WO2005069352A1 - Lifting device and method for lifting and changing wafers - Google Patents

Lifting device and method for lifting and changing wafers Download PDF

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Publication number
WO2005069352A1
WO2005069352A1 PCT/EP2005/000553 EP2005000553W WO2005069352A1 WO 2005069352 A1 WO2005069352 A1 WO 2005069352A1 EP 2005000553 W EP2005000553 W EP 2005000553W WO 2005069352 A1 WO2005069352 A1 WO 2005069352A1
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WIPO (PCT)
Prior art keywords
chuck
wafer
lifting
tweezers
lifting device
Prior art date
Application number
PCT/EP2005/000553
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German (de)
French (fr)
Inventor
Detlef Gerhard
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Icos Vision Systems N.V.
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Publication date
Application filed by Icos Vision Systems N.V. filed Critical Icos Vision Systems N.V.
Publication of WO2005069352A1 publication Critical patent/WO2005069352A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece

Definitions

  • the invention relates to a method for handling wafers which lie on a so-called chuck for processing and must be exchanged for subsequent wafers.
  • so-called chucks which correspond to the importance of clamping elements, which at the same time ensure the support of the wafer and its exact positioning relative to processing units, are used for the inspection of wafers.
  • the wafers are positioned and fixed on a chuck within so-called inspection modules.
  • the currently completely inspected wafer is removed from the chuck, put back into an exit tray and then the next wafer to be inspected is picked up from the exit tray or a so-called aligner (alignment unit) and then placed on the chuck.
  • This removal and loading process is carried out by means of a robot, which fixes the wafers using tweezers and vacuum means so that they can be transported with the tweezers.
  • the travel distances required which the robot covers with the wafers, and in particular the operating time required for these distances, determine the overall speed of the process.
  • the time required for loading and unloading processes acts as a waiting time for the actual process time.
  • the utilization of processing stations for wafers is therefore not optimally organized.
  • Previous adaptations in the prior art in particular to reduce waiting times, have essentially equipped the robot for handling the wafers at a loading and unloading point for a chuck with two so-called tweezers.
  • a robot takes, for example, an inspected wafer from a chuck of an inspection module and then inserts the next wafer that follows.
  • a robot with two tweezers moves with an unprocessed wafer on a pair of tweezers to the loading and unloading station on the chuck, removes the finished wafer from the chuck, inserts the unprocessed wafer and puts the finished wafer back in a magazine.
  • the robot pulls a finished wafer off the chuck and then uses its other arm or tweezers to apply the next unprocessed wafer to the chuck. The next inspection of the new wafer can thus be started.
  • a robot with two arms or two .
  • tweezers are extremely complex in terms of hardware costs, so that the entire handling module becomes significantly more complicated.
  • the object of the invention is to provide a system for changing wafers on a chuck with the shortest possible waiting times, a placement robot with only one arm being used to operate the loading and unloading station.
  • the result arises from the combination of features according to claim 1, claim 2 or claim 7.
  • Advantageous embodiments can be found in the dependent claims.
  • the invention is based on the knowledge that a lifting device and the possible change in the procedure for loading and unloading wafers can significantly reduce the waiting times at the loading and unloading position for loading and unloading wafers on a chuck.
  • a robot with only one pair of tweezers (robot arm) is still used to change the wafer.
  • a lifting device is set up at the loading and unloading position of the chuck, with which a wafer lying on the chuck is raised to an elevated position and from there, in the time in which the one-armed robot places a subsequent, unprocessed wafer, from This robot arm is picked up with the appropriate tweezers and transported to a corresponding target position.
  • the lifting device has, in particular, lifting pins for slightly lifting the wafer from the chuck. Due to this slight lifting, tweezers of the lifting device can be retracted or swiveled in sideways so that they can support and fix the finished wafer lifted by the chuck from below. Using the tweezers that belong to the lifting device, the finished wafer is now raised to an elevated position that is at least 10 mm away from the original position. This state allows the chuck to be immediately loaded with a wafer by the tweezers of a robot, after which the processing of this wafer can be started immediately. Regardless of this, the robot can now use its tweezers to pick up the wafer in an elevated position and place it in a magazine, for example. The reduction in the waiting time for loading and unloading the chuck is significantly reduced by the fact that the additional lifting device can remove the finished wafer from the chuck, and immediately afterwards the subsequent unprocessed wafer can be placed on the chuck by a robot.
  • the lifting movement of the lifting device runs upwards perpendicularly to the wafer surface.
  • the wafer position on the chuck is considered.
  • the tweezers have corresponding contact surfaces for fixing a wafer to the tweezers, which are advantageously provided with suppressors.
  • the chuck is monitored by sensors at the loading and unloading station or position, and the chuck must not leave this position during the loading or unloading. When a malfunction is detected by sensors, the electrical supply can be interrupted, for example.
  • wafers on a chuck can be changed in a minimal time, as a result of which waiting times are optimized.
