WO2009047990A1 - Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus - Google Patents

Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus Download PDF

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Publication number
WO2009047990A1
WO2009047990A1 PCT/JP2008/067486 JP2008067486W WO2009047990A1 WO 2009047990 A1 WO2009047990 A1 WO 2009047990A1 JP 2008067486 W JP2008067486 W JP 2008067486W WO 2009047990 A1 WO2009047990 A1 WO 2009047990A1
Authority
WO
WIPO (PCT)
Prior art keywords
scribe
material substrate
fragile material
laser scribe
scheduled line
Prior art date
Application number
PCT/JP2008/067486
Other languages
French (fr)
Japanese (ja)
Inventor
Koji Yamamoto
Norifumi Arima
Togo Gonoe
Toru Kumagai
Shuichi Inoue
Original Assignee
Mitsuboshi Diamond Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsuboshi Diamond Industrial Co., Ltd. filed Critical Mitsuboshi Diamond Industrial Co., Ltd.
Priority to CN2008801110707A priority Critical patent/CN101821071B/en
Priority to JP2009536970A priority patent/JP5171838B2/en
Publication of WO2009047990A1 publication Critical patent/WO2009047990A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0736—Shaping the laser spot into an oval shape, e.g. elliptic shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/027—Scoring tool holders; Driving mechanisms therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Laser Beam Processing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

Provided is a method for forming a scribe line excellent in linearity along a scribe-scheduled line. A laser beam irradiating mechanism is relatively moved such that irradiation area adjusting means (44b) is attached to the laser beam irradiating mechanism or a substrate. The irradiation area adjusting means (44b) makes the heat distribution along a scribe-scheduled line transversely symmetric, when the laser beam irradiating mechanism is moved relative to the region, in which the heat distribution on the two transverse sides of the scribe-scheduled line when the beam spot is scanned becomes asymmetric due to the difference in the substrate states near the two transverse sides of the scribe-scheduled line.
PCT/JP2008/067486 2007-10-11 2008-09-26 Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus WO2009047990A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008801110707A CN101821071B (en) 2007-10-11 2008-09-26 Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus
JP2009536970A JP5171838B2 (en) 2007-10-11 2008-09-26 Laser scribing method for brittle material substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007265572 2007-10-11
JP2007-265572 2007-10-11

Publications (1)

Publication Number Publication Date
WO2009047990A1 true WO2009047990A1 (en) 2009-04-16

Family

ID=40549135

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067486 WO2009047990A1 (en) 2007-10-11 2008-09-26 Fragile material substrate, laser scribe method for the fragile material substrate, and laser scribe apparatus

Country Status (5)

Country Link
JP (1) JP5171838B2 (en)
KR (1) KR101211021B1 (en)
CN (1) CN101821071B (en)
TW (1) TWI462792B (en)
WO (1) WO2009047990A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012031035A (en) * 2010-08-02 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd Method for dividing brittle material substrate
JP2014044987A (en) * 2012-08-24 2014-03-13 Fujitsu Semiconductor Ltd Dicing method and dicing device
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
US9755190B2 (en) 2013-04-16 2017-09-05 Samsung Display Co., Ltd. Laser-induced thermal imaging apparatus, method of laser-induced thermal imaging, and manufacturing method of organic light-emitting display apparatus using the method
JP2019169685A (en) * 2018-03-26 2019-10-03 パナソニックＩｐマネジメント株式会社 Manufacturing method of element chip

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2781296B1 (en) 2013-03-21 2020-10-21 Corning Laser Technologies GmbH Device and method for cutting out contours from flat substrates using a laser
EP2980033B1 (en) 2013-03-26 2021-01-20 AGC Inc. Glass sheet processing method and glass sheet processing apparatus
KR102546692B1 (en) 2015-03-24 2023-06-22 코닝 인코포레이티드 Laser Cutting and Processing of Display Glass Compositions
KR102427574B1 (en) * 2016-01-22 2022-07-29 주식회사 포스코 Method and apparatus for refining magnetic domains grain-oriented electrical steel
US10730783B2 (en) * 2016-09-30 2020-08-04 Corning Incorporated Apparatuses and methods for laser processing transparent workpieces using non-axisymmetric beam spots
CN107132659B (en) * 2017-06-29 2020-02-21 联想(北京)有限公司 Laser beam layer generation method and device
TWI681241B (en) * 2018-12-04 2020-01-01 友達光電股份有限公司 Manufacturing method for display device and display device utilized thereof
CN112008232A (en) * 2020-08-11 2020-12-01 华东师范大学 Method and device for preparing periodic stripe structure on surface of glass coated with ITO film

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117921A (en) * 2001-09-29 2003-04-23 Samsung Electronics Co Ltd Method of cutting nonmetallic substrate
JP2005186100A (en) * 2003-12-25 2005-07-14 V Technology Co Ltd Laser beam machining apparatus
JP2006143506A (en) * 2004-11-18 2006-06-08 Sanyo Electric Co Ltd Method for cutting glass substrate
JP2008031021A (en) * 2006-07-31 2008-02-14 Optrex Corp Method of cutting substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring
JPWO2006038565A1 (en) * 2004-10-01 2008-05-15 三星ダイヤモンド工業株式会社 Method and apparatus for scribing brittle materials
JP2008044823A (en) * 2006-08-18 2008-02-28 Seiko Epson Corp Method of dividing substrate, method of manufacturing electro-optic device and laser scribing apparatus
JP2008168328A (en) * 2007-01-15 2008-07-24 Seiko Epson Corp Laser scribing device, method for dividing substrate, and method for manufacturing electro-optical apparatus

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003117921A (en) * 2001-09-29 2003-04-23 Samsung Electronics Co Ltd Method of cutting nonmetallic substrate
JP2005186100A (en) * 2003-12-25 2005-07-14 V Technology Co Ltd Laser beam machining apparatus
JP2006143506A (en) * 2004-11-18 2006-06-08 Sanyo Electric Co Ltd Method for cutting glass substrate
JP2008031021A (en) * 2006-07-31 2008-02-14 Optrex Corp Method of cutting substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012031035A (en) * 2010-08-02 2012-02-16 Mitsuboshi Diamond Industrial Co Ltd Method for dividing brittle material substrate
US9266192B2 (en) 2012-05-29 2016-02-23 Electro Scientific Industries, Inc. Method and apparatus for processing workpieces
JP2014044987A (en) * 2012-08-24 2014-03-13 Fujitsu Semiconductor Ltd Dicing method and dicing device
US9755190B2 (en) 2013-04-16 2017-09-05 Samsung Display Co., Ltd. Laser-induced thermal imaging apparatus, method of laser-induced thermal imaging, and manufacturing method of organic light-emitting display apparatus using the method
JP2019169685A (en) * 2018-03-26 2019-10-03 パナソニックＩｐマネジメント株式会社 Manufacturing method of element chip
JP7138297B2 (en) 2018-03-26 2022-09-16 パナソニックＩｐマネジメント株式会社 Element chip manufacturing method

Also Published As

Publication number Publication date
KR20100065362A (en) 2010-06-16
JP5171838B2 (en) 2013-03-27
CN101821071B (en) 2012-10-03
JPWO2009047990A1 (en) 2011-02-17
TWI462792B (en) 2014-12-01
CN101821071A (en) 2010-09-01
KR101211021B1 (en) 2012-12-11
TW200936289A (en) 2009-09-01

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