WO2005091036A1 - Optical module and method for manufacturing the same - Google Patents

Abstract

[PROBLEMS] To provide an optical module produced at low cost and used for conversion of an optical path using a reflector having a reflective surface of high position and profile accuracy. [MEANS FOR SOLVING PROBLEMS] A reflective surface (2) is formed accurately by pressing a presser against the surface of each of reflectors (1a) coupled in a coupling body (30) of a thin-plate reflector on a flat base, and one end of each metal wire (3) is crimped to each of the opposite ends at the lower part of the coupling body (30). The coupling body (30) is arranged on a substrate (5), and the metal wire (3) is turned so that the angle between the central axis of the reflective surface (2) and the substrate (5) may be about 45°or 135°,thus maximizing the optical coupling between an optical transmission line (6) and an optical element (9). The other end of each metal wire (3) is crimped to the substrate (5). The coupling body (30) is buried entirely in a transparent filler, which is cured to form a transparent material part (13). Division into individual reflectors (1a) is performed to obtain a plurality of optical modules.

Description

 Specification

 Optical module and method of manufacturing the same

 Technical field

 The present invention relates to a method of reflecting light emitted from a first optical component between a first optical component having a light emission port and a second optical component having a light entrance, having a reflection surface. The present invention relates to an optical module that is reflected by the body and is incident on a second light component, and a method of manufacturing the same.

 Background art

 In the case where a single-nore mode optical waveguide is used for optical coupling between an optical element and an optical transmission path, for example, an optical transmission path, alignment of the optical axis between the optical element and the optical transmission path A margin of less than 1 / m is required. In order to reduce the mounting cost of the optical device, it is necessary to increase this alignment margin. As one of the realization methods, it is conceivable to form an optical path between an optical element and an optical transmission path by parallel light. For this purpose, a collimating optical system is required to convert light emitted from the light emitting portion of the optical element or the light emitting port of the light transmission path with a spread angle into parallel light. As such a collimating optical system, an optical system using a concave mirror or an optical system using a convex lens can be used.

 The light receiving element is usually arranged such that its optical axis is orthogonal to the main surface of the substrate. The surface light emitting type light emitting element is also disposed so that the optical axis is orthogonal to the main surface of the substrate. On the other hand, optical transmission paths such as optical fibers and optical waveguides are arranged such that their optical axes are parallel to the main surface of the substrate. Therefore, if these forces are formed on a single substrate, a 90-degree conversion is required to bend the optical path at a right angle. In such a case, using an optical system using a concave mirror as a collimating optical system is advantageous in that it can also realize 90-degree conversion of the optical path and achieve cost reduction.

[0004] As a method of manufacturing an optical module using a concave mirror as a collimating optical system, a structure having a concave reflection surface is fitted in a mold having a convex portion in the shape of an optical waveguide, and PMMA (poly) is inserted into this mold. As shown in FIG. 24 by injecting the methyl metatarylate) resin, taking out the molded body and filling the core polymer in the hollow portion in the shape of the optical waveguide of this molded body. , The concave reflecting surface 102 is formed by the structure 121 and the optical waveguide There has been proposed a method of producing a PMMA substrate 105 integrally provided with the light transmission path 106 (see, for example, Patent Document 1). Then, the optical transmission line 106 and the structure 121 are covered with the polysilicon 122. After being emitted from the light transmission path 106, the intensity of light reflected by the reflective surface 102 and detected by the photodiode 109 disposed so that the optical axis is orthogonal to the main surface of the PMMA substrate 105 is maximized. In this position, the photodiode 109 is pushed into and fixed to the polymer sheet 122.

Patent Document 1: Japanese Patent Application Laid-Open No. 10-54928 (page 4-6, FIG. 1, FIG. 5, FIG. 7)

 Disclosure of the invention

 Problem that invention tries to solve

 In the prior art optical module described above, the structure 121 occupies a wide space from the vicinity of the light receiving portion of the photodiode 109 to the substrate 5, and thus the vicinity of the structure 121. For example, it is difficult to form an electrode of the photodiode 109 and electrically connect the electrode to the substrate 105 by wire bonding, because the structure 121 prevents the connection, and so on. There is a problem that restrictions are imposed on

 Further, in the above-described prior art manufacturing method, since the structure 121 having the reflecting surface is inserted into the mold and used as it is for the optical module, the insertion of the structure 121 has an extremely small margin. Required Furthermore, in the case where the structure 121 itself is manufactured using a mold, the position, depth, diameter, etc. of the shape of the reflective surface 102 with respect to the reference plane of the shape of the structure 121 engraved in the mold in the manufacture. The cost of manufacturing molds is high because precision processing that can precisely control the mold is required. Furthermore, in order to produce a plurality of PMMA substrates 105 integrally provided with the above-mentioned structure 121 and the optical transmission path 106 in one mold, it is possible to obtain a mold that can be manufactured by connecting a plurality of structures 121. If so, it is necessary to precisely control the relative positions of the shapes of the plurality of structures 121 and engrave them in the mold, and the manufacturing cost in this case is the manufacturing cost of the mold for manufacturing one structure 121. It will be much more expensive than the connected number of times.

 The present invention has been made in view of the above problems, and an object thereof is to reduce the interference with the electrode wiring of the optical element by the mirror and increase the accuracy of the position and shape of the reflecting surface. An optical module and a method of manufacturing the same.

Means to solve the problem The optical module according to the present invention is characterized in that a first optical component having a light exit, a second optical component having a light entrance, and light from the first optical component are reflected. And a transparent material portion supported by the reflector and in contact with at least one of the light emission port and the light entrance port.

 According to the method of manufacturing an optical module of the present invention, a first optical component having a light exit, a second optical component having a light entrance, and light from the first optical component are reflected. A reflector having a reflection surface to be incident on the second optical component, and a reflector having a reflection method, the reflector, or a combination of a plurality of the reflectors connected to each other. The light from the first optical component is incident on the second optical component by rotating each one of the wires whose one end is fixed or one of the wires fixed to one side. And adjusting the angle of the central axis of the reflecting surface formed on the reflector or the connector with respect to the light.

 Effect of the invention

 In the optical module of the present invention, since the reflector having the reflection surface is embedded in the transparent material portion, the distortion caused by the contraction of the transparent material portion is uniformly distributed stress in each portion of the reflector, and the stress is totally generated. By offsetting each other, it is possible to reduce the displacement of the reflecting surface, which reduces the displacement of the reflector having the reflecting surface, and to thereby prevent the displacement of the optical path.

 According to the method of manufacturing an optical module of the present invention, the reflector or one wire in which one end is fixed to two points of a linked body to which a plurality of reflectors are connected or one fixed to one side Of the reflective surface formed on the reflector or the connecting body such that light from the first optical component is incident on the second optical component by rotating the single wire rod. Since the angle of the central axis with respect to the light is adjusted, the optical module can be manufactured inexpensively and with high accuracy.

 Brief description of the drawings

 FIG. 1 is a sectional view of an optical module according to an embodiment of the present invention [(a)] and a perspective view of a mirror [(b)].

[FIG. 2] is a part of a perspective view of an order of steps for explaining the manufacturing method of the embodiment 1 of the present invention FIG. 3 is a perspective view for explaining the manufacturing method of Embodiment 1 of the present invention in the order of processes in a process following the process in FIG. 2.

 FIG. 4 is a perspective view for explaining the manufacturing method of the embodiment 1 of the present invention in the order of processes in a step following the step in FIG. 3.

 FIG. 5 is a cross-sectional view in a step subsequent to the step of FIG. 4 for illustrating the manufacturing method of Example 1 of the present invention.

Garden 6] It is a perspective view of the process order for demonstrating another manufacturing method of Example 1 of this invention. 7) It is a perspective view of one process for explaining the further another manufacturing method of example 1 of the present invention.

 [FIG. 8] A sectional view taken along the line A-A in FIG. 2 (b).

FIG. 9 is a cross-sectional view taken along the line B-B in FIG. 6 (b).

Garden 10] Fig. 10 is a perspective view of a mirror assembly used for manufacturing the optical module in accordance with the second embodiment of the present invention.

11] A plan view of an optical module according to a third embodiment of the present invention [(a)] and a cross-sectional view taken along the line C-C [b)].

