WO2006033331A1 - 超音波振動子、超音波振動子アレイ、及び超音波内視鏡装置 - Google Patents
超音波振動子、超音波振動子アレイ、及び超音波内視鏡装置 Download PDFInfo
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- WO2006033331A1 WO2006033331A1 PCT/JP2005/017315 JP2005017315W WO2006033331A1 WO 2006033331 A1 WO2006033331 A1 WO 2006033331A1 JP 2005017315 W JP2005017315 W JP 2005017315W WO 2006033331 A1 WO2006033331 A1 WO 2006033331A1
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- ultrasonic
- ultrasonic transducer
- array
- transducer array
- insulating member
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- 239000004020 conductor Substances 0.000 claims description 62
- 239000010408 film Substances 0.000 claims description 44
- 239000000758 substrate Substances 0.000 claims description 42
- 238000000034 method Methods 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 238000003780 insertion Methods 0.000 claims description 20
- 230000037431 insertion Effects 0.000 claims description 20
- 238000007747 plating Methods 0.000 claims description 19
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- 239000010409 thin film Substances 0.000 claims description 18
- 239000000470 constituent Substances 0.000 claims description 16
- 239000011810 insulating material Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 11
- 239000003822 epoxy resin Substances 0.000 claims description 8
- 229920000647 polyepoxide Polymers 0.000 claims description 8
- 239000013013 elastic material Substances 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 238000003754 machining Methods 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims 1
- 229920003023 plastic Polymers 0.000 claims 1
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 67
- 238000010586 diagram Methods 0.000 description 30
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 238000005452 bending Methods 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 4
- 239000004519 grease Substances 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 229920006351 engineering plastic Polymers 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910000805 Pig iron Inorganic materials 0.000 description 1
- 241000270295 Serpentes Species 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 210000000232 gallbladder Anatomy 0.000 description 1
- 210000001035 gastrointestinal tract Anatomy 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 210000000952 spleen Anatomy 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0633—Cylindrical array
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
- A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
- A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
- A61B8/445—Details of catheter construction
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49005—Acoustic transducer
Definitions
- Ultrasonic transducer Ultrasonic transducer, ultrasonic transducer array, and ultrasonic endoscope apparatus
- the present invention relates to an electronic radial scanning type ultrasonic transducer.
- An electronic scanning ultrasonic transducer is provided at an insertion portion of an endoscope into a body cavity, and by using this, the gastrointestinal tract wall can be obtained with good image quality without being affected by gas or bone in the body cavity. Deep organs such as spleen and gallbladder can be clearly depicted.
- These electronic scanning ultrasonic transducers consist of several tens or more elements, and it is necessary to connect a coaxial cable for transmission and reception corresponding to the number of elements to each element.
- the method of soldering the shield wire of the coaxial cable is common.
- the radial type transmits and receives an ultrasonic beam in the circumferential direction.
- an electronic radial scanning method in which elements are arranged on the outer periphery of a cylinder and an ultrasonic beam is transmitted and received radially by electronic control (see, for example, Patent Document 1).
- FIG. 1 is a diagram showing an existing ultrasonic endoscope apparatus.
- An ultrasonic endoscope apparatus 500 shown in FIG. 1 includes a connection unit 510, an operation unit 520, and an insertion unit 530.
- the insertion unit 530 includes a distal end portion 540.
- connection unit 510 is connected to, for example, a display device or a measurement device including a display or the like, and an image obtained by a microminiature camera or the like provided at the distal end portion 540 is displayed on the display.
- the operation unit 520 performs, for example, an up / down / left / right bending operation of the insertion unit 530, an operation of the distal end unit 540, and the like according to a user operation.
- the distal end portion 540 is provided with, for example, an ultrasonic transducer array configured by continuously arranging a plurality of ultrasonic transducers.
- the ultrasonic transducer selected from among the ultrasonic transducers transmits or receives ultrasonic waves.
- the ultrasonic waves received by the ultrasonic transducer array are converted into electrical signals and displayed as images on the display or the like.
- FIG. 2 is an enlarged view of the distal end portion 540 shown in FIG.
- the distal end portion 540 is configured to include the camera portion 600 provided with the microminiature camera, illumination, and the like, and an ultrasonic transducer array 610.
- FIG. 3 is a diagram showing an example of an ultrasonic transducer array. Note that the ultrasonic transducer array shown in FIG. 3 is a part of the ultrasonic transducer array 610 shown in FIG.
- An ultrasonic transducer array 700 shown in FIG. 3 includes a piezoelectric element 710, an electrode layer 720, a first acoustic matching layer 730, a second acoustic matching layer 740, a conductive resin 750, a conductor 760, and a substrate. 770 and are configured.
- the piezoelectric element 710, the electrode layer 720, the first acoustic matching layer 730, the second acoustic matching layer 740, the conductive grease 750, the conductor 760, and the substrate 770 include a plurality of grooves 780 provided in common.
- the above-mentioned plurality of ultrasonic transducers are configured.
- the ultrasonic transducer array 700 is formed in a cylindrical shape by connecting end faces perpendicular to the longitudinal direction of the ultrasonic transducer array 700, and the cylindrical ultrasonic transducer array.
- An acoustic lens is provided on the outer periphery of the 700 to form a radial type ultrasonic transducer array that transmits ultrasonic waves in a ring shape (for example, Patent Document 1 or Patent Document 2). reference).
- FIG. 4 is a diagram showing a cross-section of the radial ultrasonic transducer array when the ultrasonic transducer array 700 shown in FIG. 3 is configured as a radial ultrasonic transducer array.
- the ultrasonic transducer array 800 shown in FIG. 4 includes a first acoustic matching layer 730 and a second acoustic matching layer 7.
