WO1999006949A1 - Chip card for contactless data and energy transmission and method for its production - Google Patents

Chip card for contactless data and energy transmission and method for its production Download PDF

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Publication number
WO1999006949A1
WO1999006949A1 PCT/DE1998/002079 DE9802079W WO9906949A1 WO 1999006949 A1 WO1999006949 A1 WO 1999006949A1 DE 9802079 W DE9802079 W DE 9802079W WO 9906949 A1 WO9906949 A1 WO 9906949A1
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WO
WIPO (PCT)
Prior art keywords
chip
electrically conductive
card
chip module
card body
Prior art date
Application number
PCT/DE1998/002079
Other languages
German (de)
French (fr)
Inventor
Frank PÜSCHNER
Jürgen Fischer
Achim Neu
Original Assignee
Siemens Aktiengesellschaft
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Aktiengesellschaft filed Critical Siemens Aktiengesellschaft
Publication of WO1999006949A1 publication Critical patent/WO1999006949A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • G06K19/07783—Antenna details the antenna being of the inductive type the inductive antenna being a coil the coil being planar
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item

Definitions

  • Figures 1 and 2 is constructed, but has slightly different dimensions.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The invention relates to a chip card for contactless data and/or energy transmission. The chip module (1) has a hollow space (9) inside the sealing compound (5), in the region of a connecting contact surface (2a, 2b). This hollow space (9) passes through said sealing compound (5) and up to the connecting contact surface (2a, 2b), which is filled with an electrically conductive material (11). This material (11) is in contact with an electrically conductive adhesive layer (17) which lies between the body of the card (13), close to a coil end (15), and the sealing compound (5).

