WO2009115063A1

WO2009115063A1 - Arrangement, lamp arrangement and method for emitting light

Info

Publication number: WO2009115063A1
Application number: PCT/DE2008/000472
Authority: WO
Inventors: Raimund Oberschmid
Original assignee: Osram Gesellschaft mit beschränkter Haftung
Priority date: 2008-03-17
Filing date: 2008-03-17
Publication date: 2009-09-24

Abstract

An arrangement for emitting light is disclosed, comprising a carrier element (1), at least one semi-conductor component (2) emitting the light, the semi-conductor component (2) being disposed on the carrier element (1), and a sleeve-shaped housing bottom (3), which is open towards two opposing sides (31, 32).

Description

description

Arrangement, lamp arrangement and method for emitting light

The invention relates to an arrangement for emitting light or a method for removing heat from light-emitting semiconductor components.

In the living area, sometimes atmospheric chandeliers in the form of, for example, crystal chandeliers, also referred to as chandeliers, are used as means of illumination with incandescent lamps in the shape of a candle. In this case, particularly clear incandescent lamps are used, since especially their filaments have a high light output concentrated at a certain point or a certain line, which lead to the desired atmospheric color refractions on the specially cut crystal hangings.

When using conventional incandescent lamps, however, the electro-optical efficiency of a lighting device is worse than, for example, when using light-emitting semiconductor components. Especially with lights or lamp assemblies with more than one bulb is usually one, in relation to the luminous efficacy, high electrical energy needed to operate. The electro-optical efficiency is about 5%, with the remaining electrical energy being largely converted into thermal energy.

It is therefore anxious to increase the electro-optical efficiency. Therefore, incandescent lamps are increasingly being replaced by light-emitting diodes (LEDs). When using light-emitting diodes whose light output is already much better these days, than The light output of conventional incandescent lamps, a much lower percentage of electrical energy is converted into thermal energy. Since, however, the active area in which the emitted light is produced is generally lower in the case of LEDs than in the case of incandescent lamps, it is precisely the use of LEDs which increasingly requires care for sufficient heat dissipation. Since the lighting equipment used in the living area should meet certain aesthetic requirements, this heat dissipation should be as inconspicuous and inconspicuous as possible.

It is therefore an object of the invention to provide an arrangement for emitting light, which has an improved electro-optical efficiency over incandescent lamps and allows a very efficient and aesthetic heat dissipation.

This object is achieved with the measures indicated in the independent claims. There is shown an arrangement for emitting light comprising a support member and at least one semiconductor device emitting the light. The semiconductor component is arranged on the carrier element and has a sleeve-shaped housing lower part open to two opposite sides. The support member is mechanically connected to the lower housing part, heat-conducting and at least partially enveloped by the lower housing part, without the open sides of the housing lower part are thereby closed.

Furthermore, a lamp device is provided, which has at least one mechanical arm and an electrical socket. The electrical socket is arranged on the mechanical arm. An arrangement for emitting Light, wherein the housing lower part with the electrical socket is mechanically detachable and electrically connected, so that the arrangement for emitting light via the electrical socket is operable, is additionally provided. The carrier element and the lower housing part are formed such that a chimney effect occurs in the interior of the arrangement, which removes the heat generated in the interior of the arrangement outside of the arrangement.

Finally, a method is provided for removing heat from light-emitting semiconductor components, with the method steps:

Forming a housing lower part as a sleeve and opening the sleeve on two opposite sides,

Placing a carrier element in the housing lower part so that none of the openings is closed,

Placing at least one semiconductor component on the carrier element, as well as

- Operating the semiconductor device.

The measures described in the independent claims creates a so-called chimney effect within the arrangement. The chimney effect is a physical effect caused by a heat source that creates an upward flow of air. The actual chimney effect is based on heat flow. If the semiconductor device is in operation, it will emit a high amount of energy in the infrared part of the electromagnetic spectrum. This is also called thermal radiation or radiating thermal energy. This thermal energy heats the air surrounding the semiconductor device. Characterized in that the carrier element, on which the semiconductor component is arranged, is heat-conducting and at least partially in a sleeve sen-shaped housing lower part, this heated air according to the laws of thermals, also called convection, through the upper of the open sides of the housing base rise upwards. In the sleeve thereby creates a negative pressure, which is compensated by the fact that cold air flows. This colder air passes primarily through the lower of the open sides of the sleeve in the lower housing part and in turn leads past the heat dissipating semiconductor device. As a result, the semiconductor device is cooled. The chimney effect creates an air flow which leads the ever-colder air from the environment to the heat-emitting semiconductor component and thereby cools this semiconductor component. It comes to heat transfer from the semiconductor device to the passing air.

