WO1996029850A1 - Clip for preventing heat sink for cpu/mpu from coming off - Google Patents

Clip for preventing heat sink for cpu/mpu from coming off Download PDF

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Publication number
WO1996029850A1
WO1996029850A1 PCT/JP1995/000525 JP9500525W WO9629850A1 WO 1996029850 A1 WO1996029850 A1 WO 1996029850A1 JP 9500525 W JP9500525 W JP 9500525W WO 9629850 A1 WO9629850 A1 WO 9629850A1
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WO
WIPO (PCT)
Prior art keywords
clip
heat sink
mpu
cpu
mounting
Prior art date
Application number
PCT/JP1995/000525
Other languages
French (fr)
Japanese (ja)
Inventor
Tatsuro Iwaki
Original Assignee
Tatsuro Iwaki
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuro Iwaki filed Critical Tatsuro Iwaki
Priority to PCT/JP1995/000525 priority Critical patent/WO1996029850A1/en
Publication of WO1996029850A1 publication Critical patent/WO1996029850A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a clip for fixing a heat sink to a CPU / MPU (central processing unit), which is the heart of a computer. (Hereinafter referred to as clip)
  • a hook is attached to the mounting groove of the socket for CPU and MPU, and the heat sink is fixed with a heat conductive double-sided tape.
  • the heat conductive double-sided tape type relies on the adhesive of the tape to fix the heat sink. Therefore, the adhesive strength may decrease over time. Of course, there is a danger of falling off due to strong vibration or dropping. Also, the type with strong adhesiveness has poor thermal conductivity. Conversely, the type with good thermal conductivity has poor adhesion. Furthermore, the tape itself is expensive, and the installation work is more expensive than the clip type, so the cost is very high. [Disclosure of the Invention]
  • the present invention is of a type which is not mounted on a socket for CPU / MPU but is mounted on a mounting hole of a mother board.
  • this clip is arranged diagonally diagonally to the heat sink and is attached so as to hold the whole from above. For this reason, it was possible to project nails to fix the fins of the heat sink from the clip body at an angle of 45 degrees and four directions. As a result, the clip and heat sink were fixed when not attached, making it easier to attach to the motherboard. Also, since the upper part of the clip is slightly curved after mounting, the heat sink fixing claw will fix the fin more strongly.
  • This clip uses the fins for fixing the heat sink, so even if the size of the heat sink is different, it can be used if the size of the fins and the fixing claw match.
  • Fig. 1 is a schematic diagram of each part.
  • Figure 2 is a view of the mounting holes on the motherboard.
  • FIG. 3 is an enlarged view of the hook when attached.
  • Fig. 1 shows the pin (1-a) and clip (1-b) from the top.
  • a stainless steel 1.2 mm round wire was used for the captive pin. Then, bend it into a U-shape to fit slightly inside the clip ends. At this time, the bending height should be longer than the hook of the clip.
  • the clip body was made by making a press die. Attach a small hook (1-c) at the center of the clip so that the drop-out prevention pin does not come off after mounting. Drill a 1.4 mm hole (3-a) just near the ends. Make a steadying guide (3-b) for the captive pin on the inside of the hook at both ends of the clip.
  • Figure 2 is a view of a mounting hole of a certain manufacturer.
  • the feature is that the long holes are arranged diagonally at the four corners. In the present invention, two diagonal holes are used.
  • FIG. 3 is an enlarged view at that time.
  • the pins do not go together but go up. This movement does not disturb the pin at all.
  • the hook is inserted into the mounting hole, it is automatically inserted into the margin of the mounting hole by the operation of the steady rest guide.
  • the clip for preventing the heat sink from falling off for the CPU / MPU of the present invention is mainly for fixing the CPU / MPU and the heat sink in the field of computers.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A mounting clip used for fitting a heat sink to a CPU or MPU. Conventional clips involve problems that they tend to come off due to drop or vibration, the CPU or MPU may break internally due to heat expansion, and the total cost of a double-sided type is inevitably high. In order to solve such problems, a detachment preventing clip has been developed. Since this clip is obliquely attached along a diagonal line to a heat sink and simultaneously fixes the fin section of the heat sink in four directions with fixing claws (1-d) in such a way as to hold the whole body of the sink from above, the clip can prevent detachment of any heat sink regardless of its size, if the size of the fin section is equal to that of the claws. In addition, the fixing forces of the claws (1-d) are strong, since the upper sections of clip slightly curve upward. Since foreign matters are inserted into the voids of mounting holes (see fig. 2) after mounting a heat sink, coming off of the clip can be prevented. Using this, a coming off preventing pin (1-a) has been devised. The pin (1-a) can be automatically inserted into the mounting holes, when a small hook (1-c) is used at the central part of the clip and holes (3-a) or bracing guides (3-b) are provided at both ends of the clip (see fig. 3).

