WO2008075495A1

WO2008075495A1 - Photosensitive resin composition for forming insulating film, hardened film thereof and electronic part having the same

Info

Publication number: WO2008075495A1
Application number: PCT/JP2007/069615
Authority: WO
Inventors: Hirofumi Goto; Atsushi Ito; Hirofumi Sasaki; Ryuichi Okuda
Original assignee: Jsr Corporation
Priority date: 2006-12-21
Filing date: 2007-10-05
Publication date: 2008-06-26
Also published as: JP5093116B2; JPWO2008075495A1

Abstract

It is intended to provide a photosensitive resin composition for forming an insulating film which makes it possible to form a surface protective film, an interlayer insulating film or a flatten film being highly sensitive to g-ray and h-ray and having various excellent properties such as resolution, electrical insulating properties and heat impact strength, a hardened film thereof and an electronic part having the hardened film. This photosensitive resin composition for forming an insulating film comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound represented by the following general formula (1), a crosslinking agent and an adhesion aid: (1) wherein R's independently represent each a hydrogen atom, a C1-6 alkyl group, -R1OH, -R2OR3 or -R4OR5OR6; n is 1 or 2; and X's independently represent each a halogen atom.

Description

Specification

Photosensitive resin composition for forming insulating film, cured film thereof, and electron roller provided with the same

Technical field

[0001] The present invention relates to a photosensitive resin composition for forming an insulating film used for a surface protective film (passivation film, overcoat film), an interlayer insulating film, a flattening film, etc., such as a semiconductor element, and a cured product thereof. The present invention relates to an insulating cured film and an electronic component including the same. More specifically, a cured film having excellent properties such as electrical insulation and thermal shock as a permanent film, and a photosensitive resin composition for forming an insulating film in which such a cured film can be obtained with high resolution and a high residual film ratio. The present invention also relates to an electronic component provided with a cured product.

Background art

Conventionally, photosensitive polyimide resin compositions having excellent heat resistance, mechanical properties, and the like have been widely used for surface protective films, interlayer insulating films, and the like used in semiconductor devices of electronic devices. For example, Patent Document 1 and Patent Document 2 each include a composition containing a photosensitive polyimide resin in which a photocrosslinking group is introduced into a polyimide precursor by ionic bonding, and photocrosslinking by an ester bond to a polyimide precursor. A composition containing a photosensitive polyimide resin having a group introduced therein is described.

However, these compositions require a high-temperature ring-closing step for imidization, and have a disadvantage that resolution is not sufficient due to solvent development.

Patent Document 3 describes a negative-type photosensitive composition in which a polyfunctional acrylic compound is added to an aromatic polyimide precursor! However, the same problems as described above are pointed out. .

On the other hand, Patent Document 4 discloses a photosensitive insulating resin composition that does not require a high-temperature curing step, has excellent resolution, electrical insulation, and thermal shock resistance, and has good heat resistance and chemical resistance. However, the acid generators that are exemplified are the type that mainly absorbs i-line, and absorbs little to g-line or h-line! /, So when using g-line stepper or h-line stepper The degree was insufficient. [0003] Patent Document 1: Japanese Patent Laid-Open No. 54-145794

Patent Document 2: Japanese Patent Laid-Open No. 03-186847

Patent Document 3: Japanese Patent Laid-Open No. 08-50354

Patent Document 4: Japanese Patent Laid-Open No. 2003-215802

Disclosure of the invention

Problems to be solved by the invention

[0004] An object of the present invention is to solve the problems associated with the prior art as described above, have good sensitivity to g-line and h-line, and have various resolution, electrical insulation, thermal shock properties, and the like. An object of the present invention is to provide a photosensitive resin composition for forming an insulating film capable of forming a surface protective film, an interlayer insulating film, and a planarizing film having excellent characteristics. Furthermore, the present invention makes it easy to provide a cured film (insulating film) obtained by curing such a photosensitive resin composition for forming an insulating film, and an electronic component including the cured film.

Means for solving the problem

[0005] As a result of intensive studies to solve the above problems, the present inventors have found a photosensitive resin composition for forming an insulating film having excellent characteristics.

Means for achieving the above object are as follows.

[1] (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound represented by the following general formula (1), (C) a crosslinking agent, (E) an adhesion assistant, (F) And a solvent. A photosensitive resin composition for forming an insulating film, comprising: a solvent;

[Chemical 1]

(1)

[In the formula (1), each R independently represents a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, Ι ^ ΟΗ, —R ² OR ³ or —R ⁴ OR ⁵ OR ⁶ , and n is 1 or 2 Each X independently represents a halogen atom. R ¹ is a methylene group or an alkylene group having 2 to 6 carbon atoms, R ² is a methylene group or an alkylene group having 2 to 4 carbon atoms, R ³ is an alkyl group having 1 to 6 carbon atoms, R ⁴ is a methylene group or An alkylene group having 2 to 4 carbon atoms, R ⁵ represents a methylene group or an alkylene group having 2 to ⁶ carbon atoms, and R ⁶ represents an alkyl group having 1 to ⁶ carbon atoms. ]

[2] The photosensitive resin composition for forming an insulating film according to the above [1], which contains a compound having two or more alkyl etherified amino groups in the molecule (C).

[3] The photosensitive resin composition for forming an insulating film according to the above [1] or [2], wherein the (C) crosslinking agent comprises an oxsilane ring-containing compound.

[4] The photosensitive resin composition for forming an insulating film according to any one of [1] to [3] above, further comprising (D) crosslinked polymer particles.

[5] A cured film obtained by curing the photosensitive resin composition for forming an insulating film according to any one of [1] to [4] above.

[6] An electronic component comprising the cured film as described in [5] above.

[7] The electronic component according to [6], wherein the cured film is an interlayer insulating film or a planarizing film. The invention's effect

[0006] The photosensitive resin composition for forming an insulating film of the present invention uses a specific compound represented by the above formula (1) as a radiation-sensitive acid generator, so that g spring (436 nm), h It has a wide absorption in the spring (405 nm) and i-line (365 nm) regions, and can increase the acid generation efficiency as compared with general radiation-sensitive acid generators having other triazine skeletons. Therefore, a cured film having a high residual film ratio and excellent properties such as resolution, electrical insulation, thermal shock resistance, and chemical resistance can be obtained. Therefore, it can be suitably used as a surface protective film (passivation film, overcoat film), interlayer insulating film, planarizing film, etc. for electronic components such as semiconductor elements.

