WO2004061914A3 - Chamber for uniform substrate heating - Google Patents

Chamber for uniform substrate heating Download PDF

Info

Publication number
WO2004061914A3
WO2004061914A3 PCT/US2003/039783 US0339783W WO2004061914A3 WO 2004061914 A3 WO2004061914 A3 WO 2004061914A3 US 0339783 W US0339783 W US 0339783W WO 2004061914 A3 WO2004061914 A3 WO 2004061914A3
Authority
WO
WIPO (PCT)
Prior art keywords
chamber
substrate heating
uniform substrate
heater
substrates
Prior art date
Application number
PCT/US2003/039783
Other languages
French (fr)
Other versions
WO2004061914A2 (en
Inventor
Makoto Inagawa
Akihiro Hosokawa
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2004565462A priority Critical patent/JP2006515433A/en
Priority to AU2003297065A priority patent/AU2003297065A1/en
Priority to CN200380109616.2A priority patent/CN1748285B/en
Publication of WO2004061914A2 publication Critical patent/WO2004061914A2/en
Publication of WO2004061914A3 publication Critical patent/WO2004061914A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67109—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Physical Vapour Deposition (AREA)
  • Chemical Vapour Deposition (AREA)
  • Furnace Details (AREA)

Abstract

In a first aspect, a first apparatus is provided for heating substrates. The first apparatus includes (1) a chamber having a bottom portion and a top portion; (2) a plurality of heated supports disposed within the chamber to support at least two substrates thereon; and (3) a heater disposed within the chamber between a sidewall of the chamber and the plurality of substrate supports and having an edge region and a center region. The heater is adapted to produce more heat within the edge region than within the center region of the heater. Numerous other aspects are provided.
PCT/US2003/039783 2002-12-17 2003-12-15 Chamber for uniform substrate heating WO2004061914A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004565462A JP2006515433A (en) 2002-12-17 2003-12-15 Chamber for heating the substrate evenly
AU2003297065A AU2003297065A1 (en) 2002-12-17 2003-12-15 Chamber for uniform substrate heating
CN200380109616.2A CN1748285B (en) 2002-12-17 2003-12-15 Chamber for uniform substrate heating

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US43406402P 2002-12-17 2002-12-17
US60/434,064 2002-12-17

Publications (2)

Publication Number Publication Date
WO2004061914A2 WO2004061914A2 (en) 2004-07-22
WO2004061914A3 true WO2004061914A3 (en) 2008-01-17

Family

ID=32713006

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/039783 WO2004061914A2 (en) 2002-12-17 2003-12-15 Chamber for uniform substrate heating

Country Status (6)

Country Link
JP (1) JP2006515433A (en)
KR (1) KR101035828B1 (en)
CN (1) CN1748285B (en)
AU (1) AU2003297065A1 (en)
TW (1) TWI279828B (en)
WO (1) WO2004061914A2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7326877B2 (en) * 2004-12-01 2008-02-05 Ultratech, Inc. Laser thermal processing chuck with a thermal compensating heater module
KR100707788B1 (en) * 2005-02-04 2007-04-13 주식회사 테라세미콘 TFT LCD annealing Method and TFT LCD annealing System
KR101073550B1 (en) 2009-10-29 2011-10-14 삼성모바일디스플레이주식회사 Apparatus for thermal processing of substrate
CN102300342A (en) * 2010-06-24 2011-12-28 北京北方微电子基地设备工艺研究中心有限责任公司 Support plate heating device and plasma processor using same
US8517657B2 (en) * 2010-06-30 2013-08-27 WD Media, LLC Corner chamber with heater
CN102508381B (en) * 2011-11-29 2015-02-11 深圳市华星光电技术有限公司 Baking device for liquid crystal display panel
CN104269368A (en) * 2014-08-29 2015-01-07 沈阳拓荆科技有限公司 Device and method utilizing front end module for heating wafers
JP2019119903A (en) * 2017-12-28 2019-07-22 キヤノントッキ株式会社 Device for heating substrate and film deposition apparatus
US11319627B2 (en) * 2018-12-27 2022-05-03 Ulvac, Inc. Vacuum processing apparatus
CN112363335A (en) * 2020-11-12 2021-02-12 深圳市华星光电半导体显示技术有限公司 Liquid crystal display panel baking equipment
CN114959659B (en) * 2022-03-31 2023-11-28 松山湖材料实验室 Heating device for heating sample

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567152A (en) * 1994-04-12 1996-10-22 Tokyo Electron Limited Heat processing apparatus
US5850071A (en) * 1996-02-16 1998-12-15 Kokusai Electric Co., Ltd. Substrate heating equipment for use in a semiconductor fabricating apparatus
US20010002668A1 (en) * 1998-12-10 2001-06-07 Arnon Gat Rapid thermal processing chamber for processing multiple wafers
US20020086260A1 (en) * 2000-12-29 2002-07-04 Applied Materials, Inc. Chamber for uniform substrate heating

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5626680A (en) * 1995-03-03 1997-05-06 Silicon Valley Group, Inc. Thermal processing apparatus and process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5567152A (en) * 1994-04-12 1996-10-22 Tokyo Electron Limited Heat processing apparatus
US5850071A (en) * 1996-02-16 1998-12-15 Kokusai Electric Co., Ltd. Substrate heating equipment for use in a semiconductor fabricating apparatus
US20010002668A1 (en) * 1998-12-10 2001-06-07 Arnon Gat Rapid thermal processing chamber for processing multiple wafers
US20020086260A1 (en) * 2000-12-29 2002-07-04 Applied Materials, Inc. Chamber for uniform substrate heating
WO2002056349A2 (en) * 2000-12-29 2002-07-18 Applied Materials, Inc. Chamber for uniform substrate heating

Also Published As

Publication number Publication date
KR20040054514A (en) 2004-06-25
CN1748285A (en) 2006-03-15
TW200416798A (en) 2004-09-01
TWI279828B (en) 2007-04-21
AU2003297065A1 (en) 2004-07-29
KR101035828B1 (en) 2011-05-20
JP2006515433A (en) 2006-05-25
AU2003297065A8 (en) 2008-03-13
WO2004061914A2 (en) 2004-07-22
CN1748285B (en) 2010-04-28

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