- the second acoustic matching layer 740 is formed in a cylindrical shape on the outer side, and an acoustic lens 810 is provided on the outer periphery of the second acoustic matching layer 740.
- the acoustic lens 810 converges the ultrasonic wave transmitted from the piezoelectric element 710 through the first acoustic matching layer 730 and the second acoustic matching layer 740 at a predetermined focal point.
- it is not limited to the radial ultrasonic transducer array where it is desirable to make the tip of the ultrasonic endoscope apparatus as thin as possible.
- the transducer array should be configured as small as possible.
- Patent Document 1 an FPC (flexible printed circuit board) and a connector are used to form a signal wiring between the cable and each vibrator.
- the length of the hard part is increased.
- the patient who has inserted the ultrasonic endoscope apparatus provided with the vibrator feels pain and the operability is deteriorated.
- the signal wiring is covered with GND everywhere, there is a problem even if the electrical safety to the human body
- an ultrasonic endoscope apparatus using an electronic radial scanning method is disclosed as an invention, the size must be taken into consideration when actually put into practical use.
- the diameter of the entire transducer must be reduced, and the piezoelectric elements that form the ultrasonic transducer must be reduced accordingly. Absent.
- each piezoelectric element since it is necessary to arrange multiple (for example, about 200) piezoelectric elements in a 360 degree direction, each piezoelectric element must have a size of the order of 0.1 mm or less.
- the cable is covered with an insulating material!
- an insulating material Even if a problem occurs such as a part of the cable covering portion is damaged and the conductor is exposed to the outside, the patient is There is a demand for the production of vibrators that do no harm.
- tolerances difference between the maximum and minimum dimensions that are acceptable in machining
- the piezoelectric element, the acoustic matching layer, the substrate, or the like is very thin. Made (for example, with a thickness of about 0.1 mm). Therefore, the piezoelectric element Array components such as acoustic matching layers or substrates are prone to breakage. In addition, array components such as piezoelectric elements and acoustic matching layers are becoming thinner and thinner with the recent increase in the frequency of ultrasonic waves in ultrasonic endoscope apparatuses.
- the piezoelectric element, the acoustic matching layer, the substrate, or the like is very easily damaged.
- the array components such as the piezoelectric element and the acoustic matching layer may be damaged. If an array component such as a piezoelectric element or an acoustic matching layer is damaged, the pieces of the array component may fall out of the ultrasonic endoscope apparatus.
- the ultrasonic transducer capable of positioning and fixing the cable to the transducer and securing the wiring, and further improving the safety of the transducer and reducing the diameter.
- the purpose is to provide
- An object of the present invention is to provide an ultrasonic transducer array.
- Patent Document 1 Japanese Patent Publication No. 63-14623
- Patent Document 2 JP-A-5-42146
- the present invention employs the following configuration.
- the electronic radial ultrasonic transducer has a plurality of ultrasonic transducer elements that transmit and receive ultrasonic waves arranged in a cylindrical shape, and transmits a drive signal that drives each ultrasonic transducer element.
- a cable corresponding to each ultrasonic transducer element is stored inside, and is an electronic radial ultrasonic transducer.
- a conductor film is formed on the surface of an insulating member through which the cable group is inserted, and a ground It is characterized by the line being connected.
- the ground line may be connected to the cable group via the conductor film.
- a hole is provided in a side surface of the insulating member, and one end of the cap is inserted through the hole.
- the other end of the ground wire connected to the group of wires may be bonded to the conductive film.
- a plurality of electrode pads are provided on the surface of the flange portion of the insulating member, the cable corresponding to each electrode pad is bonded to the electrode pad, and the ultrasonic transducer
- the electrode of the element and the electrode pad may be connected by a conductive wire.
- the insulating member may be provided with a flange at one end of the substantially cylindrical body.
- a conductor film may be formed by plating on the outer surface and the inner surface of the substantially cylindrical body portion of the insulating member.
- the plating may be a wet plating.
- the conductor film may be composed of a plurality of metal thin films.
- the insulating member may be made of engineering plastic.
- the insulating member may be composed of polysulfone, polyetherimide, polyphenylene oxide, or epoxy resin.
- the thickness of the conductor film is preferably 1 to 50 ⁇ m.
- the thickness of the conductor film is preferably 20 / zm.
- the scope of the present invention extends to an ultrasonic endoscope apparatus including the electronic radial ultrasonic transducer.
- the method for manufacturing an electronic radial ultrasonic transducer of the present invention includes a structure manufacturing process for manufacturing a structure in which a plurality of ultrasonic transducer elements that transmit and receive ultrasonic waves are arranged, and the structure
- a cable insertion step in which a ground wire is connected to the cable group via the conductive film, and the flange of the insulating member obtained by the cable insertion step includes the annular member.
- the plating may be performed by a wet plating method!
- a hole is provided in a side surface of the insulating member, and one end of the insulating member is connected to the cable group through the hole in the cable insertion step. Adhere the other end of the ground wire to the conductive film.
- the ultrasonic transducer array of the present invention includes a plurality of ultrasonic transducers arranged continuously and an acoustic lens provided outside the plurality of ultrasonic transducers, and the plurality of ultrasonic transducers.
- a ultrasonic transducer array in which an ultrasonic transducer selected from among the wave transducers transmits or receives ultrasonic waves, wherein the acoustic lens is made of an elastic material and converges ultrasonic waves.
- a covering portion that covers the array constituent member, which is easily damaged, among the array constituent members for constituting the ultrasonic transducer array.
- the array constituent member of the ultrasonic transducer array may be a piezoelectric element or an acoustic matching layer.
