WO2003052890A1 - Processing a memory link with a set of at least two laser pulses - Google Patents
Processing a memory link with a set of at least two laser pulses Download PDFInfo
- Publication number
- WO2003052890A1 WO2003052890A1 PCT/US2002/040410 US0240410W WO03052890A1 WO 2003052890 A1 WO2003052890 A1 WO 2003052890A1 US 0240410 W US0240410 W US 0240410W WO 03052890 A1 WO03052890 A1 WO 03052890A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser
- laser output
- link
- electrically conductive
- output pulses
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/005—Optical devices external to the laser cavity, specially adapted for lasers, e.g. for homogenisation of the beam or for manipulating laser pulses, e.g. pulse shaping
- H01S3/0057—Temporal shaping, e.g. pulse compression, frequency chirping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
- B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
- G11C17/143—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM using laser-fusible links
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/525—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
- H01L23/5256—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive
- H01L23/5258—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections comprising fuses, i.e. connections having their state changed from conductive to non-conductive the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C17/00—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards
- G11C17/14—Read-only memories programmable only once; Semi-permanent stores, e.g. manually-replaceable information cards in which contents are determined by selectively establishing, breaking or modifying connecting links by permanently altering the state of coupling elements, e.g. PROM
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4012—Beam combining, e.g. by the use of fibres, gratings, polarisers, prisms
Abstract
Description
Claims
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003553680A JP2005512814A (en) | 2001-12-17 | 2002-12-17 | Processing a memory link with a set of at least two laser pulses |
CA002436227A CA2436227A1 (en) | 2001-12-17 | 2002-12-17 | Processing a memory link with a set of at least two laser pulses |
DE10296468T DE10296468T5 (en) | 2001-12-17 | 2002-12-17 | Processing a memory connection line with a group of at least two laser pulses |
AU2002357300A AU2002357300A1 (en) | 2001-12-17 | 2002-12-17 | Processing a memory link with a set of at least two laser pulses |
KR10-2003-7010094A KR20040073958A (en) | 2001-12-17 | 2002-12-17 | Processing a memory link with a set of at least two laser pulses |
GB0317976A GB2390834B (en) | 2001-12-17 | 2002-12-17 | Processing a memory link with a set of at least two laser pulses |
US10/361,206 US6887804B2 (en) | 2000-01-10 | 2003-02-07 | Passivation processing over a memory link |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34174401P | 2001-12-17 | 2001-12-17 | |
US60/341,744 | 2001-12-17 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003052890A1 true WO2003052890A1 (en) | 2003-06-26 |
WO2003052890B1 WO2003052890B1 (en) | 2003-09-04 |
Family
ID=23338848
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/040410 WO2003052890A1 (en) | 2000-01-10 | 2002-12-17 | Processing a memory link with a set of at least two laser pulses |
Country Status (9)
Country | Link |
---|---|
JP (1) | JP2005512814A (en) |
KR (1) | KR20040073958A (en) |
CN (1) | CN1293682C (en) |
AU (1) | AU2002357300A1 (en) |
CA (1) | CA2436227A1 (en) |
DE (1) | DE10296468T5 (en) |
GB (1) | GB2390834B (en) |
TW (1) | TWI295491B (en) |
WO (1) | WO2003052890A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005006422A1 (en) * | 2003-06-30 | 2005-01-20 | Electro Scientific Industries, Inc | Laser pulse picking employing controlled aom loading |
EP1716964A1 (en) * | 2005-04-28 | 2006-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device and laser irradiation apparatus |
EP1989017A1 (en) * | 2006-03-02 | 2008-11-12 | Korea Research Institute of Standards and Science | Laser processing method and processing apparatus based on conventional laser-induced material changes |
US7616669B2 (en) | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
US7671295B2 (en) | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
US7723642B2 (en) | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US7955906B2 (en) | 2001-03-29 | 2011-06-07 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
US9036247B2 (en) | 2011-07-05 | 2015-05-19 | Electro Scientific Industries, Inc. | Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use |
US20210305763A1 (en) * | 2020-03-24 | 2021-09-30 | David Stucker | Composite fiber laser assembly |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2114614A1 (en) * | 2007-01-05 | 2009-11-11 | GSI Group Corporation | System and method for multi-pulse laser processing |
US8278595B2 (en) * | 2007-03-16 | 2012-10-02 | Electro Scientific Industries, Inc. | Use of predictive pulse triggering to improve accuracy in link processing |
US10307862B2 (en) * | 2009-03-27 | 2019-06-04 | Electro Scientific Industries, Inc | Laser micromachining with tailored bursts of short laser pulses |
DE102018200811B4 (en) * | 2018-01-18 | 2020-02-20 | Trumpf Laser Gmbh | Method and laser system for generating amplified pulse on demand output laser pulses |
KR102497645B1 (en) * | 2021-06-23 | 2023-02-08 | 인하대학교 산학협력단 | Method of laser machine the mold surface |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208437A (en) * | 1990-05-18 | 1993-05-04 | Hitachi, Ltd. | Method of cutting interconnection pattern with laser and apparatus thereof |
