WO2002003045A3 - Probe, systems and methods for integrated circuit board testing - Google Patents

Probe, systems and methods for integrated circuit board testing Download PDF

Info

Publication number
WO2002003045A3
WO2002003045A3 PCT/IL2001/000602 IL0100602W WO0203045A3 WO 2002003045 A3 WO2002003045 A3 WO 2002003045A3 IL 0100602 W IL0100602 W IL 0100602W WO 0203045 A3 WO0203045 A3 WO 0203045A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe
systems
methods
circuit board
integrated circuit
Prior art date
Application number
PCT/IL2001/000602
Other languages
French (fr)
Other versions
WO2002003045A2 (en
Inventor
Ilan Makmel
Meir Dror
Original Assignee
Testship Automatic Test Soluti
Ilan Makmel
Meir Dror
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Testship Automatic Test Soluti, Ilan Makmel, Meir Dror filed Critical Testship Automatic Test Soluti
Priority to AU2001270952A priority Critical patent/AU2001270952A1/en
Publication of WO2002003045A2 publication Critical patent/WO2002003045A2/en
Publication of WO2002003045A3 publication Critical patent/WO2002003045A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2223/00—Investigating materials by wave or particle radiation
    • G01N2223/60—Specific applications or type of materials
    • G01N2223/611—Specific applications or type of materials patterned objects; electronic devices
    • G01N2223/6113—Specific applications or type of materials patterned objects; electronic devices printed circuit board [PCB]
PCT/IL2001/000602 2000-06-30 2001-06-29 Probe, systems and methods for integrated circuit board testing WO2002003045A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2001270952A AU2001270952A1 (en) 2000-06-30 2001-06-29 Probe, systems and methods for integrated circuit board testing

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21566800P 2000-06-30 2000-06-30
US60/215,668 2000-06-30

Publications (2)

Publication Number Publication Date
WO2002003045A2 WO2002003045A2 (en) 2002-01-10
WO2002003045A3 true WO2002003045A3 (en) 2002-04-25

Family

ID=22803889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IL2001/000602 WO2002003045A2 (en) 2000-06-30 2001-06-29 Probe, systems and methods for integrated circuit board testing

Country Status (2)

Country Link
AU (1) AU2001270952A1 (en)
WO (1) WO2002003045A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2003269535A1 (en) 2003-10-14 2005-04-27 Mirtec Co., Ltd. Printed circuit board inspection system combining x-ray inspection and visual inspection
FR2944894B1 (en) * 2009-04-22 2012-03-23 Regie Autonome Transports SYSTEM AND METHOD FOR CONDUCTING AUTOMATED TESTS
TWI497092B (en) * 2013-12-05 2015-08-21 Inventec Corp Detection script reading system for circuit board and method thereof
KR102121521B1 (en) * 2015-04-15 2020-06-29 익슬론 인터나치오날 게엠베하 How to test electronic components
CN109769389A (en) * 2019-01-23 2019-05-17 浙江灵杰智控科技有限公司 One kind being based on the surface-pasted controller production technology of tin cream
US11125807B2 (en) * 2019-11-07 2021-09-21 Kuan-Hung Chen Support fixture and probe station having the same

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476433A (en) * 1982-09-07 1984-10-09 Logan John K Electronic test fixture
US4544889A (en) * 1983-09-12 1985-10-01 International Business Machines Corporation Robot precision probe positioner with guidance optics
US5039938A (en) * 1990-06-21 1991-08-13 Hughes Aircraft Company Phosphor glow testing of hybrid substrates
US5394100A (en) * 1993-05-06 1995-02-28 Karl Suss America, Incorporated Probe system with automatic control of contact pressure and probe alignment
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
US5850146A (en) * 1995-12-30 1998-12-15 Samsung Electronics Co., Ltd. Probe apparatus for electrical inspection of printed circuit board assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4476433A (en) * 1982-09-07 1984-10-09 Logan John K Electronic test fixture
US4544889A (en) * 1983-09-12 1985-10-01 International Business Machines Corporation Robot precision probe positioner with guidance optics
US5039938A (en) * 1990-06-21 1991-08-13 Hughes Aircraft Company Phosphor glow testing of hybrid substrates
US5469064A (en) * 1992-01-14 1995-11-21 Hewlett-Packard Company Electrical assembly testing using robotic positioning of probes
US5394100A (en) * 1993-05-06 1995-02-28 Karl Suss America, Incorporated Probe system with automatic control of contact pressure and probe alignment
US5850146A (en) * 1995-12-30 1998-12-15 Samsung Electronics Co., Ltd. Probe apparatus for electrical inspection of printed circuit board assembly

Also Published As

Publication number Publication date
AU2001270952A1 (en) 2002-01-14
WO2002003045A2 (en) 2002-01-10

Similar Documents

Publication Publication Date Title
FI20001562A (en) Antenna circuit arrangement and test method
GB0304664D0 (en) System and method for testing integrated circuit devices
SG110203A1 (en) Printed circuit board test access point structures and method for making the same
AU2003245273A1 (en) Probe card for testing integrated circuits
SG115395A1 (en) Systems and methods for facilitating automated test equipment functionality within integrated circuits
TWI319485B (en) Probe card covering system and method for testing integrated circuits
GB2370364B (en) Testing integrated circuits
AU2002351111A1 (en) Microprocessor-based probe for integrated circuit testing
AU7709900A (en) Enhancements in testing devices on burn-in boards
EP1331642A4 (en) Semiconductor storage device, its testing method, and test circuit
SG120065A1 (en) Circuit board coupon tester
PL351406A1 (en) Connection tester for an electronic trip unit
WO2002003045A3 (en) Probe, systems and methods for integrated circuit board testing
SG101949A1 (en) Method and apparatus for testing an integrated circuit
GB0102436D0 (en) Circuit board testing
GB0002326D0 (en) Circuit board component testing
GB0030346D0 (en) Integrated circuit test structure
SG94342A1 (en) Burn-in board
TW371485U (en) Probe device for testing circuit board
EP1212626A4 (en) Method for testing circuits
TW540709U (en) Component testing device for printed circuit board
TW359416U (en) Testing device for testing integrated circuit chip
GB9805893D0 (en) Circuit testing device
TW535908U (en) Testing seat interface circuit board
TW358549U (en) Tester for testing integrted circuit

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GH GM KE LS MW MZ SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE TR BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase
NENP Non-entry into the national phase

Ref country code: JP