WO2003019643A1 - Semiconductor device having high-permittivity insulation film and production method therefor - Google Patents
Semiconductor device having high-permittivity insulation film and production method therefor Download PDFInfo
- Publication number
- WO2003019643A1 WO2003019643A1 PCT/JP2002/008453 JP0208453W WO03019643A1 WO 2003019643 A1 WO2003019643 A1 WO 2003019643A1 JP 0208453 W JP0208453 W JP 0208453W WO 03019643 A1 WO03019643 A1 WO 03019643A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- insulation film
- semiconductor device
- production method
- method therefor
- permittivity insulation
- Prior art date
Links
- 238000009413 insulation Methods 0.000 title abstract 3
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910052914 metal silicate Inorganic materials 0.000 abstract 2
- 239000000758 substrate Substances 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02142—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing silicon and at least one metal element, e.g. metal silicate based insulators or metal silicon oxynitrides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28185—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation with a treatment, e.g. annealing, after the formation of the gate insulator and before the formation of the definitive gate conductor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28194—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation by deposition, e.g. evaporation, ALD, CVD, sputtering, laser deposition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31608—Deposition of SiO2
- H01L21/31612—Deposition of SiO2 on a silicon body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31637—Deposition of Tantalum oxides, e.g. Ta2O5
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31641—Deposition of Zirconium oxides, e.g. ZrO2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31604—Deposition from a gas or vapour
- H01L21/31645—Deposition of Hafnium oxides, e.g. HfO2
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/477,109 US7164169B2 (en) | 2001-08-23 | 2002-08-22 | Semiconductor device having high-permittivity insulation film and production method therefor |
JP2003522997A JP4120938B2 (en) | 2001-08-23 | 2002-08-22 | Semiconductor device having high dielectric constant insulating film and manufacturing method thereof |
US11/608,078 US7495264B2 (en) | 2001-08-23 | 2006-12-07 | Semiconductor device with high dielectric constant insulating film and manufacturing method for the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-252258 | 2001-08-23 | ||
JP2001252258 | 2001-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003019643A1 true WO2003019643A1 (en) | 2003-03-06 |
Family
ID=19080768
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/008453 WO2003019643A1 (en) | 2001-08-23 | 2002-08-22 | Semiconductor device having high-permittivity insulation film and production method therefor |
Country Status (4)
Country | Link |
---|---|
US (2) | US7164169B2 (en) |
JP (1) | JP4120938B2 (en) |
CN (1) | CN1261986C (en) |
WO (1) | WO2003019643A1 (en) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004304053A (en) * | 2003-03-31 | 2004-10-28 | Fujitsu Ltd | Semiconductor device and its manufacturing method |
JP2005191482A (en) * | 2003-12-26 | 2005-07-14 | Semiconductor Leading Edge Technologies Inc | Semiconductor device and its manufacturing method |
WO2005071723A1 (en) * | 2004-01-21 | 2005-08-04 | Hitachi Kokusai Electric Inc. | Method for manufacturing semiconductor device and substrate processing system |
JP2006054382A (en) * | 2004-08-16 | 2006-02-23 | Sony Corp | Metallic silicate film, manufacturing method thereof, semiconductor device, and manufacturing method thereof |
WO2006057400A1 (en) * | 2004-11-29 | 2006-06-01 | Hitachi Kokusai Electric Inc. | Semiconductor device manufacturing method and substrate processing equipment |
JP2007514293A (en) * | 2003-04-21 | 2007-05-31 | アヴィザ テクノロジー インコーポレイテッド | System and method for forming a multi-component dielectric film |
US7858536B2 (en) | 2002-01-08 | 2010-12-28 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing semiconductor device |
