WO1999017364A1 - Chip-size package using a polyimide pcb interposer - Google Patents

Chip-size package using a polyimide pcb interposer Download PDF

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Publication number
WO1999017364A1
WO1999017364A1 PCT/US1998/020467 US9820467W WO9917364A1 WO 1999017364 A1 WO1999017364 A1 WO 1999017364A1 US 9820467 W US9820467 W US 9820467W WO 9917364 A1 WO9917364 A1 WO 9917364A1
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WO
WIPO (PCT)
Prior art keywords
chip
integrated circuit
circuit board
package
printed circuit
Prior art date
Application number
PCT/US1998/020467
Other languages
French (fr)
Inventor
Robert W. Warren
Original Assignee
Raytheon Company
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Company filed Critical Raytheon Company
Priority to CA002273223A priority Critical patent/CA2273223C/en
Publication of WO1999017364A1 publication Critical patent/WO1999017364A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Definitions

  • the present mvenuon relates generally to integrated circuit packages and methods, and more particularly, to a chip-size integrated circuit package formed using a polyimide p ⁇ nted circuit board mterposer.
  • the closest form of art to the present invention is a chip-size package made by a company called Tessera.
  • the Tessera chip-size package uses formed tape automated bonded (TAB 1 ) lead frames on a polyimide film.
  • TAB 1 tape automated bonded
  • chip size package designs are larger than the die itself. It would therefore be desirable to have a chip-size package that packages the integrated circuit chip within the internal surface area of the bare die.
  • the present invention provides for a chip-size package formed using a polyimide printed circuit board mterposer. It is believed that the present invention may be built for a lower cost than the Tessera or other p ⁇ or art chip-size package because the present invention has fewer processing steps and has a lower material cost. The present invention also uses more common and lower cost processing equipment than does the Tessera or other p ⁇ or art process.
  • the present invention converts a single, unpacKaged bare silicon chip into a packaged chip no larger in area than the bare chip
  • the present invention uses readily available p ⁇ nted circuit board materials and technology
  • This chip size packaging scheme of the present invention is novel in that it uses a low cost p ⁇ nted circuit board mterposer with exposed, lower layers incorporating wire bond pads.
  • the wire bond pads are sufficiently lower than the solder bumps on the top layer of the mterposer. and as such, wire bonds to the wire bond pads can be encapsulated without exceeding the height of the top p ⁇ nted circuit board layer which must remain flat for solde ⁇ ng.
  • the present invention conve ⁇ s a bare chip into a chip size package.
  • the chip size package may be assembled in a manner similar to surface mount devices which are soldered to p ⁇ nted circuit boards. Chip size packages, however, take up only 10-20% of the area of conventionally packaged chips fabricated as surface mount devices. Development of the chip size package of the present invention is an important step in achieving miniatunzauon of microelectronics. Most chip size packages are larger than the die itself. The present invention however, packages the chip within the internal surface area of the bare die. Because the present chip size package takes up no additional area than the bare die. it is believed to be the smallest two-dimensional integrated circuit package that has yet been developed.
  • the benefit of convening a bare die into a surface mount device is that it provides mechanical and environmental protection for the fragile silicon integrated circuit chip.
  • the present invention also conve ⁇ s a fine pitch pe ⁇ pheral pad integrated circuit into a packaged, courser pitch area array device, permitting it to be easily tested, burned in. and assembled to standard p ⁇ nted circuit boards using existing, common equipment used in the industry.
  • the ability to use 'known good" tested devices while uuhzing industry standard and accepted equipment and processes is a key element in obtaining the absolute lowest product cost.
  • the present invenuon permits silicon integrated circuits to be packaged in the smallest area possible, which is no larger than the size of the integrated circuit itself. Incorporating such low cost integrated circuit packages into va ⁇ ous microelectronic applications will provide for smaller product sizes, lower weight, and lower assembly and testing costs.
  • the present invention provides for a robust packaging structure that is suitable for a va ⁇ ety of commercial and military applications, including automotive electronics, for example.
  • Fig. la-lc illustrate formation ot a cmp-size integrated circuit package in accordance with the p ⁇ ncipies of the present invention.
  • Fig. 2 is a perspective view of a fully assembled chip-size integrated circuit package;
  • Fig. 3 illustrates the chip-size integrated circuit package assembled to a p ⁇ nted circuit board.
  • the chip-size integrated circuit package 10 comprises an integrated circuit chip 1 1. which may be a silicon integrated circuit chip 1 1. for example, having a plurality of pe ⁇ pherai bond pads 13.
