WO1992009345A1 - Game machine using metallic body as medium - Google Patents

Game machine using metallic body as medium Download PDF

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Publication number
WO1992009345A1
WO1992009345A1 PCT/JP1991/001612 JP9101612W WO9209345A1 WO 1992009345 A1 WO1992009345 A1 WO 1992009345A1 JP 9101612 W JP9101612 W JP 9101612W WO 9209345 A1 WO9209345 A1 WO 9209345A1
Authority
WO
WIPO (PCT)
Prior art keywords
game machine
transmission
board
reception
receiving
Prior art date
Application number
PCT/JP1991/001612
Other languages
French (fr)
Japanese (ja)
Inventor
Takatoshi Takemoto
Kazunari Kawashima
Shigeru Handa
Original Assignee
Kabushiki Kaisha Ace Denken
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Ace Denken filed Critical Kabushiki Kaisha Ace Denken
Priority to KR1019920701713A priority Critical patent/KR920703163A/en
Priority to MC91JP9101612D priority patent/MC2238A1/en
Priority to EP92902499A priority patent/EP0513399B1/en
Priority to DE69126128T priority patent/DE69126128T2/en
Publication of WO1992009345A1 publication Critical patent/WO1992009345A1/en

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Classifications

    • AHUMAN NECESSITIES
    • A63SPORTS; GAMES; AMUSEMENTS
    • A63FCARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F7/00Indoor games using small moving playing bodies, e.g. balls, discs or blocks
    • A63F7/02Indoor games using small moving playing bodies, e.g. balls, discs or blocks using falling playing bodies or playing bodies running on an inclined surface, e.g. pinball games
    • A63F7/022Pachinko
    • AHUMAN NECESSITIES
    • A63SPORTS; GAMES; AMUSEMENTS
    • A63FCARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F7/00Indoor games using small moving playing bodies, e.g. balls, discs or blocks
    • A63F7/02Indoor games using small moving playing bodies, e.g. balls, discs or blocks using falling playing bodies or playing bodies running on an inclined surface, e.g. pinball games
    • AHUMAN NECESSITIES
    • A63SPORTS; GAMES; AMUSEMENTS
    • A63FCARD, BOARD, OR ROULETTE GAMES; INDOOR GAMES USING SMALL MOVING PLAYING BODIES; VIDEO GAMES; GAMES NOT OTHERWISE PROVIDED FOR
    • A63F3/00Board games; Raffle games
    • A63F3/00643Electric board games; Electric features of board games
    • A63F2003/00662Electric board games; Electric features of board games with an electric sensor for playing pieces

Definitions

  • the present invention relates to a game machine that signals a game using a metal body as an intermediary, and in particular, moves a metal body in a space sandwiched between parallel planes so that the metal body enters a specific hole.
  • a metal object for example, a metal ball is moved in a specific space set in the game device, and a prize is determined according to the destination.
  • a pachinko game machine in which a pachinko ball made of a metal ball is dropped and moved in a space sandwiched between parallel planes having many obstacles.
  • This pachinko game machine has a board constituting a space for moving the pachinko balls, a glass plate covering the pachinko balls at regular intervals, and a projection mechanism for projecting the pachinko balls onto an upper portion of the board.
  • Pachinko game machines are installed so that their board surfaces are substantially parallel to the vertical direction.
  • On the board a number of safe holes and pachinko balls that did not enter the safe hole are the most hit when a pachinko ball enters and is ejected from the board.
  • One art hole that finally gathers and is discharged from the panel is provided.
  • pachinko game machines such as machines that are easy to hit and machines that are difficult to hit, are slightly different in pin arrangement and inclination of each pin. , Individuality arises in the machine. In the same machine, there are differences between safe holes with high hit rates and safe holes with low hit rates. Moreover, this difference also varies depending on the machine.
  • this conventional sensor since this conventional sensor has a pair of contacts, the arrangement of the sheets is restricted, and the sensor can only be arranged along the flow path of the pachinko balls. Therefore, it is not possible to detect the movement of the ball from the viewpoint of viewing the entire board. For this reason, for example, there is a problem that it is difficult to detect how and when the ball enters the safe hole and the gate hole.
  • the detection is performed by the physical contact of the contact pair, depending on the motion state of the ball, the pressure on the sheet is weak, and the contact pair does not contact and may not be detected. obtain.
