WO2009035257A2 - Cooling device for led light source using non-conductive liquid - Google Patents

Cooling device for led light source using non-conductive liquid Download PDF

Info

Publication number
WO2009035257A2
WO2009035257A2 PCT/KR2008/005328 KR2008005328W WO2009035257A2 WO 2009035257 A2 WO2009035257 A2 WO 2009035257A2 KR 2008005328 W KR2008005328 W KR 2008005328W WO 2009035257 A2 WO2009035257 A2 WO 2009035257A2
Authority
WO
WIPO (PCT)
Prior art keywords
heat
light source
led light
dissipation
conductive liquid
Prior art date
Application number
PCT/KR2008/005328
Other languages
French (fr)
Other versions
WO2009035257A3 (en
Inventor
Dae Young Lee
Original Assignee
Luminature Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Luminature Co., Ltd. filed Critical Luminature Co., Ltd.
Publication of WO2009035257A2 publication Critical patent/WO2009035257A2/en
Publication of WO2009035257A3 publication Critical patent/WO2009035257A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/59—Cooling arrangements using liquid coolants with forced flow of the coolant
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
    • F21V29/67—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans
    • F21V29/677—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air characterised by the arrangement of fans the fans being used for discharging
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00—Illumination
    • Y10S362/80—Light emitting diode