  • the polyimide p ⁇ nted circuit board 14. or mterposer 14. is attached to the integrated circuit chip 1 1 using a layer of adhesive 12. such as a layer of epoxy adhesive 12, for example.
  • Fig. lb shows an assembled chip-size package 10 wherein the polyimide printed circuit board 14 is electrically attached to the integrated circuit chip 1 1 using a plurality of wire bonds 18 coupled between the respective pluralities of bond pads 13. 15. Refemng to Fig. lc. after the wire bonds 18 are tormed between the polyimide p ⁇ nted circuit board 14 and the integrated circuit chip 1 1. the wire bonds 18 are encapsulated using an encapsulant 17, such as flexible epoxy or silicone, for example.
  • an encapsulant 17 such as flexible epoxy or silicone, for example.
  • Fig. 2 is a perspective view of a fully assembled chip-size integrated circuit package 10.
  • the encapsulant 17 is shown in phantom.
  • the chip-size integrated circuit package 10 has the area array of solder bumps 16 exposed for reflow solde ⁇ ng.
  • Fig. 3 illustrates the chip-size integrated circuit package 10 of Fig. 2 assembled to a pnnted circuit board 21.
  • the p ⁇ nted circuit board 21 has an area array of solder bumps 22 that matches the area array of solder bumps 16 on the chip-size integrated circuit package 10.
  • the chip-size integrated circuit package 10 and the p ⁇ nted circuit board 21 are electrically connected together by reflowing the solder bumps 16. 22 to form the electrical interconnecuons therebetween.
  • the present invention provides for a chip-size package 10 formed using a polyimide pnnted circuit board mterposer 14. It is believed that the present invention may be built for a relatively low cost than p ⁇ or an chip-size packages because the present invention has fewer processing steps and has lower mate ⁇ al costs. The present invention also uses more common and lower cost processing equipment than is used to produce p ⁇ or an chip-size packages. The present invention converts a single, unpackaged bare integrated circuit chip
  • the present invention uses readily available p ⁇ nted circuit board materials and technology.
  • the chip size package 10 uses the low cost p ⁇ nted circuit board interposer 14 with exposed, lower layers having wire bond pads 13, 15.
  • the wire bond pads 13. 15 are sufficiently lower than the solder bumps 16 on top of the interposer 14, and therefore, wire bonds 18 to the wire bond pads 13, 15 are encapsulated without exceeding the height of the top p ⁇ nted circuit board 14 which must remain flat for soldering.
  • the present invention thus converts a bare chip 11 into a chip size package 10.
  • the chip size package 10 may be assembled in a manner similar to surface mount devices which are soldered to p ⁇ nted circuit boards.
  • the chip size package 10. however, takes up only 10-20% of the area of conventionally packaged chips 1 1 fabricated as surface mount devices.
  • the present invention packages the chip 11 within the internal surface area of the bare chip 11. Because the chip size package 10 takes up no additional area than the bare chip 11, it is believed to be the smallest two-dimensional integrated circuit package 10 that has yet been developed.
  • the chip size package 10 provides mechanical and environmental protection for the fragile integrated circuit chip 1 1.
  • the chip size package 10 also converts a fine pitch pe ⁇ pherai pad integrated circuit 1 1 into a packaged, courser pitch area array device, permitting it to be easily tested, burned in. and assembled to standard p ⁇ nted circuit boards 21 using existing, common equipment used in the industry.
  • the present invention permits integrated circuits to be packaged in the smallest area possible, which is no larger than area of the integrated circuit 11.
  • the chip size package 10 provides for a robust packaging structure that is suitable for a va ⁇ ety of commerci ⁇ il and military applications, including automotive electronics, for example.
  • a chip-size package formed using a polyimide p ⁇ nted circuit board interposer has been disclosed. It is to be understood that the described embodiment is merely illustrative of some of the many specific embodiments which represent applications of the p ⁇ ncipies of the present invention. Clearly, numerous and other arr.angements can be readily devised by those skilled in the an without depaning from the scope of the invention.

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

A chip-size package formed using a printed circuit board, preferably comprising polyimide. The chip-size package comprises an integrated circuit chip having a plurality of peripheral bond pads. The printed circuit board has a plurality of solder bumps formed on its top surface and a plurality of bond pads around its periphery. A layer of adhesive is used to secure the printed circuit board and the integrated circuit chip together. A plurality of wire bonds electrically connected between selected bond pads of the integrated circuit chip and the printed circuit board. An encapsulant encapsulates the wire bonds and bond pads of the integrated circuit chip and the printed circuit board.

