WO2002059961A1 - Single semiconductor wafer transfer system and transfer unit - Google Patents

Single semiconductor wafer transfer system and transfer unit Download PDF

Info

Publication number
WO2002059961A1
WO2002059961A1 PCT/JP2001/005409 JP0105409W WO02059961A1 WO 2002059961 A1 WO2002059961 A1 WO 2002059961A1 JP 0105409 W JP0105409 W JP 0105409W WO 02059961 A1 WO02059961 A1 WO 02059961A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
conveyor
wafers
robot
single wafer
Prior art date
Application number
PCT/JP2001/005409
Other languages
French (fr)
Japanese (ja)
Inventor
Takehide Hayashi
Original Assignee
Takehide Hayashi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001073088A external-priority patent/JP2002237512A/en
Priority claimed from JP2001088757A external-priority patent/JP2002239961A/en
Priority claimed from JP2001173188A external-priority patent/JP2002334917A/en
Application filed by Takehide Hayashi filed Critical Takehide Hayashi
Priority to PCT/JP2002/005939 priority Critical patent/WO2003000472A1/en
Priority to CN02802206.8A priority patent/CN1263584C/en
Priority to KR10-2003-7002695A priority patent/KR100504673B1/en
Priority to US10/480,249 priority patent/US20040234360A1/en
Priority to JP2003506695A priority patent/JP4090990B2/en
Publication of WO2002059961A1 publication Critical patent/WO2002059961A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading

Definitions

  • the present invention streamlines the supply and recovery of wafers to the manufacturing equipment in the semiconductor manufacturing process, which is usually performed using a cassette or closed box containing 25 wafers, by transporting wafers one by one. This relates to the method of transporting and transferring wafers, and reading the E81 number. Background art
  • the present invention relates to a system in which manufacturing apparatuses are linked by a single wafer by continuously transporting wafers one by one, and the following effects can be expected.
  • the present invention is one means for changing the manufacturing method of a semiconductor manufacturing factory, and aims at streamlining factory operation. Disclosure of the invention
  • the present invention consists of the following three transport and transfer equipment.
  • a batch robot that removes a single wafer from a cassette or closed box used for transport between processes, a temporary storage box with an elevating function, and a single-sheet opening pot that transfers between the temporary storage box and the single-wafer conveyor.
  • FIG. 1 is a plan view showing the relationship among a patch robot, a temporary storage box, a single-wafer robot, and a single-wafer conveyor, which take out wafers from a cassette or a closed box to form a single wafer or force-set.
  • FIG. 2 is a cross-sectional view of a single-sheet or cassette-type patch robot, a temporary storage box, a single-sheet opening pot, and a single-sheet conveyor.
  • FIG. 3 is a plan view showing the relationship between a semiconductor manufacturing apparatus, a single-wafer conveyor, and an out buffer box for single-wafer opening.
  • FIG. 4 is a detailed plan view of a sheet-fed conveyor, a sheet-fed mouth pot, and an in-out buffer box.
  • FIG. 5 is a group cross-sectional view of a nonstop non-stop sheet-fed conveyor and a sheet-fed mouth pot.
  • FIG. 6 is a detailed sectional view of a single-stop type single-sheet conveyor and a single-sheet mouth pot.
  • FIG. 7 is a cross-sectional view of the details of the single-wafer robot and the number ironing device.
  • FIG. 8 is a cross-sectional view of a multistage conveyor and a multistage single-wafer pot showing the transfer and transfer of a plurality of wafers. Explanation of reference numerals
  • Is a stocker. 29 is a drive roller.
  • Is an out station. 30 is a pallet stop lifter. Is an in-station. 31 is a spirit fan.
  • Is a cassette or box conveyor 32 is an air duct.
  • Is an out batch robot. 33 is an arm rotation mechanism.
  • Numeral 34 is a multi-stage conveyor finger
  • numeral 8 is a temporary storage box for out.
  • 35 is a multi-stage robot finger.
  • , 10 is a temporary storage box for in.
  • Reference numerals 1 and 12 denote single-wafer out robots.
  • 3.14 is an in-feed single-wafer robot.
  • Reference numeral 5 denotes a sheet-fed conveyor body.
  • Numeral 0 denotes a single-leaf mouth pot body.
  • 1 is a robot arm with a rotation mechanism.
  • Figures 1 and 2 show the functions of converting wafers contained in a cassette or a closed box) into single wafers and placing them on a conveyor, or converting the processed wafers back into cassettes and returning them to stockers.
  • the cassettes stored in the stocker (1) are sent to the out-station (2), and usually 25 wafers can be temporarily stored in the temporary storage boxes (7, 8) once or several times by the patch robot (5). ).
  • the temporary storage box has the function of elevating and lowering.
  • the single wafer conveyor conveys the wafer to the manufacturing equipment, but the processed wafer (16) is scooped by the single wafer opening pots (13, 14), and the temporary storage box for in-box has the same lifting function.
  • the pot is used to insert the empty cassette that has been transported from inside the stocker to the in-station (3) via the lip pot (6) and passed through the stocker And transported to the next step. If you want to transport lots of various varieties on a single wafer conveyor, you need to increase the number of temporary bun boxes (7, 8, 9, 10).
  • Figure 3 shows the wafer transported by the single wafer conveyor (15).
  • FIG. 1 shows an operation relation supplied and collected.
  • the single-wafer robot turns the arm to dig under the wafer and raises the arm in conjunction with the movement of the finger. Scoop the wafer.
  • the equipment station (19) is empty, the wafer is placed in the station, but when it is not empty, it is temporarily placed in the in buffer box (17). If the equipment station is empty, supply the wafer from the buffer box.
  • T The processed wafer is loaded from the equipment station (19) onto the single wafer conveyor. If there is no empty finger on the conveyor, the wafer is temporarily out (18). Place it in the box and transfer it when an empty finger comes.
  • FIG. 4 is a plan view y showing the transfer operation of the sheet-fed conveyor and the sheet-fed mouth pot
  • FIG. 5 is a cross-sectional view thereof.
  • the single-wafer conveyor (15) is a continuously operated conveyor driven by a looped chain or pelt.
  • the conveyor is equipped with a road wheel, side wheels, and an air filter unit with a filter, and is structured to be quiet and maintain cleanliness.
  • the arm (21) of the sheet-fed robot (20) is moved to the conveyer.
  • the wafer (16) is placed on the four holding members (22) by lowering the finger (23) while raising the arm (21) while interlocking with the traveling speed of the robot.
  • the fly number mounted on the single wafer robot (20) is installed. ) Indicates the alphanumeric characters and barcodes imprinted on the wafer. Use the rotation mechanism built into the robot arm (21) for humility. In addition, wafer transfer is performed via fingers and the holding material of the robot arm, which is the method that minimizes chipping of wafers.
  • FIG. 6 shows a method of temporarily stopping the fingers of the conveyor in front of the equipment station for the continuously operating conveyor of FIGS. 4 and 5.
  • the funger (23) is mounted on the pallet (28).
  • the lifter (30) rises and the finger stops.
  • the single-wafer robot pulls under the wafer and lifts it to scoop up the wafer.
  • the pallet moves by the action of the drive roller because the lifter descends at the time of scooping.
  • the movement of the pallet is the same when the wafer is placed on the finger, and the movement of the single wafer robot is the same as that described in FIGS.
  • This pallet stopping method can also achieve the same function by using a drive roller with an accumulation function and operating a stopper. It is common to the continuous operation type conveyor to install a filter air fan (31) and air filter (32) so that dust is not outside the single wafer conveyor.
  • FIG. 7 shows a single-wafer robot, a wafer number reading device, and a rotating mechanism of an arm.
  • a single wafer robot picks up wafers from a conveyor or places them on a wafer
  • the arm is rotated by a rotating mechanism (33) attached to the arm (21), and a wafer number moderator (25 )
  • a rotating mechanism can be provided outside the robot.
  • Fig. 8 shows that the transfer frequency is high and two or more wafers (34) and robot arm (35) can be transferred if it is too late to carry one wafer at a time. If it is used, the transport capacity will be doubled, and if it is three, it will be tripled. Industrial applicability
  • the wafers which have been transported in a cassette or a closed box are changed to the single wafer continuous transport. It can supply and collect continuous wafers in a fully automatic manner.
  • the pre-processing time required for completing the wafer is greatly shortened, which contributes to a reduction in manufacturing costs and a reduction in construction investment due to a reduction in space for transport and storage.
  • the present invention is not only a mere use of the machine but also promotes the rationalization of the whole semiconductor pre-treatment process and is immediately feasible.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)

Abstract

A single wafer transfer system for shortening the production time and reducing the required space. Twenty five wafers contained in a cassette are taken out simultaneously by means of a batch robot and placed in a temporary box. A single wafer robot takes out the wafer sheet by sheet from the temporary box and transfers it onto a single wafer conveyor traveling continuously while reading out a wafer number. A single wafer robot on the production apparatus side scoops the wafer from the conveyor and transfers it to the production apparatus while reading out a wafer number. When the wafer can not be transferred to the production apparatus, it is placed temporarily in a buffer box. The single wafer robot reads out the number of a machined wafer and transfers it to the single wafer conveyor thus carrying the machined wafer to the next production apparatus. Wafers circulated on the single wafer conveyor and returned back to the original position are contained in the cassette in reverse order and fed to the next process.

