WO2008120883A1 - Apparatus for inspection of semiconductor device and method for inspection using the same - Google Patents
Apparatus for inspection of semiconductor device and method for inspection using the same Download PDFInfo
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- WO2008120883A1 WO2008120883A1 PCT/KR2008/001637 KR2008001637W WO2008120883A1 WO 2008120883 A1 WO2008120883 A1 WO 2008120883A1 KR 2008001637 W KR2008001637 W KR 2008001637W WO 2008120883 A1 WO2008120883 A1 WO 2008120883A1
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- semiconductor device
- illuminators
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- image
- respect
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 103
- 238000007689 inspection Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims description 24
- 230000007547 defect Effects 0.000 claims abstract description 17
- 238000003384 imaging method Methods 0.000 claims abstract description 8
- 238000005286 illumination Methods 0.000 claims description 10
- 238000005192 partition Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 238000007792 addition Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
Definitions
- the present invention relates to an apparatus for inspection of a semiconductor device and a method for inspection using the same, and more particularly to an apparatus for inspection of a semiconductor device and a method for inspection using the same capable of more accurately inspecting the semiconductor device by illuminating light on the semiconductor device received in a tray in various directions to acquire images without shadows.
- the outer shape of the semiconductor device is photographed using a vision camera and the photograph is analyzed to inspect whether a defect is generated in, for example, a marking formed on one surface of the semiconductor device and a ball or lead in contact with one surface of the semiconductor device.
- an outer frame 110 is formed at a periphery of the tray 100, and partition walls 130 are formed to define receiving grooves 120 in order to receive a number of semiconductor devices in the tray 100.
- partition walls 130 are formed to define receiving grooves 120 in order to receive a number of semiconductor devices in the tray 100.
- the shadow is formed due to the outer frame and the partition walls formed in the tray according to the light illumination direction.
- the shadow may be considered as a surface spot, and it may be analyzed that the lead or ball is inferior.
- the present invention has been made in view of the above problems, and it is an object of the present invention to provide an apparatus for inspection of a semiconductor device and a method for inspection using the same, wherein light is illuminated on the semiconductor device received in a tray in various directions to acquire a number of images reflected from the surface of the semiconductor device according to light illumination, shadows are removed from the acquired images to combine the images without the shadows into a single image, and the combined single image is compared with a reference image to determine whether there is a defect of the semiconductor device, thereby reducing inspection errors due to a shadow image.
- an apparatus for inspection of an external appearance of a semiconductor device received in a tray comprising: a controller; a lighting unit having at least two illuminators which are sequentially turned on and off according to control signals of the controller to illuminate light on an upper surface of the semiconductor device at a specific angle, an imaging unit which captures at least two images reflected from the surface of the semiconductor device according to selective light illumination of the lighting unit an image processor which respectively removes shadows from the images captured by the imaging unit and combines the images into a single image; and an image inspection unit which compares the single image combined by the image processor with a reference image to determine whether there is a defect.
- the lighting unit may include first to fourth illuminators which are disposed in four directions of front, rear, left and right directions with respect to the semiconductor device.
- the lighting unit may include first illuminators which are disposed in a first direction and in a second direction adjacent to the first direction with respect to the semiconductor device and second illuminators which are disposed in a third direction facing the first direction and in a fourth direction facing the second direction.
- the lighting unit may include first illuminators which are disposed in a first direction and in a third direction facing the first direction with respect to the semiconductor device and second illuminators which are disposed in a second direction adjacent to the first direction and in a fourth direction facing the second direction.
- a method for inspection of an external appearance of a semiconductor device received in a tray comprising: sequentially turning on and off illuminators disposed in at least two divided regions with respect to the semiconductor device and acquiring respective images reflected from a surface of the semiconductor device removing shadows from the acquired images; combining the respective images without the shadows into a single image; and comparing the combined single image with a reference image to determine whether there is a defect.
- the step of sequentially turning on and off illuminators includes selectively turning on and off the illuminators in four directions of front, rear, left and right directions with respect to the semiconductor device.
- the step of sequentially turning on and off illuminators includes alternately turning on and off first illuminators, which are disposed in a first direction and in a second direction adjacent to the first direction with respect to the semiconductor device, and second illuminators, which are disposed in a third direction facing the first direction and in a fourth direction facing the second direction with respect to the semiconductor device.
