WO2003091970A1

WO2003091970A1 - Sticking device for flat panel substrate

Info

Publication number: WO2003091970A1
Application number: PCT/JP2003/004963
Authority: WO
Inventors: Toshio Sekigawa; Akiyoshi Yokota; Ichiro Ishizaka
Original assignee: Shin-Etsu Engineering Co., Ltd.
Priority date: 2002-04-24
Filing date: 2003-04-18
Publication date: 2003-11-06
Also published as: JPWO2003091970A1; TWI228612B; KR100666021B1; CN1568493A; AU2003227422A1; CN1304885C; TW200305743A; KR20040096490A; JP3572307B2

Abstract

A sticking device for flat panel substrate, wherein both holding plates (1, 2) are adjustably moved relative to each other in XYθ directions by a positioning moving means (8) disposed on the outside of a closed space (S) while maintaining the closed space (S) in vacuum state by maintaining clearances between the peripheral edge parts (1a, 2a) of both holding plates (1, 2) in sealed state by moving seal means (4) so that positioning adjustment means (5) are moved in the same direction to position both substrates (A, B) relative to each other and that the clearance between the peripheral edge parts (1a, 2a) of both holding plates (1, 2) is held at a specified clearance by the large rigidity of the positioning adjusting means (5) in Z direction, whereby a support resistance applied to the moving seal means (4) can be maintained at a proper value, and both substrates can be smoothly moved for alignment from the outside in XYθ direction in vacuum without using an XYθ stage.

Description

Technical document Bonding device for flat panel substrates

The present invention relates to a flat panel for aligning and bonding two substrates used in flat panel display manufacturing processes such as liquid crystal display (LCD) and plasma display (PDP). The present invention relates to a substrate bonding apparatus.

Specifically, two substrates which are respectively detachably held on a pair of upper and lower holding plates are overlapped in vacuum, and these are relatively adjusted and moved in the XY 0 direction to align the two substrates with each other. And a bonding device for a substrate for a flood panel which is crushed to a predetermined gap by a pressure difference generated between inside and outside of the both substrates. Background art

Conventionally, as a pasting device for flat panel substrates of this kind, by bringing a pair of upper and lower holding plates relatively close, a closed space is formed between the both holding plates via a sealing material, and the inside of the closed space is After suction and depressurization to a predetermined degree of vacuum, the two substrates (glass substrates) are accurately aligned by moving one of the holding plates horizontally with respect to the other to perform precise adjustment, and then closing it. In some cases, the pressure in the space is returned to atmospheric pressure, and the difference between the pressure in the sealed space between the two substrates and the atmospheric pressure pressurizes the two substrates (see, for example, Patent Document 1).

[Patent Document 1]

In addition, the pair of vacuum chamber units are arranged to be separable in the Z direction so that the pair of pressure plates is enclosed. The lower chamber unit is placed on the top of the mount. The vacuum chamber unit is supported so as to be adjustable and movable in the XY 0 direction via a stage, and the vacuum chamber unit is joined to vacuum-vacuum the vacuum chamber (closed space) in a state where the vacuum chamber is formed. The interior of the vacuum chamber is evacuated, and the upper and lower chamber units are moved relative to each other while maintaining the sealed condition on the stage, so that high-precision alignment between the two substrates can be performed from the outside of the vacuum chamber 1 (See, for example, Patent Document 2).

[Patent Document 2]

Furthermore, this XY 0 stage is an X stage that can be reciprocated in the X axis direction by a drive motor and an X stage. A Y stage movable back and forth in the Y-axis direction is provided by a separate drive mode via a rotary bearing, and another Y stage is mounted on the Y stage with respect to the Y stage. It is arranged to be horizontally rotatable. On the other hand, in recent years, in the bonding apparatus for substrates for liquid crystal, the TFT glass and the CF glass have been increased in size year by year, and at present one side is beginning to be manufactured to a size exceeding 1000 mm. At present, the amount of movement in the direction is about 20 μm to about 50 m, and even a large glass substrate having a side exceeding 1000 mm does not exceed several hundred im.

However, in such a conventional flat panel substrate bonding apparatus, the XY 0 stage is used as a means for aligning the two substrates, but the existing XY 0 stage is basically in the direction of mm units or more. Generally designed for moving, especially in the case of a slight movement of several hundred meters or less like the alignment of a substrate, the rolling elements of the rotating pairing do not reach up to one rotation, and the alignment of each substrate is When repeated slight movements of several hundreds of meters or less each time, there is a problem that the sliding portion is worn out due to oil shortage and the durability is inferior. Furthermore, since it is necessary to make the closed space formed on the above-mentioned Υ »6 ステージ stage into a structure that can withstand a predetermined degree of vacuum, its weight becomes heavy, so even if it is XY There was a problem that the sliding parts of the 0 stage were prone to wear, and maintenance work had to be performed frequently to prevent this.

