WO2009155732A1 - An antenna device and an electronic product of using it - Google Patents
An antenna device and an electronic product of using it Download PDFInfo
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- WO2009155732A1 WO2009155732A1 PCT/CN2008/001224 CN2008001224W WO2009155732A1 WO 2009155732 A1 WO2009155732 A1 WO 2009155732A1 CN 2008001224 W CN2008001224 W CN 2008001224W WO 2009155732 A1 WO2009155732 A1 WO 2009155732A1
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- antenna device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
Definitions
- the present invention relates to antennas, and more particularly to antennas in the FM band. Background technique
- the design difficulty of the FM band (76MHz ⁇ 1 08MHz) antenna lies in the problem of miniaturization.
- the antenna length can be resonated at least equal to a quarter of the operating wavelength, so that the radiation can be radiated or received ideally. Therefore, we infer that the radiation length of the 100 MHz signal should be about 75 cm. This length is not possible on today's popular electronic multimedia terminals.
- L is the resonant length of the antenna and ⁇ is the wavelength of the working electromagnetic wave.
- a prior art FM receiving antenna is disposed in a headphone cord connected to a communication device. This structure with relatively long wires makes the antenna length sufficient for low frequency applications. However, longer external antennas are not allowed for most FM transmission scenarios and some FM reception.
- the present invention provides an antenna device in a first aspect.
- the antenna device includes a circuit substrate and a first conductor overlying the first layer of the circuit substrate, wherein the antenna device further includes a second conductor, a first conductor and a second, overlying at least another layer of the circuit substrate Mutual inductance is formed between the conductors.
- the present invention provides an antenna device. It comprises a circuit substrate and a first conductor coated on the first layer of the circuit substrate, characterized in that the antenna device further comprises a parasitic capacitance formed between the first conductor and the ground.
- the ground has an overlapping area between the first conductor and the adjacent ground on another layer of the circuit substrate.
- the ground may be formed in the same layer or a different layer as the first conductor, and the parasitic capacitance is formed between the ground and the adjacent portion of the first conductor.
- the antenna of the present invention can be greatly miniaturized. Stable performance and low cost. In other words, given a small length or area, its resonant frequency can be greatly reduced.
- the antenna can be widely used in various electronic products.
- FIG. 1 is a schematic diagram of a two-layer board-level antenna according to a first embodiment of the present invention
- FIG. 2 is a partial enlarged view of the board-level antenna of FIG.
- 3 is an equivalent circuit diagram of a three-layer antenna having mutual inductance
- FIG. 4 is a schematic diagram of introducing a capacitance by increasing a facing area s of two plates of a capacitor according to a second embodiment
- Figure 5 is a schematic diagram showing the introduction of a capacitance by reducing the facing distance d of the two plates of the capacitor according to the third embodiment
- Figure 6 illustrates two patterns of antenna and ground forming parasitic capacitance
- Figure 7 illustrates an equivalent circuit diagram of a three-layer antenna with parasitic capacitance
- Figure 8 illustrates a circuit layout using an antenna device of the present invention
- Fig. 9 is a schematic diagram of a board level antenna according to a fourth embodiment. Detailed ways
- FIG. 1 is a schematic diagram of a two-layer board level antenna according to a first embodiment of the present invention.
- the spiral-plate antenna is wound on both sides of the double-layer printed circuit board.
- the two-layered helical antennas are connected by via holes, and viewed from one direction (for example, a top view angle), the two-layer helical antennas are wound in the same direction.
- Figure 2 is a partial enlarged view of the board-level antenna of Figure 1, in which the dark pattern portion is the antenna top layer and the light portion is the antenna bottom layer.
- each layer of the helical antenna can be selected to increase the inductivity of the layer to reduce the resonance point.
- the pattern of the antenna can be varied, round, rectangular or irregular, with the emphasis on forming a spiral effect that makes it inductive to reduce the resonant frequency.
- each layer of antennas may be other patterns that are non-helical, and the patterns of different layers of antennas may also be different as long as they can have inductive characteristics to form a mutual inductance effect between each other.
- Figure 3 is an equivalent circuit diagram of a three-layer antenna with mutual inductance.
- P 0 is the feed input of the antenna
- r is the input resistance of the antenna
- L1 is the equivalent inductance of the top antenna
- L2 is the equivalent inductance of the intermediate layer antenna
- K1 is the top layer inductor and the middle layer inductor.
- the mutual inductance coefficient The closer the distance between the top layer and the middle layer, the larger the mutual inductance, the larger K 1 and the greater the equivalent sum inductance.
- L 3 is the equivalent inductance of the underlying antenna
- K2 is the mutual inductance of the intermediate layer inductance and the underlying inductance.