12) A plan view [(a)] and a cross-sectional view along a line DD in one process of manufacturing an optical module according to Embodiment 3 of the present invention [(b)].

13] A plan view of an optical module according to a fourth embodiment of the present invention [(a)] and a cross-sectional view taken along the line EE [(b)].

Garden 14] It is a perspective view of a mirror used for the optical module of FIG.

Garden 15] FIG. 15 is a view showing a part of a front view of an order of steps, for explaining a method of manufacturing the mirror shown in FIG.

 FIG. 16 is a perspective view for explaining the method of manufacturing the mirror of FIG. 14 in order of processes in a step subsequent to the step of FIG. 15.

Garden 17] is a plan view in a process of manufacturing an optical module according to Embodiment 4 of the present invention. Garden 18] is a cross-sectional view of an optical module according to Embodiment 5 of the present invention.

Garden 19] is a cross-sectional view of another optical module according to Embodiment 5 of the present invention. Garden 20] It is sectional drawing of the optical module based on Example 6 of this invention.

 [FIG. 21] A perspective view [(a)] and a side view [(b)] showing another example of the reflector according to the present invention

[FIG. 22] A top view [(a)] showing still another example of a reflector according to the present invention, a perspective view [b)], and a side view [()].

 FIG. 23 is a cross-sectional view of an optical module according to an embodiment of the present invention.

FIG. 24 is a front view of a conventional optical module.

Explanation of sign

1, la plate with reflective surface

lb connection

2 Reflective surface

3, 3 'metal wire

3a Metal wire section

4 Auxiliary board

4a Auxiliary plate

5, 5a substrate

6 Optical transmission line

6A, 9A core

6B, 9B clad

6C end opening

7, 7a outer wall

8 Holders

9 light element

10 Light receiving / emitting part

1 1 Light

12 pressure contact

 13, 13a Transparent material section

14, 42 electrodes 15 bonding wire

 16 Processing table

 17 lower plate

 18 slope

 19, 39 indenter

 20 mirror

 30, 31, 32 connected body

 40 electrode pads,

 41 copper pattern

 50 light module mother

 BEST MODE FOR CARRYING OUT THE INVENTION

 Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 (a) is a cross-sectional view of an optical module according to an embodiment of the present invention. An outer wall 7 is disposed on the substrate 5, and inside thereof is a transparent material 13 formed using a transparent filler. In the inside of the transparent material portion 13, a plate-like body 1 having a reflective surface is embedded in a part of the main surface, which is a thin plate having a thickness of 100 / im or less. As shown in FIG. 1 (b), the plate-like body 1 is a thin plate-like metal plate, in particular, a gold plate, a metal plate with a surface plated metal, or an aluminum plate, and the concave mirror A reflective surface 2 is formed. Here, although a reflector having a reflective surface is in the form of a plate, the shape of the reflector may have a thickness of 100 μm or less, and the reflective surface 2 may be placed on the substrate at a predetermined angle. Any possible shape is possible. For example, as the reflector, as shown in the perspective view from the lower bottom side of FIG. 21 (a) and the side view of FIG. 21 (b), the upper bottom is larger in area than the lower bottom (eg, lower bottom). When the length of the side is tl, the upper base is a trapezoidal body with a length of 3 tl) and the height (thickness) of tl (100 μm), and a reflective surface is formed on the upper base It may be shaped. In addition, as shown in the top view of FIG. 22 (a), the perspective view of FIG. 22 (b), and the side view of FIG. 22 (c), the cross section is a parallelogram (side length is 2 tl); With respect to the quadrangular prism (height t 2, shift length t 2 in the oblique direction) inclined to the above, a shape in which a reflection surface is formed on the side surface may be adopted. Also, as shown in the cross-sectional view of the optical module in FIG. 23, the foot such that a reflector such as a trapezoid can be easily fixed to the substrate. You may provide a part (here, the side part of square-prism shape has a foot part). This foot may be about 20% of the bottom of the reflector (in this case, a trapezoid). In addition, reflectors such as plate-like members are all carried in the transparent material part, and contact with the lower surface of the substrate without contact, etc. It does not have to be inside.

 The plate-like body 1 has a transparent material portion 13 so that the central axis of the reflective surface 2 forms an angle of approximately 135 degrees [hereinafter, simply referred to as “135 degrees”] counterclockwise from the upper surface of the substrate 5. It is embedded in the inside. Here, in the plate-like member 1 having a reflective surface, the central axis of the reflective surface 2 is at an angle other than that from the upper surface of the substrate 5, for example, the normal of the reflective surface 2 is inclined 60 degrees from the normal to the substrate surface. The material part 13 may be embedded in the mold. The inclination angle can be set arbitrarily depending on the application.

 On the upper surface of the outer wall 7, a light receiving portion which is a light entrance or a light emitting portion which is a light exit (hereinafter referred to as “light receiving / light emitting portion”) 10 is made to face the reflecting surface 2 of the plate 1. The light element 9 is mounted. In addition, an optical transmission path 6 formed of an optical fiber having a core 6A and a clad 6B, which penetrates one side of the outer wall 7 and reaches the inside of the transparent material 13 on the substrate 5, has its optical axis as the substrate 5 It is disposed parallel to the main surface of the The end opening 6C of the core 6A faces the reflecting surface 2. The optical axis of the light transmission path 6, the optical axis of the optical element 9, and the central axis of the reflecting surface 2 are both in one plane perpendicular to the substrate 5.

 The optical element 9 is, for example, a light receiving element such as a photodiode or a light emitting element such as a surface emitting semiconductor laser. For the substrate 5, any of metal, semiconductor and insulator may be used. In addition, the transparent material portion 13 can be formed by filling a transparent filler, and as the transparent filler, a transparent adhesive, a transparent gel or the like that is transparent to light used in this optical module can be formed. It is desirable to have the same refractive index as the used core 6A. Specifically, a refractive index matching agent such as silicone grease or silicone oil, a thermosetting resin, an ultraviolet curable resin, or a thermoplastic resin such as PMMA, polycarbonate or liquid crystal polymer can be used. It is desirable that the outer wall 7 is also transparent to light used in this optical module at least in the vicinity of the light receiving Z light emitting portion 10 of the optical element 9 and further has the same refractive index as the transparent material 13. .

The light transmitted from the outside in the core 6 A of the light transmission path 6 is emitted to the transparent material portion 13 and then reflected almost at right angles by the reflecting surface 2 of the plate 1, ie, the substrate 5. Perpendicular to the main surface of Is bent upward, passes through the outer wall 7, and enters the light receiving / emitting part 10 of the optical element 9, or conversely, light emitted from the light receiving / emitting part 10 of the optical element 9 is reflected. The light is bent parallel to the main surface of the substrate 5 by the surface 2 and is transmitted through the core 6A of the light transmission path 6 and emitted to the outside.

 Example 1

 Next, the manufacturing method according to the first embodiment of the present invention will be described with reference to FIGS. The manufacturing method according to the present embodiment is a manufacturing method of the optical module shown in FIG. In FIG. 2 to FIG. 5, the same parts as those of FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted as appropriate.

 First, a plurality of plate-like members la having the same shape as the plate-like members 1 of the optical module shown in FIG. Figure 2 (a)]. As shown in FIG. 2A, the direction of length L, width W, and thickness t of the connector 30 is in the direction in which the plate members la are aligned, and in the plane in which the reflecting surface 2 is formed. When defined as a direction orthogonal to the direction of length L, and a direction perpendicular to the direction of length L and the direction of width W, the width W is lmm or less, and the thickness t is 0.1 lmm or less. As the material of the connector 30, a gold plate, a metal plate with a surface plated metal, or a thin plate-like metal plate such as an aluminum plate was used.

 Next, the connector 30 is placed on a heating table heated to 220 ° C., and one metal wire extending in the length direction of the connector 30 at each of the lower ends of the connector 30. 3 Crimp one end of (Diameter: R, Length: d) using ultrasonic thermocompression bonding [Fig. 2 (b)]. As a material of the metal wire 3, a gold wire or an aluminum wire having a diameter of 50 μm or less used for wire bonding is optimum. The length d is suitably 200 mm or less.