Description

Beschreibungdescription
Chipkarte für kontaktlose Daten- und/oder Energieübertragung sowie Verfahren zu deren HerstellungChip card for contactless data and / or energy transmission and method for its production
Die Erfindung betrifft eine Chipkarte für kontaktlose Daten- und/oder Energieübertragung zu einem externen Gerät gemäß dem Oberbegriff des Patentanspruchs 1 sowie ein Verfahren zu deren Herstellung gemäß dem Oberbegriff des Patentanspruchs 4.The invention relates to a chip card for contactless data and / or energy transmission to an external device according to the preamble of patent claim 1 and a method for its production according to the preamble of patent claim 4.
Chipkarten dieser Art werden häufig als Kreditkarten, Telefonkarten etc. verwendet. Sie weisen einen Chip mit einem integrierten Schaltkreis auf, um Daten oder Informationen speichern bzw. mit einem externen Lesegerät wieder auslesen zu können. Zur kontaktfreien Daten- und/oder Energieübertragung zum externen Gerät weisen derartige kontaktfreie Chipkarten im Inneren des Kartenkörpers eine als Antenne wirkende Spule auf, die mit dem Chip in Wirkverbindung steht.Chip cards of this type are often used as credit cards, telephone cards etc. They have a chip with an integrated circuit in order to store data or information or to be able to read them out again with an external reading device. For contact-free data and / or energy transmission to the external device, such contact-free chip cards have a coil acting as an antenna in the interior of the card body, which coil is operatively connected to the chip.
Derartige kontaktfreie Chipkarten werden von kontaktbehaf eten Chipkarten unterschieden, bei welchen der Daten- oder Energieaustausch mit dem externen Gerät über Kontaktflächen auf der Oberseite der Chipkarte erfolgt, die mit entsprechenden Kontakten des externen Geräts in Verbindung gebracht wer- den. Daneben existieren auch sogenannte Kombi-Chipkarten, die sowohl eine kontaktbehaftete als auch eine kontaktfreie Signal- und/oder Energieübertragung ermöglichen.Such contact-free chip cards are distinguished from contact-bearing chip cards, in which the data or energy exchange with the external device takes place via contact areas on the top of the chip card, which are connected to corresponding contacts of the external device. In addition, there are also so-called combination chip cards that enable both contact-based and contact-free signal and / or energy transmission.
Chipkarten können bekannterweise derart hergestellt werden, daß zunächst der Kartenkörper durch Laminieren mehrererAs is known, chip cards can be produced in such a way that the card body is first laminated by several
Schichten oder durch ein Spritzverfahren hergestellt und anschließend in den Kartenkörper eine Kavität eingefräst wird, in welche ein Chipmodul eingesetzt wird. Dieses Chipmodul kann beispielsweise aus einem Chipträger in Form eines lei- tenden Trägerbandes und einem darauf befestigten Chip beste- hen, der zur Fixierung und zum Schutz des Chips und der An- schlußdrähtchen in eine Vergießmasse aus Harz eingegossen ist. Bei kontaktfreien Chipkarten muß das Chipmodul mit sich im Bereich der Kavität befindenden, freigelegten Spulenenden elektrisch verbunden werden, was üblicherweise mittels Lot oder einem elektrisch leitfähigen Kleber erfolgt. Zusätzlich muß auch das Chipmodul in der Kavität festgeklebt werden.Layers or produced by an injection molding process and then a cavity is milled into the card body, in which a chip module is inserted. This chip module can consist, for example, of a chip carrier in the form of a conductive carrier tape and a chip attached to it. hen, which is poured into a resin casting compound to fix and protect the chip and the connecting wires. In the case of contact-free chip cards, the chip module must be electrically connected to the exposed coil ends located in the region of the cavity, which is usually done by means of solder or an electrically conductive adhesive. In addition, the chip module must also be glued into the cavity.
Bei dieser bekannten Art der Chipkartenherstellung besteht häufig das Problem, daß aufgrund der Geometrie des Chipmoduls und der räumlichen Anordnung seiner Anschlußkontakte die freizulegenden Spulenenden und damit die gesamte Spule innerhalb des Kartenkörpers häufig aussermittig im Bezug auf die Dicke des Kartenkörpers angeordnet werden müssen, wodurch beim Verbiegen der Chipkarte hohe Spannungen auf das Chipmodul übertragen werden können. Dies kann zu einer Beschädigung des Chipmoduls oder der Verbindung zwischen den Spulenenden und den Anschlußkontakten des Chipmoduls führen. Weiterhin kann die Temperaturbelastung beim Verlöten der Spulenenden mit den Anschlußkontakten des Chipmoduls ein Problem darstellen.In this known type of chip card production, there is often the problem that due to the geometry of the chip module and the spatial arrangement of its connecting contacts, the coil ends to be exposed and thus the entire coil within the card body often have to be arranged eccentrically with respect to the thickness of the card body, as a result of which bending occurs the chip card can transmit high voltages to the chip module. This can damage the chip module or the connection between the coil ends and the connection contacts of the chip module. Furthermore, the temperature load when soldering the coil ends to the connection contacts of the chip module can be a problem.