- f is the resonant frequency of the antenna
- L is the inductance of the antenna
- C is the capacitance of the antenna.
- the capacitance calculation formula (3) it can be seen that increasing the capacitance of the two plates and the distance between the two plates of the reduced capacitance can achieve the purpose of introducing the capacitance.
- the two poles of the capacitor are the antenna (an t enna ) and the ground (gnd ).
- C is the capacitance
- k is the constant coefficient
- s is the facing area of the two plates of the capacitor
- d is the facing distance of the two plates of the capacitor.
- 4 is a schematic diagram of introducing a capacitance by increasing a facing area s of two plates of a capacitor according to a second embodiment.
- the figure takes a two-layer board as an example.
- the dark antenna pattern is the top layer of the antenna, and the light part is the bottom layer of the antenna.
- One side of the top antenna is ground; the bottom antenna extends to a certain area on the same side and overlaps with the ground (black frame) of the top layer to generate parasitic capacitance.
- the size of the capacitor can be adjusted by the area s of the overlap region.
- Fig. 5 is a schematic view showing the introduction of a capacitance by reducing the distance d of the two plates of the capacitor according to the third embodiment.
- the antenna and ground are closer in the layer of the two-layer board-level antenna.
- a parasitic capacitance can be generated between the antenna and the ground. With such parasitic capacitance, the inductance can be cancelled and the resonant frequency of the antenna can be reduced.
- the parasitic capacitance can be simultaneously formed with the antenna on both sides of the front and back sides, and the capacitance can be increased to lower the resonance frequency.
- Figure 6 illustrates two patterns of antenna and ground forming parasitic capacitance. It should be noted that this is only an example.
- the parasitic capacitances shown in Figs. 4 and 5 can also be formed on or between different layers of the multilayer PCB to further increase the parasitic capacitance.
- Figure 7 shows an equivalent circuit diagram of a three-layer antenna with parasitic capacitance.
- the parasitic capacitance formed between the top antenna and ground is CP 1
- the parasitic capacitance formed between the middle layer antenna and ground is CP2
- the parasitic capacitance formed between the bottom antenna and ground is CP 3 .
- the remaining circuits are the same as in Figure 3.
- One of ordinary skill in the art of antennas knows that when electromagnetic waves propagate in a medium, the wavelength will be shorter than the wavelength at which it propagates in the air.
- ⁇ is the wavelength of the working electromagnetic wave in the medium
- k is a constant coefficient
- ⁇ It is the wavelength of the working electromagnetic wave in the air
- ⁇ r is the relative dielectric constant of the medium.
- Figure 8 illustrates the circuit layout of an antenna device employing the present invention.
- the antenna device of the present invention can be compactly disposed on one side of the circuit board, and the other side of the circuit board is configured correspondingly The circuits are separated by a small area of land.
- Fig. 9 is a schematic diagram of an antenna device according to a fourth embodiment.
- the dark antenna pattern is the top layer of the antenna
- the light part is the ground layer
- the top layer antenna overlaps with the ground of the bottom layer to generate parasitic capacitance.
- the bottom layer is extended below the antenna to form an overlapping effect with the antenna portion to generate parasitic capacitance.
- the present invention has been described above in connection with an F M antenna, the present invention is not limited thereto, and can be applied to other types of antennas to achieve miniaturization.
- ground described above may be either a physical ground or a relative reference potential.
- the antenna of the present invention is applicable not only to portable wireless communication devices including mobile phones, but also to other portable devices that are mainly intended for stationary use, such as small timepieces or game consoles.
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Abstract
An antenna device is provided. The antenna device includes a circuit substrate, and the first conductor which is covered on the first layer of the circuit substrate; the antenna device also includes the second conductor which is covered on at least another layer of the circuit substrate; an inductance is formed between the first conductor and the second conductor; and /or the antenna device includes a parasitic capacitor which is formed between the first conductor and the ground. The antenna can be greatly miniaturized, and it can be widely used in all kinds of electronic products.
Description
一种天线装置和采用它的电子产品 技术领域 Antenna device and electronic product using the same
本发明涉及天线， 尤其涉及 FM频段的天线。 背景技术 The present invention relates to antennas, and more particularly to antennas in the FM band. Background technique
FM频段（ 76MHz ~ 1 08MHz )天线的设计难点在于小型化的问题。 根 据单极子天线的谐振长度计算公式（公式 1 )可知， 天线长度至少等于 四分之一工作波长的时候才可以谐振， 即才可以比较理想地辐射或接 收能量。因此我们推知，以辐射 1 00MHz信号为例，其天线长度应为 75 cm 左右。 而这个长度在当今流行的电子多媒体终端上是不可能实现的。 ( 1 ) The design difficulty of the FM band (76MHz ~ 1 08MHz) antenna lies in the problem of miniaturization. According to the calculation formula of the resonance length of the monopole antenna (Equation 1), it can be known that the antenna length can be resonated at least equal to a quarter of the operating wavelength, so that the radiation can be radiated or received ideally. Therefore, we infer that the radiation length of the 100 MHz signal should be about 75 cm. This length is not possible on today's popular electronic multimedia terminals. ( 1 )
其中， L是天线的谐振长度， λ是工作电磁波的波长。 Where L is the resonant length of the antenna and λ is the wavelength of the working electromagnetic wave.