Description

CHIP-SIZE PACKAGE USING A POLYIMIDE PCB INTERPOSER
BACKGROUND
The present mvenuon relates generally to integrated circuit packages and methods, and more particularly, to a chip-size integrated circuit package formed using a polyimide pπnted circuit board mterposer.
The closest form of art to the present invention is a chip-size package made by a company called Tessera. The Tessera chip-size package uses formed tape automated bonded (TAB1) lead frames on a polyimide film. t would be desirable to have a chip- size package that has fewer processing steps, is less expensive to build, and that employs commonly available processing equipment.
Furthermore, most chip size package designs are larger than the die itself. It would therefore be desirable to have a chip-size package that packages the integrated circuit chip within the internal surface area of the bare die.
Accordingly, it is an objective of the present invention to provide for an improved chip-size package formed using a polyimide pπnted circuit board mterposer.
SUMMARY OF THE INVENTION
To meet the above and other objectives, the present invention provides for a chip-size package formed using a polyimide printed circuit board mterposer. It is believed that the present invention may be built for a lower cost than the Tessera or other pπor art chip-size package because the present invention has fewer processing steps and has a lower material cost. The present invention also uses more common and lower cost processing equipment than does the Tessera or other pπor art process. The present invention converts a single, unpacKaged bare silicon chip into a packaged chip no larger in area than the bare chip The present invention uses readily available pπnted circuit board materials and technology This chip size packaging scheme of the present invention is novel in that it uses a low cost pπnted circuit board mterposer with exposed, lower layers incorporating wire bond pads. The wire bond pads are sufficiently lower than the solder bumps on the top layer of the mterposer. and as such, wire bonds to the wire bond pads can be encapsulated without exceeding the height of the top pπnted circuit board layer which must remain flat for soldeπng.
The present invention conveπs a bare chip into a chip size package. The chip size package may be assembled in a manner similar to surface mount devices which are soldered to pπnted circuit boards. Chip size packages, however, take up only 10-20% of the area of conventionally packaged chips fabricated as surface mount devices. Development of the chip size package of the present invention is an important step in achieving miniatunzauon of microelectronics. Most chip size packages are larger than the die itself. The present invention however, packages the chip within the internal surface area of the bare die. Because the present chip size package takes up no additional area than the bare die. it is believed to be the smallest two-dimensional integrated circuit package that has yet been developed. The benefit of convening a bare die into a surface mount device is that it provides mechanical and environmental protection for the fragile silicon integrated circuit chip. The present invention also conveπs a fine pitch peπpheral pad integrated circuit into a packaged, courser pitch area array device, permitting it to be easily tested, burned in. and assembled to standard pπnted circuit boards using existing, common equipment used in the industry The ability to use 'known good" tested devices while uuhzing industry standard and accepted equipment and processes is a key element in obtaining the absolute lowest product cost.
The present invenuon permits silicon integrated circuits to be packaged in the smallest area possible, which is no larger than the size of the integrated circuit itself. Incorporating such low cost integrated circuit packages into vaπous microelectronic applications will provide for smaller product sizes, lower weight, and lower assembly and testing costs. The present invention provides for a robust packaging structure that is suitable for a vaπety of commercial and military applications, including automotive electronics, for example.
BRIEF DESCRIPTION OF THE DRAWINGS
The vaπous features and advantages of the present invenuon may be more readily understood with reference to the following detailed description taken in conjunction with the accompanying drawings, wherein like reference numerals represent like structural elements, and in which:
Fig. la-lc illustrate formation ot a cmp-size integrated circuit package in accordance with the pπncipies of the present invention. Fig. 2 is a perspective view of a fully assembled chip-size integrated circuit package; and
Fig. 3 illustrates the chip-size integrated circuit package assembled to a pπnted circuit board.
DETAILED DESCRIPTION