Description

明 細 害  Harm
半導体ウェハー枚葉搬送及び移載装置 技術分野  Semiconductor wafer single wafer transfer and transfer equipment
この発明は半導体製造工程において製造装置へのウェハーの供給回収を、 通常 25枚入りのカセットや密閉ボックスを使用して行われていたものを、ゥェ ハーを枚葉搬送する事によって合理化するものであ y、ウェハーの搬送、移載、 ゥェ八一ナンバーの読み取り方法などに関する。 背景技術  The present invention streamlines the supply and recovery of wafers to the manufacturing equipment in the semiconductor manufacturing process, which is usually performed using a cassette or closed box containing 25 wafers, by transporting wafers one by one. This relates to the method of transporting and transferring wafers, and reading the E81 number. Background art
従来から半導体製造工場前処理工程におけるウェハーの搬送の取り扱い は 25枚入りのカセットや密閉ボックスにウェハーを入れて、製造装置に供給、 回収を行っていた。このために製造装屨にはカセットや密閉ボックスからウェハー を取 y出したり、装置での処理の後、再びウェハーを入れる機構が必要であった。 また、このカセットやボックスを自動搬送、自動保管するには、これらの寸法、重量 に合わせた大きいスペースと高価な物流システムが必要であった。一方、生産効 率向上のためにウェハー寸法は大口径化しており、カセットやボックスの寸法と重 量は高額投資を要するクリーンルーム工場建設経费増大要因の一つになっている。 本発明はウェハーを枚葉で連続搬送することによって、製造装置間をウェハー単 体で結びつけるシステムであり、次のような効果が期待できる。  Conventionally, wafer handling in the pretreatment process of a semiconductor manufacturing factory has been performed by supplying wafers to a cassette or sealed box containing 25 wafers, supplying them to manufacturing equipment, and collecting them. For this reason, the manufacturing equipment needed a mechanism for taking out wafers from a cassette or a closed box, or for reloading wafers after processing in the apparatus. In order to automatically transport and store these cassettes and boxes, a large space and an expensive logistics system were required according to their dimensions and weight. On the other hand, the wafer size is increasing in diameter to improve production efficiency, and the size and weight of cassettes and boxes are one of the factors that increase the cost of building a clean room factory requiring high investment. The present invention relates to a system in which manufacturing apparatuses are linked by a single wafer by continuously transporting wafers one by one, and the following effects can be expected.
1 )従来のカセットや密閉ボックスに比べてウェハ一単体は小さく、搬送や保管に 要するスペースが小さくて済み、クリーンルーム建設面積、経費の低減になる。  1) Compared to conventional cassettes and sealed boxes, the size of a single wafer is small, the space required for transport and storage is small, and the clean room construction area and cost are reduced.
2)ウェハーが小さいために自動搬送、保管設備も小さく且つ安価になる。  2) Since the wafer is small, the automatic transfer and storage equipment is small and inexpensive.
3)製造装置に直結する自動搬送形態が取れるので、加工する順番に製造装置を 並べる配置を採用し易くなリ、連銃的にウェハーの加工ができる。（インライン化） 従来は製造装置の種類別に群を形成する配通が取られていたので、本発明の 方式を採用することによって、ウェハーの総加工時間が大幅に短銪できる。  3) Since an automatic transfer mode directly connected to the manufacturing equipment is available, it is easy to adopt an arrangement in which manufacturing equipment is arranged in the processing order, and wafers can be processed in a continuous gun. (In-line) Conventionally, a group is formed for each type of manufacturing apparatus, so that the total processing time of the wafer can be greatly reduced by employing the method of the present invention.
4)ウェハーの総加工時間の短縮は、ェ埸内仕掛品の減少になり製造コスト低減 に紫力る。  4) Reducing the total wafer processing time will reduce the number of in-process products and reduce the production cost.
以上のように本発明は半導体製造工場の製造方法の変革を行う一手段であ y、 工場運営の合理化を目的としている。 発明の開示 As described above, the present invention is one means for changing the manufacturing method of a semiconductor manufacturing factory, and aims at streamlining factory operation. Disclosure of the invention
本発明は次の 3つの搬送、移載設備から成 y立っている。  The present invention consists of the following three transport and transfer equipment.
1 )工程間の搬送で使われるカセットや密閉ボックスからウェハ一を一度に取り 出すバッチロボット、昇降機能付き仮置きボックス、仮置きボックスと枚葉コンペ ャ間の移載を行う枚葉口ポット。  1) A batch robot that removes a single wafer from a cassette or closed box used for transport between processes, a temporary storage box with an elevating function, and a single-sheet opening pot that transfers between the temporary storage box and the single-wafer conveyor.
2)ウェハーを一枚毎に連練搬送する枚葉コンペャ  2) Single wafer conveyor for continuous kneading and transferring wafers one by one
