WO2008026640A1

WO2008026640A1 - Rfid tag structure

Info

Publication number: WO2008026640A1
Application number: PCT/JP2007/066773
Authority: WO
Inventors: Kazuto Kokuryo; Satoshi Furusawa
Original assignee: Nippon Sheet Glass Company, Limited
Priority date: 2006-08-29
Filing date: 2007-08-29
Publication date: 2008-03-06

Abstract

In a RFID tag structure, a RFID tag having an antenna (12) and a semiconductor chip (13) connected to the antenna is formed on the front surface of a base film (11), and at least on the front surface or the rear surface of the RFID tag, a suction layer (22) having many fine suckers (23) on the surface is formed by having or without having a sheet film (21) in between. Thus, the RFID tag can be reused and easily attached to or removed from an object to be managed, without deteriorating the appearance of the object even when the RFID tag is removed.

Description

Specification

RFID tag structure

Technical field

The present invention relates to an RFID tag structure used for merchandise management, for example. Furthermore, the present invention relates to an RFID tag structure that can be used even when exposed to high temperatures. For example, the RFID tag structure can withstand high temperatures in the laminated glass laminating process and can withstand repeated use.

Background art

[0002] RFID (Radio Frequency Identification) tags incorporating an antenna and an IC chip have begun to be used for product management. The price of RFID tags (hereinafter also referred to as IC tags) is increasing due to mass production. However, the actual situation is that it is still expensive to use the product once it is pasted on the product to be managed, such as a barcode.

[0003] Therefore, in order to popularize IC tags for system use such as product management, it is indispensable to reduce the cost of IC tags. In order to reduce the cost of IC tags, it is important to establish a mechanism for reusing IC tags, as well as establishing inexpensive mass production technology.

[0004] Incidentally, the structure of an IC tag is generally as follows. That is, as shown in FIG. 18A, an antenna 112 is formed on a polyethylene terephthalate (PET) phenolic 111 serving as a base, an IC chip 113 is connected to the antenna, and the antenna and the IC chip are further protected. A protective film (for example, a PET film) 114 is bonded and laminated with an adhesive. 100 is an IC tag.

[0005] Note that as the IC tag, a protective film is not used but a structure by potting with a thermosetting resin is also used. That is, as shown in FIG. 18B, an antenna 112 is formed on a PET film 111, an IC chip 113 is connected to the antenna, and a connection portion between the antenna and the semiconductor chip is connected to a thermosetting resin. According to (potting) 115, a protective structure is also used.

[0006] As a method of attaching this IC tag to an object to be managed (hereinafter referred to as "object!"), Force using a double-sided adhesive tape affixed to the back surface of the base film of the IC tag, or applied contact Often due to a dressing. Also, it was more common to use the IC tag assuming that it would not be removed once the IC tag was attached to the object.

[0007] Here, in order to reuse an IC tag attached to an object, the IC tag must be removed from the object.

[0008] When removing the IC tag, the IC tag must be peeled off with a force exceeding the adhesive strength of the double-sided adhesive tape or adhesive. At this time, there is a problem that the IC tag is bent, and the electrical connection between the antenna and the IC chip is often lost, so that the IC tag does not function. In addition, there is an invention that loses the function of the IC tag by placing importance on individual management by the IC tag and peeling the IC tag from the object.

[0009] If the IC tag is repeatedly attached and removed, the connection between the antenna and the IC chip

, Stress force S will be applied many times, and electrical connection may be lost.

[0010] Furthermore, after the IC tag is removed, the adhesive remains on the surface of the object, which may impair the appearance.

[0011] Patent Document 1 discloses a home delivery slip with an IC tag, which is characterized in that an IC tag is attached to a collection slip portion of the home delivery slip, and ensures the collection of the IC tag. However, to reuse the IC tag, the collection slip and the IC tag must be peeled off using a cleaning solution!

[0012] Further, Patent Document 2 describes an IC tag in which an IC tag is loaded on an inner surface where a base material and a covering material are overlapped without bonding, and the base material, the covering material, and the periphery are joined by an adhesive layer. The inclusion body is disclosed. With this configuration, the IC tag can be easily removed and reused easily. However, the IC tag enclosure itself is adhered to the management object via an adhesive layer.

Patent Document 3 proposes a clip having an IC tag as a mechanism for attaching the IC tag to an object. However, there was a problem that the clip had to be used and the versatility was poor.

[0014] Patent Document 4 proposes forming a small bag with a heat-resistant protective film and enclosing an IC tag (RFID tag) therein. However, there is no disclosure about how to attach to the management object. [0015] Patent Document 5 proposes an IC tag for clothing (RFID tag) in which urethane resin is bonded and protected on both the upper and lower surfaces of a film-like circuit portion on which an IC chip and an antenna are mounted. . The IC chip and the antenna are protected by the flexibility and elasticity of this urethane resin. For the attachment to clothing, a method using a double-sided adhesive sheet (tape) is disclosed.

[0016] Patent Document 6 proposes a cleaning IC tag (RFID tag) in which an IC tag inlet is set in a tray storage portion, and resin is poured into the tray storage portion to embed it into an integrated structure.

The IC chip and the antenna coil of the IC tag inlet are protected by a thermosetting resin. There is no disclosure about attachment to clothing.

[0017] Further, regarding RFID tags having chemical resistance and heat resistance, Patent Document 7 describes that an antenna circuit and an IC chip are sandwiched by thermally bonding two plastic films each having a thermal adhesive layer on one side. An IC tag (RFID tag) manufacturing method has been proposed. This thermal bonding is a method in which heat is applied to two plastic films with a heat press laminator to melt the thermal adhesive layer and bond the films together. Furthermore, it has also been proposed that at least one of the plastic films is a polyester film containing cavities. This uses the cushioning properties to absorb the unevenness of the antenna, etc., and alleviates the problem of unevenness appearing on the tag surface.