Referπng to the drawing figures. Fig. la-lc illustrate formation of a chip-size integrated circuit package 10 in accordance with the pπncipies of the present invention. Referπng to Fig. la. the chip-size integrated circuit package 10 comprises an integrated circuit chip 1 1. which may be a silicon integrated circuit chip 1 1. for example, having a plurality of peπpherai bond pads 13. A pπnted circuit board 14, or mterposer 14, which is preferably compnsed of polyimide, is formed having a plurality of solder bumps 16 (or an area array of solder bumps 16) formed on a top surface, and a plurality of bond pads 15 around its peπphery. The polyimide pπnted circuit board 14. or mterposer 14. is attached to the integrated circuit chip 1 1 using a layer of adhesive 12. such as a layer of epoxy adhesive 12, for example.
Fig. lb shows an assembled chip-size package 10 wherein the polyimide printed circuit board 14 is electrically attached to the integrated circuit chip 1 1 using a plurality of wire bonds 18 coupled between the respective pluralities of bond pads 13. 15. Refemng to Fig. lc. after the wire bonds 18 are tormed between the polyimide pπnted circuit board 14 and the integrated circuit chip 1 1. the wire bonds 18 are encapsulated using an encapsulant 17, such as flexible epoxy or silicone, for example.
Fig. 2 is a perspective view of a fully assembled chip-size integrated circuit package 10. The encapsulant 17 is shown in phantom. The chip-size integrated circuit package 10 has the area array of solder bumps 16 exposed for reflow soldeπng. Fig. 3 illustrates the chip-size integrated circuit package 10 of Fig. 2 assembled to a pnnted circuit board 21. The pπnted circuit board 21 has an area array of solder bumps 22 that matches the area array of solder bumps 16 on the chip-size integrated circuit package 10. The chip-size integrated circuit package 10 and the pπnted circuit board 21 are electrically connected together by reflowing the solder bumps 16. 22 to form the electrical interconnecuons therebetween.
Thus, the present invention provides for a chip-size package 10 formed using a polyimide pnnted circuit board mterposer 14. It is believed that the present invention may be built for a relatively low cost than pπor an chip-size packages because the present invention has fewer processing steps and has lower mateπal costs. The present invention also uses more common and lower cost processing equipment than is used to produce pπor an chip-size packages. The present invention converts a single, unpackaged bare integrated circuit chip
11, for example, into a packaged chip 20 no larger in area than the bare chip 1 1. The present invention uses readily available pπnted circuit board materials and technology. The chip size package 10 uses the low cost pπnted circuit board interposer 14 with exposed, lower layers having wire bond pads 13, 15. The wire bond pads 13. 15 are sufficiently lower than the solder bumps 16 on top of the interposer 14, and therefore, wire bonds 18 to the wire bond pads 13, 15 are encapsulated without exceeding the height of the top pπnted circuit board 14 which must remain flat for soldering.
The present invention thus converts a bare chip 11 into a chip size package 10. The chip size package 10 may be assembled in a manner similar to surface mount devices which are soldered to pπnted circuit boards. The chip size package 10. however, takes up only 10-20% of the area of conventionally packaged chips 1 1 fabricated as surface mount devices.
The present invention packages the chip 11 within the internal surface area of the bare chip 11. Because the chip size package 10 takes up no additional area than the bare chip 11, it is believed to be the smallest two-dimensional integrated circuit package 10 that has yet been developed.
The chip size package 10 provides mechanical and environmental protection for the fragile integrated circuit chip 1 1. The chip size package 10 also converts a fine pitch peπpherai pad integrated circuit 1 1 into a packaged, courser pitch area array device, permitting it to be easily tested, burned in. and assembled to standard pπnted circuit boards 21 using existing, common equipment used in the industry.
The present invention permits integrated circuits to be packaged in the smallest area possible, which is no larger than area of the integrated circuit 11. The chip size package 10 provides for a robust packaging structure that is suitable for a vaπety of commerci∑il and military applications, including automotive electronics, for example. Thus, a chip-size package formed using a polyimide pπnted circuit board interposer has been disclosed. It is to be understood that the described embodiment is merely illustrative of some of the many specific embodiments which represent applications of the pπncipies of the present invention. Clearly, numerous and other arr.angements can be readily devised by those skilled in the an without depaning from the scope of the invention.