  • the operating method for changing wafers on a chuck provides, in particular, that a finished wafer is lifted from the chuck by means of lifting pins, which are present in the number of 1 to 3 on the chuck, by means of one or more tweezers of the lifting device Position is brought and takes a waiting position there. This relatively short process is necessary to unload the chuck from a finished wafer.
  • a robot that is already waiting can now insert a new wafer into the chuck using its tweezers without delay. The loading and unloading is thus essentially completed at this point.
  • the finished processed wafer in the lifting device can now be transported by the robot with its single tweezers.
  • FIG. 1 shows a top view of a lifting device for handling acceleration for loading or unloading wafers on a chuck
  • FIG. 2 shows a side view with different positions of a wafer that are possible during the method.
  • FIG. 1 shows a chuck 1 with three lifting pins 4, a lifting device with two tweezers 2, a robot 3 with tweezers 5 and wafers at different heights.
  • the robot 3 with tweezers 5 is just placing a new wafer on the chuck 1.
  • the robot tweezers 5 travel between the chuck 1 and the wafer 7 located in the elevated position.
  • the wafer 7 is located on the tweezers 2 of the lifting device between the chuck 1 and the wafer located in the elevated position.
  • the wafer 7 is located on the tweezers 2 of the lifting device 8.
  • the upper wafer with the reference number 7 is shown in a semi-transparent manner.
  • the lifting pins 4 have, for example, diameters of 3 to 10 mm and can be moved perpendicular to the wafer axis.
  • the lifting device 8 in this case consists of two steerable tweezers which swivel in or rotate over the chuck and then can be moved upwards, ie perpendicular to the plane of the sheet, in order to lift a wafer.
  • FIG. 2 shows a side view corresponding to FIG. 1.
  • the robot 3 with its tweezers 5 is shown without the wafer being picked up.
  • a pivoted-in tweezers 2 are located below the wafer 7 located in an elevated position.
  • the wafers are raised parallel to the wafer axis 9 by the lifting device 8, which also includes the tweezers 2.
  • the robot with the tweezers 5 can thus move under the wafer 7 after picking up the chuck 1 with a new wafer 6, the lifting pins being retracted, picking it up and transporting it further.
  • the tweezers of the lifting device 8 are further dimensioned such that the wafer resting on these tweezers 2 can also be taken over by the robot tweezers, ie the action areas are selected in such a way that no collisions take place.
  • the tweezers are moved by the lifting device under the wafers lifted out with pins. During the upward movement, the tweezers of the lifting device take over the wafer and ideally lift it upwards by at least 10 mm from its previous position in the Z direction.
  • the wafer is picked up with at least one pair of tweezers from the lifting device.
  • two tweezers are used, which pivot under the wafer from both sides.
  • Each tweezer of the lifting device has at least two small contact surfaces for the wafer, via which the wafer is picked up with air vacuum.
  • Each pair of tweezers also has a suction ring with negative air pressure around the wafer support surfaces in order to suck free particles when the wafer is touched. The suction ring does not touch the wafer.
  • the tweezers are moved back to their starting position by the robot after the wafer has been removed.
  • the loading and unloading position of the chuck is monitored by sensors.
  • the robot waits with the next wafer to be placed on the chuck immediately in front of the loading and unloading zone of the chuck.
  • the robot positions the next wafer on the robot tweezers on the chuck. After positioning the next wafer on the chuck, the robot moves back with the tweezers until the chuck can be operated freely by the inspection system. The inspection is released.
  • the robot takes the already lifted wafer from the tweezers of the lifting device and positions it in a so-called target slot or another target position.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The lifting device for lifting wafers (6) from a chuck (1) to an elevated position at a loading or unloading position of the chuck (1) is comprised of: at least one lifting pin (4), which is located at least in the vicinity of the chuck (1) and which lifts the wafer (6) with an axial lift from the chuck (1), and; at least one pair of pincers (2) for laterally retracting or pivoting in under the wafer (6) when in a raised state, for supporting the wafer and for lifting the wafer to an elevated position located at a distance from the chuck (1).

Description

Beschreibungdescription
Hebevorrichtung und Verfahren zum Anheben und Wechseln von WafernLifting device and method for lifting and changing wafers
Die Erfindung betrifft ein Verfahren zur Handhabung von Wafern, die zur Bearbeitung auf einem sogenannten Chuck aufliegen und gegen jeweils nachfolgende Wafer ausgetauscht werden müssen.The invention relates to a method for handling wafers which lie on a so-called chuck for processing and must be exchanged for subsequent wafers.