Patent Document 1: Japanese Unexamined Patent Application Publication No. 2006-001069

Patent Document 2: JP 2002-157569 Koyuki

Patent Document 3: Japanese Patent Laid-Open No. 2005-216275

Patent Document 4: Japanese Patent Laid-Open No. 2001-66990

Patent Document 5: JP 2005-56362 Koyuki

Patent Document 6: Japanese Unexamined Patent Publication No. 2006-95153

Patent Document 7: Japanese Unexamined Patent Application Publication No. 2005-209171

Disclosure of the invention

The present invention provides an RFID tag structure that can be easily attached to and detached from an object to be managed in order to make the IC tag reusable. It also provides an RFID tag structure that does not impair the appearance of the management target after the IC tag is removed. Furthermore, the present invention uses an adhesive or the like. To provide a heat resistant RFID tag structure that can be used.

[0019] The RFID tag structure of the present invention includes a RFID tag in which an antenna and a semiconductor chip connected thereto are formed on the surface of a base film, and a sheet on at least one of the front surface or the back surface of the RFID tag. It is characterized by having a foamed resin sheet layer having an adsorption function by having a large number of fine suction cups on the surface with or without a film.

[0020] The heat-resistant RFID tag structure of the present invention has a structure in which the foaming resin sheet layer having the adsorption function is adsorbed directly to the antenna and the semiconductor chip connected thereto. .

Brief Description of Drawings

FIG. 1A is a schematic sectional view of Example 1 of the present invention.

FIG. 1B shows the result of observing the surface of the foamable acrylic resin used in Example 1.

FIG. 1C is a result of observing a cross section of the foamable acrylic resin used in Example 1.

FIG. 1D is a schematic cross-sectional view of a modification of the first embodiment.

FIG. 1E is a plan view of another modification of the first embodiment.

FIG. 2A is a schematic sectional view of Example 2. FIG.

FIG. 2B is a schematic cross-sectional view of a modification of the second embodiment.

FIG. 3A is a schematic cross-sectional view of Example 3. FIG.

FIG. 3B is a schematic cross-sectional view of a modified example of Example 3.

FIG. 4A is a schematic sectional view of Example 4. FIG.

FIG. 4B is a schematic cross-sectional view of a modification of the fourth embodiment.

[FIG. 5] FIG. 5 shows an example in which an adsorption layer is formed by screen-printing a resin having the same flexibility to form a large number of small suction cups.

FIG. 6 is a schematic cross-sectional view of a double-sided adsorbable foamed resin sheet used in the present invention.

FIG. 7 is a photograph of the adsorption surface of the foamed resin sheet used in the present invention, observed with a scanning electron microscope.

FIG. 8 is a photograph of a cross section of the foamed resin sheet observed with a scanning electron microscope. FIG. 9 is a sectional view of an information management tag in Embodiment 5 of the present invention.

FIG. 10 is a perspective view of the RFID tag in FIG.

[Fig. 11] A cross-sectional view of the information management tag adsorbed on an automotive windshield glass.

[Fig. 12] A plan view of the information management tag adsorbed on a car windshield glass.

FIG. 13 is a photograph obtained by observing the adsorption surface of the foamed resin sheet used in Example 5 of the present invention after heat treatment at 150 ° C. for 90 minutes with a scanning electron microscope.

FIG. 14 is a sectional view of an information management tag in Embodiment 6 of the present invention.

FIG. 15 is a cross-sectional view of an information management tag in Embodiment 7 of the present invention.

FIG. 16 is a sectional view of an information management tag in Embodiment 8 of the present invention.

FIG. 17 is a cross-sectional view of an information management tag in Embodiment 9 of the present invention.

FIG. 18A and FIG. 18B are schematic cross-sectional views of conventional general IC tags.

BEST MODE FOR CARRYING OUT THE INVENTION

[0022] In the RFID tag structure according to the present invention, the surface in contact with the management target has an adsorption structure provided with a number of minute suction cups. As a result, it is possible to provide an RFID tag structure that can be repeatedly adsorbed to the management object, can be reused, and does not leave an adhesion trace on the surface of the management object. In other words, no adhesive or adhesive is used on the surface that comes into contact with the product, so there will be no trace of adhesion. Also, when it becomes reusable, even if expensive RFID tags are used, the cost per use can be reduced.

[0023] In the RFID tag structure according to the present invention, it is preferable that one of the films is a rigid member. The RFID tag structure according to the present invention may be configured by further laminating a resin rigid plate.

[0024] Further, the adsorption structure in the RFID tag structure according to the present invention is preferably made of, for example, a foamed resin sheet obtained by foaming acrylic resin.

[0025] Further, in the RFID tag structure, when the film constituting the RFID tag structure is made of a rigid member or laminated with a rigid resin plate, the antenna and the semiconductor are not bent excessively when removed. A poor electrical connection with the chip can be prevented. [0026] For example, when a sheet having a fine suction cup on the surface is adsorbed to an object, the sheet is easily peeled off when the end of the sheet is rolled up. If the RFID tag structure according to the present invention has a rigid configuration as described above, it is possible to prevent the end from rolling up, and thus it is possible to obtain an RFID tag structure that is difficult to come off in a normal use level.

[0027] In the present specification, adsorption is used to mean adsorption by a fine suction cup, and is different from so-called chemical adsorption or physical adsorption.

[0028] Thus, the RFID tag structure according to the present invention has an adsorption structure on at least one of the front surface and the back surface thereof, so that it can be easily attached to an object having a smooth surface with a force S.

[0029] In addition, the adhesive does not need to be interposed on the adsorption surface. When the RFID tag is removed, no adhesive remains! /, So that the appearance of the management target is not impaired.

[0030] The adsorbing structure of the present invention may be formed by applying a foamed resin sheet technique or by a printing technique using a flexible resin as a suction cup structure. This foamed resin sheet is made of a resin such as acrylic resin, silicone rubber, silicone gel, or fluororubber. Preferably, an elastic resin is used. A gas such as air is added to the resin raw material, and it is subjected to a mechanical foaming machine, formed into a sheet, dried and vulcanized or crosslinked. After forming the sheet, gas escapes from the surface of the sheet or bubbles are destroyed and foam marks are generated. If this foaming mark is left as it is, vulcanization or crosslinking is carried out to form a suction cup (hereinafter also referred to as a foam suction cup) consisting of a foam hole. A preferable number of the foam suction cups is 10,000 to 30,000 / cm ² . This foam suction cup can be repeatedly attracted to the object to be managed. Independent foaming remains in the sheet.

