersubstrat 11 und das Hilfssubstrat 21 durch das Laminieren aufeinander gepresst werden. Das Verbindungselement 32 bildet gleichzeitig eine Isolierschicht zwischen der ersten Leiterbahn 12 und der zweiten Leiterbahn 22. Carrier substrate 11 is a flat connecting element 32 angeord ¬ net, which in this case is a thermoplastic film, which has the same size as the auxiliary substrate 21 and the carrier substrate 11 and in those areas in which an electrical contact of the second conductor 22 to the connection point 14th the first conductor 12 and the contact pad 15 is to be produced, from ¬ sections. Is formed by laminating a Stoffschlüs ¬ fitting connection between the connecting member 14 and the carrier Substrate 11 and between the connecting element 14 and the auxiliary substrate 21. The electrical contact of the connection point 14 and the contact pad 15 with the first conductor 12 is achieved in that the carrier substrate 11 and the auxiliary substrate 21 are pressed against each other by the lamination. The connecting element 32 simultaneously forms an insulating layer between the first printed conductor 12 and the second printed conductor 22.
RFID-TransponderantenneRFID transponder antenna
BezugszeichenlisteLIST OF REFERENCE NUMBERS
11 Trägersubstrat11 carrier substrate
12 erste Leiterbahn12 first trace
13 Kontaktterminal13 contact terminal
14 Verbindungsstelle14 connection point
15 Kontaktinsel 21 Hilfssubstrat15 contact pad 21 auxiliary substrate
22 zweite Leiterbahn22 second trace
23 Isolierschicht23 insulating layer
31 Stützstruktur31 supporting structure
32 Verbindungselement 4 Verstärkungslage32 connecting element 4 reinforcing layer
5 Schweißorgan 5 welding organ

