WO2008122347A3 - Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support - Google Patents

Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support Download PDF

Info

Publication number
WO2008122347A3
WO2008122347A3 PCT/EP2008/002202 EP2008002202W WO2008122347A3 WO 2008122347 A3 WO2008122347 A3 WO 2008122347A3 EP 2008002202 W EP2008002202 W EP 2008002202W WO 2008122347 A3 WO2008122347 A3 WO 2008122347A3
Authority
WO
WIPO (PCT)
Prior art keywords
support
printed conductor
sheet
production
contact point
Prior art date
Application number
PCT/EP2008/002202
Other languages
German (de)
English (en)
Other versions
WO2008122347A2 (fr
Inventor
Hans Layer
Original Assignee
Alcan Tech & Man Ltd
Hans Layer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcan Tech & Man Ltd, Hans Layer filed Critical Alcan Tech & Man Ltd
Priority to EP08734674A priority Critical patent/EP2145292A2/fr
Publication of WO2008122347A2 publication Critical patent/WO2008122347A2/fr
Publication of WO2008122347A3 publication Critical patent/WO2008122347A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0323—Carbon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/032—Materials
    • H05K2201/0329—Intrinsically conductive polymer [ICP]; Semiconductive polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Switches (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

L'invention concerne un support en forme de feuille (10) réalisé dans un matériau flexible, comportant une piste conductrice (16) disposée sur un côté (12) du support (10), pourvue d'une connexion électrique avec une zone de contact (22) disposée sur l'autre côté (14) du support (10). La connexion électrique entre la zone de contact (22) et un point de contact (24) situé sur la piste conductrice (16), opposé à la zone de contact (22), est un passage (20) réalisé dans le support (10), rempli d'une masse électroconductrice (EL).
PCT/EP2008/002202 2007-04-10 2008-03-19 Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support WO2008122347A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP08734674A EP2145292A2 (fr) 2007-04-10 2008-03-19 Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH0586/07 2007-04-10
CH5862007 2007-04-10

Publications (2)

Publication Number Publication Date
WO2008122347A2 WO2008122347A2 (fr) 2008-10-16
WO2008122347A3 true WO2008122347A3 (fr) 2008-11-27

Family

ID=39769165

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/002202 WO2008122347A2 (fr) 2007-04-10 2008-03-19 Support en forme de feuille comportant une piste conductrice et procédé de fabrication du support

Country Status (2)

Country Link
EP (1) EP2145292A2 (fr)
WO (1) WO2008122347A2 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0818752A2 (fr) * 1996-07-08 1998-01-14 Fela Holding AG Carte à circuits (Inlet) pour des cartes à puces
DE19811578A1 (de) * 1998-03-17 1999-10-14 Siemens Ag Mehrlagige Leiterplatte sowie Verfahren zu deren Herstellung
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US20050158456A1 (en) * 2001-08-03 2005-07-21 Seiko Epson Corporation Method and apparatus for making devices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0818752A2 (fr) * 1996-07-08 1998-01-14 Fela Holding AG Carte à circuits (Inlet) pour des cartes à puces
DE19811578A1 (de) * 1998-03-17 1999-10-14 Siemens Ag Mehrlagige Leiterplatte sowie Verfahren zu deren Herstellung
US6421013B1 (en) * 1999-10-04 2002-07-16 Amerasia International Technology, Inc. Tamper-resistant wireless article including an antenna
US20050158456A1 (en) * 2001-08-03 2005-07-21 Seiko Epson Corporation Method and apparatus for making devices

Also Published As

Publication number Publication date
WO2008122347A2 (fr) 2008-10-16
EP2145292A2 (fr) 2010-01-20

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