In addition, due to the structure of the ステージ 6 ステージ stage, there is also a problem that the entire apparatus becomes large and heavy, which increases the manufacturing cost and the transportation cost.

Moreover, with the recent trend of increasing the size of substrates, the size of devices has been increased, and the above-mentioned problems are becoming more serious.

Among the present inventions, the invention according to claim 1 aims at performing alignment by smoothly moving both substrates X Y 0 from the outside in vacuum without using the X Y 0 stage.

The invention according to claim 2 is, in addition to the object of the invention according to claim 1, the object is to miniaturize the drive source of the positioning moving means while simplifying the structure of the position adjusting means. .

The invention according to claim 3 is intended to simplify the structure of the position adjusting means in addition to the object of the invention according to claim 1.

The invention according to claim 4 is intended to enable high precision alignment in addition to the object of the invention according to claim 1, 2 or 3. Disclosure of the invention

In order to achieve the above-mentioned object, the invention according to claim 1 of the present invention supports movably relatively in the XY 6 direction while maintaining the sealing between the opposing peripheral portions of both holding plates. A movable sealing means, and the movable sealing means is extended from either the movable sealing means to either of the two holding plates, and can be moved in the same direction along with the relative adjustment movement of the two holding plates in the XY 6> direction. Position adjusting means having a large rigidity, raising and lowering means for forming a closed space so as to surround both substrates by moving both holding plates relatively close to each other, vacuum condition in the closed space To move both holding plates relative to each other in the XY direction while maintaining the The positioning movement means disposed outside the space is provided, and the movement of the position adjustment means is utilized by relatively adjusting and moving the two holding members f relative to each other with the positioning movement means. It is characterized in that the two substrates are aligned relative to each other.

The action of the invention according to claim 1 resulting from such a configuration is that the movable seal means maintains the sealed state between the peripheral portions of both holding plates and maintains the inside of the closed space in a vacuum state, while the outside of the closed space is maintained. The positioning adjustment means is moved in the same direction by relatively adjusting and moving the two holding plates in the relative direction by means of the positioning moving means provided on the substrate, and the two substrates are aligned with each other. At the same time, since the peripheral portions of both holding plates are held at a predetermined distance by the large rigidity in the Ζ direction of the position adjusting means, the support resistance to which the moving seal means is held can be maintained at an appropriate value.める ο

According to the invention of claim 2, according to the structure of the invention of claim 1, the position adjusting means is composed of a plurality of substantially parallel members extending in the direction of 、, and connecting these one ends to each other and the other end It is characterized in that a part is joined to either the moving seal means or the holding plate, and at least a part of the plurality of members is supported so as to be deformable in the XY 0 direction.

Here, as a structure for supporting at least a part of the plurality of members so as to be deformable (deformable) in the XYS direction, for example, a link mechanism in which a plurality of movable rods are flexibly connected is used. The present invention is not limited to one that bends and deforms at least a part, and also includes one that supports at least a part of a plurality of members with an elastically deformable member without using such a mechanism, and deforms using its stagnation. Ο ο

The operation of the invention according to claim 2 resulting from the configuration added in this way is that, in addition to the action of the invention according to claim 1, a plurality of members constituting the position adjustment means even if the driving load by the positioning movement means is small. At least part of the direction Transform into mousse.

The invention according to claim 3 is characterized in that the configuration according to the invention according to claim 1 is that the position adjusting means is a laminated body in which elastic sheets and metal plates are alternately stacked and adhesively formed. I assume.

In addition to the effect of the invention of claim 1, the action of the invention according to claim 3 resulting from the configuration added in this way is that relative to the both holding plates by the positioning moving means while maintaining the inside of the closed space in a vacuum state. By adjusting and moving in the direction of XY 6>, both substrates are relatively aligned in the direction of XY 0 by utilizing elastic deformation of the elastic sheets respectively stacked between the metal plates.

According to the fourth aspect of the present invention, in the configuration according to the first, second or third aspect, the positioning moving means is connected to the upper holding plate, and the upper holding plate is adjusted and moved in the XY direction. It is characterized in that it is supported and supports the lower holding plate with high rigidity and is immovably supported in the XY 6 / direction.

The action of the invention of claim 4 resulting from the configuration added in this way is that, in addition to the action of the invention according to claims 1, 2 or 3, the lower holding plate does not follow the movement of the upper holding plate. Brief description of the drawings

FIG. 1 is a front view in vertical section of a flat panel substrate bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a cross-sectional plan view taken along line (2)-(2) of FIG.

FIG. 3 is an enlarged perspective view of the position adjusting means.

