WO2007109081A3 - Method and apparatus for improved operation of an abatement system - Google Patents

Method and apparatus for improved operation of an abatement system Download PDF

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Publication number
WO2007109081A3
WO2007109081A3 PCT/US2007/006494 US2007006494W WO2007109081A3 WO 2007109081 A3 WO2007109081 A3 WO 2007109081A3 US 2007006494 W US2007006494 W US 2007006494W WO 2007109081 A3 WO2007109081 A3 WO 2007109081A3
Authority
WO
WIPO (PCT)
Prior art keywords
effluent
abatement system
improved operation
information
receive
Prior art date
Application number
PCT/US2007/006494
Other languages
French (fr)
Other versions
WO2007109081A2 (en
Inventor
Peter Porshnev
Mark W Curry
Sebastien Raoux
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2009500470A priority Critical patent/JP6034546B2/en
Priority to EP07753143A priority patent/EP1994457B1/en
Priority to CN2007800089808A priority patent/CN101400875B/en
Publication of WO2007109081A2 publication Critical patent/WO2007109081A2/en
Publication of WO2007109081A3 publication Critical patent/WO2007109081A3/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • F04B49/06Control using electricity
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04BPOSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B49/00Control, e.g. of pump delivery, or pump pressure of, or safety measures for, machines, pumps, or pumping installations, not otherwise provided for, or of interest apart from, groups F04B1/00 - F04B47/00
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05DSYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D16/00Control of fluid pressure
    • G05D16/20Control of fluid pressure characterised by the use of electric means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Drying Of Semiconductors (AREA)
  • Treating Waste Gases (AREA)
  • Testing And Monitoring For Control Systems (AREA)
  • General Factory Administration (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Incineration Of Waste (AREA)
  • Sampling And Sample Adjustment (AREA)
  • Control Of Fluid Pressure (AREA)
  • Measuring Fluid Pressure (AREA)
  • User Interface Of Digital Computer (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Control Of Positive-Displacement Pumps (AREA)

Abstract

In one aspect, an apparatus is provided that includes (1) an interface adapted to analyze information about an electronic device manufacturing system that produces an effluent having an undesirable material, and provide information about the effluent, and (2) an abatement system adapted to receive information about the effluent, receive the effluent, and attenuate the undesirable material. Numerous other aspects are provided.
PCT/US2007/006494 2006-03-16 2007-03-14 Method and apparatus for improved operation of an abatement system WO2007109081A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009500470A JP6034546B2 (en) 2006-03-16 2007-03-14 Method and apparatus for improved operation of mitigation system
EP07753143A EP1994457B1 (en) 2006-03-16 2007-03-14 Method and apparatus for improved operation of an abatement system
CN2007800089808A CN101400875B (en) 2006-03-16 2007-03-14 Method and apparatus for improved operation of an abatement system

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US78333706P 2006-03-16 2006-03-16
US78337006P 2006-03-16 2006-03-16
US78337406P 2006-03-16 2006-03-16
US60/783,337 2006-03-16
US60/783,370 2006-03-16
US60/783,374 2006-03-16
US89060907P 2007-02-19 2007-02-19
US60/890,609 2007-02-19

Publications (2)

Publication Number Publication Date
WO2007109081A2 WO2007109081A2 (en) 2007-09-27
WO2007109081A3 true WO2007109081A3 (en) 2008-08-07

Family

ID=38522928

Family Applications (3)

Application Number Title Priority Date Filing Date
PCT/US2007/006495 WO2007109082A2 (en) 2006-03-16 2007-03-14 Methods and apparatus for improving operation of an electronic device manufacturing system
PCT/US2007/006392 WO2007109038A2 (en) 2006-03-16 2007-03-14 Methods and apparatus for pressure control in electronic device manufacturing systems
PCT/US2007/006494 WO2007109081A2 (en) 2006-03-16 2007-03-14 Method and apparatus for improved operation of an abatement system

Family Applications Before (2)

Application Number Title Priority Date Filing Date
PCT/US2007/006495 WO2007109082A2 (en) 2006-03-16 2007-03-14 Methods and apparatus for improving operation of an electronic device manufacturing system
PCT/US2007/006392 WO2007109038A2 (en) 2006-03-16 2007-03-14 Methods and apparatus for pressure control in electronic device manufacturing systems

Country Status (7)

Country Link
US (3) US7970483B2 (en)
EP (3) EP1994458A2 (en)
JP (4) JP2009530819A (en)
KR (2) KR20080104372A (en)
CN (1) CN101495925B (en)
TW (3) TWI407997B (en)
WO (3) WO2007109082A2 (en)

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US9080576B2 (en) * 2011-02-13 2015-07-14 Applied Materials, Inc. Method and apparatus for controlling a processing system
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US10649424B2 (en) 2013-03-04 2020-05-12 Fisher-Rosemount Systems, Inc. Distributed industrial performance monitoring and analytics
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US20160042916A1 (en) * 2014-08-06 2016-02-11 Applied Materials, Inc. Post-chamber abatement using upstream plasma sources
US20160054731A1 (en) * 2014-08-19 2016-02-25 Applied Materials, Inc. Systems, apparatus, and methods for processing recipe protection and security
US9872341B2 (en) 2014-11-26 2018-01-16 Applied Materials, Inc. Consolidated filter arrangement for devices in an RF environment
US20160149733A1 (en) * 2014-11-26 2016-05-26 Applied Materials, Inc. Control architecture for devices in an rf environment
JP2020031135A (en) * 2018-08-22 2020-02-27 株式会社ディスコ Silicon wafer processing method and plasma etching system
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JP2009530821A (en) 2009-08-27
JP6182116B2 (en) 2017-08-16
CN101495925B (en) 2013-06-05
TWI357003B (en) 2012-01-21
EP1994457A4 (en) 2010-05-19
US20070260343A1 (en) 2007-11-08
WO2007109082A2 (en) 2007-09-27
CN101495925A (en) 2009-07-29
EP1994458A2 (en) 2008-11-26
EP1994457A2 (en) 2008-11-26
JP6034546B2 (en) 2016-11-30
KR20080104372A (en) 2008-12-02
US7532952B2 (en) 2009-05-12
TWI407997B (en) 2013-09-11
US20070256704A1 (en) 2007-11-08
EP1994457B1 (en) 2012-06-13
JP6030278B2 (en) 2016-11-24
JP2015015480A (en) 2015-01-22
JP2009530822A (en) 2009-08-27
US20070260351A1 (en) 2007-11-08
KR101126413B1 (en) 2012-03-28
WO2007109082A3 (en) 2008-11-20
TW200740509A (en) 2007-11-01
KR20080103600A (en) 2008-11-27
TW200741805A (en) 2007-11-01
EP1994456A4 (en) 2010-05-19
TW200741494A (en) 2007-11-01
WO2007109038A3 (en) 2008-07-24
US7970483B2 (en) 2011-06-28
WO2007109081A2 (en) 2007-09-27
JP2009530819A (en) 2009-08-27
EP1994456A2 (en) 2008-11-26
WO2007109038A2 (en) 2007-09-27

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