一种现有技术的 FM接收天线被设置在与通信设备相连的耳机线 中。 这种具有相对较长导线的结构使得天线长度对于低频应用已经足 够。 然而， 对于绝大多数 FM发射场合和部分 FM接收的场合下都不允 许有较长的外部天线。 A prior art FM receiving antenna is disposed in a headphone cord connected to a communication device. This structure with relatively long wires makes the antenna length sufficient for low frequency applications. However, longer external antennas are not allowed for most FM transmission scenarios and some FM reception.
因此 FM天线如何小型化就成为一个重要的课题。 换言之， 在给定 很小的长度或面积的情况下， 如何将其谐振频率降低便是技术攻关的 难点。 发明内容 Therefore, how to miniaturize the FM antenna becomes an important issue. In other words, how to reduce the resonant frequency is a difficult point in technical research given a small length or area. Summary of the invention
本发明的目的是通过降低天线的谐振频率，提供小型化的发射和接 收天线。 It is an object of the present invention to provide a miniaturized transmitting and receiving antenna by reducing the resonant frequency of the antenna.
为此， 本发明在第一方面提供一种天线装置。 该天线装置包括电 路基板与被覆在电路基板第一层上的第一导体， 其特征在于所述天线 装置还包括被覆在电路基板的至少另一层上的第二导体， 第一导体和 第二导体之间形成互感。 To this end, the present invention provides an antenna device in a first aspect. The antenna device includes a circuit substrate and a first conductor overlying the first layer of the circuit substrate, wherein the antenna device further includes a second conductor, a first conductor and a second, overlying at least another layer of the circuit substrate Mutual inductance is formed between the conductors.
根据第二方面， 本发明提供一种天线装置。 它包括电路基板与被 覆在电路基板第一层上的第一导体， 其特征在于所述天线装置还包括 在第一导体和地之间形成的寄生电容。
优选地， 在第二方面中， 所述地在电路基板的另一层上， 所述第 一导体和相邻的地之间具有重叠的面积。 根据另一替代方案， 所述地 可以与第一导体在同一层或不同层， 且地和第一导体的相邻部分之间 形成所述寄生电容。 According to a second aspect, the present invention provides an antenna device. It comprises a circuit substrate and a first conductor coated on the first layer of the circuit substrate, characterized in that the antenna device further comprises a parasitic capacitance formed between the first conductor and the ground. Preferably, in the second aspect, the ground has an overlapping area between the first conductor and the adjacent ground on another layer of the circuit substrate. According to another alternative, the ground may be formed in the same layer or a different layer as the first conductor, and the parasitic capacitance is formed between the ground and the adjacent portion of the first conductor.
本发明的天线可以大幅度小型化。 性能稳定， 造价低廉。 换言之， 在给定很小的长度或面积的情况下， 可以将其谐振频率大幅降低。 该 天线可以广泛应用于各种电子产品中。 附图说明 The antenna of the present invention can be greatly miniaturized. Stable performance and low cost. In other words, given a small length or area, its resonant frequency can be greatly reduced. The antenna can be widely used in various electronic products. DRAWINGS
下面将参照附图对本发明的具体实施方案进行更详细的说明，附图 中： DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described in more detail with reference to the accompanying drawings in which:
图 1是根据本发明的第一实施方案的双层板级天线示意图； 图 2是图 1的板级天线的局部放大图； 1 is a schematic diagram of a two-layer board-level antenna according to a first embodiment of the present invention; FIG. 2 is a partial enlarged view of the board-level antenna of FIG.