Der Erfindung liegt daher die Aufgabe zugrunde, eine Chipkarte gemäß dem Oberbegriff des Anspruches 1 zu schaffen, die auf möglichst einfache und kostengünstige Weise eine sichere mechanische und elektrische Verbindung zwischen dem Chipmodul und dem Kartenkörper gewährleistet und eine Anordnung der Spule in mittiger Höhenlage innerhalb des Kartenkörpers ermöglicht. Außerdem soll ein Verfahren zur Herstellung einer derartigen Chipkarte geschaffen werden.The invention is therefore based on the object of providing a chip card according to the preamble of claim 1 which ensures a secure mechanical and electrical connection between the chip module and the card body in the simplest and cheapest possible manner and an arrangement of the coil at a central height within the card body enables. In addition, a method for producing such a chip card is to be created.
Diese Aufgabe wird erfindungsgemäß durch die Merkmale des Anspruches 1 bzw. 4 gelöst. Vorteilhafte Ausführungsformen der Erfindung sind in den weiteren Ansprüchen beschrieben. Bei der erfindungsgemäßen Chipkarte gemäß Anspruch 1 weist das Chipmodul innerhalb der Vergießmasse im Bereich einer jeden Trägerband-Anschlußkontaktfläche einen durch die Vergießmasse hindurchgehenden, zur Anschlußkontaktfläche führenden Hohlraum auf, der mit einem elektrisch leitfähigen Material gefüllt ist, das mit einer elektrisch leitfähigen Klebeschicht in Kontakt ist, welche zwischen dem Kontaktkörper im Bereich eines Spulenendes und der Vergießmasse vorgesehen ist .This object is achieved by the features of claims 1 and 4, respectively. Advantageous embodiments of the invention are described in the further claims. In the chip card according to the invention according to claim 1, the chip module within the encapsulation compound in the region of each carrier tape connection contact surface has a cavity which passes through the casting compound and leads to the connection contact surface and which is filled with an electrically conductive material which is in contact with an electrically conductive adhesive layer , which is provided between the contact body in the region of a coil end and the casting compound.
Für die erfindungsgemäße Chipkarte ist somit charakteristisch, daß eine elektrisch leitfähige Klebeschicht verwendet wird, welche eine Verbindung zwischen dem Kartenkörper und der Vergießmasse des implantierten Chipmoduls schafft und gleichzeitig für die elektrische Verbindung zwischen demIt is therefore characteristic of the chip card according to the invention that an electrically conductive adhesive layer is used which creates a connection between the card body and the potting compound of the implanted chip module and at the same time for the electrical connection between the
Chipmodul und der Antenne dient. Die elektrische Verbindung zwischen den Anschlußkontaktflächen des leitfähigen Trägerbands und der Klebeschicht erfolgt über eine „Brücke" aus elektrisch leitfähigem Material, so daß die Klebeschicht und damit auch die Spulenenden und die als Antenne wirkende Spule in größerem Abstand zum Trägerband und damit etwa in mittiger Höhenlage (in der neutralen Zone) des Kartenkörpers angeordnet werden können. Dadurch wird verhindert, daß Spannungen, welche durch Biegebeanspruchungen der Karte erzeugt werden, auf das Chipmodul übertragen werden. Die Gefahr einer Beschädigung des Chipmoduls oder der Verbindung zwischen Kartenkörper und Chipmodul beim Verbiegen der Chipkarte wird daher bedeutend verringert. Ein weiterer Vorteil ist, daß auf diese Weise auf keiner der beiden Kartenseiten die Spule durch- scheint und das optische Erscheinungsbild beeinträchtigt.Chip module and the antenna is used. The electrical connection between the connection contact surfaces of the conductive carrier tape and the adhesive layer takes place via a “bridge” made of electrically conductive material, so that the adhesive layer and thus also the coil ends and the coil acting as an antenna are at a greater distance from the carrier tape and thus approximately in the middle ( can be arranged in the neutral zone) of the card body. This prevents stresses, which are generated by bending stresses of the card, from being transmitted to the chip module. The risk of damage to the chip module or the connection between the card body and chip module when the chip card is bent is increased A further advantage is that in this way the coil does not shine through on either side of the card and impair the visual appearance.
