WO2008026640A1 - Rfid tag structure - Google Patents

Rfid tag structure Download PDF

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Publication number
WO2008026640A1
WO2008026640A1 PCT/JP2007/066773 JP2007066773W WO2008026640A1 WO 2008026640 A1 WO2008026640 A1 WO 2008026640A1 JP 2007066773 W JP2007066773 W JP 2007066773W WO 2008026640 A1 WO2008026640 A1 WO 2008026640A1
Authority
WO
WIPO (PCT)
Prior art keywords
rfid tag
film
foamed resin
resin sheet
tag
Prior art date
Application number
PCT/JP2007/066773
Other languages
French (fr)
Japanese (ja)
Inventor
Kazuto Kokuryo
Satoshi Furusawa
Original Assignee
Nippon Sheet Glass Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2006232683A external-priority patent/JP2008059085A/en
Priority claimed from JP2006232684A external-priority patent/JP2008059086A/en
Application filed by Nippon Sheet Glass Company, Limited filed Critical Nippon Sheet Glass Company, Limited
Publication of WO2008026640A1 publication Critical patent/WO2008026640A1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/02Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions
    • B32B3/08Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by added members at particular parts
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06KGRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07758Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
    • G06K19/0776Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker

Definitions

  • the present invention relates to an RFID tag structure used for merchandise management, for example. Furthermore, the present invention relates to an RFID tag structure that can be used even when exposed to high temperatures. For example, the RFID tag structure can withstand high temperatures in the laminated glass laminating process and can withstand repeated use.
  • RFID Radio Frequency Identification
  • an IC tag is generally as follows. That is, as shown in FIG. 18A, an antenna 112 is formed on a polyethylene terephthalate (PET) phenolic 111 serving as a base, an IC chip 113 is connected to the antenna, and the antenna and the IC chip are further protected. A protective film (for example, a PET film) 114 is bonded and laminated with an adhesive. 100 is an IC tag.
  • PET polyethylene terephthalate
  • a protective film is not used but a structure by potting with a thermosetting resin is also used. That is, as shown in FIG. 18B, an antenna 112 is formed on a PET film 111, an IC chip 113 is connected to the antenna, and a connection portion between the antenna and the semiconductor chip is connected to a thermosetting resin. According to (potting) 115, a protective structure is also used.
  • the IC tag When removing the IC tag, the IC tag must be peeled off with a force exceeding the adhesive strength of the double-sided adhesive tape or adhesive. At this time, there is a problem that the IC tag is bent, and the electrical connection between the antenna and the IC chip is often lost, so that the IC tag does not function. In addition, there is an invention that loses the function of the IC tag by placing importance on individual management by the IC tag and peeling the IC tag from the object.
  • the adhesive remains on the surface of the object, which may impair the appearance.
  • Patent Document 1 discloses a home delivery slip with an IC tag, which is characterized in that an IC tag is attached to a collection slip portion of the home delivery slip, and ensures the collection of the IC tag. However, to reuse the IC tag, the collection slip and the IC tag must be peeled off using a cleaning solution!
  • Patent Document 2 describes an IC tag in which an IC tag is loaded on an inner surface where a base material and a covering material are overlapped without bonding, and the base material, the covering material, and the periphery are joined by an adhesive layer.
  • the inclusion body is disclosed. With this configuration, the IC tag can be easily removed and reused easily. However, the IC tag enclosure itself is adhered to the management object via an adhesive layer.
  • Patent Document 3 proposes a clip having an IC tag as a mechanism for attaching the IC tag to an object.
  • the clip had to be used and the versatility was poor.
  • Patent Document 4 proposes forming a small bag with a heat-resistant protective film and enclosing an IC tag (RFID tag) therein.
  • RFID tag IC tag for clothing
  • Patent Document 5 proposes an IC tag for clothing (RFID tag) in which urethane resin is bonded and protected on both the upper and lower surfaces of a film-like circuit portion on which an IC chip and an antenna are mounted. .
  • the IC chip and the antenna are protected by the flexibility and elasticity of this urethane resin.
  • a method using a double-sided adhesive sheet (tape) is disclosed.
  • Patent Document 6 proposes a cleaning IC tag (RFID tag) in which an IC tag inlet is set in a tray storage portion, and resin is poured into the tray storage portion to embed it into an integrated structure.
  • RFID tag RFID tag
  • thermosetting resin The IC chip and the antenna coil of the IC tag inlet are protected by a thermosetting resin. There is no disclosure about attachment to clothing.
  • Patent Document 7 describes that an antenna circuit and an IC chip are sandwiched by thermally bonding two plastic films each having a thermal adhesive layer on one side.
  • An IC tag (RFID tag) manufacturing method has been proposed. This thermal bonding is a method in which heat is applied to two plastic films with a heat press laminator to melt the thermal adhesive layer and bond the films together.
  • at least one of the plastic films is a polyester film containing cavities. This uses the cushioning properties to absorb the unevenness of the antenna, etc., and alleviates the problem of unevenness appearing on the tag surface.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2006-001069
  • Patent Document 2 JP 2002-157569 Koyuki
  • Patent Document 3 Japanese Patent Laid-Open No. 2005-216275
  • Patent Document 4 Japanese Patent Laid-Open No. 2001-66990
  • Patent Document 5 JP 2005-56362 Koyuki
  • Patent Document 6 Japanese Unexamined Patent Publication No. 2006-95153
  • Patent Document 7 Japanese Unexamined Patent Application Publication No. 2005-209171
  • the present invention provides an RFID tag structure that can be easily attached to and detached from an object to be managed in order to make the IC tag reusable. It also provides an RFID tag structure that does not impair the appearance of the management target after the IC tag is removed. Furthermore, the present invention uses an adhesive or the like. To provide a heat resistant RFID tag structure that can be used.
  • the RFID tag structure of the present invention includes a RFID tag in which an antenna and a semiconductor chip connected thereto are formed on the surface of a base film, and a sheet on at least one of the front surface or the back surface of the RFID tag. It is characterized by having a foamed resin sheet layer having an adsorption function by having a large number of fine suction cups on the surface with or without a film.
  • the heat-resistant RFID tag structure of the present invention has a structure in which the foaming resin sheet layer having the adsorption function is adsorbed directly to the antenna and the semiconductor chip connected thereto. .
  • FIG. 1A is a schematic sectional view of Example 1 of the present invention.
  • FIG. 1B shows the result of observing the surface of the foamable acrylic resin used in Example 1.
  • FIG. 1C is a result of observing a cross section of the foamable acrylic resin used in Example 1.
  • FIG. 1D is a schematic cross-sectional view of a modification of the first embodiment.
  • FIG. 1E is a plan view of another modification of the first embodiment.
  • FIG. 2A is a schematic sectional view of Example 2.
  • FIG. 2A is a schematic sectional view of Example 2.
  • FIG. 2B is a schematic cross-sectional view of a modification of the second embodiment.
  • FIG. 3A is a schematic cross-sectional view of Example 3.
  • FIG. 3B is a schematic cross-sectional view of a modified example of Example 3.
  • FIG. 4A is a schematic sectional view of Example 4.
  • FIG. 4A is a schematic sectional view of Example 4.
  • FIG. 4B is a schematic cross-sectional view of a modification of the fourth embodiment.
  • FIG. 5 shows an example in which an adsorption layer is formed by screen-printing a resin having the same flexibility to form a large number of small suction cups.
  • FIG. 6 is a schematic cross-sectional view of a double-sided adsorbable foamed resin sheet used in the present invention.
  • FIG. 7 is a photograph of the adsorption surface of the foamed resin sheet used in the present invention, observed with a scanning electron microscope.
  • FIG. 8 is a photograph of a cross section of the foamed resin sheet observed with a scanning electron microscope.
  • FIG. 9 is a sectional view of an information management tag in Embodiment 5 of the present invention.
  • FIG. 10 is a perspective view of the RFID tag in FIG.
  • FIG. 11 A cross-sectional view of the information management tag adsorbed on an automotive windshield glass.
  • FIG. 12 A plan view of the information management tag adsorbed on a car windshield glass.
  • FIG. 13 is a photograph obtained by observing the adsorption surface of the foamed resin sheet used in Example 5 of the present invention after heat treatment at 150 ° C. for 90 minutes with a scanning electron microscope.
  • FIG. 14 is a sectional view of an information management tag in Embodiment 6 of the present invention.
  • FIG. 15 is a cross-sectional view of an information management tag in Embodiment 7 of the present invention.
  • FIG. 16 is a sectional view of an information management tag in Embodiment 8 of the present invention.
  • FIG. 17 is a cross-sectional view of an information management tag in Embodiment 9 of the present invention.
  • FIG. 18A and FIG. 18B are schematic cross-sectional views of conventional general IC tags.
  • the surface in contact with the management target has an adsorption structure provided with a number of minute suction cups.
  • an RFID tag structure that can be repeatedly adsorbed to the management object, can be reused, and does not leave an adhesion trace on the surface of the management object.
  • no adhesive or adhesive is used on the surface that comes into contact with the product, so there will be no trace of adhesion.
  • the cost per use can be reduced.
  • one of the films is a rigid member.
  • the RFID tag structure according to the present invention may be configured by further laminating a resin rigid plate.
  • the adsorption structure in the RFID tag structure according to the present invention is preferably made of, for example, a foamed resin sheet obtained by foaming acrylic resin.
  • the film constituting the RFID tag structure when the film constituting the RFID tag structure is made of a rigid member or laminated with a rigid resin plate, the antenna and the semiconductor are not bent excessively when removed. A poor electrical connection with the chip can be prevented.
  • the sheet having a fine suction cup on the surface when adsorbed to an object, the sheet is easily peeled off when the end of the sheet is rolled up. If the RFID tag structure according to the present invention has a rigid configuration as described above, it is possible to prevent the end from rolling up, and thus it is possible to obtain an RFID tag structure that is difficult to come off in a normal use level.
  • adsorption is used to mean adsorption by a fine suction cup, and is different from so-called chemical adsorption or physical adsorption.
  • the RFID tag structure according to the present invention has an adsorption structure on at least one of the front surface and the back surface thereof, so that it can be easily attached to an object having a smooth surface with a force S.
  • the adhesive does not need to be interposed on the adsorption surface.
  • the RFID tag is removed, no adhesive remains! /, So that the appearance of the management target is not impaired.
  • the adsorbing structure of the present invention may be formed by applying a foamed resin sheet technique or by a printing technique using a flexible resin as a suction cup structure.
  • This foamed resin sheet is made of a resin such as acrylic resin, silicone rubber, silicone gel, or fluororubber.
  • an elastic resin is used.
  • a gas such as air is added to the resin raw material, and it is subjected to a mechanical foaming machine, formed into a sheet, dried and vulcanized or crosslinked. After forming the sheet, gas escapes from the surface of the sheet or bubbles are destroyed and foam marks are generated.
  • vulcanization or crosslinking is carried out to form a suction cup (hereinafter also referred to as a foam suction cup) consisting of a foam hole.
  • a foam suction cup consisting of a foam hole.
  • a preferable number of the foam suction cups is 10,000 to 30,000 / cm 2 . This foam suction cup can be repeatedly attracted to the object to be managed. Independent foaming remains in the sheet.
  • foam sucker examples include polystyrene elastomers (for example, trade names “Tuffprene” and “Tough Tech” manufactured by Asahi Kasei Kogyo Co., Ltd.), olefin elastomers (for example, product name “Dynalon CEBC” manufactured by JSR, Mitsui Chemicals, trade name “Mistramer”), urethane elastomer, estenore elastomer, amide elastomer, chlorinated polyethylene elastomer, Syn-1,2-polybutadiene, Trans_l, 4-polyisoprene, fluorine Elastomer can be used. These are described in the “Plastics' Data Book” published by the Industrial Research Council, December 1, 1999, pp. 854-857, and in the present invention the polymers described therein are also described. One can be used.
  • the average diameter of the foam suction cup is preferably in the range of 1 to 300 111.
  • the foamed resin sheet is directly adsorbed, and the base film of the IC tag and the foamed resin sheet are It is good to be integrated.
  • Such a foamed resin sheet is commercially available under the following trade names. These include Zeon AL Sheet (Zeon Kasei Co., Ltd.), Diafit (Diamic Co., Ltd.), Pitatto-kun (Ookura Paper Co., Ltd.). Since these foamed resin sheets do not use an adhesive or the like, the foamed resin sheet has a characteristic that the adhesive or the like remains on the peeled mark.
  • the adsorption structure using the printing technique may be manufactured by, for example, a method disclosed in Japanese Patent Laid-Open No. 6-238845. This is a method for forming a sucker by “printing a continuous sucker-type pattern of mesh-like suckers on a softened ink-like substance by a screen printing method”. Japanese Patent Laid-Open No. 2000-274421 also discloses a similar technique.
  • the RFID tag structure of the present invention includes a semiconductor chip and an antenna connected to the semiconductor chip on the surface of the base film. As a result, electric power is supplied from the antenna to the semiconductor chip by electromagnetic induction, and various management information is written. For example, various information such as varieties, raw materials, production history, usage, user name, destination, etc. If this information is read correctly, it can be used for many managements such as production management, supply management, and quality control.
  • the heat-resistant RFID tag structure of the present invention has a semiconductor chip on the surface of the base film.
  • RFID tag on which the antenna and the antenna connected to the RFID tag are formed, and a first foamed resin sheet having a large number of bubble holes formed on at least one main surface of the first film sheet as an adsorption surface.
  • the adsorption surface of the resin sheet is directly adsorbed to the semiconductor chip and the antenna.
  • the foamed resin sheet used in the present invention can be obtained by mixing gas into the resin during production.
  • the resin itself is basically a foam containing closed cells, and since it contains air, it has heat insulation properties and high heat resistance.
  • this foamed resin sheet has flexibility, is a foam, and has cushioning properties, the semiconductor chip and the antenna can be sufficiently protected from damage due to contact or the like.
  • the information management tag of the present invention preferably has a configuration in which a bubble hole is further provided and the suction surface is arranged on the outside. With this suction surface, it is possible to repeat attachment and removal with the management object.
  • the information management tag according to the present invention may be configured by further laminating a hard resin plate or film. If it is configured by laminating a hard resin plate or film, the information management tag will not be folded or bent excessively when it is removed, and the semiconductor chip and the antenna cannot be electrically connected. There is no fear.
  • the foamed resin sheet used in the present invention tends to be easily peeled off when its end is rolled up. If the information management tag is configured by laminating a hard resin plate or film, it is possible to prevent the edge from rolling up, so that the information management tag cannot be easily removed in the normal use.
  • the IC chip and the antenna are more sufficiently protected.
  • the adsorption surface of the foamed resin sheet has a semiconductor Directly adsorbed to the chip and antenna. For this reason, even if the information management tag is exposed to a high temperature, since the adhesive is not used, the adhesive does not cure and shrink.
  • the information management tag of the present invention is excellent in heat resistance.
  • a foamed resin sheet is provided on the surface of the information management tag of the present invention that contacts the management target. Due to the adsorption action of this resin sheet, it is possible to repeatedly attach and remove it to the management object. As a result, it is possible to provide an information management tag that can be reused and does not leave any trace of adhesion on the management target. In this way, once reuse becomes possible, the cost per use can be reduced even if an expensive RFI D tag is used.
  • the information management tag of the present invention when configured by laminating a hard resin plate or film, the information management tag can be handled safely. Moreover, there is no risk of damaging the RFID tag even after repeated mounting and removal.
  • a standard RFID tag (both base film and protective film made of PET) was affixed to the glass plate with an adhesive layer attached in advance to the back side. We put it in a thermostatic bath, raised the temperature to about 130 ° C, and kept it for 90 minutes, repeating the heat cycle several times, and confirmed the change due to the heat of the RFID tag.
  • RFID tags three types of RFI D tags with different structures were prepared and used for heating experiments with autoclave to confirm the shrinkage of the film.
  • Each prepared RFID tag has the following structure.
  • Laundry type An RFID tag developed to be applicable to cleaning, and a type that is said to be further laminated to the RFID tag of type (2) above
  • the member strength for protecting the IC chip and the antenna has heat resistance, for example! / Even if it is fixed with an adhesive, the adhesive is cured by heat and shrinks. . For this reason, the RFID tag is distorted and D information cannot be read by the RFID tag. Therefore, we have found that it is necessary to fix the RFID tag regardless of the adhesive to make it heat resistant.
  • Adhesive material can be applied if a heat-resistant material is selected.
  • a foamed resin sheet made by foaming acrylic resin and forming a large number of foam holes on the surface to make it an adsorption surface, and used it as a protective film for RFID tags.
  • the above-mentioned foamed resin sheet is adsorbed to an RFID tag (hereinafter also referred to as a bare IC tag) that has an IC chip and an antenna exposed by a PET protective film, and is about 1.5 MPa (15 atm) in an autoclave. And heating for 90 minutes at a temperature of 150 ° C. When the RFID tag was observed after heating, there was no problem in reading the ID information, which did not change in appearance.
  • this foamed resin sheet was adsorbed on a glass plate and a heating experiment was conducted in an autoclave.
  • the autoclave is heated by hot air circulation, and is exposed to hot air at a speed of 3 to 4 m / sec.
  • the foamed resin sheet kept adsorbed on the glass plate.