图 3是具有互感的三层天线的等效电路图； 3 is an equivalent circuit diagram of a three-layer antenna having mutual inductance;
图 4是根据第二实施方案的增加电容两个极板的正对面积 s来引入 电容的示意图； 4 is a schematic diagram of introducing a capacitance by increasing a facing area s of two plates of a capacitor according to a second embodiment;
图 5是根据第三实施方案的减小电容两个极板的正对距离 d来引入 电容的示意图； Figure 5 is a schematic diagram showing the introduction of a capacitance by reducing the facing distance d of the two plates of the capacitor according to the third embodiment;
图 6示意了天线与地形成寄生电容的两种图案； Figure 6 illustrates two patterns of antenna and ground forming parasitic capacitance;
图 7示意了具有寄生电容的三层天线的等效电路图； Figure 7 illustrates an equivalent circuit diagram of a three-layer antenna with parasitic capacitance;
图 8示意了采用本发明天线装置的电路布局； Figure 8 illustrates a circuit layout using an antenna device of the present invention;
图 9是根据第四实施方案的板级天线的示意图。 具体实施方式 Fig. 9 is a schematic diagram of a board level antenna according to a fourth embodiment. Detailed ways
图 1是根据本发明的第一实施方案的双层板级天线示意图。 1 is a schematic diagram of a two-layer board level antenna according to a first embodiment of the present invention.
如图 1所示， 在双层印制电路板的正反两面绕制螺旋板级天线。这 两层的螺旋天线之间用过孔实现连接， 并且从一个方向看 （譬如俯视 角度） ， 两层螺旋天线绕制的方向相同。 图 2是图 1的板级天线的局 部放大图， 其中深色的图案部分是天线顶层， 浅色部分是天线底层。 As shown in Figure 1, the spiral-plate antenna is wound on both sides of the double-layer printed circuit board. The two-layered helical antennas are connected by via holes, and viewed from one direction (for example, a top view angle), the two-layer helical antennas are wound in the same direction. Figure 2 is a partial enlarged view of the board-level antenna of Figure 1, in which the dark pattern portion is the antenna top layer and the light portion is the antenna bottom layer.
因此， 这两层螺旋天线之间将形成互感效应， 大大增加电感量， 降 低了天线的谐振频率。 Therefore, a mutual inductance effect will be formed between the two layers of helical antennas, which greatly increases the inductance and reduces the resonant frequency of the antenna.
值得注意的是， 互感的效果与螺旋天线之间的距离， 即层间距成反
比。 层间距越小， 板子越薄， 螺旋天线距离越近， 互感量越大。 It is worth noting that the effect of mutual inductance and the distance between the helical antennas, that is, the layer spacing is reversed. Than. The smaller the layer spacing, the thinner the board, and the closer the helical antenna is, the greater the mutual inductance.
此外， 可以选择每层螺旋天线的图案， 使其形成的电感性增强， 以 此来降低谐振点。 天线的图案可以是多样化的， 圓形、 矩形或不规则 形状， 重点是形成螺旋效果使其呈感性来降低谐振频率。 In addition, the pattern of each layer of the helical antenna can be selected to increase the inductivity of the layer to reduce the resonance point. The pattern of the antenna can be varied, round, rectangular or irregular, with the emphasis on forming a spiral effect that makes it inductive to reduce the resonant frequency.
需要说明，每层天线可以为非螺旋的其它图案， 不同层天线的图案 也可以不相同， 只要它们能够具有电感特性以在彼此之间形成互感效 应即可。 It should be noted that each layer of antennas may be other patterns that are non-helical, and the patterns of different layers of antennas may also be different as long as they can have inductive characteristics to form a mutual inductance effect between each other.
当然，也可以在多层 PCB板上绕制螺旋天线，以进一步增大互感量。 图 3是具有互感的三层天线的等效电路图。 Of course, it is also possible to wind the spiral antenna on the multilayer PCB to further increase the mutual inductance. Figure 3 is an equivalent circuit diagram of a three-layer antenna with mutual inductance.
如图 3所示， P 0是天线的馈电输入端， r是天线的输入电阻， L1 是顶层天线的等效电感， L2是中间层天线的等效电感， K1是顶层电感 与中间层电感的互感系数。 顶层与中间层之间的距离越近， 互感量越 大， K 1越大， 等效的总和电感量越大。 同理， L 3是底层天线的等效电 感， K2是中间层电感与底层电感的互感系数。 当然， 顶层电感与底层 电感也存在着互感效应， 图示如 K 3。 是负载电阻。 虽然天线中电感的引入可以降低谐振频率，但同时电感也增加了天 线的储能效果， 而不利于辐射。 因此， 需要引入电容以抵消电感带来 的储能效果。 As shown in Figure 3, P 0 is the feed input of the antenna, r is the input resistance of the antenna, L1 is the equivalent inductance of the top antenna, L2 is the equivalent inductance of the intermediate layer antenna, and K1 is the top layer inductor and the middle layer inductor. The mutual inductance coefficient. The closer the distance between the top layer and the middle layer, the larger the mutual inductance, the larger K 1 and the greater the equivalent sum inductance. Similarly, L 3 is the equivalent inductance of the underlying antenna, and K2 is the mutual inductance of the intermediate layer inductance and the underlying inductance. Of course, there is also a mutual inductance effect between the top layer inductor and the bottom layer inductor, as shown by K 3 . Is the load resistance. Although the introduction of the inductance in the antenna can reduce the resonant frequency, the inductance also increases the energy storage effect of the antenna, which is not conducive to radiation. Therefore, it is necessary to introduce a capacitor to offset the energy storage effect of the inductor.