Further advantageous embodiments are described in the subordinate claims.

For improved Nachempfinden an atmospheric light of the arrangement a plurality of semiconductor devices are arranged on the carrier element. By choosing different wavelengths and superimposing or mixing these wavelengths in the arrangement, a mixed light is produced which resembles a candle or an incandescent lamp.

If the semiconductor devices are placed on cantilevers of the carrier element, an improved light emission of the device is produced. The more cantilever the carrier element has, the higher the total surface area of the carrier element, whereby the semiconductor components arranged thereon are better cooled. The chimney effect additionally generates more cooling of the support element due to the larger surface area. By placing the semiconductor devices on the cantilevers it is again possible to provide the inner part of the support element by means of reflective or reflective surfaces in order to produce the most authentic incandescent or Glimmkerzenlicht.

If a plurality of semiconductor components are provided in the arrangement, then these are connected in parallel, for example. This makes it easier to produce wiring and contacting connections. In this case, a first terminal of the semiconductor component is preferably connected to the heat sink in an electrically conductive manner. For this purpose, for example, SMT-based semiconductor devices on the chip side on a first, usually large-area connection, which is soldered or clamped to the support member. The carrier element thereby forms a common reference point of all semiconductor components and is electrically conductive. A second terminal is isolated from the first terminal on an electrically isolated from the carrier element metal conductor of the support element out. Preference is given to a series circuit of semiconductor components which are located on a cantilever, wherein the series-connected semiconductor components of each cantilever are connected in parallel.

In one refinement, the semiconductor components are applied to one another on one side and / or on the second side by means of conductor structures on the carrier element and contact the semiconductor components electrically. The contacting of the individual semiconductor components takes place here more flexible. Also conceivable is a contact foil with which the semiconductor components can be electrically contacted by means of bonding or soldering. By using a plurality of semiconductor devices in an array, for example nine, a more authentic replica of a candle is achieved. For an authentic candle reproduction, it is preferable to use a plurality of semiconductor devices having a low light output than a few semiconductor devices having a high light output.

The chimney effect can be enhanced by applying a sleeve-shaped upper housing part to the lower housing part. The upper housing part also has two open, opposite sides. This upper housing part is at least partially transparent to the light emitted by the at least one semiconductor component and at least partially surrounds the carrier element. The upper part of the housing can be clear, frosted or pearlized.

In particular, the lower housing part is socket-like and releasably mechanically connectable by means of screw connection, bayonet connection with a tailor-made counterpart. For example, conceivable here would be the Edison sockets, such as E14 or E17. Through this Edison socket in addition to the mechanical screw connection also generates an electrical connection for operating the semiconductor device. Other possible socket types are sockets and bayonet sockets.

In one embodiment, the semiconductor device is a white light LED or a blue light based LED. These LEDs may further include wavelength conversion means that convert a primary wavelength to a secondary wavelength. It is also advantageous if the carrier element has cooling ribs, whereby in addition a higher surface of the carrier element is generated and more heat is released from the carrier element to the environment by the generated air flow of the chimney effect.

In one embodiment, bores are incorporated into the carrier element and / or heat-transporting pipes, so-called heatpipes provided. These heatpipes can be soldered, glued or otherwise heat conductively connected to the support element. These heat pipes are closed in one embodiment and filled with a cooling liquid. These heatpipes can continue to be designed annular, whereby an improved heat dissipation is achieved.

Embodiments of the invention will be explained with reference to the drawings, wherein in the drawings the same or equivalent components are each marked with the same reference numerals. The illustrated elements are not to be considered as true to scale, but individual elements may be exaggerated in size or exaggerated simplified for better understanding. Show it:

FIG. 1 shows a first embodiment of an arrangement according to the invention for emitting light,

2 shows a development of the embodiment shown in Figure 1,

3 shows a development of the embodiment shown in Figure 1, FIG. 4 shows an alternative exemplary embodiment of an arrangement for emitting light with the usual screw base,

5 shows in A to D exemplary embodiments of an at least partially transparent housing upper part,

FIG. 6 shows in A to E exemplary embodiments for electrically contacting the semiconductor components on the carrier element,

FIG. 7A enlarged detailed representation for contacting a semiconductor component on the carrier element,

FIG. 7B shows a further enlarged view for contacting a semiconductor component on the carrier element,

Figure 8 in A to F embodiments of the support element

Figure 9 in A to D embodiments for the electronic supply of the semiconductor devices

FIG. 10 Exemplary embodiment for the electronic supply of the semiconductor components from FIG. 5

FIG. 11 shows an alternative exemplary embodiment for the electronic supply of the semiconductor components of FIGS. 9 and 10.