  • poor contact may occur due to wear, corrosion, etc. of the contact pair.
  • erroneous contact of the contact pair may occur due to vibration or the like or due to chattering. For this reason, there is a problem of lack of reliability.
  • An object of the present invention is to be able to detect an arbitrary position of a metal body in a specific space without using a contact that involves physical contact without contact with the metal body, and has high reliability.
  • An object of the present invention is to provide a game machine using a metal body as a vehicle that can obtain a detection result.
  • Another object of the present invention is to provide a metal component capable of housing a part for detecting a metal body and a signal processing part for driving the same in a mounting frame without adversely affecting a game area. It is to provide game machines that use the body as a vehicle.
  • a board having a surface constituting a game area for moving a metal body which is a medium of a game, and a metal body having a lotus on the board surface
  • the cover that covers the board surface while holding the moving space, the attachment frame to which these are attached, and the detection unit that is attached to the cover and detects metal objects in a non-contact manner.
  • a matrix sensor configured to be arranged in a matrix shape, and a signal processing unit that drives the matrix sensor to detect a position of a metal body on a board surface. At least including the part connected to the X sensor
  • a game machine using a metal body as a medium is provided, wherein a part of the game machine is arranged outside the game area in a space surrounded by a mounting frame.
  • the signal processing unit includes at least a transmission circuit that transmits a signal for driving a matrix sensor and a reception circuit that receives a signal from the matrix sensor as the part. It can have onboard transmitting and receiving boards.
  • the transmitting / receiving board can be attached to two lower corners of the lower end of the mounting frame, the side end of the mounting frame, or the lower end of the mounting frame.
  • the lid may have a surface glass body located on the surface of the game machine and an inner glass body inside the glass body.
  • the front glass body and the inner glass body are attached to a brace frame with a space between them, and the inner glass bodies are overlapped to form the inner glass body.
  • a structure having the first and second glass substrates to be formed can be obtained.
  • the transmitting and receiving boards can be arranged in a space between the surface glass body and the inner glass body.
  • the matrix sensor can be provided on the inner glass body.
  • the matrix sensor has a folded transmission line in which a plurality of wires are arranged in parallel and a folded reception line in which a plurality of wires are arranged in parallel.
  • Sandwich the inner glass body And a detection unit can be formed at the intersection of each transmission line and each reception line.
  • the transmission line and the reception line can be arranged on the outer surfaces of the superposed first and second glass substrates in a direction intersecting the first and second glass substrates.
  • the upper surfaces of the first and second glass substrates provided with the transmission lines and the reception lines, including the transmission lines and the reception lines, can be covered with protective sheets.
  • a transmission connector connected to the transmission line, a reception connector connected to the reception line, and a connector mounting plate for fixing these connectors are further provided. It can be configured to be attached to the lower end of the body.
  • the matrix sensor in which the detection units are arranged in a matrix shape is attached to the lid. For this reason, each part of the board surface covered with the lid is in a state of being monitored by the matrix-like detection unit. It is possible to detect the position of a metal object in a specific space, that is, in an arbitrary game area. Also, since a non-contact matrix sensor that can detect metal objects is used without requiring contact with metal objects, it does not need to be in contact with physical objects. Can be detected, and highly reliable detection results can be obtained.
  • the part connected to the matrix sensor is the space inside the mounting frame, which is outside the game area, for example, the lower end and side edges of the mounting frame. Department, Ko It is arranged in a part of the corner. Therefore, it does not narrow the game area or limit the player's field of view.
  • FIG. 1 is an explanatory view showing an outline of a first embodiment of a game machine of the present invention.
  • FIG. 2 is a perspective view conceptually exploding and showing the game machine of the present invention and a detection matrix used for the game machine.
  • Fig. 3 is a partial vertical sectional view of the game machine.
  • Fig. 4 is a front view of the detection matrix.
  • FIG. 5A is an enlarged cross-sectional view of the inner glass body having the detection matrix.
  • FIG. 5B is an enlarged cross-sectional view of a portion indicated by a broken-line circle in FIG. 5A.
  • FIG. 6 is a detailed front view showing the arrangement of transmission lines.
  • FIG. 7 is an enlarged sectional view of a transmission line showing a connection state of a wire.