 Next, two auxiliary plates 4 are installed at a distance of about 10 mm from both ends of the connector 30, and the open ends of the two metal wires are thermocompression-bonded to the respective auxiliary plates 4 [ Figure 2 (c)]. The auxiliary plate 4 is, for example, a plate of a soft magnetic material such as iron or nickel having a dimension of 1 mm in the length direction of the connector 30 and a dimension in the width direction of the connector 30 of about 5 mm. It is appropriate that the part to be heat-bonded be plated with gold.

Thereafter, as shown in FIG. 3 (a), on the substrate 5a, a plurality of optical transmission paths 6 consisting of optical fibers held between a pair of optical fiber grippers (not shown) are formed of the substrate 5a. Parallel to the plane Place. The substrate is mounted on a heating stage for later heating steps. The optical transmission paths 6 are arranged parallel to the plane of the substrate 5a at a pitch equal to the pitch of the plate bodies la, the number of which is equal to the number of plate bodies la of the connector 30. Next, as shown in FIG. 2 (c), after both auxiliary plates 4 in which the connecting body 30 is connected by the metal wire 3 are attracted by the holder 8 made of an electromagnet, the connecting body 30 and both metal wires 3 The holder 8 is moved so that a part of the lens rests on the substrate 5a. At this time, the direction in which the plate-like members la of the connector 30 are aligned is made to coincide with the direction in which the light transmission paths 6 are arrayed. The distance between the two auxiliary plates 4 is, for example, 200 mm. In addition, a gold plating pattern is formed in advance on the main surface of the substrate 5a in a region where a part of both the metal wires 3 is placed. In FIG. 3 (a), the connecting portion lb of the connecting body 30 is not shown for simplicity of the drawing.

 Next, the outer wall portion 7a is placed on the substrate 5a so as to include the whole of the connector 30 and the end region facing the connector 30 of the light transmission path 6 in the inside thereof. In the outer wall 7a, a gap through which the metal wire 3 and the light transmission path 6 can pass is formed. Furthermore, on the outer wall 7, a number of adjustment light elements (not shown) equal in number to the number of plate members la of the coupling body 30 are arranged in a plate member at a pitch equal to the pitch of the plate members la. The light receiving / emitting portions are placed opposite to the plate body la so as to be arranged parallel to the direction in which the la is arranged. The adjustment optical element is an optical element for adjusting the optical element to be finally mounted on the optical module so as to be positioned at the optimum position, and an optical fiber or an optical waveguide can be used for it.

Subsequently, as shown in FIG. 3 (b), the holder 8 is rotated about the axis of the metal wire 3 so that the central axis of the reflective surface 2 of the plate body la is the main of the substrate 5 a. Make it about 135 degrees to the surface. Next, light is externally applied to at least one light transmission path 6. The incident light is emitted to the inside of the outer wall 7 from the end opening facing the reflective surface 2 of the light transmission path 6, and then the optical path is bent almost at the reflective surface 2 at right angles to the main surface of the substrate 5a. And enter the light receiving / emitting part of the adjustment light element. A measuring device for measuring the intensity of light incident thereon is connected to the adjustment light element. The connector 30 is rotated using the holder 8 so that the intensity of the light measured by this measuring device is maximized, and the holder 8 is fixed at that position. If necessary, light is made incident on all the optical transmission paths 6, received by all the adjustment light elements, and measured by the measuring device connected to these adjustment light elements. The strength is The position of the optical transmission line 6 and the adjustment optical element may be finely adjusted so as to be maximized.

Next, the temperature of the heating table on which the substrate 5a is placed is raised to 220 ° C., and as shown in FIG. 4 (a), the metal wire 3 is formed by the indenter 19 using the ultrasonic thermocompression bonding method. Is pressed against the pre-formed gold plating pattern (not shown) on the substrate 5a and crimped. In order to simplify the figure, the indenter 19 is not drawn only on the metal wire 3 on the right side of the outer wall 7a, but the metal wire 3 on the left side of the outer wall 7a also presses the indenter. It is crimped to a gold-plated pattern. After that, as shown in Fig. 4 (b), the metal wire 3 is cut outside the pressure contact 12 where the metal wire 3 is crimped to the metallized pattern. As described above, after aligning the connecting body 30 in which a plurality of plate-like bodies la are connected to the substrate 5a at an optimal angle, the metal wire 3 connected to the connecting body 30 is used as two pressure contacts. By pressure-bonding to the substrate 5a at 12, the reflecting surfaces 2 formed on the plurality of plate-like members la are simultaneously aligned with the corresponding optical transmission paths 6 and the optical elements. Therefore, in the manufacturing method according to the present embodiment, the cost for the case where the alignment cost of the reflective surface 2 aligns the reflective surface of each plate with respect to the optical transmission path and the optical element is It has the effect of reducing the cost divided by the number of

 Next, the adjustment optical element mounted on the outer wall 7 a is replaced with an optical element actually used in the optical module.

Then, as shown in FIG. 5, a transparent adhesive or transparent gel having a refractive index the same as that of the core 6A of the light transmission path 6 is injected into the space covered by the outer wall 7a. Thus, the transparent material portion 13a in which the connecting body 30 is embedded is formed. As a result, an optical module matrix 50 is produced in which a plurality of optical modules shown in FIG. 1 are connected. As a material of the transparent filler, specifically, refractive index matching agents such as silicone grease and silicone oil, thermosetting resins, ultraviolet curable resins, thermoplastic resins and the like can be used. In the case of using a thermosetting resin, an ultraviolet curable resin, or a thermoplastic resin, of course, they are thermally cured and ultraviolet cured after injection, respectively. In a state where the connector 30 is not carried in the transparent material portion 13a, for example, assuming that a couple sandwiching the connector 30 acts on the substrate 5a in a pulsing manner, the connector is disconnected when the couple is broken. 30 rotates about the metal wire 3 and the rotation causes the metal wire 3 to twist, and the restoring motion of the twist causes reverse rotation, and so on. Such rotational displacement or vibration is gold This would cause torsional stress to be applied to the entire genus wire 3 and to apply unnecessary stress to the pressure contact 12 and the crimping point of the metal wire 3 to the connector 30, which is undesirable. Carrying the connector 30 into the transparent material portion 13a has the effect of preventing such rotational displacement and vibration.

 Next, the manufacturing method of the present embodiment is completed by dividing the optical module base body 50 in a state in which the connector 30 is embedded in the transparent material portion 13a in this manner for each plate-like member la. Thereby, the optical module shown in FIG. 1 is obtained. The plate-like body 1 is carried in the transparent material portion 13 and fixed. Here, the transparent material portion 13 is formed by curing a thermosetting resin, an ultraviolet curable resin, a thermoplastic resin or the like, and thereafter, the metal wire 3 is separated from the plate 1 to obtain the plate 1 May be fixed only by the transparent material portion 13.

In the above description, the plate-like body having the reflection surface of the optical module embeds and fixes the connector 30 as shown in FIG. 2 (a) in the transparent material portion to produce the optical module base. Then, it was formed by cutting each plate-like body la. As an alternative example, as shown in FIG. 6 (a), in the plate-like body having a reflection surface, a plurality of plate-like bodies 1 are connected by metal wires 3 'to form a connecting body 31, which is inside the transparent material portion. It may be formed by embedding and fixing it in the substrate to make an optical module base, and then cutting each plate 1 one by one. In this case, a silicon plate, a ceramic plate, a glass plate, or a highly heat-resistant resin plate such as a polyimide resin or a liquid crystal polymer may be used as the plate-like body 1. Further, as shown in FIG. 2 (a), the connector 31 may be formed as a single piece using the same constituent material. When the plate 1 is a glass plate or a resin plate, an indenter 19 having a convex surface whose temperature is raised to a temperature at which they can be plastically deformed is pressed against them to form a concave surface, A metal film such as aluminum or gold is vapor-deposited on the concave surface to form the reflective surface 2. When a silicon plate is used as the material of the plate-like body, the spread of about 25 zm of gold, aluminum or the like on one side is performed on at least one side of a silicon substrate of about 50 zm in thickness by, for example, a plating method. After forming a thin metal film with high conductivity, a concave indenter having a convex surface is pressed into the thin metal film to form a concave reflective surface 2. A hard silicon substrate prevents the warpage of the plate-like body 1, and by stopping the indenter on the silicon substrate, it is possible to form the dimension S of the reflecting surface 2 with high precision. FIG. 6 (b) is the same as the case of FIG. 2 (c) in addition to the outermost plates of the plurality of plates 1 connected by metal wires 3 'shown in FIG. 6 (a). , Connected metal wire 3 Afterward, the state where the metal wire 3 is thermocompression-bonded to the auxiliary plate 4 is shown. Thereafter, individual light modules are manufactured using the same process as described above. When the optical module base is cut for each plate 1, the metal wire 3 ′ connecting the two adjacent plates 1 is cut.