Zweckmäßigerweise besteht das Material zur Füllung der Hohlräume sowie die Klebeschicht zwischen dem Kartenkörper und der Vergießmasse aus einem elektrisch leitfähigen Epoxykle- ber. Das erfindungsgemäße Verfahren ist dadurch gekennzeichnet, daß bei der Herstellung des Chipmoduls innerhalb der Vergießmasse Hohlräume freigehalten und anschließend mit einem elek- trisch leitfähigem Material gefüllt werden, welches mit den Anschlußkontaktflächen des Trägerbands in elektrischem Kontakt und zur gegenüberliegenden Seite der Vergießmasse hin frei zugänglich ist, und daß vor dem Einsetzen des fertigen Chipmoduls in die Kavität eine elektrisch leitfähige Klebe- schicht zumindest im Bereich der freigelegten Spulenenden eingebracht wird, die mit dem elektrisch leitfähigen Material der Hohlräume und der Vergießmasse in Verbindung gebracht wird.The material for filling the cavities and the adhesive layer between the card body and the casting compound expediently consist of an electrically conductive epoxy adhesive. The method according to the invention is characterized in that cavities are kept free within the potting compound during manufacture of the chip module and are subsequently filled with an electrically conductive material which is in electrical contact with the connection contact surfaces of the carrier tape and is freely accessible to the opposite side of the potting compound. and that before the finished chip module is inserted into the cavity, an electrically conductive adhesive layer is introduced, at least in the region of the exposed coil ends, which is brought into connection with the electrically conductive material of the cavities and the casting compound.
Vorteilhafter Weise werden die Hohlräume während des Aufbrin- gens der Vergießmasse auf den Chip mittels entfernbarer Stempel freigehalten.The cavities are advantageously kept free by means of removable stamps during the application of the casting compound to the chip.
Die Erfindung wird nachfolgend anhand der Zeichnungen bei- spielshaft näher erläutert. In diesen zeigen:The invention is explained in more detail below with reference to the drawings. In these show:
Figur 1 : eine schematische Draufsicht auf ein Chipmodul ohne darüberliegendem Trägerband,FIG. 1: a schematic top view of a chip module without a carrier tape lying above it,
Figur 2 : einen Schnitt entlang der Linie II-II von Figur 1 mit Trägerband, undFigure 2 shows a section along the line II-II of Figure 1 with carrier tape, and
Figur 3 : eine Schnittdarstellung der erfindungsgemäßen Chipkarte im Bereich des Chipmoduls, wobei das Chipmodul in gleicher Weise wie das Chipmodul derFigure 3 is a sectional view of the chip card according to the invention in the area of the chip module, the chip module in the same way as the chip module of the
Figuren 1 und 2 aufgebaut ist, jedoch etwas andere Dimensionen aufweist.Figures 1 and 2 is constructed, but has slightly different dimensions.
Aus den Figuren 1 bis 3 ist ein Chipmodul 1 ersichtlich, das aus einem oberen elektrisch leitfähigen Trägerband 2 aus Me- tall, einer darunterliegenden Trägerschicht 3 aus nichtleitendem Kunststoff, einem Chip 4 mit einem integrierten Schaltkreis und einer Vergießmasse 5 aus Epoxyharz besteht.A chip module 1 can be seen from FIGS. tall, an underlying carrier layer 3 made of non-conductive plastic, a chip 4 with an integrated circuit and a potting compound 5 made of epoxy resin.
Das Trägerband 2 weist zwei voneinander getrennte Anschlußkontaktflächen 2a, 2b auf, die voneinander durch einen Schlitz 6 elektrisch getrennt sind.The carrier tape 2 has two mutually separate connection contact surfaces 2a, 2b, which are electrically separated from one another by a slot 6.
Bei der Herstellung des Chipmoduls 1 wird zunächst der Chip 4 auf dem Trägerband 2 festgeklebt und über Anschlußdrähtchen 7 mit den entsprechenden Anschlußkontaktflächen 2a bzw. 2b des Trägerbands 2 kontaktiert. Die Trägerschicht 3 ist derart ausgestaltet, daß sie im Bereich der Kontaktstelle der Anschlußdrähtchen 7 mit dem Trägerband 2 weite Kontaktfenster 8 aufweist, durch welche die freien Enden der Anschlußdrähtchen 7 maschinell hindurchgeführt und an den entsprechenden Anschlußkontaktflächen 2a, 2b festgelötet werden können.In the manufacture of the chip module 1, the chip 4 is first glued to the carrier tape 2 and contacted via connecting wires 7 with the corresponding terminal contact surfaces 2a and 2b of the carrier tape 2. The carrier layer 3 is designed in such a way that it has wide contact windows 8 in the region of the contact point of the connecting wires 7 with the carrier tape 2, through which the free ends of the connecting wires 7 can be guided mechanically and can be soldered to the corresponding connecting contact surfaces 2a, 2b.
Im folgenden wird die Vergießmasse 5 aus Harz über den Chip 4 und die Anschlußdrähtchen 7 aufgebracht, so daß diese vollkommen eingekapselt werden. Hierbei werden mittels eines nicht dargestellten Stempels kreisförmige Hohlräume 9 neben den Kontaktfenstern 8 innerhalb der Vergießmasse 5 freigehalten, die sich an angrenzende durchgehende Hohlräume 10 inner- halb der Trägerschicht 3 anschließen. Die hintereinanderlie- genden, fluchtenden Hohlräume 9, 10 durchdringen daher den gesamten Chipmodulkörper bis hin zum Trägerband 2.In the following, the potting compound 5 made of resin is applied over the chip 4 and the connecting wires 7, so that they are completely encapsulated. Here, by means of a stamp (not shown), circular cavities 9 are kept free next to the contact windows 8 within the casting compound 5, which adjoin adjacent continuous cavities 10 within the carrier layer 3. The consecutive, aligned cavities 9, 10 therefore penetrate the entire chip module body up to the carrier tape 2.