Brief Description of Drawings

FIG. 1 is a schematic diagram for explaining a cross section of a semiconductor element.

FIG. 2 is a schematic diagram illustrating a cross section of a semiconductor element.

FIG. 3 is a schematic diagram for explaining a cross section of a base material for thermal shock evaluation. FIG. 4 is a schematic diagram illustrating a base material for thermal shock evaluation.

FIG. 5 is a schematic diagram for explaining a base material for electrical insulation evaluation.

Explanation of symbols

[0008] 1; substrate, 2; metal pad, 3; cured insulating film, 4; metal wiring, 5; cured insulating film, 6; substrate, 7; copper foil, 8: base material for thermal shock evaluation, 9 ; Board | substrate, 10; copper foil, 11; the base material for insulation evaluation. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described in detail. In the present specification, “(meth) acryl” means one or both of “acryl” and “methacryl”. In addition, “(meta) atelate” indicates either or both of “atalylate” and “metatalate”.

[1] A photosensitive resin composition for forming an insulating film

The photosensitive resin composition for forming an insulating film of the present invention comprises (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a specific compound represented by the formula (1), and (C) a crosslinking agent. And.

[1-1] (A) Alkali-soluble resin having phenolic hydroxyl group

Examples of the “alkali-soluble resin having a phenolic hydroxyl group” in the present invention (hereinafter referred to as “phenol resin (A)”) include, for example, nopolac resin, polyhydroxystyrene, polyhydroxystyrene copolymer, hydroxy Copolymers of styrene and styrene, copolymers of hydroxy styrene, styrene and (meth) acrylic acid derivatives, phenol-xylylene glycol condensation resins, crezo-loxylylene glycol condensation resins, phenol-dicyclopentagen condensation resins, etc. are used. . Among these, nopolac resin, poly (ethylene) copolymer, copolymer of hydroxystyrene, styrene and (meth) acrylic acid derivative, and phenol-xylylene glycol condensation resin are preferable. These phenol resins (A) may be used alone or in combination of two or more.

[0012] The nopolac resin can be obtained by, for example, the force S obtained by condensing phenols and aldehydes in the presence of a catalyst.

Examples of the phenols include phenol, o-cresol, m-cresol, p Creso Monore, ο echino lehuenore, m— echeno lehuenore, p echino lehuenore, o buchinolehuenore, m buchinolehuenore, p buchinolehuenore, 2, 3 Xylenol, 2, 4 xylenol, 2, 5 xylenol, 2, 6 xylenol, 3, 4 xylenore, 3, 5 xylenore, 2, 3, 5 卜 limethino leenoure, 3, 4, 5 , Power teconore, resorcinol, pyrogalonore, α-naphthol, β-naphthol and the like.

Examples of the aldehydes include formaldehyde, paraformaldehyde, acetate aldehyde, and benzaldehyde.

Specific nopolac resins include, for example, phenol / formaldehyde condensed novolac resins, talesol / formaldehyde condensed nopolac resins, phenol-naphthol.

In the present invention, the polystyrene-reduced weight average molecular weight of the phenolic resin (Α) is 2000 or more from the viewpoint of the resolution, thermal shock resistance, heat resistance, residual film ratio, etc. of the obtained insulating film. Preferred <is about 2000-20000.

In addition, the content ratio of the phenol resin (Α) in the photosensitive resin composition for forming an insulating film of the present invention is 30 to 90% by weight when the entire composition excluding the solvent is 100% by weight. More preferably, it is 40 to 80% by weight. When the content of this phenolic resin (Α) is 30 to 90% by weight, the film formed using the photosensitive resin composition for forming an insulating film has sufficient developability with an alkaline aqueous solution! / Looks good for

[1-2] (Β) —Compound represented by general formula (1)

In the present invention, the “compound” represented by the following general formula (1) (hereinafter also referred to as “acid generator (Β)”) is a compound that generates an acid upon irradiation with radiation or the like. Due to the catalytic action, it can react with a functional group in the crosslinking agent (C) described later to form a negative pattern.

Further, the acid generator (Β) has an s-triazine skeleton as represented by the following general formula (1). This acid generator (Β) with s-triazine skeleton has broad absorption and absorption in the g-line, h-line, and i-line regions, and is a general radiation-sensitive acid generator with other triazine skeletons. Compared to the above, it is possible to obtain an insulating cured film having high acid generation efficiency and a high residual film ratio.

[0016] [Chemical 2]

(1)

[In the formula (1), each R independently represents a hydrogen atom, an alkyl group having 16 carbon atoms, Ι ^ ΟΗ — R ² OR ³ or — R ⁴ OR ⁵ OR ⁶ , n is 1 or 2, Independently, X represents a halogen atom. R ¹ is a methylene group or an alkylene group having 26 carbon atoms, R ² is a methylene group or an alkylene group having 24 carbon atoms, R ³ is an alkyl group having 16 carbon atoms, R ⁴ is a methylene group or 2 carbon atoms 4 alkylene group, R ⁵ represents a methylene group or an alkylene group having 26 carbon atoms, and R ⁶ represents an alkyl group having 16 carbon atoms. ]

In the above general formula (1), the R force When the alkyl group has 16 carbon atoms, specifically, a methyl group [CH], an ethyl group [CH CH] n propyl group [CH CH CH]

3 2 3 2 2 3 Isopropyl [CH (CH)] n Butyl [CH CH CH CH] isobutyl

3 2 2 2 2 3

Group [CH CH (CH)] sec Butyl [CH (CH) CH CH] tert Butyl [

2 3 2 3 2 3

C (CH 2)], pentyl group, isopentyl group, neopentyl group, hexyl group, etc.

3 3

The power S

When R is Ι ^ ΟΗ, R ¹ is a methylene group or an alkylene group having 26 carbon atoms. One specific R ^ OH is CH OH CH CH OH CH CH

2 2 2 2 2

CH OH -CH CH CH CH CH OH and the like can be exemplified.

2 2 2 2 2

Further, when R is R ² OR ³ , R ² is a methylene group or an alkylene group having 24 carbon atoms, and R ³ is an alkyl group having 16 carbon atoms. Specific — R ² OR ³ includes —CH 2 OCH 2 —CH 2 CH 2 O 2 CH 3 CH 2 CH ² O ³ CH 2 O 2 CH 2

CH CH OCH CH -CH CH CH OCH CH CH CH CH CH OCH C

2 2 2 2 2 H etc. can be illustrated.