US5720894A (en) * | 1996-01-11 | 1998-02-24 | The Regents Of The University Of California | Ultrashort pulse high repetition rate laser system for biological tissue processing |
US6281471B1 (en) * | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5656186A (en) * | 1994-04-08 | 1997-08-12 | The Regents Of The University Of Michigan | Method for controlling configuration of laser induced breakdown and ablation |
US5742634A (en) * | 1994-08-24 | 1998-04-21 | Imar Technology Co. | Picosecond laser |
US6057180A (en) * | 1998-06-05 | 2000-05-02 | Electro Scientific Industries, Inc. | Method of severing electrically conductive links with ultraviolet laser output |
-
2002
- 2002-12-17 GB GB0317976A patent/GB2390834B/en not_active Expired - Fee Related
- 2002-12-17 DE DE10296468T patent/DE10296468T5/en not_active Withdrawn
- 2002-12-17 CN CNB028047893A patent/CN1293682C/en not_active Expired - Fee Related
- 2002-12-17 JP JP2003553680A patent/JP2005512814A/en active Pending
- 2002-12-17 CA CA002436227A patent/CA2436227A1/en not_active Abandoned
- 2002-12-17 WO PCT/US2002/040410 patent/WO2003052890A1/en active Application Filing
- 2002-12-17 AU AU2002357300A patent/AU2002357300A1/en not_active Abandoned
- 2002-12-17 TW TW091136366A patent/TWI295491B/en not_active IP Right Cessation
- 2002-12-17 KR KR10-2003-7010094A patent/KR20040073958A/en not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5208437A (en) * | 1990-05-18 | 1993-05-04 | Hitachi, Ltd. | Method of cutting interconnection pattern with laser and apparatus thereof |
US5720894A (en) * | 1996-01-11 | 1998-02-24 | The Regents Of The University Of California | Ultrashort pulse high repetition rate laser system for biological tissue processing |
US6281471B1 (en) * | 1999-12-28 | 2001-08-28 | Gsi Lumonics, Inc. | Energy-efficient, laser-based method and system for processing target material |
Cited By (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8253066B2 (en) | 1999-12-28 | 2012-08-28 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US7838794B2 (en) | 1999-12-28 | 2010-11-23 | Gsi Group Corporation | Laser-based method and system for removing one or more target link structures |
US7723642B2 (en) | 1999-12-28 | 2010-05-25 | Gsi Group Corporation | Laser-based system for memory link processing with picosecond lasers |
US7671295B2 (en) | 2000-01-10 | 2010-03-02 | Electro Scientific Industries, Inc. | Processing a memory link with a set of at least two laser pulses |
US8338746B2 (en) | 2000-01-10 | 2012-12-25 | Electro Scientific Industries, Inc. | Method for processing a memory link with a set of at least two laser pulses |
US8217304B2 (en) | 2001-03-29 | 2012-07-10 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
US7955906B2 (en) | 2001-03-29 | 2011-06-07 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
US7955905B2 (en) | 2001-03-29 | 2011-06-07 | Gsi Group Corporation | Methods and systems for thermal-based laser processing a multi-material device |
WO2005006422A1 (en) * | 2003-06-30 | 2005-01-20 | Electro Scientific Industries, Inc | Laser pulse picking employing controlled aom loading |
US6947454B2 (en) | 2003-06-30 | 2005-09-20 | Electro Scientific Industries, Inc. | Laser pulse picking employing controlled AOM loading |
GB2420004A (en) * | 2003-06-30 | 2006-05-10 | Electro Scient Ind Inc | Laser pulse picking employing controlled aom loading |
GB2420004B (en) * | 2003-06-30 | 2007-01-03 | Electro Scient Ind Inc | Laser pulse picking employing controlled aom loading |
US7616669B2 (en) | 2003-06-30 | 2009-11-10 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
US8081668B2 (en) | 2003-06-30 | 2011-12-20 | Electro Scientific Industries, Inc. | High energy pulse suppression method |
KR101123231B1 (en) | 2003-06-30 | 2012-03-20 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser pulse picking employing controlled aom loading |
EP1716964A1 (en) * | 2005-04-28 | 2006-11-02 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device and laser irradiation apparatus |
US8309443B2 (en) | 2005-04-28 | 2012-11-13 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device and laser irradiation apparatus |
US7618882B2 (en) | 2005-04-28 | 2009-11-17 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device and laser irradiation apparatus |
EP1989017A4 (en) * | 2006-03-02 | 2012-08-15 | Korea Res Inst Of Standards | Laser processing method and processing apparatus based on conventional laser-induced material changes |
EP1989017A1 (en) * | 2006-03-02 | 2008-11-12 | Korea Research Institute of Standards and Science | Laser processing method and processing apparatus based on conventional laser-induced material changes |
US9036247B2 (en) | 2011-07-05 | 2015-05-19 | Electro Scientific Industries, Inc. | Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use |
US20210305763A1 (en) * | 2020-03-24 | 2021-09-30 | David Stucker | Composite fiber laser assembly |
Also Published As
Publication number | Publication date |
---|---|
GB0317976D0 (en) | 2003-09-03 |
KR20040073958A (en) | 2004-08-21 |
TW200304205A (en) | 2003-09-16 |
CN1293682C (en) | 2007-01-03 |
CN1491467A (en) | 2004-04-21 |
DE10296468T5 (en) | 2004-04-22 |
AU2002357300A1 (en) | 2003-06-30 |
CA2436227A1 (en) | 2003-06-26 |
GB2390834B (en) | 2005-01-12 |
GB2390834A (en) | 2004-01-21 |
AU2002357300A8 (en) | 2003-06-30 |
TWI295491B (en) | 2008-04-01 |
JP2005512814A (en) | 2005-05-12 |
WO2003052890B1 (en) | 2003-09-04 |
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