  • no curling of the edge of the foamed resin sheet due to the blowing of hot air was observed. From the above, it was found that this foamed resin sheet is also useful as a structure for attaching RFID tags to products and the like.
  • the information management tag of the present invention naturally has a normal RFID tag function. Basically, D information is written on the IC chip. Furthermore, various management information can be written in a writable semiconductor chip. For example, various information such as varieties, raw materials, production history, usage, user name, destination, etc. If this information is read correctly, it can be used for many managements such as production control, supply control, quality control, etc., and it is useful. [0063] As an example, the delivery of glass products by the so-called Kanban system of an automobile manufacturer will be described. First, the delivery date, time, and location are specified according to the assembly schedule of various types of vehicles.
  • various glass products such as windshield glass, side glass, rear glass, and roof glass with different shapes and sizes need to be supplied in the assembling order.
  • individual management using a computer is useful.
  • an information management tag can be attached before the glass base plate is supplied to the processing line.
  • the information management tag of the present invention is suitable for such a use.
  • laminated glass is used mainly for windshield glass, in which an interlayer film made of polyvinyl butyral (PVB) is sandwiched between two glasses and heat-treated.
  • the heat treatment is performed in an autoclave, for example, under a pressure of about 1.5 MPa (15 atm) at a temperature of 150 ° C. for 90 minutes. If the information management tag can withstand the heat treatment conditions of laminated glass, for example, it can be managed individually from the stage before it is put into the autoclave, so that more accurate control can be achieved.
  • the adsorbable foamed resin sheet affixed to the information management tag of the present invention is preferably made from a resin such as acrylic resin, silicone rubber, silicone gel, or fluororubber.
  • a resin such as acrylic resin, silicone rubber, silicone gel, or fluororubber.
  • an elastic resin is used.
  • a gas such as air is added to the resin raw material, and it is applied to a mechanical foaming machine, spread on a film sheet, and dried. Then, gas escapes from the surface or bubbles are destroyed and foam marks are generated. If this foaming mark is left as it is and vulcanized or crosslinked, a suction cup composed of a foam hole (hereinafter also referred to as a foam suction cup) is formed.
  • the preferred number of foam suckers is 10,000 to 30,000 / cm 2 . Independent foam remains in the foamed resin sheet.
  • Such a foamed resin sheet is commercially available under the following trade names. Zeon AL sheet (Zeon Kasei Co., Ltd.), Diafit (Diamic Co., Ltd.), Pitatto-kun (Ookura Paper Co., Ltd.), etc.
  • the average diameter of the foam suction cup is preferably in the range of 1 to 300 m.
  • No adhesive or adhesive is present on the adsorption surface of the foamed resin sheet. As described above, adhesives and adhesives change in quality or discolor due to heating, causing problems. Also removed from the management object There is also a problem that marks are left behind.
  • foamed resin sheet examples include polystyrene-based elastomers (for example, trade names “Tuffprene” and “Tuftec” manufactured by Asahi Kasei Kogyo Co., Ltd.), and olefin-based elastomers (for example, product names “Dynalon” manufactured by JSR Corporation).
  • polystyrene-based elastomers for example, trade names “Tuffprene” and “Tuftec” manufactured by Asahi Kasei Kogyo Co., Ltd.
  • olefin-based elastomers for example, product names “Dynalon” manufactured by JSR Corporation.
  • CEBC trade name
  • Mistramer manufactured by Mitsui Chemicals, Inc.
  • urethane elastomer estenole elastomer
  • amide elastomer chlorinated polyethylene elastomer
  • Syn-1,2-polybutadiene Syn-1,2-polybutadiene
  • Trans_l 4-polyisoprene Fluorine-based elastomers
  • Materials for the base film of the RFID tag include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyimide (PI), polyphenylene sulfide (PPS), polyether ether ketone ( PEEK), polyethersulfone (PES), or polyetherimide (PEI) can be used.
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PA polyamide
  • PI polyimide
  • PPS polyphenylene sulfide
  • PEEK polyether ether ketone
  • PEI polyetherimide
  • the material of the hard resin plate or film includes polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyimide (PI), and polyphenylene sulfide.
  • PP polypropylene
  • PET polyethylene terephthalate
  • PEN polyethylene naphthalate
  • PA polyamide
  • PI polyimide
  • PPS polyetheretherketone
  • PEEK polyethersulfone
  • PEI polyetherimide
  • the thickness of the hard resin plate or film is such that when the information management tag is removed, the information management tag is not deformed to such an extent that the electrical connection between the antenna and the IC chip does not cause a problem. As long as it has.
  • the degree of deformation of the information management tag varies depending on the adsorption force of the foamed resin sheet.
  • the rigidity of resin plates and films varies depending on the material. Therefore, the preferable thickness of the resin plate or film may be determined in consideration of the difference in material and the adsorption power of the foamed resin sheet. For example, an appropriate thickness may be selected from commercially available resin boards and films.
  • the hard resin plate or film is preferably annealed (heat treated) in advance in order to remove the remaining distortion. When annealing, it is adsorbed to the foamed resin sheet used in the present invention, and this foamed resin sheet is further heated to a heat resistant plate such as a flat glass plate. It is good to heat-treat it.
  • a polypropylene (PP) sheet (melting point: 160 ° C to 165 ° C, heat distortion temperature: 124 ° C) or a polyethylene terephthalate (PET) film (melting point: 255 ° C, glass transition temperature: 76)
  • PP polypropylene
  • PET polyethylene terephthalate
  • an information management tag having a suction surface on the outer side may be lightly pressed by hand to be sucked onto a management object (eg, glass).
  • a management object eg, glass
  • an adsorption force of about 80 to 90 kg / cm 2 can be obtained.
  • the information management tag of the present invention may be a glass production management tag.
  • the foamed resin sheet integrated with the information management tag of the present invention has a bubble-like hole portion with high heat resistance, and has a tackiness. For this reason, even if glass contacts, there is an advantage that neither the glass nor the information management tag is damaged by the buffering action.
  • the information management tag of the present invention can be adsorbed to a black ceramic print portion which is printed around the glass and has a thickness of about 15 m. Although this ceramic print has some irregularities, the foamed resin sheet is flexible and can be adsorbed.
  • Roussilon Place the Roussilon in a mechanical foaming machine and mix it with air.
  • This acrylic emulsion solution was applied to the surface of a polyethylene terephthalate sheet film (width 30 cm, thickness 50 ⁇ m, long product) with a knife coater so that the dry thickness was 200 ⁇ m.
  • crosslinking was carried out while drying from 110 ° C to 140 ° C over 9 minutes.
  • a polyethylene terephthalate protective film having a thickness of 30 m was coated on the crosslinked acrylic resin foam layer.
  • an acrylic resin foam layer could be formed on one side of the polyethylene terephthalate sheet film.
  • the foam layer surface of the acrylic resin, foam marks gas escapes or foam is made form by the destruction was present in a proportion of from 10,000 to 30,000 pieces / cm 2.
  • the surface of this foam layer functions as an adsorption surface.
  • a double-sided foamed resin sheet can be obtained by applying this acrylic emulsion solution to the back surface of the above-described sheet film and crosslinking it.
  • FIG. 1A shows a schematic sectional view of Example 1.
  • an RFID tag 10 in which an antenna 12 and a semiconductor chip 13 connected to the antenna 12 were formed on the surface of the base film 11 and a protective film 14 was further laminated thereon was prepared.
  • RFID having a structure in which a sheet film 21 having a foamable acrylic resin adsorption layer 22 formed on the back surface of the base film 11 of the RFID tag 10, that is, a foamed resin sheet 20, is bonded via an adhesive layer 30.
  • Tag structure 1 Many suction cups 23 are formed on the suction surface 24 of the foamed resin sheet 20. Note that a double-sided adhesive tape may be used instead of the adhesive layer.
  • Results of observation of the surface (adsorption surface) and the cross section of the foamable acrylic resin with a scanning electron microscope manufactured by Hitachi, S-4500, acceleration voltage: 5 kV, photographing magnification: 250 times
  • Figures 1B and 1C are shown in Figures 1B and 1C, respectively.
  • the foamed resin sheet had a thickness of lmm, and was cut into a size of 30mm in length and 70mm in width.
  • an adsorption force of about 80 to 90 kg / cm 2 can be obtained.
  • the average diameter of the foam sucker ranges from 1 to 300 111.
  • Example 1 shown in Fig. 1A the RFID tag structure according to the present invention can be easily obtained by simply adhering a commercially available foamed resin sheet to an existing IC tag with an adhesive or a double-sided adhesive tape. Obtainable.
  • the RFID tag structure according to the present invention can be easily attached to an object. Also, no adhesive remains when the RFID tag structure is removed.
  • the foamed resin sheet be made difficult to be bent by changing the force and material to make the sheet film thick. This is preferable because the connection between the semiconductor chip and the antenna becomes painful when the RFID tag structure is removed.
  • the base film material is preferably polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), etc./.
  • the sheet film may be a film material similar to the base film.
  • the base film 11 of the IC tag and the sheet film 21 of the foamed resin sheet may be shared as shown in FIG. 1D.
  • Example 1 a foamed resin sheet 20 matching the size of an existing IC tag 10 is bonded.
  • the configuration was as follows.
  • the size of the IC tag 10 is 10 mm long, 45 mm wide, and about 100 m thick, and it may not be large enough from the viewpoint of ease of handling and visibility. Since the size of the existing IC tag is almost the same, if necessary, the foamed resin sheet 20 is made larger than the existing IC tag 10 and the IC tag 10 is arranged in the center as shown in Fig. 1E.
  • the RFID tag structure 1 may be configured.
  • an IC tag may be arranged not only at the center but also at the end.
  • FIG. 2A shows a schematic cross-sectional view of Example 2.
  • This Example 2 has the same structure as that of Example 1 except that the sheet film 21 having a foamable acrylic resin adsorbing layer formed thereon is bonded to the surface of the IC tag protective film 14 via the adhesive layer 30. It is.
  • IC tag protection film 14 and the foamed resin sheet film 21 may be shared as shown in FIG. 2B.
  • FIG. 3A shows a schematic cross-sectional view of Example 3.
  • Example 3 is an example in which a resin plate made of PP (polypropylene), PE (polyethylene), PET, acrylic resin, or the like is laminated, and the resin rigid plate 40 is bonded onto the protective film of Example 1. (Adhesive layer not shown) are stacked. If the laminated structure as shown in FIG. 3A is used, the resin rigid plate 40 can protect the surface of the IC tag 10, and if the resin rigid plate 40 is gripped, the RFID tag structure 1 may be damaged. There is no, you can ring.
  • the stacking position is not particularly limited, and as shown in Fig. 3B, the resin is placed between the IC tag 10 and the foamed resin sheet 20.
  • a rigid plate 40 may be provided. The adhesive layer between the resin rigid plate 40 and the protective film 14 of the IC tag 10 is not shown.
  • the RFID tag structure of the present invention has sufficient rigidity and is easy to handle. There is no damage to the connection between the antenna and the semiconductor chip when removing.
  • FIG. 4A shows a schematic cross-sectional view of Example 4.
  • Example 4 is an RFID tag structure in which a semiconductor chip and an antenna are adsorbed on one side of a double-sided foamed resin sheet and the other side is used for adsorbing an object.
  • FIG. 4B a structure in which a resin rigid plate is bonded to the back side of the base film and laminated may be used.
  • the force exemplified by the adsorption layer made of foamable acrylic resin may be an adsorption layer made of foamable urethane resin without being limited thereto.
  • a flexible resin for example, polychlorinated bur resin 25, is formed on the front or back surface of the IC tag so that the cross section is convex and has a mesh shape in plan view. (21, (11, 14)) may be screen-printed to form a large number of small suction cups 23 to form an adsorption structure.
  • Example 5 The following is an example of a heat-resistant RFID tag structure! (1) Production of foamed resin sheet
  • Acrylic copolymer resin (trade name “DICNAL MEP-20WO” manufactured by Dainippon Chemical Co., Ltd.) 1 OOOg, 100 g of foam stabilizer (trade name “DICNAL M-40” manufactured by Dainippon Chemical Co., Ltd.), and thickener ( Dainippon Chemical Co., Ltd. trade name "DICNAL MX”) 100g and crosslinker melamine resin (Dainippon Chemical Co., Ltd. product) 50g are mixed to make acrylic emulsion, and this acrylic emulsion is put into a mechanical foaming machine. Then, an acryl emulsion solution containing bubbles with a foaming ratio of 1.5 times was prepared.
  • This acrylic emulsion solution was applied on one side of a polyethylene terephthalate film sheet (width 30 cm, thickness 50 111, long) with a knife coater to a dry thickness of 200 mm. Immediately thereafter, crosslinking was carried out while drying from 110 ° C to 140 ° C over 9 minutes. Thereafter, a protective film made of polyethylene terephthalate having a thickness of 30 m was coated on the crosslinked acrylic resin layer. Thereafter, an acrylic emulsion solution was similarly applied to the other surface of the polyethylene terephthalate finalene sheet and crosslinked in the same manner.
  • a double-sided type foamed resin sheet is produced.
  • a single-sided type foamed resin sheet can be obtained by forming a foamed acrylic resin layer only on one side.
  • the surface of the acrylic resin layer of the foamed resin sheet is present at a rate of 10,000 to 30,000 pieces / cm 2 of foamed traces S formed when air escapes or bubbles burst. These function as a micro suction cup. When this foamed resin sheet was pressed against a glass plate, an adsorption force of 80 to 90 kg / cm 2 was obtained.
  • FIG. 6 shows a schematic cross-sectional view of the obtained foamed resin sheet capable of adsorbing on both sides.
  • 54 is a polyethylene terephthalate film sheet
  • 53 and 55 are acrylic foamed resin layers
  • 63 and 65 are foam suckers
  • 64 and 66 are internal bubbles.
  • This acrylic resin layer is a closed-cell foam having elasticity.
  • FIG. 7 is a photograph of the adsorption surface of the foamed resin sheet observed with a scanning electron microscope (manufactured by Hitachi, Ltd., S-4500, acceleration voltage: 5 kV, photographing magnification: 250 times). It can be seen that there is a force S where a plurality of bubbles are combined, which is basically an independent foam. The boundaries of individual bubbles are clearly observed, indicating that they can function as micro-suction cups.
  • FIG. 8 is a photograph of the cross section of the foamed resin sheet, similarly observed with a scanning electron microscope. There is a place where a plurality of foams are united. There were no places where the foamed resin sheet communicated in the thickness direction, and the foam was confirmed to be an independent foam.
  • the double-sided foamed resin sheet 56 is adsorbed on the surface of the bare IC tag 51 in which the IC chip and the antenna are formed on the base film 2 (thickness 50 m, polyethylene terephthalate).
  • RFID tag 60 was constructed. This integration is possible with the pressing force of pushing by hand. Such bare IC tags are generally available for purchase.
  • FIG. 9 56 is a double-sided adsorbable foamed resin sheet obtained as described above, and acrylic foamed resin layers 53, 55 are formed on both sides of a polyethylene terephthalate film sheet 54. . Microscopic suction cups are formed on the outer surfaces of the acrylic foam resin layers 53 and 55, respectively.
  • FIG. 10 shows a bare IC tag 51 used in this example.
  • the bare IC tag 51 includes a semiconductor chip (IC chip) 59 and antennas 57 and 58 connected thereto on the surface of a base film 52 of a polyethylene terephthalate film.
  • Antennas 57 and 58 are made of copper print.
  • This RFID tag 60 was applied to the laminated glass laminating process. This is to confirm whether the RFID tag 60 can withstand the heating in the autoclave used in the alignment process. As shown in FIG. 11, the RFID tag 60 was adsorbed on a single glass plate 61 constituting a laminated glass.
  • This laminated glass is an automotive windshield glass.
  • the adsorption position of the RFID tag 60 was the ceramic mix portion 62 formed around the glass plate 61 as shown in FIG.
  • the RFID tag 60 was not pasted on the other glass of the windshield glass.
  • An interlayer film made of polybulubutyral (PVB) is sandwiched between the two sheets of glass prepared in this way, put in an autoclave at a temperature of 150 ° C for 90 minutes under a pressure of 1/5 MPa, and bonded by heat treatment. Integrated.
  • the laminated glass thus obtained had the same quality as that without the RFID tag 60 attached thereto, and the attachment of the RFID tag had no effect on the production of the laminated glass. In addition, there was no suction mark left on the side of the force glass from which the RFID tag 60 was removed. Furthermore, no deterioration or deformation of the reading quality of the RFID tag 60 was observed.
  • Fig. 13 is a photograph of the adsorption surface after heat treatment of the foamed resin sheet at 150 ° C for 90 minutes, observed with a scanning electron microscope. Part of the micro-suction cups had a force S that was damaged by heat and repeated use. Most of the suction cups remained clear, and it was confirmed that repeated use was possible.
  • the information management tag according to the present invention is not limited to the above configuration, and may be an information management tag having the following configuration. [0119] (Example 6)
  • the information management tag shown in FIG. 14 has a bare IC tag 51 and a larger double-sided foam resin sheet 56, and presses the bare IC tag 51 against the center of the main surface of the double-sided foam resin sheet 56. Further, in this example, the information management tag 50 is formed by further pressing a resin plate 70 having the same size as the foamed resin sheet 56. In this case, the information management tag 60 is attached to the management target by pressing the other main surface of the double-sided foamed resin sheet 56.