Three

When R is R ⁴ OR ⁵ OR ⁶ , R ⁴ is a methylene group or an alkylene group having 24 carbon atoms, R ⁵ is a methylene group or an alkylene group having 26 carbon atoms, R ⁶ is an alkyl group having ¹⁶ carbon atoms. Specific — R ⁴ OR ⁵ OR ⁶ includes CH OCH OCH

2 2 3 -CH CH OCH OCH CH CH CH OCH OCH CH OCH OCH C

2 2 2 3 2 2 2 2 3 2 2 2

Examples include H CH CH OCH OCH CH CH CH CH OCH OCH CH

3 2 2 2 2 3 2 2 2 2 2 3

[0018] Further, among the above R, a methyl group, Echiru group, n- propyl radical, n-butyl group, a -R ¹ OH is, CH CH OH CH CH CH OH CH CH CH CH OH virtuous

2 2 2 2 2 2 2 2 2 More preferably a methyl group, an ethyl group, or —CH 2 CH 2 OH.

twenty two

In the above general formula (1), n is 1 or 2.

[0020] In the general formula (1), X representing a halogen atom is preferably a fluorine atom, a chlorine atom, a bromine atom or an iodine atom, more preferably a chlorine atom.

Specific examples of the acid generator (B) having an s-triazine skeleton represented by the general formula (1) include 2- (p methoxystyryl) -1,4 bis (trichloromethyl) 1, 3, 5 Triazine [R; CH n; l X; Cl] 2— (m methoxystyryl) in formula (1)

Three

(Trichloromethyl) 1, 3, 5-triazine [R; CH n; l X; Cl] 2 in formula (1)

Three

-[4- [2- {4, 6 Bis (trichloromethyl) 1, 3, 5 Triazine 1-2 yl} bur] Phenoxy] ethanol [R in formula (1); CH CH OH n; l X; C1] 2— [2— (3,

twenty two

4-Dimethoxyphenyl) ethyl] 4,6-bis (trichloromethyl) -1,3,5-triazine [R; CH n; 2 X; C1] in formula (1) 2- [2- (2, 4 Dimethoxyphene) ete

Three

Nyl] -4,6-bis (trichloromethyl) -1,3,5-triazine [R; CH in formula (1)

3 n; 2 X; Cl] and the like.

The acid generator (B) may be used alone or in combination of two or more.

[0022] The blending amount of the acid generator (B) is selected from the viewpoint of ensuring the remaining film ratio, sensitivity, resolution, pattern shape, etc. of the photosensitive resin composition for forming an insulating film of the present invention. 100 parts by weight 0.;! 10 parts by weight is preferred, more preferably 0.3 5 parts by weight More preferably, it is 0.5 · 3 to 3 parts by weight. When the blending amount of this acid generator (配合) is 0.;! To 10 parts by weight, it has high transparency to radiation and generates an amount of acid sufficient for the progress of the curing reaction upon exposure. Therefore, it is preferable because a good pattern shape can be obtained with a high residual film ratio.

In addition to the acid generator (酸), the photosensitive resin composition for forming an insulating film in the present invention includes other acid generators (hereinafter referred to as “other acid generator (b)”. .) May be included

Yes

Examples of the other acid generator (b) include onium salt compounds, halogen-containing compounds, diazoketone compounds, sulfone compounds, sulfonic acid compounds, sulfonimide compounds, and diazomethane compounds.

[0024] Examples of the above-mentioned onium salt compounds include odonium salts, sulfonium salts, phosphonium salts, diazonium salts, pyridinium salts, and the like. Specifically, for example, diphenenoleo trimethyloroleomethane methane norephonate, diphenenoleo de noorne mutono renenos nore honate, diphenenoleo de noordone hexaph noreo mouth. Antimonate, Diphenenoredonium Hexafnoreo Mouth Phosphate, Diphenenorenodon Tetrafluororeborate, Triphenenoresnorehonium Trifriolomethanes Norephonate, Triphenenoresnorephoni 1-tonolencenorephonate, trifenenolesnorehonome hexaphnore mouth antimonate, 4 tert-butenolevenore, diphenenolesnorehonorium trifnoreolomethane senophonate, 4-t Norefeninor 'Diphnenores Norehonium p Tonorensnorephonate, 1-(4, 7 Dibutoxy 1 And naphthalenyl) tetrahydrothiophenetrifluoromethanesulfonate.

[0025] Examples of the halogen-containing compound include haloalkyl group-containing hydrocarbon compounds, and haloalkyl group-containing heterocyclic compounds. Specifically, for example,

1, 10 Jib mouth m decane, 1, 1-bis (4-crophine phenenole) 1, 2, 2, 2 Triclo mouth ethane, phenyl bis (trichloromethyl) 1, 3, 5-triazine, 4-methoxy Phenyl —bis (trichloromethyl) 1,3,5-triazine, styryl monobis (trichloromethyl) 1,3,5 triazine, naphthinolebis (trichloromethinole) 1,3,5 triazine, 2,4 trichloromethyl ( Piperonyl) 1,3,5-triazine, 2- (1,3-benzodioxol) —5—yl) 4, 6-bis (trichloromethyl) 1, 3, 5-trisazine and other s-triazine derivatives can be cited.

[0026] Examples of the diazoketone compound include 1,3 diketo 2-diazo compound, diazobenzoquinone compound, diazonaphthoquinone compound and the like. Specific examples include 1,2-naphthoquinonediazido 4-sulfonic acid ester compounds of phenols.

[0027] Examples of the sulfone compounds include β-ketosulfone compounds, β sulfonylsulfone compounds, α diazo compounds of these compounds, and the like. Specific examples include 4-trisphenacylsulfone, mesitylphenacylsulfone, bis (phenacylsulfonyl) methane, and the like.

[0028] Examples of the sulfonic acid compound include alkyl sulfonic acid esters, halo aralkyl sulfonic acid esters, aryl sulfonic acid esters, imino sulfonates, and the like. Specifically, for example, benzoin tosylate, pyrogalronoletri twelve trobenzyl ρ-toluenesulfonate and the like can be mentioned.

[0029] Examples of the sulfonimide compound include Ν (trifluoromethylsulfonyloxy) succinimide, Ν- (trifluoromethylsulfonyloxy) phthalimide, Ν- (trifluoromethylsulfonyloxy) diphf. Enylmaleimide, Ν- (trifluoromethylsulfonyloxy) bicyclo [2.2.1] hept-5,2,3 dicarboximide, Ν- (trifluoromethylsulfuroxy) naphthylimide, etc. Can do.