Here, consider the state of FIG. 4 (b). In the state of FIG. 4 (b), in the stationary state, the connector 30 is rotated by an angle by the metal wire 3 as an axis by its own weight, as compared with the case without gravity. That is, the metal wire 3 is twisted by the rotation angle between the pressure contact 12 to the substrate 5 a and the pressure contact point to the connector 30. The width W, thickness t, and length L of the connector 30 are defined as shown in FIG. 1, the density is p, the diameter of the metal wire 3 is R, and the pressure of the metal wire 3 to the connector 30 is Assuming that the length from the landing point to the pressure contact point 12 is d, and the angle between the connector 30 and the main surface of the substrate 5a is Θ, this rotation angle φ (degrees) is well known in elastic mechanics related to the torsion of the shaft. As shown, it can be calculated by the following equation.

[0034] = (1440 / π 2) p gdLtW 2 - cos Θ / (GR 4) (1)

Here, g is an acceleration of gravity of 9 · 8 m / sec ² , and G is a shear modulus of the metal wire 3. In the formula (1), the connecting portion lb of the connecting body 30 shown in FIG. 2 can be neglected to be much smaller in size than the plate body la. The following equation is obtained from equation (1).

(D / R) (L / R) (W / R) ² = π ² G / (1440 p gt-cos)) (2)

 In this state, when the space covered by the outer wall 7a is filled with the transparent filler, φ changes in order for the transparent filler to give the connecting body 30 a buoyancy. If this change in φ is large, the reflecting surface 2 deviates from the optimum position. Therefore, there is an allowable upper limit to this change in φ.

In order to reduce the change in φ, φ itself may be reduced. For example, let φ <0. 5 degrees. If connected body 30 and metal wire 3 are also gold,

G = 2. 7 x 10 ¹ ° N / m ² . When φ is 45 degrees, in the case of φ 0.5 degree, the following inequality can be obtained from equation (2).

(D / R) (L / R) (W / R) ² <700 / t (3)

Here, the unit of t is m. From equation (3), when the diameter R of the metal wire 3 is 18 x m or more, that is, R> 18〃 111 (top, d <200 x m, t <100 x m, W <l mm, L <3.6 mm If it is, the condition of equation (3) is satisfied, conversely, it is in the range of R, d, t, W, L or more. If so, the twist angle φ of the metal wire 3 is not more than 0.5 degrees, and the change in the rotation angle of the connector 30 after filling with the transparent filler is also as small as not more than 0.5 degrees, Between modules, the width of the light path variation is reduced.

On the other hand, when the connector 30 is an aluminum plate and the metal wire 3 is an aluminum wire, p = 2

In the case of 7 × 10 ³ kg / m ³ , G = 2. 6 × 10 ¹⁰ N / m ² , and in the case of φ 0 0.5 degrees as described above, the following inequality can be obtained from equation (2).

(D / R) (L / R) (W / R) ² <4800 / t (3)

If R> 18 is xm _{is, d <400 1 m, t} <100 1 m, W <lmm, L <12mm, there Rere is, d <lmm, t rather 100μπι, W rather lmm, L <5. The condition of equation (3) is satisfied at O mm.

 Further, in the case of R> 0.5 × m, the condition of the equation (3) is satisfied with d <100 mm, t <l〃m, W <5〃m, L <120 zm. That is, a connected body of aluminum plates having a width of 5 μm and a length of 120 / im connected between two aluminum metal wires 3 each having a diameter of 1 zm and a length of 100 mm fixed at one end to the substrate 5a The 30 rotation angles from the position when there is no gravity can be reduced to less than 0.5 degrees. Therefore, the change in the rotation angle of the group of plate-like bodies having a reflective surface after the filling with the transparent filler is also reduced to less than 0.5 degrees. This can be implemented by integrally forming two metal wires 3 of 100 mm in length formed in an etching pattern on a 1 / m thick aluminum film and the connector 30.

 Furthermore, as shown in FIG. 6 (a), two pieces of which one end is fixed to the outermost plate-like body of a plurality of plate-like bodies 1 made of silicon plates connected by metal wires 3 '. Consider the case where the metal wire 3 is fixed to the substrate at the other end by the same process as described above. The metal wires 3 and 3 'are aluminum or gold having the same diameter R, and the total length of the metal wires 3 and 3' is 2d '. The dimension of each plate 1 connected by the metal wire 3 ′ in the direction in which the plates 1 are arranged is L ′, in the plane where the reflecting surface 2 is formed, in the direction in which the plates 1 are arranged Assuming that the dimension in the orthogonal direction is W 'and the dimension in the orthogonal direction is t', the angle of rotation of the central plate from the position without gravity in the case of φ of 0.5 degree Is as follows.

(D '/ R) (NL' / R) (W / R) ² 5400 / t (4)

Here, N is the number of plate-like bodies 1 connected by the metal wire 3 '. R> 25 IX m If the condition of equation (4) is satisfied, d ′ <100 mm, <100 / im, W く 0.2 mm, L ′ <0.2 mm, N <26. That is, the position of the group of 26 silicon plates connected by metal wire 3 'between two metal wires 3 fixed at one end to substrate 5a in the absence of gravity. The rotation angle from is suppressed to less than 0.5 degrees. Therefore, the change in the angle of rotation of the plate group after filling with the transparent filler is also reduced to less than 0.5 degrees. Therefore, the 26 plate groups connected by metal wire 3 'between the total length of 200 mm are fixed on the substrate by two metal wires 3, and a thermosetting or UV curable transparent filler is used. The sheet group is wrapped with the plate, and after the transparent filler is cured, the sheet, the outer wall, the transparent material portion, and the metal wire 3 'are cut for each sheet 1, so that the sheet 1 is made of:! It is possible to manufacture an optical module divided into separate pieces. As the plate 1, in addition to a silicon plate, an aluminum plate having a small specific gravity as in the silicon plate, a polymer plate containing a liquid crystal polymer as a main component, or the like can be used.

 Although there is no lower limit to the width, length, thickness, and diameter of the metal wire, etc. of one plate-like body 1, one plate-like body is preferable in terms of ease of handling. Width and length are 以上 005 mm or more and lm m or less, thickness 厚 0 001 mm or more (desirably 1 ΐ ΐ 100 or more) 100 ΐ 以下 or less, metal wire diameter is. 0 001 mm or more desirable.

 As described above, in the method of manufacturing the optical module according to the present embodiment, the thin plate-like coupling body is placed on the flat table, and the plurality of plates coupled in the coupling body Since the reflecting surface can be formed by pressing the indenter against the surface of the body, it is possible to simultaneously form the reflecting surfaces on a plurality of plate-like members with high reproducibility and at low cost.

Further, in the method of manufacturing the optical module according to the present embodiment, a metal wire 3 composed of a bonding wire having a diameter of 50 μm or less, which is used to obtain an electrical connection of the electrodes of the integrated circuit, is connected 30 Alternatively, a plurality of plate-like members la having a reflecting surface 2 or a plate using a plate as mechanical holding means 31 or high-speed processing by ultrasonic thermocompression bonding as a means of fixing the metal wire 3 to the substrate 5a. Since the body 1 is fixed so that the central axis of its reflecting surface 2 forms an angle of 135 degrees with the substrate 5a, the manufacturing cost of the optical module can be reduced and the production speed can be improved. Have the effect. In the method of manufacturing an optical module according to the present embodiment, the metal wire 3 of the connector 30 or 31 is used as an axis by adopting the above configuration. It has an effect that rotation by dead weight can be made small.

 Furthermore, in the method of manufacturing the optical module according to the present embodiment, after the connector 30 or 31 is embedded in a transparent filler such as a thermosetting resin or an ultraviolet curing resin in the above state, The strain of the curing shrinkage of the transparent filler is uniformly dispersed on both main surfaces of the plate la or the plate 1, so that the plate la or There is an effect that the displacement of the plate-like body 1 is small. Furthermore, in the method of manufacturing the optical module according to the present embodiment, as described above, since the rotation due to its own weight is small around the metal wire 3 of the connector 30 or 31, the connection by the buoyancy of the transparent filler The angle change of the body 30 or 31 relative to the substrate 5a can be reduced.

