WO2000067944A1 - Ultrasonic wire bonding device - Google Patents

Ultrasonic wire bonding device Download PDF

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Publication number
WO2000067944A1
WO2000067944A1 PCT/DE2000/001434 DE0001434W WO0067944A1 WO 2000067944 A1 WO2000067944 A1 WO 2000067944A1 DE 0001434 W DE0001434 W DE 0001434W WO 0067944 A1 WO0067944 A1 WO 0067944A1
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WO
WIPO (PCT)
Prior art keywords
transducer
wire bonding
ultrasonic
ultrasonic wire
clamping device
Prior art date
Application number
PCT/DE2000/001434
Other languages
German (de)
French (fr)
Inventor
Frank Walther
Original Assignee
Hesse & Knipps Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hesse & Knipps Gmbh filed Critical Hesse & Knipps Gmbh
Priority to DE10081207T priority Critical patent/DE10081207D2/en
Priority to AU56719/00A priority patent/AU5671900A/en
Publication of WO2000067944A1 publication Critical patent/WO2000067944A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • B23K20/106—Features related to sonotrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/788—Means for moving parts
    • H01L2224/78821—Upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/78822—Rotational mechanism
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor

Definitions

  • the invention relates to an ultrasound wire bonding device with a bond head that can be moved and rotated in the Z direction and to which an ultrasound transducer with an associated bonding tool and an ultrasound oscillation generator is attached by means of a transducer receptacle, the transducer receptacle being designed as a spring-elastic parallel in the Z direction. is formed guide and wherein a drive device is provided between the bondhead and the transducer receptacle to move the transducer receptacle in the Z direction relative to the bondhead.
  • Ultrasonic wire bonding devices of this type are required for the assembly of semiconductor components and are used to produce wire bridges, for example between bonding pads on semiconductor chips and contact pads on a carrier element on which the semiconductor component has been mounted beforehand.
  • the ultrasonic energy required for ultrasonic wire bonding is provided by an ultrasonic vibration generator and transmitted to an attached bond tool via an ultrasonic transducer.
  • This bond unit is usually attached to a rotatable and rotatable bond head in the Z direction such that the bond tool can be moved in the Z direction relative to the bond head.
  • This movement of the bonding tool is achieved in that the transducer is arranged on the bonding head so as to be pivotable about a horizontal axis. It is also possible to arrange the bonding unit in a vertical guide on the bonding head.
  • a device has become known in which a bonding unit consisting of ultrasound vibration generator, transducer and bonding tool is attached to the bonding head via a four-armed bracket.
  • This four-armed bracket is formed by an upper and a lower plate, which are extension arms of the four-armed bracket.
  • flexible, leaf spring Mige connecting elements are provided, which connect the plates with the bonding head on the one hand and with a receptacle for the transducer on the other. With this holder, the transducer can be moved in the Z direction relative to the bondhead.
  • Such a device consists of a large number of components, so that the assembly process is very complex.
  • the construction of the four-armed bracket is very complicated, which proves to be very disadvantageous in particular in the event of a necessary repair, for example if one of the springs breaks.
  • the invention is therefore based on the object of creating an ultrasonic wire bonding device with a transducer holder which has a particularly simple structure, can be produced at low cost and which allows simple and quick assembly.
  • the object on which the invention is based is achieved in an ultrasonic wire bonding device of the type mentioned at the outset in that the transducer holder is designed as a parallel guide made from one piece and a clamping device for the ultrasonic transducer, a fastening block for fastening the transducer holder on Bond head and solid joints.
  • An ultrasound wire bonding device designed in this way creates a particularly simple transducer receptacle, which, particularly in the case of servicing, enables the wire bonding device to be mounted easily and quickly on the bonding head.
  • the main advantage of this solution is, however, that the transducer can now be moved out of the rest position after being placed on the bond site, it being possible either to run through a predetermined deformation profile or to regulate the bond force.
  • the invention provides an ultrasonic wire bonding device with a completely maintenance-free transducer holder, in which it is not necessary to work on mechanical stops. The consequence of this is that the otherwise necessary calming times and repositioning movements can be dispensed with.
  • the transducer receptacle between the clamping device and the fastening block has a translating parallelogram which includes the solid-state joints, i.e. a four-link chain with solid-state joints is implemented. All movable elements, including the associated fastening elements, are thus combined in a one-piece assembly, which can be produced, for example, by eroding or laser cutting.
  • the translating parallelogram consists of two support arms running parallel to each other, in each of which a solid-state joint is incorporated at the transition to the clamping device or the fastening block.
  • the support arms are further designed so that they have a high bending stiffness between the respective solid joints.
  • the width of the transducer holder and also of the support arms is determined by the width of the transducer. This is necessary because the ultrasound transducer extends transversely through the transducer receptacle and the bonding tool is fastened to the transducer at a distance from it.
  • the bonding force required for wire bonding must under no circumstances lead to a twisting of the transducer receptacles, but it must be ensured that the bonding tool is largely only moved along the Z axis.
  • the slight parallel displacement of the transducer in the X direction which is inevitably caused by the parallel guidance, is not critical since after the touch-down of the bonding tool, no subsequent movement is required.
  • the required bonding force is only generated by the corresponding electrical control of the drive device.
  • a further development of the invention according to the invention is characterized in that the clamping device surrounds the ultrasound transducer in a positive and non-positive manner, which enables simple assembly.
  • the clamping device is preferably provided with a bore for receiving the ultrasound transducer, in which a plurality of receiving elements are regularly distributed. These receiving elements are designed as mating surfaces which at least partially enclose the ultrasound transducer in a form-fitting manner.
  • a recess running transversely to the bore and approximately to the center of the bore is machined into the clamping device.
  • the parts of the clamping device located next to the recess can thus be braced against one another with a tensioning device, which at the same time leads to the transducer being securely clamped.
  • the clamping device preferably consists of a clamping screw running parallel to the bore.
  • a further embodiment of the invention is characterized in that a coupling element protruding inwards between the support arms for coupling the drive device protrudes from the clamping device.
  • the drive device preferably consists of a voice coil drive with which the required actuating forces in the Z direction can be exerted in a finely metered manner on the clamping device.
  • the base part of the voice coil drive which is provided with a coil, is fastened to the bonding head and its actuator, which is designed as a magnetic actuator, is connected to the coupling element.
  • a distance sensor is furthermore arranged on the bonding head, which is directed towards the clamping device.
  • An ultrasonic wire bonding device designed according to the invention has further advantages over the solutions known from the prior art. This means that the otherwise necessary repositioning movement after the bonding tool has been placed on the bonding point can be dispensed with. The deformation path required for bonding can be traversed from the rest position of the transducer. The electrical control of the Voce-Coil drive is used for this. This means an additional time saving per bonding process, which is approx. 20 ms.
  • FIG. 1 shows a front view of the ultrasonic wire bonding device with a transducer holder according to the invention arranged on a bonding head;
  • FIG. 2 shows a side view, partly in section, of the ultrasonic wire bonding device according to FIG. 1;
  • Fig. 3 is a perspective view of the transducer holder with a transducer attached to it with an ultrasonic vibration generator and a bonding tool.
  • Fig. 5 is a plan view of the transducer holder.
  • a bonding head 1 which is fastened to an ultrasonic wire bonder so that it can be rotated and displaced vertically in the Z direction.
  • a cantilever 2 which projects vertically downward outside the axis of rotation and which is firmly connected to the bondhead 1.
  • This cantilever 2 serves to receive a transducer receptacle 3, to which a transducer 4 with a bonding tool 5 attached thereto and an associated ultrasonic oscillator 6 are detachably attached.
  • the transducer receptacle 3 contains a clamping device 7 for receiving the transducer 4 and a fastening block 8 with which the transducer receptacle 3 is fastened to the bracket 2 with the aid of a screw connection 9. Between the clamping device 7 and the fastening block 8, the transducer receptacle 3 contains a parallel guide, consisting of two support arms 10 arranged at a distance from one another. These support arms 10 are each connected to the clamping device 7 or the fastening block 8 via a solid-state joint 11. The attachment of the transducer receptacle 3 with the mounting block 8 to the arm 2 is carried out in such a way that the clamping device 7 can be moved up or down in the Z direction against the spring force of the solid body joints 11.
  • transducer holder 3 The special characteristic of the transducer holder 3 can be seen in the fact that it includes the clamping device 7, the Support arms 10, the solid joints 11 and the mounting block 8 is integrally formed. This assembly can be mounted on the cantilever 2 in a few simple steps and without any special adjustment effort, which significantly increases the ease of servicing of the entire bond head.
  • the clamping device 7 contains a bore 12 for receiving the ultrasound transducer 4.
  • this bore 12 three receiving elements 13 are arranged regularly distributed on the surface of the bore, which are each formed as a mating surface 14. These mating surfaces 14 enclose the ultrasound transducer 4 at least partially in a form-fitting manner.
  • the clamping device 7 is provided with a recess 15 which extends transversely to the bore 12 and approximately to the center of the bore, as can be seen clearly from FIGS. 3, 5.
  • the clamping parts 16, 17 of the clamping device 7 located next to the recess 15 can thus be clamped against one another with the aid of a clamping device.
  • the clamping device used in the exemplary embodiment consists of a clamping screw 18 arranged parallel to the bore 12.
  • This clamping screw 18 is screwed into a threaded bore in the left part 16 of the clamping device 7 next to the recess 15 and extends through a bore in the other part 18, so that through Turning the clamping screw 18 can produce a clamping force acting on the transducer 4. It is understood that only a slight tensioning of the clamping parts 16, 17 in the elastic range is required for a sufficient clamping force. A prerequisite for this, however, is a sufficiently precise fit between the transducer 4 and the receiving elements 13, so that the transducer 4 can be pushed tightly into the tensioning device when it is relaxed.
  • a drive device which in the present exemplary embodiment consists of a voce-coil drive 19.
  • This voice coil drive 18 contains a base part 20, which is fastened to the bondhead 1 directly above the clamping device 7 and a magnetic actuator 21.
  • This magnetic actuator 21 acts directly on the clamping device 7, which thus acts with the magnetic actuator 21 in the Z direction can be moved away from or in the direction of the bondhead 1.
  • a coupling element 22 protrudes inward from the latter, to which the actuator 21 is laterally attached by a screw connection 23.
  • a distance sensor 24 is also provided, which is directed towards an outer surface of the clamping device 7. The relative position of the transducer 4 relative to the bonding head 1 can thus be measured.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