[0030] Examples of the diazomethane compound include bis (trifnoleolomethylsulfonyl) diazomethane, bis (cyclohexenolesnorephoninore) diazomethane, bis (phenenoresnorephoninore) diazomethane, and the like. it can.

[0031] These other acid generators (b) may be contained alone or in combination of two or more.

The amount of the other acid generator (b) is 5 parts by weight or less, preferably 3 parts by weight or less, more preferably 1 part by weight or less with respect to 100 parts by weight of the phenol resin (A). .

[0032] [1 3] (C) Crosslinking agent In the present invention, the “crosslinking agent” (hereinafter also referred to as “crosslinking agent (c)”) is the phenol resin (

If it acts as a crosslinking component (curing component) that reacts with A), it is not particularly limited. Examples of the crosslinking agent (C) include compounds having at least two alkyl etherated amino groups in the molecule, oxsilane ring-containing compounds, thiirane ring-containing compounds, oxetanyl group-containing compounds, and isocyanate groups. It is possible to list compounds (including blocked ones).

[0033] Examples of the compound having at least two or more alkyl etherified amino groups in the molecule include (poly) methylolated melamine, (poly) methylolated glycolurinole, (poly) methylol. All or part (at least two) of the active methylol groups (CH OH groups) in nitrogen compounds such as benzoguanamine chloride and (poly) methylol urea are alkyl ether

2

Mention may be made of monotelinated compounds. Here, examples of the alkyl group constituting the alkyl ether include a methyl group, an ethyl group, and a butyl group, and they may be the same as or different from each other. Further, a methylol group that is not alkyl etherified may be condensed between two molecules, which may be self-condensed within one molecule, and as a result, an oligomer component may be formed. Specifically, hexamethoxymethyl melamine, hexabutoxymethyl melamine, tetramethoxymethyldalicoluril, tetrabutoxymethylglycoluril and the like can be used.

[0034] The oxysilane ring-containing compound is not particularly limited as long as it contains an oxysilane ring in the molecule. For example, phenol nopolac epoxy resin, cresol nopolac epoxy resin, bisphenol epoxy resin , Trisphenol type epoxy resin, tetraphenol type epoxy resin, phenol-xylylene type epoxy resin, naphthol xylylene type epoxy resin, phenol-naphthol type epoxy resin, phenol-dicyclopentagen type epoxy resin, alicyclic type An epoxy resin, an aliphatic epoxy resin, etc. are mentioned.

These crosslinking agents (C) may be used alone or in a combination of two or more.

[0035] Of these crosslinking agents (C), compounds having at least two alkyl etherated amino groups in the molecule and oxsilane ring-containing compounds are preferred. Furthermore More preferably, a compound having at least two alkyl etherified amino groups in the molecule and an oxysilane ring-containing compound are used in combination.

[0036] The blending amount of the crosslinking agent (C) in the present invention is preferably 1 to 100 parts by weight, more preferably 5 to 50 parts by weight with respect to 100 parts by weight of the phenol resin (A). Part. When the amount of the crosslinking agent (C) is 1 to 100 parts by weight, the curing reaction proceeds sufficiently, and the resulting cured film has a high resolution, good pattern shape, heat resistance, It is preferable because of its excellent insulation.

In addition, when the alkyl etherified amino group-containing compound and the oxsilane ring-containing compound are used in combination, the content ratio of the oxsilane ring-containing compound is the same as that of the compound having the alkyl etherified amino group and the oxsilane ring-containing compound. When the total is 100% by weight, it is preferably 50% by weight or less, more preferably 5 to 40% by weight. In this case, the obtained cured film is preferable because it is excellent in chemical resistance without impairing high resolution.

[0037] [14] (D) Crosslinked polymer particles

In the photosensitive resin composition for forming an insulating film of the present invention, in order to improve the durability or thermal shock resistance of the cured film obtained, it is also referred to as a crosslinked polymer particle (hereinafter referred to as “crosslinked polymer particle (D)”). )) Can be further contained.

The crosslinked polymer particle (D) is not particularly limited as long as the glass transition temperature (Tg) of the polymer constituting the crosslinked polymer particle is 0 ° C. or lower! /, But has an unsaturated polymerizable group. Two or more crosslinkable monomers (hereinafter simply referred to as “crosslinkable monomers”) and one or more “others” selected so that the Tg of the crosslinked polymer particles (D) is 0 ° C. or less. And a monomer obtained by copolymerization with a monomer. In particular, two or more of the above-mentioned other monomers are used in combination, and at least one of the other monomers has a functional group other than a polymerizable group such as a canolepoxinole group, an epoxy group, an amino group, an isocyanate group, or a hydroxyl group. It is preferable to have it.

[0038] By the way, the conventional radiation-sensitive insulating resin composition may contain a liquid rubber for the purpose of improving adhesion (see Japanese Patent Application Laid-Open No. 2004-191816). There was a tendency for the resolution to decrease. Such liquid rubber flows at room temperature. For example, acrylic rubber (ACM), attalononitrile tributadiene butadiene rubber (NBR), alitrononitrile triacrylate butadiene rubber (NBA) and the like are often known. The photosensitive resin composition for forming an insulating film of the present invention is characterized in that it basically does not contain the liquid rubber.

Here, since the crosslinked polymer particle (D) contained in the photosensitive resin composition for forming an insulating film of the present invention is a particulate crosslinked copolymer, it is in a dispersed state in the composition. On the other hand, the liquid rubber is different from the crosslinked polymer particle (D) in that it is in a state compatible with a solvent or a resin in a solution. Therefore, by containing the crosslinked polymer particles (D), the photosensitive resin composition for forming an insulating film is superior in resolution as compared with the case of containing liquid rubber and the glass transition temperature of the cured film is extremely low. Can be obtained. Further, the cured film obtained by using the bridge polymer particles (D) is excellent in thermal shock resistance. As described above, the liquid rubber is in a state compatible with other components in the composition. Therefore, in order to ensure compatibility with other components, there are limitations on the molecular weight and the content in the composition. On the other hand, since the crosslinked polymer particles (D) are in a dispersed state in the composition, the content of the cured film obtained is sufficient to obtain effects such as crack resistance, elongation and insulation. This force S is possible. From the above points, the photosensitive resin composition for forming an insulating film of the present invention is excellent in resolution, crack resistance, elongation, and insulation.