[0031] Other materials for the foam sucker include polystyrene elastomers (for example, trade names “Tuffprene” and “Tough Tech” manufactured by Asahi Kasei Kogyo Co., Ltd.), olefin elastomers (for example, product name “Dynalon CEBC” manufactured by JSR, Mitsui Chemicals, trade name "Mistramer"), urethane elastomer, estenore elastomer, amide elastomer, chlorinated polyethylene elastomer, Syn-1,2-polybutadiene, Trans_l, 4-polyisoprene, fluorine Elastomer can be used. These are described in the “Plastics' Data Book” published by the Industrial Research Council, December 1, 1999, pp. 854-857, and in the present invention the polymers described therein are also described. One can be used.

[0032] The average diameter of the foam suction cup is preferably in the range of 1 to 300 111. There should be no pressure-sensitive adhesive or adhesive on the surface in contact with the controlled object. Adhesives and adhesives have a problem of heat resistance, and there is a problem that marks remain after they are removed.

[0033] Furthermore, in the RFID tag structure of the present invention, in order to protect the IC chip and the antenna of the IC tag, the foamed resin sheet is directly adsorbed, and the base film of the IC tag and the foamed resin sheet are It is good to be integrated.

[0034] Such a foamed resin sheet is commercially available under the following trade names. These include Zeon AL Sheet (Zeon Kasei Co., Ltd.), Diafit (Diamic Co., Ltd.), Pitatto-kun (Ookura Paper Co., Ltd.). Since these foamed resin sheets do not use an adhesive or the like, the foamed resin sheet has a characteristic that the adhesive or the like remains on the peeled mark.

[0035] The adsorption structure using the printing technique may be manufactured by, for example, a method disclosed in Japanese Patent Laid-Open No. 6-238845. This is a method for forming a sucker by “printing a continuous sucker-type pattern of mesh-like suckers on a softened ink-like substance by a screen printing method”. Japanese Patent Laid-Open No. 2000-274421 also discloses a similar technique.

Yes

[0036] In order to adsorb the RFID tag structure of the present invention to an object to be managed, it is only necessary to lightly press it with a hand. Thereby, for example, an adsorption force of about 80 to 90 kg / cm ² can be obtained. When removing the RFID tag structure from the object to be managed, it can be easily removed by peeling it off from the edge. Since the RFID tag structure is only attached by adsorption, no trace remains after removal.

[0037] The RFID tag structure of the present invention includes a semiconductor chip and an antenna connected to the semiconductor chip on the surface of the base film. As a result, electric power is supplied from the antenna to the semiconductor chip by electromagnetic induction, and various management information is written. For example, various information such as varieties, raw materials, production history, usage, user name, destination, etc. If this information is read correctly, it can be used for many managements such as production management, supply management, and quality control.

[0038] The heat-resistant RFID tag structure of the present invention has a semiconductor chip on the surface of the base film. RFID tag on which the antenna and the antenna connected to the RFID tag are formed, and a first foamed resin sheet having a large number of bubble holes formed on at least one main surface of the first film sheet as an adsorption surface. The adsorption surface of the resin sheet is directly adsorbed to the semiconductor chip and the antenna. With this configuration, in the information management tag, since the protective member for protecting the semiconductor chip and the antenna is not fixed with an adhesive or the like, there is no problem caused by the adhesive or the like caused by heating. Further, the used foamed resin sheet does not change in quality or discolor. However, since the foamed resin sheet contains a large amount of air in the form of foam, it has heat insulation properties and high heat resistance. Therefore, according to the present invention, an information management tag with high heat resistance can be obtained.

[0039] The foamed resin sheet used in the present invention can be obtained by mixing gas into the resin during production. For this reason, the resin itself is basically a foam containing closed cells, and since it contains air, it has heat insulation properties and high heat resistance. In addition, since this foamed resin sheet has flexibility, is a foam, and has cushioning properties, the semiconductor chip and the antenna can be sufficiently protected from damage due to contact or the like.

[0040] The information management tag of the present invention preferably has a configuration in which a bubble hole is further provided and the suction surface is arranged on the outside. With this suction surface, it is possible to repeat attachment and removal with the management object.

[0041] The information management tag according to the present invention may be configured by further laminating a hard resin plate or film. If it is configured by laminating a hard resin plate or film, the information management tag will not be folded or bent excessively when it is removed, and the semiconductor chip and the antenna cannot be electrically connected. There is no fear.

[0042] Furthermore, the foamed resin sheet used in the present invention tends to be easily peeled off when its end is rolled up. If the information management tag is configured by laminating a hard resin plate or film, it is possible to prevent the edge from rolling up, so that the information management tag cannot be easily removed in the normal use.

[0043] Furthermore, in the information management tag having a configuration in which a hard resin plate or film is disposed on the outermost side opposite to the attachment means, the IC chip and the antenna are more sufficiently protected.

[0044] In the heat-resistant RFID tag structure of the present invention, the adsorption surface of the foamed resin sheet has a semiconductor Directly adsorbed to the chip and antenna. For this reason, even if the information management tag is exposed to a high temperature, since the adhesive is not used, the adhesive does not cure and shrink.

. For this reason, since the stress force s is not particularly applied to the joint between the IC chip and the antenna, the information management tag of the present invention is excellent in heat resistance.

[0045] Further, it is preferable that a foamed resin sheet is provided on the surface of the information management tag of the present invention that contacts the management target. Due to the adsorption action of this resin sheet, it is possible to repeatedly attach and remove it to the management object. As a result, it is possible to provide an information management tag that can be reused and does not leave any trace of adhesion on the management target. In this way, once reuse becomes possible, the cost per use can be reduced even if an expensive RFI D tag is used.

[0046] In addition, when the information management tag of the present invention is configured by laminating a hard resin plate or film, the information management tag can be handled safely. Moreover, there is no risk of damaging the RFID tag even after repeated mounting and removal.

[0047] In order to obtain a heat-resistant information management tag, the following preliminary examination was performed.