Im nächsten Herstellschritt des Chipmoduls 1 werden diese Hohlräume 9, 10 mit einem elektrisch leitfähigen Material 11 aus einem elektrisch leitfähigen Epoxykleber gefüllt, der anschließend aushärtet (z.B. silbergefüllter Epoxykleber mit einer Aushärtezeit von 150°C/1 min), siehe Figur 3. Dieses elektrisch leitfähige Material 11 kontaktiert somit die ent- sprechende Anschlußkontaktfläche 2a, 2b des Trägerbands 2 und reicht bis zum Boden der Vergießmasse 5 , der im gezeigtenIn the next manufacturing step of the chip module 1, these cavities 9, 10 are filled with an electrically conductive material 11 made of an electrically conductive epoxy adhesive, which then hardens (for example silver-filled epoxy adhesive with a curing time of 150 ° C./1 min), see FIG. 3. This electrically Conductive material 11 thus contacts the corresponding connection contact surface 2a, 2b of the carrier tape 2 and extends to the bottom of the casting compound 5, which is shown in the
Ausführungsbeispiel eben ausgebildet ist.Embodiment is flat.
Das auf diese Weise hergestellte Chipmodul 1 wird in eine Ka- vität 12 eines Kartenkörpers 13 eingesetzt. In diesem Kartenkörper 13 befindet sich in mittlerer Höhenlage eine als Antenne wirkende Spule 14, deren Wicklungen ausserhalb der Kavität 12 angeordnet sind und die zwei freie Spulenenden 15 aufweist, die nach innen in den Bereich der Kavität 12 ge- führt sind. In Figur 3 ist lediglich eines dieser Spulenenden (15) dargestellt. Die Spulenenden 15 liegen auf gleicher Höhe wie die übrigen Wicklungen der Spule 14, d.h. in der mittigen oder neutralen Faser 16 des Kartenkörpers 13.The chip module 1 produced in this way is inserted into a cavity 12 of a card body 13. In this card body 13 there is a coil 14, acting as an antenna, whose windings are arranged outside the cavity 12 and which has two free coil ends 15, which are guided inwards into the region of the cavity 12, in the middle height position. In Figure 3, only one of these coil ends (15) is shown. The coil ends 15 are at the same level as the other windings of the coil 14, i.e. in the central or neutral fiber 16 of the card body 13.
Die Kavität 12 erstreckt sich ebenfalls bis zur neutralen Faser 16 hinab, so daß etwa die Hälfte der Spulenenden 15 freigefräst wird. Das anschließende Befestigen des Chipmoduls 1 innerhalb der Kavität 2 erfolgt nun nicht mehr, wie dies beim Stand der Technik bekannt ist, durch Einkleben von Randberei- chen des Moduls ausserhalb der Vergießmasse 5, sondern über eine elektrisch leitfähige Klebeschicht 17, welche direkt den Boden der Vergießmasse 6 auf den Grund der Kavität 12 klebt. Dazu werden zwei leitfähige Klebestreifen im Kartengrund aufgebracht, welche die Spulenenden 15 jeweils mit einschließen. Danach wird das Chipmodul 1 derart eingesetzt, daß jeweils ein gefüllter Hohlraum 9, 10 auf dieser Klebeschicht 17 zu liegen kommt. Dadurch entsteht eine leitfähige Verbindung von den Spulenenden 15 über die Klebeschicht 17 und das elektrisch leitfähige Material 11 innerhalb der Hohlräume 9, 10 bis zur dazugehörigen Anschlußkontaktfläche 2a, 2b. Gleichzeitig wird durch die Klebeschicht 17 eine feste Verbindung zwischen Kartenkörper 13 und Chipmodul 1 hergestellt.The cavity 12 also extends down to the neutral fiber 16, so that approximately half of the coil ends 15 are milled free. The subsequent fastening of the chip module 1 within the cavity 2 is no longer carried out, as is known in the prior art, by gluing peripheral areas of the module outside the casting compound 5, but via an electrically conductive adhesive layer 17 which directly covers the bottom of the Potting compound 6 sticks to the bottom of the cavity 12. For this purpose, two conductive adhesive strips are applied in the base of the card, each of which includes the coil ends 15. Then the chip module 1 is inserted in such a way that a filled cavity 9, 10 comes to rest on this adhesive layer 17. This creates a conductive connection from the coil ends 15 via the adhesive layer 17 and the electrically conductive material 11 within the cavities 9, 10 to the associated connection contact surface 2a, 2b. At the same time, the adhesive layer 17 establishes a firm connection between the card body 13 and the chip module 1.
Das Befestigen und Kontaktieren des Chipmoduls 1 mittels der Klebeschicht 17 hat weiterhin den Vorteil, daß keine zusätz- liehe Wärme zum Erweichen eines Lotes etc . eingebracht werden muß, wodurch der Kunststoff des Chipmoduls 1 und des Kartenkörpers 13 geschont wird. Fastening and contacting the chip module 1 by means of the adhesive layer 17 has the further advantage that no additional heat to soften a solder etc. must be introduced, whereby the plastic of the chip module 1 and the card body 13 is protected.