Claims

CLAIMSWhat is claimed is:
1. A chip-size integrated circuit package comprising: an integrated circuit chip having a plurality of peripheral bond pads a printed circuit board having a plurality of solder bumps formed on a top surface thereof and a plurality of bond pads around its periphery; a layer of adhesive disposed between the polyimide printed circuit board and the integrated circuit chip to secure them together; a plurality of wire bonds electrically connected between selected bond pads of the integrated circuit chip and the printed circuit board: and an encapsulant for encapsulating the wire bonds and bond pads of the integrated circuit chip and the printed circuit board.
2. The package of Claim 1 wherein the integrated circuit chip comprises a silicon integrated circuit chip.
3. The package of Claim 1 wherein the printed circuit board comprises a polyimide printed circuit board.
4. The package of Claim 1 wherein the layer of adhesive comprises a layer of epoxy adhesive.
5. The package of Claim 1 wherein the encapsulant comprises flexible epoxy.
6. The package of Claim 1 wherein the encapsulant comprises silicone.
PCT/US1998/020467 1997-09-29 1998-09-29 Chip-size package using a polyimide pcb interposer WO1999017364A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA002273223A CA2273223C (en) 1997-09-29 1998-09-29 Chip-size package using a polyimide pcb interposer

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US93983297A 1997-09-29 1997-09-29
US939,832 1997-09-29

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008127985A1 (en) * 2007-04-12 2008-10-23 Micron Technology, Inc. Flip chip with interposer, and methods of making same
US7531643B2 (en) 1997-09-11 2009-05-12 Chugai Seiyaku Kabushiki Kaisha Monoclonal antibody inducing apoptosis
US7691588B2 (en) 2003-03-13 2010-04-06 Chugai Seiyaku Kabushiki Kaisha Ligand having agonistic activity to mutated receptor
US7696325B2 (en) 1999-03-10 2010-04-13 Chugai Seiyaku Kabushiki Kaisha Polypeptide inducing apoptosis
US8034903B2 (en) 2000-10-20 2011-10-11 Chugai Seiyaku Kabushiki Kaisha Degraded TPO agonist antibody
US8945543B2 (en) 2005-06-10 2015-02-03 Chugai Seiyaku Kabushiki Kaisha Stabilizer for protein preparation comprising meglumine and use thereof
US9241994B2 (en) 2005-06-10 2016-01-26 Chugai Seiyaku Kabushiki Kaisha Pharmaceutical compositions containing sc(Fv)2
US9493569B2 (en) 2005-03-31 2016-11-15 Chugai Seiyaku Kabushiki Kaisha Structural isomers of sc(Fv)2

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227908A (en) * 1994-12-20 1996-09-03 Hitachi Ltd Semiconductor device and manufacture thereof
US5633785A (en) * 1994-12-30 1997-05-27 University Of Southern California Integrated circuit component package with integral passive component
US5714800A (en) * 1996-03-21 1998-02-03 Motorola, Inc. Integrated circuit assembly having a stepped interposer and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08227908A (en) * 1994-12-20 1996-09-03 Hitachi Ltd Semiconductor device and manufacture thereof
US5777391A (en) * 1994-12-20 1998-07-07 Hitachi, Ltd. Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
US5633785A (en) * 1994-12-30 1997-05-27 University Of Southern California Integrated circuit component package with integral passive component
US5714800A (en) * 1996-03-21 1998-02-03 Motorola, Inc. Integrated circuit assembly having a stepped interposer and method

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7531643B2 (en) 1997-09-11 2009-05-12 Chugai Seiyaku Kabushiki Kaisha Monoclonal antibody inducing apoptosis
US7696325B2 (en) 1999-03-10 2010-04-13 Chugai Seiyaku Kabushiki Kaisha Polypeptide inducing apoptosis
US8034903B2 (en) 2000-10-20 2011-10-11 Chugai Seiyaku Kabushiki Kaisha Degraded TPO agonist antibody
US7691588B2 (en) 2003-03-13 2010-04-06 Chugai Seiyaku Kabushiki Kaisha Ligand having agonistic activity to mutated receptor
US9493569B2 (en) 2005-03-31 2016-11-15 Chugai Seiyaku Kabushiki Kaisha Structural isomers of sc(Fv)2
US8945543B2 (en) 2005-06-10 2015-02-03 Chugai Seiyaku Kabushiki Kaisha Stabilizer for protein preparation comprising meglumine and use thereof
US9241994B2 (en) 2005-06-10 2016-01-26 Chugai Seiyaku Kabushiki Kaisha Pharmaceutical compositions containing sc(Fv)2
US9777066B2 (en) 2005-06-10 2017-10-03 Chugai Seiyaku Kabushiki Kaisha Pharmaceutical compositions containing sc(Fv)2
WO2008127985A1 (en) * 2007-04-12 2008-10-23 Micron Technology, Inc. Flip chip with interposer, and methods of making same
CN101681852B (en) * 2007-04-12 2011-07-06 美光科技公司 Flip chip with interposer, and methods of making same
US7659151B2 (en) 2007-04-12 2010-02-09 Micron Technology, Inc. Flip chip with interposer, and methods of making same
KR101122805B1 (en) * 2007-04-12 2012-03-21 마이크론 테크놀로지, 인크 Flip chip with interposer, and methods of making same
US8178984B2 (en) 2007-04-12 2012-05-15 Micron Technology, Inc. Flip chip with interposer

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