FIG. 4 is a partial explanatory view in which (a) to (d) show the method of bonding the flat panel substrates in the order of steps.

FIG. 5 is an enlarged perspective view showing a modification of the position adjusting means (a) and (b). FIG. 6 is a bonding panel for a flat panel according to another embodiment of the present invention. And FIG.

FIG. 7 is a vertical cross-sectional front view of a flat panel substrate bonding apparatus according to another embodiment of the present invention. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, an embodiment of the present invention will be described based on the drawings.

In this embodiment, as shown in FIGS. 1 to 4, the upper holding plate 1 is reciprocably moved in the Z (up and down) direction and is supported so as to be adjustably moved in the »6» (horizontal) direction. And the lower holding plate 2 is supported on the pedestal 9 with high rigidity so that it can not move in the Z direction and in the direction, and it is a lower surface plate, and these opposing surfaces of the upper surface plate 1 and the lower surface plate 2 Roughly align and finely align both substrates A and B as alignment by superposing and holding two glass substrates A and B held in a vacuum atmosphere and relatively adjusting and moving in the X and Y directions. The case where both substrates A and B are crushed to a predetermined gap due to the pressure difference generated inside and outside the two substrates A and B is shown.

A frame shape in which a linear adhesive C is closed as a sealing material for liquid crystal sealing, for example, along one of the opposing surfaces of the substrates A and B, and in the case of the illustrated example, the surface peripheral portion of the lower substrate B. The liquid crystal (not shown) is filled inside, and, if necessary, a number of gap adjustment spacers (not shown) are dispersed.

The upper surface plate 1 and the lower surface plate 2 are made of, for example, a rigid body such as metal or ceramic, and the center portion of these opposing surfaces is used as a holding means 3 for holding both substrates A and B immovably. In the case of the example, suction / suction means 3a, 3a for sucking with a suction source (not shown) such as a vacuum pump from a plurality of suction holes respectively opened, and a suction holding means in vacuum. A pair of electrostatic attraction means 3 b and 3 b are disposed. The suction source of the suction / suction means 3a, 3a and the power supply of the electrostatic suction means 3b, 3b are controlled in operation by a controller (not shown), and both substrates A, B are set. Suction adsorption and electrostatic adsorption are started in the initial state, and either one of the two substrates A and B is finely aligned. In this embodiment, the electrostatic adsorption of the upper substrate A is released, and the closed space S described later is exposed to the atmosphere. After returning, the suction adsorption and the electrostatic adsorption of the lower substrate B are released to return to the initial state.

The holding means 3 is not limited to the above-described one. For example, if the vacuum is low, even if the vacuum suction means using a vacuum difference is used instead of the electrostatic suction means 3 b and 3 b good.

Further, between the peripheral portion 1 a of the upper surface plate 1 and the peripheral portion 2 a of the lower surface plate 2, movement is supported so as to be relatively movable in the XY 0 direction while maintaining the sealed state between them. Sealing means 4 is annularly provided to surround both substrates A and B. In the illustrated example, since the two substrates A and B are rectangular, the movable sealing means 4 is formed in a flat frame shape, but is not limited to this. For example, both substrates When A and B are circular, they are formed in a similar shape along their outer circumference.

In the case of this embodiment, the moving sealing means 4 is a moving block 4a formed in a circular or rectangular cross section in accordance with the planar shape of the upper surface plate 1 and the lower surface plate 2, and the moving block 4a. An annular seal member 4b elastically deformable in the Z direction, such as a 0 ring, which contacts and separates from the peripheral portion 1a of the upper surface plate 1 mounted on the upper surface, and a lower surface plate 2 mounted on the lower surface of the moving workpiece 4a. And an annular vacuum seal 4 c such as an 0 ring which can be moved in the direction at all times in contact with the peripheral portion 2 a of the ring. For this vacuum seal 4c, use, for example, vacuum grease as needed. In the illustrated example, on the peripheral portion 1 a of the upper surface plate 1, an engaging portion 4 d which is mutually fitted only in the Z direction and the upper surface of the moving pro 4 a is integrally protruded. From the lower surface of d to the upper surface of moving block 4 a While mounting, from the lower surface of the moving pro 4 a to the peripheral part 2 a of the lower surface plate 2! Although a double vacuum seal 4c is interposed, the present invention is not limited to this, and the inner side vacuum seal 4 is formed so that a single annular seal material 4b (not shown) overlaps with the Z direction. The vacuum seal 4c on the outer circumference side may be removed leaving only c.

The movable sealing means 4 can be moved in the same direction along with the relative adjustment movement of the upper surface plate 1 and the lower surface plate 2 from one of the upper surface plate 1 to the lower surface plate 2. A position adjusting means 5 having high rigidity in the Z (vertical or vertical) direction is constructed.