  • the double-sided foam resin sheet 56 is made larger than the bare IC tag 51, so that the force is the same as that of Example 5 described above, and the resin plate 70 is easily laminated. it can. Since the resin plate 70 is provided, it is preferable that the electrical connection between the IC chip and the antenna which cannot be bent excessively when removing the information management tag is lost.
  • Example 6 the bare IC tag 51 is arranged in the central portion of the large foamed resin sheet 56. However, if the information management tag does not easily peel off, it is not limited to the central portion. A bare IC tag 51 may be arranged.
  • the information management tag shown in Fig. 15 uses a single-sided foamed resin sheet 67, which is made larger than the bare IC tag 1, so that it is possible to obtain a heat-resistant information management tag with the simplest configuration. Monkey.
  • the information management tag shown in FIG. 16 has a resin plate 70 laminated on the back side of the film sheet 54 of the foamed resin sheet 67 in the information management tag shown in FIG. 15 using an adhesive or a double-sided adhesive tape (71).
  • Information management tag In this case, an adhesive or double-sided adhesive tape is used to fix the resin plate. However, even if this adhesive or double-sided adhesive tape force heat shrinks and cures, the function of the information management tag will not be lost. Les.
  • a single-sided foam resin sheet 67 is adsorbed on the surface of the bare IC tag 51, and a double-sided foam resin sheet 56 is attached to the surface of the bare IC tag 51. It is the adsorbed information management tag.

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Abstract

In a RFID tag structure, a RFID tag having an antenna (12) and a semiconductor chip (13) connected to the antenna is formed on the front surface of a base film (11), and at least on the front surface or the rear surface of the RFID tag, a suction layer (22) having many fine suckers (23) on the surface is formed by having or without having a sheet film (21) in between. Thus, the RFID tag can be reused and easily attached to or removed from an object to be managed, without deteriorating the appearance of the object even when the RFID tag is removed.

Description

明 細 書  Specification
RFIDタグ構造体  RFID tag structure
技術分野  Technical field
[0001] 本発明は、例えば、商品管理などに用いられる RFIDタグ構造体に関する。さらに、 高温に曝されても使用可能であり、例えば、合わせガラスの合わせ工程における高 温にも耐え、さらに、繰り返しの使用に耐えうる RFIDタグ構造体に関する。  The present invention relates to an RFID tag structure used for merchandise management, for example. Furthermore, the present invention relates to an RFID tag structure that can be used even when exposed to high temperatures. For example, the RFID tag structure can withstand high temperatures in the laminated glass laminating process and can withstand repeated use.
背景技術  Background art
[0002] アンテナと ICチップを組み込んだ RFID(Radio Frequency Identification)タグは、商 品管理などに利用され始めている。この RFIDタグ (以下、 ICタグともいう)は、量産化 などにより、低価格化が進んでいる。しかし、バーコードのように、管理する対象の商 品に貼り付けたままで、 1回だけの使用形態とするには、まだまだ高コストであるのが 実情である。  [0002] RFID (Radio Frequency Identification) tags incorporating an antenna and an IC chip have begun to be used for product management. The price of RFID tags (hereinafter also referred to as IC tags) is increasing due to mass production. However, the actual situation is that it is still expensive to use the product once it is pasted on the product to be managed, such as a barcode.
[0003] そこで、 ICタグを商品管理などシステム用途に普及させるためには、 ICタグの低コ スト化が欠かせない。 ICタグの低コスト化のためには、安価な量産技術の確立もさる ことながら、 ICタグの再使用可能な仕組みを構築することが重要である。  [0003] Therefore, in order to popularize IC tags for system use such as product management, it is indispensable to reduce the cost of IC tags. In order to reduce the cost of IC tags, it is important to establish a mechanism for reusing IC tags, as well as establishing inexpensive mass production technology.
[0004] ところで、 ICタグの構造としては、以下のようなものが一般的である。すなわち、図 1 8Aに示したように、ベースとなるポリエチレンテレフタレート(PET)フイノレム 111上に 、アンテナ 112を形成し、このアンテナに ICチップ 113を接続し、さらに、アンテナと I Cチップとを保護する保護フィルム (例えば PETフィルム) 114を、接着剤にて接着し 積層した構造である。 100は ICタグである。  [0004] Incidentally, the structure of an IC tag is generally as follows. That is, as shown in FIG. 18A, an antenna 112 is formed on a polyethylene terephthalate (PET) phenolic 111 serving as a base, an IC chip 113 is connected to the antenna, and the antenna and the IC chip are further protected. A protective film (for example, a PET film) 114 is bonded and laminated with an adhesive. 100 is an IC tag.
[0005] なお、 ICタグとしては、保護フィルムを用いず、熱硬化性の樹脂によるポッティング による構造のものも用いられている。すなわち、図 18Bに示したように、 PETフィルム 111上に、アンテナ 112を形成し、このアンテナに ICチップ 113を接続し、さらに、ァ ンテナと半導体チップとの接続部を、熱硬化性の樹脂(ポッティング) 115により、保 護する構造のものも用いられてレ、る。  [0005] Note that as the IC tag, a protective film is not used but a structure by potting with a thermosetting resin is also used. That is, as shown in FIG. 18B, an antenna 112 is formed on a PET film 111, an IC chip 113 is connected to the antenna, and a connection portion between the antenna and the semiconductor chip is connected to a thermosetting resin. According to (potting) 115, a protective structure is also used.
[0006] この ICタグを管理対象物(以下、対象物とも!/、う)に取り付ける方法としては、 ICタグ のベースフィルム裏面に貼り付けた両面接着テープを用いる力、、または塗布した接 着剤によることが多い。また、 ICタグを一旦対象物に取り付けると、取り外さないことを 前提とする使!/、方が一般的であった。 [0006] As a method of attaching this IC tag to an object to be managed (hereinafter referred to as "object!"), Force using a double-sided adhesive tape affixed to the back surface of the base film of the IC tag, or applied contact Often due to a dressing. Also, it was more common to use the IC tag assuming that it would not be removed once the IC tag was attached to the object.
[0007] ここで、対象物に貼付けた ICタグを再使用するためには、対象物から ICタグを取り 外さなければならない。 [0007] Here, in order to reuse an IC tag attached to an object, the IC tag must be removed from the object.
[0008] ICタグを取り外す際には、両面接着テープや接着剤の接着力を上回る力で、 ICタ グを引き剥がさなくてはならない。このとき、 ICタグが折れ曲がってしまい、アンテナと ICチップとの間で、電気的な接続がとれなくなることが多ぐ ICタグとして機能しなくな る、という問題がある。なお、 ICタグによる個別管理を重視し、対象物から ICタグが引 き剥がされたことにより、 ICタグの機能を失わせる発明があるほどである。  [0008] When removing the IC tag, the IC tag must be peeled off with a force exceeding the adhesive strength of the double-sided adhesive tape or adhesive. At this time, there is a problem that the IC tag is bent, and the electrical connection between the antenna and the IC chip is often lost, so that the IC tag does not function. In addition, there is an invention that loses the function of the IC tag by placing importance on individual management by the IC tag and peeling the IC tag from the object.
[0009] また、 ICタグの取り付けや取り外しを繰り返すと、アンテナと ICチップの接続部には [0009] If the IC tag is repeatedly attached and removed, the connection between the antenna and the IC chip
、何度もストレス力 Sかかることになり、電気的な接続がとれなくなってしまうこともある。 , Stress force S will be applied many times, and electrical connection may be lost.
[0010] さらに、 ICタグを取り外した後、対象物の表面には接着剤が残ってしまい、外観を 損なうこともあった。  [0010] Furthermore, after the IC tag is removed, the adhesive remains on the surface of the object, which may impair the appearance.
[0011] 特許文献 1は、宅配伝票の回収票部分に ICタグを接着したことを特徴とする ICタグ 付き宅配伝票を開示しており、 ICタグの回収を確実なものとしている。しかし、 ICタグ を再使用するには、回収票と ICタグとを洗浄液などを使って剥離しなければならな!/ヽ  [0011] Patent Document 1 discloses a home delivery slip with an IC tag, which is characterized in that an IC tag is attached to a collection slip portion of the home delivery slip, and ensures the collection of the IC tag. However, to reuse the IC tag, the collection slip and the IC tag must be peeled off using a cleaning solution!
[0012] また、特許文献 2は、ベース材と被覆材とを重ね合わせた内面に、 ICタグを接着せ ずに装填し、前記ベース材と被覆材と周囲を接着剤層で接合した ICタグ封入体が開 示されている。このような構成により、 ICタグを取り出しやすくし、容易に再利用できる ようにしている。しかし、 ICタグ封入体そのものは、管理対象物に接着剤層を介して 接着している。 [0012] Further, Patent Document 2 describes an IC tag in which an IC tag is loaded on an inner surface where a base material and a covering material are overlapped without bonding, and the base material, the covering material, and the periphery are joined by an adhesive layer. The inclusion body is disclosed. With this configuration, the IC tag can be easily removed and reused easily. However, the IC tag enclosure itself is adhered to the management object via an adhesive layer.
[0013] 特許文献 3は、 ICタグを対象物に取り付ける機構として、 ICタグを有したクリップを 提案している。しかし、クリップを使用しなければならず、汎用性に乏しいという問題が あった。  Patent Document 3 proposes a clip having an IC tag as a mechanism for attaching the IC tag to an object. However, there was a problem that the clip had to be used and the versatility was poor.
[0014] 特許文献 4には、耐熱性の保護フィルムで小袋を形成し、その中に ICタグ (RFIDタ グ)を封入することが提案されている。しかし、管理対象物への取り付け方については 、何ら開示されていない。 [0015] 特許文献 5には、 ICチップとアンテナとを搭載したフィルム状の回路部の上下両面 に、ウレタン樹脂を貼り合わせて保護する、衣類用の ICタグ (RFIDタグ)が提案され ている。このウレタン樹脂の柔軟性や弾力性クッションにより、 ICチップとアンテナとを 保護している。衣類への取り付けは、両面接着シート (テープ)による方法などが開示 されている。 [0014] Patent Document 4 proposes forming a small bag with a heat-resistant protective film and enclosing an IC tag (RFID tag) therein. However, there is no disclosure about how to attach to the management object. [0015] Patent Document 5 proposes an IC tag for clothing (RFID tag) in which urethane resin is bonded and protected on both the upper and lower surfaces of a film-like circuit portion on which an IC chip and an antenna are mounted. . The IC chip and the antenna are protected by the flexibility and elasticity of this urethane resin. For the attachment to clothing, a method using a double-sided adhesive sheet (tape) is disclosed.
[0016] 特許文献 6には、トレーの収納部に ICタグインレットをセットし、そこに樹脂を流して 埋め込んで一体化構造とした、クリーニング用 ICタグ (RFIDタグ)が提案されている。  [0016] Patent Document 6 proposes a cleaning IC tag (RFID tag) in which an IC tag inlet is set in a tray storage portion, and resin is poured into the tray storage portion to embed it into an integrated structure.
ICタグインレットの ICチップやアンテナコイルは、熱硬化性樹脂によって保護されて いる。なお、衣類への取り付けについては、何ら開示されていない。  The IC chip and the antenna coil of the IC tag inlet are protected by a thermosetting resin. There is no disclosure about attachment to clothing.
[0017] また、耐薬品性や耐熱性を有する RFIDタグに関して、特許文献 7には、片面に熱 接着層を有する 2枚のプラスチックフィルムを熱接着させて、アンテナ回路及び ICチ ップを挟み込む ICタグ (RFIDタグ)の製造方法が提案されている。この熱接着とは、 2枚のプラスチックフィルムに、ヒートプレスゃラミネーターによって熱を加えて、熱接 着層を溶融させて、フィルム同士を接着する方法である。さらに、上記プラスチックフ イルムの少なくとも一方を、空洞を含有するポリエステルフィルムとすることも提案され ている。これは、そのクッション性を利用して、アンテナなどの凹凸を吸収し、タグ表面 に凹凸が浮き出す問題を軽減している。  [0017] Further, regarding RFID tags having chemical resistance and heat resistance, Patent Document 7 describes that an antenna circuit and an IC chip are sandwiched by thermally bonding two plastic films each having a thermal adhesive layer on one side. An IC tag (RFID tag) manufacturing method has been proposed. This thermal bonding is a method in which heat is applied to two plastic films with a heat press laminator to melt the thermal adhesive layer and bond the films together. Furthermore, it has also been proposed that at least one of the plastic films is a polyester film containing cavities. This uses the cushioning properties to absorb the unevenness of the antenna, etc., and alleviates the problem of unevenness appearing on the tag surface.
特許文献 1 :特開 2006— 001069号公報  Patent Document 1: Japanese Unexamined Patent Application Publication No. 2006-001069
特許文献 2:特開 2002— 157569号公幸  Patent Document 2: JP 2002-157569 Koyuki
特許文献 3 :特開 2005— 216275号公報  Patent Document 3: Japanese Patent Laid-Open No. 2005-216275
特許文献 4:特開 2001— 66990号公報  Patent Document 4: Japanese Patent Laid-Open No. 2001-66990
特許文献 5:特開 2005— 56362号公幸  Patent Document 5: JP 2005-56362 Koyuki
特許文献 6 :特開 2006— 95153号公報  Patent Document 6: Japanese Unexamined Patent Publication No. 2006-95153
特許文献 7 :特開 2005— 209171号公報  Patent Document 7: Japanese Unexamined Patent Application Publication No. 2005-209171
発明の開示  Disclosure of the invention
[0018] 本発明は、 ICタグを再使用可能にするために、管理対象物に取り付け取り外しが 容易な RFIDタグ構造体を提供する。また、 ICタグを取り外した後の管理対象物の外 観を損なうことのない RFIDタグ構造体を提供する。さらに本発明は、接着剤等を使 用することなぐ耐熱性のある RFIDタグ構造体を提供する。 The present invention provides an RFID tag structure that can be easily attached to and detached from an object to be managed in order to make the IC tag reusable. It also provides an RFID tag structure that does not impair the appearance of the management target after the IC tag is removed. Furthermore, the present invention uses an adhesive or the like. To provide a heat resistant RFID tag structure that can be used.
[0019] 本発明の RFIDタグ構造体は、ベースフィルム表面に、アンテナとこれに接続される 半導体チップとが形成された RFIDタグと、前記 RFIDタグの表面又は裏面の少なくと も一方に、シートフィルムを介して又は介さず、表面に微小な吸盤を多数有すること により吸着機能を有する発泡樹脂シート層を備えたことを特徴とする。 [0019] The RFID tag structure of the present invention includes a RFID tag in which an antenna and a semiconductor chip connected thereto are formed on the surface of a base film, and a sheet on at least one of the front surface or the back surface of the RFID tag. It is characterized by having a foamed resin sheet layer having an adsorption function by having a large number of fine suction cups on the surface with or without a film.
[0020] 本発明の耐熱性のある RFIDタグ構造体は、前記吸着機能を有する発泡樹脂シー ト層の吸着面力 前記アンテナ及びこれに接続されている半導体チップに直接吸着 している構造である。 [0020] The heat-resistant RFID tag structure of the present invention has a structure in which the foaming resin sheet layer having the adsorption function is adsorbed directly to the antenna and the semiconductor chip connected thereto. .
図面の簡単な説明  Brief Description of Drawings
[0021] [図 1A]図 1Aは、本発明の実施例 1の断面模式図である。  FIG. 1A is a schematic sectional view of Example 1 of the present invention.
[図 1B]図 1Bは、同実施例 1に用いた発泡性のアクリル樹脂の表面を観察した結果で ある。  FIG. 1B shows the result of observing the surface of the foamable acrylic resin used in Example 1.
[図 1C]図 1Cは、同実施例 1に用いた発泡性のアクリル樹脂の断面を観察した結果で ある。  FIG. 1C is a result of observing a cross section of the foamable acrylic resin used in Example 1.
[図 1D]図 1Dは、同実施例 1の変形例の断面模式図である。  FIG. 1D is a schematic cross-sectional view of a modification of the first embodiment.
[図 1E]図 1Eは、同実施例 1の別変形例の平面図である。  FIG. 1E is a plan view of another modification of the first embodiment.
[図 2A]図 2Aは、同実施例 2の断面模式図である。  FIG. 2A is a schematic sectional view of Example 2. FIG.
[図 2B]図 2Bは、同実施例 2の変形例の断面模式図である。  FIG. 2B is a schematic cross-sectional view of a modification of the second embodiment.
[図 3A]図 3Aは、同実施例 3の断面模式図である。  FIG. 3A is a schematic cross-sectional view of Example 3. FIG.
[図 3B]図 3Bは、同実施例 3の変形例の断面模式図である。  FIG. 3B is a schematic cross-sectional view of a modified example of Example 3.
[図 4A]図 4Aは、同実施例 4の断面模式図である。  FIG. 4A is a schematic sectional view of Example 4. FIG.
[図 4B]図 4Bは、同実施例 4の変形例の断面模式図である。  FIG. 4B is a schematic cross-sectional view of a modification of the fourth embodiment.
[図 5]図 5は、同柔軟性を有する樹脂をスクリーン印刷して、微小な吸盤を多数形成し て吸着層とした例である。  [FIG. 5] FIG. 5 shows an example in which an adsorption layer is formed by screen-printing a resin having the same flexibility to form a large number of small suction cups.