The invention relates to an ultrasonic wire bonding device comprising a bonding head (1) which can be displaced in a Z direction and which can be rotated. An ultrasonic transducer (4) provided with an allocated bonding tool (5) and an ultrasonic vibration generator (6) is fixed to said bonding head by means of a transducer holding fixture (3). The transducer holding fixture (3) is configured as a parallel guide which is elastic in a Z direction and which is articulated at four points. A drive device (21) is provided between the bonding head (1) and the transducer holding fixture (3) in order to displace the transducer holding fixture (3), relative to the bonding head (1), in a Z direction. The invention enables the creation of an ultrasonic wire bonding device which is equipped with a transducer holding fixture and which comprises a particularly simple construction, can be economically manufactured, and can be easily and quickly installed. According to the invention, the transducer holding fixture (3) is worked from a piece and comprises a clamping device (7) for the ultrasonic transducer (4), a fixing block (8) for fixing the transducer holding fixture (3) to the bonding head (1) and has solid body joints (11).

Description

Ultraschall-Drahtbondeinrichtung Ultrasonic wire bonding device
Die Erfindung betrifft eine Ultraschall-Drahtbondeinrichtung mit einem in Z-Richtung verfahrbaren und drehbaren Bondkopf, an dem mittels einer Transduceraufnahme ein Ultraschall-Transducer mit einem zugehörigen Bondwerkzeug und einem Ultraschall-Schwingungserzeuger befestigt ist, wobei die Transduceraufnahme als in Z-Richtung federelastische Parallel- führung ausgebildet ist und wobei zwischen dem Bondkopf und der Transduceraufnahme eine Antriebsvorrichtung vorgesehen ist, um die Transduceraufnahme in Z-Richtung relativ zum Bondkopf zu bewegen.The invention relates to an ultrasound wire bonding device with a bond head that can be moved and rotated in the Z direction and to which an ultrasound transducer with an associated bonding tool and an ultrasound oscillation generator is attached by means of a transducer receptacle, the transducer receptacle being designed as a spring-elastic parallel in the Z direction. is formed guide and wherein a drive device is provided between the bondhead and the transducer receptacle to move the transducer receptacle in the Z direction relative to the bondhead.
Derartige Ultraschall-Drahtbondvorrichtungen werden für die Montage von Halbleiterbauelementen benötigt und dienen zur Herstellung von Drahtbrücken, beispielsweise zwischen Bondinseln auf Halbleiterchips und Kontaktinseln auf einem Trägerelement auf dem das Halbleiterbauelement vorher montiert wor- den ist. Die für das Ultraschall-Drahtbonden benötigte Ultraschallenergie wird durch einen Ultraschall-Schwingungserzeuger bereitgestellt und über einen Ultraschall-Transducer an ein daran befestigtes Bondwerkzeug übertragen. Diese Bondeinheit ist üblicherweise so an einem in Z-Richtung verfahr- baren und drehbaren Bondkopf befestigt, daß das Bondwerkzeug gegenüber dem Bondkopf in Z-Richtung bewegbar ist. Diese Bewegung des Bondwerkzeuges wird dadurch erreicht, daß der Transducer um eine horizontale Achse verschwenkbar am Bondkopf angeordnet ist. Auch besteht die Möglichkeit, die Bondeinheit in einer Vertikalführung am Bondkopf anzuordnen.Ultrasonic wire bonding devices of this type are required for the assembly of semiconductor components and are used to produce wire bridges, for example between bonding pads on semiconductor chips and contact pads on a carrier element on which the semiconductor component has been mounted beforehand. The ultrasonic energy required for ultrasonic wire bonding is provided by an ultrasonic vibration generator and transmitted to an attached bond tool via an ultrasonic transducer. This bond unit is usually attached to a rotatable and rotatable bond head in the Z direction such that the bond tool can be moved in the Z direction relative to the bond head. This movement of the bonding tool is achieved in that the transducer is arranged on the bonding head so as to be pivotable about a horizontal axis. It is also possible to arrange the bonding unit in a vertical guide on the bonding head.
Aus der DE 40 16 720 AI ist beispielsweise eine Vorrichtung bekannt geworden, bei welcher eine aus Ultraschall-Schwingungserzeuger, Transducer und Bondwerkzeug bestehende Bond- einheit über eine vierarmige Halterung am Bondkopf befestigt ist. Diese vierarmige Halterung wird durch eine obere und eine untere Platte gebildet, die Verlängerungsarme der vierarmigen Halterung darstellen. Weiterhin sind flexible, blattfederför- mige Verbindungselemente vorgesehen, welche die Platten mit dem Bondkopf einerseits und mit einer Aufnahme für den Transducer andererseits verbinden. Durch diese Halterung kann der Transducer in Z-Richtung gegenüber dem Bondkopf verlagert werden.From DE 40 16 720 AI, for example, a device has become known in which a bonding unit consisting of ultrasound vibration generator, transducer and bonding tool is attached to the bonding head via a four-armed bracket. This four-armed bracket is formed by an upper and a lower plate, which are extension arms of the four-armed bracket. Furthermore, flexible, leaf spring Mige connecting elements are provided, which connect the plates with the bonding head on the one hand and with a receptacle for the transducer on the other. With this holder, the transducer can be moved in the Z direction relative to the bondhead.
Um die für den Ultraschallbondvorgang notwendige Bondkraft erzeugen zu können, befindet sich zwischen dem Bondkopf und der oberen Platte der vierarmigen Halterung eine Druckfeder und zusätzlich ein elektromagnetischer Antrieb.In order to be able to generate the bonding force necessary for the ultrasound bonding process, there is a compression spring between the bonding head and the upper plate of the four-armed holder and an additional electromagnetic drive.