3)各製造装置と枚葉コンペャ間でウェハーの供給、回収を行い、アーム上で ウェハーを回転させながら英数字やバーコードなどのウェハーナンバー読み取 リ装置を備えた口ポット、及びバッファステーション  3) Supply and recovery of wafers between each manufacturing equipment and single-wafer conveyor, and a mouth pot and a buffer station equipped with a device for reading wafer numbers such as alphanumeric characters and bar codes while rotating the wafers on the arm.
これらの移載装置やコンペャはすべてウェハーの欠けが発生しないように、 ウェハーの端面を持って動作させる。 図面の簡単な説明  All of these transfer equipment and conveyors are operated with the wafer end faces in order to avoid chipping of the wafer. BRIEF DESCRIPTION OF THE FIGURES
第 1図はカセットまたは密閉ボックスからウェハーを取り出し枚葉化または力 セット化するパッチロボット、仮置きボックス、枚葉ロボット、枚葉コンペャの関係を 示す平面図である。  FIG. 1 is a plan view showing the relationship among a patch robot, a temporary storage box, a single-wafer robot, and a single-wafer conveyor, which take out wafers from a cassette or a closed box to form a single wafer or force-set.
第 2図は枚葉化またはカセット化のパッチロボット、仮置きボックス、枚葉口ポット、枚 葉コンペャの断面図である。  FIG. 2 is a cross-sectional view of a single-sheet or cassette-type patch robot, a temporary storage box, a single-sheet opening pot, and a single-sheet conveyor.
第 3図は半導体製造装置、枚葉コンペャ、枚葉口ポッ イン用アウト用バッファ ボックスの関係を示す平面図である。  FIG. 3 is a plan view showing the relationship between a semiconductor manufacturing apparatus, a single-wafer conveyor, and an out buffer box for single-wafer opening.
第 4図は枚葉コンペャ、枚葉口ポット、イン用アウト用バッファボックスの詳細 平面図である。  FIG. 4 is a detailed plan view of a sheet-fed conveyor, a sheet-fed mouth pot, and an in-out buffer box.
第 5図は無停止式枚葉コンペャと枚葉口ポットの群細断面図である。  FIG. 5 is a group cross-sectional view of a nonstop non-stop sheet-fed conveyor and a sheet-fed mouth pot.
第 6図は一旦停止式枚葉コンペャと枚葉口ポットの詳細断面図である。  FIG. 6 is a detailed sectional view of a single-stop type single-sheet conveyor and a single-sheet mouth pot.
第 7図は枚葉ロボットの詳細とナンバー銑取装置の断面図である。  FIG. 7 is a cross-sectional view of the details of the single-wafer robot and the number ironing device.
第 8図は複数枚のウェハー搬送、移載を示す多段コンペャと多段枚葉口ポット の断面図である。 符号の説明 FIG. 8 is a cross-sectional view of a multistage conveyor and a multistage single-wafer pot showing the transfer and transfer of a plurality of wafers. Explanation of reference numerals
はストッカーである。 29は駆勤ローラーである。 Is a stocker. 29 is a drive roller.
はアウト用ステーションである。 30はパレット停止リフターである。 はイン用ステーションである。 31は珠気ファンである。 Is an out station. 30 is a pallet stop lifter. Is an in-station. 31 is a spirit fan.
はカセット又はボックス用コンペャである 32は抹気ダクトである。 Is a cassette or box conveyor 32 is an air duct.
はアウト用バッチロボットである。 33はアーム回転機構である。 Is an out batch robot. 33 is an arm rotation mechanism.
はイン用バッチ口ポットである。 34は多段式コンペャフィンガーである《 、 8はアウト用仮置きボックスである。 35は多段式ロボットフィンガーである。Is an in-use batch mouth pot. Numeral 34 is a multi-stage conveyor finger, and numeral 8 is a temporary storage box for out. 35 is a multi-stage robot finger.
, 1 0はイン用仮置きボックスである。, 10 is a temporary storage box for in.
1 , 1 2はアウト用枚葉ロボットである。Reference numerals 1 and 12 denote single-wafer out robots.
3. 1 4はイン用枚葉ロボットである。 3.14 is an in-feed single-wafer robot.
5は枚葉コンペャ本体である。Reference numeral 5 denotes a sheet-fed conveyor body.
6はウェハーである。 6 is a wafer.
7はイン用バッファボックスである。 7 is an in buffer box.
8はアウト用バッファボックスである。 8 is an out buffer box.
9は装置用ステーションである。9 is an equipment station.
0は枚葉口ポット本体である。Numeral 0 denotes a single-leaf mouth pot body.
1は回転機構付きロボットアームである。1 is a robot arm with a rotation mechanism.
2はロボットアームのウェハー保持材である2 is the wafer holding material of the robot arm
3はコンペャのフィンガーである。3 is the finger of the conveyor.
4はフィンガー上の保持材である。4 is a holding material on the finger.
5はウェハーナンバー諫取装置である。5 is a wafer number issuance device.
6は諫取装置のサポートである。6 is the support of the Isari device.
7はアームのペース部である。7 is the arm pace.
8はパレットである。 発明を実施するための最良の形態 8 is a pallet. BEST MODE FOR CARRYING OUT THE INVENTION
本発明を詳細に説述するために、添付の図面に従ってこれを説明する。  The present invention will be described in detail with reference to the accompanying drawings.
第 1図と第 2図はカセットほたは密閉ボックス）に入ったウェハーを枚葉化し てコンペャに載せたり、加工後のウェハーを再びカセット化してストッカーに戻す 機能を示すものである。ストッカー（1 )に格納されていたカセットはアウト用ステ ーシヨン（2)に送られ、パッチロボット（5)によって、通常 25枚のウェハーは一 回あるいは数回の動作で仮置きボックス (7， 8)に移し換えられる。仮置きボック スは昇降する機能を備えてぉリ、ウェハーを一枚ずつ掬い取って枚葉コンペャ  Figures 1 and 2 show the functions of converting wafers contained in a cassette or a closed box) into single wafers and placing them on a conveyor, or converting the processed wafers back into cassettes and returning them to stockers. The cassettes stored in the stocker (1) are sent to the out-station (2), and usually 25 wafers can be temporarily stored in the temporary storage boxes (7, 8) once or several times by the patch robot (5). ). The temporary storage box has the function of elevating and lowering.