[図 6]本発明に用いられる両面吸着可能な発泡樹脂シートの概略断面図である。  FIG. 6 is a schematic cross-sectional view of a double-sided adsorbable foamed resin sheet used in the present invention.
[図 7]本発明に用いた発泡樹脂シートの吸着面を、走査型電子顕微鏡にて観察した 写真である。  FIG. 7 is a photograph of the adsorption surface of the foamed resin sheet used in the present invention, observed with a scanning electron microscope.
[図 8]同発泡樹脂シートの断面を、走査型電子顕微鏡にて観察した写真である。 [図 9]本発明の実施例 5における情報管理タグの断面図である。 FIG. 8 is a photograph of a cross section of the foamed resin sheet observed with a scanning electron microscope. FIG. 9 is a sectional view of an information management tag in Embodiment 5 of the present invention.
[図 10]図 9における RFIDタグの斜視図である。  FIG. 10 is a perspective view of the RFID tag in FIG.
[図 11]同、情報管理タグを自動車用ウィンドシールドガラスに吸着させた断面図であ  [Fig. 11] A cross-sectional view of the information management tag adsorbed on an automotive windshield glass.
[図 12]同、情報管理タグを自動車用ウィンドシールドガラスに吸着させた平面図であ [Fig. 12] A plan view of the information management tag adsorbed on a car windshield glass.
[図 13]本発明の実施例 5で用いた発泡樹脂シートを、 150°C、 90分間熱処理した後 の吸着面を、走査型電子顕微鏡にて観察した写真である。 FIG. 13 is a photograph obtained by observing the adsorption surface of the foamed resin sheet used in Example 5 of the present invention after heat treatment at 150 ° C. for 90 minutes with a scanning electron microscope.
[図 14]本発明の実施例 6における情報管理タグの断面図である。  FIG. 14 is a sectional view of an information management tag in Embodiment 6 of the present invention.
[図 15]本発明の実施例 7における情報管理タグの断面図である。  FIG. 15 is a cross-sectional view of an information management tag in Embodiment 7 of the present invention.
[図 16]本発明の実施例 8における情報管理タグの断面図である。  FIG. 16 is a sectional view of an information management tag in Embodiment 8 of the present invention.
[図 17]本発明の実施例 9における情報管理タグの断面図である。  FIG. 17 is a cross-sectional view of an information management tag in Embodiment 9 of the present invention.
[図 18]図 18Aおよび図 18Bは、従来の一般的な ICタグの断面模式図である。  FIG. 18A and FIG. 18B are schematic cross-sectional views of conventional general IC tags.
発明を実施するための最良の形態  BEST MODE FOR CARRYING OUT THE INVENTION
[0022] 本発明の RFIDタグ構造体では、管理対象物と接する面を、微小な吸盤を多数備 えた吸着構造としている。これにより、管理対象物との吸着が繰り返し可能であり、再 使用可能で、かつ管理対象物の表面に、付着痕跡を残さない RFIDタグ構造体を提 供できる。すなわち、製品等と接する面には粘着剤や接着剤を使用しないので、付 着痕跡を残すことはない。また、再使用可能になると、高価な RFIDタグを使用しても 、 1回使用当たりのコストを下げることができる。  [0022] In the RFID tag structure according to the present invention, the surface in contact with the management target has an adsorption structure provided with a number of minute suction cups. As a result, it is possible to provide an RFID tag structure that can be repeatedly adsorbed to the management object, can be reused, and does not leave an adhesion trace on the surface of the management object. In other words, no adhesive or adhesive is used on the surface that comes into contact with the product, so there will be no trace of adhesion. Also, when it becomes reusable, even if expensive RFID tags are used, the cost per use can be reduced.
[0023] 本発明による RFIDタグ構造体は、レ、ずれかのフィルムを剛性部材とすることが好ま しい。また、本発明による RFIDタグ構造体は、さらに樹脂剛性板を積層して構成され てもよい。  [0023] In the RFID tag structure according to the present invention, it is preferable that one of the films is a rigid member. The RFID tag structure according to the present invention may be configured by further laminating a resin rigid plate.
[0024] さらに、本発明による RFIDタグ構造体における吸着構造は、例えばアクリル系樹 脂を発泡させた発泡樹脂シートからなることが好ましい。  [0024] Further, the adsorption structure in the RFID tag structure according to the present invention is preferably made of, for example, a foamed resin sheet obtained by foaming acrylic resin.
[0025] さらに、 RFIDタグ構造体において、それを構成するフィルムを剛性部材とする、ま たは剛性樹脂板を積層して構成されると、取り外す際に過度に折れ曲がることがなく 、アンテナと半導体チップとの電気的な接続不良を防止できる。 [0026] 例えば、表面の微小な吸盤を有するシートを対象物に吸着させた場合、シートの端 部が捲れ上がると剥がれやすくなる。本発明による RFIDタグ構造体において、上述 のように剛性ある構成とすると、端部の捲れ上がりを抑えることができるので、通常の 使用程度では外れにくい RFIDタグ構造体とすることができる。 [0025] Further, in the RFID tag structure, when the film constituting the RFID tag structure is made of a rigid member or laminated with a rigid resin plate, the antenna and the semiconductor are not bent excessively when removed. A poor electrical connection with the chip can be prevented. [0026] For example, when a sheet having a fine suction cup on the surface is adsorbed to an object, the sheet is easily peeled off when the end of the sheet is rolled up. If the RFID tag structure according to the present invention has a rigid configuration as described above, it is possible to prevent the end from rolling up, and thus it is possible to obtain an RFID tag structure that is difficult to come off in a normal use level.
[0027] なお本明細書において、吸着とは、微小な吸盤による吸い付きという意味で用い、 いわゆる化学的な吸着や物理的な吸着とは異なる。  [0027] In the present specification, adsorption is used to mean adsorption by a fine suction cup, and is different from so-called chemical adsorption or physical adsorption.
[0028] このように、本発明による RFIDタグ構造体では、その表面または裏面の少なくとも 一方に吸着構造を有しているので、平滑な表面を有する対象物に簡単に取り付ける こと力 Sでさる。  [0028] Thus, the RFID tag structure according to the present invention has an adsorption structure on at least one of the front surface and the back surface thereof, so that it can be easily attached to an object having a smooth surface with a force S.
[0029] また、吸着面には接着剤を介在させる必要がなぐ RFIDタグを取り外した際に、接 着剤が残らな!/、ので、管理対象物の外観を損なうことがなレ、。  [0029] In addition, the adhesive does not need to be interposed on the adsorption surface. When the RFID tag is removed, no adhesive remains! /, So that the appearance of the management target is not impaired.
[0030] 本発明の吸着構造としては、発泡樹脂シートの技術を応用するか、柔軟性を有す る樹脂を吸盤構造とする印刷技術にて形成させるとよい。この発泡樹脂シートは、ァ クリル系樹脂、シリコーンゴム、シリコーンゲル、フッ素ゴム等の樹脂を原料とする。好 ましくは弾性樹脂を使用する。樹脂原料に空気などの気体を加えて機械的発泡機に かけ、シート成形し、乾燥及び加硫又は架橋させる。シート成形をした後に、シート表 面から気体が抜けたり泡が破壊して発泡痕が発生する。この発泡痕をそのまま残して 加硫又は架橋させると、泡状穴部からなる吸盤 (以下、泡状吸盤ともいう。)が形成さ れる。この泡状吸盤の好ましい数は、 1万〜 3万個 /cm2である。この泡状吸盤により 管理対象物体との吸着が繰り返し可能となる。なおシート内には独立発泡が残って いる。 [0030] The adsorbing structure of the present invention may be formed by applying a foamed resin sheet technique or by a printing technique using a flexible resin as a suction cup structure. This foamed resin sheet is made of a resin such as acrylic resin, silicone rubber, silicone gel, or fluororubber. Preferably, an elastic resin is used. A gas such as air is added to the resin raw material, and it is subjected to a mechanical foaming machine, formed into a sheet, dried and vulcanized or crosslinked. After forming the sheet, gas escapes from the surface of the sheet or bubbles are destroyed and foam marks are generated. If this foaming mark is left as it is, vulcanization or crosslinking is carried out to form a suction cup (hereinafter also referred to as a foam suction cup) consisting of a foam hole. A preferable number of the foam suction cups is 10,000 to 30,000 / cm 2 . This foam suction cup can be repeatedly attracted to the object to be managed. Independent foaming remains in the sheet.
[0031] 泡状吸盤の別の材料としては、ポリスチレン系エラストマ一(例えば旭化成工業社 製商品名"タフプレン"、 "タフテック")、ォレフィン系エラストマ一(例えば JSR社製商 品名"ダイナロン CEBC"、三井化学社製商品名"ミストラマー")、ウレタン系エラストマ 一、エステノレ系エラストマ一、アミド系エラストマ一、塩素化ポリエチレン系エラストマ 一、 Syn-1,2-ポリブタジエン、 Trans_l,4-ポリイソプレン、フッ素系エラストマ一などが 使用できる。これらは工業調査会発行「プラスチック 'データブック」 1999年 12月 1日 、 854〜857頁に記載されており、本発明においてもこれらに記載されているポリマ 一を使用できる。 [0031] Other materials for the foam sucker include polystyrene elastomers (for example, trade names “Tuffprene” and “Tough Tech” manufactured by Asahi Kasei Kogyo Co., Ltd.), olefin elastomers (for example, product name “Dynalon CEBC” manufactured by JSR, Mitsui Chemicals, trade name "Mistramer"), urethane elastomer, estenore elastomer, amide elastomer, chlorinated polyethylene elastomer, Syn-1,2-polybutadiene, Trans_l, 4-polyisoprene, fluorine Elastomer can be used. These are described in the “Plastics' Data Book” published by the Industrial Research Council, December 1, 1999, pp. 854-857, and in the present invention the polymers described therein are also described. One can be used.
[0032] 泡状吸盤の平均直径は 1〜300 111の範囲が好ましい。管理対象物と接する面に は、粘着剤および接着剤を存在させない。粘着剤や接着剤は耐熱性が問題となり、 かつ取り外した後に痕が残る問題がある。  [0032] The average diameter of the foam suction cup is preferably in the range of 1 to 300 111. There should be no pressure-sensitive adhesive or adhesive on the surface in contact with the controlled object. Adhesives and adhesives have a problem of heat resistance, and there is a problem that marks remain after they are removed.
[0033] さらに、本発明の RFIDタグ構造体では、 ICタグの ICチップとアンテナを保護するた めに、この発泡樹脂シートが直接吸着され、 ICタグのベースフィルムと発泡樹脂シー トとが、一体化されているとよい。  [0033] Furthermore, in the RFID tag structure of the present invention, in order to protect the IC chip and the antenna of the IC tag, the foamed resin sheet is directly adsorbed, and the base film of the IC tag and the foamed resin sheet are It is good to be integrated.
[0034] このような発泡樹脂シートが、以下のような商品名で市販されている。ゼオン ALシ ート (ゼオン化成 (株))、ダイヤフィット (ダイヤミック (株))、ぴたっと君 (大庫洋紙 (株) )などである。これら発泡樹脂シートは、接着剤などを用いていないので、剥がした跡 に接着剤などが残らなレ、とレ、う特徴を有してレ、る。  [0034] Such a foamed resin sheet is commercially available under the following trade names. These include Zeon AL Sheet (Zeon Kasei Co., Ltd.), Diafit (Diamic Co., Ltd.), Pitatto-kun (Ookura Paper Co., Ltd.). Since these foamed resin sheets do not use an adhesive or the like, the foamed resin sheet has a characteristic that the adhesive or the like remains on the peeled mark.
[0035] また、印刷技術を利用した吸着構造としては、例えば特開平 6— 238845号公報に 開示された方法によって製造すればよい。これは、「柔軟質化したインキ様物質をス クリーン印刷方法により網目状の吸盤型の連続した紋様を印刷して」吸盤を形成する 方法である。また、特開 2000— 274421号公報にも、同様の技術が開示されている [0035] The adsorption structure using the printing technique may be manufactured by, for example, a method disclosed in Japanese Patent Laid-Open No. 6-238845. This is a method for forming a sucker by “printing a continuous sucker-type pattern of mesh-like suckers on a softened ink-like substance by a screen printing method”. Japanese Patent Laid-Open No. 2000-274421 also discloses a similar technique.
Yes
[0036] 本発明の RFIDタグ構造体を管理対象物に吸着させるには、手で軽く押圧するだ けでよい。これにより、例えば 80〜90kg/cm2程度の吸着力が得られる。 RFIDタグ 構造体を管理対象物体から取り外す際には、端側から剥がすことにより簡単に取り外 せる。 RFIDタグ構造体は吸着により貼り付いているだけであるから、取り外した後に 痕は残らない。 [0036] In order to adsorb the RFID tag structure of the present invention to an object to be managed, it is only necessary to lightly press it with a hand. Thereby, for example, an adsorption force of about 80 to 90 kg / cm 2 can be obtained. When removing the RFID tag structure from the object to be managed, it can be easily removed by peeling it off from the edge. Since the RFID tag structure is only attached by adsorption, no trace remains after removal.
[0037] 本発明の RFIDタグ構造体は、ベースフィルムの表面に半導体チップとこれに接続 するアンテナを備えている。これにより、アンテナから電磁誘導により電力が半導体チ ップに供給され、様々な管理情報が書き込まれる。例えば品種、原材料、生産履歴、 用途、ユーザー名、仕向け地等様々な情報である。これらの情報が正確に読み込ま れると、生産管理、供給管理、品質管理等多くの管理に使用することができ有用であ  [0037] The RFID tag structure of the present invention includes a semiconductor chip and an antenna connected to the semiconductor chip on the surface of the base film. As a result, electric power is supplied from the antenna to the semiconductor chip by electromagnetic induction, and various management information is written. For example, various information such as varieties, raw materials, production history, usage, user name, destination, etc. If this information is read correctly, it can be used for many managements such as production management, supply management, and quality control.
[0038] 本発明の耐熱性のある RFIDタグ構造体は、ベースフィルム表面上に、半導体チッ プとこれに接続するアンテナが形成された RFIDタグと、第 1フィルムシートの少なくと も一主表面に、多数の泡状穴部を形成して吸着面とした第 1発泡樹脂シートとを備え 、前記樹脂シートの吸着面が、前記半導体チップと前記アンテナとに直接吸着され ている。この構成により、情報管理タグにおいて、半導体チップとアンテナを保護する 保護部材を接着剤等で固定していないので、加熱されることによる接着剤等に起因 する問題が生じることはない。また、用いた発泡樹脂シートは、変質したり変色したり することがない。し力、も、発泡樹脂シートは、空気を泡状に多く含んでいるので断熱性 があり、耐熱性も高い。したがって、本発明によれば、耐熱性の高い情報管理タグが 得られる。 [0038] The heat-resistant RFID tag structure of the present invention has a semiconductor chip on the surface of the base film. RFID tag on which the antenna and the antenna connected to the RFID tag are formed, and a first foamed resin sheet having a large number of bubble holes formed on at least one main surface of the first film sheet as an adsorption surface. The adsorption surface of the resin sheet is directly adsorbed to the semiconductor chip and the antenna. With this configuration, in the information management tag, since the protective member for protecting the semiconductor chip and the antenna is not fixed with an adhesive or the like, there is no problem caused by the adhesive or the like caused by heating. Further, the used foamed resin sheet does not change in quality or discolor. However, since the foamed resin sheet contains a large amount of air in the form of foam, it has heat insulation properties and high heat resistance. Therefore, according to the present invention, an information management tag with high heat resistance can be obtained.
[0039] 本発明に用いられる発泡樹脂シートは、製造時に樹脂に気体を混ぜ込むことにより 得られる。このため樹脂自体は、基本的に独立気泡を含んでなる発泡体であり、空気 を含んでいるので断熱性があり、耐熱性も高い。またこの発泡樹脂シートは、柔軟性 もあり、発泡体でありクッション性もあるので、半導体チップとアンテナとを、接触等に よる破損から十分に保護できる。  [0039] The foamed resin sheet used in the present invention can be obtained by mixing gas into the resin during production. For this reason, the resin itself is basically a foam containing closed cells, and since it contains air, it has heat insulation properties and high heat resistance. In addition, since this foamed resin sheet has flexibility, is a foam, and has cushioning properties, the semiconductor chip and the antenna can be sufficiently protected from damage due to contact or the like.
[0040] 本発明の情報管理タグは、さらに泡状穴部を設けてその吸着面を外側に配する構 成を有しているとよい。この吸着面により、管理対象物との取り付け取り外しが繰り返 し可能となる。  [0040] The information management tag of the present invention preferably has a configuration in which a bubble hole is further provided and the suction surface is arranged on the outside. With this suction surface, it is possible to repeat attachment and removal with the management object.
[0041] 本発明による情報管理タグは、さらに硬質の樹脂板またはフィルムを積層して構成 されてもよい。硬質の樹脂板またはフィルムを積層して構成されていると、取り外す際 に、情報管理タグが過度に折られたり曲げられたりすることがなぐ半導体チップとァ ンテナとの電気的な接続がとれなくなるおそれがない。  [0041] The information management tag according to the present invention may be configured by further laminating a hard resin plate or film. If it is configured by laminating a hard resin plate or film, the information management tag will not be folded or bent excessively when it is removed, and the semiconductor chip and the antenna cannot be electrically connected. There is no fear.