- the step of sequentially turning on and off illuminators includes alternately turning on and off first illuminators, which are disposed in a first direction and in a third direction facing the first direction with respect to the semiconductor device, and second illuminators, which are disposed in a second direction adjacent to the first direction and in a fourth direction facing the second direction with respect to the semiconductor device.
- FIG. 1 illustrates a configuration of an apparatus for inspection of a semiconductor device according to the present invention
- FIGS. 2 to 4 illustrate various arrangement structures of a lighting unit shown in
- FIG. 1 A first figure.
- FIGS. 5 to 7 illustrate conceptional diagrams for explaining a method for inspection of a semiconductor device according to embodiments of the present invention
- FIGS. 8 and 9 illustrate conceptional diagrams for explaining a conventional method for inspection of a semiconductor device. Best Mode for Carrying Out the Invention
- FIG. 1 illustrates a configuration of an apparatus for inspection of a semiconductor device according to the present invention, which includes a controller 11, a supporting table 14 which supports a tray 13 for receiving a semiconductor device 12, a lighting unit 15 which includes at least two illuminators 151 to illuminate light on the semiconductor device 12 at inclined angles, an imaging unit 16 which captures at least two images reflected from the surface of the semiconductor device 12 according to the selective light illumination of the lighting unit 15, an image processor 17 which combines a number of images captured by the imaging unit 16into a single image, and an image inspection unit 18 which compares the combined single image with a reference image to determine whether there is a defect of the semiconductor device 12.
- FIGS. 2 to 4 illustrate various arrangement structures of the lighting unit shown in
- the lighting unit 15 includes first to fourth illuminators Rl, R2,
- R3 and R4 which are disposed in four (front, rear, left and right) directions with respect to the semiconductor device 12.
- the lighting unit 15 illuminates light at inclined angles in four directions with respect to the semiconductor device 12 received in the tray.
- the lighting unit 15 includes a first illuminator Rl corresponding to the front side of the semiconductor device 12, a second illuminator R2 corresponding to the right side thereof, a third illuminator R3 corresponding to the rear side thereof, and a fourth illuminator R4 corresponding to the left side thereof.
- Each illuminator may include a number of LEDs.
- divided regions of the first to fourth illuminators Rl, R2, R3 and R4 may be modified through various embodiments without being limited to the case shown in FIG. 2.
- the lighting unit 15 may include first illuminators Rl which are disposed in a first direction and in a second direction adjacent to the first direction with respect to the semiconductor device, and second illuminators R2 which are disposed in a third direction facing the first direction and in a fourth direction facing the second direction.
- the lighting unit 15 may include first illuminators Rl which are disposed in the first direction and in the third direction facing the first direction with respect to the semiconductor device, and second illuminators R2 which are disposed in the second direction adjacent to the first direction and in the fourth direction facing the second direction.
- FIGS. 5 to 7 illustrate conceptional diagrams for explaining a method for inspection of a semiconductor device according to embodiments of the present invention.
- an external appearance of the semiconductor device is inspected while the semiconductor device is received in the tray.
- the method according to a first embodiment of the present invention includes sequentially turning on and off the illuminators disposed in the four divided regions (front, rear, left and right regions) with respect to the semiconductor device and acquiring respective images reflected from the surface of the semiconductor device removing shadows from the acquired images; combining the respective images without the shadows into a single image; comparing the combined single image with a reference image to determine whether there is a defect of the semiconductor device.
- first to fourth images are acquired by capturing images reflected from the surface of the semiconductor device whenever the illuminator lights up while the first to fourth illuminators Rl to R4 are turned on and off in a certain order.
- each illuminator illuminates light at an angle inclined to any side
- a partition wall or an outer frame formed in the tray 13 has a height difference with the surface of the semiconductor device 12
- a shadow is formed by a side adjacent to the light illumination direction.
- illuminators are disposed in four directions with respect to the semiconductor device and four images are acquired in the present invention, illuminators may be installed in five or more divided regions to acquire images as the number of the illuminators.
- the method according to a second embodiment of the present invention includes turning on illuminators disposed in first and second directions adjacent to a tray loading position to acquire a first image turning on illuminators disposed in third and fourth directions to acquire a second image removing shadows of the first image and the second image; combining the first image and the second image without the shadows into a singe image; and comparing the combined single image with a reference image to determine whether there is a defect of the semiconductor device.