  • Fig. 8 is an enlarged front view of the transmission terminal.
  • FIG. 9 is a cross-sectional view of the matrix sensor shown in Fig. 4 taken along the line I-I.
  • FIG. 10 is a cross-sectional view of the matrix sensor of FIG. 4 taken along the line II-II.
  • FIG. 11 is a block diagram showing an example of a hardware configuration used in an embodiment of the sensor for detecting the position of a metal body according to the present invention.
  • FIG. 12 is a block diagram showing a configuration of a transmission circuit of a matrix I / O transmission / reception board included in the above hardware.
  • Fig. 13 shows the channel switching port included in the above hardware.
  • Fig. 14 is a block diagram of the receiving circuit of the matrix I / O sending / receiving board included in the above hardware.
  • FIG. 15 is a block diagram of the receiving and transmitting circuits of the CPU memory control board included in the above hardware.
  • FIG. 16 is a flowchart showing a procedure for scanning the detection matrix in the present embodiment.
  • FIG. 17 is an explanatory view showing an outline of a second embodiment of the game machine of the present invention.
  • FIG. 18 is an explanatory diagram showing an outline of a third embodiment of the game machine of the present invention.
  • the game machine 10 As shown in FIG. 1, FIG. 2, and FIG. 3, the game machine 10 according to the present embodiment has a board 11 that forms a space for moving the metal body B and a fixed space between the board 11 and the board 11. It has a glass lid 10a for covering with a cover, a projection mechanism for projecting the metal body B onto the upper part of the board surface 11, and a bracing frame 38 for accommodating these.
  • the game machine 10 is installed such that its board surface 11 is substantially parallel to the vertical direction.
  • a guide rail 12 for determining a game area is provided on a board 11 of the game machine 10.
  • the inside of the guide rails 1 and 2 is the game area.
  • a plurality of safe holes 14a, 14a... Are opened in various places, and a single hole 15 is opened at the lower end of the game area.
  • each of the pins 13 is provided substantially vertically so as to protrude from the board 11 by a length corresponding to the diameter of the metal body B.
  • these pins 13 frequently fall along the board surface 11 and fall between the pins 13 and 13, and frequently collide with many pins 13 existing in the traveling path. It is arranged so as to cause fluctuation in the direction of movement. More specifically, as shown in FIG. 2, a plurality of these pins 13 collectively form a pin array or a pin group 13a.
  • the pin group 13a depending on the projection position of the metal body, i.e., the drop starting point, the direction of movement, the speed, etc., while giving fluctuation to the colliding metal body in the direction of movement
  • the distribution is determined so as to guide the vehicle toward the safe hole 14a, and in some cases, to guide the vehicle away from the safe hole 14a.
  • the safe hole 14a is a hole that becomes a hit when a metal body enters and is discharged from the board surface 11 o.
  • the out hole 15 does not enter the safe hole 14a. This is the hole from which the metal objects finally gather and are discharged from the board surface 11.
  • the front glass cover 10a covering the panel 11 has a double structure of a front glass body 16 and an inner glass body 17 as shown in FIG.
  • the projection mechanism has a launch handle 33 and a drive mechanism (not shown).
  • the handle 33 is provided on the front surface of the game machine 10 and is used for a punching operation of a metal body.
  • the launching operation is performed by rotating the handle 33 by a desired angle.
  • a tray 34 for receiving a metal body supplied from the game machine 10 is provided on a front surface of the game machine 10.
  • a metal object projected on the board 11 enters any one of the safe holes 14a, a predetermined number of prizes are provided.
  • the detection matrix 20 is an inner glass body 17 that is arranged along the board surface 11 while maintaining a certain space. As a substrate.
  • the detection matrix 20 has a plurality of transmission lines 22 and a plurality of reception lines 26.
  • the plurality of transmission lines 22 are arranged and mounted on one side of the inner glass body 17 in parallel in one direction.
  • the plurality of receiving wires 26 are arranged and mounted on the opposite surface of the inner glass body 17 in parallel in one direction.
  • Each transmission line 22 has a parallel folded shape (or loop shape) that makes a U-turn at the folded portion 61.
  • each reception line 26 has a folded (or looped) form in which one reception line 26 makes a U-turn and is parallel.