[0042] さらに、本発明に用いられる発泡樹脂シートは、その端部が捲れ上がると剥がれや すくなる傾向がある。情報管理タグが硬質の樹脂板またはフィルムを積層して構成さ れていると、端部の捲れ上がりを抑えることができるので、通常の使用程度では外れ にくい情報管理タグとすることができる。  [0042] Furthermore, the foamed resin sheet used in the present invention tends to be easily peeled off when its end is rolled up. If the information management tag is configured by laminating a hard resin plate or film, it is possible to prevent the edge from rolling up, so that the information management tag cannot be easily removed in the normal use.
[0043] さらに、硬質の樹脂板またはフィルムを、取り付け手段の反対側の最外部に配した 構成の情報管理タグでは、 ICチップとアンテナとがより十分に保護される。  [0043] Furthermore, in the information management tag having a configuration in which a hard resin plate or film is disposed on the outermost side opposite to the attachment means, the IC chip and the antenna are more sufficiently protected.
[0044] 本発明の耐熱性のある RFIDタグ構造体は、発泡樹脂シートの吸着面が、半導体 チップとアンテナとに直接吸着されている。このため、情報管理タグが高温に曝され ても、接着剤等を使用していないので、接着剤等が硬化し収縮したりすることがない[0044] In the heat-resistant RFID tag structure of the present invention, the adsorption surface of the foamed resin sheet has a semiconductor Directly adsorbed to the chip and antenna. For this reason, even if the information management tag is exposed to a high temperature, since the adhesive is not used, the adhesive does not cure and shrink.
。このため、 ICチップとアンテナとの接合部に、特に応力力 sかかることがないので、本 発明の情報管理タグは、耐熱性に優れたものとなる。 . For this reason, since the stress force s is not particularly applied to the joint between the IC chip and the antenna, the information management tag of the present invention is excellent in heat resistance.
[0045] さらに、本発明の情報管理タグの管理対象物と接する面にも、発泡樹脂シートが備 えられているとよい。この樹脂シートの吸着作用により、管理対象物への取り付け取り 外しが、繰り返し可能となる。その結果、再使用が可能で、管理対象物に付着の痕跡 を残さない情報管理タグを提供できる。このように、再使用が可能になると高価な RFI Dタグを使用しても、 1回使用当たりのコストを下げることができる。  [0045] Further, it is preferable that a foamed resin sheet is provided on the surface of the information management tag of the present invention that contacts the management target. Due to the adsorption action of this resin sheet, it is possible to repeatedly attach and remove it to the management object. As a result, it is possible to provide an information management tag that can be reused and does not leave any trace of adhesion on the management target. In this way, once reuse becomes possible, the cost per use can be reduced even if an expensive RFI D tag is used.
[0046] 加えて、本発明の情報管理タグが硬質の樹脂板またはフィルムを積層して構成さ れていると、情報管理タグを安全に取り扱うことができる。また、取り付け取り外しを繰 り返しても、 RFIDタグを痛める虞がない。  [0046] In addition, when the information management tag of the present invention is configured by laminating a hard resin plate or film, the information management tag can be handled safely. Moreover, there is no risk of damaging the RFID tag even after repeated mounting and removal.
[0047] 耐熱性のある情報管理タグを得るために、以下のような予備検討を行った。  [0047] In order to obtain a heat-resistant information management tag, the following preliminary examination was performed.
[0048] 1.予備検討 1  [0048] 1. Preliminary study 1
通常仕様の RFIDタグ(ベースフィルム、保護フィルムともに PET製)を、その裏面に 予め付着されている接着剤層でガラス板に貼り付けた。それを恒温槽に入れて、約 1 30°Cまで昇温し 90分間保つという、熱サイクルを何回か繰り返し、 RFIDタグの熱に よる変化を確認した。  A standard RFID tag (both base film and protective film made of PET) was affixed to the glass plate with an adhesive layer attached in advance to the back side. We put it in a thermostatic bath, raised the temperature to about 130 ° C, and kept it for 90 minutes, repeating the heat cycle several times, and confirmed the change due to the heat of the RFID tag.
[0049] その結果、 RFIDタグは熱の影響により、特に端部においてフィルムが収縮している ことが観察された。また保護フィルムにおいて、その傾向が顕著であることも認められ た。さらに熱サイクルを何回力、繰り返すと、読み取りができなくなる RFIDタグも認めら れた。このことから、フィルムの収縮により、半導体チップとアンテナとの接合部に応 力がかかり、その電気的な接続が不確実になりうることが予想された。  [0049] As a result, it was observed that the film of the RFID tag was shrunk particularly at the edge due to the influence of heat. It was also recognized that the tendency was remarkable in the protective film. In addition, RFID tags that could not be read after several cycles of thermal cycling were recognized. From this, it was expected that due to the shrinkage of the film, stress was applied to the joint between the semiconductor chip and the antenna, and the electrical connection could be uncertain.
[0050] 2.予備検討 2  [0050] 2. Preliminary study 2
予備検討 1から得られた知見から、 RFIDタグのフィルムの収縮を抑え込むために、 ガラス板に貼り付けた RFIDタグの上にさらにテープを貼り付けて、オートクレーブ中 で約 1. 5MPa (15気圧)の加圧下で、温度 150°Cで、 90分間の加熱する、加熱実 験を実施した。テープとしては、フッ素樹脂テープ(寺岡製作所製 No.841, 日東電 ェ製ニトフロン No.903UL)や、ポリエステルテープ(寺岡製作所製 No.631S)を用 いた。 Based on the findings from Preliminary Study 1, in order to suppress the shrinkage of the RFID tag film, another tape was applied on the RFID tag attached to the glass plate, and approximately 1.5 MPa (15 atm) in the autoclave. A heating experiment was performed in which heating was performed at 150 ° C. for 90 minutes under the pressure of the above. Fluoropolymer tape (No.841, manufactured by Teraoka Seisakusho, Nittoden) Nitoflon No.903UL) and polyester tape (Teraoka Seisakusho No.631S) were used.
[0051] RFIDタグについては、フィルムの収縮状況を確認するために、構造の異なる RFI Dタグを 3種類準備し、オートクレープによる加熱実験に供した。準備した RFIDタグ は、それぞれ以下のような構造を有している。  [0051] Regarding RFID tags, three types of RFI D tags with different structures were prepared and used for heating experiments with autoclave to confirm the shrinkage of the film. Each prepared RFID tag has the following structure.
( 1 )通常タイプ:ベースフィルムに比べて、保護フィルムの厚みが薄いタイプ  (1) Normal type: Type with a thinner protective film than the base film
(2)保護フィルムが厚!/、タイプ:保護フィルムに、ベースフィルムと同じフィルムを用い たタイプ  (2) Protective film is thick! /, Type: Type that uses the same protective film as the base film
(3)ランドリータイプ:クリーニングに適用できるように開発された RFIDタグで、上記( 2)のタイプの RFIDタグに、さらにラミネート加工をしたとされるタイプ  (3) Laundry type: An RFID tag developed to be applicable to cleaning, and a type that is said to be further laminated to the RFID tag of type (2) above
[0052] 予備検討 2の結果、耐熱性のあるフッ素樹脂テープを用いても、使われて!/、る接着 剤が熱により硬化して収縮し、 RFIDタグに歪みを与えていた。また、保護フィルムを 貝占り付ける際に取り込まれたと思われる空気力 加熱によって膨張して、保護フィルム が縮むような方向に力力 Sかかることとなり、さらに RFIDタグに歪みを与えていた。その ことによると思われる力 ID情報の読み取りができなくなつていた。  [0052] As a result of Preliminary Study 2, even if a heat-resistant fluororesin tape was used, the adhesive used was hardened and contracted by heat, and the RFID tag was distorted. In addition, it was expanded by aerodynamic heating that seems to have been taken in when the protective film was taken into the shellfish, and the force S was applied in the direction in which the protective film was contracted, which further distorted the RFID tag. Force that seems to be due to that I could not read ID information.
[0053] また、上述した 3つのタイプのいずれの RFIDタグにおいても、上述した結果 1と同 様の結果であり、 D 情報の読み取りができなくなつていた。  [0053] Further, in any of the above three types of RFID tags, the result was the same as the result 1 described above, and D information could not be read.
[0054] 以上のことから、 ICチップとアンテナとを保護する部材力 例え耐熱性を有して!/、て も、接着剤によって固定されていると、接着剤が熱により硬化して収縮する。そのため 、 RFIDタグに歪みを与え、 RFIDタグにおいて D 情報の読み取りができなくなる不 具合が起こっている。そこで、 RFIDタグを耐熱性あるものとするためには、接着剤に よらず固定する必要がある、という知見を得た。  [0054] From the above, the member strength for protecting the IC chip and the antenna has heat resistance, for example! / Even if it is fixed with an adhesive, the adhesive is cured by heat and shrinks. . For this reason, the RFID tag is distorted and D information cannot be read by the RFID tag. Therefore, we have found that it is necessary to fix the RFID tag regardless of the adhesive to make it heat resistant.
[0055] 保護部材を接着剤によらず固定する方法として、まず粘着材について検討した。粘 着材は、耐熱性のある材料を選択すれば、適用が可能と思われる。  [0055] As a method for fixing the protective member without using an adhesive, first, an adhesive material was examined. Adhesive material can be applied if a heat-resistant material is selected.
[0056] しかし、粘着材の表面に埃や汚れが付着すると、粘着力が極端に落ちる。このため 、実用的な観点から適当でないと判断した。  [0056] However, if dust or dirt adheres to the surface of the adhesive material, the adhesive strength is extremely reduced. For this reason, it was judged that it was not suitable from a practical viewpoint.
[0057] つぎに、吸盤による固定を考えた。シリコーンゴムなどをモールド成形し表面に吸盤 を多数形成した吸盤シートについて、検討した。予備実験として、ガラス板に吸盤シ ートを取り付けて、オートクレーブ中で約 1. 5MPa (15気圧)の加圧下で、温度 150 °Cで 90分間の加熱をした。その結果、吸盤シートは、その一部がガラス板に溶着して しまった。また、一旦吸盤シートを取り外すと、再使用はできなかった。以上より、吸盤 シートは適当でないと判断した。 Next, fixing with a suction cup was considered. We examined a sucker sheet that was molded with silicone rubber and formed many suction cups on the surface. As a preliminary experiment, a suction cup And heated for 90 minutes at a temperature of 150 ° C. under a pressure of about 1.5 MPa (15 atm) in an autoclave. As a result, a part of the sucker sheet was welded to the glass plate. Moreover, once the suction cup sheet was removed, it could not be reused. Based on the above, it was judged that the suction cup sheet was not appropriate.
[0058] さらに、ミクロな吸盤による固定を考えた。例えばアクリル系樹脂を発泡させ、その表 面に多数の泡状穴部を形成して吸着面とした発泡樹脂シートを、 RFIDタグの保護フ イルムとして用いてみた。 PET製保護フィルムがなぐ ICチップとアンテナとが露出さ れている RFIDタグ(以下ベア ICタグともいう)に、上述の発泡樹脂シートを吸着させ て、オートクレーブ中で約 1. 5MPa (15気圧)の加圧下で、温度 150°Cで 90分間の 加熱をした。加熱した後、 RFIDタグを観察したところ、外観には特に変化がなぐ ID 情報の読み取りにも問題がなかった。  [0058] Further, fixing with a micro suction cup was considered. For example, we used a foamed resin sheet made by foaming acrylic resin and forming a large number of foam holes on the surface to make it an adsorption surface, and used it as a protective film for RFID tags. The above-mentioned foamed resin sheet is adsorbed to an RFID tag (hereinafter also referred to as a bare IC tag) that has an IC chip and an antenna exposed by a PET protective film, and is about 1.5 MPa (15 atm) in an autoclave. And heating for 90 minutes at a temperature of 150 ° C. When the RFID tag was observed after heating, there was no problem in reading the ID information, which did not change in appearance.
[0059] 3.予備検討 3  [0059] 3. Preliminary study 3
さらに、 RFIDタグを商品等に取り付ける構造として、この発泡樹脂シートの吸着面 を適用してみた。検討のため、ガラス板にこの発泡樹脂シートを吸着させて、オートク レーブ中で加熱実験を行った。オートクレーブは、熱風の循環によって加熱しており 、その内部では 3〜4m/秒の速度の熱風に曝される。加熱実験の結果、発泡樹脂 シートは、ガラス板に吸着した状態を保っていた。さらに、熱風の吹き付けによる発泡 樹脂シートの端部の捲れ上がりは、認められなかった。以上より、 RFIDタグを商品等 に取り付ける構造としても、この発泡樹脂シートは有用であることがわかった。  Furthermore, we applied the adsorption surface of this foamed resin sheet as a structure for attaching RFID tags to products. For examination, this foamed resin sheet was adsorbed on a glass plate and a heating experiment was conducted in an autoclave. The autoclave is heated by hot air circulation, and is exposed to hot air at a speed of 3 to 4 m / sec. As a result of the heating experiment, the foamed resin sheet kept adsorbed on the glass plate. Furthermore, no curling of the edge of the foamed resin sheet due to the blowing of hot air was observed. From the above, it was found that this foamed resin sheet is also useful as a structure for attaching RFID tags to products and the like.
[0060] なお、予備検討に用いたアクリル系の発泡樹脂シートは、オートクレープによる加熱 実験において、形状の変化、特に問題となる収縮のないことが確認された。  [0060] It was confirmed that the acrylic foamed resin sheet used for the preliminary study had no shape change, and no particularly problematic shrinkage, in a heating experiment using autoclave.
[0061] 以上のような発明者の検討と新規な着想によって、本発明が完成したのである。  [0061] The present invention has been completed by the inventor's examination and novel ideas as described above.
[0062] 本発明の情報管理タグは、もちろん通常の RFIDタグ機能を有している。 ICチップ には、基本的に D 情報が書き込まれている。さらに、書き込み型の半導体チップであ れば、様々な管理情報を書き込むことができる。例えば品種,原材料,生産履歴,用 途,ユーザー名,仕向け地等の様々な情報である。これらの情報が正確に読み込ま れると、生産管理,供給管理,品質管理等、多くの管理に使用することができ、有用 である。 [0063] 一例として、自動車メーカーのいわゆるカンバン方式におけるガラス製品の納入に ついて述べる。まず、各種タイプの自動車の組立てスケジュールに合わせて、納入の 日時や場所が指定される。さらに、形状や大きさの異なる、ウィンドシールドガラスや サイドガラス,リャガラス,ルーフガラス等の各種ガラス製品を、組み付ける順番通りに 供給する必要がある。これを間違いなく実行するためには、コンピュータを用いた個 別管理が有用である。この個別管理を実施するためには、ガラス素板を加工ラインに 供給する前から、情報管理タグをつけておくことができれば、好ましい。本発明の情 報管理タグは、このような用途に好適である。 [0062] The information management tag of the present invention naturally has a normal RFID tag function. Basically, D information is written on the IC chip. Furthermore, various management information can be written in a writable semiconductor chip. For example, various information such as varieties, raw materials, production history, usage, user name, destination, etc. If this information is read correctly, it can be used for many managements such as production control, supply control, quality control, etc., and it is useful. [0063] As an example, the delivery of glass products by the so-called Kanban system of an automobile manufacturer will be described. First, the delivery date, time, and location are specified according to the assembly schedule of various types of vehicles. In addition, various glass products such as windshield glass, side glass, rear glass, and roof glass with different shapes and sizes need to be supplied in the assembling order. In order to execute this without fail, individual management using a computer is useful. In order to carry out this individual management, it is preferable if an information management tag can be attached before the glass base plate is supplied to the processing line. The information management tag of the present invention is suitable for such a use.
[0064] 自動車用ガラスのうち、主にウィンドシールドガラスには、 2枚のガラスの間にポリビ 二ルブチラール (PVB)製の中間膜をはさみ、熱処理して一体化した合わせガラスが 使用されている。熱処理条件としては、オートクレーブ中で、例えば約 1. 5MPa (15 気圧)の加圧下で、温度 150°Cで、 90分間加熱される。情報管理タグが、例えば合 わせガラスの熱処理条件にも耐えられると、オートクレープへ投入する前の段階から 個別管理ができるので、より精度のょレ、管理が可能となる。  [0064] Of the glass for automobiles, laminated glass is used mainly for windshield glass, in which an interlayer film made of polyvinyl butyral (PVB) is sandwiched between two glasses and heat-treated. . The heat treatment is performed in an autoclave, for example, under a pressure of about 1.5 MPa (15 atm) at a temperature of 150 ° C. for 90 minutes. If the information management tag can withstand the heat treatment conditions of laminated glass, for example, it can be managed individually from the stage before it is put into the autoclave, so that more accurate control can be achieved.