(1 5)に載せかえる枚葉ロボットの動作レベルに合わせて昇降を行う。枚葉コンペ ャはウェハーを製造装置の方に搬送するが、加工の終わったウェハー（16)は枚 葉口ポット（13, 14)によって掬い取られ、同じく昇降機能を持つイン用仮置きボッ クス (9， 10)に収納されて所定の枚数になった時点で ツチ口ポット (6)によ y ストッカー内からイン用ステーション（3)に運ばれてきている空カセットに入れられ、 ストッカーを経由して次工程に搬送される。多品種のロットを枚葉コンペャで搬 送したい場合は仮饅きボックス (7, 8, 9, 10)を増やす必要があるが、増えた ボックスと枚葉口ポットの移載が容易になるように仮置きボックス全体に横スライド 機構や回転機構を設けることによ y対応が可能になる。また枚葉口ポットにはゥェ ハーに刻印された英数字やバーコードを餽取るナンバー読取装置を取り付け、ゥ ェハーの所在や行き先の確認を適時行う。 Lift up and down according to the operation level of the single-wafer robot to be replaced in (15). The single wafer conveyor conveys the wafer to the manufacturing equipment, but the processed wafer (16) is scooped by the single wafer opening pots (13, 14), and the temporary storage box for in-box has the same lifting function. When the number of sheets stored in (9, 10) has reached the specified number, the pot is used to insert the empty cassette that has been transported from inside the stocker to the in-station (3) via the lip pot (6) and passed through the stocker And transported to the next step. If you want to transport lots of various varieties on a single wafer conveyor, you need to increase the number of temporary bun boxes (7, 8, 9, 10). By providing a horizontal slide mechanism and a rotation mechanism on the entire temporary storage box, it becomes possible to handle y. In addition, a number reading device that picks up alphanumeric characters and barcodes engraved on the wafer is attached to the sheet-fed mouth pot, and the location and destination of the wafer are checked in a timely manner.
第 3図は枚葉コンペャ（15)によって搬送されてきたウェハーが製造装置  Figure 3 shows the wafer transported by the single wafer conveyor (15).
(a~h)に供給、回収される動作闋係を示すものである。ウェハーは枚葉コンペ ャで所定の装置 (d)の前にさしかかった際に枚葉ロボットはアームを旋回させて ウェハーの下のもぐり込み、フィンガーの動きに連動しながらアームを上昇させ ることによってウェハーを掬い取る。装置ステーション（19)が空きの状態の時は ステーションにウェハーを置くが、空いていない埸合はイン用バッファボックス（17) に仮置きする。装置ステーションが空けばバッファボックスからウェハーを供給する t 加工が終わったウェハーは装置ステーション（19)から枚葉コンペャに載せられ るが、コンペャに空きフィンガーがない場合は一旦アウト用（1 8)仮置きボックス に置き、空きフィンガーが来れば移載する。 第 4図は枚葉コンペャと枚葉口ポットの移載動作を示す平面図であ y、第 5図は その断面図である。枚葉コンペャ（15)はループ状のチェンまたはペルトによって 駆動する連統運転式コンペャである。コンペャにはロードホイールとサイドホイール 及びフィルター付き抹気ユニットを備えておリ、静粛且つクリーン度維持が可能な 構造になっている。枚葉コンペャのフィンガー（23)の 4つの保持材（24)に載せら れたウェハ一 ( 16)が所定の製造装置の前に差し掛かった時に枚葉ロボット (20) のアーム（21 )はコンペャの走行速度に連動しながら、フィンガー (23)の下にもぐ リ込み、アーム（21 )を上昇させることによってウェハー（16)を 4つの保持材（22) 上に載せる。枚葉コンペャ（15)からウェハ一を掬い取る時と、製造装置の加工が 終わってコンペャに載せる時のいずれにおいても、枚葉ロボット (20)に搭載され たゥハエ一ナンバー睐取装 g(25)はウェハーに刻印された英数字やバーコード を諫取る。謙み取リに際してロボットアーム（21 )に内臓されている回転機構を利 用する。またウェハーの移載はウェハーの欠けが最も少ない方法であるフィンガー とロボットアームの保持材を介している。 ( a to h) shows an operation relation supplied and collected. When the wafer is approaching the specified device (d) by the single-wafer conveyer, the single-wafer robot turns the arm to dig under the wafer and raises the arm in conjunction with the movement of the finger. Scoop the wafer. When the equipment station (19) is empty, the wafer is placed in the station, but when it is not empty, it is temporarily placed in the in buffer box (17). If the equipment station is empty, supply the wafer from the buffer box. T The processed wafer is loaded from the equipment station (19) onto the single wafer conveyor. If there is no empty finger on the conveyor, the wafer is temporarily out (18). Place it in the box and transfer it when an empty finger comes. FIG. 4 is a plan view y showing the transfer operation of the sheet-fed conveyor and the sheet-fed mouth pot, and FIG. 5 is a cross-sectional view thereof. The single-wafer conveyor (15) is a continuously operated conveyor driven by a looped chain or pelt. The conveyor is equipped with a road wheel, side wheels, and an air filter unit with a filter, and is structured to be quiet and maintain cleanliness. When the wafer (16) placed on the four holding members (24) of the fingers (23) of the sheet-fed conveyor approaches the predetermined manufacturing equipment, the arm (21) of the sheet-fed robot (20) is moved to the