CN102446700A (en) * | 2010-09-30 | 2012-05-09 | 中国科学院微电子研究所 | Method for improving silicon substrate and obtained silicon substrate |
JP2013138213A (en) * | 2005-11-09 | 2013-07-11 | Advanced Micro Devices Inc | Replacement gate transistors with reduced gate oxide leakage |
US10125096B2 (en) | 2007-05-10 | 2018-11-13 | Plastipak Packaging, Inc. | Oxygen scavenging molecules, articles containing same, and methods of their use |
US10923560B2 (en) | 2018-02-15 | 2021-02-16 | Panasonic Intellectual Property Management Co., Ltd. | Capacitor including electrode and dielectric layer each containing silicon, and method for manufacturing capacitor |
Families Citing this family (8)
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JP3974547B2 (en) * | 2003-03-31 | 2007-09-12 | 株式会社東芝 | Semiconductor device and manufacturing method of semiconductor device |
US7504700B2 (en) * | 2005-04-21 | 2009-03-17 | International Business Machines Corporation | Method of forming an ultra-thin [[HfSiO]] metal silicate film for high performance CMOS applications and semiconductor structure formed in said method |
JPWO2007043709A1 (en) * | 2005-10-14 | 2009-04-23 | 日本電気株式会社 | Semiconductor device manufacturing method and manufacturing apparatus thereof |
KR100924195B1 (en) * | 2007-09-18 | 2009-10-29 | 주식회사 하이닉스반도체 | Semicoductor device and method of fabricating the same |
US8012822B2 (en) * | 2007-12-27 | 2011-09-06 | Canon Kabushiki Kaisha | Process for forming dielectric films |
WO2009094570A2 (en) * | 2008-01-24 | 2009-07-30 | Applied Materials, Inc. | Plating through tunnel dielectrics for solar cell contact formation |
US20100186808A1 (en) * | 2009-01-27 | 2010-07-29 | Peter Borden | Plating through tunnel dielectrics for solar cell contact formation |
JP2014053571A (en) | 2012-09-10 | 2014-03-20 | Toshiba Corp | Ferroelectric memory and method of manufacturing the same |
Citations (2)
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US6020243A (en) * | 1997-07-24 | 2000-02-01 | Texas Instruments Incorporated | Zirconium and/or hafnium silicon-oxynitride gate dielectric |
JP2001217238A (en) * | 2000-02-03 | 2001-08-10 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
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JPH05275646A (en) | 1992-03-26 | 1993-10-22 | Matsushita Electric Ind Co Ltd | High-dielectric constant material and manufacture thereof |
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US6190779B1 (en) * | 1994-10-21 | 2001-02-20 | Elisha Technologies Co Llc | Corrosion resistant coating containing and amorphous phase |
WO1997005222A1 (en) * | 1995-07-25 | 1997-02-13 | Henkel Corporation | Composition and method for degreasing metal surfaces |
JPH10294432A (en) | 1997-04-21 | 1998-11-04 | Sony Corp | Ferroelectric capacitor, ferroelectric nonvolatile storage device, and ferroelectric device |
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JPH11186523A (en) | 1997-12-19 | 1999-07-09 | Sharp Corp | Insulating material, substrate covered with insulating film, and manufacture and use thereof |
JP2000323591A (en) | 1999-05-14 | 2000-11-24 | Matsushita Electric Ind Co Ltd | Semiconductor element and method of forming dielectric film |
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JP2001257344A (en) * | 2000-03-10 | 2001-09-21 | Toshiba Corp | Semiconductor device and manufacturing method of semiconductor device |
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JP4184686B2 (en) * | 2001-03-28 | 2008-11-19 | 株式会社東芝 | Manufacturing method of semiconductor device |
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JP2003249649A (en) * | 2002-02-26 | 2003-09-05 | Toshiba Corp | Semiconductor device and manufacturing method therefor |
JP4014431B2 (en) * | 2002-03-27 | 2007-11-28 | 富士通株式会社 | Semiconductor memory device and manufacturing method of semiconductor memory device |
JP4574951B2 (en) * | 2003-02-26 | 2010-11-04 | 株式会社東芝 | Semiconductor device and manufacturing method thereof |
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JP4463597B2 (en) | 2004-03-24 | 2010-05-19 | 富士通株式会社 | 3D drawing model generation method and program thereof |