In the case of the present embodiment, the position adjusting means 5 is composed of a plurality of substantially parallel plural members extending in the Z direction, and these end portions are joined to each other, and the other end portion is moved and sealed. It is joined to either the surface plate 1 or the lower surface plate 2, and at least a part of the plurality of members is supported so as to be deformable only in the XY 0 direction. More specifically, as shown in FIGS. 1 to 3, the center member 5 is joined such that the plurality of members are suspended from the bottom of the movable block 4 a toward the peripheral portion 2 a of the lower platen 2. and a lower end portion of the central member 5a and the peripheral member 5b, which are joined so as to be suspended from the bottom surface of the peripheral portion 2a of the lower surface plate 2 so as to surround the periphery thereof. And a connecting member 5c for supporting the same, and by arranging a plurality of units integrated with these along the outer periphery of the upper surface plate 1 and the lower surface plate 2, the upper surface plate 1 and the moving block The force such as the weight 4 a acts on the joint portion between the central member 5 a and the lower platen 2 and the joint portion between the central member 5 a and the peripheral member 5 b and the connecting member 5 c. The vacuum seal 4c of the sealing means 4 is prevented from acting excessively.

In particular, in the examples shown in FIGS. 1 to 3 and FIG. 4, the center member 5a is formed into a cylindrical shape having high rigidity in the Z direction which is its axial direction and can not be deformed in the XY 6> direction. The center member 5a is movably penetrated in the XY 0 direction with respect to the through hole 2b opened in the peripheral portion 2a of the second part 2, and a link mechanism, for example, is formed around the center member 5a. For example, a ball joint or the like may be used as the bending member 5b1 used for the lower end portion and the upper end portion of these link mechanisms, in addition to arranging a plurality of peripheral members 5b which can be bent and deformed in the direction. Further, the connecting member 5c is formed in a disk shape.

In order to define a closed space S in the upper surface plate 1 so that the two substrates A and B are enclosed between the upper surface plate 1 and the lower surface plate 2 with the movable sealing means 4 interposed therebetween, for example, Lifting means 6 consisting of cylinders for vertical drive, jacks, etc. are provided in series.

The elevating means 6 is controlled by the controller 1 (not shown), and in the initial state of setting the substrates A and B, the upper surface plate 1 stands by at the upper limit position as shown in FIG. After setting the substrates A and B, lower the upper surface plate 1 as shown by the solid line in Fig. 1 and Fig. 4 (b) so that the closed space S surrounds both the substrates A and B with the lower surface plate 2. After partitioning of both substrates A and B is completed or closed space S described later returns to atmospheric pressure, it is raised and returned to the initial state.

Further, separately from the elevating means 6, substrate space adjusting means is provided for moving one or both of the upper and lower surface plates 1 and 2 in parallel in the Z direction to adjust the distance between the two substrates A and B.

In the case of the present embodiment, this board interval adjusting means is between the tip of the engaging portion 4 d provided on the peripheral portion 1 a of the upper surface plate 1 and the upper surface of the movable block 4 a fitted thereto. A plurality of drivers 4 e are arranged in the circumferential direction at equal intervals, for example, linear actuators 1 and so on. The drivers 4 e extend in the Z direction, and these drivers 4 e are shortened in the Z direction to By compressively deforming the seal 4 b in the Z direction, the two substrates A and B approached by the lifting means 6 are further approached to a position where they are sealed by the annular adhesive C.

These drivers 4 e are also controlled in operation by a controller (not shown) and extend in the Z direction as shown in FIG. 4 (a) in the initial state. After completion of the alignment, the substrate is shortened as shown in Fig. 4 (c), and after the end of fine alignment of both substrates A and B, or after the closed space S described later returns to atmospheric pressure, it is extended and returned to the initial state.

Further, in the closed space S, the gas in the closed space S, in the present embodiment, air is taken in and out in communication with, for example, a vacuum pump disposed outside as shown by the reference numeral 7 in FIG. Intake means is provided to provide a predetermined degree of vacuum.

The intake means 7 is controlled by the controller 1 (not shown), and after the closed space S is formed by the approach movement of the upper platen 1 and the lower platen 2, intake is started from the closed space S. After completion of the fine alignment of the substrates A and B, air is supplied to the closed space S to return to atmospheric pressure.

And, on the outside of the closed space S, positioning moving means 8 for relatively adjusting movement of the upper surface plate 1 and the lower surface plate 2 in the XY 6 direction while maintaining it in a vacuum state is disposed. .