  • the transmitting terminal 23 and the receiving terminal 27 are arranged in a concentrated manner at the lower end of the inner glass body 17 in a vertical relationship with the inner glass body 17 when attached to the game machine.
  • Each of the receiving lines 26 is electromagnetically coupled to each of the transmitting lines 22 and is arranged in a plane-parallel position with respect to each of the transmitting lines 22 in a direction perpendicular to the plane of the transmitting line 22 so that the electromagnetic characteristics change when the metal body approaches.
  • Each transmission line 22 and each reception line 26 having the inner glass body 17 as a substrate constitute a planar detection matrix 20.
  • each of the substantially square enclosures surrounded by the intersecting transmission lines 22 and reception lines 26 detects metal objects.
  • Detection units 20a, 20a ... Is composed.
  • FIG. 5A shows an enlarged cross-sectional view of the inner glass body 17, and FIG. 5B shows an enlarged view of a portion surrounded by a broken line in FIG. 5A.
  • the inner glass body 17 is an inner protective glass plate 17a, which is a protective sheet for the receiving line 26 (shown in Fig. 4), the receiving glass.
  • the inner glass body (front glass) 17 typically has a square shape with a vertical length a of 367 ⁇ ⁇ 10 mm and a horizontal length b of 4.55 mm ⁇ 10 mm.
  • the inner protective glass plate 17a and the outer glass plate 17d are shorter than the receiving glass base substrate 17b and the transmitting glass base substrate 17c, and the inner glass body 17 Has the lower end 17p exposed.
  • the inner glass body 17 is formed by disposing the transmission line 22 on one surface of the transmission-side glass base substrate 17c with the transparent adhesive layer 18a.
  • the outer glass plate 17 d is bonded with a transparent adhesive ⁇ 1 8 1>, and the receiving wire 26 is attached to the transparent adhesive layer 18 C on the other side of the receiving glass base substrate 1 ⁇ b.
  • the inner protective glass plate 17a is bonded on it with a transparent adhesive layer 18d, and the other side of the transmission side glass space board 17c and the reception side glass base
  • the other side of the substrate 17b is bonded to the other side with a transparent adhesive layer 18e.
  • a transparent conductive film for shielding is provided on the entire surface of the outer glass plate 17d which is the front side of the plurality of transmission lines 22.
  • the transparent conductive film is formed by a film of indium oxide-tin (IT.O.) or a film of tin oxide.
  • the rectangular transmission-side glass base substrate 17c is formed by a transmission-side folded substrate 19a formed of an elongated flexible print substrate (FPC) along one longitudinal side thereof.
  • An L-shaped transmission side routing board 19b composed of a flexible board is bonded to the opposite side of the vertical direction and a part of the lower side in the same manner.
  • the transmitting-side folded substrate 19a is formed with a plurality of, specifically, 32 arc-shaped folded portions 61 in a row by a conductor pattern made of copper foil. Then, as shown in FIG. 7, one end 62 a of a wire 62 is connected to one end 61 a of each folded portion 61 by soldering or welding using a solder 63.
  • FIG. 8 is an enlarged view of a portion surrounded by a broken line in FIG.
  • a conductor pattern made of copper foil is formed on the lower end of the transmission side wiring board 19b on the opposite side along a part of the side.
  • a plurality of, specifically, sixty-four vertically extending transmission terminals 23 for external connection are formed.
  • the transmission terminal 23 is disposed at the lower end 17 p of the inner glass body 17, is not covered by the outer glass plate 17 d, and is exposed. That is, the outer glass plate 17 d is bonded to the transmission line 22 except for the transmission terminal 23 on the transmission-side glass base substrate 1 ⁇ c.
  • the terminal side of each transmission line 22 is It has a transmission terminal 23 of each transmission line 22 and a routing section 64 to each transmission terminal 23.
  • the routing section 64 to each transmission terminal 23 is formed on the transmission side routing board 19b by a conductive pattern, and extends from each transmission terminal 23 along the transmission side routing board 19b. Is running.
  • the other end 6 2b of the wire 6 2 extending from one end 6 1 a of each turn-up portion 6 1 is provided with a tension on the wire 62, and is soldered to the starting point 6 4 a of the corresponding wire-side portion 6 4 on the terminal side.
  • the connection is made by soldering or welding using 63, and connected to the transmission terminal 23 via the routing section 64.