Description

明細書  Specification
[発明の名称] [Title of Invention]
C P U ' M P U用ヒ一トシンク脱落防止クリップ [技術分野]  Heat sink clip for CPU 'MPU [Technical field]
この発明は、 コンピュータ一の心臓部である C P U · M P U (中央 演算装置） と、 ヒートシンクを固定するための、 クリップに関するも のである。 （以降クリップと記す）  The present invention relates to a clip for fixing a heat sink to a CPU / MPU (central processing unit), which is the heart of a computer. (Hereinafter referred to as clip)
[背景技術] [Background technology]
従来のヒートシンク固定方法は、 C P U · M P U用ソケッ トの装着 用溝にフックを掛けるものと、 熱伝導性のある両面テープで固定して いた。  In the conventional heat sink fixing method, a hook is attached to the mounting groove of the socket for CPU and MPU, and the heat sink is fixed with a heat conductive double-sided tape.
ソケッ卜の装着用溝を利用したタイプは、 縦もしくは横の一方向に クリップするタイプと、 まれに縦横二方向をクリップするタイプがあ る。 この方法の多くは、 ヒートシンク単体とクリップ自体が固定され ておらず、 装着時のばね性のみに頼っている。 また、 フックが装着時 に外れぬように処置をしたものは、 皆無である。 したがって、 強い振 動によって、 ヒートシンクがカタカタと音をたてて動いたり、 落下に よる脱落の恐れがある。 これらの問題を解決するため、 必要以上にば ね性を強くしたものもある。 このタイプの最大の欠点は、 M P U作動 時に、 内部の熱膨張による内部変形を誘発することである。  There are two types that use the socket's mounting groove: one that clips vertically or horizontally, and one that rarely clips both vertically and horizontally. In many of these methods, the heatsink alone and the clip itself are not fixed, relying solely on the resiliency when mounted. There is no measure to prevent the hook from coming off when attached. Therefore, a strong vibration may cause the heat sink to move with a rattling noise or fall off due to falling. To solve these problems, some have become more vulnerable than necessary. The biggest drawback of this type is that during MPU operation, it induces internal deformation due to internal thermal expansion.
熱伝導性両面テープタイプは、 ヒートシンクの固定を、 テープの接 着剤にのみたよっている。 そのため、 時間の経過によって、 接着力の 低下がありうる。 当然、 強い振動または落下による脱落の危険がある。 また、 粘着力の強いタイプは、 熱伝導率があまりよくない。 逆に熱伝 導率がよいタイプは、 粘着力がよくない。 更に、 テープ自体が高価で、 取り付け作業費がクリップタイプよりもかかってしまうので、 たいへ んコスト高である。 [発明の開示] The heat conductive double-sided tape type relies on the adhesive of the tape to fix the heat sink. Therefore, the adhesive strength may decrease over time. Of course, there is a danger of falling off due to strong vibration or dropping. Also, the type with strong adhesiveness has poor thermal conductivity. Conversely, the type with good thermal conductivity has poor adhesion. Furthermore, the tape itself is expensive, and the installation work is more expensive than the clip type, so the cost is very high. [Disclosure of the Invention]
本発明は、 C P U · M P U用ソケットに装着せずに、 マザ一ボード の装着用穴に取り付けるタイプである。  The present invention is of a type which is not mounted on a socket for CPU / MPU but is mounted on a mounting hole of a mother board.