conveyer. The wafer (16) is placed on the four holding members (22) by lowering the finger (23) while raising the arm (21) while interlocking with the traveling speed of the robot. Both when scooping wafers from the single wafer conveyor (15) and when placing them on the conveyor after processing of the manufacturing equipment, the fly number mounted on the single wafer robot (20) is installed. ) Indicates the alphanumeric characters and barcodes imprinted on the wafer. Use the rotation mechanism built into the robot arm (21) for humility. In addition, wafer transfer is performed via fingers and the holding material of the robot arm, which is the method that minimizes chipping of wafers.
第 6図は第 4図、第 5図の連続運転式のコンペャに対して、装置ステーションの前 で一旦コンペャのフィンガーを停止させる方法を示すものである。ファンガー（23) はパレット (28)に取り付けられている。パレットが所定の位置に到達するとリフター (30)が上昇することによって、フィンガーは停止する。停止と同時に枚葉ロボットは ウェハーの下にもぐリ込み、上昇することによってウェハーを掬い取る。掬い取った 時点でリフタ一は下降するのでパレットは駆動ローラーの働きによって、走行する。 フィンガー上にウェハーを Sく場合もパレットの動きは同様でぁリ、枚葉ロボットの動 きは第 4, 5図の説明と同様である。このパレット停止方法はアキユームレーシヨン機 能付き駆動ローラ一を使い、ストッパーを働かせることによつても同様の機能が達成 できる。枚葉コンペャ外に塵がでないようにフィルター付き抹気ファン（31 )や抹気ダ クト (32)を取リ付けることは連練運転タイプのコンペャにも共通である。 FIG. 6 shows a method of temporarily stopping the fingers of the conveyor in front of the equipment station for the continuously operating conveyor of FIGS. 4 and 5. The funger (23) is mounted on the pallet (28). When the pallet reaches a predetermined position, the lifter (30) rises and the finger stops. At the same time as the stop, the single-wafer robot pulls under the wafer and lifts it to scoop up the wafer. The pallet moves by the action of the drive roller because the lifter descends at the time of scooping. The movement of the pallet is the same when the wafer is placed on the finger, and the movement of the single wafer robot is the same as that described in FIGS. This pallet stopping method can also achieve the same function by using a drive roller with an accumulation function and operating a stopper. It is common to the continuous operation type conveyor to install a filter air fan (31) and air filter (32) so that dust is not outside the single wafer conveyor.
第 7図は枚葉ロボットとウェハーナンバー読取装置、及びアームの回転機構を示す ものである。枚葉ロボットがウェハーをコンペャから掬い取る時や載せる時にアーム (21 )に取り付けられた回転機構 (33)でアームを回転させ、口ポットまたは外部に取リ 付けられたウェハーナンバー謙取装置 (25)によって、ウェハーに刻印されている英数 字やバーコ一ドを諫み取る。アーム上で回転させて読取る以外に、移載速度が遅くても 良い場合には回転機構をロボット外に設けることも可能である。 FIG. 7 shows a single-wafer robot, a wafer number reading device, and a rotating mechanism of an arm. When a single wafer robot picks up wafers from a conveyor or places them on a wafer, the arm is rotated by a rotating mechanism (33) attached to the arm (21), and a wafer number moderator (25 ) To remove the alphanumeric characters and bar codes engraved on the wafer. In addition to reading by rotating on the arm, if the transfer speed can be slow, a rotating mechanism can be provided outside the robot.
第 8図は搬送頻度が高く、ウェハ一を一枚単位で運んでいては間に合わない場合に はフィンガー (34)とロボットアーム (35)を複数搬送可能にしたものである、ウェハ一を 2枚用にすれば 2倍の搬送能力向上になり、 3枚にすれば 3倍向上する。 産業上の利用可能性  Fig. 8 shows that the transfer frequency is high and two or more wafers (34) and robot arm (35) can be transferred if it is too late to carry one wafer at a time. If it is used, the transport capacity will be doubled, and if it is three, it will be tripled. Industrial applicability
以上のように本発明は従来カセットや密閉ボックスに入れて搬送していたウェハ一を 枚葉連続搬送に変えるものであり、半導体製造装置の配置をウェハーの加工、処理す る順番に並べてその間を全自動で、連続ウェハーの供給、回収を可能とするものであ る。このことによってウェハーが完成するまでの前処理工程時間は大幅に短箱され製 造コスト低減と、搬送、保管のスペース低減による建設投資額削減に貢献する。本発 明は単なる機械の効率敵な使用にとどまらず、半導体生産前処理工程全体の合理化 を促すものであり、直ちに実現可能である。  As described above, in the present invention, the wafers which have been transported in a cassette or a closed box are changed to the single wafer continuous transport. It can supply and collect continuous wafers in a fully automatic manner. As a result, the pre-processing time required for completing the wafer is greatly shortened, which contributes to a reduction in manufacturing costs and a reduction in construction investment due to a reduction in space for transport and storage. The present invention is not only a mere use of the machine but also promotes the rationalization of the whole semiconductor pre-treatment process and is immediately feasible.