Definitions

  • the present invention relates to a cooling device for an LED light source capable of solving a problem of heat generation generated from the LED in the LED light source, such as an illumination device or a backlight unit that uses the LED, and the like and more specifically, to a cooling device for an LED light source using a non-conductive liquid capable of realizing lightweight of the LED light source and significantly improving cooling and heat-dissipation effects by providing environments that can easily generate heat exchange by directly contacting a heat-dissipated non-conductive liquid to the surfaces of an LED device in all directions by a sufficiently secured heat exchange area as well as suppressing a use of an aluminum material that has relatively high specific gravity and has been mainly used from the past.
  • Background Art for an LED light source capable of solving a problem of heat generation generated from the LED in the LED light source, such as an illumination device or a backlight unit that uses the LED, and the like and more specifically, to a cooling device for an LED light source using a non-conductive liquid capable of realizing lightweight of the LED light source and significantly improving cooling and
  • FIG. 1 shows an example using the known aluminum heat sink when using an LED in a chip (SMD) type as a light source.
  • SMD chip
  • PCB 1 or PCB of phenol or epoxy material attaches a thermal tape (heat conductive tape) or a similar adhesive tape 3 to the rear of the PCB 1 and attaches an aluminum heat sink 4 thereto using a screw.
  • thermal tape heat conductive tape
  • aluminum heat sink 4 thereto using a screw.
  • FIG. 2 shows an example of a case of using an LED of a dip (DIP) type as the light source.
  • a plurality of LEDs 13 are bonded on a PCB 12 by a soldering 14, the rear of the PCB 12 being attached with an adhesive tape 11 and an aluminum heat sink 15 is attached to a rear of the PCB 12 using a screw to perform heat-dissipation and in order to smooth a role of heat- dissipation, a copper foil surface on a surface of the PCB 12 is widely secured or in order to help heat conduction, a surface of the soldering 14 is widened.
  • the case of the related art has a problem of having an effect on the size and weight of the light source due to an attachment of the heat sink of an aluminum material having high specific gravity to the light source on which the LED device is mounted.
  • LED light source using a non-conductive liquid which can make a configuration of the LED light source lightweight by rapidly transferring heat generation of an LED device to a heat exchanger using a non-conductive liquid having significantly low specific gravity as compared to metal.
  • a cooling device for an LED light source of the present invention comprising: an LED light source 110 where a PCB 112 having a plurality of LEDs 111 mounted thereon is received in a transparent device 113; a heat-dissipation device 130 connected to the transparent device 113 of the LED light source 110; and a non- conductive liquid 160 that is filled inside the transparent device 113 of the LED light source 110 and the heat-dissipation device 130.
  • the present invention includes a liquid circulation tube 120 that communicates the transparent device 113 of the LED light source 110 with the heat-dissipation device 130 and a pump 170 that is installed on the liquid circulation tube 120 to circulate the non-conductive liquid 160.
  • the present invention includes a cooling fan 140 at the central portion of the heat- dissipation device 130.
  • the present invention includes a buffer plate 150 that is disposed at a lower portion of the cooling fan 140 and has a function of preventing a leakage of liquid from the heat-dissipation device 130.
  • the present invention is configured to control the cooling and heat-dissipation by sensing a temperature of the non-conductive liquid 160 by installing a temperature sensor 181 on the PCB 112 of the LED light source 110 or a micro switch 182 on an upper side of the buffer plate 150.
  • the present invention is configured to form a through hole 112a on the PCB 112 to allow the non-conductive liquid 160, which circulates the transparent device 113 and the heat-dissipation device 130, to smoothly move the rear and front surfaces of the PCB 112.
  • the heat-dissipation device 130 is made of any one selected from heat conductive resin or thin plate metal or its main body is made of heat conductive resin and the heat-dissipation surface is made of a thin plate metal.
  • the heat-dissipation device 130 is configured to secure a large heat-exchanging area by being formed in an uneven or wrinkle structure.
  • the present invention can significantly improve the cooling and heat-dissipation efficiency in response to the heat generation of the LED by performing the heat exchange through the direct contact with the LED device and the surface contact in all directions using the non-conductive liquid, as compared to the related art, to show best lifetime and highest luminance of the LED device, make a configuration of the LED light source lightweight by using the non-conductive liquid having significantly low specific gravity as compared to the use of the existing metallic heat sink, and freely dispose a position of the light source by integrating the LED light source and the cooling by directly attaching the cooling device to the LED light source or separating the cooling device from the LED light source device.
  • FIG. 1 is a view showing one example of a configuration of an LED light source of the related art
  • FIG. 2 is a view showing another example of a configuration of an LED light source of the related art
  • FIG. 3 is a configuration view showing a cooling device of an LED light source using a non-conductive liquid according to the present invention
  • FIG. 4 is a detailed view of a configuration including a heat-dissipation device in
  • FIG. 3 according to the present invention.
  • FIG. 5 is a plan view of the heat-dissipation device according to the present invention.
  • FIG. 6 is a detailed view of a configuration including the LED light source in FIG. 3 according to the present invention.