このクリップの外観の特徴は、 ヒートシンクに対して斜め対角に配 し、 上から全体を抱えるように装着する点である。 このため、 クリツ プ本体から、 斜め 4 5度四方向に、 ヒー トシンクのフィン部を固定す るための爪を出すことが可能となった。 これによつて、 未装着時にク リップとヒートシンクが固定され、 マザ一ボードへの装着が安易にな つた。 また、 装着後にクリップ上部がやや湾曲するため、 ヒートシン ク固定用の爪が、 フィン部をさらに強く固定することとなる。  The feature of the appearance of this clip is that it is arranged diagonally diagonally to the heat sink and is attached so as to hold the whole from above. For this reason, it was possible to project nails to fix the fins of the heat sink from the clip body at an angle of 45 degrees and four directions. As a result, the clip and heat sink were fixed when not attached, making it easier to attach to the motherboard. Also, since the upper part of the clip is slightly curved after mounting, the heat sink fixing claw will fix the fin more strongly.
このクリップは、 フィン部をヒートシンク固定用に利用するため、 ヒートシンクの大きさが違っても、 フィン部と固定用の爪のサイズが 合えば使用が可能である。  This clip uses the fins for fixing the heat sink, so even if the size of the heat sink is different, it can be used if the size of the fins and the fixing claw match.
また、 クリップのばねの力が、 上に引き上げる方向と外側にし力 Hi かず、 落下に弱いとゆう欠点をもっていたが、 マザ一ボードの装着用 穴に取り付けた後、 装着用穴の余白部分に着目した。 この余白部分に、 金属 ·非金属を問わず、 丸線もしくわ平板などの異物を挿入すること によって、 フックの動きを止めることを発見した。 これによつて、 ク リップ本体が変形するか、 マザ一ボードが破損するような力が加わら ない限り、 脱落することはない。 この発見を利用して、 最良な方法は クリップ中央部に小フックを作り、 脱落防止ピンを仮固定する。 （1 . 2ミリのコの字に曲げたステンレス製の丸線） これにより、 M P U装 着時に、 脱落防止ピンを意識せずに使用することができ、 マザ一ボー ドの装着用穴にフックを掛けた後、 余白部分に脱落防止ピンが自動挿 入される。 これにより、 必要以上にばね性がいらなくなった。  In addition, there was a drawback that the spring force of the clip was strong in the direction of pulling up and outside in the direction of pulling up, and it was weak to drop, but after attaching it to the mounting hole of the motherboard, pay attention to the margin of the mounting hole did. We discovered that inserting a foreign object, such as a round wire or a flat plate, whether metallic or non-metallic, into this margin would stop the movement of the hook. As a result, the clip does not come off unless the clip itself is deformed or a force that damages the motherboard is applied. Taking advantage of this finding, the best method is to make a small hook in the center of the clip and temporarily fix the captive pin. (Stainless steel round wire bent into a U-shape of 1.2 mm) This allows the MPU to be used without being aware of the dropout prevention pin when mounting it, and to hook into the mounting hole on the motherboard. After that, the captive pin is automatically inserted into the margin. This eliminated the need for springiness more than necessary.
[図面の簡単な説明] [Brief description of drawings]
第一図は、 各部の形体図である。  Fig. 1 is a schematic diagram of each part.
第二図は、 マザ一ボード上の装着用穴の図である。  Figure 2 is a view of the mounting holes on the motherboard.
第三図は、 装着時のフックの拡大図である。  FIG. 3 is an enlarged view of the hook when attached.
[発明を実施するための最良の形態] [Best Mode for Carrying Out the Invention]
本発明をより詳細に説述するために、 添付の図面に従ってこれを説 明する。  The present invention will be described in more detail with reference to the accompanying drawings.
第一図は、 上より脱落防止ピン（1-a) ·クリップ（1-b) . ヒートシン ク（1-e) - M P U (l-f) ·装着穴の開いたプリン卜基板（1-g)の順であ る。 この順が、 装着順である。 Fig. 1 shows the pin (1-a) and clip (1-b) from the top. (1-e)-MPU (lf) · Printed board (1-g) with mounting holes. This order is the mounting order.