- first illuminators Rl disposed in the first and second directions are turned on and an image reflected from the semiconductor device 12 is captured to acquire the first image.
- the first illuminators Rl are turned off and second illuminators R2 disposed in the third and fourth directions opposite to the first and second directions are turned on.
- the image reflected from the semiconductor device 12 is captured to acquire the second image.
- each illuminator illuminates light at an angle inclined to any side, if a partition wall or an outer frame formed in the tray 13has a height difference with the surface of the semiconductor device 12, a shadow is formed by sides adjacent to the light illumination direction.
- the first and second images without the shadows are combined into a single image.
- the combined single image is compared with the reference image to determine whether there is a defect of the semiconductor device.
- the method according to a third embodiment of the present invention includes turning on first illuminators Rl disposed in a first direction adjacent to a tray loading position and in a third direction facing the first direction to acquire a first image turning on second illuminators R2 disposed in second and fourth directions to acquire a second image removing shadows from the first image and the second image; combining the first image and the second image without the shadows into a singe image; and comparing the combined single image with a reference image to determine whether there is a defect of the semiconductor device.
- the first illuminators Rl disposed in the first direction and the third direction facing the first direction are turned on and the image reflected from the semiconductor device 12is captured to acquire the first image.
- the first illuminators Rl are turned off and the second illuminators R2, which are disposed in the second direction adjacent to the first direction and in the fourth direction facing the second direction, are turned on.
- the image reflected from the semiconductor device 12 is captured to acquire the second image.
- the first and second images without the shadows are combined into a single image.
- the combined single image is compared with a reference image to determine whether there is a defect of the semiconductor device.
- the present invention light is illuminated on the semiconductor device received in the tray in various directions to acquire a number of images reflected from the surface of the semiconductor device according to the light illumination. Then, shadows are removed from the acquired images and the images without the shadows are combined into a single image. Then, the combined single image is compared with a reference image to determine whether there is a defect of the semiconductor device. Therefore, it is possible to improve reliability of inspection by reducing inspection errors due to a shadow image.
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- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
An apparatus for inspection of an external appearance of a semiconductor device received in a tray includes a controller, a lighting unit having at least two illuminators which are sequentially turned on and off according to control signals of the controller to illuminate light on an upper surface of the semiconductor device at a specific angle, an imaging unit which captures at least two images reflected from the surface of the semiconductor device according to selective light il¬ lumination of the lighting unit, an image processor which respectively removes shadows from the images captured by the imaging unit and combines the images into a single image, and an image inspection unit which compares the single image combined by the image processor with a reference image to determine whether there is a defect.
Description
Description
APPARATUS FOR INSPECTION OF SEMICONDUCTOR DEVICE AND METHOD FOR INSPECTION USING THE SAME
Technical Field
[1] The present invention relates to an apparatus for inspection of a semiconductor device and a method for inspection using the same, and more particularly to an apparatus for inspection of a semiconductor device and a method for inspection using the same capable of more accurately inspecting the semiconductor device by illuminating light on the semiconductor device received in a tray in various directions to acquire images without shadows. Background Art
[2] Generally, semiconductor devices manufactured through a manufacturing process should undergo accurate inspection before shipping.
[3] Since the semiconductor device requires high accuracy, an even small defect occurring in an inner element or an outer shape of the device causes a critical influence on performance of the device.
[4] Accordingly, it is necessary to inspect not only an electrical operation of the semiconductor device, but also an outer shape thereof.
[5] In a method for inspection of an outer shape of the semiconductor device, the outer shape of the semiconductor device is photographed using a vision camera and the photograph is analyzed to inspect whether a defect is generated in, for example, a marking formed on one surface of the semiconductor device and a ball or lead in contact with one surface of the semiconductor device.
[6] Specifically, as shown in FIGS. 8 and 9, semiconductor devices undergo various inspections while the devices are disposed in a rectangular tray made of plastic and moved.
[7] In this case, after a semiconductor device 200 disposed in a tray 100 is picked up by a holder and placed in a specific position of a tester, the electrical inspection is performed on the semiconductor device 200.
[8] Further, as for the inspection of an outer shape, in a state where the semiconductor device is disposed in the tray 100, that is, in an in-tray state, light is illuminated on the semiconductor device using a lighting unit. Then, the outer shape of the semiconductor device is photographed by the vision camera, and the image is analyzed.