In the case of the present embodiment, as shown in FIG. 1, the moving means for positioning 8 is, for example, a drive source consisting of a cam, a drive, etc. arranged in series for moving the upper platen 1 in the XY 0 direction. 8a and a mark displayed on both substrates A and B, the detector 8b comprising a microscope and a camera, and based on the data output from the detector 8b, a drive source 8a By moving the movable board 4a and the upper surface plate 1 connected thereto are pushed in the XY 0 direction, rough alignment and fine alignment of the upper substrate A held by the upper surface plate 1 are performed. There is.

In the case of the illustrated example, as shown in FIG. 2, three driving sources 8a are arranged in a line toward the moving pro- mark 4a of the moving seal means 4 described above.

Next, a method for bonding such a flat panel substrate will be described in the order of steps.

First, as shown in Fig. 4 (a), the upper surface of the upper surface plate 1 and the lower surface surface 2 are coated with the upper substrate A and the lower substrate B coated with the adhesive C in advance and filled with liquid crystal. Align and set each substrate, and set both substrates A and B so that they can not be moved and held by the suction and adsorption means 3a and 3a and the electrostatic adsorption means 3b and 3b, respectively o

After that, as shown in FIG. 4 (b), the engaging part 4 d which is provided on the peripheral part 1 a of the upper surface plate 1 by bringing the upper surface plate 1 and the lower surface plate 2 close to each other A closed space S is defined between the upper surface plate 1 and the lower surface plate 2 so as to surround the two substrates A and B in close contact with the annular seal 4 b on the upper surface a.

At the same time, the two substrates A and B approach each other to a predetermined distance due to the close movement of the upper surface plate 1 and the lower surface plate 2 and face each other with a gap of about 1 mm in this state. However, the other substrate A is not in contact with the annular adhesive C applied to the one substrate B, and the closed space S is communicated between the two substrates A and B.

Thereafter, the air is removed from the closed space S by the operation of the suction means 7 to obtain a predetermined degree of vacuum, and the air is also removed from between the two substrates A and B to form a vacuum.

In this state, the upper surface plate 1 and the lower surface plate 2 are adjusted and moved relative to each other in the Y direction by the operation of the positioning movement means 8, and rough alignment of both substrates A and B is performed. Subsequently, if the closed space S reaches a predetermined degree of vacuum, the pressure difference between the closed space S and the atmospheric pressure received by the upper surface plate 1 and the lower surface plate 2 further moves the upper surface plate 1 and the lower surface plate 2 closer. The force to make it work acts. However, as shown in FIG. 4 (c), the shortening movement of the driving members 4 e... Of the substrate space adjusting means causes the engagement portion 4 d or the peripheral portion 1 a of the upper surface plate 1 and the moving block 4 a to Although the upper surface and the upper surface are closer to each other, the space between them is held at a set distance to compress and deform the annular seal 4b but it does not completely collapse.

As a result, with the other substrate A approaching to a predetermined distance, fine adjustment of both substrates A and B is performed by the operation of the positioning transfer means 8 (this is referred to as substrate non-contact fine adjustment). Or, as shown in the figure, the other substrate A comes closer and contacts the annular adhesive C applied to one substrate B, and a sealing space is formed between the two. In this state, fine adjustment of the two substrates A and B is performed by the operation of the positioning moving means 8 (this is called substrate contact fine adjustment).

Here, the alignment (rough alignment, fine alignment) operation will be described in detail according to FIG. 4. As shown in FIG. 4 (a), the upper surface plate 1 is operated by the operation of the lifting means 6 from the state where both substrates A and B face each other When the lower plate 2 and the lower plate 2 are brought close to each other, as shown in FIG. 4 (b), when the engaging portion 4 d provided on the peripheral edge 1 a of the upper plate 1 closely contacts the annular seal 4 b, these upper plates 1 The upper surface of the engaging portion 4d of the second embodiment and the moving block 4a mutually fit only in the Z direction, and both are integrated in the second direction.

Between the bottom of moving block 4a and peripheral part 2a of lower surface plate 2, a vacuum seal 4c always contacting peripheral part 2a of lower surface plate 2 and a plurality of members constituting position adjusting means 5, ie, The center member 5a joined to the bottom surface of the moving block 4a, the peripheral member 5b joined to the bottom surface of the peripheral portion 2b of the lower surface plate 2, and the connecting member 5c joined to the lower end of these Supported at a distance of 1 mm or more ο

Therefore, when the drive source 8a of the positioning moving means 8 is operated to adjust and move the upper surface plate 1 and the lower surface plate 2 relative to each other in the Y direction, the solid line in FIG. 1 and FIG. 4 (b) The moving block 4a and the upper surface plate 1 connected thereto move in the XY 0 direction with respect to the lower surface plate 2 while maintaining the vacuum state in the closed space S by the vacuum seal 4c, as shown by the two-dot chain line in FIG. Moving.

