WO2008096441A1 - Thermosetting resin composition containing a compound having a carbon-carbon triple bond, process for low-temperature curing of the same, and cured articles - Google Patents

Thermosetting resin composition containing a compound having a carbon-carbon triple bond, process for low-temperature curing of the same, and cured articles Download PDF

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Publication number
WO2008096441A1
WO2008096441A1 PCT/JP2007/052281 JP2007052281W WO2008096441A1 WO 2008096441 A1 WO2008096441 A1 WO 2008096441A1 JP 2007052281 W JP2007052281 W JP 2007052281W WO 2008096441 A1 WO2008096441 A1 WO 2008096441A1
Authority
WO
WIPO (PCT)
Prior art keywords
carbon
resin composition
compound
composition containing
thermosetting resin
Prior art date
Application number
PCT/JP2007/052281
Other languages
French (fr)
Japanese (ja)
Inventor
Satoru Nanba
Original Assignee
Manac Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Manac Inc. filed Critical Manac Inc.
Priority to PCT/JP2007/052281 priority Critical patent/WO2008096441A1/en
Priority to JP2008556961A priority patent/JPWO2008096441A1/en
Publication of WO2008096441A1 publication Critical patent/WO2008096441A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F38/00—Homopolymers and copolymers of compounds having one or more carbon-to-carbon triple bonds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1089—Polyisoimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

The invention aims at lowering the curing temperature of a resin composition containing a compound having a phenylethynyl group and thereby providing cured articles excellent in mechanical characteristics such as heat resistance, modulus of elasticity and tensile strength. The invention relates to a thermosetting resin composition containing both a compound having at least one carbon-carbon triple bond and an onium salt and a process of curing a thermosetting resin composition containing a compound having at least one carbon-carbon triple bond to form a cured article, characterized in that the curing of the thermosetting resin composition is conducted in the presence of an onium salt. According to the process, the curing temperature of the composition can be lowered, so that the deterioration of the resin itself can be remarkably diminished.
PCT/JP2007/052281 2007-02-08 2007-02-08 Thermosetting resin composition containing a compound having a carbon-carbon triple bond, process for low-temperature curing of the same, and cured articles WO2008096441A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/JP2007/052281 WO2008096441A1 (en) 2007-02-08 2007-02-08 Thermosetting resin composition containing a compound having a carbon-carbon triple bond, process for low-temperature curing of the same, and cured articles
JP2008556961A JPWO2008096441A1 (en) 2007-02-08 2007-02-08 Thermosetting resin composition containing compound having carbon-carbon triple bond, low temperature curing method and product thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2007/052281 WO2008096441A1 (en) 2007-02-08 2007-02-08 Thermosetting resin composition containing a compound having a carbon-carbon triple bond, process for low-temperature curing of the same, and cured articles

Publications (1)

Publication Number Publication Date
WO2008096441A1 true WO2008096441A1 (en) 2008-08-14

Family

ID=39681360

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/052281 WO2008096441A1 (en) 2007-02-08 2007-02-08 Thermosetting resin composition containing a compound having a carbon-carbon triple bond, process for low-temperature curing of the same, and cured articles

Country Status (2)

Country Link
JP (1) JPWO2008096441A1 (en)
WO (1) WO2008096441A1 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102153980A (en) * 2011-01-13 2011-08-17 新疆中石油管业工程有限公司 Daub used for making glass steel pipeline threads and preparation method thereof
WO2012128165A1 (en) * 2011-03-18 2012-09-27 株式会社カネカ Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4'-diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance
JP2014509674A (en) * 2011-04-01 2014-04-21 ネクサム ケミカル エイビー Improved oligoimides and polyimides
CN110498760A (en) * 2019-08-28 2019-11-26 东华大学 A kind of aromatic thermosetting liquid crystal fiber and preparation method thereof
WO2020071483A1 (en) * 2018-10-03 2020-04-09 株式会社カネカ Uncured laminate, reinforcing fiber composite material, method for producing uncured laminate, and method for producing reinforcing fiber composite material
CN112694749A (en) * 2020-12-28 2021-04-23 长春长光宇航复合材料有限公司 non-PMR type polyimide carbon fiber prepreg, composite material and preparation method thereof
CN112708133A (en) * 2020-12-28 2021-04-27 长春长光宇航复合材料有限公司 Low-viscosity thermosetting polyimide resin and preparation method and application thereof
CN114262315A (en) * 2021-12-22 2022-04-01 山东非金属材料研究所 Soluble norbornene-terminated imide oligomer and preparation method thereof

