WO2003038862A3 - Pads for cmp and polishing substrates - Google Patents
Pads for cmp and polishing substrates Download PDFInfo
- Publication number
- WO2003038862A3 WO2003038862A3 PCT/US2002/034617 US0234617W WO03038862A3 WO 2003038862 A3 WO2003038862 A3 WO 2003038862A3 US 0234617 W US0234617 W US 0234617W WO 03038862 A3 WO03038862 A3 WO 03038862A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pads
- cmp
- substrates
- polishing substrates
- polishing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
- B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
- Nonwoven Fabrics (AREA)
- Treatments For Attaching Organic Compounds To Fibrous Goods (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003541020A JP2005518286A (en) | 2001-10-29 | 2002-10-29 | CMP and substrate polishing pad |
EP02776348A EP1465753A2 (en) | 2001-10-29 | 2002-10-29 | Pads for cmp and polishing substrates |
AU2002342182A AU2002342182A1 (en) | 2001-10-29 | 2002-10-29 | Pads for cmp and polishing substrates |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US34081901P | 2001-10-29 | 2001-10-29 | |
US60/340,819 | 2001-10-29 | ||
US10/020,082 US20030100250A1 (en) | 2001-10-29 | 2001-12-11 | Pads for CMP and polishing substrates |
US10/020,082 | 2001-12-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003038862A2 WO2003038862A2 (en) | 2003-05-08 |
WO2003038862A3 true WO2003038862A3 (en) | 2004-03-11 |
Family
ID=26692987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/034617 WO2003038862A2 (en) | 2001-10-29 | 2002-10-29 | Pads for cmp and polishing substrates |
Country Status (6)
Country | Link |
---|---|
US (1) | US20030100250A1 (en) |
EP (1) | EP1465753A2 (en) |
JP (1) | JP2005518286A (en) |
KR (1) | KR20050040838A (en) |
AU (1) | AU2002342182A1 (en) |
WO (1) | WO2003038862A2 (en) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US8864859B2 (en) | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
TWI286964B (en) | 2003-03-25 | 2007-09-21 | Neopad Technologies Corp | Customized polish pads for chemical mechanical planarization |
US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
WO2005035194A2 (en) * | 2003-10-09 | 2005-04-21 | Thomas West, Inc. | Stacked pad and method of use |
TWI385050B (en) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | Customized polishing pads for cmp and methods of fabrication and use thereof |
WO2007016498A2 (en) * | 2005-08-02 | 2007-02-08 | Raytech Composites, Inc. | Nonwoven polishing pads for chemical mechanical polishing |
KR100723959B1 (en) * | 2006-08-29 | 2007-06-04 | 주식회사 디스텍 | Chemical mechanical polishing pad using bast fiber as a major material and method for manufacturing thereof |
TWI432285B (en) * | 2007-02-01 | 2014-04-01 | Kuraray Co | Abrasive pad and process for manufacturing abrasive pad |
JP5411862B2 (en) | 2008-08-08 | 2014-02-12 | 株式会社クラレ | Polishing pad and polishing pad manufacturing method |
CN105008614B (en) | 2013-02-12 | 2017-06-13 | 可乐丽股份有限公司 | The manufacture method of hard sheet and hard sheet |
KR102129665B1 (en) | 2018-07-26 | 2020-07-02 | 에스케이씨 주식회사 | Polishing pad, preparation method thereof, and polishing method applying of the same |
CN113226642B (en) | 2018-12-27 | 2024-03-15 | 株式会社可乐丽 | Polishing pad |
US11628535B2 (en) | 2019-09-26 | 2023-04-18 | Skc Solmics Co., Ltd. | Polishing pad, method for manufacturing polishing pad, and polishing method applying polishing pad |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4841680A (en) * | 1987-08-25 | 1989-06-27 | Rodel, Inc. | Inverted cell pad material for grinding, lapping, shaping and polishing |
US4927432A (en) * | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
US4954141A (en) * | 1988-01-28 | 1990-09-04 | Showa Denko Kabushiki Kaisha | Polishing pad for semiconductor wafers |
US5197999A (en) * | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US6095902A (en) * | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4728552A (en) * | 1984-07-06 | 1988-03-01 | Rodel, Inc. | Substrate containing fibers of predetermined orientation and process of making the same |
US5020283A (en) * | 1990-01-22 | 1991-06-04 | Micron Technology, Inc. | Polishing pad with uniform abrasion |
US5232875A (en) * | 1992-10-15 | 1993-08-03 | Micron Technology, Inc. | Method and apparatus for improving planarity of chemical-mechanical planarization operations |
US5394655A (en) * | 1993-08-31 | 1995-03-07 | Texas Instruments Incorporated | Semiconductor polishing pad |
US6017265A (en) * | 1995-06-07 | 2000-01-25 | Rodel, Inc. | Methods for using polishing pads |
US6099954A (en) * | 1995-04-24 | 2000-08-08 | Rodel Holdings, Inc. | Polishing material and method of polishing a surface |
US6022268A (en) * | 1998-04-03 | 2000-02-08 | Rodel Holdings Inc. | Polishing pads and methods relating thereto |
US6126532A (en) * | 1997-04-18 | 2000-10-03 | Cabot Corporation | Polishing pads for a semiconductor substrate |
US6712681B1 (en) * | 2000-06-23 | 2004-03-30 | International Business Machines Corporation | Polishing pads with polymer filled fibrous web, and methods for fabricating and using same |
-
2001
- 2001-12-11 US US10/020,082 patent/US20030100250A1/en not_active Abandoned
-
2002
- 2002-10-29 JP JP2003541020A patent/JP2005518286A/en active Pending
- 2002-10-29 EP EP02776348A patent/EP1465753A2/en not_active Withdrawn
- 2002-10-29 KR KR1020047006435A patent/KR20050040838A/en not_active Application Discontinuation
- 2002-10-29 WO PCT/US2002/034617 patent/WO2003038862A2/en not_active Application Discontinuation
- 2002-10-29 AU AU2002342182A patent/AU2002342182A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4927432A (en) * | 1986-03-25 | 1990-05-22 | Rodel, Inc. | Pad material for grinding, lapping and polishing |
US4841680A (en) * | 1987-08-25 | 1989-06-27 | Rodel, Inc. | Inverted cell pad material for grinding, lapping, shaping and polishing |
US4954141A (en) * | 1988-01-28 | 1990-09-04 | Showa Denko Kabushiki Kaisha | Polishing pad for semiconductor wafers |
US5212910A (en) * | 1991-07-09 | 1993-05-25 | Intel Corporation | Composite polishing pad for semiconductor process |
US5197999A (en) * | 1991-09-30 | 1993-03-30 | National Semiconductor Corporation | Polishing pad for planarization |
US5489233A (en) * | 1994-04-08 | 1996-02-06 | Rodel, Inc. | Polishing pads and methods for their use |
US6095902A (en) * | 1998-09-23 | 2000-08-01 | Rodel Holdings, Inc. | Polyether-polyester polyurethane polishing pads and related methods |
Also Published As
Publication number | Publication date |
---|---|
WO2003038862A2 (en) | 2003-05-08 |
AU2002342182A1 (en) | 2003-05-12 |
US20030100250A1 (en) | 2003-05-29 |
KR20050040838A (en) | 2005-05-03 |
EP1465753A2 (en) | 2004-10-13 |
JP2005518286A (en) | 2005-06-23 |
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