[0065] 本発明の情報管理タグに貼付けられる吸着可能な発泡樹脂シートは、アクリル系樹 脂、シリコーンゴム、シリコーンゲル、フッ素ゴム等の樹脂を原料とするとよい。好ましく は弾性樹脂を使用する。樹脂原料に空気などの気体を加えて機械的発泡機にかけ 、フィルムシート上に展開し、乾燥させる。すると、その表面から気体が抜けたり泡が 破壊して、発泡痕が発生する。この発泡痕をそのまま残して加硫または架橋させると 、泡状穴部からなる吸盤 (以下、泡状吸盤ともいう)が形成される。この泡状吸盤の好 ましい数は、 1万〜 3万個 /cm2である。なお、発泡樹脂シート内には独立した泡が 残っている。 [0065] The adsorbable foamed resin sheet affixed to the information management tag of the present invention is preferably made from a resin such as acrylic resin, silicone rubber, silicone gel, or fluororubber. Preferably, an elastic resin is used. A gas such as air is added to the resin raw material, and it is applied to a mechanical foaming machine, spread on a film sheet, and dried. Then, gas escapes from the surface or bubbles are destroyed and foam marks are generated. If this foaming mark is left as it is and vulcanized or crosslinked, a suction cup composed of a foam hole (hereinafter also referred to as a foam suction cup) is formed. The preferred number of foam suckers is 10,000 to 30,000 / cm 2 . Independent foam remains in the foamed resin sheet.
[0066] なお、このような発泡樹脂シートは、以下のような商品名で市販されている。ゼオン ALシート(ゼオン化成 (株) )、ダイヤフィット (ダイヤミック (株) )、ぴたっと君(大庫洋 紙 (株))などである。  [0066] Such a foamed resin sheet is commercially available under the following trade names. Zeon AL sheet (Zeon Kasei Co., Ltd.), Diafit (Diamic Co., Ltd.), Pitatto-kun (Ookura Paper Co., Ltd.), etc.
[0067] 前記泡状吸盤の平均直径は 1〜300 mの範囲が好ましい。発泡樹脂シートの吸 着面には、粘着剤や接着剤を存在させない。粘着剤や接着剤は、上述のように加熱 により、変質したり、変色したりして、問題を起こす。また、管理対象物から取り外した 後に痕が残る問題もある。 [0067] The average diameter of the foam suction cup is preferably in the range of 1 to 300 m. No adhesive or adhesive is present on the adsorption surface of the foamed resin sheet. As described above, adhesives and adhesives change in quality or discolor due to heating, causing problems. Also removed from the management object There is also a problem that marks are left behind.
[0068] 発泡樹脂シートの別の材料としては、ポリスチレン系エラストマ一(例えば、旭化成 工業社製商品名"タフプレン"、 "タフテック")、ォレフィン系エラストマ一(例えば、 JS R社製商品名"ダイナロン CEBC"、三井化学社製商品名"ミストラマー")、ウレタン系 エラストマ一、エステノレ系エラストマ一、アミド系エラストマ一、塩素化ポリエチレン系 エラストマ一、 Syn-1,2-ポリブタジエン、 Trans_l,4-ポリイソプレン、フッ素系エラストマ 一などが使用できる。これらは、工業調査会発行「プラスチック 'データブック」 1999 年 12月 1日、 854〜857頁に記載されており、本発明においても、これらに記載され ているポリマーを使用できる。  [0068] Other materials for the foamed resin sheet include polystyrene-based elastomers (for example, trade names “Tuffprene” and “Tuftec” manufactured by Asahi Kasei Kogyo Co., Ltd.), and olefin-based elastomers (for example, product names “Dynalon” manufactured by JSR Corporation). CEBC ", trade name" Mistramer "manufactured by Mitsui Chemicals, Inc.), urethane elastomer, estenole elastomer, amide elastomer, chlorinated polyethylene elastomer, Syn-1,2-polybutadiene, Trans_l, 4-polyisoprene Fluorine-based elastomers can be used. These are described in “Plastics Data Book” published by the Industrial Research Council, December 1, 1999, pages 854 to 857, and the polymers described in these can also be used in the present invention.
[0069] RFIDタグのベースフィルムの材料としては、ポリエチレンテレフタレート(PET)、ポ リエチレンナフタレート(PEN)、ポリアミド(PA)、ポリイミド(PI)、ポリフエ二レンサルフ アイド(PPS)、ポリエーテルエーテルケトン(PEEK)、ポリエーテルサルホン(PES)、 またはポリエーテルイミド(PEI)を用いること力 Sできる。  [0069] Materials for the base film of the RFID tag include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyimide (PI), polyphenylene sulfide (PPS), polyether ether ketone ( PEEK), polyethersulfone (PES), or polyetherimide (PEI) can be used.
[0070] また、硬質の樹脂板またはフィルムの材料としては、ポリプロピレン(PP)、ポリェチ レンテレフタレート(PET)、ポリエチレンナフタレート(PEN)、ポリアミド(PA)、ポリイ ミド(PI)、ポリフエ二レンサルファイド(PPS)、ポリエーテルエーテルケトン(PEEK)、 ポリエーテルサルホン(PES)、またはポリエーテルイミド(PEI)を用いることができる。  [0070] In addition, the material of the hard resin plate or film includes polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyimide (PI), and polyphenylene sulfide. (PPS), polyetheretherketone (PEEK), polyethersulfone (PES), or polyetherimide (PEI) can be used.
[0071] さらに、硬質の樹脂板またはフィルムは、情報管理タグを取り外す際に、特にアンテ ナと ICチップとの電気的な接続に不具合を起こさない程度に、情報管理タグが変形 しないような厚みを有していればよい。また、情報管理タグが発泡樹脂シートによって 管理対象物に取り付けられた構造の場合、発泡樹脂シートの吸着力によっても、情 報管理タグにおける変形の程度は異なる。さらに、樹脂板やフィルムも材料の違いに より、その剛性は異なる。したがって、樹脂板やフィルムの好ましい厚みは、材料の違 いや、発泡樹脂シートの吸着力を考慮して決めるとよい。例えば、市販されている樹 脂板やフィルムの中から、適切な厚みを選択するとよい。  [0071] Further, the thickness of the hard resin plate or film is such that when the information management tag is removed, the information management tag is not deformed to such an extent that the electrical connection between the antenna and the IC chip does not cause a problem. As long as it has. In addition, when the information management tag is attached to the management object by the foamed resin sheet, the degree of deformation of the information management tag varies depending on the adsorption force of the foamed resin sheet. Furthermore, the rigidity of resin plates and films varies depending on the material. Therefore, the preferable thickness of the resin plate or film may be determined in consideration of the difference in material and the adsorption power of the foamed resin sheet. For example, an appropriate thickness may be selected from commercially available resin boards and films.
[0072] なお、硬質の樹脂板またはフィルムは、残留している歪みを取り除くために、予めァ ニール (熱処理)されているとよい。ァニールする際には、本発明で使用する発泡樹 脂シートに吸着させ、さらにこの発泡樹脂シートを平坦なガラス板等の耐熱性プレー トに吸着させて、熱処理するとよい。このようにすると、例えばポリプロピレン(PP)シー ト(融点: 160°C〜165°C、熱変形温度: 124°C)やポリエチレンテレフタレート(PET) フィルム(融点: 255°C、ガラス転移温度: 76°C〜77°C)を 150°Cで 90分間の熱処理 をしても、収縮はする力 変形しないので、好ましい。 [0072] The hard resin plate or film is preferably annealed (heat treated) in advance in order to remove the remaining distortion. When annealing, it is adsorbed to the foamed resin sheet used in the present invention, and this foamed resin sheet is further heated to a heat resistant plate such as a flat glass plate. It is good to heat-treat it. For example, a polypropylene (PP) sheet (melting point: 160 ° C to 165 ° C, heat distortion temperature: 124 ° C) or a polyethylene terephthalate (PET) film (melting point: 255 ° C, glass transition temperature: 76) Even if heat treatment is performed at 150 ° C for 90 minutes at 150 ° C to 77 ° C, the shrinkage force does not deform, which is preferable.
[0073] これは、発泡樹脂シートによって、 PPシートや PETフィルムの全面を吸着し固定し ているため、変形を起こさないためと考えられる。このような現象を利用して、予めァ ニールした硬質の樹脂板またはフィルムを使用すると、さらなる収縮は防げ、寸法安 定性の高いものとなる。硬質樹脂板またはフィルムをァニール (熱処理)する際に、発 泡樹脂シートに吸着させておくと、変形しないということは、驚くべき現象である。その 理由は、 PPシートや PETフィルムを単体で、 150°Cで 90分間熱処理すると、必ず変 形し、無定形になってしまうからである。  [0073] This is presumably because the entire surface of the PP sheet or PET film is adsorbed and fixed by the foamed resin sheet, so that deformation does not occur. If a hard resin plate or film annealed in advance using such a phenomenon is used, further shrinkage can be prevented and dimensional stability is improved. It is a surprising phenomenon that when a hard resin plate or film is annealed (heat treated), it is not deformed if it is adsorbed to a foamed resin sheet. The reason is that a PP sheet or PET film alone is heat-treated at 150 ° C for 90 minutes, and it always deforms and becomes amorphous.
[0074] 本発明において、さらに外側に吸着面を配した情報管理タグを、管理対象物(例え ばガラス)に吸着させるには、手で軽く押圧するだけでよい。こうすることにより、例え ば 80〜90kg/cm2程度の吸着力が得られる。情報管理タグを管理対象物から取り 外す際には、端部から剥がすことにより簡単に取り外せる。情報管理タグは、吸着に より貼り付!/、て!/、るだけであるから、取り外した後に痕は残らな!/、。 In the present invention, an information management tag having a suction surface on the outer side may be lightly pressed by hand to be sucked onto a management object (eg, glass). In this way, for example, an adsorption force of about 80 to 90 kg / cm 2 can be obtained. When removing the information management tag from the management object, it can be easily removed by peeling it off the edge. The information management tag is only attached by adsorption! /, Te! /, So there will be no traces after removal!
[0075] 本発明の情報管理タグは、ガラス生産用管理タグとすることができる。本発明の情 報管理タグに一体化されている発泡樹脂シートは耐熱性が高ぐ泡状穴部を有しタツ シヨン性がある。このため、ガラス同士が接触しても、緩衝作用により、ガラスも情報管 理タグも傷まない利点がある。特に自動車用ガラスに適用する場合は、ガラス周囲に 印刷され、厚さ約 15 m程度で黒色のセラミックスプリント部にも、本発明の情報管 理タグを吸着させることができる。このセラミックスプリント部には多少の凹凸があるが 、発泡樹脂シートには柔軟性があるので、吸着させること力 Sできる。  [0075] The information management tag of the present invention may be a glass production management tag. The foamed resin sheet integrated with the information management tag of the present invention has a bubble-like hole portion with high heat resistance, and has a tackiness. For this reason, even if glass contacts, there is an advantage that neither the glass nor the information management tag is damaged by the buffering action. In particular, when applied to glass for automobiles, the information management tag of the present invention can be adsorbed to a black ceramic print portion which is printed around the glass and has a thickness of about 15 m. Although this ceramic print has some irregularities, the foamed resin sheet is flexible and can be adsorbed.
実施例  Example
[0076] 以下に、本発明の実施例を示しながら、さらに具体的に説明する。下記の実施例に おいて、同一符号は同一部品を示し、説明を省略することがある。  [0076] Hereinafter, the present invention will be described more specifically with reference to examples. In the following embodiments, the same reference numerals indicate the same parts, and the description may be omitted.
[0077] (実施例 1) [0077] (Example 1)
(1)発泡樹脂シートの製造 アクリル共重合樹脂(大日本化学工業社製商品名" DICNAL MEP- 20WO") 1 OOOgと、整泡剤(大日本化学工業社製商品名" DICNAL M— 40") 100gと、増粘 剤(大日本化学工業社製商品名 "DICNAL MX") 100gと、架橋剤メラミン樹脂(大 日本化学工業社製商品)
Figure imgf000017_0001
(1) Production of foamed resin sheet Acrylic copolymer resin (trade name “DICNAL MEP-20WO” manufactured by Dainippon Chemical Co., Ltd.) 1 OOOg, 100 g of foam stabilizer (trade name “DICNAL M-40” manufactured by Dainippon Chemical Co., Ltd.), and thickener ( Dainippon Chemical Co., Ltd. trade name "DICNAL MX") 100g and crosslinker melamine resin (Dainippon Chemical Co., Ltd. product)
Figure imgf000017_0001
ルシヨンを機械的発泡機に入れて空気を混入させ、発泡倍率 1. 5倍の気泡を含むァ
Figure imgf000017_0002
Place the Roussilon in a mechanical foaming machine and mix it with air.
Figure imgf000017_0002
[0078] このアクリルエマルシヨン液をナイフコーターにより、ポリエチレンテレフタレートのシ 一トフイルム(幅 30cm、厚さ 50 μ m、長尺物)の表面に、乾燥厚みで 200 μ mとなる ように塗布し、直後に 110°C〜140°Cまで 9分間かけて乾燥しつつ架橋させた。その 後、前記架橋されたアクリル系樹脂の発泡層上に、厚さ 30 mのポリエチレンテレフ タレート保護フィルムを被覆した。こうして、ポリエチレンテレフタレートのシートフィル ムの片面に、アクリル系樹脂の発泡層が形成できた。  [0078] This acrylic emulsion solution was applied to the surface of a polyethylene terephthalate sheet film (width 30 cm, thickness 50 μm, long product) with a knife coater so that the dry thickness was 200 μm. Immediately thereafter, crosslinking was carried out while drying from 110 ° C to 140 ° C over 9 minutes. Thereafter, a polyethylene terephthalate protective film having a thickness of 30 m was coated on the crosslinked acrylic resin foam layer. Thus, an acrylic resin foam layer could be formed on one side of the polyethylene terephthalate sheet film.
[0079] このアクリル系樹脂の発泡層表面には、気体が抜けたり泡が破壊したことにより形 成された発泡痕が 1万〜 3万個 /cm2の割合で存在した。この発泡層の表面が、吸 着面として機能する。 [0079] The foam layer surface of the acrylic resin, foam marks gas escapes or foam is made form by the destruction was present in a proportion of from 10,000 to 30,000 pieces / cm 2. The surface of this foam layer functions as an adsorption surface.
[0080] このようにして発泡性アクリル樹脂からなる発泡樹脂シートを製造した。この発泡樹 脂シートをガラス板に押圧すると、 80〜90kg/cm2の吸着力が得られた。 In this way, a foamed resin sheet made of a foamable acrylic resin was produced. When this foamed resin sheet was pressed against a glass plate, an adsorption force of 80 to 90 kg / cm 2 was obtained.
[0081] なお、上述したシートフィルムの裏面にも、このアクリルエマルシヨン液を塗布し架橋 させると、両面タイプの発泡樹脂シートとすることができる。  [0081] It should be noted that a double-sided foamed resin sheet can be obtained by applying this acrylic emulsion solution to the back surface of the above-described sheet film and crosslinking it.
[0082] (2) RFIDタグの形成  [0082] (2) RFID tag formation
図 1Aに、実施例 1の断面模式図を示す。まず、ベースフィルム 11表面に、アンテナ 12とこれに接続される半導体チップ 13とを形成し、さらに、その上に保護フィルム 14 を積層した RFIDタグ 10を準備した。  FIG. 1A shows a schematic sectional view of Example 1. FIG. First, an RFID tag 10 in which an antenna 12 and a semiconductor chip 13 connected to the antenna 12 were formed on the surface of the base film 11 and a protective film 14 was further laminated thereon was prepared.
[0083] この RFIDタグ 10のベースフィルム 11裏面に、発泡性アクリル樹脂の吸着層 22が 形成されたシートフィルム 21、すなわち発泡樹脂シート 20を、接着剤層 30を介して 接着した構造を有する RFIDタグ構造体 1である。発泡樹脂シート 20の吸着面 24に は、微小な吸盤 23が多数形成されている。なお、接着剤層に代えて、両面接着テー プとしてあよい。 [0084] 前記発泡性アクリル樹脂の表面(吸着面)と断面とを、走査型電子顕微鏡(日立製 作所製, S -4500,加速電圧: 5kV,撮影倍率: 250倍)にて観察した結果を、図 1B と図 1Cとにそれぞれ示す。 [0083] RFID having a structure in which a sheet film 21 having a foamable acrylic resin adsorption layer 22 formed on the back surface of the base film 11 of the RFID tag 10, that is, a foamed resin sheet 20, is bonded via an adhesive layer 30. Tag structure 1. Many suction cups 23 are formed on the suction surface 24 of the foamed resin sheet 20. Note that a double-sided adhesive tape may be used instead of the adhesive layer. [0084] Results of observation of the surface (adsorption surface) and the cross section of the foamable acrylic resin with a scanning electron microscope (manufactured by Hitachi, S-4500, acceleration voltage: 5 kV, photographing magnification: 250 times) Are shown in Figures 1B and 1C, respectively.
[0085] 観察結果によると、発泡性アクリル樹脂の表面には、開放された多数の泡が観察さ れる。発泡性アクリル樹脂の内部では、複数の泡が合体しているように、観察される 泡も存在するが、断面の観察結果力、らも明らかなように、表面から裏面まで連通する ような泡の連なりはなぐ独立した泡ができている。発泡性アクリル樹脂の表面に存在 する多数の泡が、微小な吸盤として機能し、発泡樹脂シートを構成している。  [0085] According to the observation results, a large number of open bubbles are observed on the surface of the foamable acrylic resin. Inside the foamable acrylic resin, some bubbles are observed as if multiple bubbles are united, but the cross-sectional observation force shows that the bubbles communicate from the front to the back. Independent bubbles are formed. A large number of bubbles present on the surface of the foamable acrylic resin function as fine suction cups to form a foamed resin sheet.