Claims

RFID-TransponderantennePatentansprüche RFID transponder antenna patent claims
1. RFID-Transponderantenne mit einem Trägersubstrat und einem Hilfssubstrat, wobei auf dem Trägersubstrat eine Kontakt¬ insel für einen ersten Anschluss eines integrierten Schaltkreises sowie eine mindestens zwei Spulenwindungen bildende erste Leiterbahnstruktur angeordnet sind, deren erstes Ende ein Kontaktterminal für einen zweiten An¬ schluss des integrierten Schaltkreises bildet und deren anderes Ende eine Verbindungsstelle zur elektrischen Ver¬ bindung mit einer zweiten Leiterbahn bildet, und wobei auf dem Hilfssubstrat eine zweite Leiterbahn angeordnet ist, die eine Brücke über die Spulenwindungen bildet und deren eines Ende mit der Kontaktinsel und deren anderes Ende mit der Verbindungsstelle elektrisch verbunden ist, dadurch gekennzeichnet, dass an mindestens einer zwischen den beiden Enden des Hilfssubstrats liegenden Stelle eine unlösbare Verbindung zwischen Hilfssubstrat oder/und ers¬ ter Leiterbahn einerseits und Trägersubstrat oder/und zweiter Leiterbahn andererseits vorgesehen ist.1. RFID transponder antenna having a carrier substrate and an auxiliary substrate, wherein on the carrier substrate a contact ¬ island for a first terminal of an integrated circuit and at least two coil turns forming the first interconnect structure are arranged, the first end of a contact terminal for a second An ¬ circuit of integrated circuit forms and the other end forms a connection point for electrical Ver ¬ bond with a second conductor, and wherein on the auxiliary substrate, a second conductor is arranged, which forms a bridge over the coil turns and having one end with the contact pad and the other end with the connection point is electrically connected, characterized in that at least one location lying between the two ends of the auxiliary substrate a permanent connection between the auxiliary substrate and / or ers ¬ ter interconnect on the one hand and the carrier substrate and / or second interconnect is provided on the other hand.
2 . RF ID-Tran sponderantenne nach An spruch 1 , d a d u r c h g e ¬ k e n n z e i c h n e t , d a s s auf dem Trägersubstrat minde sten s eine Stützstruktur angeordnet ist, welche mit der zweiten2. RF ID transponder antenna according to claim 1, dadurchge ¬ indicates that on the carrier substrate least one support structure is arranged, which with the second
Leiterbahn stoffschlüssig verbunden ist.Conductor is connected cohesively.
3. RFID-Transponderantenne nach Anspruch 2, dadurch ge¬ kennzeichnet, dass die Stützstruktur eine zwischen zwei benachbarten Spulenwindungen angeordnete Materialin- sei ist, die aus demselben Material wie die erste Leiter¬ bahn besteht und gleichzeitig mit dieser hergestellt wur¬ de. 3. RFID transponder antenna according to claim 2, characterized ge ¬ indicates that the support structure is a material arranged between two adjacent coil turns material inlay, which consists of the same material as the first conductor ¬ path and at the same time made with this wur ¬ de.
4. RFID-Transponderantenne nach Anspruch 1, dadurch ge¬ kennzeichnet, dass zwischen dem Trägersubstrat und dem Hilfssubstrat mindestens ein Verbindungselement an¬ geordnet ist, welches einerseits mit dem Trägersubstrat oder/und der ersten Leiterbahn und andererseits mit dem4. RFID transponder antenna according to claim 1, characterized ge ¬ indicates that between the carrier substrate and the auxiliary substrate at least one connecting element is arranged on ¬ , which on the one hand to the carrier substrate and / or the first conductor track and on the other hand with the
Hilfssubstrat oder/und der zweiten Leiterbahn stoffschlüs¬ sig verbunden ist.Auxiliary substrate and / or the second conductor stoffschlüs ¬ sig is connected.
5. RFID-Transponderantenne nach Anspruch 4, dadurch ge¬ kennzeichnet , das s das Verbindungselement nur so groß ist, dass es den Überdeckungsbereich zwischen Trägersubstrat und Hilfssubstrat elektrisch isoliert.5. RFID transponder antenna according to claim 4, characterized ge ¬ indicates that s the connecting element is only so large that it electrically isolates the overlap region between the carrier substrate and auxiliary substrate.
6. RFID-Transponderantenne nach Anspruch 4 oder 5, dadurch gekennzeichnet, dass das Verbindungselement gleich oder größer ist als das Trägersubstrat, wobei die das Trä- gersubstrat überragenden Bereiche des Verbindungselements mit zwei Verstärkungslagen stoffschlüssig verbunden sind, welche das Trägersubstrat mit dem Hilfssubstrat und dem Verbindungselement von je einer Seite bedecken, und wobei die beiden Enden der zweiten Leiterbahn mit dem ersten En- de der ersten Leiterbahn und der Kontaktinsel durch das6. RFID transponder antenna according to claim 4 or 5, characterized in that the connecting element is equal to or larger than the carrier substrate, wherein the carrier substrate the projecting carrier regions of the connecting element with two reinforcing layers are materially connected, which the carrier substrate with the auxiliary substrate and the Cover each side of the connecting element, and wherein the two ends of the second conductor track with the first end of the first conductor track and the contact pad by the
Verbindungselement hindurch elektrisch verbunden sind.Connecting element are electrically connected therethrough.
7. RFID-Transponderantenne nach einem der Ansprüche 4 bis 6, dadurch gekennzeichnet, dass das Verbindungsele¬ ment eine thermoplastische Kunststoff folie ist.7. RFID transponder antenna according to one of claims 4 to 6, characterized in that the Verbindungsele ¬ ment is a thermoplastic film.
8. RFID-Transponderantenne nach einem der Ansprüche 4 bis 6, dadurch gekennzeichnet, dass das Verbindungsele¬ ment ein nichtleitender Kleber ist. 8. RFID transponder antenna according to one of claims 4 to 6, characterized in that the Verbindungsele ¬ ment is a non-conductive adhesive.
PCT/EP2009/062463 2008-09-25 2009-09-25 Rfid transponder antenna WO2010034820A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MX2011003156A MX2011003156A (en) 2008-09-25 2009-09-25 Rfid transponder antenna.
EP09783437.8A EP2338207B1 (en) 2008-09-25 2009-09-25 Rfid transponder antenna
US13/120,726 US8917219B2 (en) 2008-09-25 2009-09-25 RFID transponder antenna
BRPI0919849-0A BRPI0919849B1 (en) 2008-09-25 2009-09-25 rfid transponder antenna

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008048948.4 2008-09-25
DE102008048948 2008-09-25

Publications (1)

Publication Number Publication Date
WO2010034820A1 true WO2010034820A1 (en) 2010-04-01

Family

ID=41381872

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2009/062463 WO2010034820A1 (en) 2008-09-25 2009-09-25 Rfid transponder antenna

Country Status (7)

Country Link
US (1) US8917219B2 (en)
EP (1) EP2338207B1 (en)
KR (1) KR20110074996A (en)
BR (1) BRPI0919849B1 (en)
MX (1) MX2011003156A (en)
MY (1) MY176260A (en)
WO (1) WO2010034820A1 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013032921A1 (en) * 2011-08-26 2013-03-07 Identive Group, Inc. Card lamination
TW201423484A (en) * 2012-12-14 2014-06-16 Pixart Imaging Inc Motion detection system
US10311353B1 (en) * 2017-04-28 2019-06-04 Impinj, Inc. RFID integrated circuits with electrical bridges
KR20190091985A (en) 2018-01-30 2019-08-07 주식회사 알앤스테크 Loop type antenna and rfid card including the same
DE212019000133U1 (en) * 2019-03-13 2020-06-23 Murata Manufacturing Co., Ltd. RFID tag and item provided with an RFID tag
US10783424B1 (en) 2019-09-18 2020-09-22 Sensormatic Electronics, LLC Systems and methods for providing tags adapted to be incorporated with or in items
US11443160B2 (en) 2019-09-18 2022-09-13 Sensormatic Electronics, LLC Systems and methods for laser tuning and attaching RFID tags to products
KR20210048268A (en) * 2019-10-23 2021-05-03 삼성전기주식회사 Antenna apparatus
US11055588B2 (en) 2019-11-27 2021-07-06 Sensormatic Electronics, LLC Flexible water-resistant sensor tag
US11755874B2 (en) 2021-03-03 2023-09-12 Sensormatic Electronics, LLC Methods and systems for heat applied sensor tag
US11869324B2 (en) 2021-12-23 2024-01-09 Sensormatic Electronics, LLC Securing a security tag into an article