Bei derartigen Bondeinrichtungen, bei denen die Ruhelage ihres Transducers durch einen einstellbaren Festanschlag vorgegeben ist, muß eine Nachsetzbewegung erzeugt werden, um beim Bond- Vorgang einen Verformungsweg durchlaufen zu können. Die Nachsetzbewegung muß dabei mindestens so groß sein, wie der Verformungsweg des zu bondenden Drahtes, damit der Transducer während des Bodvorganges seine Ruhelage nicht erreichen kann.In such bonding devices, in which the rest position of their transducer is predetermined by an adjustable fixed stop, a subsequent movement must be generated in order to be able to traverse a deformation path during the bonding process. The repositioning movement must be at least as large as the deformation path of the wire to be bonded so that the transducer cannot reach its rest position during the flooring process.
Eine derartige Vorrichtung besteht aus einer Vielzahl von Bauteilen, so daß der Montagevorgang sehr aufwendig ist. Insbesondere ist der Aufbau der vierarmigen Halterung sehr kompliziert, was sich insbesondere im Falle einer notwendigen Reparatur, beispielsweise beim Bruch einer der Federn, als sehr nachteilig erweist.Such a device consists of a large number of components, so that the assembly process is very complex. In particular, the construction of the four-armed bracket is very complicated, which proves to be very disadvantageous in particular in the event of a necessary repair, for example if one of the springs breaks.
Der Erfindung liegt daher die Aufgabe zugrunde, eine Ultraschall-Drahtbondeinrichtung mit einer Transduceraufnahme zu schaffen, die einen besonders einfachen Aufbau besitzt, ko- stengünstig gefertigt werden kann und die eine einfache und schnelle Montage erlaubt.The invention is therefore based on the object of creating an ultrasonic wire bonding device with a transducer holder which has a particularly simple structure, can be produced at low cost and which allows simple and quick assembly.
Die der Erfindung zugrundeliegende Aufgabenstellung wird bei einer Ultraschall-Drahtbondvorrichtung der eingangs genannten Art dadurch gelöst, daß die Transduceraufnahme als aus einem Stück gearbeitete Parallelführung ausgebildet ist und eine Klemmvorrichtung für den Ultraschall-Transducer, einen Befestigungsblock zur Befestigung der Transduceraufnahme am Bondkopf sowie Festkörpergelenke umfaßt.The object on which the invention is based is achieved in an ultrasonic wire bonding device of the type mentioned at the outset in that the transducer holder is designed as a parallel guide made from one piece and a clamping device for the ultrasonic transducer, a fastening block for fastening the transducer holder on Bond head and solid joints.
Durch eine derartig ausgestaltete Ultraschall-Drahtbondvorrichtung wird eine besonders einfache Transduceraufnahme ge- schaffen, die insbesondere auch im Servicefall eine leichte und schnelle Montage der Drahtbondeinrichtung am Bondkopf ermöglicht. Der wesentliche Vorteil dieser Lösung ist jedoch darin zu sehen, daß der Transducer nunmehr nach dem Aufsetzen auf der Bondstelle aus der Ruhelage heraus bewegt werden kann, wobei entweder ein vorgegebenes Verformungsprofil durchlaufen werden kann, oder die Bondkraft geregelt werden kann.An ultrasound wire bonding device designed in this way creates a particularly simple transducer receptacle, which, particularly in the case of servicing, enables the wire bonding device to be mounted easily and quickly on the bonding head. The main advantage of this solution is, however, that the transducer can now be moved out of the rest position after being placed on the bond site, it being possible either to run through a predetermined deformation profile or to regulate the bond force.
Weiterhin wird durch die Erfindung eine Ultraschall-Drahtbondvorrichtung mit einer vollkommen wartungsfreien Transducerauf- nähme geschaffen, bei der das Arbeiten auf mechanische Anschläge nicht erforderlich ist. Das hat zur Folge, daß auf die sonst erforderlichen Beruhigungszeiten und Nachsetzbewegungen verzichtet werden kann.Furthermore, the invention provides an ultrasonic wire bonding device with a completely maintenance-free transducer holder, in which it is not necessary to work on mechanical stops. The consequence of this is that the otherwise necessary calming times and repositioning movements can be dispensed with.
In Fortführung der Erfindung weist die Transduceraufnahme zwischen der Klemmvorrichtung und dem Befestigungsblock ein übersetzendes Parallelogramm auf, welches die Festkörpergelenke einschließt, d.h. es wird eine Viergelenkkette mit Festkörpergelenken realisiert. Damit sind sämtliche bewegbaren Ele- mente einschließlich der zugehörigen Befestigungselemente in einer einstückigen Baugruppe zusammengefaßt, die beispielsweise durch Erodieren oder Laserschneiden hergestellt werden kann.In continuation of the invention, the transducer receptacle between the clamping device and the fastening block has a translating parallelogram which includes the solid-state joints, i.e. a four-link chain with solid-state joints is implemented. All movable elements, including the associated fastening elements, are thus combined in a one-piece assembly, which can be produced, for example, by eroding or laser cutting.
Im Interesse einer ausreichenden Systemsteifigkeit in X- und Y-Richtung besteht das übersetzende Parallelogramm aus zwei parallel zueinander verlaufenden Tragarmen, in denen am Übergang zur Klemmvorrichtung bzw. zum Befestigungsblock jeweils ein Festkörpergelenk eingearbeitet ist. Zu diesem Zweck sind die Tragarme weiterhin so ausgestaltet, daß diese zwischen den jeweiligen Festkörpergelenken eine hohe Biegesteifigkeit aufweisen. Um die Masse der Transduceraufnahme auf ein Minimun zu beschränken und dennoch eine ausreichende Verwindungssteifigkeit zu erreichen, wird die Breite der Transduceraufnahme und auch der Tragarme durch die Breite des Transducers bestimmt. Das ist notwendig, da sich der Ultraschalltransducer in Querrichtung durch die Transduceraufnahme erstreckt und das Bondwerkzeug in einem Abstand zur Einspannstelle des Transducers an diesem befestigt ist. Die für das Drahtbonden notwendige Bondkraft darf in keinem Fall zu einem Verwinden der Transducer- aufnähme führen, sondern es muß sichergestellt sein, daß das Bondwerkzeug weitgehend nur entlang der Z-Achse bewegt wird. Die durch die Parallelführung zwangsläufig bedingte geringfügige Parallelverlagerung des Transducers in X-Richtung ist dabei unkritisch, da nach dem Touch-Down des Bondwerkzeuges keine Nachsetzbewegung mehr erforderlich ist. Die benötigte Bondkraft wird nur durch