[9] In the conventional in-tray method, an outer frame 110 is formed at a periphery of the tray 100, and partition walls 130 are formed to define receiving grooves 120 in order to receive a number of semiconductor devices in the tray 100.
[10] However, since there is height difference between the surfaces of the semiconductor devices received in the receiving grooves 120 and the outer frame 100 and the partition walls 130, a shadow is formed according to the light illumination direction when light is illuminated for vision inspection, thereby causing an inspection error due to the shadow.
[11] In other words, the shadow is formed due to the outer frame and the partition walls formed in the tray according to the light illumination direction. The shadow may be considered as a surface spot, and it may be analyzed that the lead or ball is inferior.
[12] Meanwhile, the method for inspection of an outer shape of a semiconductor device is filed by the present applicant and disclosed in Korean Patent Registration No. 10-617619, entitled "Apparatus for inspection of a semiconductor device and method for inspection using the same."
[13] According to the disclosed method, light is illuminated on the upper surface of the semiconductor device at inclined angles from a plurality of light sources to produce a plurality of distinguishable shadows. Then, the shadow images are combined to detect an outline of the semiconductor device, thereby inspecting the size of the semiconductor device.
[14] That is, in a case of acquiring an unclear image of the semiconductor device and the tray, since an external appearance (i.e., outline) of the semiconductor device cannot be accurately obtained, it is difficult to inspect the size of the semiconductor device, but it is possible to overcome the problem by the disclosed method. In this method, only the size of the semiconductor device is inspected by illuminating light to facing edges of the semiconductor device, producing shadows in the facing edges and neighboring sides of the semiconductor device, and combining the shadow images. In this case, since the shadow images are combined, it is difficult to inspect whether there is a defect in the surface of the semiconductor device due to the shadow images. Disclosure of Invention Technical Problem
[15] Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide an apparatus for inspection of a semiconductor device and a method for inspection using the same, wherein light is illuminated on the semiconductor device received in a tray in various directions to acquire a number of images reflected from the surface of the semiconductor device according to light illumination, shadows are removed from the acquired images to combine the images without the shadows into a single image, and the combined single image is compared with a reference image to determine whether there is a defect of the semiconductor device, thereby reducing inspection errors due to a shadow image.
Technical Solution
[16] In accordance with an aspect of the present invention, there is provided an apparatus for inspection of an external appearance of a semiconductor device received in a tray, the apparatus comprising: a controller; a lighting unit having at least two illuminators which are sequentially turned on and off according to control signals of the controller to illuminate light on an upper surface of the semiconductor device at a specific angle, an imaging unit which captures at least two images reflected from the surface of the semiconductor device according to selective light illumination of the lighting unit an image processor which respectively removes shadows from the images captured by the imaging unit and combines the images into a single image; and an image inspection unit which compares the single image combined by the image processor with a reference image to determine whether there is a defect.
[17] In this case, the lighting unit may include first to fourth illuminators which are disposed in four directions of front, rear, left and right directions with respect to the semiconductor device.
[18] Further, the lighting unit may include first illuminators which are disposed in a first direction and in a second direction adjacent to the first direction with respect to the semiconductor device and second illuminators which are disposed in a third direction facing the first direction and in a fourth direction facing the second direction.
[19] Further, the lighting unit may include first illuminators which are disposed in a first direction and in a third direction facing the first direction with respect to the semiconductor device and second illuminators which are disposed in a second direction adjacent to the first direction and in a fourth direction facing the second direction.
[20] In accordance with another aspect of the present invention, there is provided a method for inspection of an external appearance of a semiconductor device received in a tray, the method comprising: sequentially turning on and off illuminators disposed in at least two divided regions with respect to the semiconductor device and acquiring respective images reflected from a surface of the semiconductor device removing shadows from the acquired images; combining the respective images without the shadows into a single image; and comparing the combined single image with a reference image to determine whether there is a defect.
[21] In this case, the step of sequentially turning on and off illuminators includes selectively turning on and off the illuminators in four directions of front, rear, left and right directions with respect to the semiconductor device.
[22] Further, the step of sequentially turning on and off illuminators includes alternately turning on and off first illuminators, which are disposed in a first direction and in a second direction adjacent to the first direction with respect to the semiconductor
device, and second illuminators, which are disposed in a third direction facing the first direction and in a fourth direction facing the second direction with respect to the semiconductor device.