FIG. 1 shows a first exemplary embodiment of the invention. Here, five semiconductor devices 2 are arranged on a carrier element 1. The carrier element 1, which is heat-conducting, is connected via the mechanical connection 4 with a nem housing bottom part 3 connected. The lower housing part 3 is designed sleeve-shaped. As a sleeve, a hollow body is understood, which is open on at least two opposite sides. The semiconductor devices 2 are driven via electrical contacts and thereby operated. In operation, the semiconductor devices 2 will emit light of a certain wavelength range of the electromagnetic spectrum. In addition, thermal energy is radiated from the semiconductor devices 2 in the infrared region of the EM spectrum.

The heat-conducting carrier element 1 is heated by the operation of the semiconductor devices 2. Due to the partial placement of the support element 1 in the lower housing part 3 creates a heat source in the sleeve-shaped housing bottom 3. By the chimney effect described above, the warm air will rise up and escape through the first open side 31 of the housing base. Due to the resulting negative pressure in the interior of the lower housing part 3 cold air is drawn from the environment through the second open side 32 of the lower housing part in the lower housing part 3. There is a continuous flow of cold air through the first side 31 and warm or hot air from the second side 32. By the colder air of the environment, the support member 1 is cooled.

In addition, an upper housing part 7 on the lower housing part 3, which further enhances the chimney effect. The flowing out of the first side 71 of the upper housing part warm air is replaced by cold, flowing over the first side 31 of the lower housing part 3 colder air and cools the support element. The first side 31 of the housing base is still open at least partially. By means of Effect generated cooling the semiconductor devices 2 are cooled.

When using semiconductor devices 2, an electro-optical efficiency of 20% and more is achieved. Thus, an electrical power saving is achieved for the same luminous efficacy of the device using LED. When replacing a 25 watt incandescent lamp with LED, only 6.25 watt of electrical power is needed to get the same light output. With an efficiency of 20%, a heat output of 5W is dissipated.

The electro-optical efficiency of LED is very temperature dependent. Slope coefficients for red LEDs are assumed to be -0.6% / K and -0.4% / K for blue LEDs. When using blue LED with conversion substances, the slope coefficient deteriorates slightly. The efficiency of an LED is therefore 1.4 times higher at 25 degrees Celsius than at 75 degrees Celsius. It is therefore desirable to ensure that the temperature within the assembly does not rise above a certain level.

To determine the heat transfer to the ambient air is basically no linear relationship between the heat exchange surface and equilibrium temperature, or to expect heat transfer resistance. The reason for this is the chimney effect, because the hotter the arrangement inside, the stronger the cooling air flow.

If, for example, a power dissipation of 5 W is dissipated, it must first be determined how much heat dissipation has been achieved by the arrangement. In empirical tests it was determined that a 12cm long aluminum tube, with 25mm Au ßendurchmesser and 12mm pipe thickness has a heat transfer resistance of about 6.3 K / W.

When dissipating 5 watts of heat output, a heating of 5 W * 6.3 K / W = 31.5K can therefore be expected. At an ambient temperature of 25 degrees Celsius, the pipe reaches about 57 degrees Celsius. As an empirical value, it was determined that a total thermal resistance of 3.6 K / W should not be exceeded. These calculations and numerical values are for illustrative purposes only and should not be considered as universal values.

Conveniently, the semiconductor device 2 is not too bright to choose. By means of many low-faint LEDs, the thermal energy generated is better distributed on the heat sink or the support element and improves drainable. This also results in a greater design freedom of the arrangement in order to arrive at a more aesthetic overall picture of the arrangement and to obtain a more authentic candle reproduction. By means of many weak LEDs, the color play of an incandescent lamp is easier to reproduce than with only a few very strong LEDs.

