WO1997037374A3 - Method of packaging multiple integrated circuit chips in a standard semiconductor device package - Google Patents
Method of packaging multiple integrated circuit chips in a standard semiconductor device packageInfo
- Publication number
- WO1997037374A3 WO1997037374A3 PCT/US1997/005050 US9705050W WO9737374A3 WO 1997037374 A3 WO1997037374 A3 WO 1997037374A3 US 9705050 W US9705050 W US 9705050W WO 9737374 A3 WO9737374 A3 WO 9737374A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- bonding pads
- semiconductor device
- device package
- top surface
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0657—Stacked arrangements of devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48145—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06506—Wire or wire-like electrical connections between devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/0651—Wire or wire-like electrical connections from device to substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06513—Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06572—Auxiliary carrier between devices, the carrier having an electrical connection structure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
- H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/06503—Stacked arrangements of devices
- H01L2225/06582—Housing for the assembly, e.g. chip scale package [CSP]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US62067096A | 1996-03-26 | 1996-03-26 | |
US08/620,670 | 1996-03-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1997037374A2 WO1997037374A2 (en) | 1997-10-09 |
WO1997037374A3 true WO1997037374A3 (en) | 1997-11-20 |
Family
ID=24486880
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1997/005050 WO1997037374A2 (en) | 1996-03-26 | 1997-03-26 | Method of packaging multiple integrated circuit chips in a standard semiconductor device package |
Country Status (1)
Country | Link |
---|---|
WO (1) | WO1997037374A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6169329B1 (en) * | 1996-04-02 | 2001-01-02 | Micron Technology, Inc. | Semiconductor devices having interconnections using standardized bonding locations and methods of designing |
JP2000164796A (en) * | 1998-11-27 | 2000-06-16 | Nec Corp | Multichip module |
JP2000243876A (en) * | 1999-02-23 | 2000-09-08 | Fujitsu Ltd | Semiconductor device and its manufacture |
JP3304921B2 (en) * | 1999-06-18 | 2002-07-22 | 日本電気株式会社 | Semiconductor storage device |
SG100635A1 (en) | 2001-03-09 | 2003-12-26 | Micron Technology Inc | Die support structure |
US6798055B2 (en) | 2001-03-12 | 2004-09-28 | Micron Technology | Die support structure |
SG95637A1 (en) | 2001-03-15 | 2003-04-23 | Micron Technology Inc | Semiconductor/printed circuit board assembly, and computer system |
US6441483B1 (en) | 2001-03-30 | 2002-08-27 | Micron Technology, Inc. | Die stacking scheme |
US7217597B2 (en) | 2004-06-22 | 2007-05-15 | Micron Technology, Inc. | Die stacking scheme |
CN112788222B (en) * | 2021-02-07 | 2022-07-29 | 维沃移动通信有限公司 | Camera module and electronic equipment |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61287133A (en) * | 1985-06-13 | 1986-12-17 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
JPS62261166A (en) * | 1986-05-08 | 1987-11-13 | Matsushita Electronics Corp | Semiconductor device |
EP0348972A2 (en) * | 1988-07-01 | 1990-01-03 | Sharp Kabushiki Kaisha | A semiconductor device and a process for manufacturing thereof |
US5019946A (en) * | 1988-09-27 | 1991-05-28 | General Electric Company | High density interconnect with high volumetric efficiency |
JPH03165550A (en) * | 1989-11-24 | 1991-07-17 | Hitachi Cable Ltd | High mounting density type semiconductor device |
EP0486829A2 (en) * | 1990-10-22 | 1992-05-27 | Seiko Epson Corporation | Semiconductor device and semiconductor device packaging system |
EP0575051A1 (en) * | 1992-05-22 | 1993-12-22 | National Semiconductor Corporation | Stacked multi-chip modules and method of manufacturing |
-
1997
- 1997-03-26 WO PCT/US1997/005050 patent/WO1997037374A2/en active Application Filing
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61287133A (en) * | 1985-06-13 | 1986-12-17 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
JPS62261166A (en) * | 1986-05-08 | 1987-11-13 | Matsushita Electronics Corp | Semiconductor device |
EP0348972A2 (en) * | 1988-07-01 | 1990-01-03 | Sharp Kabushiki Kaisha | A semiconductor device and a process for manufacturing thereof |
US5019946A (en) * | 1988-09-27 | 1991-05-28 | General Electric Company | High density interconnect with high volumetric efficiency |
JPH03165550A (en) * | 1989-11-24 | 1991-07-17 | Hitachi Cable Ltd | High mounting density type semiconductor device |
EP0486829A2 (en) * | 1990-10-22 | 1992-05-27 | Seiko Epson Corporation | Semiconductor device and semiconductor device packaging system |
EP0575051A1 (en) * | 1992-05-22 | 1993-12-22 | National Semiconductor Corporation | Stacked multi-chip modules and method of manufacturing |
Non-Patent Citations (5)
Title |
---|
"HIGH-PERFORMANCE PROCESSOR", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 31, no. 10, 1 March 1989 (1989-03-01), pages 229 - 231, XP000120401 * |
CICONE R A ET AL: "SILICON INTEGRATED HIGH PERFORMANCE PACKAGE", IBM TECHNICAL DISCLOSURE BULLETIN, vol. 27, no. 7B, 1 December 1984 (1984-12-01), pages 4226, XP002010996 * |
PATENT ABSTRACTS OF JAPAN vol. 011, no. 148 (E - 506) 14 May 1987 (1987-05-14) * |
PATENT ABSTRACTS OF JAPAN vol. 012, no. 135 (E - 604) 23 April 1988 (1988-04-23) * |
PATENT ABSTRACTS OF JAPAN vol. 015, no. 405 (E - 1122) 16 October 1991 (1991-10-16) * |
Also Published As
Publication number | Publication date |
---|---|
WO1997037374A2 (en) | 1997-10-09 |
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