[23] Further, the step of sequentially turning on and off illuminators includes alternately turning on and off first illuminators, which are disposed in a first direction and in a third direction facing the first direction with respect to the semiconductor device, and second illuminators, which are disposed in a second direction adjacent to the first direction and in a fourth direction facing the second direction with respect to the semiconductor device. Brief Description of the Drawings
[24] The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
[25] FIG. 1 illustrates a configuration of an apparatus for inspection of a semiconductor device according to the present invention
[26] FIGS. 2 to 4 illustrate various arrangement structures of a lighting unit shown in
FIG. 1
[27] FIGS. 5 to 7 illustrate conceptional diagrams for explaining a method for inspection of a semiconductor device according to embodiments of the present invention and
[28] FIGS. 8 and 9 illustrate conceptional diagrams for explaining a conventional method for inspection of a semiconductor device. Best Mode for Carrying Out the Invention
[29] FIG. 1 illustrates a configuration of an apparatus for inspection of a semiconductor device according to the present invention, which includes a controller 11, a supporting table 14 which supports a tray 13 for receiving a semiconductor device 12, a lighting unit 15 which includes at least two illuminators 151 to illuminate light on the semiconductor device 12 at inclined angles, an imaging unit 16 which captures at least two images reflected from the surface of the semiconductor device 12 according to the selective light illumination of the lighting unit 15, an image processor 17 which combines a number of images captured by the imaging unit 16into a single image, and an image inspection unit 18 which compares the combined single image with a reference image to determine whether there is a defect of the semiconductor device 12.
[30] FIGS. 2 to 4 illustrate various arrangement structures of the lighting unit shown in
FIG. 1.
[31] Referring to FIG. 2, the lighting unit 15 includes first to fourth illuminators Rl, R2,
R3 and R4, which are disposed in four (front, rear, left and right) directions with respect to the semiconductor device 12. The lighting unit 15illuminates light at
inclined angles in four directions with respect to the semiconductor device 12 received in the tray.
[32] That is, the lighting unit 15 includes a first illuminator Rl corresponding to the front side of the semiconductor device 12, a second illuminator R2 corresponding to the right side thereof, a third illuminator R3 corresponding to the rear side thereof, and a fourth illuminator R4 corresponding to the left side thereof. Each illuminator may include a number of LEDs.
[33] In this case, divided regions of the first to fourth illuminators Rl, R2, R3 and R4 may be modified through various embodiments without being limited to the case shown in FIG. 2.
[34] Referring to FIG. 3, the lighting unit 15 may include first illuminators Rl which are disposed in a first direction and in a second direction adjacent to the first direction with respect to the semiconductor device, and second illuminators R2 which are disposed in a third direction facing the first direction and in a fourth direction facing the second direction.
[35] Referring to FIG. 4, the lighting unit 15 may include first illuminators Rl which are disposed in the first direction and in the third direction facing the first direction with respect to the semiconductor device, and second illuminators R2 which are disposed in the second direction adjacent to the first direction and in the fourth direction facing the second direction.
[36] FIGS. 5 to 7 illustrate conceptional diagrams for explaining a method for inspection of a semiconductor device according to embodiments of the present invention. In the present invention, an external appearance of the semiconductor device is inspected while the semiconductor device is received in the tray.
[37] Referring to FIG. 5, the method according to a first embodiment of the present invention includes sequentially turning on and off the illuminators disposed in the four divided regions (front, rear, left and right regions) with respect to the semiconductor device and acquiring respective images reflected from the surface of the semiconductor device removing shadows from the acquired images; combining the respective images without the shadows into a single image; comparing the combined single image with a reference image to determine whether there is a defect of the semiconductor device.
[38] That is, first to fourth images are acquired by capturing images reflected from the surface of the semiconductor device whenever the illuminator lights up while the first to fourth illuminators Rl to R4 are turned on and off in a certain order.
[39] In this case, since each illuminator illuminates light at an angle inclined to any side, if a partition wall or an outer frame formed in the tray 13has a height difference with the surface of the semiconductor device 12, a shadow is formed by a side adjacent to the light illumination direction.
[40] Accordingly, the shadows are removed from the respective images acquired according to sequential light illumination.
[41] Then, four images without the shadows are combined into a single image. The combined single image is compared with the reference image to determine whether there is a defect of the semiconductor device.
[42] In this case, although the illuminators are disposed in four directions with respect to the semiconductor device and four images are acquired in the present invention, illuminators may be installed in five or more divided regions to acquire images as the number of the illuminators.
