WO2009021202A3 - Apparatus and method for wafer edge defects detection - Google Patents

Apparatus and method for wafer edge defects detection Download PDF

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Publication number
WO2009021202A3
WO2009021202A3 PCT/US2008/072673 US2008072673W WO2009021202A3 WO 2009021202 A3 WO2009021202 A3 WO 2009021202A3 US 2008072673 W US2008072673 W US 2008072673W WO 2009021202 A3 WO2009021202 A3 WO 2009021202A3
Authority
WO
WIPO (PCT)
Prior art keywords
wafer edge
defects detection
edge defects
substrate
edge
Prior art date
Application number
PCT/US2008/072673
Other languages
French (fr)
Other versions
WO2009021202A2 (en
Inventor
Ju Jin
Satish Sadam
Vishal Verma
Zhiyan Huang
Siming Lin
Michael D Robbins
Paul F Forderhase
Original Assignee
Accretech Usa Inc
Ju Jin
Satish Sadam
Vishal Verma
Zhiyan Huang
Siming Lin
Michael D Robbins
Paul F Forderhase
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/891,657 external-priority patent/US7508504B2/en
Application filed by Accretech Usa Inc, Ju Jin, Satish Sadam, Vishal Verma, Zhiyan Huang, Siming Lin, Michael D Robbins, Paul F Forderhase filed Critical Accretech Usa Inc
Publication of WO2009021202A2 publication Critical patent/WO2009021202A2/en
Publication of WO2009021202A3 publication Critical patent/WO2009021202A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9503—Wafer edge inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A substrate illumination and inspection system provides for illuminating and inspecting a substrate particularly the substrate edge. The system a image processor to automatically detect and characterize defects on the wafer's edge.
PCT/US2008/072673 2007-08-09 2008-08-08 Apparatus and method for wafer edge defects detection WO2009021202A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US96416307P 2007-08-09 2007-08-09
US60/964,163 2007-08-09
US11/891,657 US7508504B2 (en) 2006-05-02 2007-08-09 Automatic wafer edge inspection and review system
US11/891,657 2007-08-09

Publications (2)

Publication Number Publication Date
WO2009021202A2 WO2009021202A2 (en) 2009-02-12
WO2009021202A3 true WO2009021202A3 (en) 2009-04-09

Family

ID=40342065

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2008/072673 WO2009021202A2 (en) 2007-08-09 2008-08-08 Apparatus and method for wafer edge defects detection

Country Status (1)

Country Link
WO (1) WO2009021202A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9239295B2 (en) 2012-04-09 2016-01-19 Kla-Tencor Corp. Variable polarization wafer inspection
CN109001228B (en) * 2018-09-18 2024-02-27 华侨大学 Rotary workbench with backlight illumination for detecting substrate defects
CN111307819B (en) * 2020-03-16 2024-03-08 上海华力微电子有限公司 Wafer edge defect detection system and method
CN114088724B (en) * 2021-11-20 2023-08-18 深圳市北科检测科技有限公司 Display screen edge defect detection device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859698A (en) * 1997-05-07 1999-01-12 Nikon Corporation Method and apparatus for macro defect detection using scattered light
US6432800B2 (en) * 2000-02-03 2002-08-13 Selight Co., Ltd. Inspection of defects on the circumference of semiconductor wafers
US6629292B1 (en) * 2000-10-06 2003-09-30 International Business Machines Corporation Method for forming graphical images in semiconductor devices
US20050013474A1 (en) * 2003-07-14 2005-01-20 August Technology Corp. Edge normal process
KR20050024922A (en) * 2003-09-05 2005-03-11 김광렬 Apparatus for detecting a defect on edge area of a wafer and method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5859698A (en) * 1997-05-07 1999-01-12 Nikon Corporation Method and apparatus for macro defect detection using scattered light
US6432800B2 (en) * 2000-02-03 2002-08-13 Selight Co., Ltd. Inspection of defects on the circumference of semiconductor wafers
US6629292B1 (en) * 2000-10-06 2003-09-30 International Business Machines Corporation Method for forming graphical images in semiconductor devices
US20050013474A1 (en) * 2003-07-14 2005-01-20 August Technology Corp. Edge normal process
KR20050024922A (en) * 2003-09-05 2005-03-11 김광렬 Apparatus for detecting a defect on edge area of a wafer and method therefor

Also Published As

Publication number Publication date
WO2009021202A2 (en) 2009-02-12

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