die entsprechende elektrische An- steuerung der Antriebsvorrichtung erzeugt.In the interest of sufficient system rigidity in the X and Y directions, the translating parallelogram consists of two support arms running parallel to each other, in each of which a solid-state joint is incorporated at the transition to the clamping device or the fastening block. For this purpose, the support arms are further designed so that they have a high bending stiffness between the respective solid joints. In order to limit the mass of the transducer holder to a minimum and still achieve sufficient torsional rigidity, the width of the transducer holder and also of the support arms is determined by the width of the transducer. This is necessary because the ultrasound transducer extends transversely through the transducer receptacle and the bonding tool is fastened to the transducer at a distance from it. The bonding force required for wire bonding must under no circumstances lead to a twisting of the transducer receptacles, but it must be ensured that the bonding tool is largely only moved along the Z axis. The slight parallel displacement of the transducer in the X direction, which is inevitably caused by the parallel guidance, is not critical since after the touch-down of the bonding tool, no subsequent movement is required. The required bonding force is only generated by the corresponding electrical control of the drive device.
Eine weitere erfindungsgemäße Fortbildung der Erfindung ist dadurch gekennzeichnet, daß die Klemmvorrichtung den Ultraschall-Transducer form- und kraftschlüssig umgibt, wodurch eine einfache Montage ermöglicht wird.A further development of the invention according to the invention is characterized in that the clamping device surrounds the ultrasound transducer in a positive and non-positive manner, which enables simple assembly.
Die Klemmvorrichtung ist bevorzugt mit einer Bohrung zur Auf- nähme des Ultraschall-Transducers versehen, in der mehrere Aufnahmeelemente regelmäßig verteilt angeordnet sind. Diese Aufnahmeelemente sind als Paßflächen ausgebildet, die den Ultraschall-Transducer zumindest teilweise formschlüssig umschließen.The clamping device is preferably provided with a bore for receiving the ultrasound transducer, in which a plurality of receiving elements are regularly distributed. These receiving elements are designed as mating surfaces which at least partially enclose the ultrasound transducer in a form-fitting manner.
Um eine sichere und feste Klemmung des Transducers zu ermöglichen, ist in die Klemmvorrichtung eine quer zur Bohrung und etwa bis zur Bohrungsmitte verlaufende Ausnehmung eingearbeitet. Damit können die sich neben der Ausnehmung befindlichen Teile der Klemmvorrichtung mit einer Spanneinrichtung gegeneinander verspannt werden, was gleichzeitig dazu führt, daß der Transducer sicher geklemmt wird. Bevorzugt besteht die Spanneinrichtung aus einer parallel zur Bohrung verlaufenden Spannschraube.In order to enable safe and firm clamping of the transducer, a recess running transversely to the bore and approximately to the center of the bore is machined into the clamping device. The parts of the clamping device located next to the recess can thus be braced against one another with a tensioning device, which at the same time leads to the transducer being securely clamped. The clamping device preferably consists of a clamping screw running parallel to the bore.
Um weiterhin eine besonders einfache Ankopplung der Antriebs- Vorrichtung zu ermöglichen, ist eine weitere Ausgestaltung der Erfindung dadurch gekennzeichnet, daß aus der Klemmvorrichtung ein einwärts zwischen die Tragarme reichendes Koppelelement zur Ankopplung der Antriebsvorrichtung hervorsteht.In order to enable a particularly simple coupling of the drive device, a further embodiment of the invention is characterized in that a coupling element protruding inwards between the support arms for coupling the drive device protrudes from the clamping device.
Die Antriebsvorrichtung besteht bevorzugt aus einem Voice- Coil-Antrieb, mit dem die erforderlichen Stellkräfte in Z- Richtung fein dosiert auf die Klemmeinrichtung ausgeübt werden können. Der mit einer Spule versehene Basisteil des Voice- Coil-Antriebes ist am Bondkopf befestigt und dessen als Mag- netaktor ausgebildeter Aktor mit dem Koppelelement verbunden.The drive device preferably consists of a voice coil drive with which the required actuating forces in the Z direction can be exerted in a finely metered manner on the clamping device. The base part of the voice coil drive, which is provided with a coil, is fastened to the bonding head and its actuator, which is designed as a magnetic actuator, is connected to the coupling element.
Um die aktuelle Position des Transducers bzw. des Bondwerkzeuges in Z-Richtung relativ zum Bondkopf ständig aktuell erfassen zu können, ist am Bondkopf weiterhin ein Abstandssensor angeordnet, der auf die Klemmvorrichtung gerichtet ist.In order to be able to continuously record the current position of the transducer or of the bonding tool in the Z direction relative to the bonding head, a distance sensor is furthermore arranged on the bonding head, which is directed towards the clamping device.
Eine erfindungsgemäß ausgestaltete Ultraschall-Drahtbondvorrichtung besitzt gegenüber den aus dem Stand der Technik bekannten Lösungen weitere Vorteile. So kann die ansonsten not- wendige Nachsetzbewegung nach dem Aufsetzen des Bondwerkzeuges auf die Bondstelle entfallen. Der zum Bonden notwendige Verformungsweg kann nämlich aus der Ruhelage des Transducers durchlaufen werden. Hierzu dient die elektrische Ansteuerung des Voce-Coil-Antriebes . Das bedeutet pro Bondvorgang eine weitere Zeiteinsparung, die bei ca. 20 ms liegt.An ultrasonic wire bonding device designed according to the invention has further advantages over the solutions known from the prior art. This means that the otherwise necessary repositioning movement after the bonding tool has been placed on the bonding point can be dispensed with. The deformation path required for bonding can be traversed from the rest position of the transducer. The electrical control of the Voce-Coil drive is used for this. This means an additional time saving per bonding process, which is approx. 20 ms.
