WO2008111283A1 - Photocurable resin composition - Google Patents

Photocurable resin composition Download PDF

Info

Publication number
WO2008111283A1
WO2008111283A1 PCT/JP2008/000347 JP2008000347W WO2008111283A1 WO 2008111283 A1 WO2008111283 A1 WO 2008111283A1 JP 2008000347 W JP2008000347 W JP 2008000347W WO 2008111283 A1 WO2008111283 A1 WO 2008111283A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
photocurable resin
disclosed
photoacid generator
anion moiety
Prior art date
Application number
PCT/JP2008/000347
Other languages
French (fr)
Japanese (ja)
Inventor
Hiroto Miyake
Tsukasa Yoshida
Original Assignee
Daicel Chemical Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daicel Chemical Industries, Ltd. filed Critical Daicel Chemical Industries, Ltd.
Publication of WO2008111283A1 publication Critical patent/WO2008111283A1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/08—Saturated oxiranes
    • C08G65/10—Saturated oxiranes characterised by the catalysts used
    • C08G65/105—Onium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
    • C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
    • C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
    • C08G65/16—Cyclic ethers having four or more ring atoms
    • C08G65/18—Oxetanes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)

Abstract

Disclosed is a photocurable resin composition which is excellent in transparency and heat resistance, while having high photocuring rate and suppressed curing shrinkage. Also disclosed is a cured product of such a photocurable resin composition. Specifically disclosed is a photocurable resin composition containing at least the following components (A)-(C). (A) a vinyl ether compound (B) an epoxy compound and/or a cyclic ether compound containing an oxetanyl group (C) a cationic photoacid generator wherein the anion moiety has a charge density equal to or higher than that of PF6- This photocurable resin composition is characterized in that the component (B) is contained in an amount of 6-85% by weight of the total of the composition. The anion moiety of the cationic photoacid generator (C) is preferably composed of PF6-, BF4- or CF3SO4-.
PCT/JP2008/000347 2007-03-09 2008-02-26 Photocurable resin composition WO2008111283A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-059460 2007-03-09
JP2007059460 2007-03-09

Publications (1)

Publication Number Publication Date
WO2008111283A1 true WO2008111283A1 (en) 2008-09-18

Family

ID=39759227

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/000347 WO2008111283A1 (en) 2007-03-09 2008-02-26 Photocurable resin composition

Country Status (2)

Country Link
TW (1) TW200844124A (en)
WO (1) WO2008111283A1 (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010001538A1 (en) * 2008-06-30 2010-01-07 株式会社日立製作所 Fine structure and stamper for imprinting
WO2010116929A1 (en) * 2009-04-06 2010-10-14 ダイセル化学工業株式会社 Cation-polymerizable resin composition and cured product thereof
WO2011043288A1 (en) * 2009-10-08 2011-04-14 三菱重工業株式会社 Chain curing resin composition and fiber-reinforced composite material
WO2013161524A1 (en) * 2012-04-23 2013-10-31 株式会社ダイセル Photosensitive composition for volume hologram recording, volume hologram recording medium using same, method for manufacturing volume hologram recording medium, and hologram recording method
WO2015199093A1 (en) * 2014-06-27 2015-12-30 株式会社ダイセル Monomer composition and curable composition containing same
US10392473B2 (en) 2014-06-27 2019-08-27 Daicel Corporation Monomer composition and curable composition containing same
WO2020218065A1 (en) * 2019-04-23 2020-10-29 デンカ株式会社 Composition