[0086] 発泡樹脂シートは、厚さ lmmであり、縦 30mm、横 70mmの大きさに切り抜いた。  [0086] The foamed resin sheet had a thickness of lmm, and was cut into a size of 30mm in length and 70mm in width.
この発泡樹脂シートを管理対象物体 (例えば電器製品)に吸着させるには、手で軽く 押圧するだけでよい。これにより、例えば 80〜90kg/cm2程度の吸着力が得られる 。泡状吸盤の平均直径は 1〜300 111の範囲である。 In order to adsorb the foamed resin sheet to an object to be managed (for example, an electrical appliance), it is only necessary to lightly press it by hand. Thereby, for example, an adsorption force of about 80 to 90 kg / cm 2 can be obtained. The average diameter of the foam sucker ranges from 1 to 300 111.
[0087] 図 1Aに示した実施例 1では、既存の ICタグに、市販されている発泡樹脂シートを 接着剤や両面接着テープなどにより接着するだけで、本発明による RFIDタグ構造 体を簡単に得ることができる。  [0087] In Example 1 shown in Fig. 1A, the RFID tag structure according to the present invention can be easily obtained by simply adhering a commercially available foamed resin sheet to an existing IC tag with an adhesive or a double-sided adhesive tape. Obtainable.
[0088] このような構造により、本発明による RFIDタグ構造体は、対象物に簡単に取り付け ること力 Sできる。また、 RFIDタグ構造体を取り外した際に、接着剤が残ることはない。  [0088] With such a structure, the RFID tag structure according to the present invention can be easily attached to an object. Also, no adhesive remains when the RFID tag structure is removed.
[0089] このとき、発泡樹脂シートのシートフィルムを厚手のものとする力、、材質を変更する などして、折れ曲げにくいものとするとよい。こうすれば、 RFIDタグ構造体を取り外す 際に、半導体チップとアンテナとの接続部が痛みに《なるので、好ましい。ベースフ イルムの材質としては、ポリエチレン(PE)、ポリプロピレン(PP)、ポリエチレンテレフ タレート(PET)等であることが好まし!/、。  [0089] At this time, it is preferable that the foamed resin sheet be made difficult to be bent by changing the force and material to make the sheet film thick. This is preferable because the connection between the semiconductor chip and the antenna becomes painful when the RFID tag structure is removed. The base film material is preferably polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), etc./.
[0090] また、 ICタグのベースフィルムを厚手のものとする力、、材質を変更するなどして、折 れ曲げにくいものとしてもよぐさらには、保護フィルムを、折れ曲げにくいものとしても よい。シートフィルムを、ベースフィルムと同様のフィルム材としてもよい。  [0090] In addition, it is possible to make the base film of the IC tag thick, change the material, etc. to make it difficult to bend, and the protective film may be hard to bend. . The sheet film may be a film material similar to the base film.
[0091] さらに、 ICタグのベースフィルム 11と、発泡樹脂シートのシートフィルム 21とを、図 1 Dのように、共通化してもよい。  Furthermore, the base film 11 of the IC tag and the sheet film 21 of the foamed resin sheet may be shared as shown in FIG. 1D.
[0092] 実施例 1では、既存の ICタグ 10の大きさに合わせた発泡樹脂シート 20が接着され た構成とした。 ICタグ 10の大きさは、縦 10mm、横 45mm、厚さ 100 m程度であり 、取扱いやすさや視認性の点からは、十分な大きさでない場合がある。既存の ICタグ では、その大きさは大体同じようであるので、必要に応じて図 1Eのように、発泡樹脂 シート 20を既存の ICタグ 10より大きくし、 ICタグ 10をその中央部に配して、 RFIDタ グ構造体 1を構成してもよい。また、 RFIDタグ構造体が容易に剥がれることがなけれ ば、中央部のみならず、端部に ICタグを配してもよい。 [0092] In Example 1, a foamed resin sheet 20 matching the size of an existing IC tag 10 is bonded. The configuration was as follows. The size of the IC tag 10 is 10 mm long, 45 mm wide, and about 100 m thick, and it may not be large enough from the viewpoint of ease of handling and visibility. Since the size of the existing IC tag is almost the same, if necessary, the foamed resin sheet 20 is made larger than the existing IC tag 10 and the IC tag 10 is arranged in the center as shown in Fig. 1E. Thus, the RFID tag structure 1 may be configured. In addition, if the RFID tag structure is not easily peeled off, an IC tag may be arranged not only at the center but also at the end.
[0093] (実施例 2)  [0093] (Example 2)
図 2Aに、実施例 2の断面模式図を示す。この実施例 2は、発泡性のアクリル樹脂の 吸着層が形成されたシートフィルム 21を、 ICタグの保護フィルム 14表面に接着剤層 30を介して接着した以外は、実施例 1と同様の構造である。  FIG. 2A shows a schematic cross-sectional view of Example 2. This Example 2 has the same structure as that of Example 1 except that the sheet film 21 having a foamable acrylic resin adsorbing layer formed thereon is bonded to the surface of the IC tag protective film 14 via the adhesive layer 30. It is.
[0094] また ICタグの保護フィルム 14と発泡樹脂シートのシートフィルム 21とを、図 2Bのよう に、共通化してもよい。  Further, the IC tag protection film 14 and the foamed resin sheet film 21 may be shared as shown in FIG. 2B.
[0095] (実施例 3)  [Example 3]
図 3Aに、実施例 3の断面模式図を示す。この実施例 3は、 PP (ポリプロピレン)、 P E (ポリエチレン)、 PET、アクリル樹脂などの樹脂板を積層して構成した例であって、 実施例 1の保護フィルム上に樹脂剛性板 40を接着し (接着剤層は図示せず)、積層 している。この図 3Aのような積層構造であれば、樹脂剛性板 40が ICタグ 10表面を 保護でき、し力、もこの樹脂剛性板 40を掴むようにすれば、 RFIDタグ構造体 1を痛め ることなく、ノ、ンドリングできる。  FIG. 3A shows a schematic cross-sectional view of Example 3. Example 3 is an example in which a resin plate made of PP (polypropylene), PE (polyethylene), PET, acrylic resin, or the like is laminated, and the resin rigid plate 40 is bonded onto the protective film of Example 1. (Adhesive layer not shown) are stacked. If the laminated structure as shown in FIG. 3A is used, the resin rigid plate 40 can protect the surface of the IC tag 10, and if the resin rigid plate 40 is gripped, the RFID tag structure 1 may be damaged. There is no, you can ring.
[0096] 樹脂剛性板が対象物に接する面に位置しなければ、積層される位置は特に限定さ れず、図 3Bに示したように、 ICタグ 10と発泡樹脂シート 20との間に、樹脂剛性板 40 を配してもよい。なお、樹脂剛性板 40と ICタグ 10の保護フィルム 14との間の、接着 剤層は図示していない。  [0096] If the resin rigid plate is not positioned on the surface in contact with the object, the stacking position is not particularly limited, and as shown in Fig. 3B, the resin is placed between the IC tag 10 and the foamed resin sheet 20. A rigid plate 40 may be provided. The adhesive layer between the resin rigid plate 40 and the protective film 14 of the IC tag 10 is not shown.
[0097] なお、樹脂の材質にもよる力 樹脂剛性板の厚みは 0. 3〜2mm程度であれば、本 発明の RFIDタグ構造体として、十分な剛性を有しており、取扱いが容易であり、取り 外す際にもアンテナと半導体チップとの接続部を痛めることがない。  [0097] It should be noted that if the thickness of the resin rigid plate is about 0.3 to 2 mm, the RFID tag structure of the present invention has sufficient rigidity and is easy to handle. There is no damage to the connection between the antenna and the semiconductor chip when removing.
[0098] なお実施例 3では、樹脂剛性板を 1枚積層した構成であつたが、複数枚の樹脂剛 性板を積層した構成でもよレヽ。 [0099] (実施例 4) [0098] In the third embodiment, a configuration in which one resin rigid plate is laminated is used, but a configuration in which a plurality of resin rigid plates are laminated may also be used. [0099] (Example 4)
図 4Aに、実施例 4の断面模式図を示す。この実施例 4は、半導体チップとアンテナ に、両面タイプの発泡樹脂シートの一面を吸着させ、他面を対象物との吸着に用い る構成の RFIDタグ構造体である。さらに実施例 4において、図 4Bに示したように、ベ 一スフイルムの裏面側に、樹脂剛性板を接着し積層した構成としてもよ!/、。  FIG. 4A shows a schematic cross-sectional view of Example 4. Example 4 is an RFID tag structure in which a semiconductor chip and an antenna are adsorbed on one side of a double-sided foamed resin sheet and the other side is used for adsorbing an object. Furthermore, in Example 4, as shown in FIG. 4B, a structure in which a resin rigid plate is bonded to the back side of the base film and laminated may be used.
[0100] 以上の実施例では、発泡性のアクリル樹脂による吸着層を例示した力 これに限ら れることなぐ発泡性のウレタン樹脂による吸着層でもよい。  [0100] In the above-described embodiments, the force exemplified by the adsorption layer made of foamable acrylic resin may be an adsorption layer made of foamable urethane resin without being limited thereto.
[0101] さらに、図 5に示したように、柔軟性を有する樹脂、例えばポリ塩化ビュル樹脂 25を 、その断面が凸状で平面視して網目状となるように、 ICタグの表面または裏面(21 , ( 11 , 14) )にスクリーン印刷して、微小な吸盤 23を多数形成して、吸着構造としてもよ い。  [0101] Further, as shown in FIG. 5, a flexible resin, for example, polychlorinated bur resin 25, is formed on the front or back surface of the IC tag so that the cross section is convex and has a mesh shape in plan view. (21, (11, 14)) may be screen-printed to form a large number of small suction cups 23 to form an adsorption structure.
[0102] (実施例 5)  [0102] (Example 5)
実施例 5以下は、耐熱性のある RFIDタグ構造体につ!/、ての実施例である。 (1)発泡樹脂シートの製造  Example 5 The following is an example of a heat-resistant RFID tag structure! (1) Production of foamed resin sheet
アクリル共重合樹脂(大日本化学工業社製商品名" DICNAL MEP- 20WO") 1 OOOgと、整泡剤(大日本化学工業社製商品名" DICNAL M— 40") 100gと、増粘 剤(大日本化学工業社製商品名 "DICNAL MX") 100gと、架橋剤メラミン樹脂(大 日本化学工業社製商品) 50gを混合してアクリルエマルシヨンとし、このアクリルエマ ルシヨンを機械的発泡機に入れて空気を混入させ、発泡倍率 1. 5倍の気泡を含むァ クリルエマルシヨン液を調製した。  Acrylic copolymer resin (trade name “DICNAL MEP-20WO” manufactured by Dainippon Chemical Co., Ltd.) 1 OOOg, 100 g of foam stabilizer (trade name “DICNAL M-40” manufactured by Dainippon Chemical Co., Ltd.), and thickener ( Dainippon Chemical Co., Ltd. trade name "DICNAL MX") 100g and crosslinker melamine resin (Dainippon Chemical Co., Ltd. product) 50g are mixed to make acrylic emulsion, and this acrylic emulsion is put into a mechanical foaming machine. Then, an acryl emulsion solution containing bubbles with a foaming ratio of 1.5 times was prepared.
[0103] このアクリルエマルシヨン液をナイフコーターにより、ポリエチレンテレフタレートのフ イルムシート(幅 30cm、厚さ 50 111、長尺物)の一方の面上に、乾燥厚みで 200〃 mとなるように塗布し、直後に 110°C〜140°Cまで 9分間かけて乾燥しつつ架橋させ た。その後、前記架橋されたアクリル系樹脂層の上に厚さ 30 mのポリエチレンテレ フタレート製の保護フィルムを被覆した。その後、ポリエチレンテレフタレートのフィノレ ムシートの他方の面上にも、同様にアクリルエマルシヨン液を塗布し、同様に架橋さ せた。  [0103] This acrylic emulsion solution was applied on one side of a polyethylene terephthalate film sheet (width 30 cm, thickness 50 111, long) with a knife coater to a dry thickness of 200 mm. Immediately thereafter, crosslinking was carried out while drying from 110 ° C to 140 ° C over 9 minutes. Thereafter, a protective film made of polyethylene terephthalate having a thickness of 30 m was coated on the crosslinked acrylic resin layer. Thereafter, an acrylic emulsion solution was similarly applied to the other surface of the polyethylene terephthalate finalene sheet and crosslinked in the same manner.
[0104] このようにして、ポリエチレンテレフタレートのフィルムシートの両面に、アクリル系樹 脂が発泡した層を形成した発泡樹脂シートを得ることができた。 [0104] In this way, acrylic resin was coated on both sides of the polyethylene terephthalate film sheet. A foamed resin sheet having a foamed layer of fat was obtained.
[0105] なお、以上の説明では、両面タイプの発泡樹脂シートを作製したが、片面にのみに 発泡したアクリル系樹脂層を形成すれば、片面タイプの発泡樹脂シートが得られるこ とはいうまでもない。 [0105] In the above description, a double-sided type foamed resin sheet is produced. However, it goes without saying that a single-sided type foamed resin sheet can be obtained by forming a foamed acrylic resin layer only on one side. Nor.
[0106] この発泡樹脂シートのアクリル系樹脂層の表面は、空気が抜けたり、泡が破裂した ことにより形成された発泡痕カ S、 1万〜 3万個 /cm2の割合で存在し、これらがミクロな 吸盤として機能する。この発泡樹脂シートをガラス板に押圧すると、 80〜90kg/cm2 の吸着力が得られた。 [0106] The surface of the acrylic resin layer of the foamed resin sheet is present at a rate of 10,000 to 30,000 pieces / cm 2 of foamed traces S formed when air escapes or bubbles burst. These function as a micro suction cup. When this foamed resin sheet was pressed against a glass plate, an adsorption force of 80 to 90 kg / cm 2 was obtained.
[0107] 得られた両面吸着可能な発泡樹脂シートの断面模式図を図 6に示す。図 6におい て、 54はポリエチレンテレフタレートのフィルムシート、 53, 55はアクリル系発泡樹脂 層、 63, 65は泡状吸盤、 64, 66は内部気泡である。このアクリル系樹脂層は、弾性 を有する独立気泡の発泡体である。  [0107] FIG. 6 shows a schematic cross-sectional view of the obtained foamed resin sheet capable of adsorbing on both sides. In FIG. 6, 54 is a polyethylene terephthalate film sheet, 53 and 55 are acrylic foamed resin layers, 63 and 65 are foam suckers, and 64 and 66 are internal bubbles. This acrylic resin layer is a closed-cell foam having elasticity.
[0108] 図 7は、発泡樹脂シートの吸着面を、走査型電子顕微鏡(日立製作所製, S— 450 0,加速電圧: 5kV,撮影倍率: 250倍)にて観察した写真である。複数の泡が合体さ れているところもある力 S、基本的に独立した発泡体であることがわかる。個々の泡の境 界は明瞭に観察され、ミクロな吸盤として機能できることがわかる。  FIG. 7 is a photograph of the adsorption surface of the foamed resin sheet observed with a scanning electron microscope (manufactured by Hitachi, Ltd., S-4500, acceleration voltage: 5 kV, photographing magnification: 250 times). It can be seen that there is a force S where a plurality of bubbles are combined, which is basically an independent foam. The boundaries of individual bubbles are clearly observed, indicating that they can function as micro-suction cups.
[0109] 図 8は、発泡樹脂シートの断面を、同じく走査型電子顕微鏡にて観察した写真であ る。複数の泡が合体されているところもある力 発泡樹脂シートの厚み方向に連通し たような箇所は認められず、独立した発泡体であることが確認された。  FIG. 8 is a photograph of the cross section of the foamed resin sheet, similarly observed with a scanning electron microscope. There is a place where a plurality of foams are united. There were no places where the foamed resin sheet communicated in the thickness direction, and the foam was confirmed to be an independent foam.
[0110] (2)情報管理タグの構成  [0110] (2) Information management tag configuration
図 9に示すように、ベースフィルム 2 (厚み 50 m、ポリエチレンテレフタレート)に IC チップとアンテナとが形成されたベア ICタグ 51の表面に、両面タイプの発泡樹脂シ ート 56を吸着させて一体化し、 RFIDタグ 60を構成した。この一体化は、手で押す程 度の押圧力で可能である。なお、このようなベア ICタグは、一般に購入可能である。  As shown in Fig. 9, the double-sided foamed resin sheet 56 is adsorbed on the surface of the bare IC tag 51 in which the IC chip and the antenna are formed on the base film 2 (thickness 50 m, polyethylene terephthalate). RFID tag 60 was constructed. This integration is possible with the pressing force of pushing by hand. Such bare IC tags are generally available for purchase.