In der Halbleiter-Industrie werden sogenannte Chucks, die von der Bedeutung her Einspann-Elerαenten entsprechen, die gleichzeitig die Unterstützung des Wafers und dessen exakte Positionierung relativ zu Bearbeitungseinheiten sicherstellen, für die Inspektion von Wafern verwendet. Innerhalb von sogenannten Inspektionsmodulen sind die Wafer auf einem Chuck positioniert und fixiert. Beim Wechseln von Wafern wird der aktuell fertig inspizierte Wafer vom Chuck heruntergenommen, in eine Ausgangshorde zurückgelegt und anschließend wird der nächste zu inspizierende Wafer aus der Ausgangshorde oder einem sogenannten Aligner (Ausrichteeinheit) aufgenommen und dann auf den Chuck gelegt. Dieser Entnahme und Bestückungsvorgang wird mittels eines Roboters ausgeführt, der die Wafer jeweils mittels Pinzetten und Unterdruckmitteln fixiert, so dass diese mit der Pinzette transportierbar sind, bewerkstelligt. Die dabei erforderlichen Verfahrwege, die der Roboter mit den Wafern zurücklegt, und insbesondere die für diese Wegstrecken notwendige Betriebszeit bestimmen insgesamt die Geschwindigkeit des Verfahrens. Die für Be- und Entladevorgänge notwendige Zeit wirkt als Wartezeit für die eigentliche Prozesszeit. Somit ist die Auslastung von Bearbeitungsstationen für Wafer nicht optimal organisiert.In the semiconductor industry, so-called chucks, which correspond to the importance of clamping elements, which at the same time ensure the support of the wafer and its exact positioning relative to processing units, are used for the inspection of wafers. The wafers are positioned and fixed on a chuck within so-called inspection modules. When changing wafers, the currently completely inspected wafer is removed from the chuck, put back into an exit tray and then the next wafer to be inspected is picked up from the exit tray or a so-called aligner (alignment unit) and then placed on the chuck. This removal and loading process is carried out by means of a robot, which fixes the wafers using tweezers and vacuum means so that they can be transported with the tweezers. The travel distances required, which the robot covers with the wafers, and in particular the operating time required for these distances, determine the overall speed of the process. The time required for loading and unloading processes acts as a waiting time for the actual process time. The utilization of processing stations for wafers is therefore not optimally organized.
Bisherige Anpassungen im Stand der Technik, insbesondere zur Reduzierung der Wartezeiten, haben im Wesentlichen den Roboter zur Handhabung der Wafer an einer Be- und Entladestelle für einen Chuck mit zwei sogenannten Pinzetten ausgerüstet. Eine derartige Ausführung eines Roboters nimmt beispielsweise einen inspizierten Wafer von einem Chuck eines Inspektionsmoduls und legt danach den darauffolgenden, nächsten Wafer ein. Ein Roboter mit zwei Pinzetten bewegt sich somit mit einem unbearbeiteten Wafer an einer Pinzette auf die Be- und Entladestation am Chuck zu, entnimmt vom Chuck den fertig bearbeiteten Wafer, legt den unbearbeiteten Wafer ein und legt den fertig bearbeiteten Wafer zurück in ein Magazin. Der Roboter zieht also einen fertig bearbeiteten Wafer vom Chuck herunter und bringt anschließend mit seinem anderen Arm bzw. der anderen Pinzette den nächst folgenden unbearbeiteten Wafer auf den Chuck auf. Somit kann die nächst folgende Inspektion des neuen Wafers gestartet werden. Ein Roboter mit zwei Armen bzw. zwei. Pinzetten ist jedoch hinsichtlich der Hardware- Kosten äußerst aufwändig, so dass das gesamte Handlingsmodul deutlich komplizierter wird.Previous adaptations in the prior art, in particular to reduce waiting times, have essentially equipped the robot for handling the wafers at a loading and unloading point for a chuck with two so-called tweezers. Such a design of a robot takes, for example, an inspected wafer from a chuck of an inspection module and then inserts the next wafer that follows. A robot with two tweezers moves with an unprocessed wafer on a pair of tweezers to the loading and unloading station on the chuck, removes the finished wafer from the chuck, inserts the unprocessed wafer and puts the finished wafer back in a magazine. The robot pulls a finished wafer off the chuck and then uses its other arm or tweezers to apply the next unprocessed wafer to the chuck. The next inspection of the new wafer can thus be started. A robot with two arms or two . However, tweezers are extremely complex in terms of hardware costs, so that the entire handling module becomes significantly more complicated.
Der Erfindung liegt die Aufgabe zugrunde, ein System für den Waferwechsel an einem Chuck mit geringst möglichen Wartezeiten bereitzustellen, wobei ein Bestückungsroboter mit lediglich einem Arm zur Bedienung der Be- und Entladestation- eingesetzt wird. Das Ergebnis ergibt sich jeweils aus der Merkmalskombination entsprechend Anspruch 1, Anspruch 2 oder Anspruch 7. Vorteilhafte Ausgestaltungen sind den Unteransprüchen jeweils zu entnehmen.The object of the invention is to provide a system for changing wafers on a chuck with the shortest possible waiting times, a placement robot with only one arm being used to operate the loading and unloading station. The result arises from the combination of features according to claim 1, claim 2 or claim 7. Advantageous embodiments can be found in the dependent claims.