与此同时， 根据等式 （2 ) 可知， 随着引入电容的增大， 使得谐振 频率进一步降低。
At the same time, according to the equation (2), as the introduction capacitance increases, the resonance frequency is further lowered.
其中， f 是天线的谐振频率， L是天线的电感量， C是天线的电容 量。 Where f is the resonant frequency of the antenna, L is the inductance of the antenna, and C is the capacitance of the antenna.
引入电容的方法有两个。 根据电容计算公式 （ 3 ) 可知， 增加电容 两个极板的正对面积 s和减小电容两个极板的正对距离都可以达到引 入电容的目的。 这里电容的两极分别是天线 （an t enna ) 和地 （gnd ) 。 There are two ways to introduce a capacitor. According to the capacitance calculation formula (3), it can be seen that increasing the capacitance of the two plates and the distance between the two plates of the reduced capacitance can achieve the purpose of introducing the capacitance. Here the two poles of the capacitor are the antenna (an t enna ) and the ground (gnd ).
C = k - - d ( 3 ) C = k - - d ( 3 )
其中， C是电容量， k是常数系数， s是电容两个极板的正对面积， d是电容两个极板的正对距离。
图 4是根据第二实施方案的增加电容两个极板的正对面积 s来引入 电容的示意图。 该图以两层板为例。 在图中， 深色的天线图案是天线 顶层， 浅色部分是天线底层。 顶层天线一侧为地； 底层天线向同一侧 面延伸出一定的面积， 并且与顶层的地 （黑色框） 形成重叠， 产生寄 生电容。 Where C is the capacitance, k is the constant coefficient, s is the facing area of the two plates of the capacitor, and d is the facing distance of the two plates of the capacitor. 4 is a schematic diagram of introducing a capacitance by increasing a facing area s of two plates of a capacitor according to a second embodiment. The figure takes a two-layer board as an example. In the figure, the dark antenna pattern is the top layer of the antenna, and the light part is the bottom layer of the antenna. One side of the top antenna is ground; the bottom antenna extends to a certain area on the same side and overlaps with the ground (black frame) of the top layer to generate parasitic capacitance.
当然， 电容的大小可通过重叠区域的面积 s来调整。 Of course, the size of the capacitor can be adjusted by the area s of the overlap region.
图 5是根据第三实施方案的减小电容两个极板的正对距离 d来引入 电容的示意图。 如图 5所示， 双层板级天线的一层中天线和地距离较 近。 当减小天线与地之间的距离到一定程度， 天线和地之间可以产生 寄生电容。 利用这样的寄生电容， 可以抵消电感并且降低天线的谐振 频率。 Fig. 5 is a schematic view showing the introduction of a capacitance by reducing the distance d of the two plates of the capacitor according to the third embodiment. As shown in Figure 5, the antenna and ground are closer in the layer of the two-layer board-level antenna. When the distance between the antenna and the ground is reduced to a certain extent, a parasitic capacitance can be generated between the antenna and the ground. With such parasitic capacitance, the inductance can be cancelled and the resonant frequency of the antenna can be reduced.
此外， 可以用正反两面的地同时与天线形成寄生电容，增大电容以 降低谐振频率。 In addition, the parasitic capacitance can be simultaneously formed with the antenna on both sides of the front and back sides, and the capacitance can be increased to lower the resonance frequency.
当然， 天线与地形成电容的形式可以多种多样。 图 6示意了天线与 地形成寄生电容的两种图案。 需要说明的是， 这仅属示例。 Of course, the form in which the antenna and the ground form a capacitor can be varied. Figure 6 illustrates two patterns of antenna and ground forming parasitic capacitance. It should be noted that this is only an example.
需要说明的是， 也可以在多层 PCB板的不同层上或之间形成图 4 和 5所示的寄生电容， 以进一步增大寄生电容量。 It should be noted that the parasitic capacitances shown in Figs. 4 and 5 can also be formed on or between different layers of the multilayer PCB to further increase the parasitic capacitance.