Die Erfindung soll nachfolgend an einem Ausführungsbeispiel näher erläutert werden. In den zugehörigen Zeichnungen zeigen:The invention will be explained in more detail using an exemplary embodiment. In the accompanying drawings:
Fig. 1 eine Vorderansicht der Ultraschall-Drahtbondvorrichtung mit einer an einem Bondkopf angeordneten erfindungsgemäßen Transduceraufnahme ; Fig. 2 eine teilweise im Schnitt dargestellte Seitenansicht der Ultraschall-Drahtbondvorrichtung nach Fig. 1;1 shows a front view of the ultrasonic wire bonding device with a transducer holder according to the invention arranged on a bonding head; FIG. 2 shows a side view, partly in section, of the ultrasonic wire bonding device according to FIG. 1;
Fig. 3 eine perspektivische Darstellung der Transduceraufnahme mit einem an dieser befestigten Transducer mit einem Ultraschall-Schwingungserzeuger und einem Bondwerkzeug.Fig. 3 is a perspective view of the transducer holder with a transducer attached to it with an ultrasonic vibration generator and a bonding tool.
Fig. 4 eine Seitenansicht der Transduceraufnahme; und4 shows a side view of the transducer holder; and
Fig. 5 eine Draufsicht auf die Transduceraufnahme.Fig. 5 is a plan view of the transducer holder.
In Fig. 1, 2 ist schematisch ein Bondkopf 1 dargestellt, der drehbar und vertikal in Z-Richtung verschiebbar an einem Ul- traschall-Drahtbonder befestigt ist. An dem Bondkopf 1 befindet sich außerhalb der Drehachse ein senkrecht nach unten ragender Ausleger 2, der mit dem Bondkopf 1 fest verbunden ist. Dieser Ausleger 2 dient zur Aufnahme einer Transduceraufnahme 3, an der ein Transducer 4 mit einem daran befestigten Bondwerkzeug 5 und ein zugehöriger Ultraschall-Schwinger 6 lösbar befestigt sind.1, 2 schematically shows a bonding head 1 which is fastened to an ultrasonic wire bonder so that it can be rotated and displaced vertically in the Z direction. On the bondhead 1 there is a cantilever 2 which projects vertically downward outside the axis of rotation and which is firmly connected to the bondhead 1. This cantilever 2 serves to receive a transducer receptacle 3, to which a transducer 4 with a bonding tool 5 attached thereto and an associated ultrasonic oscillator 6 are detachably attached.
Die Transduceraufnahme 3 enthält eine Klemmvorrichtung 7 zur Aufnahme des Transducers 4 und einen Befestigungsblock 8, mit dem die Transduceraufnahme 3 mit Hilfe einer Schraubverbindung 9 am Ausleger 2 befestigt ist. Zwischen der Klemmvorrichtung 7 und dem Befestigungsblock 8 enthält die Transduceraufnahme 3 eine Parallelführung, bestehend aus zwei im Abstand zueinander angeordneten Tragarmen 10. Diese Tragarme 10 sind je- weils über ein Festkörpergelenk 11 mit der Klemmvorrichtung 7 bzw. dem Befestigungsblock 8 verbunden. Die Befestigung der Transduceraufnahme 3 mit dem Befestigungsblock 8 am Ausleger 2 erfolgt dabei derart, daß die Klemmvorrichtung 7 entgegen der Federkraft der Festkörpergelenke 11 in Z-Richtung auf- oder abwärts bewegt werden kann.The transducer receptacle 3 contains a clamping device 7 for receiving the transducer 4 and a fastening block 8 with which the transducer receptacle 3 is fastened to the bracket 2 with the aid of a screw connection 9. Between the clamping device 7 and the fastening block 8, the transducer receptacle 3 contains a parallel guide, consisting of two support arms 10 arranged at a distance from one another. These support arms 10 are each connected to the clamping device 7 or the fastening block 8 via a solid-state joint 11. The attachment of the transducer receptacle 3 with the mounting block 8 to the arm 2 is carried out in such a way that the clamping device 7 can be moved up or down in the Z direction against the spring force of the solid body joints 11.
Das besondere Kennzeichen der Transduceraufnahme 3 ist darin zu sehen, daß diese einschließlich der Klemmvorrichtung 7, der Tragarme 10, der Festkörpergelenke 11 und des Befestigungsblockes 8 einstückig ausgebildet ist. Damit läßt sich diese Baugruppe mit wenigen Handgriffen und ohne besonderen Einstellaufwand am Ausleger 2 montieren, was die Servicefreundlich- keit des gesamten Bondkopfes wesentlich erhöht.The special characteristic of the transducer holder 3 can be seen in the fact that it includes the clamping device 7, the Support arms 10, the solid joints 11 and the mounting block 8 is integrally formed. This assembly can be mounted on the cantilever 2 in a few simple steps and without any special adjustment effort, which significantly increases the ease of servicing of the entire bond head.
Wie aus den Fig. 1 bis 3 und insbesondere Fig. 4 weiterhin ersichtlich ist, enthält die Klemmvorrichtung 7 eine Bohrung 12 zur Aufnahme des Ultraschall-Transducers 4. In dieser Boh- rung 12 sind auf der Bohrungsmantelfläche drei Aufnahmeelemente 13 regelmäßig verteilt angeordnet, die jeweils als Paßfläche 14 ausgebildet sind. Diese Paßflächen 14 umschließen den Ultraschall-Transducer 4 zumindest teilweise formschlüssig .As can also be seen from FIGS. 1 to 3 and in particular FIG. 4, the clamping device 7 contains a bore 12 for receiving the ultrasound transducer 4. In this bore 12, three receiving elements 13 are arranged regularly distributed on the surface of the bore, which are each formed as a mating surface 14. These mating surfaces 14 enclose the ultrasound transducer 4 at least partially in a form-fitting manner.