Der Erfindung liegt die Erkenntnis zugrunde, dass eine Hebevorrichtung und der damit mögliche veränderte Ablauf beim Be- und Entladen von Wafern die Wartezeiten an der Be- und Entladeposition für die Be- und Entladung von Wafern auf einem Chuck wesentlich vermindern kann. Für den Waferwechsel wird nach wie vor ein Roboter mit nur einer Pinzette (Roboterarm) eingesetzt. Zusätzlich wird eine Hebevorrichtung an der Be- und Entladeposition des Chucks eingerichtet, mit der ein auf dem Chuck liegender Wafer auf eine erhöhte Position angehoben wird und von dort, in der Zeit, in der der einarmige Roboter einen nachfolgenden, nicht bearbeiteten Wafer auflegt, von diesem Roboterarm mit der entsprechenden Pinzette aufgenommen und zu einer entsprechenden Zielposition transportiert.The invention is based on the knowledge that a lifting device and the possible change in the procedure for loading and unloading wafers can significantly reduce the waiting times at the loading and unloading position for loading and unloading wafers on a chuck. A robot with only one pair of tweezers (robot arm) is still used to change the wafer. In addition, a lifting device is set up at the loading and unloading position of the chuck, with which a wafer lying on the chuck is raised to an elevated position and from there, in the time in which the one-armed robot places a subsequent, unprocessed wafer, from This robot arm is picked up with the appropriate tweezers and transported to a corresponding target position.
Die Hebevorrichtung weist insbesondere Hubstifte zur geringfügigen Anhebung des Wafers vom Chuck auf. Durch diese geringfügige Anhebung können Pinzetten der Hebevorrichtung seitwärts eingefahren oder eingeschwenkt werden, so dass sie den fertig bearbeiteten, vom Chuck angehobenen Wafer von unten abstützen und fixieren können. Kittels dieser Pinzetten, die zur Hebevorrichtung gehören, wird nun der fertig bearbeitete Wafer auf eine erhöhte Position, die mindestens 10 mm Abstand zur ursprünglichen Position aufweist, angehoben. Dieser Zustand erlaubt die sofortige Bestückung des Chucks mit einem Wafer durch die Pinzette eines Roboters, wobei anschließend die Bearbeitung dieses Wafers sofort gestartet werden kann. Unabhängig davon kann nun der Roboter mit seiner Pinzette den an erhöhter Position befindlichen Wafer aufnehmen und beispielsweise in einem Magazin ablegen. Die Reduzierung der Wartezeit zur Be- und Entladung des Chucks wird dadurch wesentlich verringert, dass die zusätzliche Hebevorrichtung den fertig bearbeiteten WafTer vom Chuck entfernt und unmittelbar danach der folgende unbearbeitete Wafer von einem Roboter auf dem Chuck platziert werden kann.The lifting device has, in particular, lifting pins for slightly lifting the wafer from the chuck. Due to this slight lifting, tweezers of the lifting device can be retracted or swiveled in sideways so that they can support and fix the finished wafer lifted by the chuck from below. Using the tweezers that belong to the lifting device, the finished wafer is now raised to an elevated position that is at least 10 mm away from the original position. This state allows the chuck to be immediately loaded with a wafer by the tweezers of a robot, after which the processing of this wafer can be started immediately. Regardless of this, the robot can now use its tweezers to pick up the wafer in an elevated position and place it in a magazine, for example. The reduction in the waiting time for loading and unloading the chuck is significantly reduced by the fact that the additional lifting device can remove the finished wafer from the chuck, and immediately afterwards the subsequent unprocessed wafer can be placed on the chuck by a robot.
Vorteilhafte Ausgestaltungen der Erfindung sehen beispielsweise vor, dass die Ausführung der Hubbewegung der Hebevorrichtung senkrecht zur Waferflache nach oben verläuft. Dabei wird die Waferposition auf dem Chuck: betrachtet. Weiterhin ist es besonders vorteilhaft, die mindestens eine Pinzette der Hebevorrichtung doppelt auszuführen, wobei diese beispielsweise von gegenüberliegenden Seiten einfahrbar oder einschwenkbar sind und sich die Bereiche der Pinzetten der Hebevorrichtung mit dem Aktionsberei-ch der Pinzette des Roboters nicht überschneiden. Die Pinzetten weisen zur Fixierung eines Wafers an der Pinzette entsprechende Auflageflächen, die vorteilhaft mit Unterdrückerffnurigen versehen sind. Zur Vermeidung von Kollisionen ist der Chuck an der Be- und Entladestation bzw. -position sensorisch überwacht, wobei ein Verlassen dieser Position durch den Chuck während der Bestückung oder Entladung zu vermeiden ist. Bei der sensorunterstützten Feststellung einer Fehlfunktion kann beispielsweise die elektrische Versorgung unterbrochen werden.Advantageous refinements of the invention provide, for example, that the lifting movement of the lifting device runs upwards perpendicularly to the wafer surface. The wafer position on the chuck is considered. Furthermore, it is particularly advantageous to design the at least one pair of tweezers of the lifting device twice, for example these can be retracted or pivoted in from opposite sides and the areas of the tweezers of the lifting device do not overlap with the range of action of the tweezers of the robot. The tweezers have corresponding contact surfaces for fixing a wafer to the tweezers, which are advantageously provided with suppressors. To avoid collisions, the chuck is monitored by sensors at the loading and unloading station or position, and the chuck must not leave this position during the loading or unloading. When a malfunction is detected by sensors, the electrical supply can be interrupted, for example.