 In the above description, an optical fiber is used as the optical transmission path 6, but the optical transmission path may be an optical waveguide formed in parallel to the surface of the substrate 5a.

 Further, in the process of aligning the optical transmission path, the connector, and the optical element, the optical element to be finally mounted on the optical module is adjusted so as to be positioned at the optimum position as an optical element. Although the adjustment optical element is used, the adjustment optical element may be replaced by an optical element actually mounted on the optical module. FIG. 7 is a cross-sectional view of steps in the case where an optical fiber actually mounted on an optical module is used as an optical element at the time of alignment of an optical transmission path, a connector, and an optical element. In FIG. 7, parts equivalent to those in FIG. 5 are assigned the same reference numerals, and redundant descriptions will be omitted as appropriate. The light device 9 is connected to a measuring device for measuring the intensity of light incident thereon. The position of the connector 30 and the angle of the central axis of its reflecting surface with respect to the substrate 5a are determined so that the light intensity measured by this measuring device is maximized. Thereafter, the optical device 9 is mounted on the optical module as it is without being replaced by another optical device. The light element 9 may be a light receiving element such as a photodiode which is not an optical fiber. In that case, the angle of the connector 30 with respect to the substrate 5a is determined such that the current flowing to the light receiving element is maximized. Also, instead of the optical element 9 composed of the light transmission path 6 or the optical fiber, a light emitting element such as an edge emitting semiconductor laser may be used.

FIG. 8 (a) is a cross-sectional view taken along the line AA of FIG. 2 (b). The metal wire 3 is crimped to the main surface of the plate body la on which the reflective surface 2 is formed. Force, while as shown in Figure 8 (b), gold The genus wire 3 may be crimped to the main surface of the plate-like body la in which the reflective surface 2 is not formed.

Further, metal wire 3 is a wire having rigidity other than metal such as a silicon wire, a ceramic wire, or a wire of carbon fiber as a substitute, and is substituted by a substitute wire having a metal mesh formed on the surface thereof. May be A paste of silver nanoparticles or copper nanoparticles with a diameter of about 5 nm is applied to the junctions between these alternative wires and the plate 1 having a reflective surface, or to the junctions with the auxiliary plate 4, and approximately 200 These may be bonded by forming a strong metal bond by heating to ° C.

 FIG. 9 (a) is a cross-sectional view taken along the line B-B in FIG. 6 (a). The light 11 that has entered the plate-like body 1 from the side of the concave reflecting surface 2 is reflected by the reflecting surface 2. When the plate-like body 1 is a high heat resistant resin plate such as a transparent polyimide resin or liquid crystal polymer, a glass plate, or a silicon plate transparent at the used wavelength, as shown in FIG. A metal film such as aluminum or gold is vapor-deposited only on the main surface on the convex side of these plates so as to form a convex surface to form the reflective surface 2, and a plate-like body on the opposite side to the reflective surface 2 The light 11 incident from the main surface 1 and transmitted through the inside of the plate 1 may be reflected by the inner surface of the reflecting surface 2.

 In the above process, the auxiliary plate 4 is a soft magnetic material and is held by the holder 8 made of an electromagnet, but the means for holding the auxiliary plate 4 is not limited to the electromagnet, and the auxiliary plate is not limited to the electromagnet. As long as the connector 30 can be rotated about the metal wire 3 by holding and fixing 4, any may be used. For example, it is also possible to hold the auxiliary plate 4 by vacuum suction. In this case, any plate can be used as the auxiliary plate 4 as long as it is a flat surface to which one end of the metal wire 3 can be fixed. Furthermore, the auxiliary plate 4 can be configured as two parallel flat plates sandwiching the metal wire 3 as a part of the holder 8.

Further, in the present embodiment, the auxiliary plate 4 is installed at the open end of each of the two metal wires 3 crimped to both ends of the connecting body 30, but the metal wire between the connecting body 30 and the auxiliary plate 4 is Good even if you install a third auxiliary plate (not shown). The third auxiliary plate is preferably provided with a metal wire in such a way as to face the horizontal plane when the connector 30 is oriented at an appropriate angle. By doing so, it is possible to align the connecting body 30 with the third auxiliary plate as a support. Next, after the connector 30 is oriented, the position between the third auxiliary plate and the auxiliary plate 4 at the tip is The metal wire 3 is crimped to the gold-plated pattern on the substrate 5 a with the indenter 19. By so doing, it is possible to form a structure in which the third auxiliary plate is also supported by the pressure contact along with the connector 30. Next, a transparent filler is injected into the space covered by the outer wall 7a. As the transparent filler, a refractive index matching agent such as silicone grease or silicone oil, or a thermoplastic resin is used to form the transparent material portion 13a. It can be formed. In this case, if necessary, the third auxiliary plate is later rotated to turn and turn the connector 30 connected by the metal wire 3 in the transparent material portion 13a. Can. In the case of a thermoplastic resin, the coupling body 30 can be rotated by liquefying the transparent filler of the transparent material portion 13a by heating. In this way, it is also possible to produce a structure that allows the connector 30 to be later rotated as required.

 Example 2

 FIG. 10 is a perspective view of a connector used for manufacturing the optical module according to the second embodiment of the present invention. The connecting body 32 shown in FIG. 10 is different from the connecting body 30 shown in FIG. 2 (a) in that the connecting body 30 shown in FIG. 2 (a) is composed of a plate la and a connecting portion lb. The point is that the wire portion 3a and the auxiliary plate portion 4a are connected. That is, in the connecting body 32 shown in FIG. 10, the connecting body 30, the metal wire 3 and the auxiliary plate 4 shown in FIG. 2C are integrally formed. The connector 32 is a metal plate of gold, silver, copper or aluminum having a thickness of about 50-18 × m. The width of the metal wire portion 3a is substantially the same as the thickness thereof, and hence the cross section of the metal wire portion 3a is approximately square. The manufacturing process of the optical module in the present embodiment is the same as the manufacturing process in the first embodiment.

 According to the manufacturing method of the present embodiment, a connecting body 32 in which a plate body la, a connecting portion lb, a metal wire portion 3a, and an auxiliary plate portion 4a are connected to a body is used. Thus, the manufacturing time can be shortened and the manufacturing cost can be reduced. Further, in the manufacturing method of the present embodiment, since the metal wire portion 3a is a metal wire of a square cross section, the twist φ of the metal wire portion 3a is smaller than in the case of the metal wire of a circular cross section. Have an effect.

 Example 3

FIG. 11 (a) is a plan view of an optical module according to Example 3 of the present invention, and FIG. 11 (b) is a cross-sectional view taken along line C--C in FIG. 11 (a). In FIG. 11, parts equivalent to those in FIG. Are given the same reference numerals, and redundant description will be omitted as appropriate. The optical module shown in FIG. 11 is different from the optical module shown in FIG. 1 in that the optical element 9 is mounted on the recessed area of the substrate 5 rather than being mounted on the outer wall 7; The metal element 3 is crimped to the electrode 14 of the optical element 9 rather than crimped to the substrate 5, and the pressure contact 12 is formed on the electrode 14 of the optical element 9. The point is that the electrode 14 is electrically connected to the electrode pad 40 formed on the substrate 5 through the bonding wire 15. The light incident on the light transmission path 6 from the outside is emitted to the transparent material portion 13 and is then reflected downward by the plate-like member 1 and travels substantially perpendicularly to the main surface of the substrate 5. It enters the light emitting unit 10.

FIG. 12 (a) is a plan view in one process of manufacturing the optical module shown in FIG. 11, and FIG. 11 (b) is a cross-sectional view taken along line DD of FIG. 11 (a). . The substrate 5 is placed on a heating table (not shown). In FIG. 11 and FIG. 12, equivalent parts are given the same reference numerals.

