WO2007141185A3 - Homogenizer with reduced interference - Google Patents
Homogenizer with reduced interference Download PDFInfo
- Publication number
- WO2007141185A3 WO2007141185A3 PCT/EP2007/055323 EP2007055323W WO2007141185A3 WO 2007141185 A3 WO2007141185 A3 WO 2007141185A3 EP 2007055323 W EP2007055323 W EP 2007055323W WO 2007141185 A3 WO2007141185 A3 WO 2007141185A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light beam
- input light
- propagation direction
- input
- directing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0927—Systems for changing the beam intensity distribution, e.g. Gaussian to top-hat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/09—Beam shaping, e.g. changing the cross-sectional area, not otherwise provided for
- G02B27/0938—Using specific optical elements
- G02B27/095—Refractive optical elements
- G02B27/0955—Lenses
- G02B27/0961—Lens arrays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
- G02B3/0062—Stacked lens arrays, i.e. refractive surfaces arranged in at least two planes, without structurally separate optical elements in-between
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70583—Speckle reduction, e.g. coherence control or amplitude/wavefront splitting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
Abstract
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020117007447A KR101227803B1 (en) | 2006-06-09 | 2007-05-31 | Homogenizer with reduced interference |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US81222006P | 2006-06-09 | 2006-06-09 | |
US60/812,220 | 2006-06-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007141185A2 WO2007141185A2 (en) | 2007-12-13 |
WO2007141185A3 true WO2007141185A3 (en) | 2008-02-28 |
Family
ID=38442049
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2007/055323 WO2007141185A2 (en) | 2006-06-09 | 2007-05-31 | Homogenizer with reduced interference |
Country Status (2)
Country | Link |
---|---|
KR (2) | KR101227803B1 (en) |
WO (1) | WO2007141185A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2237079B1 (en) * | 2009-04-03 | 2013-05-29 | Innovavent GmbH | Device for homogenising coherent radiation |
DE102009037141B4 (en) | 2009-07-31 | 2013-01-03 | Carl Zeiss Laser Optics Gmbh | Optical system for generating a light beam for treating a substrate |
US9793673B2 (en) | 2011-06-13 | 2017-10-17 | Kla-Tencor Corporation | Semiconductor inspection and metrology system using laser pulse multiplier |
US9525265B2 (en) * | 2014-06-20 | 2016-12-20 | Kla-Tencor Corporation | Laser repetition rate multiplier and flat-top beam profile generators using mirrors and/or prisms |
US9907636B2 (en) | 2015-07-01 | 2018-03-06 | 3M Innovative Properties Company | Curing lights with homogenous light patch |
KR101913654B1 (en) * | 2017-05-30 | 2018-12-28 | 학교법인 한동대학교 | Laser Beam Homogenizer having Zooming Apparatus |
CN114072977A (en) | 2019-08-07 | 2022-02-18 | 极光先进雷射株式会社 | Optical pulse stretcher, laser device, and method for manufacturing electronic device |
KR20230064979A (en) | 2021-11-04 | 2023-05-11 | 한국전기연구원 | Composite lighting system for improving visibility |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001035451A1 (en) * | 1999-11-09 | 2001-05-17 | Nikon Corporation | Illuminator, aligner, and method for fabricating device |
US20030202251A1 (en) * | 1996-02-06 | 2003-10-30 | Shunpei Yamazaki | Apparatus and method for laser radiation |
US6693930B1 (en) * | 2000-12-12 | 2004-02-17 | Kla-Tencor Technologies Corporation | Peak power and speckle contrast reduction for a single laser pulse |
-
2007
- 2007-05-31 KR KR1020117007447A patent/KR101227803B1/en not_active IP Right Cessation
- 2007-05-31 WO PCT/EP2007/055323 patent/WO2007141185A2/en active Application Filing
- 2007-05-31 KR KR1020097000395A patent/KR20090028625A/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030202251A1 (en) * | 1996-02-06 | 2003-10-30 | Shunpei Yamazaki | Apparatus and method for laser radiation |
WO2001035451A1 (en) * | 1999-11-09 | 2001-05-17 | Nikon Corporation | Illuminator, aligner, and method for fabricating device |
US6693930B1 (en) * | 2000-12-12 | 2004-02-17 | Kla-Tencor Technologies Corporation | Peak power and speckle contrast reduction for a single laser pulse |
Also Published As
Publication number | Publication date |
---|---|
KR20110042132A (en) | 2011-04-22 |
WO2007141185A2 (en) | 2007-12-13 |
KR20090028625A (en) | 2009-03-18 |
KR101227803B1 (en) | 2013-01-29 |
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