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-
2002
- 2002-08-22 WO PCT/JP2002/008453 patent/WO2003019643A1/en active Application Filing
- 2002-08-22 JP JP2003522997A patent/JP4120938B2/en not_active Expired - Lifetime
- 2002-08-22 CN CNB028096312A patent/CN1261986C/en not_active Expired - Lifetime
- 2002-08-22 US US10/477,109 patent/US7164169B2/en not_active Expired - Lifetime
-
2006
- 2006-12-07 US US11/608,078 patent/US7495264B2/en not_active Expired - Lifetime
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US6020243A (en) * | 1997-07-24 | 2000-02-01 | Texas Instruments Incorporated | Zirconium and/or hafnium silicon-oxynitride gate dielectric |
JP2001217238A (en) * | 2000-02-03 | 2001-08-10 | Matsushita Electric Ind Co Ltd | Semiconductor device and its manufacturing method |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7858536B2 (en) | 2002-01-08 | 2010-12-28 | Kabushiki Kaisha Toshiba | Semiconductor device and method for manufacturing semiconductor device |
JP4691873B2 (en) * | 2003-03-31 | 2011-06-01 | 富士通株式会社 | Semiconductor device and manufacturing method thereof |
JP2004304053A (en) * | 2003-03-31 | 2004-10-28 | Fujitsu Ltd | Semiconductor device and its manufacturing method |
JP2007514293A (en) * | 2003-04-21 | 2007-05-31 | アヴィザ テクノロジー インコーポレイテッド | System and method for forming a multi-component dielectric film |
JP2005191482A (en) * | 2003-12-26 | 2005-07-14 | Semiconductor Leading Edge Technologies Inc | Semiconductor device and its manufacturing method |
US7531467B2 (en) | 2004-01-21 | 2009-05-12 | Hitachi Kokusai Electric, Inc. | Manufacturing method of semiconductor device and substrate processing apparatus |
CN100447962C (en) * | 2004-01-21 | 2008-12-31 | 株式会社日立国际电气 | Method for manufacturing semiconductor device and substrate processing system |
WO2005071723A1 (en) * | 2004-01-21 | 2005-08-04 | Hitachi Kokusai Electric Inc. | Method for manufacturing semiconductor device and substrate processing system |
JP2006054382A (en) * | 2004-08-16 | 2006-02-23 | Sony Corp | Metallic silicate film, manufacturing method thereof, semiconductor device, and manufacturing method thereof |
US7723245B2 (en) | 2004-11-29 | 2010-05-25 | Hitachi Kokusai Electric Inc. | Method for manufacturing semiconductor device, and substrate processing apparatus |
JP4512098B2 (en) * | 2004-11-29 | 2010-07-28 | 株式会社日立国際電気 | Semiconductor device manufacturing method and substrate processing apparatus |
JPWO2006057400A1 (en) * | 2004-11-29 | 2008-06-05 | 株式会社日立国際電気 | Semiconductor device manufacturing method and substrate processing apparatus |
WO2006057400A1 (en) * | 2004-11-29 | 2006-06-01 | Hitachi Kokusai Electric Inc. | Semiconductor device manufacturing method and substrate processing equipment |
JP2013138213A (en) * | 2005-11-09 | 2013-07-11 | Advanced Micro Devices Inc | Replacement gate transistors with reduced gate oxide leakage |
US10125096B2 (en) | 2007-05-10 | 2018-11-13 | Plastipak Packaging, Inc. | Oxygen scavenging molecules, articles containing same, and methods of their use |
US10906870B2 (en) | 2007-05-10 | 2021-02-02 | Plastipak Packaging, Inc. | Oxygen scavenging molecules, articles containing same, and methods of their use |
CN102446700A (en) * | 2010-09-30 | 2012-05-09 | 中国科学院微电子研究所 | Method for improving silicon substrate and obtained silicon substrate |
CN102446700B (en) * | 2010-09-30 | 2015-11-11 | 中国科学院微电子研究所 | A kind of method improving silicon substrate |
US10923560B2 (en) | 2018-02-15 | 2021-02-16 | Panasonic Intellectual Property Management Co., Ltd. | Capacitor including electrode and dielectric layer each containing silicon, and method for manufacturing capacitor |
Also Published As
Publication number | Publication date |
---|---|
CN1261986C (en) | 2006-06-28 |
US20040171276A1 (en) | 2004-09-02 |
JP4120938B2 (en) | 2008-07-16 |
US20070090450A1 (en) | 2007-04-26 |
CN1507654A (en) | 2004-06-23 |
US7495264B2 (en) | 2009-02-24 |
JPWO2003019643A1 (en) | 2004-12-16 |
US7164169B2 (en) | 2007-01-16 |
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