[0039] Examples of the crosslinkable monomer include dibutylbenzene, diallyl phthalate, ethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate. And compounds having a plurality of polymerizable unsaturated groups, such as pentaerythritol tri (meth) acrylate, polyethylene glycol di (meth) acrylate and polypropylene glycol di (meth) acrylate. Of these, dibulenebenzene is preferred!

[0040] The crosslinkable monomer used in producing the crosslinked polymer particles (D) is preferably 1 to 20% by weight with respect to 100% by weight of the total monomers used for copolymerization. More preferably 2 to 10% by weight.

[0041] Examples of the other monomers include butadiene, isoprene, dimethylbutadiene, black-opened polyne, 1,3-pentagen and other gen compounds, (meth) acrylonitrile, a Black port acrylonitrile, alpha-chloromethyl acrylonitrile, alpha-methoxy Atari b Nitrile Le, _alpha - ethoxy acrylonitrile, crotonic acid nitrile, Kei cinnamic acid nitrile, Itakon acid Gini tolyl, dinitrile maleate, unsaturated and fumaric acid dinitrile Nitryl compounds, (meth) acrylamide, N, N, monomethylene bis (meth) acrylamide, N, N, monoethylene bis (meth) acrylamide, N, N, monohexamethylene bis (meth) acrylamide, N hydroxymethy Unsaturated amides such as ru (meth) acrylamide, N- (2-hydroxyethyl) (meth) acrylamide, N, N bis (2-hydroxyethyl) (meth) acrylamide, crotonic acid amide, and key cinnamate amide , Methyl (meth) acrylate, ethyl (meth) acrylate, (meth (Meth) acrylic acid propinole, (meth) butyl acrylate, (meth) hexyl acrylate, (meth) lauryl acrylate, polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate Acrylic esters, styrene, α-methyl styrene, ο methoxy styrene, ρ hydroxy styrene, ρ-isopropure phenol and other aromatic bur compounds, bis-phenolate ジ diglycidino enotenole, glyconole diglycidino enotenole Etc. and (meth) acrylic acid, hydroxyalkyl (meth) atarylate, etc. obtained by the reaction of epoxy (meth) atalylate, and hydroxyalkyl (meth) acrylate and polyisocyanate obtained by reaction ( Meta) Relates, glycidyl (meth) atalylate, unsaturated compounds containing epoxy groups such as (meth) aryl glycidyl ether, (meth) acrylic acid, itaconic acid, succinic acid 1/3-(meth) atari mouth quichetil, maleic acid Β- (Meth) acrylochetyl, phthalic acid-β (Meth) atari mouth kichetil, hexahydrophthalic acid-/ 3

-Unsaturated acid compounds such as (meth) ataryloxetyl, amino group-containing unsaturated compounds such as dimethylamino (meth) atalylate, jetylamino (meth) atalylate, (meth) acrylamide

Amide group-containing unsaturated compounds such as dimethyl (meth) acrylamide, and hydroxyethyl-containing unsaturated compounds such as hydroxyethyl (methato).

Among these other monomers, butadiene, isoprene, (meth) acrylonitrile, (meth) acrylic acid alkyl esters, styrene, ρ hydroxystyrene, ρ isopropyl phenol, glycidyl (meth) acrylate, (meth) acrylic Acids, hydroxyalkyl (meth) acrylates, etc. are preferred! [0043] In addition, in the production of the crosslinked polymer particles (D), it is preferable that at least one type of gen compound, specifically butadiene, is used as another monomer. Such a gen compound is preferably 20 to 80% by weight, more preferably 30 to 70% by weight, based on 100% by weight of all monomers used for copolymerization. When other gen compounds such as butadiene are copolymerized at 20 to 80% by weight with respect to 100% by weight of the total monomers as other monomers, the crosslinked polymer particles (D) become rubbery soft fine particles. It is possible to prevent cracks from occurring in the cured film and to obtain a cured film having excellent durability.

[0044] The crosslinked polymer particles (D) may be used singly or in combination of two or more.

[0045] The average particle size of the crosslinked polymer particles (D) is usually 30 to 500 nm, preferably 40 to 200, and more preferably 50 to 120.

The method for controlling the particle size of the crosslinked polymer particles (D) is not particularly limited. For example, when the crosslinked polymer particles are synthesized by emulsion polymerization, the number of micelles during the emulsion polymerization is controlled by the amount of the emulsifier used. The particle size can be controlled.

The average particle diameter of the crosslinked polymer particles (D) in the present invention is determined by diluting a dispersion of crosslinked polymer particles according to a conventional method using a light scattering flow distribution measuring device “LPA-3000” manufactured by Otsuka Electronics. Measured value.

[0046] The amount of the crosslinked polymer particles (D) blended is preferably 0.5 to 50 parts by weight, more preferably 1 to 30 parts by weight with respect to 100 parts by weight of the phenol resin (A). Part. When the blended amount of the crosslinked polymer particles (D) is 0.5 to 50 parts by weight, it has excellent compatibility or dispersibility with other components, and improves the thermal shock resistance and heat resistance of the resulting cured film. It can be made.

[0047] [1 5] (E) Adhesion aid

In addition, the photosensitive resin composition for forming an insulating film of the present invention can contain an adhesion assistant in order to improve the adhesion to the substrate.

Examples of the adhesion assistant include a functional silane coupling agent having a reactive substituent such as a carboxyl group, a methacryloyl group, an isocyanate group, and an epoxy group. It is.

Specific examples include trimethoxysilylbenzoic acid, _Ί -methacryloxypropyltrimethoxysilane, _{butyltriacetoxysilane} , _{butyltrimethoxysilane} , γ-isocyanatopropyltriethoxysilane, _Ί -glycidoxypropyl trimethoxysilane , Β- (3,4-epoxysilane) isocyanurate, and the like. These adhesion aids may be used alone or in combination.

Two or more kinds may be mixed and used.

[0048] The amount of the adhesion assistant is 0.2 to 100 parts by weight of the phenol resin (部).

It is preferably 10 parts by weight, more preferably 0.5 to 8 parts by weight. When the blending amount of the adhesion aid is 0.2 to 10 parts by weight, it is preferable because it has excellent storage stability and good adhesion.

[0049] [16] (F) Solvent

In addition, the photosensitive resin composition for forming an insulating film of the present invention can contain a solvent in order to improve the handleability of the resin composition and to adjust the viscosity and storage stability.