脱落防止ピンは、 ステンレス製の 1. 2ミリの丸線を使用した。 これ に、 クリップ両端やや内側に合わせてコの字に曲げる。 この時、 曲げ 高さは、 クリップのフック部より長くする。  A stainless steel 1.2 mm round wire was used for the captive pin. Then, bend it into a U-shape to fit slightly inside the clip ends. At this time, the bending height should be longer than the hook of the clip.
クリップ本体は、 プレス金型を作って製作した。 クリップ中央部に、 脱落防止ピンが、 装着後に抜けないように小フック（1-c)を付ける。 また両端ぎりぎりのところに 1. 4ミリの穴（3- a)をあける。 クリップの 両端フック内側に、 脱落防止ピン用の振れ止め用ガイ ド（3- b)をつくる。  The clip body was made by making a press die. Attach a small hook (1-c) at the center of the clip so that the drop-out prevention pin does not come off after mounting. Drill a 1.4 mm hole (3-a) just near the ends. Make a steadying guide (3-b) for the captive pin on the inside of the hook at both ends of the clip.
ヒー トシンク（1- e)は、 フィン固定用の爪（1-d)に合うサイズのもの を使用する。  Use a heat sink (1-e) with a size that matches the fin fixing nail (1-d).
第二図は、 あるメーカーの装着用穴の図である。 長穴を四隅に対角に 配した点が、 特長である。 本発明では、 どちらか対角の二つの穴を使 用する。  Figure 2 is a view of a mounting hole of a certain manufacturer. The feature is that the long holes are arranged diagonally at the four corners. In the present invention, two diagonal holes are used.
脱落防止ピンをクリップに装着するには、 両端にあけた 1. 4ミ リの 穴に挿入し、 クリップ中央部の小フックにピンを掛ける。 この時クリ ップ両端の振れ止めガイ ドに、 挿入されているか確認する。  To attach the captive pin to the clip, insert it into the 1.4 mm hole drilled at both ends and hook the pin on the small hook at the center of the clip. At this time, check that the clip is inserted into the steady rest guides at both ends of the clip.
つぎに、 ヒートシンクにクリップをはめ込む。 M P Uは基板に取り付 けたものとする。  Next, fit the clip into the heat sink. MPU is assumed to be attached to the substrate.
クリ ップを取り付けたヒー トシンクを M P Uにのせ、 両端のフック を片方ずつ掛ける。 第三図がその時の拡大図である。 図を見ても解る ように、 フックが装着用穴に挿入されるときには、 ピンは一緒に入ら ずに上方にあがる。 この動きによってピンは全く じゃまにならない。 また、 フックが装着用穴に挿入されてしまうと、 振れ止めガイ ドの作 用によって自動的に、 装着用穴の余白部分に挿入される。  Place the heat sink with the clip on the MPU and hook the hooks at both ends one by one. FIG. 3 is an enlarged view at that time. As can be seen from the figure, when the hook is inserted into the mounting hole, the pins do not go together but go up. This movement does not disturb the pin at all. When the hook is inserted into the mounting hole, it is automatically inserted into the margin of the mounting hole by the operation of the steady rest guide.
装着後は、 脱落防止ピンが装着用穴に挿入されている事と、 クリ ツ ップ中央部が僅かに湾曲して、 ヒートシンクフィン部を固定用爪がし つかりと押さえている事を確認する。 [産業上の利用可能性]  After mounting, check that the captive pin is inserted into the mounting hole, and that the center of the clip is slightly curved, and the fixing fin is firmly holding the heat sink fin. . [Industrial applicability]
以上のように、 本発明の C P U · M P U用ヒ一トシンク脱落防止ク リップは、 主にコンピュータ一分野の C P U · M P Uとヒ一卜シンク を、 固定するためのものである。  As described above, the clip for preventing the heat sink from falling off for the CPU / MPU of the present invention is mainly for fixing the CPU / MPU and the heat sink in the field of computers.