Claims

Patentansprüche claims
1. Chipkarte für kontaktlose Daten- und/oder Energieübertragung zu einem externen Gerät, bestehend aus einem Kartenkör- per (13) und einem in eine Kavität (12) des Kartenkörpers1. Chip card for contactless data and / or energy transmission to an external device, consisting of a card body (13) and one in a cavity (12) of the card body
(13) eingesetzten Chipmodul (1), das ein leitfähiges Trägerband (2) mit zwei Anschlußkontaktflächen (2a, 2b) und einen am Trägerband (2) befestigten elektronischen Chip (4) aufweist, der mittels Anschlußdrähtchen (7) mit den Anschlußkon- taktflächen (2a, 2b) leitend verbunden und mittels einer Vergießmasse (5) eingegossen ist, wobei jede Anschlußkontaktfläche (2a, 2b) mit einem freien Spulenende (15) einer im Kartenkörper (13) integrierten, als Antenne dienenden Spule (14) in elektrischer Wirkverbindung steht, dadurch gekennzeichnet, daß das Chipmodul (1) innerhalb der Vergießmasse (5) einen im Bereich einer jeden Anschlußkontaktfläche (2a, 2b) durch die Vergießmasse (5) hindurchgehenden, zur Anschlußkontak fläche (2a, 2b) führenden Hohlraum (9) aufweist, der mit einem elektrisch leitfähigen Material (11) gefüllt ist, das mit einer elektrisch leitfähigen Klebeschicht (17) in Kontakt ist, welche zwischen dem Kartenkörper (13) im Bereich eines Spulenendes (15) und der Vergießmasse (5) vorgesehen ist.(13) used chip module (1), which has a conductive carrier tape (2) with two connection contact surfaces (2a, 2b) and an electronic chip (4) fastened to the carrier band (2), which is connected to the connection contact surfaces by means of connecting wires (7) (2a, 2b) is conductively connected and cast in by means of a casting compound (5), each connection contact surface (2a, 2b) having a free coil end (15) of a coil (14) integrated in the card body (13) and serving as an antenna, in an electrically operative connection stands, characterized in that the chip module (1) within the potting compound (5) has in the region of each connection contact surface (2a, 2b) through the potting compound (5), leading to the terminal contact surface (2a, 2b) leading cavity (9) , which is filled with an electrically conductive material (11) which is in contact with an electrically conductive adhesive layer (17) which un between the card body (13) in the region of a coil end (15) d the casting compound (5) is provided.
2. Chipkarte nach Anspruch 2, dadurch gekennzeichnet, daß das Material (11) zur Füllung der Hohlräume (9) aus einem elektrisch leitfähigen Epoxykleber besteht.2. Chip card according to claim 2, characterized in that the material (11) for filling the cavities (9) consists of an electrically conductive epoxy adhesive.
3. Chipkarte nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Klebeschicht (17) zwischen dem Kartenkörper (13) und der Vergießmasse (5) aus einem elektrisch leitfähigen Epoxykleber besteht. 3. Chip card according to claim 1 or 2, characterized in that the adhesive layer (17) between the card body (13) and the casting compound (5) consists of an electrically conductive epoxy adhesive.
4. Verfahren zur Herstellung einer Chipkarte für kontaktlose4. Process for producing a chip card for contactless
Daten- und/oder Energieübertragung zu einem externen Gerät, wobei ein Chipmodul (1) durch Befestigen eines Chips (4) auf einem elektrisch leitfähigen Trägerband (2), durch Kontaktieren von Anschlußdrähtchen (7) des ChipsData and / or energy transmission to an external device, wherein a chip module (1) by attaching a chip (4) on an electrically conductive carrier tape (2), by contacting connecting wires (7) of the chip
(4) an Anschlußkontaktflächen (2a, 2b) des Trägerbands (2) und durch Eingießen des Chips (4) in einer Vergießmasse (5) hergestellt und in eine Kavität (12) eines Kartenkörpers (13) eingesetzt wird, in welchem eine als Antenne wirkende Spule (14) vorgesehen ist, wobei im Bereich der Kavität (12) liegende, freigelegte Spulenenden (15) mit den Anschlußkontakt- flächen (2a, 2b) des Trägerbands (2) in elektrische Wirkverbindung gebracht werden, dadurch gekennzeichnet, daß bei der Herstellung des Chipmoduls (1) innerhalb der Vergießmasse (5) Hohlräume (9) freigehalten und anschließend mit einem elektrisch leitfähigen Material (11) gefüllt werden, welches mit den Anschlußkontaktflächen (2a, 2b) des Trägerbands in elektrischem Kontakt und zur gegenüberliegenden Seite der Vergießmasse (5) hin frei zugängig ist, und daß vor dem Einset- zen des fertigen Chipmoduls (1) in die Kavität (12) eine elektrisch leitfähige Klebeschicht (17) zumindest im Bereich der freigelegten Spulenenden (15) eingebracht wird, die mit dem elektrisch leitfähigen Material (11) der Hohlräume (9) und der Vergießmasse (5) in Verbindung gebracht wird.(4) on connection contact surfaces (2a, 2b) of the carrier tape (2) and by pouring the chip (4) into a potting compound (5) and inserted into a cavity (12) of a card body (13), in which one acts as an antenna Acting coil (14) is provided, wherein exposed coil ends (15) lying in the region of the cavity (12) are brought into electrical operative connection with the connection contact surfaces (2a, 2b) of the carrier tape (2), characterized in that at Production of the chip module (1) within the casting compound (5) cavities (9) are kept free and then filled with an electrically conductive material (11) which is in electrical contact with the connection contact surfaces (2a, 2b) of the carrier tape and to the opposite side of the casting compound (5) is freely accessible, and that before the finished chip module (1) is inserted into the cavity (12), an electrically conductive adhesive layer (17) at least in the area of the exposed S Pulenenden (15) is introduced, which is associated with the electrically conductive material (11) of the cavities (9) and the potting compound (5).
5. Verfahren nach Anspruch (4), dadurch gekennzeichnet, daß die Hohlräume (9) während des Aufbringens der Vergießmasse (5) auf dem Chip (1) mittels entfernbarer Stempel freigehalten werden . 5. The method according to claim (4), characterized in that the cavities (9) during the application of the potting compound (5) on the chip (1) are kept clear by means of removable stamps.
PCT/DE1998/002079 1997-07-31 1998-07-23 Chip card for contactless data and energy transmission and method for its production WO1999006949A1 (en)

