WO1997008483A3 - Heat pipe - Google Patents
Heat pipe Download PDFInfo
- Publication number
- WO1997008483A3 WO1997008483A3 PCT/IL1996/000093 IL9600093W WO9708483A3 WO 1997008483 A3 WO1997008483 A3 WO 1997008483A3 IL 9600093 W IL9600093 W IL 9600093W WO 9708483 A3 WO9708483 A3 WO 9708483A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat transfer
- fluid
- evaporator
- condenser
- housing
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24H—FLUID HEATERS, e.g. WATER OR AIR HEATERS, HAVING HEAT-GENERATING MEANS, e.g. HEAT PUMPS, IN GENERAL
- F24H3/00—Air heaters
- F24H3/002—Air heaters using electric energy supply
- F24H3/004—Air heaters using electric energy supply with a closed circuit for a heat transfer liquid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/40—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only inside the tubular element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Combustion & Propulsion (AREA)
- Chemical & Material Sciences (AREA)
- Geometry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An improved heat pipe construction includes an evaporator for evaporating a low-temperature boiling fluid so as to generate vapors thereof, and a condenser for condensing the vapors so as to provide a condensate; wherein a predetermined one of the evaporator and the condenser includes a first heat transfer arrangement and the other one of the evaporator and the condenser comprises a second heat transfer arrangement, and wherein the first heat transfer arrangement includes a generally tubular housing; a plurality of substantially flat heat transfer portions having heat transfer surfaces operative to exchange thermal energy with the fluid in contact therewith, thereby to convert the fluid from a first fluid form to a second fluid form, wherein the heat transfer portions also have fluid flow ports provided therein for permitting fluid circulation transversely through the plurality of heat transfer portions between the first and second heat transfer arrangements, and the heat transfer portions are arranged within the housing so as to be in thermally conductive touching contact with the wall surfaces and such that the heat transfer surfaces are oriented transversely with respect to the wall surfaces; apparatus for causing capillary wetting of either the inner housing surface or the heat transfer surfaces of the heat transfer portions; and apparatus for thermally coupling the housing with an external mass having a temperature in a known range, wherein the other one of the evaporator and the condenser is the second heat transfer arrangement which includes tubular apparatus having an inward-facing surface for receiving the fluid in the second fluid form from the first heat transfer arrangement and for thermally coupling the fluid with an external mass having a temperature in a known range, thereby to convert the fluid back to the first fluid form.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IL11510995A IL115109A0 (en) | 1995-08-30 | 1995-08-30 | Heat pipe |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO1997008483A2 WO1997008483A2 (en) | 1997-03-06 |
| WO1997008483A3 true WO1997008483A3 (en) | 1997-05-15 |
Family
ID=11067930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/IL1996/000093 WO1997008483A2 (en) | 1995-08-30 | 1996-08-30 | Heat pipe |
Country Status (2)
| Country | Link |
|---|---|
| IL (1) | IL115109A0 (en) |
| WO (1) | WO1997008483A2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI981783A (en) * | 1998-08-19 | 2000-02-20 | Nokia Networks Oy | Method and heat transfer for heat energy dissipation generated by a heat source by means of heat energy dissolved in a phase change of a working medium |
| EP4022651A2 (en) * | 2019-10-15 | 2022-07-06 | NuScale Power, LLC | Heat pipe networks for heat removal, such as heat removal from nuclear reactors, and associated systems and methods |
| EP4022649B1 (en) | 2019-10-15 | 2023-12-13 | NuScale Power, LLC | Nuclear reactors having liquid metal alloy fuels and/or moderators |
| CN113724963A (en) * | 2020-05-25 | 2021-11-30 | 新疆金风科技股份有限公司 | Transformer, cooling system and wind generating set |
| CN114302608B (en) | 2021-03-31 | 2024-01-30 | 华为数字能源技术有限公司 | Heat exchanger, cabinet and communication base station |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3414475A (en) * | 1965-05-20 | 1968-12-03 | Euratom | Heat pipes |
| US3603382A (en) * | 1969-11-03 | 1971-09-07 | Nasa | Radial heat flux transformer |
| US4880053A (en) * | 1989-04-24 | 1989-11-14 | The Board Of Governors Of Wayne State University | Two-phase cooling apparatus for electronic equipment and the like |
| US5335720A (en) * | 1991-08-09 | 1994-08-09 | Mitsubishi Denki Kabushiki Kaisha | Heat pipe |
-
1995
- 1995-08-30 IL IL11510995A patent/IL115109A0/en unknown
-
1996
- 1996-08-30 WO PCT/IL1996/000093 patent/WO1997008483A2/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3414475A (en) * | 1965-05-20 | 1968-12-03 | Euratom | Heat pipes |
| US3603382A (en) * | 1969-11-03 | 1971-09-07 | Nasa | Radial heat flux transformer |
| US4880053A (en) * | 1989-04-24 | 1989-11-14 | The Board Of Governors Of Wayne State University | Two-phase cooling apparatus for electronic equipment and the like |
| US5335720A (en) * | 1991-08-09 | 1994-08-09 | Mitsubishi Denki Kabushiki Kaisha | Heat pipe |
Also Published As
| Publication number | Publication date |
|---|---|
| IL115109A0 (en) | 1995-12-08 |
| WO1997008483A2 (en) | 1997-03-06 |
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| DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
| 121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
| 122 | Ep: pct application non-entry in european phase |