WO2008104796A3 - Data centers - Google Patents

Data centers Download PDF

Info

Publication number
WO2008104796A3
WO2008104796A3 PCT/GB2008/000718 GB2008000718W WO2008104796A3 WO 2008104796 A3 WO2008104796 A3 WO 2008104796A3 GB 2008000718 W GB2008000718 W GB 2008000718W WO 2008104796 A3 WO2008104796 A3 WO 2008104796A3
Authority
WO
WIPO (PCT)
Prior art keywords
data centers
cooling
conduit
heat conducting
end portion
Prior art date
Application number
PCT/GB2008/000718
Other languages
French (fr)
Other versions
WO2008104796A2 (en
Inventor
Jason Stevens
Original Assignee
Carter Stephen
Jason Stevens
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from GBGB0703995.1A external-priority patent/GB0703995D0/en
Application filed by Carter Stephen, Jason Stevens filed Critical Carter Stephen
Publication of WO2008104796A2 publication Critical patent/WO2008104796A2/en
Publication of WO2008104796A3 publication Critical patent/WO2008104796A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The invention is concerned with new approaches to cooling processing equipment in data centers. A cooling system is described herein that is suitable for cooling processing equipment in data centers. The cooling system includes a vertical conduit (6) carrying a cooling liquid and an array of elongate heat conducting elements (4), such as heat pipes, extending laterally outwardly from the conduit (6). An inner end portion (42) of each heat conducting element (4) is in thermal contact with cooling liquid flowing in the conduit (6) and an outer end portion (41) of each heat conducting element (4) is adapted for conductive thermal contact with at least one heat producing electronic component.
PCT/GB2008/000718 2007-03-01 2008-03-03 Data centers WO2008104796A2 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
GB0703995.1 2007-03-01
GBGB0703995.1A GB0703995D0 (en) 2007-03-01 2007-03-01 Data centers
US11/734,835 2007-04-13
US11/734,835 US20080209931A1 (en) 2007-03-01 2007-04-13 Data centers

Publications (2)

Publication Number Publication Date
WO2008104796A2 WO2008104796A2 (en) 2008-09-04
WO2008104796A3 true WO2008104796A3 (en) 2008-11-06

Family

ID=39315881

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/GB2008/000718 WO2008104796A2 (en) 2007-03-01 2008-03-03 Data centers

Country Status (2)

Country Link
GB (1) GB2447337A (en)
WO (1) WO2008104796A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2003272C2 (en) * 2009-07-23 2011-01-25 Volkerwessels Intellectuele Eigendom B V COOLING DEVICE AND METHOD FOR COOLING EQUIPMENT INSTALLED.

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0390053A1 (en) * 1989-03-29 1990-10-03 Hughes Aircraft Company Heat conducting interface for electric module
US20030128516A1 (en) * 2002-01-04 2003-07-10 Faneuf Barrett M. Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
WO2004082088A1 (en) * 2003-03-11 2004-09-23 Rittal Gmbh & Co. Kg Coolant guiding element and coolant guiding device
US20050047083A1 (en) * 2002-09-24 2005-03-03 Yoshihiro Kondo Electronic equipment
US20070002536A1 (en) * 2005-06-30 2007-01-04 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4366526A (en) * 1980-10-03 1982-12-28 Grumman Aerospace Corporation Heat-pipe cooled electronic circuit card
US5343358A (en) * 1993-04-26 1994-08-30 Ncr Corporation Apparatus for cooling electronic devices
US6052285A (en) * 1998-10-14 2000-04-18 Sun Microsystems, Inc. Electronic card with blind mate heat pipes
WO2002102124A2 (en) * 2001-06-12 2002-12-19 Liebert Corporation Single or dual buss thermal transfer system
TWI285081B (en) * 2005-08-10 2007-08-01 Cooler Master Co Ltd Heat-dissipation structure and method thereof
US20070297136A1 (en) * 2006-06-23 2007-12-27 Sun Micosystems, Inc. Modular liquid cooling of electronic components while preserving data center integrity

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0390053A1 (en) * 1989-03-29 1990-10-03 Hughes Aircraft Company Heat conducting interface for electric module
US20030128516A1 (en) * 2002-01-04 2003-07-10 Faneuf Barrett M. Frame-level thermal interface component for transfer of heat from an electronic component of a computer system
US20050047083A1 (en) * 2002-09-24 2005-03-03 Yoshihiro Kondo Electronic equipment
WO2004082088A1 (en) * 2003-03-11 2004-09-23 Rittal Gmbh & Co. Kg Coolant guiding element and coolant guiding device
US20070002536A1 (en) * 2005-06-30 2007-01-04 International Business Machines Corporation Method and apparatus for cooling an equipment enclosure through closed-loop, liquid-assisted air cooling in combination with direct liquid cooling

Also Published As

Publication number Publication date
GB0803956D0 (en) 2008-04-09
GB2447337A (en) 2008-09-10
WO2008104796A2 (en) 2008-09-04

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