图 7示意了具有寄生电容的三层天线的等效电路图。顶层天线与地 之间形成的寄生电容为 CP 1 , 中间层天线与地之间形成的寄生电容为 CP2 , 底层天线与地之间形成的寄生电容为 CP 3。 其余电路与图 3相同。 天线领域的普通技术人员知道， 当电磁波传播在某种介质中， 波长 会比其在空气中传播的波长短。 Figure 7 shows an equivalent circuit diagram of a three-layer antenna with parasitic capacitance. The parasitic capacitance formed between the top antenna and ground is CP 1 , the parasitic capacitance formed between the middle layer antenna and ground is CP2 , and the parasitic capacitance formed between the bottom antenna and ground is CP 3 . The remaining circuits are the same as in Figure 3. One of ordinary skill in the art of antennas knows that when electromagnetic waves propagate in a medium, the wavelength will be shorter than the wavelength at which it propagates in the air.
Λ = k .几0 sr~ ( 4 ) Λ = k. A few 0 s r ~ ( 4 )
其中， λ是介质中工作电磁波的波长， k是常数系数， λ。是空气 中工作电磁波的波长， ε r是介质的相对介电常数。 Where λ is the wavelength of the working electromagnetic wave in the medium, and k is a constant coefficient, λ. It is the wavelength of the working electromagnetic wave in the air, and ε r is the relative dielectric constant of the medium.
根据等式（4 )可知， 该介质的相对介电常数 ε r越大， 则波长越短。 再根据等式 （ 1 ) 可知， 波长越短， 其所需的天线长度越短， 越有利于 天线小型化。 因此， 采用高介电常数的 PCB板材有利于实现天线小型 化。 According to the equation (4), the larger the relative dielectric constant ε r of the medium, the shorter the wavelength. According to the equation (1), the shorter the wavelength, the shorter the antenna length required, and the smaller the antenna is. Therefore, the use of a high dielectric constant PCB sheet facilitates miniaturization of the antenna.
图 8示意了采用本发明天线装置的电路布局。 如图所示， 本发明的 天线装置可以紧凑地设置在电路板的一侧， 电路板另一侧配置相应的
电路， 其间采用较小面积的地将它们隔离开。 Figure 8 illustrates the circuit layout of an antenna device employing the present invention. As shown in the figure, the antenna device of the present invention can be compactly disposed on one side of the circuit board, and the other side of the circuit board is configured correspondingly The circuits are separated by a small area of land.
图 9是根据第四实施方案的天线装置的示意图。不同于图 4的地方 在于， 在本图中深色的天线图案是天线顶层， 浅色部分是地层， 而顶 层天线与底层的地之间形成重叠， 产生寄生电容。 换言之， 不是如图 4 那样天线部分向地所在位置延伸， 而是将底层地延伸到天线下方， 与 天线部分形成重叠效果以产生寄生电容。 Fig. 9 is a schematic diagram of an antenna device according to a fourth embodiment. The difference from Fig. 4 is that in this figure, the dark antenna pattern is the top layer of the antenna, the light part is the ground layer, and the top layer antenna overlaps with the ground of the bottom layer to generate parasitic capacitance. In other words, instead of extending the antenna portion to the ground as shown in Fig. 4, the bottom layer is extended below the antenna to form an overlapping effect with the antenna portion to generate parasitic capacitance.
虽然上文结合 F M天线对本发明进行了展开说明， 但是本发明不限 于此， 还可应用于其它类型天线， 以实现小型化。 Although the present invention has been described above in connection with an F M antenna, the present invention is not limited thereto, and can be applied to other types of antennas to achieve miniaturization.
需要说明的是， 前文所述的地既可以是实际上的地， 也可以是一个 相对的参考电位。 It should be noted that the ground described above may be either a physical ground or a relative reference potential.
此外，本发明的天线不仅适用于包括移动电话在内的便携式无线通 信设备中， 还可以适用于其它可便携但主要倾向于静止使用的设备， 比如小钟表或者游戏控制台。 Furthermore, the antenna of the present invention is applicable not only to portable wireless communication devices including mobile phones, but also to other portable devices that are mainly intended for stationary use, such as small timepieces or game consoles.
显而易见， 在此描述的本发明可以有许多变化， 这种变化不能认为 偏离本发明的精神和范围。 因此， 所有对本领域技术人员显而易见的改 变， 都包括在本权利要求书的涵盖范围之内。
It is apparent that there are many variations to the invention described herein, and such variations are not to be construed as departing from the spirit and scope of the invention. Accordingly, all changes which are obvious to those skilled in the art are included within the scope of the claims.
Claims
权利要求书 Claim
I . 一种天线装置，包括电路基板与被覆在电路基板第一层上的第一 导体， 其特征在于所述天线装置还包括被覆在电路基板的至少另一层 上的第二导体， 第一导体和第二导体之间形成互感。 An antenna device comprising a circuit substrate and a first conductor coated on the first layer of the circuit substrate, wherein the antenna device further comprises a second conductor overlying at least another layer of the circuit substrate, the first A mutual inductance is formed between the conductor and the second conductor.