Claims

請 求 の 範 囲 半導体ウェハー 25枚入りのカセットまたは密開ボックスのウェハーを まとめて掬い取るロボットと、昇降機能付き仮置きボックス及びウェハー 枚葉ロボットと枚葉コンペャからなる設備 ウェハー端面をもって搬送するウェハー枚葉コンペャ、コンペャの動きに 連動しながらウェハーの移載を行う枚葉ロボットそしてバッファーボックスから なる設備 ウェハーの端面を持ち、ウェハーに刻印された英数字やバーコードのナン バー読取装置を搭載し、アームにウェハ一回転機構を備えて、ウェハー ナンバーを読取るロボット Scope of request Robots to collectively collect 25 semiconductor wafers in cassettes or open boxes, and temporary storage boxes with elevating function and wafers Equipment consisting of single-wafer robots and single-wafer conveyers Wafers to be transported with wafer edge Equipment consisting of a single-wafer conveyor, a single-wafer robot that transfers wafers in conjunction with the movement of the conveyor, and a buffer box.Has a wafer end face, and is equipped with an alphanumeric and barcode number reading device engraved on the wafer. , Arm equipped with a wafer rotation mechanism to read the wafer number
PCT/JP2001/005409 2001-01-24 2001-06-25 Single semiconductor wafer transfer system and transfer unit WO2002059961A1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
PCT/JP2002/005939 WO2003000472A1 (en) 2001-06-25 2002-06-14 System for conveying and transferring semiconductor or liquid crystal wafer one by one
CN02802206.8A CN1263584C (en) 2001-06-25 2002-06-14 System for conveying and transferring semiconductor or liquid crystal wafer one by one
KR10-2003-7002695A KR100504673B1 (en) 2001-06-25 2002-06-14 System for conveying and transferring semiconductor or liquid crystal wafer one by one
US10/480,249 US20040234360A1 (en) 2001-06-25 2002-06-14 System for conveying and transferring semiconductor or liquid crystal wafer one by one
JP2003506695A JP4090990B2 (en) 2001-06-25 2002-06-14 Semiconductor or liquid crystal wafer single wafer transfer and transfer system