- the ultrasonic transducer array of the present invention includes a plurality of ultrasonic transducers arranged in series and an acoustic lens provided outside the plurality of ultrasonic transducers, and the plurality of ultrasonic transducers An ultrasonic transducer array in which an ultrasonic transducer electrically selected from the above transmits or receives ultrasonic waves, wherein the acoustic lens is made of an insulating material and converges ultrasonic waves. And a covering portion that covers a conductor member that is electrically connected to the plurality of ultrasonic transducers in order to select the plurality of ultrasonic transducers.
- the covering portion of the ultrasonic transducer array may be configured to cover the conductor member that is not covered with the GND wire.
- the conductor member of the ultrasonic transducer array is a signal line for transmitting a signal to the ultrasonic transducer, or a substrate for connecting the plurality of ultrasonic transducers and the signal line. Or as a wire.
- the plurality of ultrasonic transducers are centered on an insertion axis. You can also arrange them in a ring continuously.
- the ultrasonic transducer array may be configured such that the plurality of ultrasonic transducers are continuously arranged in two dimensions! /.
- the acoustic lens of the ultrasonic transducer array may include a siloxane bond.
- the acoustic lens of the ultrasonic transducer array may include iron oxide.
- an ultrasonic endoscope apparatus of the present invention includes an ultrasonic transducer including a plurality of ultrasonic transducers arranged in series and an acoustic lens provided outside the ultrasonic transducers. And an ultrasonic endoscope device in which an ultrasonic transducer selected from the plurality of ultrasonic transducers transmits or receives ultrasonic waves, wherein the acoustic lens is made of an elastic material. And a lens portion for converging ultrasonic waves, and a covering portion for covering an easily damaged array constituent member among the array constituent members for constituting the ultrasonic transducer array. To do.
- the ultrasonic endoscope apparatus of the present invention includes an ultrasonic transducer including a plurality of ultrasonic transducers arranged in series and an acoustic lens provided outside the ultrasonic transducers.
- the ultrasonic endoscope apparatus is provided with a layer, and an ultrasonic transducer electrically selected from the plurality of ultrasonic transducers transmits or receives ultrasonic waves, wherein the acoustic lens is isolated.
- a covered portion that covers a conductive member that is electrically connected to the plurality of ultrasonic transducers in order to select the ultrasonic transducer. It is characterized by comprising.
- FIG. 1 is a diagram showing an existing ultrasonic endoscope apparatus.
- FIG. 2 is an enlarged view of the tip.
- FIG. 3 is a diagram showing an example of an ultrasonic transducer array.
- FIG. 4 is a diagram showing a cross section when the ultrasonic transducer array shown in FIG. 3 is configured as a radial ultrasonic transducer array.
- FIG. 5 is a diagram showing an external configuration of an ultrasonic endoscope apparatus according to the present embodiment.
- FIG. 6 is an enlarged view of the distal end portion 3 of the ultrasonic endoscope apparatus 1 of FIG. [7]
- FIG. 7 is a diagram showing an ultrasonic transducer manufacturing process (1).
- FIG. 8 is a diagram showing an ultrasonic vibrator manufacturing process (2).
- FIG. 9 is a diagram showing a manufacturing process (No. 3) of the ultrasonic vibrator.
- FIG. 10A is a diagram showing a manufacturing process (No. 4) of the ultrasonic transducer.
- FIG. 10B is a diagram showing a manufacturing process (4) of the ultrasonic transducer.
- FIG. 10C is a diagram showing a manufacturing process (4) of the ultrasonic transducer.
- FIG. 12 is a view showing a surface of the cylindrical member 50.
- FIG. 13 A perspective view of the cylindrical member 50.
- FIG. 12 is a view of the manufacturing process of FIG. 11 as seen from the cross-sectional direction.
- FIG. 12 is a view of the manufacturing process of FIG. 11 as viewed from the cross-sectional direction.
- FIG. 15A A view showing a cylindrical member 50 having a hole in the cylindrical portion 53.
- FIG. 15B is a view showing a cylindrical member 50 having a hole in the cylindrical portion 53.
- FIG. 16A is a diagram showing an example of a pattern that fits the cylindrical portion 53 of the cylindrical member 50.
- FIG. 16B is a diagram showing an example of a pattern that fits about the cylindrical portion 53 of the cylindrical member 50.
- FIG. 16C is a diagram showing an example of a pattern that fits the cylindrical portion 53 of the cylindrical member 50.
- FIG. 16D is a diagram showing an example of a pattern that fits about the cylindrical portion 53 of the cylindrical member 50.
- FIG. 17A is a diagram showing an example of a pattern in which a cable 62 is connected to a cylindrical member 50 that has been mated.
- FIG. 17B is a diagram showing an example of a pattern in which the cable 62 is connected to the cylindrical member 50 that has been mated.
- FIG. 17C is a diagram showing an example of a pattern in which the cable 62 is connected to the cylindrical member 50 that has been mated.
- FIG. 17D is a diagram showing an example of a pattern in which the cable 62 is connected to the cylindrical member 50 that has been mated. is there.
- FIG. 18 is a diagram showing an ultrasonic vibrator manufacturing process (6).
- FIG. 19 is a cross-sectional view of FIG.
- FIG. 20 is a diagram showing a modification of FIG.
- FIG. 21 is a diagram showing a cross section of an ultrasonic transducer array according to an embodiment of the present invention.
- FIG. 22A is a diagram illustrating an assembly process of an ultrasonic transducer array.
- FIG. 22B is a diagram illustrating an assembly process of an ultrasonic transducer array.
- FIG. 23 is a diagram showing an ultrasonic transducer array in a state where an acoustic lens is assembled.
- FIG. 24 is a view showing a cross section of an ultrasonic transducer array according to another embodiment of the present invention.
- FIG. 5 shows an external configuration of the ultrasonic endoscope apparatus according to the present embodiment.
- the ultrasonic endoscope apparatus 1 includes an operation unit 6 at the base end of the elongated insertion unit 2.