  • FIG. 7 is a view showing one example of main parts of the LED light source in the present invention.
  • FIG. 8 is a view showing another example of main parts of the LED light source in the present invention.
  • FIG. 9 is a view showing a configuration of a cooling device of an LED light source using a non-conductive liquid according to another embodiment of the present invention.
  • FIG. 10 is a view showing a form integrated by directly attaching the cooling device to the LED light source according to the present invention. Best Mode for Carrying Out the Invention
  • a cooling device for an LED device using a non-conductive liquid includes an LED light source 110 where a PCB 112 having a plurality of LEDs 111 mounted thereon is received in a transparent device 113.
  • the cooling device for an LED device includes a heat-dissipation device 130 communicated with the transparent device 113 of the LED light source 110 by the a liquid circulation tube 120, a cooling fan 140 that is provided at the central portion of the heat-dissipation device 130, a buffer plate 150 that is disposed at a lower portion of the cooling fan 140 and has a function of preventing a leakage of liquid from the heat-dissipation device 130, a non-conductive liquid 160 that is filled inside the transparent device 113 of the LED light source 110, a pump 170 that is installed on the liquid circulation tube 120 to circulate the non- conductive liquid 160.
  • cooling fan 140 and the buffer plate 150 may be omitted as shown in
  • the cooling device can be configured of only the heat-dissipation device 230. Also, as shown in FIG. 10, the LED light source 110 and the heat- dissipation device 130 can be integrated by directly attaching the heat-dissipation device to the LED light source.
  • the liquid 160 can confirm the temperature of the liquid 160 by installing a temperature sensor 181 (see FIG. 7) on the PCB 112 of the LED light source 110 or installing a micro switch 182 (see FIG. 4) on an upper side of the buffer plate 150.
  • This configuration controls the revolution number of the cooling fan 140 by confirming the temperature of the non-conductive liquid 160 to easily control the cooling and heat dissipation in response to the heat generation state of the LED.
  • the liquid circulation tube 120 is configured to bond and separate the heat-dissipation device 130 and the transparency device 113 and can provide usefulness capable of freely disposing the position of the LED light source 110 by forming the separating structure.
  • the heat-dissipation device 130 may be made of any one selected from heat conductive resin such as silver epoxy or thin plate metal or its main body may be made of heat conductive resin and the heat-dissipation surface may be made of a thin plate metal.
  • the heat-dissipation device 130 is configured to secure a large heat-exchanging area by being formed in an uneven or wrinkle structure, making it possible to improve the cooling and heat-dissipation efficiency.
  • the buffer plate 150 is made of a soft material such as silicon and the like so that it is configured to flexibly cope with a volume change due to the temperature rising of the non-conductive liquid 160. Thereby, the leakage of the non-conductive liquid outside the heat-dissipation device 130 can be prevented even when the volume of the non- conductive liquid is changed.
  • the operations of the cooling fan 140 and the pump 170 are controlled by a controller (not shown) that is configured separately from the cooling device.
  • the LED 111 radiates heat generated by power consumption due to the lighting of the LED 111 and transfers heat to the non-conductive liquid 160 forming the direct contacting structure with the LED 111, thereby performing the heat exchange.
  • the pump 170 is driven according to the control signal of the controller to move the non-conductive liquid 160 filled in the transparent device 113 of the LED light source 110 to the heat-dissipation device 130 through the liquid circulation tube 120 and to back move the non-conductive liquid 160 to the transparent device 113 of the LED light source 110 through the liquid circulation tube 120, thereby circulating the non-conductive liquid.
  • Heat owned by the non-conductive liquid 160 is emitted in the air and is heat- exchanged by the operated cooling fan 140 while moving the non-conductive liquid 160 transferred with heat from the LED 111 to the heat-dissipation device 130 and is transferred to the transparent device 113 of the LED light source 110.
  • the buffer plate 150 which is installed at the lower portion of the cooling fan
  • the non-conductive liquid 160 moved to the transparent device 113 after being heat-exchanged in the heat-dissipation device 130 contacts the PCB 112 from the rear surface of the PCB 112 to the front surface thereof or vice versa through the through hole 112a and freely contacts the LED 111 and the PCB 112 in all directions, thereby performing the heat exchange.
  • the temperature of the circulated non-conductive liquid is monitored by the temperature sensor 181 or the micro switch 182 and the revolution number of the cooling fan 140 is controlled by the controller (not shown) having a separate connection configuration according to the sensing signal of the temperature sensor 181 or the micro switch 182, thereby controlling the cooling and heat-dissipation efficiency.
  • the micro switch 182 provides the sensing signal when outer pressure is applied by contacting the buffer plate 150, when the buffer plate 150 flexibly expanded according to the temperature owned by the non-conductive liquid is inflated by the volume change of the non-conductive liquid 160.
  • the cooling device using the non-conductive liquid according to the present invention performs the cooling process on the LED 111 and the PCB 112 through the direct contact of the non-conductive liquid 160 with the LED 111 and the PCB 112 and the non-conductive liquid contacts the LED 111 and the PCB 112 in all directions to exchange heat therebetween, making it possible to significantly increase the cooling and heat-dissipation efficiency of the LED 111 used as the lightsource as compared to the related art.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Led Device Packages (AREA)