That is, when the moving block 4a is pushed in the XY 0 direction by the drive source 8a of the positioning moving means 8, the peripheral member 5b of the position adjusting means 5 is deformed in the same direction, so that the central member 5a The moving block 4a can be moved in parallel to move the upper platen 1 connected to the moving probe 4a freely in the direction, and the large rigidity in the Z direction of the central member 5a makes Sliding resistance received by the vacuum seal 4 c to maintain a predetermined distance between the bottom of the moving block 4 a and the peripheral portion 2 a of the lower platen 2 while bearing the atmospheric pressure received by the platen 1 and the lower platen 2. Is kept at an appropriate value.

As a result, both substrates A and B can be smoothly moved from the outside smoothly in vacuum without using a stage, and alignment (rough alignment, fine alignment) can be performed with high precision.

Further, in the case of the present embodiment, the position adjusting means 5 can deform the peripheral member 5b, which is at least a part of the substantially parallel plural members extending in the Z direction, in the XY 0 direction by, for example, a link mechanism. Since at least a part of the plurality of members 5a and 5b is deformed into the XY / direction sheath even if the driving load by the positioning moving means 8 is small.

As a result, there is an advantage that the drive source 8 a of the positioning moving means 8 can be miniaturized while simplifying the structure of the position adjusting means 5.

Further, in the structure of the position adjusting means 5 described above, since there is no part that is in frictional contact with the adjustment movement in the direction, no wrinkles are generated due to this frictional contact, and both substrates A, The adverse effect on B can be prevented.

The structure of a plurality of members constituting the position adjusting means 5 is not limited to that shown in the drawings, and the peripheral member 5 b which can be deformed in the sixth direction may be replaced, for example, with FIG. (a) As shown in (a) and (b), an elastically deformable cylindrical body 5b 'is arranged, or an elastic base material 5b〃 consisting of a plurality of elastically deformable columns, a wire, etc. is arranged, On the other hand, the same effect can be obtained with other structures, such as making the rigidity of the peripheral member 5b high and making it impossible to deform in the direction and deforming the central member 5a in the direction.

When at least a part of such a plurality of members is supported by an elastically deformable member and deformed using its deflection, the structure is simplified and the manufacturing cost can be reduced, and Since there is no part in frictional contact with the adjustment movement, it is possible to completely prevent the generation of dust due to this frictional contact.

In addition, positioning moving means 8 is connected to upper surface plate 1 and lower surface plate 2 has high rigidity. Lower support plate 2 can achieve high-precision alignment without following the movement of upper support plate 1 if supported.

Then, after the rough alignment and fine alignment are completed as described above, in the case of non-contact fine alignment in which the fine alignment is performed in a state in which both the substrates A and B are approached to a predetermined distance, both substrates A, In a state in which the sealed space is substantially formed between the two closer to each other, and in the case of the substrate contact fine alignment, in the state as it is, the adsorption of only the upper electrostatic adsorption means 3b is released. The air is introduced into the closed space S by the operation of the suction means 7 and the atmosphere is returned to the atmospheric pressure.

As a result, as shown in FIG. 4 (d), the upper substrate A is separated from the upper surface plate 1, and the lower substrate B is placed on the lower substrate B via the adhesive C. Due to the difference between the internal pressure of the space and the atmospheric pressure, both substrates A and B are crushed uniformly to form a predetermined gap.

In addition, when the liquid crystal in an appropriate amount is sealed in an appropriate state at the time before the rough alignment described above, specifically, when both substrates A and B are set, the atmosphere in the closed space S is returned to the atmospheric pressure. Both substrates A and B are uniformly crushed by the pressure difference generated inside and outside of the substrates A and B, so that a predetermined gap can be formed in a state where the liquid crystal is sealed, and a liquid crystal panel can be manufactured without injecting liquid crystals in a later step. .

After that, when the inside of the closed space S returns to the atmospheric pressure, the upper surface plate 1 and the lower surface plate 2 are separated by the operation of the raising and lowering means 6, the closed space S 1 is opened, and both aligned substrates A and B It takes out and the above-mentioned operation is repeated.

On the other hand, those shown in FIG. 6 and those shown in FIG. 7 are other embodiments of the present invention.

As shown in FIG. 6, the moving seal means 4 comprises only a moving block 4a, a wedge-shaped seal member 4b and an annular vacuum seal 4c, and the moving seal means 4 moves with the peripheral portion la of the upper surface plate 1 A plurality of substrate spacing adjustment means 4 f extending and contracting in the Z direction, such as, for example, linear space, are arranged at equal intervals over the upper surface of the probe 4 a. By extending the substrate space adjusting means 4 f, the peripheral portion 1 a of the upper surface plate 1 and the upper surface of the movable block 4 a are integrally engaged in the direction, and the peripheral portion 1 of the upper surface plate 1 Unlike the embodiment shown in FIGS. 1 to 5 described above, the configuration in which a and the upper surface of the moving block 4 a and the distance are made to approach until both substrates A and B seal with the annular adhesive C is different. The other configuration is the same as that of the embodiment shown in FIGS.