The solvent is not particularly limited. For example, ethylene glycol monomethyl etherate acetates such as ethylene glycol monomethyl ether acetate and ethylene glycol monoethyl ether acetate; propylene glycol monomethyl methacrylate ether, propylene Propylene glyconolemonorenoateolate, such as glycolenolemonochinoleatenore, propyleneglycolenomonopropinoreatenore, propyleneglycolenomonobutinoreethenore; Propylene glycol dialkyl ethers such as Nollechinolene Tenole, Propylene Glyconoresin Propinoreateoretol, Propylene Glycolinole Butinoleite; Propylene glycol monoalkyl ether acetates, such as pyrene glycol monomethylenoate acetate, propylene glycolenomonoethylenoate acetate, propylene glycolenomonopropinoatenoate acetate, propylene glycolanol monobutinoate ether acetate; Cellosolves such as cetyl cellosolve and butylcetosolve, carbitols such as butylcarbitol; lactic acid esters such as methyl lactate, ethyl lactate, n-propyl lactate, and isopropyl lactate Aliphatic carboxylic acid esters such as ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, n-amyl acetate, isoamyl acetate, isopropyl propionate, n-butyl propionate, isobutyl propionate; -Other esters such as methyl methoxypropyl pionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl pyruvate, ethyl pyruvate; aromatics such as toluene and xylene Hydrocarbons; ketones such as 2 heptanone, 3 heptanone, 4 monoheptanone, cyclohexanone; amides such as N dimethylformamide, N methinoleacetoamide, N, N dimethylacetamide, N methylpyrrolidone; γ —Latatons such as butyrolacun . These solvents may be used alone or in combination of two or more.

[0050] [17] Other additives

In addition, the photosensitive resin composition for forming an insulating film of the present invention can contain other additives as necessary so as not to impair the characteristics of the present invention. Examples of such other additives include inorganic fillers, sensitizers, quenchers, leveling agents'surfactants, and phenolic low molecular compounds.

[0051] The leveling agent 'surfactant is usually added to improve the coating property of the resin composition. Such a leveling agent / surfactant is not particularly limited, and examples thereof include polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, polyoxyethylene cetinoleethenole, poly-poxyethylene-pure rain ethereole and the like. Polyoxyethylene alkyl ethers such as polyalkylene alkyl ethers, polyoxyethylene octyl phenol ether, polyoxyethylene nourol phenol ether, polyoxyethylene polyoxypropylene block copolymers, sorbitan monolaurate, sorbitan mono Sorbitan fatty acid esters such as palmitate and sorbitan monostearate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monopalmitate, polyoxy Sorbitan monostearate, Poriokishe Chile Nso sorbitan trioleate, polyoxyethylene sorbitan tristearate, etc. Poly O carboxymethyl ethylene sorbitan fatty acid ester nonionic leveling agent. Include S surfactants force. Furthermore, the product name is F-top EF301, EF303, EF352 (above, Manufactured by Tochem Products Co., Ltd.), Megafuck Fl 71, F172, F173 (above, manufactured by Dainippon Ink & Chemicals, Inc.), Fluorad FC430, FC431 (above, manufactured by Sumitomo 3M Limited), Asahi Guard AG710, Surflon S-381, S-382, SC101, SC102, SC103, SC104, SC105, SC106, Surfinore E1004, KH-10, KH-20, KH-30, KH-40 (above, manufactured by Asahi Glass Co., Ltd. ), Fluorent Leveling Agents such as 250, 251, 222F, FTX-218 (above, manufactured by Neos Co., Ltd.), surfactants, organosiloxane polymers KP341, X—70-092, X — 70— 093 (above, manufactured by Shin-Etsu Chemical Co., Ltd.), SH8400 (manufactured by Dowco Jung Toray Co., Ltd.), acrylic acid or (methacrylolic acid-based polyflow No. 75, same No. 77, same No. 90, same No. 95 (above, manufactured by Kyoeisha Yushi Chemical Co., Ltd.) It is.

These leveling agents' surfactants may be used singly or in combination of two or more.

[0052] The blending amount of the leveling agent 'surfactant is usually 50 to 2000 ppm in the resin solution, preferably S, more preferably 100 to! OOOppm. When the blending amount of this leveling agent 'surfactant is 50 to 2000 ppm, it is preferable because uniform application onto a stepped substrate is good and adhesion after development and after curing is excellent. .

[0053] Examples of the phenolic low molecular weight compound include 4,4'-dihydroxydiphenylmethane, 4,4'-dihydroxydiphenyl ether, tris (4-hydroxyphenylenomethane), 1,1- Bis (4-hydroxyphenyl) -1-1-phenylethane, tris (4-hydroxyphenyl) ethane, 1,3-bis [1- (4-hydroxyphenyl) -1-methylethynole] benzene, 1,4 Bis [1 (4-hydroxyphenyl) 1-1-methylethynole] benzene, 4, 6 Bis [1 (4-hydroxyphenyl) 1-methylethyl] 1,1,3-dihydroxybenzene, 1,1-bis (4- 1- [4- [1- (4-hydroxyphenyl) 1-methylethynole] fenenole] ethane, 1,1,2,2,2-tetra (4-hydroxyphenyl) ethane, etc. It is done. These phenolic low molecular weight compounds may be used singly or in combination of two or more.

[0054] The content ratio of the phenolic low molecular compound is preferably 40% by weight or less when the total of the phenolic resin (A) and the phenolic low molecular compound is 100% by weight. And more preferably ;! to 30% by weight.

[0055] [18] Preparation method

The method for preparing the photosensitive resin composition for forming an insulating film of the present invention is not particularly limited, and can be prepared by a known method. Alternatively, a sample bottle with each component in it and completely stoppered can be prepared by stirring on a wave rotor.

[0056] [2] Cured film

The cured film in the present invention is characterized in that the photosensitive resin composition for forming an insulating film is cured.

The above-mentioned photosensitive resin composition for forming an insulating film according to the present invention has a high residual film ratio and excellent resolution, and its cured film is excellent in electrical insulation and thermal shock resistance. The cured film can be suitably used as a surface protective film, planarizing film, interlayer insulating film material, etc. for electronic components such as semiconductor elements and semiconductor packages.