Abstract

The present invention relates to a cooling device for an LED light source using a non- conductive liquid includes an LED light source where a PCB having a plurality of LEDs mounted thereon is received in a transparent device. The cooling device for an LED device includes a heat-dissipation device communicated with the transparent device by the a liquid circulation tube based on the heat-dissipation device directly attached to the transparent device of the LED light source; a cooling fan that is provided at the central portion of the heat-dissipation device; a buffer plate that is disposed at a lower portion of the cooling fan and has a function of preventing a leakage of liquid from the heat-dissipation device; a non-conductive liquid that is filled and circulated inside the transparent device of the LED light source; and a pump that is installed on the liquid circulation tube to circulate the non-conductive liquid.

Description

Description
COOLING DEVICE FOR LED LIGHT SOURCE USING NON- CONDUCTIVE LIQUID
Technical Field
[1] The present invention relates to a cooling device for an LED light source capable of solving a problem of heat generation generated from the LED in the LED light source, such as an illumination device or a backlight unit that uses the LED, and the like and more specifically, to a cooling device for an LED light source using a non-conductive liquid capable of realizing lightweight of the LED light source and significantly improving cooling and heat-dissipation effects by providing environments that can easily generate heat exchange by directly contacting a heat-dissipated non-conductive liquid to the surfaces of an LED device in all directions by a sufficiently secured heat exchange area as well as suppressing a use of an aluminum material that has relatively high specific gravity and has been mainly used from the past. Background Art
[2] In a configuration of a light source using a currently used LED (light emitting diode), a method that mounts a plurality of LEDs on a PCB (printed circuit board) and attaches a heat sink to a rear of the PCB so as to emit heat generated when lighting the LED.
[3] Thereby, the side and front surfaces of the LED device are exposed to air or sealed in a device, such that a separate heat-dissipating unit is not provided and the LED device does not directly contact a heat-dissipating member but is mounted on the PCB.
[4] In order to improve the heat dissipation problem, when manufacturing the PCB, a plurality of thermal vias are secured and a metal core PCB (MCPCB) having good heat conductivity is used. However, it is difficult to form a best heat-dissipation condition because only a surface conducting heat to the PCB, not the whole surface of the LED device, contacts the heat sink.
[5] Also, in the LED light source, as a known general heat-dissipating method to solve the heat generation of the LED, FIG. 1 shows an example using the known aluminum heat sink when using an LED in a chip (SMD) type as a light source.
[6] Herein, it is formed in a structure that mounts a plurality of LEDs 2 on the metal core
PCB 1 or PCB of phenol or epoxy material, attaches a thermal tape (heat conductive tape) or a similar adhesive tape 3 to the rear of the PCB 1 and attaches an aluminum heat sink 4 thereto using a screw.
[7] At this time, it is configured in a structure that in order to achieve a better heat dissipation, widely secures a copper foil surface on a surface 5 of the PCB 1 to secure the heat dissipation area or widens a soldering surface 6 to help heat conduction and forms the thermals via 7 on the PCB 1 to transfer a portion of heat transited to the copper foil on the front surface thereof to a rear of a lower side and then transfer and emit it to and from the heat sink 3.
[8] Further, FIG. 2 shows an example of a case of using an LED of a dip (DIP) type as the light source. Likewise the above-mentioned chip type, a plurality of LEDs 13 are bonded on a PCB 12 by a soldering 14, the rear of the PCB 12 being attached with an adhesive tape 11 and an aluminum heat sink 15 is attached to a rear of the PCB 12 using a screw to perform heat-dissipation and in order to smooth a role of heat- dissipation, a copper foil surface on a surface of the PCB 12 is widely secured or in order to help heat conduction, a surface of the soldering 14 is widened.
[9] However, in the case of the related art as described above, since a lead of the LED device emits heat at a contacting surface of the PCBs 1 and 12, which is transferred with heat, heat generated from the surfaces or the front and side surfaces of the LED 2 and 13 devices is emitted only by being exposed to air. In particular, when the LED device is applied to a sealed space, there is a problem in that it is difficult to emit heat generated from the surface of the LED device.
[10] Therefore, only heat generated from the LED 2 and 13 devices, which is transferred to the heat sinks 4 and 15 disposed to contact the atmosphere (air), is emitted to the outside through the surface of the heat sink or is emitted by applying a heat exchanging method using a cooling fan. As a result, the efficiency of the method for solving the heat generation problem of the LED is poor so far.
[11] And, the case of the related art has a problem of having an effect on the size and weight of the light source due to an attachment of the heat sink of an aluminum material having high specific gravity to the light source on which the LED device is mounted.
Disclosure of Invention Technical Problem
[12] It is an object of the present invention to minimize the above-mentioned problems of the related art in a light source using an LED device and to provide a cooling device for an LED light source using a non-conductive liquid which can show best lifetime and highest luminance of an LED device by effectively transferring heat generated from the LED device to a heat exchanger (heat-dissipation structure) using the non- conductive liquid.
[13] Also, it is another object of the present invention to provide a cooling device for an
LED light source using a non-conductive liquid which can make a configuration of the LED light source lightweight by rapidly transferring heat generation of an LED device to a heat exchanger using a non-conductive liquid having significantly low specific gravity as compared to metal.