- a universal cord 7 connected to a light source device (not shown) extends from the side of the operation unit 6.
- the insertion portion 2 is configured by connecting a distal end portion 3, a bendable bending portion 4, and a flexible flexible tube portion 5 in order from the distal end side.
- the operation section 6 is provided with a bending operation knob 6a, and the bending section 4 can be bent by operating the bending operation knob 6a.
- FIG. 6 is an enlarged view of the distal end portion 3 of the ultrasonic endoscope apparatus 1 of FIG.
- An ultrasonic transducer 10 that enables electronic radial scanning is provided at the distal end portion 3, and a slope portion 12 is provided between the bending portion 4 and the ultrasonic transducer 10.
- the ultrasonic transducer 10 is covered with a material on which the acoustic lens 11 is formed.
- an illumination lens cover (not shown) that constitutes an illumination optical unit that irradiates the observation site with illumination light
- an observation lens cover 13 that constitutes an observation optical unit that captures an optical image of the observation site
- a treatment tool protrude A forceps outlet 14 is provided.
- Fig. 7 shows the manufacturing process (part 1) of the ultrasonic transducer.
- the substrate 20 when forming the ultrasonic transducer 10, first, the substrate 20, the conductor 21, the electrode layer 22 (22a, 22b), the piezoelectric element 2 3.
- a structure A composed of the acoustic matching layer 24 (first acoustic matching layer 24a, second acoustic matching layer 24b), conductive resin 25, and groove (dicing groove) 26 is produced. Now, the production of the structure A will be described.
- the first acoustic matching layer 24a is formed.
- a groove is formed in the first acoustic matching layer 24a using, for example, a dicing saw (precision cutting machine), and the conductive resin 25 is poured into the groove.
- the piezoelectric element 23 in which the electrode layers 22a and 22b are formed on both opposing surfaces is joined.
- the substrate 20 is attached adjacent to the piezoelectric element 23.
- An electrode 20 a is formed on the surface of the substrate 20.
- a conductor 21 for electrically connecting the electrode 20a and the electrode layer 22a is attached.
- the structure A formed above is cut to form a plurality of grooves (dicing grooves) 26 having a width of several tens of ⁇ m.
- the groove width is preferably 20 to 50 / ⁇ ⁇ .
- the structure A is cut so that only the second acoustic matching layer 24b is not completely cut and remains several tens / z m. For example, about 200 such grooves 26 are provided.
- the individual vibrators thus divided are hereinafter referred to as vibrator elements 27.
- the structure A is bent into a cylindrical shape so that the side surface XI and the side surface X2 of the laminate are aligned, and the acoustic lens 11 is formed on the cylindrical surface (see FIG. 8).
- structure B The acoustic lens 11 may be combined with a cylindrical structure A that is manufactured in advance as a single acoustic lens, or the cylindrical structure A is placed in a mold and the acoustic lens material is used as the mold.
- the acoustic lens 11 may be formed by pouring into the lens. Of the acoustic lens 11, the lens unit 11a actually functions as an acoustic lens.
- the annular structural member 30 (30a, 30b) is attached to the inside of the opening of the structural body B.
- the structural member 30 a is attached so as to be positioned on the substrate 20.
- the structural member 30b is similarly attached to the opening on the opposite side.
- the structural member 30b is attached so as to be positioned on the conductive resin 25.
- FIG. 10 shows a cross section of the structure B to which the structural member 30 is attached.
- the space between the structural members 30a-30b is filled with the backing material 40 (see FIG. 10B).
- a conductor (copper wire) 41 is mounted on the conductive resin 25 (see OC in FIG. 1) (hereinafter, the structure created in FIG. 10 is referred to as structure C).
- a cylindrical member 50 having a cylindrical shape is inserted from one opening side of the structure C (the side on which the substrate 20 is provided).
- the cylindrical member 50 includes a cylindrical portion 53 and an annular collar 52 provided at one end thereof.
- FIG. 12 shows the surface of the flange 52 of the cylindrical member 50
- FIG. 13 shows a perspective view of the cylindrical member 50.
- ⁇ FPC (flexible printed circuit board) 60 is provided on the surface 52, and several hundreds of electrode pads 51 are provided on the FPC 60. Further, a bundle of cables 62 is passed through the cylindrical member 50, and the ends of the cables 62 are soldered to the electrode pads 51 with solder 61 (inside the electrode pads 51 (in the center of the ring)). Solder the cable 62 to the cable.
- the cable 62 is usually a coaxial cable for noise reduction.
- the cylindrical member 50 is made of an insulating material (engineering plastic).
- the insulating material include polysulfone, polyetherimide, polyphenylene oxide, and epoxy resin.
- the surface of the cylindrical portion 53 is plated with a conductor.
- one or a plurality of holes (holes penetrating the cylindrical side surface) 80 may be provided in a part of the cylindrical portion 53 of the cylindrical member 50. This will be described later.
- the cylindrical member 50 will be further described with reference to FIGS. 16 and 17.
- FIG. 16 shows an example of a pattern in which the cylindrical portion 53 of the cylindrical member 50 is plated after the cylindrical member 50 is made of the insulating material 64.
- FIG. 16A shows a case where the entire outer surface and inner surface of the cylindrical portion 53 are covered with a conductor to form the conductor film 63.
- FIG. 16B shows a case in which the conductor film 63 is formed by plating the outer surface of the cylindrical portion 53 and a predetermined portion of the inner surface with a conductor.
- FIG. 16C shows a case where the conductor film 63 is formed by covering predetermined portions of the outer surface and the inner surface of the cylindrical portion 53 described in FIG. 15 with a conductor.
- FIG. 16A shows a case where the entire outer surface and inner surface of the cylindrical portion 53 are covered with a conductor to form the conductor film 63.