  • the routing portion 64 connects two straight portions with an arc portion S 4 R in order to remove high-frequency interference.
  • the rectangular receiving-side glass base substrate 17a is bonded to the receiving-side folded substrate 29a along one side of the upper end in the horizontal direction, and is partially along the side of the lower end in the horizontal direction.
  • the elongated receiving side routing board 29b is adhered.
  • the reception-side folded substrate 29a has a plurality of, specifically, 32 arc-shaped folded portions 61 formed by a conductor pattern made of copper foil.
  • one end 62 a of the wire 62 is mirrored to one end 61 a of each folded portion by soldering or welding using the solder 63.
  • the other side of the receiving-side routing board 29b has a part protruding at the lower end, and the protruding part has a transmitting part on the side thereof and along part of the side.
  • the conductor pattern made of copper foil can be used in multiple vertical directions at non-facing positions that do not overlap each other.
  • the extended receiving terminal 27 for external connection is formed. I have. Specifically, 64 receiving terminals 27 are provided.
  • the terminal side of each reception line 26 has a reception terminal 27 of each reception line 26 and a routing section 64 to each reception terminal 27.
  • the routing section 64 to each receiving terminal 27 is formed on the receiving side routing board 29b by a conductor pattern, and is connected from each receiving terminal 27 to the receiving side routing board 29b. Extending along.
  • the other end 6 2b of the wire 6 2 extending from one end 6 la of each folded portion 6 1 is provided with a tension on the wire 6 2, and the solder 6 is connected to the starting point 6 4 a of the corresponding wire-side portion 6 4 on the terminal side. It is connected by soldering or welding using 3 and connected to the receiving terminal 27 via the routing section 6 4.
  • the transmission line 22 and the reception line 26 are thus connected to the folded portions 61 formed on the folded substrates 19a and 29a, and to the folded substrates 19b and 29b, respectively.
  • each wire 62 has a matte-treated black surface to prevent light reflection in order to make it inconspicuous to the player.
  • the transmission line 22 is 32 rows
  • the reception line 26 is 32 columns
  • the detection unit 20 a is There are a total of 102 4 patterns.
  • patterns other than the outer patterns are omitted.
  • the thickness of the wires constituting the transmission line 22 and the reception line 26 is preferably set to a value of 25;
  • the entire widths c and d of the transmission terminal 23 and the reception terminal 27 are each 126 mm, and as shown in FIG.
  • the widths e, of the vertically extending portions of the transmission-side folded substrate 19a and the transmission-side routing substrate 19b are each formed to be 1 mm or less.
  • the width g of each of the transmission terminal 23 and the reception terminal 27 is 1.5 mm.
  • a connector mounting plate 66 is mounted on the inner glass body 17 below the inner protective glass plate 17a.
  • the connector attachment plate 66 is integrally fixed to the inner glass body 17 by sandwiching the inner glass body 17 from both sides at the lower end 17P thereof by a holding portion 66a.
  • the connector mounting plate 66 is made of plastic or stainless steel, and extends downward along the width of the inner glass body 17.
  • the transmitting connector 67a and the receiving connector 67b are fixed to the connector mounting plate 66 at positions corresponding to the transmitting terminal 23 and the receiving terminal 27e, as shown in FIG.
  • the transmission connector 67a is connected to the transmission terminal 23 of each transmission line.
  • the reception connector 67 b is connected to the reception terminal 27 of each reception line 26.
  • the connector attachment plate 66 is thickest at the position where the transmission connector 67a and the reception connector 67b are provided.
  • the thickness h of this part depends on the outer glass plate 17 d and the inner protective The thickness is set so as to be substantially equal to or slightly smaller than the thickness i of the inner glass body 17 including the lath plate 17a. Therefore, the transmission connector 67a and the reception connector 67b used are low in height so as to satisfy this condition.
  • a matrix I / O transmission / reception board 171 is arranged between the surface glass body 16 and the matrix sensor 20. As shown in Fig. 1, the matrix I / O transmit / receive board 17 1 is located at the lower end 38 a of the mounting frame 38 at the center of the bottom of the mounting frame 38 where the panel 11 is not covered (shaded lines). (Shown). In the present embodiment, the matrix I / O transmission / reception board 171 has a size of 350 ⁇ 40 mm.
