WO2009144823A1

WO2009144823A1 - Heat dissipation structure of electronic device and electronic device comprising the same

Info

Publication number: WO2009144823A1
Application number: PCT/JP2008/060065
Authority: WO
Inventors: 後藤克一
Original assignee: 富士通株式会社
Priority date: 2008-05-30
Filing date: 2008-05-30
Publication date: 2009-12-03

Abstract

A heat absorbing member (322) is arranged on the first surface (321b) side of a printed substrate (321). A fan unit (324) is arranged on the second surface (321c) side which is the back surface of the first surface (321b) of the printed substrate (321). A heat dissipation structure (320) comprises a stud (323) which is a connection member which runs through the printed substrate (321) and comes into contact with the heat absorbing member (322) and the fan unit (324). The stud (323) extends from the heat absorbing member (322), runs through the printed substrate (321), and comes into contact with the fan unit (324) in a state in which the heat dissipation structure (320) is assembled. Heat generated by an electronic component is dissipated via the heat absorbing member (322) and can be dissipated by use of direct discharge from the fan unit (324).

Description

Electronic device heat dissipation structure and electronic device equipped with the same

The present invention relates to a heat dissipation structure for an electronic device and an electronic device including the same.

In an electronic device such as a personal computer, electronic components housed therein generate heat, and the inside of the electronic device becomes hot. When heat accumulates inside the electronic device, there is a problem that the performance of the electronic component deteriorates, and it is necessary to efficiently dissipate the heat generated inside the electronic device.

The heat dissipation structure that dissipates the heat in the electronic device includes an air intake port that takes air into the housing of the electronic device, an air exhaust port that exhausts the heat in the housing, and a heat exhaustor that absorbs heat generated by the electronic components. A heat sink that transfers heat and a cooling fan that absorbs the heat of the heat sink into the air and exhausts it from the exhaust port are widely used.

For example, Tape Carrier Package (TCP) mounted on the back side of the circuit board, a heat receiving part for releasing the heat of the TCP in the direction of the surface of the circuit board, and the heat of the TCP via the heat receiving part. 2. Description of the Related Art A circuit module including a cold plate that receives a fan unit and a fan unit that includes a rotor and a fan case that houses the rotor is known. There is also known a CPU module in which a heat dissipation module is mounted on a CPU mounted on a central processing unit (CPU) module substrate. Also, a personal computer main body is known in which a fan for forced cooling is installed on a CPU that is a main heat source, and a heat plate is fixed on the fan (Patent Document 1, Patent Document). 2, see Patent Document 3).

JP-A-10-303582 JP 2001-135761 A JP 2003-133773 A

Incidentally, recent electronic devices are required to further increase the processing speed and diversify the functions to be mounted. In order to realize such a demand, higher performance and higher density of electronic components built in electronic devices are being promoted. As a result, the heat generated inside the electronic device is increasing. For this reason, the heat quantity which a heat sink and a fan should process has increased. In recent years, electronic devices have been miniaturized, and it has been required to narrow a space for accommodating a heat sink, a cooling fan, and the like.

For such a situation, the contents disclosed in the above patent documents all have room for further improvement.

Therefore, in view of the above circumstances, the present invention provides a heat dissipation structure for an electronic device and an electronic device equipped with the heat dissipation structure that can achieve both a reduction in size of the structure and an improvement in heat dissipation efficiency.

In order to solve the above problems, a heat dissipation structure for an electronic device disclosed in this specification includes a heat absorbing member disposed on the first surface side of the printed circuit board, a heat dissipating fin that dissipates heat collected in the heat absorbing member, A fan unit that is disposed on the second surface side of the printed circuit board and blows air to the heat radiating fin; and a connection member that passes through the printed circuit board and thermally connects the heat absorbing member and the fan unit. Yes.