[14] Further, it is still another object of the present invention to provide a cooling device for an LED light source using a non-conductive liquid which can integrate the LED light source and the cooling by directly attaching the cooling device to the LED light source or separate the cooling device from the LED light source device and when separating, since it is not necessary to directly attach the heat sink to the LED light source, can freely dispose a position of the light source. Technical Solution
[15] There is provided a cooling device for an LED light source of the present invention comprising: an LED light source 110 where a PCB 112 having a plurality of LEDs 111 mounted thereon is received in a transparent device 113; a heat-dissipation device 130 connected to the transparent device 113 of the LED light source 110; and a non- conductive liquid 160 that is filled inside the transparent device 113 of the LED light source 110 and the heat-dissipation device 130.
[16] Also, the present invention includes a liquid circulation tube 120 that communicates the transparent device 113 of the LED light source 110 with the heat-dissipation device 130 and a pump 170 that is installed on the liquid circulation tube 120 to circulate the non-conductive liquid 160.
[17] The present invention includes a cooling fan 140 at the central portion of the heat- dissipation device 130.
[18] The present invention includes a buffer plate 150 that is disposed at a lower portion of the cooling fan 140 and has a function of preventing a leakage of liquid from the heat-dissipation device 130.
[19] The present invention is configured to control the cooling and heat-dissipation by sensing a temperature of the non-conductive liquid 160 by installing a temperature sensor 181 on the PCB 112 of the LED light source 110 or a micro switch 182 on an upper side of the buffer plate 150.
[20] The present invention is configured to form a through hole 112a on the PCB 112 to allow the non-conductive liquid 160, which circulates the transparent device 113 and the heat-dissipation device 130, to smoothly move the rear and front surfaces of the PCB 112.
[21] In the present invention, the heat-dissipation device 130 is made of any one selected from heat conductive resin or thin plate metal or its main body is made of heat conductive resin and the heat-dissipation surface is made of a thin plate metal.
[22] In the present invention, the heat-dissipation device 130 is configured to secure a large heat-exchanging area by being formed in an uneven or wrinkle structure.
Advantageous Effects [23] The present invention can significantly improve the cooling and heat-dissipation efficiency in response to the heat generation of the LED by performing the heat exchange through the direct contact with the LED device and the surface contact in all directions using the non-conductive liquid, as compared to the related art, to show best lifetime and highest luminance of the LED device, make a configuration of the LED light source lightweight by using the non-conductive liquid having significantly low specific gravity as compared to the use of the existing metallic heat sink, and freely dispose a position of the light source by integrating the LED light source and the cooling by directly attaching the cooling device to the LED light source or separating the cooling device from the LED light source device. Brief Description of the Drawings
[24] FIG. 1 is a view showing one example of a configuration of an LED light source of the related art;
[25] FIG. 2 is a view showing another example of a configuration of an LED light source of the related art;
[26] FIG. 3 is a configuration view showing a cooling device of an LED light source using a non-conductive liquid according to the present invention;
[27] FIG. 4 is a detailed view of a configuration including a heat-dissipation device in
FIG. 3 according to the present invention;
[28] FIG. 5 is a plan view of the heat-dissipation device according to the present invention;
[29] FIG. 6 is a detailed view of a configuration including the LED light source in FIG. 3 according to the present invention;
[30] FIG. 7 is a view showing one example of main parts of the LED light source in the present invention;
[31] FIG. 8 is a view showing another example of main parts of the LED light source in the present invention;
[32] FIG. 9 is a view showing a configuration of a cooling device of an LED light source using a non-conductive liquid according to another embodiment of the present invention; and
[33] FIG. 10 is a view showing a form integrated by directly attaching the cooling device to the LED light source according to the present invention. Best Mode for Carrying Out the Invention
[34] Hereinafter, the present invention will be described with reference to the accompanying drawings.
[35] As described in the embodiments of FIGS. 3 to 8, a cooling device for an LED device using a non-conductive liquid according to the present invention includes an LED light source 110 where a PCB 112 having a plurality of LEDs 111 mounted thereon is received in a transparent device 113. The cooling device for an LED device includes a heat-dissipation device 130 communicated with the transparent device 113 of the LED light source 110 by the a liquid circulation tube 120, a cooling fan 140 that is provided at the central portion of the heat-dissipation device 130, a buffer plate 150 that is disposed at a lower portion of the cooling fan 140 and has a function of preventing a leakage of liquid from the heat-dissipation device 130, a non-conductive liquid 160 that is filled inside the transparent device 113 of the LED light source 110, a pump 170 that is installed on the liquid circulation tube 120 to circulate the non- conductive liquid 160.
[36] Herein, the cooling fan 140 and the buffer plate 150 may be omitted as shown in
FIG. 9 and therefore, the cooling device can be configured of only the heat-dissipation device 230. Also, as shown in FIG. 10, the LED light source 110 and the heat- dissipation device 130 can be integrated by directly attaching the heat-dissipation device to the LED light source.
