WO2006125512A3 - Device and method for assembly of electrical components - Google Patents

Device and method for assembly of electrical components Download PDF

Info

Publication number
WO2006125512A3
WO2006125512A3 PCT/EP2006/004151 EP2006004151W WO2006125512A3 WO 2006125512 A3 WO2006125512 A3 WO 2006125512A3 EP 2006004151 W EP2006004151 W EP 2006004151W WO 2006125512 A3 WO2006125512 A3 WO 2006125512A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
substrate
cooling device
connection
conductor tracks
Prior art date
Application number
PCT/EP2006/004151
Other languages
German (de)
French (fr)
Other versions
WO2006125512A2 (en
Inventor
Alexander Seufert
Volker Schueren
Original Assignee
Bosch Rexroth Ag
Alexander Seufert
Volker Schueren
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Rexroth Ag, Alexander Seufert, Volker Schueren filed Critical Bosch Rexroth Ag
Publication of WO2006125512A2 publication Critical patent/WO2006125512A2/en
Publication of WO2006125512A3 publication Critical patent/WO2006125512A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0485—Tacky flux, e.g. for adhering components during mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

The invention relates to a method for production of a connection between a cooled electronic component (1) and a substrate (6), whereby the substrate (6) has electrical conductor tracks and the component (1) is placed on a substrate surface and/or a cooling device (5) in a first step and, during a second step in one operation, an electrical connection between the component (1) and substrate conductor tracks and a mechanical connection between the component (1) and cooling device (5) are achieved. The invention further relates to an electronic component (1), in particular, for the electronic power unit of a servo motor, whereby the component has an at least partial embodiment such as to be connected by means of metallic binding agents and a deposit of binding agent is provided on the component housing (1), preferably by means of an adhesive. The removal of waste heat can thus advantageously be induced and the production process simplified.
PCT/EP2006/004151 2005-05-25 2006-05-04 Device and method for assembly of electrical components WO2006125512A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005024096A DE102005024096A1 (en) 2005-05-25 2005-05-25 Device and method for mounting electrical components
DE102005024096.8 2005-05-25

Publications (2)

Publication Number Publication Date
WO2006125512A2 WO2006125512A2 (en) 2006-11-30
WO2006125512A3 true WO2006125512A3 (en) 2007-07-05

Family

ID=36648656

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/004151 WO2006125512A2 (en) 2005-05-25 2006-05-04 Device and method for assembly of electrical components

Country Status (2)

Country Link
DE (1) DE102005024096A1 (en)
WO (1) WO2006125512A2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008002969B4 (en) * 2008-07-25 2010-08-12 Kumatec Sondermaschinenbau & Kunststoffverarbeitung Gmbh Contact pin for vias
DE102011004171A1 (en) * 2011-02-15 2012-08-16 Brose Fahrzeugteile GmbH & Co. Kommanditgesellschaft, Würzburg Temperierelement and method for fixing an electrical component to the tempering
DE102021129642A1 (en) 2021-11-15 2023-05-17 Bayerische Motoren Werke Aktiengesellschaft Electronic device and system with improved cooling concept

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471938A1 (en) * 1990-07-23 1992-02-26 International Business Machines Corporation High circuit density thermal carrier
EP0521720A1 (en) * 1991-07-02 1993-01-07 Chomerics, Inc. Heat-dissipating multi-layer circuit board
DE19949429A1 (en) * 1999-10-13 2001-05-23 Daimler Chrysler Ag Through-hole-plated printed circuit board with a printed circuit board hole has an inner contact removed in the printed circuit board hole to prevent solder from flowing off and any later contact layer from forming in a gap.
WO2004006636A1 (en) * 2002-07-03 2004-01-15 Hartmann Codier Gmbh & Co. Kg Component for assembling a printed circuit board
EP1445799A2 (en) * 2003-02-05 2004-08-11 Leopold Kostal GmbH & Co. KG Heat dissipation device for a semiconductor on a printed circuit board
DE10344745A1 (en) * 2003-09-25 2005-04-14 Endress + Hauser Gmbh + Co. Kg Mechanical equipment unit e.g. for construction of circuit board, drills holes into circuit board with contact pad surrounding drilled hole and allows for component fixing