Um eine sichere Klemmung des Transducers 4 zu erreichen, ist die Klemmvorrichtung 7 mit einer quer zur Bohrung 12 und etwa bis zur Bohrungsmitte verlaufenden Ausnehmung 15 versehen, wie dies aus Fig. 3, 5 gut ersichtlich ist. Damit können die sich neben der Ausnehmung 15 befindenden Spannteile 16, 17 der Klemmvorrichtung 7 mit Hilfe einer Spannvorrichtung gegeneinander verspannt werden. Die im Ausführungsbeispiel verwendete Spanneinrichtung besteht aus einer parallel zur Bohrung 12 angeordneten Spannschraube 18. Diese Spannschraube 18 ist in eine Gewindebohrung im zeichnungsgemäß linken Teil 16 der Klemmvorrichtung 7 neben der Ausnehmung 15 eingeschraubt und erstreckt sich durch eine Bohrung im anderen Teil 18, so daß durch Verdrehen der Spannschraube 18 eine auf den Transducer 4 einwirkende Spannkraft erzeugt werden kann. Es versteht sich, daß für eine genügende Spannkraft nur eine geringfügige Verspannung der Spannteile 16, 17 im elastischen Bereich erforderlich ist. Voraussetzung hierfür ist allerdings eine ausreichend genaue Passung zwischen dem Transducer 4 und den Aufnahmeelementen 13, so daß der Transducer 4 im entpannten Zustand der Spanneinrichtung straff in diese eingeschoben werden kann.In order to achieve a secure clamping of the transducer 4, the clamping device 7 is provided with a recess 15 which extends transversely to the bore 12 and approximately to the center of the bore, as can be seen clearly from FIGS. 3, 5. The clamping parts 16, 17 of the clamping device 7 located next to the recess 15 can thus be clamped against one another with the aid of a clamping device. The clamping device used in the exemplary embodiment consists of a clamping screw 18 arranged parallel to the bore 12. This clamping screw 18 is screwed into a threaded bore in the left part 16 of the clamping device 7 next to the recess 15 and extends through a bore in the other part 18, so that through Turning the clamping screw 18 can produce a clamping force acting on the transducer 4. It is understood that only a slight tensioning of the clamping parts 16, 17 in the elastic range is required for a sufficient clamping force. A prerequisite for this, however, is a sufficiently precise fit between the transducer 4 and the receiving elements 13, so that the transducer 4 can be pushed tightly into the tensioning device when it is relaxed.
Damit die Klemmvorrichtung 7 in Z-Richtung gegenüber dem Bond- köpf bewegt werden kann, um beispielsweise die erforderliche Bondkraft auf einen zu bondenden Draht ausüben zu können, ist eine Antriebsvorrichtung vorgesehen, die im vorliegenden Ausführungsbeispiel aus einem Voce-Coil-Antrieb 19 besteht. Die- ser Voice-Coil-Antrieb 18 enthält ein Basisteil 20, welches am Bondkopf 1 direkt über der Klemmvorrichtung 7 befestigt ist und einem Magnetaktor 21. Dieser Magnetaktor 21 wirkt unmittelbar auf die Klemmvorrichtung 7, die damit mit dem Magnetaktor 21 in Z-Richtung vom Bondkopf 1 weg- oder in Richtung zu diesen hinbewegt werden kann. Die durch die Parallelführung zwangsläufig bedingte geringfügige Parallelverlagerung des Ultraschall-Transducers 4 in Y-Richtung ist dabei unproblematisch, da nach dem Touch-Down des Bondwerkzeuges 5 keine Nachsetzbewegung mehr notwendig ist, um den Freiraum für den zu durchlaufenden Verformungsweg zu schaffen. Die nötige Bondkraft kann nunmehr durch die entsprechende elektrische An- steuerung des Voice-Coil-Antriebes 19 erzeugt werden. Das bedeutet, daß es nunmehr möglich ist, die für den jeweiligen Bondvorgang benötigte Bondkraft mittels der ohnehin vorhande- nen Rechnersteuerung des Ultraschall-Drahtbonders zu programmieren. Da das Bondwerkzeug 5 während des Bondvorganges in den Bonddraht einsinkt, erfolgt der Bondvorgang unter ständiger Lageregelung des Bondwerkzeuges 5. Selbstverständlich ist es auch möglich, den Bondvorgang durch eine Bondkraftregelung zu steuern.So that the clamping device 7 in the Z direction with respect to the bond can be moved upside down, for example in order to be able to exert the required bonding force on a wire to be bonded, a drive device is provided, which in the present exemplary embodiment consists of a voce-coil drive 19. This voice coil drive 18 contains a base part 20, which is fastened to the bondhead 1 directly above the clamping device 7 and a magnetic actuator 21. This magnetic actuator 21 acts directly on the clamping device 7, which thus acts with the magnetic actuator 21 in the Z direction can be moved away from or in the direction of the bondhead 1. The slight parallel displacement of the ultrasound transducer 4 in the Y direction, which is inevitably caused by the parallel guidance, is unproblematic, since after the touch-down of the bonding tool 5, no subsequent movement is necessary to create the space for the deformation path to be traversed. The necessary bonding force can now be generated by the corresponding electrical control of the voice coil drive 19. This means that it is now possible to program the bonding force required for the respective bonding process by means of the computer control of the ultrasound wire bonder which is already present. Since the bonding tool 5 sinks into the bonding wire during the bonding process, the bonding process takes place under constant position control of the bonding tool 5. Of course, it is also possible to control the bonding process by means of a bonding force control.
Um den Magnetaktor 21 an der Klemmvorrichtung 7 befestigen zu können, steht aus dieser ein einwärts zwischen die Tragarme 10 reichendes Koppelelement 22 hervor, an dem der Aktor 21 seit- lieh durch eine Schraubverbindung 23 befestigt ist.In order to be able to fasten the magnetic actuator 21 to the clamping device 7, a coupling element 22 protrudes inward from the latter, to which the actuator 21 is laterally attached by a screw connection 23.
Für die Bestimmung der jeweils aktuellen Position des Transducers 3 bzw. des Bondwerkzeuges 5 in Z-Richtung relativ zum Bondkopf 1, ist weiterhin ein Abstandssensor 24 vorgesehen, der auf eine Außenfläche der Klemmvorrichtung 7 gerichtet ist. Damit kann die relative Position des Transducers 4 gegenüber dem Bondkopf 1 gemessen werden. TransduceraufnahmeIn order to determine the current position of the transducer 3 or the bonding tool 5 in the Z direction relative to the bonding head 1, a distance sensor 24 is also provided, which is directed towards an outer surface of the clamping device 7. The relative position of the transducer 4 relative to the bonding head 1 can thus be measured. Transducer holder
BezugszeichenlisteReference list
Bondkopf Ausleger Transduceraufnahme Ultraschall-Transducer Bondwerkzeug Ultraschall-Schwinger Klemmvorrichtung Befestigungsblock Schraubverbindung Tragarm Festkörpergelenk Bohrung Aufnahmeelement Paßfläche Ausnehmung Spannteil Spannteil Spannschraube Voice-Coil-Antrieb Basisteil Aktuator Koppelelement Schraubverbindung Abstandssensor Bonding head Boom Transducer holder Ultrasound transducer Bonding tool Ultrasonic transducer Clamp Fixing block Screw connection Support arm Solid joint Bore Mounting element Fitting surface Recess clamping part Clamping part Clamping screw Voice coil drive Base part Actuator Coupling element Screw connection Distance sensor