The heat-absorbing member collects heat generated by electronic components such as a CPU mounted on the printed circuit board. The heat collected on the heat absorbing member is transferred to the heat radiating fins. The heat radiating fins are arranged on the air flow path of the fan unit, and the heat transferred to the heat radiating fins is radiated by the air blown by the fan unit. Thereby, cooling in an electronic device is performed.

In addition to the above heat dissipation, the heat dissipation structure of the electronic device disclosed in the present specification can also dissipate a part of the heat collected in the heat absorbing member directly by blowing air from the fan unit. In the heat dissipation structure for an electronic device disclosed in this specification, heat can be transmitted to the fan unit by contacting the heat absorbing member and the fan unit via a connection member that is thermally connected. The heat transmitted to the fan unit is radiated by the fan unit.

¡Efficient heat dissipation by two heat dissipation routes is possible in this way, so that there is room for designing the heat capacity of the heat dissipation structure. As a result, the heat dissipation structure can be reduced in size, and thus the electronic device can be reduced in size.

It is possible to provide a heat dissipation structure for electronic equipment that achieves both a compact structure and improved heat dissipation efficiency.

FIG. 1 is an external view of a laptop personal computer which is a specific embodiment of an electronic apparatus. FIG. 2 is a diagram showing one side of the personal computer. FIG. 3 is a diagram showing a side surface of the personal computer opposite to FIG. FIG. 4 is an internal configuration diagram of the personal computer. FIG. 5 is an internal configuration diagram of the main unit. FIG. 6 is a plan view of a portion including a heat dissipation structure housed in the main body housing in the embodiment. FIG. 7 is a bottom view of a portion including a heat dissipation structure accommodated in the main body housing in the embodiment. FIG. 8 is an explanatory view schematically showing a state in which the printed board, the heat absorbing member, the heat radiating fins, and the fan unit included in the heat radiating structure in the embodiment are disassembled. FIG. 9 is an explanatory view schematically showing a state in which the printed circuit board, the heat absorbing member, the heat radiating fins, and the fan unit included in the heat radiating structure are assembled in the embodiment. FIG. 10 is an explanatory view schematically showing a printed circuit board and a heat absorbing member, a heat radiating fin, and a fan unit included in the heat radiating structure in a comparative example in an exploded state. FIG. 11 is an explanatory diagram schematically showing a state in which a printed board, a heat absorbing member, a heat radiating fin, and a fan unit included in a heat radiating structure are assembled in a comparative example. FIG. 12 is an explanatory diagram showing the positional relationship between the inside of the fan unit and the radiation fins. FIG. 13 is a diagram showing the back of the personal computer in a state where the display unit is closed with respect to the main unit. FIG. 14 is an internal configuration diagram of the main unit near the heat dissipation structure. FIG. 15 is an explanatory view schematically showing a state in which a printed board having a notch, a heat absorbing member, a heat radiating fin, and a fan housing included in the heat radiating structure are disassembled. FIG. 16 is an explanatory view schematically showing a state in which a printed board having a notch, a heat absorbing member, a heat radiating fin, and a fan housing included in the heat radiating structure are assembled.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is an external view of a laptop personal computer 10 which is one of the specific embodiments of the electronic apparatus of the present invention.

The personal computer 10 includes a main unit 20 and a display unit 30. The display unit 30 is connected to the main unit 20 by a hinge part 40 so as to be freely opened and closed. FIG. 1 shows a view of the personal computer 10 with the display unit 30 opened as viewed from the front.

The main unit 20 is for executing various types of information processing, and a CPU, a hard disk device, and the like are accommodated in the main body housing 28. A keyboard 21, a track pad 22, a left click button 23, a right click button 24, and the like are provided on the upper surface of the main body housing 28. Further, a fingerprint sensor 25 that performs fingerprint authentication by tracing a fingertip and a medium loading port 26 into which a small recording medium is loaded are provided in front of the main body housing 28.