[43] Referring to FIG. 6, the method according to a second embodiment of the present invention includes turning on illuminators disposed in first and second directions adjacent to a tray loading position to acquire a first image turning on illuminators disposed in third and fourth directions to acquire a second image removing shadows of the first image and the second image; combining the first image and the second image without the shadows into a singe image; and comparing the combined single image with a reference image to determine whether there is a defect of the semiconductor device.
[44] That is, first illuminators Rl disposed in the first and second directions are turned on and an image reflected from the semiconductor device 12 is captured to acquire the first image.
[45] Then, the first illuminators Rl are turned off and second illuminators R2 disposed in the third and fourth directions opposite to the first and second directions are turned on. The image reflected from the semiconductor device 12 is captured to acquire the second image.
[46] In this case, since each illuminator illuminates light at an angle inclined to any side, if a partition wall or an outer frame formed in the tray 13has a height difference with the surface of the semiconductor device 12, a shadow is formed by sides adjacent to the light illumination direction.
[47] Accordingly, the shadows are respectively removed from the first and second images.
[48] Then, the first and second images without the shadows are combined into a single image. The combined single image is compared with the reference image to determine whether there is a defect of the semiconductor device.
[49] Referring to FIG. 7, the method according to a third embodiment of the present invention includes turning on first illuminators Rl disposed in a first direction adjacent to a tray loading position and in a third direction facing the first direction to acquire a first image turning on second illuminators R2 disposed in second and fourth directions to acquire a second image removing shadows from the first image and the second
image; combining the first image and the second image without the shadows into a singe image; and comparing the combined single image with a reference image to determine whether there is a defect of the semiconductor device.
[50] That is, the first illuminators Rl disposed in the first direction and the third direction facing the first direction are turned on and the image reflected from the semiconductor device 12is captured to acquire the first image.
[51] Then, the first illuminators Rl are turned off and the second illuminators R2, which are disposed in the second direction adjacent to the first direction and in the fourth direction facing the second direction, are turned on. The image reflected from the semiconductor device 12 is captured to acquire the second image.
[52] Then, the shadows are removed from the first and second images, respectively.
[53] Then, the first and second images without the shadows are combined into a single image. The combined single image is compared with a reference image to determine whether there is a defect of the semiconductor device. Industrial Applicability
[54] According to the present invention, light is illuminated on the semiconductor device received in the tray in various directions to acquire a number of images reflected from the surface of the semiconductor device according to the light illumination. Then, shadows are removed from the acquired images and the images without the shadows are combined into a single image. Then, the combined single image is compared with a reference image to determine whether there is a defect of the semiconductor device. Therefore, it is possible to improve reliability of inspection by reducing inspection errors due to a shadow image.
[55] Although the preferred embodiment of the present invention has been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
Claims
[1] An apparatus for inspection of an external appearance of a semiconductor device received in a tray, the apparatus comprising: a controller; a lighting unit having at least two illuminators which are sequentially turned on and off according to control signals of the controller to illuminate light on an upper surface of the semiconductor device at a specific angle, an imaging unit which captures at least two images reflected from the surface of the semiconductor device according to selective light illumination of the lighting unit an image processor which respectively removes shadows from the images captured by the imaging unit and combines the images into a single image; and an image inspection unit which compares the single image combined by the image processor with a reference image to determine whether there is a defect.
[2] The apparatus according to claim 1, wherein the lighting unit includes first to fourth illuminators which are disposed in four directions of front, rear, left and right directions with respect to the semiconductor device.
[3] The apparatus according to claim 1, wherein the lighting unit includes: first illuminators which are disposed in a first direction and in a second direction adjacent to the first direction with respect to the semiconductor device and second illuminators which are disposed in a third direction facing the first direction and in a fourth direction facing the second direction.
[4] The apparatus according to claim 1, wherein the lighting unit includes: first illuminators which are disposed in a first direction and in a third direction facing the first direction with respect to the semiconductor device and second illuminators which are disposed in a second direction adjacent to the first direction and in a fourth direction facing the second direction.
[5] A method for inspection of an external appearance of a semiconductor device received in a tray, the method comprising: sequentially turning on and off illuminators disposed in at least two divided regions with respect to the semiconductor device and acquiring respective images reflected from a surface of the semiconductor device removing shadows from the acquired images; combining the respective images without the shadows into a single image; and comparing the combined single image with a reference image to determine whether there is a defect.