In order to form the cured film of the present invention, first, the above-mentioned photosensitive resin composition for forming an insulating film according to the present invention was used as a support (with a resin-coated copper foil, a copper-clad laminate, or a metal sputtered film). It is applied to silicon wafers, alumina substrates, etc.) and dried to evaporate the solvent and form a coating film. Thereafter, the acid generated from the acid generator (B) by exposure through a desired mask pattern diffuses by performing a subsequent heat treatment (hereinafter referred to as “PEB”). This acid catalysis promotes the reaction between the phenol resin (A) and the crosslinking agent (C). Next, development is performed with an alkaline developer, and a desired pattern can be obtained by dissolving and removing unexposed portions. Furthermore, a cured film can be obtained by performing a heat treatment to develop the insulating film characteristics.

[0058] As a method for applying the resin composition to the support, for example, a coating method such as a dating method, a spray method, a bar coat method, a roll coat method, or a spin coat method can be used. Further, the thickness of the coating film can be appropriately controlled by adjusting the solid content concentration and viscosity of the coating means and the composition solution. For example, in the case of coating using a spin coating method, 20 to 10,000 mPa's is preferable from the viewpoint of handleability and in-plane uniformity of film thickness.

Examples of radiation used for exposure include low-pressure mercury lamp, high-pressure mercury lamp, and metal harassment. UV lamps such as id lamp, g spring stenonoichi, h spring stenonoichi, i spring stenonoichi, gh spring stenono 1 and ghi spring stepper. The amount of exposure is appropriately selected depending on the light source used, the resin film thickness, etc. For example, in the case of UV irradiation from a high-pressure mercury lamp, the resin film thickness is about 100 to 20000 j / m ^{2 at} a resin film thickness of 50 to 50 Hm. It is.

[0059] After the exposure, the PEB treatment is performed in order to accelerate the curing reaction of the phenol resin (A) and the crosslinking agent (C) by the generated acid. The PEB condition varies depending on the blending amount of the resin composition, the used film thickness, and the like. Usually, 70 to 150 ° C, preferably 80 to 120 ° C; Thereafter, development is performed with an alkaline developer, and a desired pattern is formed by dissolving and removing unexposed portions. Examples of the developing method in this case include a shower developing method, a spray developing method, an immersion developing method, and a paddle developing method. The development conditions are usually 20 to 40 ° C; about! To 10 minutes.

[0060] Examples of the alkaline developer include alkaline compounds such as sodium hydroxide, potassium hydroxide, ammonia water, tetramethylammonium hydroxide, and choline so that the concentration is about 1 to 10% by weight. An alkaline aqueous solution dissolved in water can be mentioned. In addition, an appropriate amount of a water-soluble organic solvent such as methanol or ethanol, a surfactant, or the like can be added to the alkaline aqueous solution. After developing with an alkaline developer, it is washed with water and dried.

[0061] Furthermore, in order to sufficiently develop the characteristics as an insulating film after development, the film can be sufficiently cured by heat treatment. Such curing conditions are not particularly limited, but the composition can be cured by heating at a temperature of 50 to 250 ° C. for about 30 minutes to 10 hours depending on the use of the cured film. It can also be heated in two stages in order to allow the curing to proceed sufficiently and to prevent deformation of the resulting pattern. For example, in the first stage, the temperature is 50 to 120 ° C. It can also be cured by heating for about 2 minutes to about 2 hours and further for about 10 minutes to 10 hours at a temperature of 80 to 250 ° C. Under such curing conditions, a general oven, an infrared furnace, or the like can be used as a heating facility.

[0062] By using the photosensitive resin composition for forming an insulating film of the present invention, an electronic component such as a semiconductor element (substrate with circuit) as shown in FIGS. 1 and 2 can be formed. That is, after the metal pad 2 is formed in a pattern on the substrate 1, the cured insulating film 3 is formed using the resin composition. If the wiring is formed in a pattern and then the metal wiring 4 is formed in a pattern, a circuit board as shown in FIG. 1 can be obtained. Further, when a cured insulating film 5 is formed thereon using the resin composition, a circuit board as shown in FIG. 2 can be obtained.

Example

[0063] Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.

[0064] [1] Preparation of photosensitive resin composition for insulating film formation

Example 1

As shown in Table 1, [A] Phenolic resin (A-1) 100 parts by weight, [B] Radiation sensitive acid generator (B-1) 1.0 part by weight, [C] Crosslinker (C4) 25 parts by weight, [E] adhesion aid (E-1) 2.5 parts by weight, and [G] surfactant (G-1) 0.2 parts by weight [F] solvent (F-1) 145 parts by weight The photosensitive resin composition for insulating film formation was prepared by melt | dissolving in a part.

[0065] Examples 2 to 5 and comparative examples;! To 2

In the same manner as in Example 1, as shown in Table 1, [A] phenol resin, [B] radiation sensitive acid generator, [C] crosslinker, [D] crosslink polymer particles, [E] adhesion aid and Each photosensitive resin composition for forming an insulating film was prepared by dissolving [G] surfactant in [F] solvent.

[0066] [Table 1]

US <AHV7 ~

table

A—1: Copolymer composed of p-hydroxystyrene / styrene / bulubenzoic acid = 18/80/2 (molar ratio), polystyrene equivalent weight average molecular weight (Mw) = 10,000

A-2: p Hydroxystyrene / Styrene = 80/20 (molar ratio) copolymer, M w = 10,000

A—3: Polyhydroxystyrene, Mw = 10,000

A— 4: p Xylylene glycol condensed phenol resin [Mitsui Chemicals, trade name “XLC-3LJ]

A— 5: m talesol / p talesol = 60/40 (molar ratio) Cresolol novolac resin, Mw = 6, 500

[B] Acid generator>

(Acid generator (B))

B— 1: 2— (p-methoxystyryl) -1,4,6-bis (trichloromethyl) 1, 3,5-tria

B-2: 2- [4- [2- {4, 6 Bis (trichloromethyl) -1,3,5 Triazine-2-amino} bule] phenoxy] ethanol

[Other acid generators (b)]

b-l: 2- (l, 3 Benzodioxol-5 yl) 4, 6 Bis (trichloromethyl) 1, 3, 5-triazine

b— 2: 1— (4, 7 Dibutoxy 1 naphthalenol) tetrahydrothiophene trifanolol methanesulfonate

[C] Crosslinking agent>

C-1: Nopolac-type epoxy resin (made by Japan Epoxy Resin Co., Ltd., trade name “EP-1 52”)

C 2: Bisphenol A type epoxy resin (made by Japan Epoxy Resin Co., Ltd., trade name “Epicoat 828”)