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DE1997133124 DE19733124C1 (en) 1997-07-31 1997-07-31 Chip for contact-less transmission of data and/or energy to external apparatus
DE19733124.6 1997-07-31

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19929610C1 (en) * 1999-06-28 2000-10-12 Giesecke & Devrient Gmbh Chip module for chip card has electrical component and contact bridge on one side of module carrier each coupled to contact surfaces on opposite side of module carrier via respective openings in latter
EP2178032A1 (en) 2008-10-17 2010-04-21 Oberthur Technologies Module, chip card and corresponding manufacturing method

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4299414B2 (en) * 1999-10-12 2009-07-22 富士通マイクロエレクトロニクス株式会社 Combination card, IC card module, and combination card manufacturing method
DE102007019329A1 (en) * 2007-04-24 2008-10-30 Innovaris Gmbh & Co. Kg Components produced by thermal spraying from predominantly metallic materials

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283423A (en) * 1991-03-15 1994-02-01 U.S. Philips Corporation Contactless microcircuit card
WO1997005569A1 (en) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Data carrier with a component-bearing module and a coil, and a process for fabricating such a data carrier

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19500925C2 (en) * 1995-01-16 1999-04-08 Orga Kartensysteme Gmbh Method for producing a contactless chip card

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283423A (en) * 1991-03-15 1994-02-01 U.S. Philips Corporation Contactless microcircuit card
WO1997005569A1 (en) * 1995-08-01 1997-02-13 Austria Card Plastikkarten Und Ausweissysteme Gesellschaft Mbh Data carrier with a component-bearing module and a coil, and a process for fabricating such a data carrier

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19929610C1 (en) * 1999-06-28 2000-10-12 Giesecke & Devrient Gmbh Chip module for chip card has electrical component and contact bridge on one side of module carrier each coupled to contact surfaces on opposite side of module carrier via respective openings in latter
EP2178032A1 (en) 2008-10-17 2010-04-21 Oberthur Technologies Module, chip card and corresponding manufacturing method

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