5 2. 如权利要求 1所述的天线装置， 其特征在于调节所述第一层和至 少另一层之间的距离， 来调节天线装置的谐振频率。 The antenna device according to claim 1, wherein the distance between the first layer and at least another layer is adjusted to adjust a resonance frequency of the antenna device.
3. 如权利要求 1所述的天线装置， 其特征在于调节所述第一导体和 第二导体的图案， 来调节天线装置的谐振频率。 The antenna device according to claim 1, wherein the pattern of the first conductor and the second conductor is adjusted to adjust a resonance frequency of the antenna device.
4. 如权利要求 1所述的天线装置， 其特征在于所述至少另一层是两 10 层或以上， 在包括电路基板第一层和至少另一层的各层之间形成多个 互感。 The antenna device according to claim 1, wherein said at least one other layer is two or more layers, and a plurality of mutual inductances are formed between the layers including the first layer of the circuit substrate and at least one other layer.
5. 如权利要求 1所述的天线装置， 其特征在于所述电路基板釆用高 介电常数的板材制成。 The antenna device according to claim 1, wherein said circuit substrate is made of a plate having a high dielectric constant.
6. 如权利要求 1所述的天线装置， 其特征在于所述天线装置还包括 15 在第一导体和地之间形成的寄生电容。 6. The antenna device according to claim 1, wherein said antenna device further comprises a parasitic capacitance formed between said first conductor and ground.
7. 如权利要求 6所述的天线装置， 其特征在于所述地在电路基板的 另一层上， 所述第一导体和相邻的地之间具有重叠的面积。 The antenna device according to claim 6, wherein said ground has another overlapping area between said first conductor and adjacent ground on another layer of the circuit substrate.
8. 如权利要求 6所述的天线装置， 其特征在于所述地与第一导体在 同一层或不同层， 且地和第一导体的相邻部分之间形成所述寄生电容。 8. The antenna device according to claim 6, wherein the ground is formed in the same layer or a different layer as the first conductor, and the parasitic capacitance is formed between the ground and an adjacent portion of the first conductor.
20 9. 如权利要求 1所述的天线装置， 其特征在于所述天线装置用于发 射和 /或接收调频信号。 The antenna device according to claim 1, characterized in that the antenna device is for transmitting and/or receiving a frequency modulated signal.
10. 如权利要求 1 所述的天线装置， 其特征在于第一导体和第二导 体具有基本相同的图案。 10. The antenna device of claim 1 wherein the first conductor and the second conductor have substantially the same pattern.
I I. 如权利要求 1所述的天线装置， 其特征在于所述第一导体和第 25 二导体为螺旋状。 I. The antenna device according to claim 1, wherein said first conductor and said 25th conductor are spiral.
12. 一种天线装置，包括电路基板与被覆在电路基板第一层上的第一 导体， 其特征在于所述天线装置还包括在第一导体和地之间形成的寄 生电容。 12. An antenna device comprising a circuit substrate and a first conductor overlying the first layer of the circuit substrate, wherein the antenna device further comprises a parasitic capacitance formed between the first conductor and the ground.
13. 如权利要求 12所述的天线装置， 其特征在于所述地在电路基板 30 的另一层上， 所述第一导体和相邻的地之间具有重叠的面积。 The antenna device according to claim 12, wherein said ground has another overlapping area between said first conductor and adjacent ground on another layer of circuit substrate 30.
14. 如权利要求 13所述的天线装置， 其特征在于所述地和 /或第一 导体具有延伸部分， 而实现所述第一导体和相邻的地之间的重叠面积。 The antenna device according to claim 13, wherein said ground and/or first conductor has an extension portion to achieve an overlapping area between said first conductor and an adjacent ground.
1002
1002
15. 如权利要求 13所述的天线装置， 其特征在于所述电路基板是多 层板， 在多层板的不同层之间形成所述寄生电容。 The antenna device according to claim 13, wherein said circuit substrate is a multi-layer board, and said parasitic capacitance is formed between different layers of the multi-layer board.
16. 如权利要求 13所述的天线装置， 其特征在于通过调节重叠面积 来调整谐振频率。 16. The antenna device according to claim 13, wherein the resonance frequency is adjusted by adjusting an overlapping area.
17. 如权利要求 12所述的天线装置, 其特征在于所述地和第一导体 的相邻部分之间形成所述寄生电容。 17. The antenna device according to claim 12, wherein said parasitic capacitance is formed between said ground and an adjacent portion of said first conductor.
18. 如权利要求 17所述的天线装置, 其特征在于所述地与第一导体 在同一层或不同层。 18. An antenna device according to claim 17, wherein said ground is in the same layer or a different layer than said first conductor.