 First, an optical element 9 having a light receiving / emitting unit 10 that receives or emits light in the direction perpendicular to the main surface of the substrate 5 is mounted inside the recessed region of the substrate 5 having a recessed region in the center. An electrode pad 40 is formed on the main surface of the substrate 5 on the right side of the drawing in the recessed area. With the heating table on which the substrate 5 is mounted heated to 220 ° C., the bonding wire 15 made of a gold wire electrically connected to the electrode 14 of the optical element 9 and to the electrode pad 40 at one end Ultrasonic thermocompression bonding the other end. This makes it possible to measure the current flowing through the light element 9 through the electrode pad 40 or to supply the necessary drive voltage to the light element 9. Next, the optical transmission path 6 is disposed on the main surface of the substrate 5 on the left side of the drawing in the drawing in the drawing so that the optical axis thereof is parallel to the main surface. The optical transmission path 6 may be an optical fiber or an optical waveguide. The recessed area of the substrate 5 is formed such that the core 6 A of the light transmission path 6 is higher than the light receiving / emitting part 10 of the optical element 9.

Subsequently, the plate-like body 1 and the auxiliary plate 4 are connected by the metal wire 3 using the same steps as the steps shown in the drawings (a) to (c) of the first embodiment. However, in the present embodiment, the plate 1 is a single plate. Subsequently, the auxiliary plate 4 is held using a holder similar to the holder 8 shown in FIG. 3, and while the reflective surface 2 of the plate-like body 1 faces the light receiving Z light emitting portion 10 of the optical element 9, the reflective surface Inside 2 After arranging the plate-like body 1 and the auxiliary plate 4 connected by the metal wire 3 so that the center axis is approximately 45 degrees from the main surface of the substrate, the angle of the plate-like body 1 to the main surface of the substrate is The light enters the core 6A of the light transmission path 6 from the outside, is reflected by the light force plate-like body 1 emitted from the end opening 6C and travels substantially perpendicularly to the main surface of the substrate. The optical coupling between 6 and the optical element 9 should be maximized. At this time, a portion of the metal wire 3 in the vicinity connected to the plate-like body 1 is placed on the electrode 14 of the optical element 9.

 Next, in a state where the temperature of the heating table is raised to 220 ° C., the metal wire 3 is ultrasonically thermocompression-bonded to the electrode 14 of the optical element 9, and the metal wire 3 is cut at the pressure contact 12. Then, an outer wall 7 having a gap through which the metal wire 3 and the optical transmission path 6 pass is formed on the substrate 5 so as to surround the plate 1 and the optical element 9. Then, a transparent filler is injected into the region surrounded by the outer wall 7 to support the plate-like body 1 in the transparent filler, and then the transparent filler is cured to form the transparent material portion 13. The manufacturing method of the embodiment is completed to obtain the optical module shown in FIG.

 In the manufacturing method of this embodiment, since the optical element 9 is not mounted on the outer wall 7, a heat-resistant resin such as epoxy resin or PMMA resin is used as the material of the outer wall 7. It has the effect of reducing the manufacturing cost and reducing the manufacturing cost.

 Although a single plate-like body is used in the above description, the manufacturing cost can be reduced as in the case of Example 1 by using the connected body shown in FIG. 2, FIG. 6, and FIG. Further reduction and improvement of the production rate will have the effect.

 Example 4

 FIG. 13 (a) is a plan view of an optical module according to Example 4 of the present invention, and FIG. 13 (b) is a cross-sectional view taken along the line EE of FIG. 13 (a). In FIG. 13, the same parts as those in FIG. 11 carry the same reference numerals for which duplicate descriptions are to be omitted as appropriate. The optical module shown in FIG. 13 differs from the optical module shown in FIG. 11 in that the pressure contact 12 of the metal wire 3 is not formed on the electrode 14 of the optical element 9 but on the lower plate 17. The lower plate 17 is fixed to the upper surface of the optical element 9.

In FIG. 14, the metal wire 3 is thermocompression-bonded to the plate-like body 1 having the reflective surface 2, and both ends of the metal wire 3 are thermocompression-bonded to one lower plate 17. It is a perspective view of the mirror 20 in which the pressure contact 12 is formed. Hereinafter, a method of manufacturing the mirror 20 shown in FIG. 14 will be described with reference to FIGS.

 First, as shown in FIG. 15 (a), a processing table having two regions having different heights and in which the protrusions having a uniform thickness in the depth direction of the paper surface are formed in the low height region. Prepare 16 The inclined surface 18 opposed to the high-height area of the projecting portion is formed to form 135 degrees from the main surface of the processing table 16. The two lower plates 17 are arranged so as to be aligned in the depth direction of the drawing with the protruding portions interposed therebetween. The plate-like body 1 is disposed on the main surface of the high area of the processing table 16 such that one side faces the slope 18. Here, the dimension of the projection in the depth direction of the sheet is smaller than the dimension of the plate-like body 1 in the depth direction of the sheet. Also, the difference in height between the two areas of the processing table 16 is such that the upper surface force S of the lower plate 17 disposed in the lower area is approximately the same height as the upper surface of the higher area. It is. The plate 1 is a gold plate or an aluminum plate. At this point, no concave reflective surface is formed on the surface of the plate 1. The lower plate 17 is made of a thin metal plate such as gold, copper, aluminum, nickel, iron or the like, or a silicon substrate, or a thin plate or substrate thereof so that the metal wire 3 made of gold wire can be thermocompression bonded. Use a board or the like.

 Next, as shown in FIG. 15 (b), a gold wire or an aluminum wire is aligned on the upper surface of the plate-like body 1 on the processing table 16 along the side facing the slope 18. , Etc., and thermocompression-bonded using an indenter 19. The alignment of the metal wire 3 to the upper surface of the plate 1 is, for example, two auxiliary plates similar to the auxiliary plate 4 shown in FIG. 2 placed on both sides of the plate 1 in the depth direction of the drawing. This can be done by wire bonding both ends of the metal wire 3 and moving this auxiliary plate. Alternatively, this alignment can be made by temporarily fixing the metal wire 3 to the thin holding film and attaching the holding film to the upper surface of the plate 1. In this case, the indenter 19 can break through the holding film to thermally press the metal wire 3 onto the plate 1.

Next, as shown in FIG. 15 (c), the lower end of the convex surface (the type of the reflecting surface formed on the plate-like body 1) above the processing table 16 with reference to the position of the metal wire 3. After aligning the indenter 39 with the lower end of the convex surface of the plate 1 and Z or the indenter 39 to about 370 ° C., the lower end of the convex of the indenter 39 is transferred to the plate 1. Press down. Thus, as shown in FIG. 16 (a), the metal wire 3 of the plate 1 is thermocompression-bonded to a surface having a depth of 30 to 30 mm and a diameter of 30. A concave reflective surface 2 of / im to 500 μΐ is formed. The plate-like body 1 may be a metal such as aluminum or gold on the surface of a liquid crystal polymer having heat resistance of 220 ° C. or more, a thermoplastic resin such as polyamide imide, etc. What deposited the film can be used. In the case of using a liquid crystal polymer, the temperature of the lower end of the convex surface of the plate 1 and / or the indenter 39 is set to 300 to 400.degree.

 Next, as shown in FIG. 16 (b), the plate 1 is placed such that the region of the plate 1 to which the metal wire 3 is thermocompression bonded is placed on the two lower plates 17. Move

 Next, as shown in FIG. 16 (c), the plate-like body 1 is rotated 135 degrees around the metal wire 3 so as to be along the slope 18, and subsequently, the processing table 16 is heated to 220 ° C. Then, the metal wire 3 is pressed against the lower plate 17 using the indenter 19, and the metal wire 3 is ultrasonically thermocompression-bonded to the lower plate 17 to form the pressure contact 12. The angle between the central axis of the reflective surface 2 and the lower plate 17 is 45 degrees. There is a gap between the plate 1 and the slope 18 because the metal wire 3 is sandwiched between the plate 1 and the inclined surface 18, but the diameter of the metal wire 3 is as small as 50 / im or less, An error in the angle between the central axis of the reflective surface 2 and the lower plate 17 can be ignored. Alternatively, if necessary, the angle of the slope 18 with respect to the main surface of the processing table 16 may be set in consideration of the error. Next, a mirror 20 shown in FIG. 14 is formed by cutting away the metal wire 3 at the position of the pressure contact 12 to the lower plate 17 of the metal wire 3.