C 3: Trimethylolpropane polyglycidyl ether (Kyoeisha Chemical Co., Ltd., trade name “Epolite 100MF”)

C—4: Hexamethoxymethyl melamine [manufactured by Sanwa Chemical Co., Ltd. — 390 ”)

[0068] [D] Crosslinked Polymer Particles>

D—1: butadiene / acrylonitrile / hydroxybutyl methacrylate / methacrylic acid / dibutylbenzene = 64/20/8/6/2 (wt%), average particle size = 65 nm, Tg = —38. C Nylbenzene = 48/20/24/6/2 (wt%), average particle size = 65nm, Tg = —9 ° C [E] Adhesion aid>

E-1: γ-Glycidoxypropyltrimethoxysilane (product name “S510”, manufactured by Chisso Corporation) E—2: 1, 3, 5—N-tris (trimethoxysilylpropyl) isocyanurate [GE Toshiba Siri (Made by Corn Co., Ltd., trade name “Y-11597”)

[F] Solvent>

F— 1: Ethyl lactate

F—2: 2-Heptanone

[G] Surfactant>

G-1: Leveling agent · Surfactant (Neos Co., Ltd., trade name "FTX-218") G-2: Leveling agent · Surfactant (Toray 'Dow Coung Co., Ltd., trade name) "SH8400"

]

[0069] [2] Evaluation of photosensitive resin composition for insulating film formation

The characteristics of the respective photosensitive resin compositions for forming an insulating film in Examples 1 to 5 and Comparative Examples;! To 2 were evaluated according to the following methods. The results are shown in Table 2.

(1) Residual film rate

A 6-inch silicon wafer was spin-coated with a photosensitive resin composition for forming an insulating film and heated at 110 ° C. for 3 minutes using a hot plate to produce a uniform resin film having a thickness of 20 μm. Then, using an aligner (manufactured by Karl Suss, “MA-100”), UV light from a high-pressure mercury lamp was exposed through a pattern mask so that the exposure amount at a wavelength of 420 nm was 500 mj / cm ² . Next, heat it at 110 ° C for 3 minutes (PEB) on a hot plate, and soak it for 2 seconds at 23 ° C using 2.38 wt% tetramethylammonium hydroxide aqueous solution. Developed. The remaining film ratio was calculated from the film thickness before and after development.

[0070] (2) Resolution

A 6-inch silicon wafer was spin-coated with a photosensitive resin composition for forming an insulating film and heated at 110 ° C. for 3 minutes using a hot plate to produce a uniform resin film having a thickness of 20 μm. Then, using an aligner (manufactured by Karl Suss, “MA-100”), UV light from a high-pressure mercury lamp was exposed through a pattern mask so that the exposure amount at a wavelength of 420 nm was 500 mj / cm ² . Next, it was heated (PEB) at 110 ° C. for 3 minutes on a hot plate, and then developed by immersion for 2 seconds at 23 ° C. using a 2.38 wt% tetramethylammonium hydroxide aqueous solution. And the minimum dimension of the obtained pattern was made into the resolution.

[0071] (3) Adhesion

Applying a photosensitive resin composition for insulating film formation to a silicon wafer sputtered with SiO,

2

A 10 m thick uniform resin film was prepared by heating at 110 ° C for 3 minutes using a hot plate. Thereafter, the resin coating film was cured by heating at 190 ° C. for 1 hour using a convection oven to obtain a cured film. Next, this cured film was treated with a pressure tacker tester (“EHS-221MD”, manufactured by Tabyes Pec Co., Ltd.) for 168 hours under conditions of a temperature of 121 ° C, a humidity of 100%, and a pressure of 2.1 atm. did. Then, the cross-cut test (cross cut tape method) was evaluated in accordance with JIS K 5400 before and after the test.

[0072] (4) Thermal shock resistance

3 and 4 are coated with a photosensitive resin composition for forming an insulating film on a base material 8 for thermal shock evaluation having a patterned copper foil 7 on a substrate 6 and hot plate. 1 was heated at 10 ° C. for 3 minutes to produce a base material having a resin coating film having a thickness of 10 m on the copper foil 7. Thereafter, the resin coating film was cured by heating at 190 ° C for 1 hour using a convection oven to obtain a cured film. This substrate was subjected to a resistance test using a thermal shock tester (Tano Yspec Co., Ltd., “TS A-40L”) at a cycle of −65 ° C./30 minutes to 150 ° C./30 minutes. Then, the number of cycles (every 100 cycles) until a defect such as a crack occurred in the cured film was measured.

[0073] (5) Insulation

Insulation evaluation base having a patterned copper foil 10 on a substrate 9 as shown in FIG. A base material having a resin coating film having a thickness of 10 m on copper foil 10 by applying a photosensitive resin composition for forming an insulating film to material 11 and heating at 110 ° C. for 3 minutes using a hot plate Was made. Thereafter, the resin coating film was cured by heating at 190 ° C. for 1 hour using a convection oven to obtain a cured film. This base material was put into a migration evaluation system (“AEI, EHS—221MD” manufactured by Tabai Espec Co., Ltd.) under the conditions of temperature 121 ° C, humidity 85%, pressure 1.2 atm, and applied voltage 5V. Processed for 200 hours. Thereafter, the resistance value (Ω) of the test substrate was measured to evaluate the insulation.

[Table 2]

Table 2

Note that the photosensitive resin composition for forming an insulating film includes (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) the compound represented by the general formula (1), and (C) a crosslinked bridge. And that contains the agent.

Claims

Claims [1] (A) An alkali-soluble resin having a phenolic hydroxyl group, (B) a compound represented by the following general formula (1), (C) a crosslinking agent, (E) an adhesion aid, (F) A photosensitive resin composition for forming an insulating film, comprising a solvent. [Chemical 1

(1)

[2] The photosensitive resin composition for forming an insulating film according to [1], wherein the compound (C) includes a compound having two or more alkyl etherified amino groups in the molecule.

[3] The photosensitive resin composition for forming an insulating film according to [1] or [2], wherein the (C) crosslinking agent comprises an oxosilane ring-containing compound.

[4] The photosensitive resin composition for forming an insulating film according to any one of claims 1 to 3, further comprising (D) crosslinked polymer particles.

[5] A cured film obtained by curing the photosensitive resin composition for forming an insulating film according to any one of claims 1 to 4.

[6] An electronic component comprising the cured film according to [5].

7. The electronic component according to claim 6, wherein the cured film is an interlayer insulating film or a planarizing film.