Mittels des beanspruchten Betriebsverfahrens kann ein Wechseln von Wafern auf einem Chuck in minimierter Zeit geschehen, wodurch Wartezeiten optimiert werden. Das Betriebsverfahren zum Wechseln von Wafern auf einem Chuck sieht insbesondere vor, dass über Hubstifte, die in der Anzahl von 1 bis 3 an dem Chuck vorhanden sind, ein fertig bearbeiteter Wafer vom Chuck abgehoben wird, mittels einer oder mehrerer Pinzetten der Hebevorrichtung auf eine erhöhte Position gebracht wird und dort eine Warteposition einnimmt. Dieser relativ kurze Vorgang ist notwendig, um den Chuck von einem fertig bearbeiteten Wafer zu entladen. Ein bereits wartender Roboter kann nun ohne Verzögerung einen neuen Wafer mittels seiner Pinzette in den Chuck einlegen. Somit ist die Be- und Entladung bereits an dieser Stelle im wesentlichen abgeschlossen. Der in der Hebevorrichtung vorhandene fertig bearbeitete Wafer kann nun vom Roboter mit seiner einzigen Pinzette weiter- transportiert werden.By means of the claimed operating method, wafers on a chuck can be changed in a minimal time, as a result of which waiting times are optimized. The operating method for changing wafers on a chuck provides, in particular, that a finished wafer is lifted from the chuck by means of lifting pins, which are present in the number of 1 to 3 on the chuck, by means of one or more tweezers of the lifting device Position is brought and takes a waiting position there. This relatively short process is necessary to unload the chuck from a finished wafer. A robot that is already waiting can now insert a new wafer into the chuck using its tweezers without delay. The loading and unloading is thus essentially completed at this point. The finished processed wafer in the lifting device can now be transported by the robot with its single tweezers.
Im Folgenden wird anhand von schematischen die Erfindung nicht einschränkenden Figuren ein Ausführungsbeispiel beschrieben.An exemplary embodiment is described below with the aid of schematic figures which do not restrict the invention.
Figur 1 zeigt eine Hebevorrichtung zur Handlingsbeschleunigung für die Bestückung bzw. Entladung von Wafern an einem Chuck in der Draufsicht,FIG. 1 shows a top view of a lifting device for handling acceleration for loading or unloading wafers on a chuck,
Figur 2 zeigt eine Seitenansicht mit unterschiedlichen, während des Verfahrens möglichen Positionen eines Wafers . In der Figur 1 sind in der Aufsicht ein Chuck 1 mit drei Hebestiften 4, eine Hebevorrichtung mit zwei Pinzetten 2, ein Roboter 3 mit einer Pinzette 5 und Wafer mit verschiedener Höhenlage dargestellt. Der Roboter 3 mit einer Pinzette 5 legt in diesem Fall gerade einen neuen Wafer auf den Chuck 1 auf. Die Roboterpinzette 5 fährt dabei zwischen den Chuck 1 und den in erhöhter Position befindlichen Wafer 7. Der Wafer 7 befindet sich auf den Pinzetten 2 der Hebevorrichtung dabei zwischen den Chuck 1 und den in erhöhter Position befindlichen Wafer . Der Wafer 7 befindet sich auf den Pinzetten 2 der Hebevorrichtung 8. Dabei ist der obere Wafer mit dem Bezugszeichen 7 halb transparent dargestellt. Die Hebestifte 4 weisen beispielsweise Durchmesser von 3 bis 10 mm auf und sind senkrecht zur Waferachse bewegbar. Die -Hebevorrichtung 8 besteht in diesem Fall aus zwei lenkbaren Pinzetten, die über dem Chuck einschwenken oder rotieren und anschließend nach oben, d. h. senkrecht zur Blattebene verfahrbar sind, um einen Wafer anzuheben.FIG. 2 shows a side view with different positions of a wafer that are possible during the method. FIG. 1 shows a chuck 1 with three lifting pins 4, a lifting device with two tweezers 2, a robot 3 with tweezers 5 and wafers at different heights. In this case, the robot 3 with tweezers 5 is just placing a new wafer on the chuck 1. The robot tweezers 5 travel between the chuck 1 and the wafer 7 located in the elevated position. The wafer 7 is located on the tweezers 2 of the lifting device between the chuck 1 and the wafer located in the elevated position. The wafer 7 is located on the tweezers 2 of the lifting device 8. The upper wafer with the reference number 7 is shown in a semi-transparent manner. The lifting pins 4 have, for example, diameters of 3 to 10 mm and can be moved perpendicular to the wafer axis. The lifting device 8 in this case consists of two steerable tweezers which swivel in or rotate over the chuck and then can be moved upwards, ie perpendicular to the plane of the sheet, in order to lift a wafer.