[0048] 1. Preliminary study 1

A standard RFID tag (both base film and protective film made of PET) was affixed to the glass plate with an adhesive layer attached in advance to the back side. We put it in a thermostatic bath, raised the temperature to about 130 ° C, and kept it for 90 minutes, repeating the heat cycle several times, and confirmed the change due to the heat of the RFID tag.

[0049] As a result, it was observed that the film of the RFID tag was shrunk particularly at the edge due to the influence of heat. It was also recognized that the tendency was remarkable in the protective film. In addition, RFID tags that could not be read after several cycles of thermal cycling were recognized. From this, it was expected that due to the shrinkage of the film, stress was applied to the joint between the semiconductor chip and the antenna, and the electrical connection could be uncertain.

[0050] 2. Preliminary study 2

Based on the findings from Preliminary Study 1, in order to suppress the shrinkage of the RFID tag film, another tape was applied on the RFID tag attached to the glass plate, and approximately 1.5 MPa (15 atm) in the autoclave. A heating experiment was performed in which heating was performed at 150 ° C. for 90 minutes under the pressure of the above. Fluoropolymer tape (No.841, manufactured by Teraoka Seisakusho, Nittoden) Nitoflon No.903UL) and polyester tape (Teraoka Seisakusho No.631S) were used.

[0051] Regarding RFID tags, three types of RFI D tags with different structures were prepared and used for heating experiments with autoclave to confirm the shrinkage of the film. Each prepared RFID tag has the following structure.

(1) Normal type: Type with a thinner protective film than the base film

(2) Protective film is thick! /, Type: Type that uses the same protective film as the base film

(3) Laundry type: An RFID tag developed to be applicable to cleaning, and a type that is said to be further laminated to the RFID tag of type (2) above

[0052] As a result of Preliminary Study 2, even if a heat-resistant fluororesin tape was used, the adhesive used was hardened and contracted by heat, and the RFID tag was distorted. In addition, it was expanded by aerodynamic heating that seems to have been taken in when the protective film was taken into the shellfish, and the force S was applied in the direction in which the protective film was contracted, which further distorted the RFID tag. Force that seems to be due to that I could not read ID information.

[0053] Further, in any of the above three types of RFID tags, the result was the same as the result 1 described above, and D information could not be read.

[0054] From the above, the member strength for protecting the IC chip and the antenna has heat resistance, for example! / Even if it is fixed with an adhesive, the adhesive is cured by heat and shrinks. . For this reason, the RFID tag is distorted and D information cannot be read by the RFID tag. Therefore, we have found that it is necessary to fix the RFID tag regardless of the adhesive to make it heat resistant.

[0055] As a method for fixing the protective member without using an adhesive, first, an adhesive material was examined. Adhesive material can be applied if a heat-resistant material is selected.

[0056] However, if dust or dirt adheres to the surface of the adhesive material, the adhesive strength is extremely reduced. For this reason, it was judged that it was not suitable from a practical viewpoint.

Next, fixing with a suction cup was considered. We examined a sucker sheet that was molded with silicone rubber and formed many suction cups on the surface. As a preliminary experiment, a suction cup And heated for 90 minutes at a temperature of 150 ° C. under a pressure of about 1.5 MPa (15 atm) in an autoclave. As a result, a part of the sucker sheet was welded to the glass plate. Moreover, once the suction cup sheet was removed, it could not be reused. Based on the above, it was judged that the suction cup sheet was not appropriate.

[0058] Further, fixing with a micro suction cup was considered. For example, we used a foamed resin sheet made by foaming acrylic resin and forming a large number of foam holes on the surface to make it an adsorption surface, and used it as a protective film for RFID tags. The above-mentioned foamed resin sheet is adsorbed to an RFID tag (hereinafter also referred to as a bare IC tag) that has an IC chip and an antenna exposed by a PET protective film, and is about 1.5 MPa (15 atm) in an autoclave. And heating for 90 minutes at a temperature of 150 ° C. When the RFID tag was observed after heating, there was no problem in reading the ID information, which did not change in appearance.

[0059] 3. Preliminary study 3

Furthermore, we applied the adsorption surface of this foamed resin sheet as a structure for attaching RFID tags to products. For examination, this foamed resin sheet was adsorbed on a glass plate and a heating experiment was conducted in an autoclave. The autoclave is heated by hot air circulation, and is exposed to hot air at a speed of 3 to 4 m / sec. As a result of the heating experiment, the foamed resin sheet kept adsorbed on the glass plate. Furthermore, no curling of the edge of the foamed resin sheet due to the blowing of hot air was observed. From the above, it was found that this foamed resin sheet is also useful as a structure for attaching RFID tags to products and the like.

[0060] It was confirmed that the acrylic foamed resin sheet used for the preliminary study had no shape change, and no particularly problematic shrinkage, in a heating experiment using autoclave.

[0061] The present invention has been completed by the inventor's examination and novel ideas as described above.

[0062] The information management tag of the present invention naturally has a normal RFID tag function. Basically, D information is written on the IC chip. Furthermore, various management information can be written in a writable semiconductor chip. For example, various information such as varieties, raw materials, production history, usage, user name, destination, etc. If this information is read correctly, it can be used for many managements such as production control, supply control, quality control, etc., and it is useful. [0063] As an example, the delivery of glass products by the so-called Kanban system of an automobile manufacturer will be described. First, the delivery date, time, and location are specified according to the assembly schedule of various types of vehicles. In addition, various glass products such as windshield glass, side glass, rear glass, and roof glass with different shapes and sizes need to be supplied in the assembling order. In order to execute this without fail, individual management using a computer is useful. In order to carry out this individual management, it is preferable if an information management tag can be attached before the glass base plate is supplied to the processing line. The information management tag of the present invention is suitable for such a use.

[0064] Of the glass for automobiles, laminated glass is used mainly for windshield glass, in which an interlayer film made of polyvinyl butyral (PVB) is sandwiched between two glasses and heat-treated. . The heat treatment is performed in an autoclave, for example, under a pressure of about 1.5 MPa (15 atm) at a temperature of 150 ° C. for 90 minutes. If the information management tag can withstand the heat treatment conditions of laminated glass, for example, it can be managed individually from the stage before it is put into the autoclave, so that more accurate control can be achieved.