Claims

TransduceraufnahmePatentansprüche Transducer holder patent claims
1. Ultraschall-Drahtbondeinrichtung mit einem in Z-Richtung verfahrbaren und drehbaren Bondkopf, an dem mittels einer Transduceraufnahme ein Ultraschall-Transducer mit einem zugehörigen Bondwerkzeug und ein Ultraschall-Schwingungs- erzeuger befestigt ist, wobei die Transduceraufnahme als in Z-Richtung federelastische Parallelführung ausgebildet ist und wobei zwischen dem Bondkopf und der Transduceraufnahme eine Antriebsvorrichtung vorgesehen ist, um die Transduceraufnahme in Z-Richtung relativ zum Bondkopf zu bewegen, d a d u r c h g e k e n n z e i c h n e t, daß die Transduceraufnahme (3) aus einem Stück gearbeitet ist und eine Klemmvorrichtung (7) für den Ultraschall-Transducer (4), einen Befestigungsblock (8) zur Befestigung der Transduceraufnahme (3) am Bondkopf (1) sowie Festkörpergelenke (11) umfaßt.1. Ultrasonic wire bonding device with a movable and rotatable bond head in the Z direction, to which an ultrasonic transducer with an associated bonding tool and an ultrasonic vibration generator is attached by means of a transducer holder, the transducer holder being designed as a spring-elastic parallel guide in the Z direction and a drive device is provided between the bond head and the transducer receptacle in order to move the transducer receptacle in the Z direction relative to the bond head, characterized in that the transducer receptacle (3) is made in one piece and a clamping device (7) for the ultrasound Transducer (4), a mounting block (8) for attaching the transducer holder (3) to the bond head (1) and solid body joints (11).
2. Ultraschall-Drahtbondeinrichtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, daß die Transducerauf ahme (3) zwischen der Klemmvorrichtung (7) und dem Befestigungsblock (8) eine übersetzendes Parallelogramm mit einem Übersetzungsverhältnis von 1 : 1 aufweist, welches die Festkörpergelenke (11) einschließt.2. Ultrasonic wire bonding device according to claim 1, so that the transducer receptacle (3) between the clamping device (7) and the fastening block (8) has a translating parallelogram with a transmission ratio of 1: 1, which includes the solid-state joints (11).
3. Ultraschall-Drahtbondeinrichtung nach Anspruch 1 und 2, d a d u r c h g e k e n n z e i c h n e t, daß das übersetzende Parallelogramm zwei parallel zueinander verlaufenden Tragarmen (10) besteht, in denen am Übergang zur Klemmvorrichtung (7) bzw. zum Befestigungsblock (8) jeweils ein Festkörpergelenk (11) eingearbeitet ist.3. Ultrasonic wire bonding device according to claim 1 and 2, characterized in that the translating parallelogram consists of two mutually parallel support arms (10), in each of which a solid-state joint (11) is incorporated at the transition to the clamping device (7) or to the fastening block (8) is.
Ultraschall-Drahtbondeinrichtung nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t, daß die Tragarme (10) zwischen den jeweiligen Festkörpergelenken (11) eine hohe Biegesteifigkeit aufweisen.Ultrasonic wire bonding device according to claim 3, characterized in that the support arms (10) between the respective solid joints (11) have high bending stiffness.
5. Ultraschall-Drahtbondeinrichtung nach einem der Ansprüche 1 bis 4, d a d u r c h g e k e n n z e i c h n e t, daß die Breite der Tragarme (10) die Breite der gesamten Transduceraufnahme (3) bestimmt.5. Ultrasonic wire bonding device according to one of claims 1 to 4, d a d u r c h g e k e n n z e i c h n e t that the width of the support arms (10) determines the width of the entire transducer holder (3).
6. Ultraschall-Drahtbondeinrichtung nach einem der Ansprüche 1 bis 5, d a d u r c h g e k e n n z e i c h n e t, daß die Klemmvorrichtung (7) den Ultraschall-Transducer (4) form- und kraftschlüssig umgibt.6. Ultrasonic wire bonding device according to one of claims 1 to 5, d a d u r c h g e k e n n z e i c h n e t that the clamping device (7) surrounds the ultrasonic transducer (4) positively and non-positively.
7. Ultraschall-Drahtbondeinrichtung nach Anspruch 6, d a d u r c h g e k e n n z e i c h n e t, daß die Klemmvor- richtung (7) mit einer Bohrung (12) zur Aufnahme des Ul- traschall-Transducers (4) versehen ist, in der mehrere Aufnahmeelemente (13) regelmäßig verteilt angeordnet sind.7. Ultrasonic wire bonding device according to claim 6, characterized in that the clamping device (7) is provided with a bore (12) for receiving the ultrasonic transducer (4), in which a plurality of receiving elements (13) are arranged regularly distributed .
8. Ultraschall-Drahtbondeinrichtung nach Anspruch 7, d a - d u r c h g e k e n n z e i c h n e t, daß die Aufnahmeelemente (13) als Paßflächen (14) ausgebildet sind, die den Ultraschall-Transducer (4) zumindest teilweise formschlüssig umschließen.8. Ultrasonic wire bonding device according to claim 7, d a - d u r c h g e k e n n z e i c h n e t that the receiving elements (13) are designed as mating surfaces (14) which enclose the ultrasonic transducer (4) at least partially in a form-fitting manner.