[0111] 図 9において、 56は前記のようにして得られた両面吸着可能な発泡樹脂シートであ り、ポリエチレンテレフタレートのフィルムシート 54の両面にアクリル系発泡樹脂層 53 , 55が形成されている。アクリル系発泡樹脂層 53, 55の外側表面には、それぞれミ クロな吸盤が形成されて!/、る。 [0112] 図 10は、本実施例で使用したベア ICタグ 51である。このベア ICタグ 51は、ポリエ チレンテレフタレートフィルムのベースフィルム 52の表面に、半導体チップ(ICチップ ) 59とこれに接続するアンテナ 57, 58を備えている。アンテナ 57, 58は銅プリントで 構成されている。 In FIG. 9, 56 is a double-sided adsorbable foamed resin sheet obtained as described above, and acrylic foamed resin layers 53, 55 are formed on both sides of a polyethylene terephthalate film sheet 54. . Microscopic suction cups are formed on the outer surfaces of the acrylic foam resin layers 53 and 55, respectively. FIG. 10 shows a bare IC tag 51 used in this example. The bare IC tag 51 includes a semiconductor chip (IC chip) 59 and antennas 57 and 58 connected thereto on the surface of a base film 52 of a polyethylene terephthalate film. Antennas 57 and 58 are made of copper print.
[0113] (3)合わせ工程への適用試験  [0113] (3) Application test to the alignment process
この RFIDタグ 60を、合わせガラスの合わせ工程に適用した。これは、合わせ工程 で用いるオートクレーブにおける加熱に、この RFIDタグ 60が耐えうるかを確認するも のである。 RFIDタグ 60を、図 11に示すように、合わせガラスを構成する 1枚のガラス 板 61に吸着させた。この合わせガラスは、自動車用ウィンドシールドガラスである。  This RFID tag 60 was applied to the laminated glass laminating process. This is to confirm whether the RFID tag 60 can withstand the heating in the autoclave used in the alignment process. As shown in FIG. 11, the RFID tag 60 was adsorbed on a single glass plate 61 constituting a laminated glass. This laminated glass is an automotive windshield glass.
[0114] RFIDタグ 60の吸着位置は、図 12に示すようにガラス板 61の周囲に形成されたセ ラミックス部 62とした。ウィンドシールドガラスを構成するもう一枚のガラスには、 RFID タグ 60を貼り付けなかった。このようにして準備した 2枚のガラスの間に、ポリビュルブ チラール(PVB)製の中間膜をはさみ、 1 · 5MPaの加圧下で、温度 150°C、 90分間 オートクレーブに入れ、熱処理して接着し一体化した。  [0114] The adsorption position of the RFID tag 60 was the ceramic mix portion 62 formed around the glass plate 61 as shown in FIG. The RFID tag 60 was not pasted on the other glass of the windshield glass. An interlayer film made of polybulubutyral (PVB) is sandwiched between the two sheets of glass prepared in this way, put in an autoclave at a temperature of 150 ° C for 90 minutes under a pressure of 1/5 MPa, and bonded by heat treatment. Integrated.
[0115] このようにして得られた合わせガラスは、 RFIDタグ 60を取り付けないものと同一の 品質であり、 RFIDタグの取り付けは、合わせガラスの製造に何ら影響を与えなかつ た。また、 RFIDタグ 60を取り外した力 ガラス側に目視で確認できる吸着痕は残って いなかった。さらに、 RFIDタグ 60の読み取り品質の劣化や、変形等は認められなか つた。  [0115] The laminated glass thus obtained had the same quality as that without the RFID tag 60 attached thereto, and the attachment of the RFID tag had no effect on the production of the laminated glass. In addition, there was no suction mark left on the side of the force glass from which the RFID tag 60 was removed. Furthermore, no deterioration or deformation of the reading quality of the RFID tag 60 was observed.
[0116] RFIDタグ 60には、商品名、原材料、生産履歴、用途、ユーザー名、仕向け地等様 々な情報が書き込まれ、生産管理から顧客への供給管理まで行うことができた。また 、この RFIDタグ 60は、繰り返し再使用することができた。  [0116] Various information such as product name, raw material, production history, usage, user name, destination, etc. was written in the RFID tag 60, and it was possible to carry out everything from production management to supply management to customers. The RFID tag 60 could be reused repeatedly.
[0117] 図 13は、発泡樹脂シートを 150°C、 90分間で熱処理した後の吸着面を、走査型電 子顕微鏡にて観察した写真である。ミクロな吸盤の一部には、熱や繰り返し使用によ り破損している部分もある力 S、大部分は明瞭な境界が残り、繰り返し使用が可能なこと が確認、できた。  [0117] Fig. 13 is a photograph of the adsorption surface after heat treatment of the foamed resin sheet at 150 ° C for 90 minutes, observed with a scanning electron microscope. Part of the micro-suction cups had a force S that was damaged by heat and repeated use. Most of the suction cups remained clear, and it was confirmed that repeated use was possible.
[0118] 本発明による情報管理タグは、以上のような構成に限られることなぐ以下の示すよ うな構成の情報管理タグでもよい。 [0119] (実施例 6) [0118] The information management tag according to the present invention is not limited to the above configuration, and may be an information management tag having the following configuration. [0119] (Example 6)
図 14に示した情報管理タグは、ベア ICタグ 51と、これより大きな両面タイプの発泡 樹脂シート 56を準備し、両面発泡樹脂シート 56の一主表面の中央部分にベア ICタ グ 51を押し付けて、さらに発泡樹脂シート 56と同程度の大きさの樹脂板 70を押し付 けて、情報管理タグ 50とした例である。この場合、管理対象物には、両面タイプの発 泡樹脂シート 56の他の主表面を押し付けて、情報管理タグ 60を取り付けることになる  The information management tag shown in FIG. 14 has a bare IC tag 51 and a larger double-sided foam resin sheet 56, and presses the bare IC tag 51 against the center of the main surface of the double-sided foam resin sheet 56. Further, in this example, the information management tag 50 is formed by further pressing a resin plate 70 having the same size as the foamed resin sheet 56. In this case, the information management tag 60 is attached to the management target by pressing the other main surface of the double-sided foamed resin sheet 56.
[0120] 図 14に示した情報管理タグでは、両面タイプの発泡樹脂シート 56をベア ICタグ 51 より大きくすることにより、上述した実施例 5と同じ構成ではある力 さらに樹脂板 70を 簡単に積層できる。樹脂板 70を備えているので、情報管理タグを取り外す際にも、過 度に曲げられることがなぐ ICチップとアンテナとの電気的な接続がとれなくなるおそ れもなぐ好ましい。 [0120] In the information management tag shown in FIG. 14, the double-sided foam resin sheet 56 is made larger than the bare IC tag 51, so that the force is the same as that of Example 5 described above, and the resin plate 70 is easily laminated. it can. Since the resin plate 70 is provided, it is preferable that the electrical connection between the IC chip and the antenna which cannot be bent excessively when removing the information management tag is lost.
[0121] この実施例 6では、大きな発泡樹脂シート 56の中央部分にベア ICタグ 51を配置し たが、情報管理タグが容易に剥がれることがなければ、中央部分に限られることなぐ 端部にベア ICタグ 51を配置してもよい。  [0121] In Example 6, the bare IC tag 51 is arranged in the central portion of the large foamed resin sheet 56. However, if the information management tag does not easily peel off, it is not limited to the central portion. A bare IC tag 51 may be arranged.
[0122] (実施例 7)  [0122] (Example 7)
図 15に示した情報管理タグでは、片面タイプの発泡樹脂シート 67を用い、これを ベア ICタグ 1より大きくすることにより、最も簡単な構成で耐熱性のある情報管理タグ を得ること力 Sでさる。  The information management tag shown in Fig. 15 uses a single-sided foamed resin sheet 67, which is made larger than the bare IC tag 1, so that it is possible to obtain a heat-resistant information management tag with the simplest configuration. Monkey.
[0123] (実施例 8)  [0123] (Example 8)
図 16に示した情報管理タグは、図 15に示した情報管理タグにおける発泡樹脂シー ト 67のフィルムシート 54の裏面に、接着剤や両面接着テープ(71)を用いて樹脂板 7 0を積層した情報管理タグである。この場合、樹脂板の固定に接着剤や両面接着テ ープを用いているが、この接着剤や両面接着テープ力 熱により収縮硬化しても、情 報管理タグの機能が失われることはなレ、。  The information management tag shown in FIG. 16 has a resin plate 70 laminated on the back side of the film sheet 54 of the foamed resin sheet 67 in the information management tag shown in FIG. 15 using an adhesive or a double-sided adhesive tape (71). Information management tag. In this case, an adhesive or double-sided adhesive tape is used to fix the resin plate. However, even if this adhesive or double-sided adhesive tape force heat shrinks and cures, the function of the information management tag will not be lost. Les.
[0124] (実施例 9)  [0124] (Example 9)
図 17に示した情報管理タグでは、ベア ICタグ 51の表面に片面タイプの発泡樹脂シ ート 67を吸着させ、さらにベア ICタグ 51の表面に両面タイプの発泡樹脂シート 56を 吸着させた情報管理タグである。 In the information management tag shown in FIG. 17, a single-sided foam resin sheet 67 is adsorbed on the surface of the bare IC tag 51, and a double-sided foam resin sheet 56 is attached to the surface of the bare IC tag 51. It is the adsorbed information management tag.

Claims

請求の範囲 The scope of the claims
[I] ベースフィルム表面に、アンテナとこれに接続される半導体チップとが形成された R FID(Radio Frequency Identification)タグと、  [I] An R FID (Radio Frequency Identification) tag in which an antenna and a semiconductor chip connected to the antenna are formed on the surface of the base film,
前記 RFIDタグの表面又は裏面の少なくとも一方に、シートフィルムを介して又は介 さず、表面に微小な吸盤を多数有することにより吸着機能を有する発泡樹脂シート層 を備えたことを特徴とする RFIDタグ構造体。  An RFID tag comprising a foamed resin sheet layer having an adsorption function by having a large number of minute suction cups on the surface, at least one of the front and back surfaces of the RFID tag, with or without a sheet film Structure.
[2] 前記発泡樹脂シート層は、表面に多数の泡状穴部を有する、請求項 1に記載の RF IDタグ構造体。 [2] The RF ID tag structure according to claim 1, wherein the foamed resin sheet layer has a large number of foam holes on a surface thereof.
[3] 前記発泡樹脂シート層は、柔軟性を有する樹脂が前記 RFIDの表面及び裏面から 選ばれる少なくとも 1つの面に、断面が凸状で平面から見て網目状となるように印刷 されて形成されている、請求項 1又は 2に記載の RFIDタグ構造体。  [3] The foamed resin sheet layer is formed by printing a flexible resin on at least one surface selected from the front and back surfaces of the RFID so that the cross section is convex and has a mesh shape when viewed from the top. The RFID tag structure according to claim 1 or 2, wherein:
[4] 前記発泡樹脂シート層は、アクリル系樹脂を発泡させたシートである、請求項;!〜 3 のいずれ力、 1項に記載の RFIDタグ構造体。 [4] The RFID tag structure according to [1], wherein the foamed resin sheet layer is a sheet obtained by foaming an acrylic resin.
[5] 前記発泡樹脂シート層は、前記ベースフィルム裏面に、シートフィルムを介して又は 介さずに形成されている、請求項 1〜4のいずれか 1項に記載の RFIDタグ構造体。 [5] The RFID tag structure according to any one of claims 1 to 4, wherein the foamed resin sheet layer is formed on the back surface of the base film with or without a sheet film interposed therebetween.
[6] 前記発泡樹脂シート層は、前記 RFIDタグより大きぐ平面から見た場合、前記 RFI[6] When the foamed resin sheet layer is viewed from a plane larger than the RFID tag, the RFI
Dタグは前記発泡樹脂シート層より内側に配置されている、請求項 1〜5のいずれかThe D tag is disposed inside the foamed resin sheet layer, any one of claims 1 to 5.
1項に記載の情報管理タグ。 The information management tag described in item 1.
[7] 前記アンテナと前記半導体チップの上に保護フィルムが積層されており、 [7] A protective film is laminated on the antenna and the semiconductor chip,
前記発泡樹脂シート層は、前記保護フィルム表面に、シートフィルムを介して又は 介さずに形成されて!/、る、請求項 1に記載の RFIDタグ構造体。  2. The RFID tag structure according to claim 1, wherein the foamed resin sheet layer is formed on the surface of the protective film with or without a sheet film.
[8] 前記ベースフィルム、前記シートフィルムから選ばれる少なくとも 1つのフィルムは剛 性部材である、請求項 1に記載の RFIDタグ構造体。 8. The RFID tag structure according to claim 1, wherein at least one film selected from the base film and the sheet film is a rigid member.
[9] 前記吸着機能を有する発泡樹脂シート層の吸着面が、前記アンテナ及びこれに接 続されて!/、る半導体チップに直接吸着してレ、る請求項 1に記載の RFIDタグ構造体。 [9] The RFID tag structure according to claim 1, wherein an adsorption surface of the foamed resin sheet layer having an adsorption function is directly adsorbed to the antenna and a semiconductor chip connected to the antenna! .
[10] 前記吸着機能を有する吸盤は、前記発泡樹脂シート層の両表面に形成されている[10] The suction cups having the adsorption function are formed on both surfaces of the foamed resin sheet layer.
、請求項 1に記載の RFIDタグ構造体。 The RFID tag structure according to claim 1.
[I I] 前記吸着機能を有する吸盤は、発泡樹脂シートの一表面に形成されており、前記 吸盤を外側にして 2枚を貼り合せてなる、請求項 1に記載の RFIDタグ構造体。 [II] The suction cup having the adsorption function is formed on one surface of a foamed resin sheet, 2. The RFID tag structure according to claim 1, wherein two sheets are bonded together with the suction cup outside.
[12] 前記 RFIDタグ構造体には、さらに硬質の樹脂板又はフィルムが積層されている、 請求項;!〜 1 1の!、ずれか 1項に記載の RFIDタグ構造体。  [12] The RFID tag structure according to claim 1, wherein a hard resin plate or a film is further laminated on the RFID tag structure.
[13] 前記硬質の樹脂板又はフィルムは、前記発泡樹脂シート層とは反対側の最外部に 配置されている、請求項 12に記載の RFIDタグ構造体。  13. The RFID tag structure according to claim 12, wherein the hard resin plate or film is disposed on the outermost side opposite to the foamed resin sheet layer.
[14] 前記硬質の樹脂板又はフィルムは、 RFIDタグより面積が大きい、請求項 1 1又は 1 3に記載の RFIDタグ構造体。  14. The RFID tag structure according to claim 11, wherein the hard resin plate or film has a larger area than the RFID tag.
[15] 前記硬質の樹脂板又はフィルムが、ポリプロピレン(PP) ,ポリエチレンテレフタレー ト(PET) ,ポリエチレンナフタレート(PEN) ,ポリアミド(PA) ,ポリイミド(PI) ,ポリフエ 二レンサルファイド(PPS) ,ポリエーテルエーテルケトン(PEEK) ,ポリエーテルサノレ ホン(PES) ,及びポリエーテルイミド(PEI)から選ばれる少なくとも 1つのフィルムであ る、請求項 12〜; 14のいずれか 1項に記載の RFIDタグ構造体。  [15] The hard resin plate or film is made of polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyimide (PI), polyphenylene sulfide (PPS), 15. The RFID according to claim 12, wherein the RFID is at least one film selected from polyetheretherketone (PEEK), polyethersanorephone (PES), and polyetherimide (PEI). Tag structure.
[16] 前記硬質の樹脂板又はフィルムが、予めァニールされている、請求項 12〜; 15のい ずれか 1項に記載の RFIDタグ構造体。  [16] The RFID tag structure according to any one of [12] to [15], wherein the hard resin plate or film is annealed in advance.
[17] 前記 RFIDタグのベースフィルム力 S、ポリエチレンテレフタレート(PET) ,ポリエチレ ンナフタレート(PEN) ,ポリアミド(PA) ,ポリイミド(PI) ,ポリフエ二レンサルファイド(P PS) ,ポリエーテルエーテルケトン(PEEK) ,ポリエーテルサルホン(PES) ,及びポリ エーテルイミド(PEI)から選ばれる少なくとも 1つのフィルムである、請求項 1に記載の RFIDタグ構造体。  [17] Base film strength of the RFID tag S, Polyethylene terephthalate (PET), Polyethylene naphthalate (PEN), Polyamide (PA), Polyimide (PI), Polyphenylene sulfide (P PS), Polyether ether ketone (PEEK) 2. The RFID tag structure according to claim 1, wherein the RFID tag structure is at least one film selected from polyethersulfone (PES) and polyetherimide (PEI).
[18] 前記発泡樹脂シート層の吸着面には、粘着剤又は接着剤を存在させない、請求項 [18] The pressure-sensitive adhesive or adhesive is not present on the adsorption surface of the foamed resin sheet layer.
;!〜 1 7のいずれ力、 1項に記載の RFIDタグ構造体。 ; RFID tag structure according to any one of 1 to 7;
[19] 前記 RFIDタグ構造体の最外層の発泡樹脂シート層吸着面を、管理対象物に取り 付ける、請求項 1〜; 18のいずれか 1項に記載の RFIDタグ構造体。 [19] The RFID tag structure according to any one of [1] to [18], wherein the outermost foamed resin sheet layer adsorption surface of the RFID tag structure is attached to an object to be managed.
PCT/JP2007/066773 2006-08-29 2007-08-29 Rfid tag structure WO2008026640A1 (en)

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JP2006232683A JP2008059085A (en) 2006-08-29 2006-08-29 Information management tag
JP2006232684A JP2008059086A (en) 2006-08-29 2006-08-29 Rfid tag structure

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