In the illustrated example, the substrate space adjusting means 4 f is arranged from the peripheral edge la of the upper surface plate 1 toward the upper surface of the movable probe 4 a, but conversely, the upper surface plate from the upper surface of the movable block 4 a It may be disposed toward the peripheral edge 1 a of 1.

Then, as shown by the one-dot chain line in FIG. 6, the substrates A and B are set in a state where only the upper surface plate 1 is moved up and separated from the moving block 4a by the lifting means 6 consisting of jacks. As shown by the solid line in the figure, the upper surface plate 1 is moved downward and integrally engaged with the moving block 4 a in the direction by the board gap adjustment means 4 f ... so as to surround both boards A and B. Closed space S is formed.

In this state, when the cam 8 is rotated by the operation of the drive source 8a consisting of the motor for positioning 8 and the spring 8c installed across the movable block 4a and the lower surface plate 2 is expanded and contracted. As a result, as shown by the two-dot chain line in the figure, the position adjusting means 5 moves, and the upper surface plate 1 and the moving block 4 a adjust and move relative to the lower surface plate 2 in the Υ direction. Rough alignment of the two substrates A and B is performed. After that, the upper surface plate 1 and the lower surface plate 2 come closer to each other by shortening the substrate space adjusting means 4 f, and the upper surface plate 1 and the lower surface plate 2 are relatively moved in the X direction as described above. Fine adjustment of both substrates A and B is performed by adjusting and moving. Therefore, the same operation as the embodiment shown in FIGS. 1 to 5 can be obtained also in the case shown in FIG.

Particularly in the case of the illustrated example, the upper and lower outer surfaces of the upper surface plate 1 and the lower surface plate 2 have outer walls 1 b,

Spaces 1 c and 2 d are defined by connecting 2 c so as to expand outward respectively. By connecting the suction means ld and 2 e to these space portions 1 c and 2 d by piping and setting the inside of each to a predetermined degree of vacuum, the pressure difference between the inside and the outside of the two substrates A The atmospheric pressure is applied only to the outer wall 1 b and 2 c of the space 1 0 and 2 c, and the upper surface plate 1 and the lower surface plate 2 are not exposed to atmospheric pressure, preventing deformation due to atmospheric pressure. doing.

Further, suction means 7 for making the inside of the closed space S have a predetermined degree of vacuum is a space 3 c between the upper surface plate 1 and the lower surface plate 2 and the plate-like electrostatic adsorption means 3 attached thereto. , 3c are formed to prevent the adverse effects of air flowing in the closed space S from the gaps 3c, 3c in one direction only. The adverse effect is, for example, that both of the held substrates A and B are inclined, and the liquid crystal filled in advance on the lower substrate B is scattered.

In the configuration shown in FIG. 7, the position adjusting means 5 is a laminate formed by alternately stacking thin elastic sheets 5d such as rubber, and metal plates 5e such as steel plates, for example. Unlike the embodiment shown in FIGS. 1 to 5 or 6, the other configuration is the same as the embodiment shown in FIGS. 1 to 5 or 6. In particular, as the elastic sheet 5d, in order to reduce long-term creep (viscoelasticity) while having excellent strength and elasticity, for example, an elastic body such as high purity natural rubber or silicone rubber can be used. By alternately stacking and vulcanizing such a sheet 5 d made of such a sheet and a metal plate 5 e made of a steel plate, it has extremely high rigidity in the Z direction and load supporting ability while being soft in the horizontal direction. Have.

Therefore, the structure shown in FIG. 7 has the advantage that the structure of the position adjusting means 5 can be further simplified and the manufacturing cost can be further reduced as compared with the embodiments shown in FIGS. is there.

In the embodiment shown above, the upper holding plate 1 is an upper surface plate which is reciprocably movable in the Z direction and is adjustably movably suspended in a sixth direction, and the lower holding plate 2 is in the Z direction. And However, the present invention is not limited to this, but the upper holding plate 1 is supported so as not to move in the Z direction and in the XY 6 direction. The lower holding plate 2 may be supported so as to be reciprocable in the Z direction and adjustably movable in the XY 6 »direction. In addition, the upper and lower holding plates 1 and 2 are two substrates A and B. Other structures may be used as long as they are capable of detachably holding them. Furthermore, although the case where alignment is performed in a vacuum atmosphere has been shown, the invention is not limited to this, and the same applies to the case where the main atmosphere is processed in a special gas atmosphere.