 [0071] In order to facilitate the subsequent handling of the mirror 20 of minute dimensions, a polyimide film or a polyimide film or the like is connected to the upper surface of the two lower plates 17 of the mirror 20, Adhere a resin film such as polyethylene terephthalate (PET) film or a holding tape such as an aluminum thin film tape with an adhesive. In any case, those holding tapes have a degree of adhesion that can be released by applying a slight force. Here, in order to protect the plate 1 protruding above the holding tape, a spacer having a height equal to or greater than that of the plate 1 is installed on the holding tape, and the holding tape is wound around a reel. By moving the reel, the mirror 20 can be moved to a desired position.

Next, the holding tape of the mirror 20 is attached to the optical element not yet mounted on the substrate to position the mirror 20 on the optical element. In this state, use an adhesive or heat The lower plate 17 of the mirror 20 is fixed to the light element 9 by pressure bonding. In this state, using the holding tape wound around the reel as the holding means, as shown in FIG. 17, after mounting the optical element 9 with the mirror 20 fixed on the substrate 5, the electrode 14 of the optical element 9 is mounted. The other end of the bonding wire 15 whose one end is electrically connected to the electrode pad 40 is ultrasonically thermocompression-bonded.

 Alternatively, as an alternative example, the mirror 20 is held by a holding tape above the optical element 9 mounted on the substrate 5 and electrically connected to the electrode pad 40 by the bonding wire 15. After the body 20 is aligned with the light element 9, the lower plate 17 of the mirror 20 is fixed to the light element 9 or the substrate 5. Fixing of the mirror 20 may be adhesion with adhesive or thermocompression bonding as described above, or the lower plate 17 may be a soft magnetic material, and the lower plate of the substrate 5 may be an electromagnet. It may be performed by means such as attracting.

 Next, the holding tape is removed from the lower plate 17 of the mirror 20.

 Then, the outer wall 7 is installed so as to surround the recessed area of the substrate 5, and the transparent filler is injected into the area surrounded by the outer wall 7 to support the plate 1 in the transparent filler. Thereafter, the transparent filler is cured to form a transparent material portion, and the manufacturing process of the optical module according to the present example shown in FIG. 13 is completed.

 According to the manufacturing method of the present embodiment, prior to the attachment of the plate 1 to the substrate 5 or the optical element 9, the high temperature process required for the thermocompression bonding of the metal wire 3 is performed by the plate 1, the metal wire 3, Since the mirror 20 consisting of the lower plate 17 is carried out during the process of manufacturing the mirror 20 on the platen 16, the light transmission path 6 and the substrate 5 are not heated by the thermocompression bonding, It has an effect that a material which does not require heat resistance can be used for the light transmission path 6 and the substrate 5, and it is also possible to reduce the deterioration of the optical element 9.

 In the above description, the plate-like body 1 is placed along the slope 18 of the protrusion formed on the processing table 16 to form a predetermined angle between the plate-like body 1 and the lower plate 17. However, this projection is not always necessary. By using the same process as the manufacturing process of Embodiment 1 shown in FIG. 3, a predetermined angle is formed between the plate 1 and the lower plate 17. May be

Furthermore, the lower plate 17 may be mounted on the substrate 5 or the optical element 9 using a thin layer of tin-silver solder having a thickness of about lxm formed on the lower surface of the lower plate 17. Alternatively, a through hole may be formed in the lower plate 17 and solder may be poured into the through hole at the time of mounting. Les.

 Further, after the mirror 20 is manufactured so that the reflecting surface 2 is directed 45 ° obliquely upward to the lower plate 17 and the mirror 20 is mounted on the substrate 5, as shown in FIG. The mirror 20 may be surrounded by an outer wall as shown, and the light element may be mounted on the upper surface of the outer wall.

 Furthermore, in the above description, a single plate-like body is used, but it is also possible to use the connecting body shown in FIG. 2, FIG. 6, and FIG. In this case, the indenter 39 is pressed against each of the plurality of plate-like members 1 or plate-like members la on the main surface of the processing table 16 with reference to the metal wire 3 or the metal wire portion 3a. Thereby, the concave reflecting surface 2 with uniform depth and diameter can be formed with high positional accuracy with respect to the metal wire 3. Further, since both ends of the metal wire 3 are connected to the lower plate 17 by the pressure contact 12 and the lower plate 17 is fixed to the optical element 9 or the substrate 5, the height of the metal wire 3 is equal to that of the optical element 9 or the substrate 5. It is precisely aligned on the top of the. Therefore, the heights of the plurality of reflecting surfaces 2 formed on the basis of the position of the metal wire 3 on the optical element 9 or the substrate 5 are also uniform, and the optical module can be manufactured with good reproducibility.

 When a highly heat-resistant resin plate such as a transparent polyimide resin or liquid crystal polymer, a glass plate, or the like is used as the plate-like body 1, a metal film is formed only on one of the main surfaces. An indenter having a concave tip end may be pressed against the main surface on which the metal film is formed to form a reflecting surface 2 which is convex outward from the main surface of the plate 1. In this case, in the completed light module, the light 11 incident from the main surface of the plate 1 opposite to the reflecting surface 2 and transmitted through the inside of the plate 1 is the reflecting surface 2. It is reflected by the inner surface. In addition, a transparent high heat resistant resin plate that can be plastically deformed is pasted to one main surface of the plate-like body 1, and a metal film is formed on the high heat resistant resin plate. Can also be used. Also in these cases, it is possible to use the connection shown in FIG. 2, FIG. 6, and FIG. 10 which is not a single plate.

 Example 5

FIG. 18 is a cross-sectional view of an optical module according to Embodiment 5 of the present invention. In FIG. 18, parts equivalent to those in FIG. 1 (a) are given the same reference numerals, and redundant descriptions will be omitted as appropriate. The optical module shown in FIG. 18 differs from the optical module shown in FIG. The light element 9 is disposed on the lower surface of the substrate 5, and the light emitted from the light transmission path 6 to the transparent material portion 13 is transmitted to the plate 1. The light is reflected in the direction of the substrate 5 by the reflecting surface 2 and is incident on the light receiving / emitting part 10 of the optical element 9.

 The manufacturing process of the optical module shown in FIG. 18 is as follows. First, use a gold-tin solder bump (not shown) at 280 ° C. so that the light emitting element 9 is placed on the copper pattern 41 on the lower surface of the substrate 5 so that the light receiving Z emitter 10 faces the substrate 5. Solder. Thereafter, through the same manufacturing process as in the first embodiment shown in FIG. 2 and FIG. 4 (however, the central axis of the reflective surface is disposed at 45 degrees with respect to the substrate so that the reflective surface faces the substrate). After the transparent material portion 13 is formed inside the outer wall portion 7, it is divided into individual optical modules as in the first embodiment, and the manufacturing process of the present embodiment is completed. In the above steps, the adjustment light element is not used. In the above-described steps, the method of forming a single plate and / or a mirror as described in Example 3 or 4 may be used.

 Furthermore, after the connector 9, the plate-like body, or the mirror is mounted on the substrate surface, the light element 9 is emitted from the light transmission path 6, and the light reflected by them is detected at maximum. It may be mounted on the back side of the board. If a through hole is formed in the portion of the substrate 5 through which the light beam 11 passes, a material which is not transparent to the used wavelength can also be used for the substrate 5. The through holes are filled with a transparent filler and hardened.

 FIGS. 19 (a)-(c) show another optical module of this embodiment. In FIG. 19 (a), the optical element 9 is an optical element that receives / emits light on the back surface of the chip, and the electrode 14 of the optical element 9 and the electrode 42 on the substrate 5 with the bonding wire 15 from the front surface Are connected electrically. In FIG. 19 (b), the optical element 9 is an optical element having a condensing lens, and the light reflected as parallel light by the reflecting surface 2 of the plate-like body 1 is condensed by the condensing lens, It is led to the light emitting unit 10. In FIG. 19 (c), the optical element 9 is an optical fiber having a core 9A and a clad 9B, and the light receiving / emitting part 10 is an end opening of the core 9A.

In the optical module of the present embodiment, the optical element 9 and the plate-like body 1 are disposed on the opposite side of the substrate 5, so the optical element 9 embeds the plate-like body 1. It is placed on the outside of the transparent material portion 13 so that the light element 9 can be attached / detached or changed later. This has the effect of improving the degree of freedom of implementation.