In Figur 2 ist eine Seitenansicht entsprechend Figur 1 dargestellt. Der Roboter 3 mit seiner Pinzette 5 ist ohne aufgenommenen Wafer gezeigt. Eine eingeschwenkte Pinzette 2 befindet sich unterhalb des an erhöhter Position befindlichen Wafers 7. über dem Chuck befinden sich weiterhin, aber nicht gleichzeitig, ein Wafer 6 in einer vom Chuck 1 durch die Hebestifte abgehobenen Position und weiterer Wafer 6 in der auf dem Chuck fixierten Position, wobei die Hubstifte 4 diesen letztgenannten Wafer natürlich nicht durchbohren. Die Wafer werden durch die Hebevorrichtung 8, zu der auch die Pinzette 2 gehört, parallel zur Waferachse 9 angehoben. Der Roboter mit der Pinzette 5 kann somit nach der Bestückung des Chucks 1 mit einem neuen Wafer 6, wobei die Hubstifte wieder eingefahren sind, unter den Wafer 7 fahren, diesen aufnehmen und weitertransportieren.FIG. 2 shows a side view corresponding to FIG. 1. The robot 3 with its tweezers 5 is shown without the wafer being picked up. A pivoted-in tweezers 2 are located below the wafer 7 located in an elevated position. Above the chuck there are, but not at the same time, a wafer 6 in a position lifted from the chuck 1 by the lifting pins and further wafers 6 in the position fixed on the chuck , the lifting pins 4 of course not piercing this latter wafer. The wafers are raised parallel to the wafer axis 9 by the lifting device 8, which also includes the tweezers 2. The robot with the tweezers 5 can thus move under the wafer 7 after picking up the chuck 1 with a new wafer 6, the lifting pins being retracted, picking it up and transporting it further.
Die Pinzetten der Hebevorrichtung 8 sind weiterhin so dimensioniert, dass der auf diesen Pinzetten 2 aufliegende Wafer zusätzlich von der Roboterpinzette übernommen werden kann, d.h. dass die Aktionsbereiche derart selektiert sind, dass keine Kollisionen stattfinden.The tweezers of the lifting device 8 are further dimensioned such that the wafer resting on these tweezers 2 can also be taken over by the robot tweezers, ie the action areas are selected in such a way that no collisions take place.
Der Ablauf eines Be- und Entladevorgangs sieht nun wie folgt aus :The sequence of a loading and unloading process now looks as follows:
- die Pinzetten werden von der Aushebevorrichtung unter den mit Stiften herausgehobenen Wafer nach oben bewegt. Bei der Bewegung nach oben wird der Wafer von den Pinzetten der Aushebevorrichtung übernommen und dieser um mindestens 10 mm aus seiner vorangegangenen Position idealerweise in Z-Richtung nach oben angehoben.- The tweezers are moved by the lifting device under the wafers lifted out with pins. During the upward movement, the tweezers of the lifting device take over the wafer and ideally lift it upwards by at least 10 mm from its previous position in the Z direction.
- Der Wafer wird mit mindestens einer Pinzette der Aushebevorrichtung übernommen. Im Ausführungsbeispiel werden zwei Pinzetten verwendet, die von beiden Seiten unter den Wafer einschwenken.- The wafer is picked up with at least one pair of tweezers from the lifting device. In the exemplary embodiment, two tweezers are used, which pivot under the wafer from both sides.
- Jede Pinzette der Aushebevorrichtung besitzt mindestens zwei kleine Auflageflächen für den Wafer, über die der Wafer mit Luftunterdruck aufgenommen wird. - Jede Pinzette besitzt um die Waferauflageflächen herum zusätzlich einen Absaugring mit Luftunterdruck, um bei der Berührung des Wafers frei werdende Partikel abzusaugen. Der Absaugring berührt nicht den Wafer.- Each tweezer of the lifting device has at least two small contact surfaces for the wafer, via which the wafer is picked up with air vacuum. - Each pair of tweezers also has a suction ring with negative air pressure around the wafer support surfaces in order to suck free particles when the wafer is touched. The suction ring does not touch the wafer.
- Die Pinzetten werden nach Entnahme des Wafers durch den Roboter in ihre Ausgangsstellung zurückgefahren.- The tweezers are moved back to their starting position by the robot after the wafer has been removed.
- Die Be- und Entladeposition des Chucks ist sensorisch ü- berwacht .- The loading and unloading position of the chuck is monitored by sensors.