Claims

請求の範囲 The scope of the claims
1 . ヒートシンクのフィン部を四方向同時に押さえ、 装着時に更に強 く固定する事ができるクリップ。 1. A clip that presses the fins of the heat sink in four directions at the same time, and can be more firmly fixed when installed.
2 . フィン部をヒートシンク固定用に利用するため、 ヒー トシンクの 大小に関らず、 フィン部と固定用の爪のサイズが合えば使用が可能な クリップ。  2. A clip that can be used if the size of the fin and the fixing claw match, regardless of the size of the heat sink because the fin is used for fixing the heat sink.
3 . ヒートシンク固定用クリップ装着後、 装着穴の余白部分に金属 . 非金属を問わず、 丸線もしくわ平板などの異物を挿入することによつ てクリップの脱落防止をすること。  3. After attaching the heat sink fixing clip, prevent the clip from falling off by inserting a foreign object such as a round wire or flat plate, regardless of metal or non-metal, into the margin of the mounting hole.
4 . ヒートシンク固定用クリ ップ装着時に、 脱落防止ピンが装着用穴 に自動挿入されるクリップ。  4. A clip that automatically inserts the captive pin into the mounting hole when the heat sink fixing clip is mounted.
PCT/JP1995/000525 1995-03-22 1995-03-22 Clip for preventing heat sink for cpu/mpu from coming off WO1996029850A1 (en)

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Application Number Priority Date Filing Date Title
PCT/JP1995/000525 WO1996029850A1 (en) 1995-03-22 1995-03-22 Clip for preventing heat sink for cpu/mpu from coming off

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Application Number Priority Date Filing Date Title
PCT/JP1995/000525 WO1996029850A1 (en) 1995-03-22 1995-03-22 Clip for preventing heat sink for cpu/mpu from coming off

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0888039A2 (en) * 1997-06-27 1998-12-30 Sun Microsystems, Inc. Heat sink attachment
FR2841091A1 (en) * 2002-06-14 2003-12-19 Thomson Licensing Sa Printed circuit assembly radiator clip retention having electrical/electronic component contacting radiator via clip and locking piece ensuring clip retention.
US7697297B2 (en) * 2007-11-29 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a clip assembly
KR101404238B1 (en) 2011-06-29 2014-06-05 미쓰비시덴키 가부시키가이샤 Electronic device
CN112077629A (en) * 2020-09-16 2020-12-15 深圳山源电器股份有限公司 Double-sided relieving equipment and material clamping device and material clamping method thereof

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685417B2 (en) * 1991-04-25 1994-10-26 株式会社三光電機製作所 Manufacturing method of radiator for electronic parts

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0685417B2 (en) * 1991-04-25 1994-10-26 株式会社三光電機製作所 Manufacturing method of radiator for electronic parts

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
MICROFILM OF THE SPECIFICATION AND DRAWINGS ANNEXED TO THE WRITTEN APPLICATION OF JAPANESE UTILITY MODEL, Application No. 2743/1991 (Laid-Open No. 96892/1992) (FUJITSU LTD.), (21.08.92). *
MICROFILM OF THE SPECIFICATION AND DRAWINGS ANNEXED TO THE WRITTEN APPLICATION OF JAPANESE UTILITY MODEL, Application No. 84205/1988 (Laid-Open No. 8097/1990) (NEC CORP.), (18.01.90). *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0888039A2 (en) * 1997-06-27 1998-12-30 Sun Microsystems, Inc. Heat sink attachment
EP0888039A3 (en) * 1997-06-27 1999-08-25 Sun Microsystems, Inc. Heat sink attachment
US6134112A (en) * 1997-06-27 2000-10-17 Sun Microsystems, Inc. Heat sink attachment
FR2841091A1 (en) * 2002-06-14 2003-12-19 Thomson Licensing Sa Printed circuit assembly radiator clip retention having electrical/electronic component contacting radiator via clip and locking piece ensuring clip retention.
US7697297B2 (en) * 2007-11-29 2010-04-13 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipation device having a clip assembly
KR101404238B1 (en) 2011-06-29 2014-06-05 미쓰비시덴키 가부시키가이샤 Electronic device
CN112077629A (en) * 2020-09-16 2020-12-15 深圳山源电器股份有限公司 Double-sided relieving equipment and material clamping device and material clamping method thereof
CN112077629B (en) * 2020-09-16 2022-06-07 深圳山源电器股份有限公司 Double-sided relieving equipment and material clamping device and material clamping method thereof

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