9. Ultraschall-Drahtbondeinrichtung nach einem der Ansprüche 1 bis 8, d a d u r c h g e k e n n z e i c h n e t, daß die Klemmvorrichtung (7) eine quer zur Bohrung (12) und etwa bis zur Bohrungsmitte verlaufende Ausnehmung (15) aufweist .9. Ultrasonic wire bonding device according to one of claims 1 to 8, d a d u r c h g e k e n n z e i c h n e t that the clamping device (7) has a transverse to the bore (12) and approximately to the center of the bore recess (15).
10. Ultraschall-Drahtbondeinrichtung nach Anspruch 9, d a d u r c h g e k e n n z e i c h n e t, daß die sich neben der Ausnehmung (15) befindlichen Spannteile (16, 17) der Klemmvorrichtung (7) mit einer Spanneinrichtung gegen- einander verspannbar sind. 10. Ultrasonic wire bonding device according to claim 9, characterized in that the clamping parts (16, 17) of the clamping device (7) located next to the recess (15) can be clamped against one another with a clamping device.
11. Ultraschall-Drahtbondeinrichtung nach Anspruch 10, d a d u r c h g e k e n n z e i c h n e t, daß die Spanneinrichtung aus einer parallel zur Bohrung (12) verlaufenden Spannschraube (18) besteht.11. Ultrasonic wire bonding device according to claim 10, that the clamping device consists of a clamping screw (18) running parallel to the bore (12).
12. Ultraschall-Drahtbondeinrichtung nach einem der Ansprüche 1 bis 11, d a d u r c h g e k e n n z e i c h n e t, daß aus der Klemmvorrichtung (7) ein einwärts zwischen die Tragarme (10) reichendes Koppelelement (22) zur Ankopplung der Antriebsvorrichtung hervorsteht.12. Ultrasonic wire bonding device according to one of claims 1 to 11, d a d u r c h g e k e n n z e i c h n e t that from the clamping device (7) protrudes inwardly between the support arms (10) extending coupling element (22) for coupling the drive device.
13. Ultraschall-Drahtbondeinrichtung nach einem der Ansprüche 1 bis 12, d a d u r c h g e k e n n z e i c h n e t, daß die Antriebsvorrichtung aus einem Voice-Coil-Antrieb (19) besteht, dessen mit einer Spule versehener Basisteil (20) am Bondkopf (1) befestigt ist und dessen Aktor (21) mit dem Koppelelement (22) verbunden ist.13. Ultrasonic wire bonding device according to one of claims 1 to 12, characterized in that the drive device consists of a voice coil drive (19), the base part (20) provided with a coil is fastened to the bonding head (1) and the actuator ( 21) is connected to the coupling element (22).
14. Ultraschall-Drahtbondeinrichtung nach einem der Ansprüche 1 bis 13, d a d u r c h g e k e n n z e i c h n e t, daß am Bondkopf (1) ein Abstandssensor (24) angeordnet ist, der auf die Klemmvorrichtung (7) gerichtet ist. 14. Ultrasonic wire bonding device according to one of claims 1 to 13, d a d u r c h g e k e n n z e i c h n e t that a distance sensor (24) is arranged on the bonding head (1), which is directed to the clamping device (7).
PCT/DE2000/001434 1999-05-07 2000-05-08 Ultrasonic wire bonding device WO2000067944A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE10081207T DE10081207D2 (en) 1999-05-07 2000-05-08 Ultrasonic wire bonding device
AU56719/00A AU5671900A (en) 1999-05-07 2000-05-08 Ultrasonic wire bonding device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19921177.9 1999-05-07
DE19921177A DE19921177A1 (en) 1999-05-07 1999-05-07 Ultrasonic wire bonding device

Publications (1)

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WO2000067944A1 true WO2000067944A1 (en) 2000-11-16

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AU (1) AU5671900A (en)
DE (2) DE19921177A1 (en)
WO (1) WO2000067944A1 (en)

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US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

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Publication number Priority date Publication date Assignee Title
EP3269492A1 (en) 2016-07-15 2018-01-17 Telsonic Holding AG Apparatus for ultrasonic welding and sonotrode for such a device
DE212017000184U1 (en) 2016-07-15 2019-02-19 Telsonic Holding Ag Apparatus for ultrasonic welding and sonotrode for such a device

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US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator
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EP0864392A1 (en) * 1997-03-13 1998-09-16 F & K Delvotec Bondtechnik GmbH Bonding head

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US5060841A (en) * 1985-12-25 1991-10-29 Hitachi, Ltd. wire bonding method and apparatus and method of producing semiconductor device by use of wire bonding apparatus
DE3716786A1 (en) * 1986-05-20 1987-11-26 Shinko Denshi Kk SCALE WITH A FORCE FREQUENCY CONVERTER AS A LOAD SENSOR
US4976392A (en) * 1989-08-11 1990-12-11 Orthodyne Electronics Corporation Ultrasonic wire bonder wire formation and cutter system
US5169050A (en) * 1991-06-03 1992-12-08 General Scanning, Inc. Wire bonder with improved actuator
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EP0864392A1 (en) * 1997-03-13 1998-09-16 F & K Delvotec Bondtechnik GmbH Bonding head

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8129220B2 (en) 2009-08-24 2012-03-06 Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive
US8833418B2 (en) 2009-08-24 2014-09-16 The Hong Kong Polytechnic University Method and system for bonding electrical devices using an electrically conductive adhesive

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DE10081207D2 (en) 2001-10-18
AU5671900A (en) 2000-11-21

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