- FIG. 16B shows a case in which the conductor film 63 is formed by plating the outer surface of the cylindrical portion 53 and a predetermined portion of the inner surface with
- the method may be any method as long as it can form a thin film of a conductor (eg, sputtering, vapor deposition, etc.), preferably a wet method such as electrolytic plating or electroless plating.
- a membrane is good. This is because it is difficult to form a thick film by sputtering or to deposit on the inner surface of the cylinder, whereas with wet plating, a thicker film can be formed on the inner and outer surfaces of the cylinder. This is because it can be easily met.
- the thickness of the metal thin film is 1 to 50 m, the force that effectively functions as a conductive film, preferably about 20 m. If the thickness of the thin film is too thin, it will not function effectively as a conductive film, and it must be thick enough that the thin film will not peel off when soldering. Further, a metal foil may be wound around the surface of the cylindrical portion 53 of the cylindrical member 50.
- a more preferable method is to form a film on the inner and outer surfaces of the insulating cylindrical member. This is because, by forming the film on the inner and outer surfaces of the insulating cylindrical member, the viewpoint stress such as thermal expansion coefficient is balanced, and a film having no film peeling or cracking can be obtained even if it is thin. In this case, it is preferable that the inner surface and the outer surface of the cylindrical member are measured so as to be electrically connected. In other words, the opening of the cylindrical member extending from the inner surface to the outer surface of the cylindrical member is rubbed.
- the metal thin film formed by plating is preferably a thin film made of a plurality of metals rather than a single layer film.
- Ni nickel
- Cu copper
- Ni nickel
- Au gold
- the cylindrical portion 53 of the cylindrical member 50 is plated with Ni as a base.
- it is plated with copper which is a soft and stretchable metal.
- Ni has high corrosion resistance.
- the strength of the plated insulating cylindrical member is improved by plating with a plurality of metal thin films.
- FIG. 17 shows an example of a pattern in which the cable 62 is connected to the cylindrical member 50 that has been mated.
- FIG. 17A shows a case where the cable 62 is connected to the cylindrical member 50 of FIG. 16A.
- FIG. 17B shows a case where the cable 62 is connected to the cylindrical member 50 of FIG. 16B.
- FIG. 17C shows a case where the cable 62 is connected to the cylindrical member 50 of FIG. 16C.
- FIG. 17D shows a case where the cable 62 is connected to the cylindrical member 50 of FIG. 16D.
- a ground wire 71 extends from the cable 62 and is joined to the conductor film 63 that is fitted on the side surface of the cylindrical portion 53. Looking at these separately, in FIGS.
- the ground wire 71 is joined to the conductor film 63 on the inner side surface, and in FIGS. 17C and 17D, the ground wire 71 penetrates the cylindrical side surface. It is bonded to the conductor film 63 on the outer side surface through the hole 80.
- a ground wire 71 which is very important for electrical safety, can be made by making a hole 80 on the side surface of the insulating cylindrical member to generate a force in the vicinity of the vibrator. Further, the position and number of holes 80 are not particularly limited.
- FIG. 19 shows a cross-sectional view of FIG.
- the cable 62 is connected to the center side of the heel of the electrode pad 51 by solder.
- One end of the wire 90 is connected to the outer peripheral side of the electrode pad 51 with solder 101 and the other end is connected to the signal side electrode 20a on the substrate 20 of the transducer element with solder 102.
- it connects using the short wire 90 so that a wire may contact the adjacent signal side electrode 20a and it does not short-circuit.
- the entire connecting portion of the cable 62 and the electrode pad 51 is covered with the potting grease 100. To do.
- a copper foil 105 is formed on the surface of the structural member 30b, and the surface of the structural member 30 and the cylindrical side surfaces of the acoustic matching layer 24 and the cylindrical member 50 are electrically conductive grease (for example, Solder) It is joined at 04.
- electrically conductive grease for example, Solder
- the ground lines 71 (71a, 71b) extending from the cable 62 are joined to the conductor film 63 with solder 103a, 103b, respectively.
- the conductor film 63 is grounded by a ground line (not shown).
- FIG. 20 shows a modification of FIG. 20 differs from FIG. 19 in the position of the hole 80 of the cylindrical member 50, and the ground wire 71b is directly connected to the copper foil 105 provided on the structural member 30b.
- An example of bonding with conductive resin 104 is shown.
- the ground wire 71 is divided into one that is bonded to the conductor film on the cylindrical member 50 (71a) and one that is connected to the piezoelectric element GND (connected to the copper foil on the structure) (71b). It does n’t matter.
- connecting the cable and the transducer element using the cylindrical member of the present embodiment is not limited to an ultrasonic transducer using a piezoelectric element, but also a capacitive transducer (c MUT).
- c MUT capacitive transducer
- the present invention can also be applied to the used electronic radial ultrasonic transducer.
- the surface of the insulator that forms the cylindrical member is provided in close contact with the conductor, and is connected to GND to enhance electrical safety.
- a ground wire which is very important for electrical safety, can be drilled on the side of an insulating cylindrical member to generate force in the vicinity of the vibrator and be connected to GND including a piezoelectric element. This results in a noise reduction effect.
- the cable when connecting the cable to the signal side electrode 20a of the transducer element, the cable can be positioned and fixed to the transducer, so that the cable can be directly connected to the signal side electrode 20a. Compared to, it is possible to connect easily and reliably.
- the cable is not directly connected to the signal side electrode 20a, but is once connected to the electrode node of the cylindrical member, and the electrode pad and the signal side electrode 20a are connected by a wire.
- the durability of the cable connection section when tension is high is improved.
- the process of connecting the cable to the cylindrical member and the process of inserting the cylindrical member connected to the cable into the structure C and connecting to the signal side electrode 20a via the wire are separated from the manufacturing process. In the latter process, since the electrode pad and the signal side electrode 20a can be connected using a short wire, there is no short circuit or erroneous connection to the signal side electrode 20a of another transducer element.