[6] The method according to claim 5, wherein the step of sequentially turning on and
off illuminators includes selectively turning on and off the illuminators in four directions of front, rear, left and right directions with respect to the semiconductor device.
[7] The method according to claim 5, wherein the step of sequentially turning on and off illuminators includes alternately turning on and off first illuminators, which are disposed in a first direction and in a second direction adjacent to the first direction with respect to the semiconductor device, and second illuminators, which are disposed in a third direction facing the first direction and in a fourth direction facing the second direction with respect to the semiconductor device.
[8] The method according to claim 5, wherein the step of sequentially turning on and off illuminators includes alternately turning on and off first illuminators, which are disposed in a first direction and in a third direction facing the first direction with respect to the semiconductor device, and second illuminators, which are disposed in a second direction adjacent to the first direction and in a fourth direction facing the second direction with respect to the semiconductor device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070031846A KR100862883B1 (en) | 2007-03-30 | 2007-03-30 | Apparatus for inspection of semiconductor device and method for inspection using the same |
| KR10-2007-0031846 | 2007-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008120883A1 true WO2008120883A1 (en) | 2008-10-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2008/001637 WO2008120883A1 (en) | 2007-03-30 | 2008-03-24 | Apparatus for inspection of semiconductor device and method for inspection using the same |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100862883B1 (en) |
| WO (1) | WO2008120883A1 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011119372A1 (en) * | 2010-03-26 | 2011-09-29 | The Aerospace Corporation | Refraction assisted illumination for imaging |
| US8138476B2 (en) | 2009-11-05 | 2012-03-20 | The Aerospace Corporation | Refraction assisted illumination for imaging |
| US8450688B2 (en) | 2009-11-05 | 2013-05-28 | The Aerospace Corporation | Refraction assisted illumination for imaging |
| US9007454B2 (en) | 2012-10-31 | 2015-04-14 | The Aerospace Corporation | Optimized illumination for imaging |
| CN108449976A (en) * | 2015-10-19 | 2018-08-24 | 永友Dsp有限公司 | Panel surface check device |
| US20230123736A1 (en) * | 2021-10-14 | 2023-04-20 | Redzone Robotics, Inc. | Data translation and interoperability |
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| JPH11258157A (en) * | 1998-03-12 | 1999-09-24 | Shin Etsu Handotai Co Ltd | Foreign matter-inspecting apparatus |
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| CN100523795C (en) | 2001-11-30 | 2009-08-05 | 国际商业机器公司 | Inspection device and inspection method for pattern profile, exposure system |
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| JPH08128816A (en) * | 1994-10-28 | 1996-05-21 | Tosok Corp | Lead inspection method |
| JPH1187452A (en) * | 1997-09-10 | 1999-03-30 | Toshiba Corp | Inspection apparatus and method of inspecting positional deviation |
| JP2000230910A (en) * | 1999-02-12 | 2000-08-22 | Advanced Display Inc | Inspection apparatus and removing apparatus for substrate-adhering foreign matter and method and removing adhered foreign matter |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8138476B2 (en) | 2009-11-05 | 2012-03-20 | The Aerospace Corporation | Refraction assisted illumination for imaging |
| US8212215B2 (en) | 2009-11-05 | 2012-07-03 | The Aerospace Corporation | Refraction assisted illumination for imaging |
| US8450688B2 (en) | 2009-11-05 | 2013-05-28 | The Aerospace Corporation | Refraction assisted illumination for imaging |
| US8461532B2 (en) | 2009-11-05 | 2013-06-11 | The Aerospace Corporation | Refraction assisted illumination for imaging |
| WO2011119372A1 (en) * | 2010-03-26 | 2011-09-29 | The Aerospace Corporation | Refraction assisted illumination for imaging |
| US9007454B2 (en) | 2012-10-31 | 2015-04-14 | The Aerospace Corporation | Optimized illumination for imaging |
| CN108449976A (en) * | 2015-10-19 | 2018-08-24 | 永友Dsp有限公司 | Panel surface check device |
| US20230123736A1 (en) * | 2021-10-14 | 2023-04-20 | Redzone Robotics, Inc. | Data translation and interoperability |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20080088938A (en) | 2008-10-06 |
| KR100862883B1 (en) | 2008-10-13 |
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