The display unit 30 is for displaying the information processing result executed by the main unit 20. The display unit 30 includes a display housing 32. A thin liquid crystal panel, a liquid crystal panel control circuit, a communication antenna, and the like are accommodated in the display housing 32. As shown in FIG. 2, the display housing 32 includes a front cover 32A and a rear cover 32B, and the liquid crystal panel is sandwiched from the front and rear by the front cover 32A and the rear cover 32B with the display screen 31 in the front side. . The display unit 30 is a wide-type display device in which the display screen 31 is extended to the vicinity of the side surface of the display housing 32 by arranging various electronic components not on the side of the liquid crystal panel but on the back side.

FIG. 2 is a diagram illustrating one side of the personal computer 10.
On one side of the main unit 20, a security slot 26a for locking with a wire cable, a connector 26b for a power supply module, and a connector 26c for an external monitor are provided. In addition, a connector 26d for a Local Area Network (LAN) cable and

connectors

26e and 26f for Universal Serial Bus (USB) are provided. Further, an audio jack connector 26g, a microphone connector 26h, a headphone connector 26i, and the like are provided.

FIG. 3 is a diagram showing a side surface of the personal computer 10 opposite to that in FIG. On the side opposite to FIG. 2 of the main unit 20, an expansion card loading slot 27a for loading an expansion card for function expansion such as a LAN card, Compact 、 Disc (CD), Digital Versatile Disk (DVD), etc. An optical disk loading port 27b for loading the optical disk is provided. In addition, a USB connector 27c and a modem connector 27d are provided.

Next, the internal configuration of the personal computer 10 will be described.
FIG. 4 is an internal configuration diagram of the personal computer 10.
As shown in FIG. 4, the personal computer 10 includes a CPU 101 that executes various programs and a hard disk device 103 that stores various programs and data. Further, a main memory 102 is built in which a program stored in the hard disk device 103 is read and expanded for execution by the CPU 101. Further, an audio device 104 equipped with a microphone, a speaker, and the like, and an input interface 105 for inputting data from an external device are incorporated. Further, an operation element 106 including a keyboard 21 and a track pad 22, a display device 107 for displaying information on a display screen 31, and a fingerprint sensor 25 shown in FIG. 1 are incorporated. In addition, a small recording medium 61 is loaded, and a small memory drive 109 for accessing the loaded small recording medium 61 is incorporated. Further, a compact disk read only memory (CD-ROM) 62 and a DVD are loaded, and an optical disk drive 110 for accessing the loaded CD-ROM 62 and DVD is incorporated. Further, a communication interface 111 that performs communication using the expansion card 63, an output interface 112 that outputs data to an external device, and the like are incorporated. These various elements are connected to each other via a bus 113.

FIG. 5 is an internal configuration diagram of the main unit 20.
As shown in FIG. 5, a power supply control circuit 331 connected to the connector 26b for the power supply module shown in FIG. 2 and a display control circuit 332 connected to the connector 26c for an external monitor are provided inside the main body housing 28. The communication control circuit 333 connected to the LAN cable connector 26d is accommodated. The input / output control circuit (not shown in FIG. 5) connected to the

USB connectors

26e, 26f, and 27c, the audio jack connector 26g, the microphone connector 26h, and the headphone connector 26i are connected. The audio circuit 335 is accommodated. Further, the expansion processing circuit (not shown in FIG. 5) connected to the expansion card loading slot 27a shown in FIG. 3, the optical disk drive 110 connected to the optical disk loading slot 27b, and the data connected to the modem connector 27d. A conversion circuit 337 is accommodated. In addition to these, various electronic components such as a heat dissipation structure (hereinafter simply referred to as a heat dissipation structure) 320 of an electronic device for radiating heat generated in the main body housing 28 and a rechargeable battery 310 are accommodated. Yes.

Next, the configuration of the heat dissipation structure 320 of this embodiment will be described.