- the metal thin film that has been plated can also be a strength member.
- the metal thin film is formed thinner than the metal pipe, it is possible to reduce the diameter without worrying about the tolerance when using the metal pipe.
- spattering or the like forms a film on only one side and causes distortion.
- there is no stress bias there is no distortion.
- FIG. 21 is a diagram showing a cross section of the ultrasonic transducer array according to the embodiment of the present invention. The same components as those in the radial ultrasonic transducer array 800 shown in FIG.
- the ultrasonic transducer array 106 (corresponding to the ultrasonic transducer 10) shown in FIG. 21 is, for example, a radial ultrasonic vibration provided at the distal end portion 540 of the ultrasonic endoscope apparatus 500 shown in FIG.
- a plurality of grooves are provided in common in the piezoelectric element 710, the electrode layer 720, the first acoustic matching layer 730, the second acoustic matching layer 740, the conductive resin 750, the conductor 760, and the substrate 770. It is assumed that an ultrasonic transducer (corresponding to transducer element 27 above) is configured.
- the ultrasonic transducer array 106 includes a cable 140 configured by bundling a knocking material 120 and signal lines 130 that are electrically connected to a plurality of ultrasonic transducers, respectively.
- Cylindrical structural member 150 for passing inside ultrasonic transducer array 106, tip structural member 160 provided at the tip of ultrasonic transducer array 106, ultrasonic transducer array 106, and ultrasonic endoscope apparatus For example, a serpentine tube connecting member 170 provided at the rear end of the ultrasonic transducer array 106 is provided for connection to the camera unit 600 (for example, the camera unit 600 shown in FIG. 2).
- the ultrasonic transducer array 106 includes a substrate 180 provided at the tip of the cylindrical structural member 150 for electrically connecting the substrate 770 and the signal line 130, a conductive resin 750, and a tube.
- the board 200 is provided at the rear part of the cylindrical structural member 150 in order to electrically connect the mating part 190 of the cylindrical structural member 150. It is assumed that the soldering portion 190 is connected to the GND wire 210 (corresponding to the ground wire 71) and the solder 220 extending through the cable 140 to the cylindrical structural member 150.
- each end of each signal line 130 passing through the cylindrical structural member 150 is connected to a predetermined pad 230 provided on the substrate 180 and fixed by a potting resin 240.
- Each pad 230 is connected to each predetermined pad 250 provided on the substrate 180 via a wiring on the substrate 180.
- Each pad 250 is connected to one end of each predetermined wire 260 by solder 220, and the other end of each wire 260 is connected to a predetermined conductor portion 270 (provided on substrate 770 by solder 220). Corresponding to the electrode 20a).
- a signal is transmitted to the piezoelectric element 710 through the signal line 130, the substrate 180, the wire 260, the substrate 770, and one of the electrode layers 720, and an ultrasonic wave is transmitted from the piezoelectric element 710.
- the mesh portion 190 is connected to the copper foil 290 provided on the substrate 200 by the conductive resin 280, and the copper foil 290 is connected to the conductive resin 750 by the conductive resin 280. .
- the other electrode layer 720 is electrically connected to GND.
- a feature of the ultrasonic transducer array 106 is that the acoustic lens 110 has a lens portion 300 formed in a convex shape so as to converge the ultrasonic wave transmitted from the piezoelectric element 710 at a predetermined focal point, Piezoelectric element 710, first acoustic matching layer 730, second acoustic matching layer 740, and multiple components such as signal line 130, substrate 180, wire 260, and substrate 770
- a coating portion 310 (310-1, 310-2) covering a conductor member electrically connected to the plurality of ultrasonic transducers in order to electrically select the ultrasonic transducers; .
- the end portion of the covering portion 310-1 on the distal end side of the ultrasonic transducer array 106 is joined to the distal end structural member 160 with an adhesive or the like. Further, it is assumed that the end of the covering portion 310-2 on the rear end side of the ultrasonic transducer array 106 is joined to the serpentine tube connecting member 170 with an adhesive or the like.
- the covering portion 310-1 mainly covers the array constituent members that are easily damaged (the piezoelectric element 710, the first acoustic matching layer 730, the second acoustic matching layer 740, the substrate 770, etc.).
- the central axial force of the ultrasonic transducer array 106 also covers conductor members (such as the signal line 130, the substrate 180, the wire 260, and the substrate 770) that are not covered with the GND wire that extends to the outer periphery.
- the covering portion 310-2 mainly covers the array constituent members (such as the piezoelectric element 710, the first acoustic matching layer 730, and the second acoustic matching layer 740) that are easily damaged.
- the piezoelectric element 710 is made of ceramics
- the first acoustic matching layer 730 is made of alumina (acid-aluminum) or titanium (acid-dioxide-titanium).
- the second acoustic matching layer 740 is made of an epoxy resin not containing a filler
- the substrate 770 is made of a glass epoxy resin.
- the sealing material 120 is composed of a gel-like epoxy resin containing a filler such as alumina.
- the first acoustic matching layer is made of carbon containing machinable ceramics, filler, or fiber
- the acoustic matching layer may be composed of an epoxy resin slightly containing a filler such as alumina or titanium
- the third acoustic matching layer may be composed of an epoxy resin that does not contain a filler.
- the acoustic lens 110 is made of an elastic material and a material that is an insulating material (for example, a silicone resin including a siloxane bond). .
- the material for constituting the acoustic lens 110 is not particularly limited as long as it is a material that is strong against impact and has an insulating property.