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123203A (en) * 1981-01-26 1982-07-31 Showa Denko Kk Production of high polymer of diphenylacetylene compound
JPH0748419A (en) * 1993-06-04 1995-02-21 Sagami Chem Res Center Polymerization catalyst for acetylenes
JP2000505119A (en) * 1995-08-04 2000-04-25 ナショナル エアロノーティクス アンド スペース アドミンストレーション Imide oligomers and cooligomers containing protruding phenylethynyl groups and polymers derived therefrom
JP2000219741A (en) * 1998-11-25 2000-08-08 Ube Ind Ltd Terminally modified imide oligomer and its cured item
JP2005272483A (en) * 2004-03-22 2005-10-06 Sumitomo Bakelite Co Ltd Curable compound, cured product thereof and electronic part device
JP2006267289A (en) * 2005-03-22 2006-10-05 Fuji Photo Film Co Ltd Polymerizable composition and planographic printing original plate

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AUPO549397A0 (en) * 1997-03-07 1997-03-27 Commonwealth Scientific And Industrial Research Organisation Reduced temperature curing of acetylenic polymers

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57123203A (en) * 1981-01-26 1982-07-31 Showa Denko Kk Production of high polymer of diphenylacetylene compound
JPH0748419A (en) * 1993-06-04 1995-02-21 Sagami Chem Res Center Polymerization catalyst for acetylenes
JP2000505119A (en) * 1995-08-04 2000-04-25 ナショナル エアロノーティクス アンド スペース アドミンストレーション Imide oligomers and cooligomers containing protruding phenylethynyl groups and polymers derived therefrom
JP2000219741A (en) * 1998-11-25 2000-08-08 Ube Ind Ltd Terminally modified imide oligomer and its cured item
JP2005272483A (en) * 2004-03-22 2005-10-06 Sumitomo Bakelite Co Ltd Curable compound, cured product thereof and electronic part device
JP2006267289A (en) * 2005-03-22 2006-10-05 Fuji Photo Film Co Ltd Polymerizable composition and planographic printing original plate

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102153980A (en) * 2011-01-13 2011-08-17 新疆中石油管业工程有限公司 Daub used for making glass steel pipeline threads and preparation method thereof
CN102153980B (en) * 2011-01-13 2014-03-19 新疆中石油管业工程有限公司 Daub used for making glass steel pipeline threads and preparation method thereof
WO2012128165A1 (en) * 2011-03-18 2012-09-27 株式会社カネカ Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4'-diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance
JP2012197237A (en) * 2011-03-18 2012-10-18 Kaneka Corp Terminal-modifed imide oligomer for resin transfer molding using 2-phenyl-4,4'-diaminodiphenyl ethers and being excellent in moldability, mixture thereof, vanish containing these, and cured resin thereof and fiber-reinforced cured resin thereof being fabricated by resin transfer molding and being excellent in heat resistance
CN103547568A (en) * 2011-03-18 2014-01-29 株式会社钟化 Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4'-diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by re
US9051430B2 (en) 2011-03-18 2015-06-09 Kaneka Corporation Resin-transfer-moldable terminal-modified imide oligomer using 2-phenyl-4,4′diaminodiphenyl ether and having excellent moldability, mixture thereof, varnish containing same, and cured resin thereof and fiber-reinforced cured resin thereof made by resin transfer molding and having excellent heat resistance
JP2014509674A (en) * 2011-04-01 2014-04-21 ネクサム ケミカル エイビー Improved oligoimides and polyimides
WO2020071483A1 (en) * 2018-10-03 2020-04-09 株式会社カネカ Uncured laminate, reinforcing fiber composite material, method for producing uncured laminate, and method for producing reinforcing fiber composite material
JPWO2020071483A1 (en) * 2018-10-03 2021-09-24 株式会社カネカ Unhardened laminates, reinforced fiber composites, and how to make them
JP7374915B2 (en) 2018-10-03 2023-11-07 株式会社カネカ Uncured laminates, reinforced fiber composite materials, and methods of manufacturing them
CN110498760A (en) * 2019-08-28 2019-11-26 东华大学 A kind of aromatic thermosetting liquid crystal fiber and preparation method thereof
CN115490629A (en) * 2019-08-28 2022-12-20 东华大学 Aromatic thermosetting liquid crystal fiber and preparation method thereof
CN110498760B (en) * 2019-08-28 2023-06-23 东华大学 Aromatic thermosetting liquid crystal fiber and preparation method thereof
CN112694749A (en) * 2020-12-28 2021-04-23 长春长光宇航复合材料有限公司 non-PMR type polyimide carbon fiber prepreg, composite material and preparation method thereof
CN112708133A (en) * 2020-12-28 2021-04-27 长春长光宇航复合材料有限公司 Low-viscosity thermosetting polyimide resin and preparation method and application thereof
CN114262315A (en) * 2021-12-22 2022-04-01 山东非金属材料研究所 Soluble norbornene-terminated imide oligomer and preparation method thereof

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