- Verlässt der Chuck während des Wafer echsels die überwachte Position, so wird die Energie des Transportsystems ab- geschaltet, um eine Kollision zu" verhindern.- If the chuck leaves the monitored position during the wafer exchange, the energy of the transport system is switched off in order to " prevent a collision " .
- Der Roboter wartet mit dem nächsten auf den Chuck abzulegenden Wafer unmittelbar vor der Be- und Entladezone des Chucks .- The robot waits with the next wafer to be placed on the chuck immediately in front of the loading and unloading zone of the chuck.
- Unmittelbar nach Abheben des Wafers durch die Pinzetten der Hebevorrichtung positioniert der Roboter den nächsten auf der Roboterpinzette liegenden Wafer auf den Chuck. Nach Positionierung des nächsten Wafers auf den Chuck fährt der Roboter mit der Pinzette soweit zurück, dass der Chuck vom Inspektionssystem frei betrieben werden kann . Die Inspektion wird freigegeben .- Immediately after the wafer is lifted by the tweezers of the lifting device, the robot positions the next wafer on the robot tweezers on the chuck. After positioning the next wafer on the chuck, the robot moves back with the tweezers until the chuck can be operated freely by the inspection system. The inspection is released.
Der Roboter übernimmt den bereits angehobenen Wafer von den Pinzetten der Aushebevorrichtung und positioniert diesen in einem sogenannten Zielslot oder einer anderen Zielposition. The robot takes the already lifted wafer from the tweezers of the lifting device and positions it in a so-called target slot or another target position.

Claims

Patentansprüche claims
1. Hebevorrichtung zum Abheben von Wafern (6) von einem Chuck (1) auf eine erhöhte Position an einer Be- und Entladepo-1. Lifting device for lifting wafers (6) from a chuck (1) to an elevated position at a loading and unloading position.
5 sition des Chucks (1), bestehend aus: mindestens einem im Bereich des Chuck (1) befindlichen Hubstift (4), der den Wafer (6) mit einem axialen Hub vom Chuck (1) anhebt, mindestens einer Pinzette (2) zum seitlichen Einfahren 0 oder Einschwenken unter den Wafer (6) im angehobenen Zustand, zur Unterstützung des Wafers und zur Anhebung des Wafers auf eine vom Chuck (1) entfernte erhöhte Position.5 position of the chuck (1), comprising: at least one lifting pin (4) located in the area of the chuck (1), which lifts the wafer (6) with an axial stroke from the chuck (1), at least one pair of tweezers (2) Side retraction 0 or swiveling under the wafer (6) in the raised state, to support the wafer and to raise the wafer to an elevated position away from the chuck (1).
5 2. Hebevorrichtung zum Abheben von Wafern (6) von einem Chuck (1) auf eine erhöhte Position an einer Be- und Entladeposition des Chucks (1), bestehend aus: mindestens einer an der Oberseite des Chucks (1) befindlichen Nut (10), in die jeweils eine Pinzette (2) der5 2. Lifting device for lifting wafers (6) from a chuck (1) to an elevated position at a loading and unloading position of the chuck (1), comprising: at least one groove (10.) Located on the top of the chuck (1) ), in each of which a pair of tweezers (2)
:0 Hebevorrichtung seitlich einfahrbar oder einschwenkbar ist, mindestens einer Pinzette (2) zum seitlichen Einfahren oder Einschwenken in die unter dem Wafer (6) befindliche mindestens eine Nut (10) zum Unterstützen des Wafers (6): 0 lifting device can be retracted or swung in from the side, at least one pair of tweezers (2) for retracting or swiveling into the at least one groove (10) under the wafer (6) to support the wafer (6)
>5 und zur Anhebung des Wafers auf eine vom Chuck (1) entfernte erhöhte Position.> 5 and to raise the wafer to an elevated position away from the chuck (1).
3. Hebevorrichtung nach Anspruch 1, die zur Ausführung von senkrechten Hubbewegungen ausgelegt ist.3. Lifting device according to claim 1, which is designed to carry out vertical lifting movements.
30 4 . Hebevorrichtung nach einem der vorhergehenden Ansprüche, bei der eine Pinzette ( 2 ) mindestens zwei Auflageflächen zur Kontaktierung mit dem Wafer mit Unterdrucköffnungen aufweist .30 4. Lifting device according to one of the preceding claims, in which tweezers (2) have at least two contact surfaces for contacting the wafer with vacuum openings having .
5 . Hebevorrichtung nach Anspruch 4 , bei der um eine Auflagefläche Unterdrucköffnungen zur Partikelabsaugung vorhanden sind.5. Lifting device according to claim 4, in which there are vacuum openings for particle suction around a support surface.
6. Hebevorrichtung nach einem der vorhergehenden Ansprüche, bei der der Chuck (1) sensorisch auf die Fixierung und/oder auf die Drehlage an der Be- und Entladeposition überwacht ist und Sollwertabweichungen ein Alarmsignal generieren.6. Lifting device according to one of the preceding claims, in which the chuck (1) is monitored by sensors for the fixation and / or the rotational position at the loading and unloading position and setpoint deviations generate an alarm signal.