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003060137A (en) * 2001-08-08 2003-02-28 Ibiden Co Ltd Substrate for module

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0471938A1 (en) * 1990-07-23 1992-02-26 International Business Machines Corporation High circuit density thermal carrier
EP0521720A1 (en) * 1991-07-02 1993-01-07 Chomerics, Inc. Heat-dissipating multi-layer circuit board
DE19949429A1 (en) * 1999-10-13 2001-05-23 Daimler Chrysler Ag Through-hole-plated printed circuit board with a printed circuit board hole has an inner contact removed in the printed circuit board hole to prevent solder from flowing off and any later contact layer from forming in a gap.
WO2004006636A1 (en) * 2002-07-03 2004-01-15 Hartmann Codier Gmbh & Co. Kg Component for assembling a printed circuit board
EP1445799A2 (en) * 2003-02-05 2004-08-11 Leopold Kostal GmbH & Co. KG Heat dissipation device for a semiconductor on a printed circuit board
DE10344745A1 (en) * 2003-09-25 2005-04-14 Endress + Hauser Gmbh + Co. Kg Mechanical equipment unit e.g. for construction of circuit board, drills holes into circuit board with contact pad surrounding drilled hole and allows for component fixing

Also Published As

Publication number Publication date
WO2006125512A2 (en) 2006-11-30
DE102005024096A1 (en) 2006-11-30

Similar Documents

Publication Publication Date Title
WO2007033849A3 (en) Combined fastening and contacting system for electrical components on superimposed circuit boards
WO2007003824A3 (en) Electronic module for rotating electrical machine
WO2005081309A3 (en) Cooling system for devices comprising power semi-conductors and method for cooling said type of device
MXPA05010527A (en) Method for manufacturing an electronic module and an electronic module.
DE502004003231D1 (en) Electrical board heating module, electronic board and method for heating
WO2007109082A3 (en) Methods and apparatus for improving operation of an electronic device manufacturing system
WO2007147602A3 (en) Method for producing a circuit part on a substrate
WO2005013363A3 (en) Circuit arrangement placed on a substrate and method for producing the same
WO2009069308A1 (en) Heat dissipating structure base board, module using heat dissipating structure base board, and method for manufacturing heat dissipating structure base board
WO2008088017A1 (en) Machine tool having brushless motor
WO2005069828A3 (en) Thermal protection for electronic components during processing
DK1961528T3 (en) Electric chainsaw with static cooling and practice to achieve this cooling
TW200644202A (en) Method of manufacturing flexible circuit substrate
EP1976060A4 (en) Antenna built-in module, card type information device and methods for manufacturing them
WO2007050533A3 (en) Piezoelectric fan
WO2008003287A3 (en) Electric component comprising a sensor element, method for encapsulating a sensor element and method for producing a board assembly
ATE356541T1 (en) ELECTRONIC POWER SYSTEM WITH PASSIVE COOLING
TW200731885A (en) Rigid-flexible printed circuit board and method of manufacturing the same
WO2006125512A3 (en) Device and method for assembly of electrical components
MY136905A (en) Electrical circuit apparatus and method for assembling same
TW200501856A (en) Method of mounting an electronic part
WO2002013270A3 (en) Semiconductor component and a method for identifying a semiconductor component
PL1728414T3 (en) Device provided with an electric motor and a main printed circuit board and mounting method
WO2005036587A3 (en) Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator
WO2008059162A3 (en) Printed substrate through which very strong currents can pass and corresponding production method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: RU

WWW Wipo information: withdrawn in national office

Country of ref document: RU

122 Ep: pct application non-entry in european phase

Ref document number: 06724703

Country of ref document: EP

Kind code of ref document: A2