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19610284A1 (en) 1996-03-15 1997-08-07 Siemens Ag Transponder antenna coil design
DE19848821C1 (en) * 1998-10-22 2000-05-18 Fraunhofer Ges Forschung Transponder production e.g. for chip cards or electronic labels, involves producing carrier substrate with coil metallisation; mounting chip; laminating insulating foil onto surface; connecting respective connection ends
DE19912201A1 (en) * 1999-01-14 2000-08-17 Pav Card Gmbh Method for producing a smart label identity device with wireless signal transmission, attaching windings running in a square by vacuum coating process to a foil or flexible insulating material.
EP1742173A2 (en) 2005-06-21 2007-01-10 VisionCard PersonalisierungsgmbH Card and method for its production

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6693541B2 (en) * 2001-07-19 2004-02-17 3M Innovative Properties Co RFID tag with bridge circuit assembly and methods of use

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19610284A1 (en) 1996-03-15 1997-08-07 Siemens Ag Transponder antenna coil design
DE19848821C1 (en) * 1998-10-22 2000-05-18 Fraunhofer Ges Forschung Transponder production e.g. for chip cards or electronic labels, involves producing carrier substrate with coil metallisation; mounting chip; laminating insulating foil onto surface; connecting respective connection ends
DE19912201A1 (en) * 1999-01-14 2000-08-17 Pav Card Gmbh Method for producing a smart label identity device with wireless signal transmission, attaching windings running in a square by vacuum coating process to a foil or flexible insulating material.
EP1742173A2 (en) 2005-06-21 2007-01-10 VisionCard PersonalisierungsgmbH Card and method for its production

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
HAGHIRI YAHYA ET AL: "Vom Plastik zur Chipkarte; 7.2 Kontaktlose Chipkarte", VOM PLASTIK ZUR CHIPKARTE: WEGWEISER ZUM AUFBAU UND ZURHERSTELLUNG VON CHIPKARTEN, XX, XX, 1 January 1999 (1999-01-01), pages 181 - 192, XP002364832 *

Also Published As

Publication number Publication date
EP2338207A1 (en) 2011-06-29
MY176260A (en) 2020-07-24
US8917219B2 (en) 2014-12-23
MX2011003156A (en) 2011-05-25
KR20110074996A (en) 2011-07-05
US20110267254A1 (en) 2011-11-03
BRPI0919849B1 (en) 2020-10-27
EP2338207B1 (en) 2016-06-29
BRPI0919849A2 (en) 2015-12-15

Similar Documents

Publication Publication Date Title
WO2010034820A1 (en) Rfid transponder antenna
DE19632115C1 (en) Combination chip module for smart cards allowing both contacting- and contactless communication with external data station
EP1271399B1 (en) Data carrier with integrated circuit
EP0756244B1 (en) Electronic unit and method of producing that unit
DE4443980A1 (en) Foil version for the assembly of chip cards with coils
DE10016715C1 (en) Laminated smart card arrangement e.g. for telephone card
EP1136943A2 (en) Transponder
EP0891603B1 (en) Non-conductive substrate forming a band or panel, on which are formed a plurality of support elements
EP2350928B1 (en) Method for producing an rfid transponder product, and rfid transponder product produced using the method
DE10297573B4 (en) Intelligent label and method for its production
EP0992939A1 (en) Method for fabricating a microtransponder
DE10145752B4 (en) Non-conductive, ribbon or sheet substrate on which a plurality of carrier elements are formed
DE10014620A1 (en) Electronic chip carrier band manufacturing method has contact elements for applied chips provided by metallized plastics foil or metal foil
EP0976104A2 (en) Smart card, connection arrangement and method of producing a smart card
EP1028388B1 (en) Identification element and method of manufacturing an identification element
EP3066618B1 (en) Ic module for different connection technologies
DE202007013680U1 (en) Device for producing a chip card
DE19758057C1 (en) Antenna fabrication method for IC card
WO2008138531A1 (en) Contactless transmission system, and method for the production thereof
DE102008024487B4 (en) Integrated coil semiconductor device and method of manufacturing the same
DE102007028357A1 (en) transponder card
EP3456160B1 (en) Circuit pattern structure, in particular for a leadframe for a smart card application, with at least two superposed planes of conductive patterns
EP1162480A2 (en) Contactless Transponder
DE102007030650B4 (en) Method for producing a chip card
DE102018215638B4 (en) Bonding foil, electronic component and method for producing an electronic component

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09783437

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: MX/A/2011/003156

Country of ref document: MX

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2009783437

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20117009361

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 13120726

Country of ref document: US

ENP Entry into the national phase

Ref document number: PI 0919849

Country of ref document: BR

Kind code of ref document: A2