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06507738A (en) * 1991-05-01 1994-09-01 アライド−シグナル・インコーポレーテッド Stereolithography using vinyl ether-epoxide polymers
JPH09106242A (en) * 1995-10-12 1997-04-22 Toppan Printing Co Ltd Hologram recording photosensitive composition, hologram recording medium and production of hologram by using the medium
JP2000112322A (en) * 1998-10-07 2000-04-21 Toppan Printing Co Ltd Transparent hologram recording material
JP2004091698A (en) * 2002-09-02 2004-03-25 Konica Minolta Holdings Inc Actinic-radiation-curing composition, actinic-radiation-curing ink, and image formation method and inkjet recorder using the same
JP2005274587A (en) * 2002-08-14 2005-10-06 Konica Minolta Holdings Inc Optical image recording material, and recording method thereof and manufacturing method thereof
JP2006045421A (en) * 2004-08-06 2006-02-16 Namics Corp Liquid, encapsulating resin composition
JP2007284613A (en) * 2006-04-19 2007-11-01 Daicel Chem Ind Ltd Active energy beam-curable coating agent and its use

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06507738A (en) * 1991-05-01 1994-09-01 アライド−シグナル・インコーポレーテッド Stereolithography using vinyl ether-epoxide polymers
JPH09106242A (en) * 1995-10-12 1997-04-22 Toppan Printing Co Ltd Hologram recording photosensitive composition, hologram recording medium and production of hologram by using the medium
JP2000112322A (en) * 1998-10-07 2000-04-21 Toppan Printing Co Ltd Transparent hologram recording material
JP2005274587A (en) * 2002-08-14 2005-10-06 Konica Minolta Holdings Inc Optical image recording material, and recording method thereof and manufacturing method thereof
JP2004091698A (en) * 2002-09-02 2004-03-25 Konica Minolta Holdings Inc Actinic-radiation-curing composition, actinic-radiation-curing ink, and image formation method and inkjet recorder using the same
JP2006045421A (en) * 2004-08-06 2006-02-16 Namics Corp Liquid, encapsulating resin composition
JP2007284613A (en) * 2006-04-19 2007-11-01 Daicel Chem Ind Ltd Active energy beam-curable coating agent and its use

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010001538A1 (en) * 2008-06-30 2010-01-07 株式会社日立製作所 Fine structure and stamper for imprinting
WO2010116929A1 (en) * 2009-04-06 2010-10-14 ダイセル化学工業株式会社 Cation-polymerizable resin composition and cured product thereof
JP2010241959A (en) * 2009-04-06 2010-10-28 Daicel Chem Ind Ltd Cationically polymerizable resin composition and cured product thereof
WO2011043288A1 (en) * 2009-10-08 2011-04-14 三菱重工業株式会社 Chain curing resin composition and fiber-reinforced composite material
CN102639589A (en) * 2009-10-08 2012-08-15 三菱重工业株式会社 Chain curing resin composition and fiber-reinforced composite material
US9416219B2 (en) 2009-10-08 2016-08-16 Mitsubishi Heavy Industries, Ltd. Chain curing resin composition and fiber-reinforced composite material
JP2013242338A (en) * 2012-04-23 2013-12-05 Daicel Corp Photosensitive composition for volume hologram recording, volume hologram recording medium using the same, manufacturing method thereof, and hologram recording method
WO2013161524A1 (en) * 2012-04-23 2013-10-31 株式会社ダイセル Photosensitive composition for volume hologram recording, volume hologram recording medium using same, method for manufacturing volume hologram recording medium, and hologram recording method
WO2015199093A1 (en) * 2014-06-27 2015-12-30 株式会社ダイセル Monomer composition and curable composition containing same
US10392473B2 (en) 2014-06-27 2019-08-27 Daicel Corporation Monomer composition and curable composition containing same
US10472466B2 (en) 2014-06-27 2019-11-12 Daicel Corporation Monomer composition and curable composition containing same
US10882953B2 (en) 2014-06-27 2021-01-05 Daicel Corporation Monomer composition and curable composition containing same
WO2020218065A1 (en) * 2019-04-23 2020-10-29 デンカ株式会社 Composition
JP7440498B2 (en) 2019-04-23 2024-02-28 デンカ株式会社 Composition

Also Published As

Publication number Publication date
TW200844124A (en) 2008-11-16

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