[0065] The adsorbable foamed resin sheet affixed to the information management tag of the present invention is preferably made from a resin such as acrylic resin, silicone rubber, silicone gel, or fluororubber. Preferably, an elastic resin is used. A gas such as air is added to the resin raw material, and it is applied to a mechanical foaming machine, spread on a film sheet, and dried. Then, gas escapes from the surface or bubbles are destroyed and foam marks are generated. If this foaming mark is left as it is and vulcanized or crosslinked, a suction cup composed of a foam hole (hereinafter also referred to as a foam suction cup) is formed. The preferred number of foam suckers is 10,000 to 30,000 / cm ² . Independent foam remains in the foamed resin sheet.

[0066] Such a foamed resin sheet is commercially available under the following trade names. Zeon AL sheet (Zeon Kasei Co., Ltd.), Diafit (Diamic Co., Ltd.), Pitatto-kun (Ookura Paper Co., Ltd.), etc.

[0067] The average diameter of the foam suction cup is preferably in the range of 1 to 300 m. No adhesive or adhesive is present on the adsorption surface of the foamed resin sheet. As described above, adhesives and adhesives change in quality or discolor due to heating, causing problems. Also removed from the management object There is also a problem that marks are left behind.

[0068] Other materials for the foamed resin sheet include polystyrene-based elastomers (for example, trade names “Tuffprene” and “Tuftec” manufactured by Asahi Kasei Kogyo Co., Ltd.), and olefin-based elastomers (for example, product names “Dynalon” manufactured by JSR Corporation). CEBC ", trade name" Mistramer "manufactured by Mitsui Chemicals, Inc.), urethane elastomer, estenole elastomer, amide elastomer, chlorinated polyethylene elastomer, Syn-1,2-polybutadiene, Trans_l, 4-polyisoprene Fluorine-based elastomers can be used. These are described in “Plastics Data Book” published by the Industrial Research Council, December 1, 1999, pages 854 to 857, and the polymers described in these can also be used in the present invention.

[0069] Materials for the base film of the RFID tag include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyimide (PI), polyphenylene sulfide (PPS), polyether ether ketone ( PEEK), polyethersulfone (PES), or polyetherimide (PEI) can be used.

[0070] In addition, the material of the hard resin plate or film includes polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyimide (PI), and polyphenylene sulfide. (PPS), polyetheretherketone (PEEK), polyethersulfone (PES), or polyetherimide (PEI) can be used.

[0071] Further, the thickness of the hard resin plate or film is such that when the information management tag is removed, the information management tag is not deformed to such an extent that the electrical connection between the antenna and the IC chip does not cause a problem. As long as it has. In addition, when the information management tag is attached to the management object by the foamed resin sheet, the degree of deformation of the information management tag varies depending on the adsorption force of the foamed resin sheet. Furthermore, the rigidity of resin plates and films varies depending on the material. Therefore, the preferable thickness of the resin plate or film may be determined in consideration of the difference in material and the adsorption power of the foamed resin sheet. For example, an appropriate thickness may be selected from commercially available resin boards and films.

[0072] The hard resin plate or film is preferably annealed (heat treated) in advance in order to remove the remaining distortion. When annealing, it is adsorbed to the foamed resin sheet used in the present invention, and this foamed resin sheet is further heated to a heat resistant plate such as a flat glass plate. It is good to heat-treat it. For example, a polypropylene (PP) sheet (melting point: 160 ° C to 165 ° C, heat distortion temperature: 124 ° C) or a polyethylene terephthalate (PET) film (melting point: 255 ° C, glass transition temperature: 76) Even if heat treatment is performed at 150 ° C for 90 minutes at 150 ° C to 77 ° C, the shrinkage force does not deform, which is preferable.

[0073] This is presumably because the entire surface of the PP sheet or PET film is adsorbed and fixed by the foamed resin sheet, so that deformation does not occur. If a hard resin plate or film annealed in advance using such a phenomenon is used, further shrinkage can be prevented and dimensional stability is improved. It is a surprising phenomenon that when a hard resin plate or film is annealed (heat treated), it is not deformed if it is adsorbed to a foamed resin sheet. The reason is that a PP sheet or PET film alone is heat-treated at 150 ° C for 90 minutes, and it always deforms and becomes amorphous.

In the present invention, an information management tag having a suction surface on the outer side may be lightly pressed by hand to be sucked onto a management object (eg, glass). In this way, for example, an adsorption force of about 80 to 90 kg / cm ² can be obtained. When removing the information management tag from the management object, it can be easily removed by peeling it off the edge. The information management tag is only attached by adsorption! /, Te! /, So there will be no traces after removal!

[0075] The information management tag of the present invention may be a glass production management tag. The foamed resin sheet integrated with the information management tag of the present invention has a bubble-like hole portion with high heat resistance, and has a tackiness. For this reason, even if glass contacts, there is an advantage that neither the glass nor the information management tag is damaged by the buffering action. In particular, when applied to glass for automobiles, the information management tag of the present invention can be adsorbed to a black ceramic print portion which is printed around the glass and has a thickness of about 15 m. Although this ceramic print has some irregularities, the foamed resin sheet is flexible and can be adsorbed.

Example

[0076] Hereinafter, the present invention will be described more specifically with reference to examples. In the following embodiments, the same reference numerals indicate the same parts, and the description may be omitted.

[0077] (Example 1)

(1) Production of foamed resin sheet Acrylic copolymer resin (trade name “DICNAL MEP-20WO” manufactured by Dainippon Chemical Co., Ltd.) 1 OOOg, 100 g of foam stabilizer (trade name “DICNAL M-40” manufactured by Dainippon Chemical Co., Ltd.), and thickener ( Dainippon Chemical Co., Ltd. trade name "DICNAL MX") 100g and crosslinker melamine resin (Dainippon Chemical Co., Ltd. product)

Place the Roussilon in a mechanical foaming machine and mix it with air.