19. 如权利要求 17所述的天线装置， 其特征在于所述寄生电容的极 板在相对侧的图案是圓弧或长方形。 19. The antenna device according to claim 17, wherein the pattern of the parasitic capacitance plates on the opposite side is an arc or a rectangle.
20. 如权利要求 17所述的天线装置， 其特征在于通过调节所述地和 第一导体之间的距离来调整谐振频率。 20. An antenna device according to claim 17, wherein the resonant frequency is adjusted by adjusting the distance between the ground and the first conductor.
21. 如权利要求 17所述的天线装置, 其特征在于所述电路基板是多 层板， 在多层板的其它层中或之间形成所述寄生电容。 21. An antenna device according to claim 17, wherein said circuit substrate is a multi-layer board, said parasitic capacitance being formed in or between other layers of the multi-layer board.
22. 如权利要求 12所述的天线装置， 其特征在于所述电路基板采用 高介电常数的板材制成。 An antenna device according to claim 12, wherein said circuit substrate is made of a plate having a high dielectric constant.
23. 如权利要求 12所述的天线装置， 其特征在于所述天线装置还包 括被覆在电路基板的至少另一层上的第二导体， 第一导体和第二导体 之间形成互感。 23. The antenna device of claim 12, wherein the antenna device further comprises a second conductor overlying at least one other layer of the circuit substrate, the mutual inductance being formed between the first conductor and the second conductor.
24. 如权利要求 12所述的天线装置， 其特征在于所述天线装置用于 发射和 /或接收调频信号。 24. An antenna device according to claim 12, characterized in that said antenna device is for transmitting and/or receiving a frequency modulated signal.
25. 一种电子产品， 包括如权利要求 1或 12所述的天线装置。
An electronic product comprising the antenna device according to claim 1 or 12.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008801299916A CN102067377A (en) | 2008-06-25 | 2008-06-25 | An antenna device and an electronic product of using it |
| PCT/CN2008/001224 WO2009155732A1 (en) | 2008-06-25 | 2008-06-25 | An antenna device and an electronic product of using it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| PCT/CN2008/001224 WO2009155732A1 (en) | 2008-06-25 | 2008-06-25 | An antenna device and an electronic product of using it |
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| WO2009155732A1 true WO2009155732A1 (en) | 2009-12-30 |
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| PCT/CN2008/001224 WO2009155732A1 (en) | 2008-06-25 | 2008-06-25 | An antenna device and an electronic product of using it |
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| CN (1) | CN102067377A (en) |
| WO (1) | WO2009155732A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5608364A (en) * | 1993-11-02 | 1997-03-04 | Ngk Insulators, Ltd. | Layered stripline filter including inductive coupling adjustment strip |
| EP0831548A2 (en) * | 1996-09-24 | 1998-03-25 | Murata Manufacturing Co., Ltd. | Antenna |
| JP2002111348A (en) * | 2000-09-26 | 2002-04-12 | Kenwood Corp | Antenna |
| US20040227672A1 (en) * | 2003-05-15 | 2004-11-18 | Kai-Te Chen | Antenna with printed compensating capacitor |
| WO2007101992A1 (en) * | 2006-03-06 | 2007-09-13 | Innovision Research & Technology Plc | A near field rf communicator and an antenna for near field rf communicators |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2101329U (en) * | 1991-09-13 | 1992-04-08 | 上海天下电子电器有限公司 | Miniature tv receiving antenna |
| JP3123363B2 (en) * | 1994-10-04 | 2001-01-09 | 三菱電機株式会社 | Portable radio |
| JP4105987B2 (en) * | 2003-06-24 | 2008-06-25 | 京セラ株式会社 | Antenna, antenna module, and wireless communication apparatus including the same |
| CN101060200B (en) * | 2007-06-12 | 2011-06-22 | 北京交通大学 | A floor-mounted curve groove type elliptic plane monopolar antenna |
-
2008
- 2008-06-25 WO PCT/CN2008/001224 patent/WO2009155732A1/en active Application Filing
- 2008-06-25 CN CN2008801299916A patent/CN102067377A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5608364A (en) * | 1993-11-02 | 1997-03-04 | Ngk Insulators, Ltd. | Layered stripline filter including inductive coupling adjustment strip |
| EP0831548A2 (en) * | 1996-09-24 | 1998-03-25 | Murata Manufacturing Co., Ltd. | Antenna |
| JP2002111348A (en) * | 2000-09-26 | 2002-04-12 | Kenwood Corp | Antenna |
| US20040227672A1 (en) * | 2003-05-15 | 2004-11-18 | Kai-Te Chen | Antenna with printed compensating capacitor |
| WO2007101992A1 (en) * | 2006-03-06 | 2007-09-13 | Innovision Research & Technology Plc | A near field rf communicator and an antenna for near field rf communicators |
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