[37] At this time, a through hole 112a having a sufficient size, not a via hole structure, is formed on the PCB 112, such that the non-conductive liquid 160 circulating the transparent device 113 and the heat-dissipation device 130 can smoothly move the rear and front surfaces of the PCB 112. This is to increase the cooling and heat-dissipation efficiency by increasing the contacting efficiency with the non-conductive liquid 160, the LED 111, and the PCB 112 in all directions while helping the smooth movement and circulation of the non-conductive liquid 160.
[38] Preferably, it can confirm the temperature of the liquid 160 by installing a temperature sensor 181 (see FIG. 7) on the PCB 112 of the LED light source 110 or installing a micro switch 182 (see FIG. 4) on an upper side of the buffer plate 150. This configuration controls the revolution number of the cooling fan 140 by confirming the temperature of the non-conductive liquid 160 to easily control the cooling and heat dissipation in response to the heat generation state of the LED.
[39] Preferably, the liquid circulation tube 120 is configured to bond and separate the heat-dissipation device 130 and the transparency device 113 and can provide usefulness capable of freely disposing the position of the LED light source 110 by forming the separating structure.
[40] The heat-dissipation device 130 may be made of any one selected from heat conductive resin such as silver epoxy or thin plate metal or its main body may be made of heat conductive resin and the heat-dissipation surface may be made of a thin plate metal.
[41] The heat-dissipation device 130 is configured to secure a large heat-exchanging area by being formed in an uneven or wrinkle structure, making it possible to improve the cooling and heat-dissipation efficiency.
[42] The buffer plate 150 is made of a soft material such as silicon and the like so that it is configured to flexibly cope with a volume change due to the temperature rising of the non-conductive liquid 160. Thereby, the leakage of the non-conductive liquid outside the heat-dissipation device 130 can be prevented even when the volume of the non- conductive liquid is changed.
[43] The operations of the cooling fan 140 and the pump 170 are controlled by a controller (not shown) that is configured separately from the cooling device.
[44] The operation of the cooling device for the LED light source using the non- conductive liquid according to the present invention having such a configuration will be described as follows.
[45] If power is applied to the LED 111 of the LED light source 110, the LED 111 radiates heat generated by power consumption due to the lighting of the LED 111 and transfers heat to the non-conductive liquid 160 forming the direct contacting structure with the LED 111, thereby performing the heat exchange.
[46] At this time, the pump 170 is driven according to the control signal of the controller to move the non-conductive liquid 160 filled in the transparent device 113 of the LED light source 110 to the heat-dissipation device 130 through the liquid circulation tube 120 and to back move the non-conductive liquid 160 to the transparent device 113 of the LED light source 110 through the liquid circulation tube 120, thereby circulating the non-conductive liquid.
[47] Heat owned by the non-conductive liquid 160 is emitted in the air and is heat- exchanged by the operated cooling fan 140 while moving the non-conductive liquid 160 transferred with heat from the LED 111 to the heat-dissipation device 130 and is transferred to the transparent device 113 of the LED light source 110.
[48] Herein, the buffer plate 150, which is installed at the lower portion of the cooling fan
140, is expanded corresponding to the non-conductive liquid 160 causing the volume change due to the temperature rising to prevent the non-conductive liquid from leaking outside the heat-dissipation device 130.
[49] Also, the non-conductive liquid 160 moved to the transparent device 113 after being heat-exchanged in the heat-dissipation device 130 contacts the PCB 112 from the rear surface of the PCB 112 to the front surface thereof or vice versa through the through hole 112a and freely contacts the LED 111 and the PCB 112 in all directions, thereby performing the heat exchange.
[50] Meanwhile, the temperature of the circulated non-conductive liquid is monitored by the temperature sensor 181 or the micro switch 182 and the revolution number of the cooling fan 140 is controlled by the controller (not shown) having a separate connection configuration according to the sensing signal of the temperature sensor 181 or the micro switch 182, thereby controlling the cooling and heat-dissipation efficiency.
[51] In other words, when the temperature of the non-conductive liquid 160 is set to the setting temperature or less, the revolution number of the cooling fan 140 is controlled to be lowered and when the temperature is set to the setting temperature or more, the revolution number of the cooling fan 140 is controlled to be raised, thereby increasing the intensity of the cooling and heat dissipation.
[52] Herein, the micro switch 182 provides the sensing signal when outer pressure is applied by contacting the buffer plate 150, when the buffer plate 150 flexibly expanded according to the temperature owned by the non-conductive liquid is inflated by the volume change of the non-conductive liquid 160.
[53] As a result, the cooling device using the non-conductive liquid according to the present invention performs the cooling process on the LED 111 and the PCB 112 through the direct contact of the non-conductive liquid 160 with the LED 111 and the PCB 112 and the non-conductive liquid contacts the LED 111 and the PCB 112 in all directions to exchange heat therebetween, making it possible to significantly increase the cooling and heat-dissipation efficiency of the LED 111 used as the lightsource as compared to the related art. Industrial Applicability
[54] Although the present invention is shown and described with reference to the specific embodiments, it can be appreciated from those skill in the art that the present is not limited thereto and can be variously changed.