- the array members that are easily damaged such as the piezoelectric element 710, the first acoustic matching layer 730, the second acoustic matching layer 740, and the substrate 770, are made of at least the acoustic lens 110 made of an elastic material. Even if the ultrasonic transducer array 106 receives an impact and the array structural members are damaged, the debris is confined in the ultrasonic transducer array 106 by the acoustic lens 110 because it is covered with the covering portion 310. I can keep it. Thereby, even if the ultrasonic transducer array 106 receives an impact and the array structural member is damaged, it is possible to prevent the ultrasonic endoscope apparatus from dropping off the pieces of the array structural member.
- the conductor members such as the signal line 130, the substrate 180, the wire 260, and the substrate 770 are covered with the covering portion 310 of the acoustic lens 110 made of at least an insulating material, for some reason. Even if an overvoltage is applied to the conductor member, the overvoltage is not applied to the outside of the ultrasonic transducer array 106 by the acoustic lens 110. As a result, even if an overvoltage is applied to the conductor member for some reason, it is possible to prevent the overvoltage from being applied to the outside of the ultrasonic endoscope apparatus. Next, the assembly process of the ultrasonic transducer array 106 will be described.
- 22A and 22B are diagrams for explaining the assembly process of the ultrasonic transducer array 106, respectively.
- the same components as those shown in FIG. 21 are denoted by the same reference numerals.
- a plate-like ultrasonic transducer array is configured like the ultrasonic transducer array 700 shown in FIG. 3, and each of the plates in the direction perpendicular to the longitudinal direction of the plate-like ultrasonic transducer array is formed.
- the end faces are connected to each other to form a cylinder.
- the backing material 120 is provided on the inner periphery of the cylindrically formed ultrasonic transducer array, and the acoustic lens 110 is provided on the outer periphery of the cylindrically formed ultrasonic transducer array.
- a cylindrical structural member 150 provided with a cable 140 is inserted into an ultrasonic transducer array formed in a cylindrical shape.
- the signal line 130 and one electrode layer 720 of the piezoelectric element 710 are connected to the conductor 760 and the conductor portion 270.
- the electrode layer 720 on the outer side of the cylindrical structural member 150 is electrically connected through the conductive resin 750, the conductive resin 280, the copper foil 290, and the plating part 190.
- the distal end structural member 160 is joined to the distal end portion of the ultrasonic transducer array formed in a cylindrical shape with an adhesive or the like, and at the rear end portion of the ultrasonic transducer array formed in the cylindrical shape.
- the ultrasonic transducer array 106 is configured by bonding the snake tube connecting member 170 with an adhesive or the like (see FIG. 21).
- FIG. 23 is a perspective view of the ultrasonic transducer array 106 in a state where the acoustic lens 110 is assembled.
- the same components as those shown in FIG. 21 are denoted by the same reference numerals.
- the covering portion 310-1 of the acoustic lens 110 covers each pad 250 provided on the substrate 180, each conductor portion 270 provided on the substrate 770, and the like.
- the present invention is not limited to the above embodiment, and various configurations are conceivable. For example, the following configuration can be considered.
- FIG. 24 is a view showing a cross section of an ultrasonic transducer array according to another embodiment of the present invention.
- An ultrasonic transducer array 400 shown in FIG. 24 is a so-called direct-view type ultrasonic transducer array, and is an optical system 410 such as an ultra-compact camera or illumination (for example, an ultrasonic transducer provided in the camera unit 600 shown in FIG. 2).
- Protective tube 430 (for example, a metal pipe that fills the backing material 120, and a weir when the air / water supply port 420 is provided inside the ultrasonic transducer array 400. ) Passes through the interior.
- the structural member 440 shown in FIG. 24 has a function of a weir when the knocking material 120 is filled. Further, it is assumed that the conductive resin 450 is filled between the tip structural member 160 and the substrate 200. It is assumed that the space between the flexible tube connecting member 170 and the structural member 440 is filled with a sealing member 460.
- the ultrasonic transducer array 400 includes the signal line 130 and one electrode layer 720 of the piezoelectric element 710 (the electrode layer 720 on the central side of the protective tube 430). It is configured to be electrically connected at the rear end, that is, near the serpentine tube connecting member 170.
- the ultrasonic transducer array 400 shown in FIG. 24 is characterized by the piezoelectric element 710, the first acoustic matching layer 730, the second, similar to the ultrasonic transducer array 106 shown in FIG. Acoustic matching layer 740 and array components that are susceptible to breakage such as substrate 770 or multiple ultrasonic transducers such as signal line 130, substrate 180, wire 260, and substrate 770 to select electrically
- the conductive member electrically connected to the ultrasonic vibrator is covered with the covering portion 310 of the acoustic lens 110. Note that the end portion of the covering portion 310-1 is joined to the tip structural member 160 by an adhesive or the like. Further, it is assumed that the end of the covering portion 310-2 is joined to the serpentine tube connecting member 170 by an adhesive or the like.
- the covering portion 310-1 mainly covers the array constituent members (such as the piezoelectric element 710, the first acoustic matching layer 730, and the second acoustic matching layer 740) that are easily damaged.
- the covering portion 310-2 mainly covers the array components that are easily damaged (such as the piezoelectric element 710, the first acoustic matching layer 730, the second acoustic matching layer 740, and the substrate 770), and
- the conductor member (signal line 130, substrate 180, wire 260, substrate 770, etc.) is covered with a GND wire between the central axis and the outer periphery of the acoustic wave transducer array 106.
- the ultrasonic transducer array 400 is similar to the ultrasonic transducer array 106 shown in FIG. Even if the array structural member is damaged due to impact, the debris can be confined in the ultrasonic transducer array 400, so that the debris is prevented from falling off the ultrasonic endoscope apparatus. be able to.
- the plurality of ultrasonic transducers of the above embodiment are continuous in one dimension by providing a plurality of grooves in the plate-like piezoelectric element 710 in a direction perpendicular to the longitudinal direction of the piezoelectric element 710.