For example, taking about 16 to 24 LEDs for an array means that each LED has an electrical operating power of 6.25 W / (16 to 24) = (0.4 to 0.26) W. As a result, the heat transfer resistance to the heat exchanger metal must be 3.6 K / W * 16 LED, which in turn corresponds to 57 K / W. This can be achieved with conventional LED chips with a size of 0.5 * 0.5 square meters. Embodiments for the electrical control of the semiconductor components is shown in FIGS. 9 to 11. This calculation example is by no means restrictive of the inventive idea, theoretically an incandescent lamp of very different wattage can also be emulated with only one high-power LED.

In the figures 2 and 3 developments of the arrangement for emitting light of Figure 1 are shown. It is shown that the lower housing part 3 is open and mechanically connected to the carrier element 1. The electrical contacting of the semiconductor components 2 takes place here, for example, by means of wire connections.

The semiconductor components used in FIGS. 1 to 3 are, for example, LEDs. These LEDs are preferably lamp radiators, which generate as many refractions and additional light effects in a crystal chandelier arrangement with ground crystals. As Lamberstrahler here a physically ideal radiator is called, which is constant in all directions.

In the following some technical details are given to the arrangement of Figure 3. The power supply has, for example, a thread of M8. The upper housing part has a diameter of 25 to 35 millimeters. Nine white light LEDs are used. The cooling vanes of the support element 1 are bevelled by 45 degrees, which can also be emitted through the lower housing part 3 light. For example, the lower housing part is an aluminum die-cast part and silver anodized or painted white. By molding a typical candle shape is obtained.

FIG. 4 shows an alternative embodiment of the arrangement for emitting light. For this purpose, the Carrier element 1 more boom 5. On these arms

5, the semiconductor devices 2 are arranged. In addition, the lower housing part 3 is designed with a screw base 6. For this purpose, the Edison socket from the E series can be used in particular. Other conceivable sockets are plug or Baj onettsockel. In addition to the mechanical attachment of the lower housing part 3 with a tailor-made counterpart, the electrical contacting of the respective semiconductor components 2 is achieved.

A simplified wiring of all semiconductor devices 2 is achieved by parallel connection, an embodiment of which is shown in Figure 9. To reduce the cable cross-sections of the wiring is provided for improved control that per boom 5, a series circuit of the semiconductor devices 2 is made, and these individual arms 5 are in turn connected in parallel. As a result, the current flow per arm is constant, which leads to a constant light output per boom 5. Any fluctuations in the forward voltage is compensated. When connected in series, it is necessary that both terminals of the semiconductor devices 2 are potential-free. This is in the figures

6 to 8 shown in more detail.

In the figures 5a to 5d embodiments of the upper housing part 7 are shown. Form and design are no limits, only the chimney effect should be reinforced by the shape of the upper housing part 7. For this purpose, the upper housing part 7 and the lower housing part 3 should have an identical average on the adjacent sides 32 and 72. The upper housing part 7 is preferably made of glass. The texture of the glass can be clear, frosted or pearlized be. Furthermore, it is conceivable that a plastic is used.

In FIGS. 6a to 6e, arrangements and interconnections of the semiconductor components 2 on the respective arm 5 are shown. The electrical supply of these semiconductor components 2 is illustrated in FIGS. 9 to 11. The arms 5 of the carrier element 1 can have a contact foil or at least partially be formed as a printed circuit board. In FIG. 6a, the boom 5 has conductor structures 8 with which the individual semiconductor components 2 are connected in series. The terminals for operating the semiconductor components 2 are arranged at the top and bottom of the boom 5. FIG. 6b shows a side view of the arm 5 shown in FIG. 6a.

FIG. 6c shows an alternative embodiment of the cantilever shown in FIG. 6a. In this case, the boom 5 has at least one plated-through hole, as a result of which the return conductor is led to the lower end of the boom 5 on the rear side of the arm 5, as shown in FIG. 6d. In the embodiment of Figure 6e an aesthetic flame simulation is provided. The arrangements and interconnections of the individual semiconductor components 2 according to FIG. 6 serve only as an example. Other arrangements and interconnections are also conceivable.

A more detailed illustration of the placement of an LED semiconductor device 2 on the cantilever 5 is shown in FIGS. 7a and 7b. By means of bond 10, the semiconductor device 2 is connected to the conductor structures 8. The placement on the boom 5 can be performed by means of adhesive 11 or a solder joint. In addition, a Capping material or potting compound 12 to protect the bond and the semiconductor device 2 may be provided. This potting compound 12 is transparent to the emitted light.

A contacting possibility is shown in FIG. 7b. In this case, two conductor structures 8 are shown and connected by means of Drahtbondverbindung with the respective semiconductor terminals. If a contact sheet is used, it should dissipate enough heat and be very thin. It can be laminated on one or two sides.