Claims

Claims
[1] A cooling device for an LED light source comprising: an LED light source 110 where a PCB 112 having a plurality of LEDs 111 mounted thereon is received in a transparent device 113; a heat-dissipation device 130 connected to the transparent device 113 of the LED light source 110; and a non-conductive liquid 160 that is filled inside the transparent device 113 of the
LED light source 110 and the heat-dissipation device 130.
[2] The cooling device for an LED light source according to claim 1, further comprising: a liquid circulation tube 120 that communicates the transparent device 113 of the LED light source 110 with the heat-dissipation device 130; and a pump 170 that is installed on the liquid circulation tube 120 to circulate the non-conductive liquid 160.
[3] The cooling device for an LED light source according to claim 2, further comprising a cooling fan 140 at the central portion of the heat-dissipation device 130.
[4] The cooling device for an LED light source according to claim 3, further comprising a buffer plate 150 that is disposed at a lower portion of the cooling fan 140 and has a function of preventing a leakage of liquid from the heat- dissipation device 130.
[5] The cooling device for an LED light source according to claim 4, wherein the cooling and heat-dissipation is controlled by sensing a temperature of the non- conductive liquid 160 by installing a temperature sensor 181 on the PCB 112 of the LED light source 110 or a micro switch 182 on an upper side of the buffer plate 150.
[6] The cooling device for an LED light source according to claim 2, wherein a through hole 112a is formed on the PCB 112 to allow the non-conductive liquid 160, which circulates the transparent device 113 and the heat-dissipation device 130, to smoothly move the rear and front surfaces of the PCB 112.
[7] The cooling device for an LED light source according to claim 2, wherein the heat-dissipation device 130 is made of any one selected from heat conductive resin or thin plate metal or its main body is made of heat conductive resin and the heat-dissipation surface is made of a thin plate metal.
[8] The cooling device for an LED light source according to claim 7, wherein the heat-dissipation device 130 is configured to secure a large heat-exchanging area by being formed in an uneven or wrinkle structure.
PCT/KR2008/005328 2007-09-10 2008-09-10 Cooling device for led light source using non-conductive liquid WO2009035257A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2020070015043U KR200438525Y1 (en) 2007-09-10 2007-09-10 Cooling device for led light source using non-conductive liquid
KR20-2007-0015043 2007-09-10

Publications (2)

Publication Number Publication Date
WO2009035257A2 true WO2009035257A2 (en) 2009-03-19
WO2009035257A3 WO2009035257A3 (en) 2009-05-14

Family

ID=40452684

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2008/005328 WO2009035257A2 (en) 2007-09-10 2008-09-10 Cooling device for led light source using non-conductive liquid

Country Status (2)

Country Link
KR (1) KR200438525Y1 (en)
WO (1) WO2009035257A2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2944855A1 (en) * 2009-04-27 2010-10-29 Hmi Innovation LED LIGHTING DEVICE INCORPORATING IMPROVED MEANS FOR ENHANCED THERMAL DISSIPATION
WO2010111223A3 (en) * 2009-03-26 2010-11-11 Cree Led Lighting Solutions, Inc. Lighting device and method of cooling lighting device
WO2010140171A1 (en) * 2009-06-02 2010-12-09 Asbjorn Elias Torfason Solid-state plant growth lighting device and a method for cooling same
CN102330962A (en) * 2011-09-19 2012-01-25 贵州光浦森光电有限公司 Lighting method and device of LED (light-emitting diode)
US20120103574A1 (en) * 2010-11-01 2012-05-03 Mingwei Zhu Heating system utilizing waste heat from illuminating device
ITMI20130787A1 (en) * 2013-05-14 2014-11-15 Tcore S R L LIGHTING DEVICE

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100932430B1 (en) * 2008-07-04 2009-12-17 주식회사 미광엔비텍 Heat-discharging apparatus for illuminator using led
KR100898492B1 (en) * 2008-09-12 2009-05-19 이동수 A circualting and cooling type illuminator using a lihgt source of high illuminating power
KR100880262B1 (en) * 2008-09-16 2009-01-30 (주)휴먼세미컴 Led-lamp with heatsink structure
KR100994754B1 (en) 2008-09-26 2010-11-19 이채은 A circualting and cooling type illuminator using a lihgt source of high illuminating power
KR200453879Y1 (en) 2009-01-16 2011-06-01 주식회사 스타라이팅 A luminescent diode lamp with cooling device
KR100934707B1 (en) * 2009-02-25 2009-12-29 주식회사 필엔지 Led lighting apparatus
KR101043656B1 (en) * 2009-06-12 2011-06-22 한국기계연구원 Liquid Cooling Apparatus for Heat Dissipation of High Power Light Emitting Diode
KR101223658B1 (en) 2011-11-07 2013-01-17 안해주 Led lighting device having cooling module
EA028004B1 (en) * 2015-04-07 2017-09-29 Илья Борисович НАЛИЧАЕВ Lighting installation
CN105736973B (en) * 2016-01-29 2019-04-02 东莞市闻誉实业有限公司 Liquid-cooling LED illuminator
CN105674073B (en) * 2016-01-29 2019-04-16 东莞市闻誉实业有限公司 Circulation radiating type lighting device
CN105546375B (en) * 2016-01-29 2018-09-18 东莞市闻誉实业有限公司 Liquid cooling LED lamps and lanterns
CN105674074B (en) * 2016-01-29 2019-02-26 东莞市闻誉实业有限公司 Lighting device
CN106195661A (en) * 2016-08-03 2016-12-07 中山市风华稀柠照明设计有限公司 A kind of heat radiation device of high-power LED