 Example 6

 FIG. 20 is a cross-sectional view of an optical module according to Example 6 of the present invention. In FIG. 20, parts that are the same as the parts in FIG. 18 are given the same reference numerals, and redundant descriptions will be omitted as appropriate. The optical module shown in FIG. 20 differs from the optical module shown in FIG. 18 in that the lower surface of the substrate 5 has a structure similar to that formed on the upper surface of the substrate 5.

 The manufacturing process of the optical module shown in FIG. 20 is as follows. First, using the same manufacturing process as that of the fifth embodiment, the same structure as the structure formed on the upper surface of the substrate 5 of the optical module of FIG. 18 is provided without disposing the optical element on the lower surface of the substrate 5. Is formed on the upper surface of the substrate 5. However, at this time, the transparent material portion is not yet formed. Next, using the same manufacturing process, a structure similar to the structure formed on the upper surface of the substrate 5 is formed on the lower surface of the substrate 5 so that the reflection surfaces of the plate-like members of both structures face each other. ,Form. At this time, in order to maximize the optical coupling between the light transmission paths 6 of both structures, the position of the connector, the plate or the mirror placed on the lower surface of the substrate 5 and the substrate or the lower plate. The angle is adjusted. With the optical coupling between the light transmission paths 6 of both structures being maximized, the coupling body, the plate-like body, or the mirror disposed on the lower surface of the substrate 5 is fixed to the lower surface of the substrate 5. The transparent material part is formed in both structures. If a connector is used, finally, division into each optical module is performed.

 In the optical module of this embodiment, the optical path is changed at right angles on each of the reflection surfaces 2 of the two plate-like members 1, so one optical path is changed to another optical path parallel to it. Therefore, it is possible to arrange a plurality of optical transmission paths so as not to cross spatially, and it is possible to form a plurality of optical transmission paths in a conventional plane. Light loss at intersections can be avoided. In FIG. 20, although the optical axes of the upper and lower light transmission paths 6 of the substrate 5 are parallel, the optical axes of the upper and lower light transmission paths 6 of the substrate 5 are viewed from the direction orthogonal to the main surface of the substrate 5. Even if it is configured to cross ,.

In each of the embodiments described above, the plate-like body used for conversion of the optical path is a thin plate having a thickness of preferably 100 zm or less, if such a thickness is desired. Elemental It is possible to form a reflective surface without disturbing the wiring of the electrodes.

 In the structure described in Patent Document 1 shown in FIG. 24, which has already been described, for example, a concave reflection surface 102 of a structure 121 in which a metal thin film is formed in the region of the slope where the reflection surface 102 is to be formed. When the indenter is formed in the sloped area, it is difficult to form the reflecting surface 102 in which the position of the light transmission path 106 is accurately aligned. In particular, in order to form the reflecting surface 102 on the slope of the structure 121, the indenter must be pressed perpendicularly to the surface of the substrate 105, and the pressed indenter then slides on the slope and the reflection formed The position of face 102 is incorrect. Also, the shape of the formed reflecting surface 102 is distorted by the fact that the pressed indenter exerts an undesirable force along the direction of the surface of the slope.

 On the other hand, by using a thin plate-like body having a reflective surface, the plate-like body before the formation of the reflective surface or a connecting body in which a plurality of plate-like bodies are connected is installed on a flat table. It is possible to easily form a reflecting surface by pressing an indenter against these plate-like bodies, thereby reducing the manufacturing constraints of the optical module and facilitating its manufacture.

Claims

The scope of the claims

[1] a first light component having a light exit,

 A second light component having a light entrance,

 A reflector having a reflective surface that reflects light from the first optical component and makes the light enter the second optical component;

 A transparent material portion in which the reflector is embedded and which is in contact with at least one of the light exit and the light entrance;

 A wire connected to the reflector and supporting the reflector;

 Light module with.

[2] The optical module according to claim 1, wherein the reflector is a plate-like body having the reflective surface on a main surface or an inner surface.

3. The optical module according to claim 2, wherein the thickness of the plate-like body is 1 μ 1 to 100 / im and the width is 0 · 005 mm to 1 mm.

[4] The optical module according to claim 1, wherein an outer wall portion is provided on a substrate, and at least one of the light emitting port and the light incident port, the reflector, and the transparent material portion are provided in the outer wall portion. The light module is equipped with a light.

[5] In the optical module according to claim 2, one end of each one of the wires fixed at one end to two points of the plate-like body, or one side of the plate-like body An optical module in which both ends of one fixed wire are fixed to a substrate.

 [6] In the optical module according to claim 2, one end of each one of the wires whose one end is fixed to two points of the plate-like body, or one side of the plate-like body The plate-like body is placed on the first or second optical component by fixing both ends of the fixed one of the wires to the substrate or the first or second optical component. An optical module characterized by

 [7] The optical module according to claim 5, wherein the other end or each end of each one of the plurality of substrates is either via the at least one plate, or the substrate or the first or second one. Light module fixed to light component.

[8] The optical module according to claim 6, wherein the other end or each end of each one of the substrates is either via the at least one plate or the substrate or the first or the second Light section Optical module fixed to the product.

The optical module according to claim 1, wherein the optical module is disposed on mutually opposite principal surface sides of the first optical component, the second optical component, and the force substrate. The optical module according to claim 9, wherein the reflector embedded in the transparent material portion is disposed on both main surfaces of the substrate.

In the optical module according to claim 1,

An optical module, wherein the first optical component and Z or the second optical component are optical fibers or optical waveguides.

A first optical component having a light exit, a second optical component having a light entrance, and a reflecting surface that reflects light from the first optical component and causes the light to enter the second optical component. In the method of manufacturing an optical module having a reflector, the reflector, or one wire each of which one end is fixed to two points of a connecting body in which a plurality of the reflectors are connected, or The reflector or the coupling body is formed such that the light from the first optical component is incident on the second optical component by rotating one wire fixed to the side. A method of manufacturing an optical module, comprising adjusting an angle of the central axis of the reflective surface to the light.

The method of manufacturing an optical module according to claim 12, wherein a plurality of reflectors of the reflector or the connector is a plate having the reflection surface on the main surface or the inner surface.

The method of manufacturing an optical module according to claim 12, further comprising: fixing the wire on the substrate after rotating the wire to adjust the angle.

The method of manufacturing an optical module according to claim 12, wherein the wire is rotated on the first or second optical component disposed on a substrate to adjust the angle, and then the first or second optical member is adjusted. A method of manufacturing an optical module, comprising the step of fixing the wire on the optical component of the above or the substrate.

The method for manufacturing an optical module according to claim 12, wherein two plates are placed on a processing table, and the wire rod is rotated on the two plates to form the central axis and the two sheets. After adjusting the angle between the plate and the plate to be substantially constant, the wire is

An optical module comprising the steps of: fixing to two plates; and fixing the two plates on the first or second optical component disposed on a substrate or on the substrate Production method.

 [17] In the method of manufacturing an optical module according to claim 12, the central axis and the second optical axis are placed by placing two plates on a processing table and rotating the wire on the two plates. After adjusting the angle between the sheet and the plate to be substantially the same, the wire may be

The process of fixing to two boards, the process of fixing said two boards on said 1st or 2nd optical components, Said 1st optical component or 2nd optical components on said board | substrate And a step of fixing the optical module.

[18] A method of manufacturing an optical module according to claim 16, further comprising the step of forming a reflecting surface on the reflector or each reflector connected to the connector on the processing table. Module manufacturing method.

[19] A method of manufacturing an optical module according to claim 17, comprising the step of forming a reflecting surface on the reflector or each reflector connected to the connector on the processing table. Module manufacturing method.

[20] In the method of manufacturing an optical module according to claim 12, the first optical component and the first optical component

The manufacturing method of the optical module which arrange | positions 2 optical components on the mutually opposite main surface side of a board | substrate.

21. The method of manufacturing an optical module according to claim 12, wherein after adjusting the angle, the reflector or the connector is carried in a transparent filler.

[22] In the method of manufacturing an optical module according to claim 21, a step of curing the transparent filler after supporting the reflector, and a step of separating the wire from the reflector next. Method of manufacturing an optical module having the same.

[23] a first light component having a light exit,

 A second light component having a light entrance,

 A reflector having a reflective surface that reflects light from the first optical component and makes the light enter the second optical component;

The reflector is embedded and is in contact with at least one of the light exit and the light entrance. A transparent material portion;