- a plurality of grooves are provided in the longitudinal direction of the piezoelectric element 710 and in a direction perpendicular to the longitudinal direction, so that they are continuously arranged in two dimensions.
- a plurality of ultrasonic transducers may be configured.
- a radial ultrasonic transducer array may be configured by arranging a plurality of ultrasonic transducers configured so as to be continuously arranged in two dimensions in an annular shape around the insertion axis.
- the acoustic lens 110 of the above embodiment may be configured to contain acid pig iron (for example, a petal (Bengara) or the like).
- acid pig iron for example, a petal (Bengara) or the like.
- the lens portion 300 of the acoustic lens 110 is formed in a convex shape and is V, but the shape of the lens portion 300 is not particularly limited, such as a concave shape.
- the covering portion 310-1 and the covering portion 310-2 of the ultrasonic transducer array 106 are the ultrasonic transducer array 106 (or the ultrasonic transducer).
- the structure of the array 400) is such that the lengths in the insertion axis direction are different from each other.
- the sizes of the portions to be covered by the covering portion 310-1 and the covering portion 310-2 are equal to each other, -The lengths in the insertion axis direction of each of the 1 and the covering portion 310-2 may be configured to be equal to each other.
- the lens unit 300 and the covering unit 310 may be configured as separate members.
- the covering member in addition to the acoustic lens 110 having only the lens unit 300, it is more likely to be damaged than the covering member that covers the conductor member that is easily covered with the GND wire. It may be provided on the outer periphery of the acoustic wave transducer array 106. It is assumed that the covering member is made of an insulating material having elasticity such as silicone resin.
- the cable can be positioned and fixed to the vibrator to be surely wired, the electrical safety of the vibrator can be improved, and the diameter can be reduced. You can.
- the easily damaged array constituent member is covered with an acoustic lens made of an elastic material, even if the ultrasonic transducer array is impacted and the array structural member is damaged, the array structural member is damaged. Debris can be confined within the ultrasonic transducer array. Thereby, even if the ultrasonic transducer array receives an impact and the array structural member is damaged, it is possible to prevent the ultrasonic endoscope apparatus from dropping off the pieces of the array structural member.
- the conductor member is covered with an acoustic lens made of an insulating material! /. Therefore, even if an overvoltage is applied to the conductor member for some reason, the overvoltage is generated by ultrasonic waves. It is not applied outside the transducer array. As a result, even if an overvoltage is applied to the conductor member for some reason, the overvoltage can be prevented from being applied to the outside of the ultrasonic endoscope apparatus.
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Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05785930.8A EP1808130A4 (en) | 2004-09-24 | 2005-09-20 | Ultrasonic transducer, ultrasonic array and ultrasonic endoscope system |
US11/663,572 US20090204006A1 (en) | 2004-09-24 | 2005-09-20 | Ultrasonic transducer, ultrasonic transducer array and ultrasonic endoscope system |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004277462A JP4377787B2 (ja) | 2004-09-24 | 2004-09-24 | 超音波振動子 |
JP2004-277462 | 2004-09-24 | ||
JP2004286910A JP4472480B2 (ja) | 2004-09-30 | 2004-09-30 | 超音波振動子アレイ |
JP2004-286910 | 2004-09-30 |
Publications (1)
Publication Number | Publication Date |
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WO2006033331A1 true WO2006033331A1 (ja) | 2006-03-30 |
Family
ID=36090090
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Application Number | Title | Priority Date | Filing Date |
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PCT/JP2005/017315 WO2006033331A1 (ja) | 2004-09-24 | 2005-09-20 | 超音波振動子、超音波振動子アレイ、及び超音波内視鏡装置 |
Country Status (3)
Country | Link |
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US (1) | US20090204006A1 (ja) |
EP (1) | EP1808130A4 (ja) |
WO (1) | WO2006033331A1 (ja) |
Cited By (1)
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CN105411629A (zh) * | 2016-01-11 | 2016-03-23 | 深圳开立生物医疗科技股份有限公司 | 超声内镜及其换能器 |
Families Citing this family (9)
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US20040082859A1 (en) | 2002-07-01 | 2004-04-29 | Alan Schaer | Method and apparatus employing ultrasound energy to treat body sphincters |
JP5768056B2 (ja) | 2009-10-30 | 2015-08-26 | リコール メディカル インコーポレイテッドReCor Medical, Inc. | 経皮的超音波腎神経除去による高血圧症を治療するための方法及び装置 |
US10722169B2 (en) | 2011-01-28 | 2020-07-28 | Medtronic, Inc. | Physiological condition determination based on pressure wave produced by an implantable medical device housing |
EP2968984B1 (en) | 2013-03-14 | 2016-08-17 | ReCor Medical, Inc. | Ultrasound-based neuromodulation system |
WO2014159273A1 (en) * | 2013-03-14 | 2014-10-02 | Recor Medical, Inc. | Methods of plating or coating ultrasound transducers |
KR102205505B1 (ko) | 2014-03-04 | 2021-01-20 | 삼성메디슨 주식회사 | 초음파 프로브의 제조 방법 및 그 초음파 프로브 |
JP6581302B2 (ja) * | 2016-05-20 | 2019-09-25 | オリンパス株式会社 | 超音波振動子モジュールおよび超音波内視鏡 |
WO2020188762A1 (ja) * | 2019-03-19 | 2020-09-24 | オリンパス株式会社 | 超音波内視鏡 |
JP7317778B2 (ja) * | 2020-09-08 | 2023-07-31 | 富士フイルム株式会社 | 超音波気管支鏡 |
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Also Published As
Publication number | Publication date |
---|---|
US20090204006A1 (en) | 2009-08-13 |
EP1808130A4 (en) | 2018-02-14 |
EP1808130A1 (en) | 2007-07-18 |
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