FIG. 6 is a plan view of a portion including the heat dissipation structure 320 of the present embodiment housed in the main body housing 28. FIG. 7 is a bottom view of a portion including the heat dissipation structure 320. FIG. 8 is an explanatory view schematically showing the printed circuit board 321 and the heat absorbing member 322, the heat radiating fins 326, and the fan unit 324 included in the heat radiating structure 320 in the present embodiment in an exploded state. FIG. 9 is an explanatory diagram schematically showing the printed circuit board 321 and the heat absorbing member 322, the heat radiating fins 326, and the fan unit 324 included in the heat radiating structure 320 in this embodiment.

[Configuration of Heat Dissipation Structure 320 of this Embodiment]
In the personal computer 10 of this embodiment, the CPU 101 and some other electronic components are mounted on a printed circuit board 321 as shown in FIGS. The CPU 101 is mounted on the first surface 321 b of the printed circuit board 321. Two through holes 321a are formed in the printed circuit board 321 as shown in FIGS. The through hole 321a is provided on the side of the CPU 101 that easily generates heat among electronic components.

The heat absorbing member 322 is disposed on the first surface 321b side of the printed board 321. A fan unit 324 is disposed on the second surface 321c side which is the back surface of the first surface 321b of the printed circuit board 321. That is, the heat absorbing member 322 and the fan unit 324 are arranged so as to sandwich the printed circuit board 321. The fan unit 324 houses a fan 324a inside the fan housing 324b. The fan unit 324 dissipates heat collected by the heat absorbing member 322 by blowing air.

The heat dissipation structure 320 also includes a stud 323 that passes through the printed circuit board 321 and contacts the heat absorbing member 322 and the fan unit 324. The stud 323 extends from the heat absorbing member 322 in a state where the heat dissipation structure 320 is assembled, passes through the printed board 321, and contacts the fan unit 324. The stud 323 is an example of a connection member that passes through the printed board 321 and thermally connects the heat absorbing member 322 and the fan unit 324.

The heat absorbing member 322 is a copper plate and is disposed so as to cover the CPU 101. The heat absorbing member 322 collects heat generated by the CPU 101 and other electronic components.

Stud 323 is a solid copper rod. The stud 323 passes through the side of the CPU 101 through the through hole 321a.

The heat absorbing member 322 and the stud 323 are integrated by welding, and the stud 322 extends from the heat absorbing member 323. Thus, heat transfer efficiency from the heat absorption member 322 to the stud 323 is improved by integrating the heat absorption member 322 and the stud 323 instead of simply contacting each other.

In order to transfer heat from the heat absorbing member 322 to the stud 323, the stud 323 and the heat absorbing member 322 may be in contact with each other. However, the heat transfer efficiency between the heat absorbing member 322 and the stud 323 can be improved by providing them integrally by welding. In addition, since the stud 323 and the heat absorbing member 322 are integrated, the number of steps in the assembly process of the heat dissipation structure 320 can be reduced, which is convenient.

One end side of the heat pipe 325 is attached to the heat absorbing member 322. The other end of the heat pipe 325 is attached to the upper surface of the heat radiating fin 326. The heat dissipating fins 326 are arranged on the air blowing path of the fan unit 324 in an assembled state. The heat pipe 325 encloses the working fluid therein, takes heat by vaporization of the working fluid, and dissipates heat when the vaporized working fluid moves to the other end side and returns to the liquid again. By this action, the heat collected in the heat absorbing member 322 is moved to the heat radiating fins 326. The heat that has moved to the heat radiating fins 326 is dissipated by blowing air from the fan unit 324.

On the other hand, the stud 323 extending from the heat absorbing member 322 passes through the side of the CPU 101 and contacts the fan unit 324 through the through hole 321a provided in the printed circuit board 321 as described above. The stud 323 is fixed to the fan housing 324b. Specifically, the fan housing 324b is provided with two screwing portions 327. The fan housing 324b and the stud 323 are fixed by a screw 328 through a screw hole provided in the screw fixing portion 327. By fixing the stud 323 to the fan housing 324b in this way, the heat transfer efficiency from the stud 323 to the fan unit 324 is improved. In order to transfer heat from the stud 323 to the fan unit 324, the stud 323 and the fan unit 324 may be in contact with each other. However, by fixing these, the thermal bondability is improved and the heat transfer efficiency is improved. be able to. If the heat transfer efficiency to the fan unit 324 is improved, the heat dissipation efficiency by the air blowing from the fan 324a is also improved.

FIG. 12 is an explanatory view showing the positional relationship between the inside of the fan unit 324 and the radiation fins 326. The fan 324a accommodated in the fan housing 324b can suck air from both the top surface side and the bottom surface side of the fan housing 324b. Then, an airflow in the centrifugal direction is generated and blown on the blowing path indicated by an arrow 329 in FIG. On the ventilation path 329, the radiation fin 326 and the exhaust port 411 provided in the main body housing | casing 28 are arrange | positioned.

[Configuration of Heat Dissipation Structure 500 of Comparative Example]
Next, a heat dissipation structure having a different configuration from the heat dissipation structure 320 of the present embodiment described above will be described as a comparative example.
FIG. 10 is an explanatory diagram schematically showing the printed circuit board 501 and the heat absorbing member 502, the heat radiating fins 506, and the fan unit 504 included in the heat radiating structure 500 in a comparative example. Further, FIG. 11 is an explanatory view schematically showing a state in which the printed board 501 and the heat absorbing member 502, the heat radiating fins 506, and the fan unit 504 included in the heat radiating structure 500 are assembled in the comparative example.
In the heat dissipation structure 500 in the comparative example, the CPU 101 and some other electronic components are mounted on a printed board 501 as shown in FIGS. This is the same as in this embodiment. However, the printed circuit board 501 does not have a through hole through which the stud penetrates unlike the printed circuit board 321 of the present embodiment.

The heat absorbing member 502 is disposed on the first surface 501b side of the printed circuit board 501 on which the CPU 101 is mounted. A fan housing 504 with a built-in fan 504a is disposed on the second surface 501c side which is the back surface side of the first surface 501b. Here, the heat absorbing member 502 itself is the same as the heat absorbing member 322 in the present embodiment. A fan unit 504 in which the fan 504a is built in the fan housing 504b is also the same as the fan unit 324 in this embodiment.

However, the heat dissipating structure 500 is different from the heat dissipating structure 320 of this embodiment in the stud mounting method.
Specifically, in the heat dissipation structure 500, the printed circuit board 501 includes two studs 503a on the first surface 501b side and two studs 503b on the second surface 501c side. That is, the

studs

503a and 503b are arranged on both sides of the printed circuit board 501 with the printed circuit board 501 therebetween.

One end side of the heat pipe 505 is attached to the heat absorbing member 502. The other end of the heat pipe 505 is attached to the upper surface of the heat radiating fin 506. The heat radiating fins 506 are arranged on the air blowing path of the fan 504a in an assembled state. These points are the same as the heat dissipation structure 320 of the present embodiment.

However, the heat absorbing member 502 is screwed to the stud 503a mounted on the first surface 501b side of the printed circuit board 501 with screws 508. The fan housing 504b is fixed to a stud 503c attached to the second surface 501c side of the printed circuit board 501. Specifically, the fan housing 504b includes a screw stopper 507 provided with a screw hole. The fan housing 504 b is screwed using a screw 508 through a screw hole provided in the screw fixing portion 507. As a result, the fan housing 504b and the stud 503c are fixed.

The heat dissipation structure 320 of the present embodiment as described above and the heat dissipation structure 500 of the comparative example are different from each other as follows.

In the heat dissipation structure 320, the heat absorbing member 322 disposed so as to cover the CPU 101 absorbs the heat radiated from the CPU 101. Part of the heat collected by the heat absorbing member 322 is transmitted to the fan unit 324 through the stud 323. The heat transferred to the fan unit 324 is directly radiated by the air blown by the fan 324a. Thus, in this embodiment, a part of the heat quantity radiated through the heat absorbing member 322 and the heat pipe 325 can be directly radiated by the air blown by the fan 324a. Thereby, the amount of heat dissipated through the heat absorbing member 322 and the heat pipe 325 is reduced, and efficient heat dissipation can be performed.

On the other hand, in the heat dissipation structure 500 of the comparative example, the heat absorbing member 502 arranged so as to cover the CPU 101 absorbs the heat radiated from the CPU 101. The heat collected in the heat absorbing member 502 moves to the heat radiating fins 506 through the heat pipe 505 and is radiated by the air blown by the fan 504a.
Here, the stud 503a attached to the first surface 501b of the printed board 501 and the stud 503b attached to the second surface 501c are separate bodies. Furthermore, it is divided by a printed circuit board 501 having low thermal conductivity. For this reason, in the heat dissipation structure 500, it is difficult to transmit a part of the heat radiated through the heat absorbing member 502 to the fan unit 504. As a result, it is difficult to directly dissipate heat by blowing air from the fan 504a.

As described above, the heat dissipation structure 500 of the comparative example does not include a configuration in which a part of the heat radiated through the heat absorbing member 502, the heat pipe 505, and the heat radiating fin 506 is radiated by direct exhaust of the fan 504a. On the other hand, the heat dissipation structure 320 of the present embodiment can dissipate a part of the heat absorbed by the heat absorbing member 500 by direct exhaust of the fan 324a. That is, a part of the heat dissipation process can be directly borne by the fan 324a. For this reason, there is a surplus in the heat capacity that can be radiated and the structure can be downsized.

Furthermore, the heat dissipation structure 320 can reduce the number of assembly steps as compared with the heat dissipation structure 500 of the comparative example. In other words, the heat dissipation structure 500 includes a total of four studs, two studs 503a and two studs 503b. Therefore, the screwing process for these studs also requires four processes. On the other hand, the heat dissipation structure 320 of this embodiment includes only two studs 323. Therefore, the screwing process for the stud is also a process for two. In addition, the mounting process of the stud itself requires four processes in the comparative example, whereas only two processes are required in this embodiment.

The heat dissipation structure 320 configured as described above is arranged in the main body housing 28 of the personal computer 10.

FIG. 13 is a rear view of the personal computer 10 in a state where the display unit 30 is closed with respect to the main unit 20.
A rechargeable battery 310 shown in FIG. 5 is fitted into the main unit 20 on the back surface of the personal computer 10. Further, an intake port 412 through which air can be supplied to the heat dissipation structure 320 and an exhaust port 411 through which air is discharged during heat dissipation are provided. The intake port 412 is provided above the exhaust port 411. Thereby, the problem that the heat accumulated near the bottom of the personal computer 10 is taken in from the air inlet 412 is reduced. As a result, the heat radiation efficiency can be maintained even if the personal computer 10 is continuously used.

FIG. 14 is an internal configuration diagram near the heat dissipation structure 320 incorporated in the main body housing 28 of the main body unit 20 of the personal computer 10.
As shown in FIG. 14, the body housing 28 is provided with an intake port 412 and an exhaust port 411. The intake port 412 and the exhaust port 411 are provided on different surfaces of the main body housing 28. That is, the intake port 412 is provided on the upper surface of the main body housing 28, and the exhaust port 411 is provided on the back surface of the main body housing 28. Further, the air inlet 412 is located in front of the display unit 30 in a state where the display unit 30 is opened. Further, the exhaust port 411 is located behind the display unit 30. By arranging the intake port 412 and the exhaust port 411 in this way, the space between the intake port 412 and the exhaust port 411 is divided by the display unit 30, so that the heat radiation efficiency can be maintained. it can. Specifically, high-temperature air exhausted from the exhaust port 411 can be prevented from being sucked again from the intake port 412.

Further, even when the display unit 30 is closed, the air inlet 412 is exposed to the outer surface of the personal computer 10. Thereby, even when the display unit 30 is closed, air can be taken in from the air inlet 412, and heat generated during operation in a state where the display unit 30 is closed is surely dissipated outside the main body housing 28. can do.

Thus, the air taken into the main body housing 28 from the intake port 412 provided in the main body housing 28 is sent out toward the exhaust port 411 by the fan 324a. In the vicinity of the exhaust port 411, the radiation fins 326 are arranged as shown in FIG. The air sent out by the fan 324 a absorbs the heat absorbed by the heat radiating fins 326 and is discharged to the outside of the main body housing 28 through the exhaust port 411. Thereby, heat dissipation can be performed.

Next, a modification of the heat dissipation structure will be described with reference to FIGS. In this modification, the shape of the printed circuit board 321 on which the heat dissipation structure 320 is arranged is different from that in the above embodiment. Specifically, it is as follows. In other words, in the above embodiment, the printed circuit board 321 includes the through hole 321a. On the other hand, in this modification, the printed board 321 is provided with a notch 321d instead of the through hole 321a. The stud 323 extends from the heat absorbing member 322 through the notch 321d and passes through the printed board 321 in a state where the heat dissipation structure 320 is assembled. The fan unit 324 is fixed to the fan housing 324b.

Moreover, the printed circuit board 321 does not necessarily have to include the through hole 321a and the notch 321d. For example, it may be configured such that the stud 323 passes through the side of the printed circuit board 321 when assembled. In other words, any configuration is acceptable as long as it passes through the printed board 321 and allows heat transfer between the heat absorbing member 322 and the fan unit 324.

The above-described embodiments are merely examples for carrying out the present invention, and the present invention is not limited to these embodiments. Various modifications of these embodiments are within the scope of the present invention, and further, It is apparent from the above description that various other embodiments are possible within the scope. For example, in the above-described embodiment, a personal computer is shown as one form of the electronic device. However, the electronic device may be a server, a personal digital assistant (PDA), a game machine, a television, a mobile phone, or the like. .

In the above description, the display panel is a liquid crystal panel, but the type of the display panel such as a plasma display, a field emission display, or an organic EL display is not questioned.

Furthermore, in this embodiment, welding is used as a method for integrating the stud 323 with the heat absorbing member 322, but so-called caulking processing such as spindle processing can also be employed. Moreover, it can also shape | mold integrally from the beginning by press work.

In the present embodiment, the stud 323 is a solid copper rod, but a hollow rod may be employed in consideration of heat capacity and the like. Also, the material is not limited to copper, and can be appropriately selected in consideration of the heat capacity and the like. The same applies to the material of the heat absorbing member 322, and can be selected as appropriate.

Claims

An endothermic member disposed on the first surface side of the printed circuit board;
A radiating fin for radiating the heat collected in the heat absorbing member;
A fan unit that is arranged on the second surface side of the printed circuit board and blows air to the heat dissipating fins;
A connecting member that passes through the printed board and thermally connects the heat absorbing member and the fan unit;
Heat dissipation structure for electronic equipment with
The heat dissipation structure for an electronic device according to claim 1, wherein the connection member passes through a through hole formed in the printed board.
The heat dissipation structure for an electronic device according to claim 1 or 2, wherein the connecting member is fixed to the fan unit.
4. The heat dissipation structure for an electronic device according to any one of claims 1 to 3, wherein the connecting member is a stud.
A heat dissipation structure for an electronic device according to any one of claims 1 to 4,
An electronic component provided on the first surface of the printed circuit board;
With electronic equipment.
The electronic device according to claim 5, wherein the stud passes laterally of the electronic component.