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2001-53114 2001-01-24
JP2001053114 2001-01-24
JP2001073088A JP2002237512A (en) 2001-02-08 2001-02-08 Transfer device for conveyor for carrying wafer sheet
JP2001-73088 2001-02-08
JP2001-088757 2001-02-20
JP2001088757A JP2002239961A (en) 2001-02-20 2001-02-20 Semiconductor wafer id reader and transfer robot with rotating finger
JP2001-173188 2001-05-07
JP2001173188A JP2002334917A (en) 2001-05-07 2001-05-07 Transfer facility consisting of pallet-type single-wafer transfer conveyor holding end face of semiconductor wafer, transfer robot, id reader, and buffer station

Publications (1)

Publication Number Publication Date
WO2002059961A1 true WO2002059961A1 (en) 2002-08-01

Family

ID=27482071

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/005409 WO2002059961A1 (en) 2001-01-24 2001-06-25 Single semiconductor wafer transfer system and transfer unit

Country Status (1)

Country Link
WO (1) WO2002059961A1 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7108121B2 (en) 2003-03-12 2006-09-19 Seiko Epson Corporation Intermediate product transferring apparatus and carrying system having the intermediate product transferring apparatus
CN1301545C (en) * 2003-03-10 2007-02-21 精工爱普生株式会社 Producer and producing method for producing object
WO2014201706A1 (en) * 2013-06-18 2014-12-24 深圳市华星光电技术有限公司 Automation device for picking and placing liquid crystal substrate of large size
CN108305846A (en) * 2017-01-12 2018-07-20 上海理想万里晖薄膜设备有限公司 A kind of silicon chip feeding/blanking Transmission system and its working method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03154751A (en) * 1989-11-08 1991-07-02 Hitachi Ltd Multiple kind conveying method and device therefor
US5183370A (en) * 1989-12-29 1993-02-02 Commissariat A L'energie Atomique Apparatus for placing or storing flat articles in a cassette with intermediate racks
JPH0969476A (en) * 1995-08-30 1997-03-11 Hitachi Ltd Article identifying device
US5820679A (en) * 1993-07-15 1998-10-13 Hitachi, Ltd. Fabrication system and method having inter-apparatus transporter

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03154751A (en) * 1989-11-08 1991-07-02 Hitachi Ltd Multiple kind conveying method and device therefor
US5183370A (en) * 1989-12-29 1993-02-02 Commissariat A L'energie Atomique Apparatus for placing or storing flat articles in a cassette with intermediate racks
US5820679A (en) * 1993-07-15 1998-10-13 Hitachi, Ltd. Fabrication system and method having inter-apparatus transporter
JPH0969476A (en) * 1995-08-30 1997-03-11 Hitachi Ltd Article identifying device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1301545C (en) * 2003-03-10 2007-02-21 精工爱普生株式会社 Producer and producing method for producing object
US7108121B2 (en) 2003-03-12 2006-09-19 Seiko Epson Corporation Intermediate product transferring apparatus and carrying system having the intermediate product transferring apparatus
WO2014201706A1 (en) * 2013-06-18 2014-12-24 深圳市华星光电技术有限公司 Automation device for picking and placing liquid crystal substrate of large size
CN108305846A (en) * 2017-01-12 2018-07-20 上海理想万里晖薄膜设备有限公司 A kind of silicon chip feeding/blanking Transmission system and its working method

Similar Documents

Publication Publication Date Title
TWI434797B (en) Integrated systems for interfacing with substrate container storage systems
TW505605B (en) In/out load port transfer mechanism
US6139239A (en) System for transferring wafers from cassettes to furnaces and method
EP2433300B1 (en) Integrated systems for interfacing with substrate container storage systems
US20070258796A1 (en) Methods and apparatus for transporting substrate carriers
WO2000068118A1 (en) Transfer system for lcd glass substrate
CN102804355A (en) Substrate container storage system
EP1845552B1 (en) Transportation system and transportation method
KR100504673B1 (en) System for conveying and transferring semiconductor or liquid crystal wafer one by one
KR20020064918A (en) Wafer transport system
JP4090990B2 (en) Semiconductor or liquid crystal wafer single wafer transfer and transfer system
US20080075564A1 (en) Container Carrying Equipment
WO2002059961A1 (en) Single semiconductor wafer transfer system and transfer unit
JP4100585B2 (en) Pod supply device in semiconductor manufacturing equipment
US20030161714A1 (en) Storage and buffer system with transport elements
JP2002237512A (en) Transfer device for conveyor for carrying wafer sheet
JPH08148538A (en) Method and system for producing semiconductor device and carrier case
JP2005136294A (en) Transfer apparatus
US6520312B2 (en) Interlinked production system
JPH09226721A (en) Box conveyer
JPH04233747A (en) Carrier stocker
TWI220420B (en) System for conveying and transferring semiconductor or liquid crystal wafer one by one
WO2005036617A1 (en) Work single wafer processing system
JP2679284B2 (en) Overhead traveling car
JPH11330195A (en) Wafer carrier device

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): KR US

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase