WO2002029393A3 - Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques - Google Patents

Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques Download PDF

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Publication number
WO2002029393A3
WO2002029393A3 PCT/US2001/031293 US0131293W WO0229393A3 WO 2002029393 A3 WO2002029393 A3 WO 2002029393A3 US 0131293 W US0131293 W US 0131293W WO 0229393 A3 WO0229393 A3 WO 0229393A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
data collection
process data
images
imaging techniques
Prior art date
Application number
PCT/US2001/031293
Other languages
French (fr)
Other versions
WO2002029393A2 (en
Inventor
Reginald Hunter
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Priority to JP2002532916A priority Critical patent/JP2005501216A/en
Priority to KR1020037004936A priority patent/KR100886850B1/en
Publication of WO2002029393A2 publication Critical patent/WO2002029393A2/en
Publication of WO2002029393A3 publication Critical patent/WO2002029393A3/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G01N21/8903—Optical details; Scanning details using a multiple detector array
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

The present invention generally provides an apparatus and a method for inspecting a substrate in a processing system. A pair of light sources is used in conjunction with an optical receiving device, such as a camera having a CCD, to illuminate and inspect a substrate for various optical signatures. The substrate signatures are then used to generate images of obstructions in three dimensions (3-D) for further analysis. In one embodiment, the substrate is scanned in two or more directions with a first light source and then scanned in two or more directions with a second light source. A receiver captures the reflected and/or scattered signals from sources comprising two or more different images. The light illumination from the first and second light sources impinges on substrate surface obstructions from two differing angles (i.e. perspectives). Differentiation between the images is provided by either different perspective angles and/or different optical filtering configurations.
PCT/US2001/031293 2000-10-06 2001-10-05 Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques WO2002029393A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002532916A JP2005501216A (en) 2000-10-06 2001-10-05 Method and apparatus for enabling inspection of embedded substrates by processing data collection and substrate imaging techniques
KR1020037004936A KR100886850B1 (en) 2000-10-06 2001-10-05 Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/680,226 2000-10-06
US09/680,226 US6813032B1 (en) 1999-09-07 2000-10-06 Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques

Publications (2)

Publication Number Publication Date
WO2002029393A2 WO2002029393A2 (en) 2002-04-11
WO2002029393A3 true WO2002029393A3 (en) 2002-07-04

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/031293 WO2002029393A2 (en) 2000-10-06 2001-10-05 Method and apparatus for enhanced embedded substrate inspection through process data collection and substrate imaging techniques

Country Status (5)

Country Link
US (1) US6813032B1 (en)
JP (1) JP2005501216A (en)
KR (1) KR100886850B1 (en)
TW (1) TW511213B (en)
WO (1) WO2002029393A2 (en)

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Also Published As

Publication number Publication date
KR100886850B1 (en) 2009-03-05
JP2005501216A (en) 2005-01-13
TW511213B (en) 2002-11-21
WO2002029393A2 (en) 2002-04-11
US6813032B1 (en) 2004-11-02
KR20030036897A (en) 2003-05-09

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