All forms of FIGS. 6 and 7 can be adapted to the respective design of the carrier element 1 and its arms 5. In principle, it should be mentioned that the semiconductor components are not limited in shape or type. Both hole-through devices and SMT devices can be used. In addition, it is also conceivable for a semiconductor chip to be arranged instead of a potted semiconductor component 2.

Exemplary embodiments of the carrier element 1 are shown in FIGS. 8a to 8f. Each carrier element 1 in this case has a plurality of arms 5. On the arms 5 semiconductor devices 2 are connected in series and interconnected via conductor structures 8 with each other in series. Embodiments for the electrical control of the semiconductor components is shown in FIGS. 9 to 11. It can be seen that the conductor structures 8 connect the semiconductor components 2 on the carrier element 1 in parallel connection per arm. If the carrier element 1 has a reflective design, then a higher light output of the arrangement is achieved. In addition, the outriggers should be heat conductive, resulting in an improved Heat dissipation is possible. The associated plan views show that the cantilevers can be fitted on one side or on both sides. The shape may be conical or straight or angled or rounded. Furthermore, the inner layer can be designed perlierend. In a preferred embodiment, the carrier element is a heat sink and shaped as a heat sink. For this purpose, additional cooling fins are provided. The semiconductor components may in this case be arranged on two sides on the arms 5, as shown in FIGS. 8c and 8d, or on one side on the arm 5, as shown in FIGS. 8e and 8f.

FIGS. 9A to D show exemplary embodiments of the electronic control of the semiconductor components 2. For this purpose, a rectifying unit 13 is provided in each of FIGS. Input is to this unit 13, an AC voltage, in particular the mains voltage of 230V, applied. Other types of voltage, voltage levels and frequencies are also conceivable. In FIG. 9A, the individual semiconductor components 2 are connected in series with a respective series resistor 14. The individual semiconductor component strands are connected in parallel. The series resistor 14 serves primarily to compensate for differences in the flux voltage of the individual semiconductor components 2. A single resistor for limiting the current in series with the entire parallel circuit is likewise conceivable insofar as no differences in the flux voltage are to be compensated. The following applies:

Series resistor 14 = (flux voltage difference / current of the individual parallel paths) - single resistor

FIG. 9B shows a series connection of the semiconductor components 2. In particular, the rectifying unit 13 as a low-loss power capacitor Sperrschwingerschaltung build. A combination of series and parallel connection is shown in Figure 9C. In this case, the semiconductor components 2 of a cantilever 5 of the carrier element 1 are connected in series and all the cantilevers 5 are connected in parallel.

FIG. 9D shows two series circuits, each having separate currents I1 and I2. This is especially useful if the color temperature should be set individually per series connection.

FIG. 10 shows an electrical drive for semiconductor components 2 of FIG. 5. In the base-like housing part 3, a current-limiting coil Ll is provided and serves partly as reactive power compensation. The coil Ll is connected in series with a capacitor Cl. The capacitor Cl is connected in series with three antiparallel-connected semiconductor devices 2. The two rear series-connected antiparallel semiconductor devices 2 are arranged parallel to a series circuit consisting of capacitor C2 switch Sl and coil L2. The semiconductor components 2 and the conductor structures 8 are preferably electrically insulated. By placing the upper housing part 7 additional contact contactor is given. By the switch S2, the two antiparallel connected diodes are bridged. This is an optional color change. The capacitor Cl is used as a current limiting resistor.

FIG. 11 shows an alternative exemplary embodiment of the electrical actuation of the semiconductor components 2 of FIGS. 9 and 10. For this purpose, a coil L3 is preferably removed. tunable. This, in turn, a color design is possible.

It is also conceivable that a plurality of wavelengths are generated by different semiconductor components 2. Basically, white LEDs or blue LEDs with converter materials should be used to produce the broadest possible color spectrum. Important here is the generation of the broadest possible color spectrum. For further color design, it may be advantageous to equip the housing upper part 7 with visible reflective surfaces designed. Furthermore, diffusers are also conceivable. The lower housing part 3 is for example a demountable, kerzenschaftiges metal tube. Any cooling fins or the support element 1 itself is heat-tight to connect to the lower housing part 3.

It is further contemplated that this arrangement is used in a lighting device. For this purpose, an electrical socket is provided, in which the arrangement is introduced, for example, by means of Edison socket housing lower part 3. A so-called chandelier with a variety of mechanical arms and described arrangements is conceivable. To create atmospheric effects crystal pendants are provided on the chandelier.

Claims

claims

1. Arrangement for emitting light with:

a support element (1),

- At least one, the light-emitting semiconductor device (2), wherein the Halbleiterbauelemeηt (2) on the carrier element (1) is arranged and

- one, on two opposite sides (31, 32) open tubular housing lower part (3), wherein the carrier element (1):

- Is mechanically connected to the lower housing part (3),

- Heat is conductive and

- At least partially by the housing lower part (3) is wrapped, without the open sides (31,32) of the housing lower part (3) to close.

2. Arrangement according to claim 1, wherein a plurality of semiconductor components (2) are placed on the carrier element (1).

3. Arrangement according to one of claims 1 or 2, wherein the carrier element (1) cantilever (5) and the semiconductor components (2) are placed on these arms (5).

4. Arrangement according to one of the preceding claims, wherein at least parts of the surface of the carrier element (1) are reflective or specular for the emitting light.

5. Arrangement according to one of claims 2 to 4, wherein the semiconductor components (2) are connected in parallel.

6. Arrangement according to claims 4 or 5, wherein the semiconductor components (-2) of a cantilever (5) are connected in series.

7. Arrangement according to one of claims 3 to 6, wherein on the carrier element (1) conductor structures (8) are applied, the conductor structures (8) on one or two sides on the Trägereiement (1) are applied and the conductor structures (8) the semiconductor devices ( 2) make it electrically contactable.

8. Arrangement according to claim 7, wherein the semiconductor components (2) are placed on a contact foil and by means of bonding or soldered connection (10) are electrically contacted with the conductor structures (8).

9. Arrangement according to one of the preceding claims, wherein the semiconductor component (2) is an uncapped semiconductor chip.

10. Arrangement according to one of the preceding claims, wherein the semiconductor component (2) is glued or soldered to the carrier element (1).

11. Arrangement according to one of the preceding claims, wherein the arrangement has an upper housing part (7) and the upper housing part:

is sleeve-shaped and is open on two opposite sides (71, 72),

is at least partially transparent to the emitted light and

- The support element (1) at least partially wrapped.

12. Arrangement according to one of the preceding claims, wherein the lower housing part (3) socket-like (6) is formed and by means of screw, bayonet connection with a tailor-made counterpart is releasably mechanically connected.

13. Arrangement according to claim 12, wherein additionally an electrical connection for operating the at least one semiconductor component (2) is produced by the detachable mechanical connection.

14. Arrangement according to one of the preceding claims, wherein the upper housing part (7) is a glass and this glass is clear transparent, at least partially matted or partially coated perlating.

15. Arrangement according to one of claims 2 to 14, wherein the wavelength of the emitted light of the individual semiconductor components (2) is different.

16. Arrangement according to one of the preceding claims, wherein the semiconductor component (2) is an LED.

17. Arrangement according to one of claims 7 to 13, wherein the carrier element (1) comprises arms (5), on the arms (5) a plurality of semiconductor devices (2) is placed and the arms (5) are shaped such that the emitted light is similar to the radiation characteristic of a candle.

18. Lamp device having at least one mechanical arm, an electrical socket, which is arranged on the mechanical arm, and an arrangement for emitting light according to one of the preceding claims, wherein the lower housing part with the electrical socket is mechanically detachable and electrically connected, so the arrangement for emitting light via the electrical socket is operable and wherein the carrier element and the housing lower part are formed such that a chimney effect in the interior Ren the arrangement occurs, which removes the heat generated in the interior of the arrangement outside the arrangement.

19. A method for removing heat from light-emitting semiconductor components with the method steps:

- forming a housing lower part as a sleeve with openings on two opposite sides,

Placing at least one semiconductor component on the carrier element,

- Operating the semiconductor device.

20. The method of claim 19, wherein a sleeve-shaped upper housing part partially surrounds the carrier element and the upper housing part is at least partially transparent to the emitted light.

21. The method according to any one of claims 19 or 20, wherein by shaping the carrier element, the emission characteristic of a candle is modeled.

22. The method according to any one of claims 19 to 21, wherein the carrier element is a heat sink.

23. The method according to any one of claims 19 to 22, wherein the carrier element has cooling ribs and the semiconductor components are arranged on these cooling fins.

24. The method according to any one of claims 19 to 23, wherein the carrier element has bores and / or tubular elements.