[0078] This acrylic emulsion solution was applied to the surface of a polyethylene terephthalate sheet film (width 30 cm, thickness 50 μm, long product) with a knife coater so that the dry thickness was 200 μm. Immediately thereafter, crosslinking was carried out while drying from 110 ° C to 140 ° C over 9 minutes. Thereafter, a polyethylene terephthalate protective film having a thickness of 30 m was coated on the crosslinked acrylic resin foam layer. Thus, an acrylic resin foam layer could be formed on one side of the polyethylene terephthalate sheet film.

[0079] The foam layer surface of the acrylic resin, foam marks gas escapes or foam is made form by the destruction was present in a proportion of from 10,000 to 30,000 pieces / cm ^2. The surface of this foam layer functions as an adsorption surface.

In this way, a foamed resin sheet made of a foamable acrylic resin was produced. When this foamed resin sheet was pressed against a glass plate, an adsorption force of 80 to 90 kg / cm ² was obtained.

[0081] It should be noted that a double-sided foamed resin sheet can be obtained by applying this acrylic emulsion solution to the back surface of the above-described sheet film and crosslinking it.

[0082] (2) RFID tag formation

FIG. 1A shows a schematic sectional view of Example 1. FIG. First, an RFID tag 10 in which an antenna 12 and a semiconductor chip 13 connected to the antenna 12 were formed on the surface of the base film 11 and a protective film 14 was further laminated thereon was prepared.

[0083] RFID having a structure in which a sheet film 21 having a foamable acrylic resin adsorption layer 22 formed on the back surface of the base film 11 of the RFID tag 10, that is, a foamed resin sheet 20, is bonded via an adhesive layer 30. Tag structure 1. Many suction cups 23 are formed on the suction surface 24 of the foamed resin sheet 20. Note that a double-sided adhesive tape may be used instead of the adhesive layer. [0084] Results of observation of the surface (adsorption surface) and the cross section of the foamable acrylic resin with a scanning electron microscope (manufactured by Hitachi, S-4500, acceleration voltage: 5 kV, photographing magnification: 250 times) Are shown in Figures 1B and 1C, respectively.

[0085] According to the observation results, a large number of open bubbles are observed on the surface of the foamable acrylic resin. Inside the foamable acrylic resin, some bubbles are observed as if multiple bubbles are united, but the cross-sectional observation force shows that the bubbles communicate from the front to the back. Independent bubbles are formed. A large number of bubbles present on the surface of the foamable acrylic resin function as fine suction cups to form a foamed resin sheet.

[0086] The foamed resin sheet had a thickness of lmm, and was cut into a size of 30mm in length and 70mm in width.

In order to adsorb the foamed resin sheet to an object to be managed (for example, an electrical appliance), it is only necessary to lightly press it by hand. Thereby, for example, an adsorption force of about 80 to 90 kg / cm ² can be obtained. The average diameter of the foam sucker ranges from 1 to 300 111.

[0087] In Example 1 shown in Fig. 1A, the RFID tag structure according to the present invention can be easily obtained by simply adhering a commercially available foamed resin sheet to an existing IC tag with an adhesive or a double-sided adhesive tape. Obtainable.

[0088] With such a structure, the RFID tag structure according to the present invention can be easily attached to an object. Also, no adhesive remains when the RFID tag structure is removed.

[0089] At this time, it is preferable that the foamed resin sheet be made difficult to be bent by changing the force and material to make the sheet film thick. This is preferable because the connection between the semiconductor chip and the antenna becomes painful when the RFID tag structure is removed. The base film material is preferably polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET), etc./.

[0090] In addition, it is possible to make the base film of the IC tag thick, change the material, etc. to make it difficult to bend, and the protective film may be hard to bend. . The sheet film may be a film material similar to the base film.

Furthermore, the base film 11 of the IC tag and the sheet film 21 of the foamed resin sheet may be shared as shown in FIG. 1D.

[0092] In Example 1, a foamed resin sheet 20 matching the size of an existing IC tag 10 is bonded. The configuration was as follows. The size of the IC tag 10 is 10 mm long, 45 mm wide, and about 100 m thick, and it may not be large enough from the viewpoint of ease of handling and visibility. Since the size of the existing IC tag is almost the same, if necessary, the foamed resin sheet 20 is made larger than the existing IC tag 10 and the IC tag 10 is arranged in the center as shown in Fig. 1E. Thus, the RFID tag structure 1 may be configured. In addition, if the RFID tag structure is not easily peeled off, an IC tag may be arranged not only at the center but also at the end.

[0093] (Example 2)

FIG. 2A shows a schematic cross-sectional view of Example 2. This Example 2 has the same structure as that of Example 1 except that the sheet film 21 having a foamable acrylic resin adsorbing layer formed thereon is bonded to the surface of the IC tag protective film 14 via the adhesive layer 30. It is.

Further, the IC tag protection film 14 and the foamed resin sheet film 21 may be shared as shown in FIG. 2B.

[Example 3]

FIG. 3A shows a schematic cross-sectional view of Example 3. Example 3 is an example in which a resin plate made of PP (polypropylene), PE (polyethylene), PET, acrylic resin, or the like is laminated, and the resin rigid plate 40 is bonded onto the protective film of Example 1. (Adhesive layer not shown) are stacked. If the laminated structure as shown in FIG. 3A is used, the resin rigid plate 40 can protect the surface of the IC tag 10, and if the resin rigid plate 40 is gripped, the RFID tag structure 1 may be damaged. There is no, you can ring.

[0096] If the resin rigid plate is not positioned on the surface in contact with the object, the stacking position is not particularly limited, and as shown in Fig. 3B, the resin is placed between the IC tag 10 and the foamed resin sheet 20. A rigid plate 40 may be provided. The adhesive layer between the resin rigid plate 40 and the protective film 14 of the IC tag 10 is not shown.

[0097] It should be noted that if the thickness of the resin rigid plate is about 0.3 to 2 mm, the RFID tag structure of the present invention has sufficient rigidity and is easy to handle. There is no damage to the connection between the antenna and the semiconductor chip when removing.

[0098] In the third embodiment, a configuration in which one resin rigid plate is laminated is used, but a configuration in which a plurality of resin rigid plates are laminated may also be used. [0099] (Example 4)

FIG. 4A shows a schematic cross-sectional view of Example 4. Example 4 is an RFID tag structure in which a semiconductor chip and an antenna are adsorbed on one side of a double-sided foamed resin sheet and the other side is used for adsorbing an object. Furthermore, in Example 4, as shown in FIG. 4B, a structure in which a resin rigid plate is bonded to the back side of the base film and laminated may be used.

[0100] In the above-described embodiments, the force exemplified by the adsorption layer made of foamable acrylic resin may be an adsorption layer made of foamable urethane resin without being limited thereto.

[0101] Further, as shown in FIG. 5, a flexible resin, for example, polychlorinated bur resin 25, is formed on the front or back surface of the IC tag so that the cross section is convex and has a mesh shape in plan view. (21, (11, 14)) may be screen-printed to form a large number of small suction cups 23 to form an adsorption structure.

[0102] (Example 5)

Example 5 The following is an example of a heat-resistant RFID tag structure! (1) Production of foamed resin sheet

Acrylic copolymer resin (trade name “DICNAL MEP-20WO” manufactured by Dainippon Chemical Co., Ltd.) 1 OOOg, 100 g of foam stabilizer (trade name “DICNAL M-40” manufactured by Dainippon Chemical Co., Ltd.), and thickener ( Dainippon Chemical Co., Ltd. trade name "DICNAL MX") 100g and crosslinker melamine resin (Dainippon Chemical Co., Ltd. product) 50g are mixed to make acrylic emulsion, and this acrylic emulsion is put into a mechanical foaming machine. Then, an acryl emulsion solution containing bubbles with a foaming ratio of 1.5 times was prepared.

[0103] This acrylic emulsion solution was applied on one side of a polyethylene terephthalate film sheet (width 30 cm, thickness 50 111, long) with a knife coater to a dry thickness of 200 mm. Immediately thereafter, crosslinking was carried out while drying from 110 ° C to 140 ° C over 9 minutes. Thereafter, a protective film made of polyethylene terephthalate having a thickness of 30 m was coated on the crosslinked acrylic resin layer. Thereafter, an acrylic emulsion solution was similarly applied to the other surface of the polyethylene terephthalate finalene sheet and crosslinked in the same manner.

[0104] In this way, acrylic resin was coated on both sides of the polyethylene terephthalate film sheet. A foamed resin sheet having a foamed layer of fat was obtained.

[0105] In the above description, a double-sided type foamed resin sheet is produced. However, it goes without saying that a single-sided type foamed resin sheet can be obtained by forming a foamed acrylic resin layer only on one side. Nor.

[0106] The surface of the acrylic resin layer of the foamed resin sheet is present at a rate of 10,000 to 30,000 pieces / cm ² of foamed traces S formed when air escapes or bubbles burst. These function as a micro suction cup. When this foamed resin sheet was pressed against a glass plate, an adsorption force of 80 to 90 kg / cm ² was obtained.

[0107] FIG. 6 shows a schematic cross-sectional view of the obtained foamed resin sheet capable of adsorbing on both sides. In FIG. 6, 54 is a polyethylene terephthalate film sheet, 53 and 55 are acrylic foamed resin layers, 63 and 65 are foam suckers, and 64 and 66 are internal bubbles. This acrylic resin layer is a closed-cell foam having elasticity.

FIG. 7 is a photograph of the adsorption surface of the foamed resin sheet observed with a scanning electron microscope (manufactured by Hitachi, Ltd., S-4500, acceleration voltage: 5 kV, photographing magnification: 250 times). It can be seen that there is a force S where a plurality of bubbles are combined, which is basically an independent foam. The boundaries of individual bubbles are clearly observed, indicating that they can function as micro-suction cups.

FIG. 8 is a photograph of the cross section of the foamed resin sheet, similarly observed with a scanning electron microscope. There is a place where a plurality of foams are united. There were no places where the foamed resin sheet communicated in the thickness direction, and the foam was confirmed to be an independent foam.

[0110] (2) Information management tag configuration

As shown in Fig. 9, the double-sided foamed resin sheet 56 is adsorbed on the surface of the bare IC tag 51 in which the IC chip and the antenna are formed on the base film 2 (thickness 50 m, polyethylene terephthalate). RFID tag 60 was constructed. This integration is possible with the pressing force of pushing by hand. Such bare IC tags are generally available for purchase.

In FIG. 9, 56 is a double-sided adsorbable foamed resin sheet obtained as described above, and acrylic foamed resin layers 53, 55 are formed on both sides of a polyethylene terephthalate film sheet 54. . Microscopic suction cups are formed on the outer surfaces of the acrylic foam resin layers 53 and 55, respectively. FIG. 10 shows a bare IC tag 51 used in this example. The bare IC tag 51 includes a semiconductor chip (IC chip) 59 and antennas 57 and 58 connected thereto on the surface of a base film 52 of a polyethylene terephthalate film. Antennas 57 and 58 are made of copper print.

[0113] (3) Application test to the alignment process

This RFID tag 60 was applied to the laminated glass laminating process. This is to confirm whether the RFID tag 60 can withstand the heating in the autoclave used in the alignment process. As shown in FIG. 11, the RFID tag 60 was adsorbed on a single glass plate 61 constituting a laminated glass. This laminated glass is an automotive windshield glass.

[0114] The adsorption position of the RFID tag 60 was the ceramic mix portion 62 formed around the glass plate 61 as shown in FIG. The RFID tag 60 was not pasted on the other glass of the windshield glass. An interlayer film made of polybulubutyral (PVB) is sandwiched between the two sheets of glass prepared in this way, put in an autoclave at a temperature of 150 ° C for 90 minutes under a pressure of 1/5 MPa, and bonded by heat treatment. Integrated.

[0115] The laminated glass thus obtained had the same quality as that without the RFID tag 60 attached thereto, and the attachment of the RFID tag had no effect on the production of the laminated glass. In addition, there was no suction mark left on the side of the force glass from which the RFID tag 60 was removed. Furthermore, no deterioration or deformation of the reading quality of the RFID tag 60 was observed.

[0116] Various information such as product name, raw material, production history, usage, user name, destination, etc. was written in the RFID tag 60, and it was possible to carry out everything from production management to supply management to customers. The RFID tag 60 could be reused repeatedly.

[0117] Fig. 13 is a photograph of the adsorption surface after heat treatment of the foamed resin sheet at 150 ° C for 90 minutes, observed with a scanning electron microscope. Part of the micro-suction cups had a force S that was damaged by heat and repeated use. Most of the suction cups remained clear, and it was confirmed that repeated use was possible.

[0118] The information management tag according to the present invention is not limited to the above configuration, and may be an information management tag having the following configuration. [0119] (Example 6)

The information management tag shown in FIG. 14 has a bare IC tag 51 and a larger double-sided foam resin sheet 56, and presses the bare IC tag 51 against the center of the main surface of the double-sided foam resin sheet 56. Further, in this example, the information management tag 50 is formed by further pressing a resin plate 70 having the same size as the foamed resin sheet 56. In this case, the information management tag 60 is attached to the management target by pressing the other main surface of the double-sided foamed resin sheet 56.

[0120] In the information management tag shown in FIG. 14, the double-sided foam resin sheet 56 is made larger than the bare IC tag 51, so that the force is the same as that of Example 5 described above, and the resin plate 70 is easily laminated. it can. Since the resin plate 70 is provided, it is preferable that the electrical connection between the IC chip and the antenna which cannot be bent excessively when removing the information management tag is lost.

[0121] In Example 6, the bare IC tag 51 is arranged in the central portion of the large foamed resin sheet 56. However, if the information management tag does not easily peel off, it is not limited to the central portion. A bare IC tag 51 may be arranged.

[0122] (Example 7)

The information management tag shown in Fig. 15 uses a single-sided foamed resin sheet 67, which is made larger than the bare IC tag 1, so that it is possible to obtain a heat-resistant information management tag with the simplest configuration. Monkey.

[0123] (Example 8)

The information management tag shown in FIG. 16 has a resin plate 70 laminated on the back side of the film sheet 54 of the foamed resin sheet 67 in the information management tag shown in FIG. 15 using an adhesive or a double-sided adhesive tape (71). Information management tag. In this case, an adhesive or double-sided adhesive tape is used to fix the resin plate. However, even if this adhesive or double-sided adhesive tape force heat shrinks and cures, the function of the information management tag will not be lost. Les.

[0124] (Example 9)

In the information management tag shown in FIG. 17, a single-sided foam resin sheet 67 is adsorbed on the surface of the bare IC tag 51, and a double-sided foam resin sheet 56 is attached to the surface of the bare IC tag 51. It is the adsorbed information management tag.

Claims

The scope of the claims

[I] An R FID (Radio Frequency Identification) tag in which an antenna and a semiconductor chip connected to the antenna are formed on the surface of the base film,

An RFID tag comprising a foamed resin sheet layer having an adsorption function by having a large number of minute suction cups on the surface, at least one of the front and back surfaces of the RFID tag, with or without a sheet film Structure.

[2] The RF ID tag structure according to claim 1, wherein the foamed resin sheet layer has a large number of foam holes on a surface thereof.

[3] The foamed resin sheet layer is formed by printing a flexible resin on at least one surface selected from the front and back surfaces of the RFID so that the cross section is convex and has a mesh shape when viewed from the top. The RFID tag structure according to claim 1 or 2, wherein:

[4] The RFID tag structure according to [1], wherein the foamed resin sheet layer is a sheet obtained by foaming an acrylic resin.

[5] The RFID tag structure according to any one of claims 1 to 4, wherein the foamed resin sheet layer is formed on the back surface of the base film with or without a sheet film interposed therebetween.

[6] When the foamed resin sheet layer is viewed from a plane larger than the RFID tag, the RFI

The D tag is disposed inside the foamed resin sheet layer, any one of claims 1 to 5.

The information management tag described in item 1.

[7] A protective film is laminated on the antenna and the semiconductor chip,

2. The RFID tag structure according to claim 1, wherein the foamed resin sheet layer is formed on the surface of the protective film with or without a sheet film.

8. The RFID tag structure according to claim 1, wherein at least one film selected from the base film and the sheet film is a rigid member.

[9] The RFID tag structure according to claim 1, wherein an adsorption surface of the foamed resin sheet layer having an adsorption function is directly adsorbed to the antenna and a semiconductor chip connected to the antenna! .

[10] The suction cups having the adsorption function are formed on both surfaces of the foamed resin sheet layer.

The RFID tag structure according to claim 1.

[II] The suction cup having the adsorption function is formed on one surface of a foamed resin sheet, 2. The RFID tag structure according to claim 1, wherein two sheets are bonded together with the suction cup outside.

[12] The RFID tag structure according to claim 1, wherein a hard resin plate or a film is further laminated on the RFID tag structure.

13. The RFID tag structure according to claim 12, wherein the hard resin plate or film is disposed on the outermost side opposite to the foamed resin sheet layer.

14. The RFID tag structure according to claim 11, wherein the hard resin plate or film has a larger area than the RFID tag.

[15] The hard resin plate or film is made of polypropylene (PP), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide (PA), polyimide (PI), polyphenylene sulfide (PPS), 15. The RFID according to claim 12, wherein the RFID is at least one film selected from polyetheretherketone (PEEK), polyethersanorephone (PES), and polyetherimide (PEI). Tag structure.

[16] The RFID tag structure according to any one of [12] to [15], wherein the hard resin plate or film is annealed in advance.

[17] Base film strength of the RFID tag S, Polyethylene terephthalate (PET), Polyethylene naphthalate (PEN), Polyamide (PA), Polyimide (PI), Polyphenylene sulfide (P PS), Polyether ether ketone (PEEK) 2. The RFID tag structure according to claim 1, wherein the RFID tag structure is at least one film selected from polyethersulfone (PES) and polyetherimide (PEI).

[18] The pressure-sensitive adhesive or adhesive is not present on the adsorption surface of the foamed resin sheet layer.

; RFID tag structure according to any one of 1 to 7;

[19] The RFID tag structure according to any one of [1] to [18], wherein the outermost foamed resin sheet layer adsorption surface of the RFID tag structure is attached to an object to be managed.