7. Verfahren zum Wechseln von Wafern an einem Chuck (1) , bestehend aus folgenden Schritten: - Positionierung eines mit einem Wafer (6) beladenen Chucks (1) an einer Be- und Entladeposition im Bereich einer Hebevorrichtung (8), Anheben des fertig bearbeiteten Wafers (6) mittels mindestens eines Hubstiftes (4) von der Position auf dem Chuck (1), Einfahren von mindestens einer Pinzette (2) einer Hebevorrichtung (8) unter den Wafer (6), Unterstützen und Anheben des Wafers (6) mit der mindestens einen Pinzette (2) auf eine erhöhte Position, - Ablegen eines nachfolgend zu bearbeitenden Wafers (6) auf den mindestens einen Hubstift (4) des Chucks (1) mittels einer Pinzette (5) eines externen Roboters und Herausfahren der unbeladenen Pinzette (5), Absenken des mindestens einen Hubstiftes (4) des Chucks (1), so dass der Wafer (6) auf dem Chuck (1) zum Liegen kommt, Entfernung des fertig bearbeiteten und an der erhöhten Position auf der mindestens einen Pinzette (2) befindli- chen Wafers (7) von dieser erhöhten Position mittels des externen Roboters (3) .7. Method for changing wafers on a chuck (1), comprising the following steps: - Positioning a chuck (1) loaded with a wafer (6) at a loading and unloading position in the area of a lifting device (8), lifting the finished processed wafers (6) by means of at least one lifting pin (4) from the position on the chuck (1), insertion of at least one pair of tweezers (2) of a lifting device (8) under the wafer (6), support and lifting of the wafer (6) with the at least one pair of tweezers (2) in an elevated position, - placing a wafer (6) to be subsequently processed on the at least one lifting pin (4) of the chuck (1) by means of a pair of tweezers (5) from an external robot and removing the unloaded tweezers (5), lowering the at least one lifting pin (4) of the chuck (1) so that the wafer (6) comes to rest on the chuck (1), removing the finished and at the elevated position on the at least one tweezers ( 2) located Chen wafers (7) from this elevated position by means of the external robot (3).
8. Verfahren nach Anspruch 7, bei dem die erhöhte Position mindestens 15 mm über der Ausgangsposition des Wafers auf dem Chuck (1) liegt.8. The method according to claim 7, wherein the elevated position is at least 15 mm above the starting position of the wafer on the chuck (1).
9. Verfahren nach Anspruch 7 oder 8, bei dem der Wafer (6) auf dem Chuck (1) beim Anheben entlang seiner Achse (9) nach oben verschiebbar ist. 9. The method according to claim 7 or 8, wherein the wafer (6) on the chuck (1) when lifting along its axis (9) is displaceable upwards.
PCT/EP2005/000553 2004-01-16 2005-01-17 Lifting device and method for lifting and changing wafers WO2005069352A1 (en)

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
EP1881332A2 (en) 2006-07-03 2008-01-23 Siemens Aktiengesellschaft Positioning unit for optical and/or electric test systems
WO2009027142A1 (en) * 2007-08-31 2009-03-05 Siemens Aktiengesellschaft Transfer chuck for transferring flat materials, particularly wafers

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EP1197988A2 (en) * 2000-10-10 2002-04-17 Applied Materials, Inc. Multiple wafer lift apparatus and method therefor
US20020154975A1 (en) * 2001-04-18 2002-10-24 Applied Materials, Inc. Method and apparatus for wafer exchange employing stacked robot blades
US20030000775A1 (en) * 2001-06-29 2003-01-02 Applied Materials, Inc. Lift pin actuating mechanism for semiconductor processing chamber

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US5580112A (en) * 1995-05-10 1996-12-03 Taiwan Semiconductor Manufacturing Company Ltd. Vacuum pencil having a short tip with an abutment means
EP1197988A2 (en) * 2000-10-10 2002-04-17 Applied Materials, Inc. Multiple wafer lift apparatus and method therefor
US20020154975A1 (en) * 2001-04-18 2002-10-24 Applied Materials, Inc. Method and apparatus for wafer exchange employing stacked robot blades
US20030000775A1 (en) * 2001-06-29 2003-01-02 Applied Materials, Inc. Lift pin actuating mechanism for semiconductor processing chamber

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1881332A2 (en) 2006-07-03 2008-01-23 Siemens Aktiengesellschaft Positioning unit for optical and/or electric test systems
EP1881332A3 (en) * 2006-07-03 2008-03-12 Siemens Aktiengesellschaft Positioning unit for optical and/or electric test systems
WO2009027142A1 (en) * 2007-08-31 2009-03-05 Siemens Aktiengesellschaft Transfer chuck for transferring flat materials, particularly wafers

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