Also, the holding means 3 of the substrates A and B, the moving sealing means 4, the position adjusting means 5, the raising and lowering means 6, the suction means 6 and the positioning moving means 8 are not limited to the illustrated structure, and act similarly. Other structures may be used. '

Furthermore, instead of the vacuum seal 4c of the moving seal means 4, a magnetic fluid type vacuum seal may be used. Industrial applicability

As described above, the invention according to claim 1 of the present invention is the invention according to claim 1 of the present invention, wherein the movable sealing means maintains the sealed state between the peripheral portions of both the holding plates and closes it. While maintaining the inside of the space in a vacuum state, the positioning moving means disposed outside the closed space relatively adjusts the positioning plates in the same direction by adjusting and moving both holding plates relative to each other in the XY 6 direction. As the means moves, the two substrates are aligned, and the large rigidity in the Z direction of the position adjusting means holds the peripheral portions of the two holding plates at a predetermined distance. Since the support resistance received is maintained at an appropriate value, alignment can be performed by smoothly moving both substrates from the outside in the vacuum without using the XY 0 stage.

Therefore, the structure of the position adjusting means can be miniaturized as compared with the conventional one using the stage 6 as a means for aligning the two substrates, thereby reducing wear and improving the durability against repeated alignment. Can be expected, Maintenance becomes easier and transportation costs can be reduced.

According to the second aspect of the invention, in addition to the effect of the first aspect of the invention, at least a part of the plurality of members constituting the position adjusting means is smoothly deformed in the direction even if the driving load by the positioning moving means is small. Therefore, the drive source of the positioning moving means can be miniaturized while simplifying the structure of the position adjusting means.

Therefore, the manufacturing cost can be reduced, and there is no part that is in frictional contact with the adjustment movement in the direction, so this frictional contact does not generate dust, and both substrates A and B are generated in the alignment. It can prevent adverse effects. According to the third aspect of the invention, in addition to the effect of the first aspect of the invention, the positioning moving means relatively moves the holding plates relatively in the XY direction while maintaining the inside of the closed space in a vacuum state. Thus, the two substrates are relatively aligned in the XY 6 direction by utilizing the elastic deformation of the elastic sheet stacked between the respective metal plates, so that the structure of the position adjustment means can be simplified.

Therefore, the manufacturing cost can be reduced.

According to the invention of claim 4, in addition to the effect of the invention of claim 1, 2 or 3, since the lower holding plate does not follow the movement of the upper holding plate, high precision alignment can be made possible. .

Claims

The scope of the claims

1. Superimpose two substrates (A, B) detachably held respectively on upper and lower pair of holding plates (1, 2) in vacuum, and adjust and move them relatively in the XY0 direction. The apparatus for bonding flat panel substrates which aligns both substrates (A, B) with each other and crushes up to a predetermined gap due to the pressure difference between the inside and outside of both substrates (A, B).

-A movable seal means (4) relatively movably supported in a lateral direction while maintaining a sealed state between the opposing peripheral portions (la, 2a) of the holding plates (1, 2);

The movable sealing means (4) extends from one of the two holding plates (1, 2) to the other along with the relative movement of the two holding plates (1, 2) in the same direction. Position adjustment means with high rigidity in movable Z direction (5

) When,

Lifting means for forming a closed space (S) so that both substrates (A, B) are enclosed by relatively moving both holding plates (1, 2) relatively close to each other. (6) and

Position for positioning outside the closed space (S) in order to adjust and move both the holding plates (1, 2) relative to the XY0 direction while maintaining the inside of the closed space (S) in a vacuum state. Equipped with moving means (8),

By adjusting and moving both holding plates (1, 2) relative to each other in the XY0 direction by the positioning moving means (8), both boards (A, B, A flat panel bonding apparatus for flat panel, characterized by relative alignment in the direction.

2. The position adjusting means (5) is composed of a plurality of substantially parallel members (5a, 5b) extending in the Z direction, these one end portions being joined together and the other end portions being transferred The dynamic sealing means (4) and either of the holding plates (1, 2) are respectively joined to support at least a part of the plurality of members (5a, 5b) in a deformable manner in the »6 direction. The bonding apparatus of the board | substrate for flat panels of claim 1.

3. A flat panel substrate bonding apparatus according to claim 1, wherein the position adjusting means (5) is a laminate obtained by alternately laminating an elastic sheet (5d) and a metal plate (5e). .

4. When the positioning moving means (8) is connected to the upper holding plate (1), the upper holding plate (1) is supported for adjustment movement in the XY 6 direction, and the lower holding plate (2) The flat panel substrate bonding apparatus according to any one of claims 1 to 4, wherein the flat panel substrate bonding apparatus according to any one of claims 1 to 3, wherein the substrate is supported with high rigidity so as not to move in the XY <direction.