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000131688A (en) * 1998-10-22 2000-05-12 Advanced Display Inc Illuminator
US6517221B1 (en) * 1999-06-18 2003-02-11 Ciena Corporation Heat pipe heat sink for cooling a laser diode
JP2005300663A (en) * 2004-04-07 2005-10-27 Seiko Epson Corp Light source device and projector using the same
JP2007103748A (en) * 2005-10-06 2007-04-19 Seiko Epson Corp Heat exchanger, liquid-cooling system, light source equipment, projector, electronic device unit, and electronic equipment

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000131688A (en) * 1998-10-22 2000-05-12 Advanced Display Inc Illuminator
US6517221B1 (en) * 1999-06-18 2003-02-11 Ciena Corporation Heat pipe heat sink for cooling a laser diode
JP2005300663A (en) * 2004-04-07 2005-10-27 Seiko Epson Corp Light source device and projector using the same
JP2007103748A (en) * 2005-10-06 2007-04-19 Seiko Epson Corp Heat exchanger, liquid-cooling system, light source equipment, projector, electronic device unit, and electronic equipment

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010111223A3 (en) * 2009-03-26 2010-11-11 Cree Led Lighting Solutions, Inc. Lighting device and method of cooling lighting device
CN102362118A (en) * 2009-03-26 2012-02-22 科锐公司 Lighting device and method of cooling lighting device
US8950910B2 (en) 2009-03-26 2015-02-10 Cree, Inc. Lighting device and method of cooling lighting device
FR2944855A1 (en) * 2009-04-27 2010-10-29 Hmi Innovation LED LIGHTING DEVICE INCORPORATING IMPROVED MEANS FOR ENHANCED THERMAL DISSIPATION
WO2010125294A1 (en) * 2009-04-27 2010-11-04 Hmi Innovation Led lighting device including improved means for promoting heat dissipation
WO2010140171A1 (en) * 2009-06-02 2010-12-09 Asbjorn Elias Torfason Solid-state plant growth lighting device and a method for cooling same
US20120103574A1 (en) * 2010-11-01 2012-05-03 Mingwei Zhu Heating system utilizing waste heat from illuminating device
CN102330962A (en) * 2011-09-19 2012-01-25 贵州光浦森光电有限公司 Lighting method and device of LED (light-emitting diode)
ITMI20130787A1 (en) * 2013-05-14 2014-11-15 Tcore S R L LIGHTING DEVICE
EP2803907A1 (en) * 2013-05-14 2014-11-19 TCore S.r.l. Lighting device

Also Published As

Publication number Publication date
KR200438525Y1 (en) 2008-02-26
WO2009035257A3 (en) 2009-05-14

Similar Documents

Publication Publication Date Title
WO2009035257A2 (en) Cooling device for led light source using non-conductive liquid
JP4757174B2 (en) Backlight unit
KR100924593B1 (en) Heat radiating device and LED streetlight comprising the same
KR20080007961A (en) Cooling device of led module and manufacturing method thereof
CA2617314A1 (en) Mounting assembly for optoelectronic devices
JP2012503306A (en) Light emitting device
KR101866835B1 (en) LED light and PCB making method therefor
JP2007059894A (en) Light source mounted with light emitting diode element
CN101769521A (en) Heat dissipation device for light-emitting device and light-emitting device thereof
TW201107658A (en) Cooling system for modular light emitting diode lighting fitting
CN101140057A (en) Back light source of planar display heat radiating device
JP2006331858A (en) Lighting system
KR20100133286A (en) Led lighting device having radiating structure
KR101824986B1 (en) Lighting device
JP2012146552A (en) Lighting device
KR101231420B1 (en) Light-emitting diode aparatus
KR101363070B1 (en) Led lighting module
EP3259526B1 (en) Led lighting unit
CN201145243Y (en) LED cup lamp
KR20100112214A (en) Pcb having cooling function for led lighting apparatus
CN202013901U (en) Cooling baseplate device used for surface-mounting LED (Light Emitting Diode) light source
JP2011129469A (en) Lighting fixture
KR101105006B1 (en) LED heat emission assembly and method of manufacturing the same
KR100907345B1 (en) A street light using led lighting module
KR200434213Y1 (en) LED module having cooling apparatus

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08830959

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase in:

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 08830959

Country of ref document: EP

Kind code of ref document: A2