  • Matrix I / O transmission and reception board 17 1 is a mounting board 17 1 a consisting of a printed circuit board and a matrix I / O case accommodating the mounting board 17 1 a. 3 5 and.
  • the mounting board 17 1a includes a transmitting circuit 40 for transmitting to the plurality of transmitting lines 22 of the matrix sensor 20, a receiving circuit 50 for receiving from the plurality of receiving lines 26, and a transmitting connector.
  • a connection connector 37 is connected to the connection connector 67a and the reception connector 67b, respectively.
  • the transmission connector 67a, the reception connector 67b, and the junction connector 37 are connected to each other so that the transmission terminal 23 is connected to the transmission circuit 40, and the reception terminal 27 is connected to the transmission circuit 40. It is connected to the receiving circuit 50.
  • the matrix / 0 transmission / reception board 1771 may be configured by using a plurality of mounting boards 1771a.
  • a signal processing unit used for detecting a metal body is as shown in FIGS. 11 to 16.
  • the matrix sensor 20 is under the control of the CPU memory control board 172 via the matrix I / O transmission and reception board 171.
  • the CPU memory control board 172 constitutes a data processing device, and can communicate with a communication line 179.
  • the CPU memory control board 172 has an interface 176 for the control device 30 to read a monitoring point from the card 173.
  • the card 173 is a memory card of a monitoring memory which records a monitoring point of a metal body in a readable manner and is detachable from the interface L-176.
  • the card 173 includes safe holes 14a, 14a, etc. provided on the board of the game machine 10 and data on the hit ball detection position and the positions of the out holes 15 and the safe holes 14a. a, 14 a... and the algorithm for detecting metal objects entering the art hole 15 are recorded as monitoring data.
  • a RAM card, a mask R ⁇ M, an EPROM, a one-shot ROM, or the like can be used as the card.
  • Option 174 which is connected to the CPU memory control board 172, traces the trajectory of a metal body moving between the board surface 11 of the game console 10 and the inner glass body 617. It is a device for recording.
  • Options 1 7 4 include optical disc, optical A storage device using a disk-type storage medium such as a personal disk, a storage device using a tape-type storage medium such as an analog or digital tape recorder and a video tape recorder can be used. Other computer systems can also be used. Further, a storage device using a solid-state storage medium such as a semiconductor memory may be used.
  • the present embodiment is applied to a game machine, it is preferable that the embodiment be small and have a large storage capacity. This is because the operating rate of the game machine 10 increases during a time period when the number of gamers increases, requiring a huge storage capacity.
  • the recorded data is applied to a computer that incorporates software for analyzing the trajectory of the metal body, and is processed by arithmetic processing to obtain the necessary data at the amusement arcade.
  • the matrix I / O transmission / reception board 17 1 has a transmission circuit 40 and a reception circuit 50.
  • the transmission circuit 40 is a circuit for sequentially transmitting a signal of a predetermined frequency to each transmission line 22.
  • the receiving circuit 50 is a circuit that sequentially receives a signal from each receiving line 26 in synchronization with the transmitting circuit 40.
  • As the voltage waveform to the transmission line 22 by the transmission circuit 40 a continuous sin wave centered on 0 V having a frequency of 1 to 1.3 MHz is preferable.
  • the transmission circuit 40 includes a transmission connector 41, an amplifier 42 connected to the transmission connector 41, a channel switching logic 43, an amplifier 42, and Connect to the analog multiplexer 44 connected to the channel switching logic 43 and the analog multiplexer 44, and , ⁇ ⁇ ⁇ + ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ ⁇ Have been.
  • the channel switching logic 43 operates using two control lines, one for clock and one for reset, by effectively using the counter IC 43a. Things.
  • the receiving circuit 50 as shown in FIG.
  • the receiving circuit 50 receives a signal from each receiving line 26 via each CT 51.
  • the CT 51 disconnects each of the receiving lines 26 and the analog multiplexer 52 and amplifies the signal from each of the receiving lines 26 by 10 times.
  • the analog multiplexer 52 sequentially receives signals from the respective CTs 51, and the amplifier 53 amplifies the signal from the analog multiplexer 52.
  • the channel switching logic 54 is the same as the channel switching logic 43 of the transmission circuit 40.
  • the CPU memory control board 17 2 has a CPU connector connected to the controller 30 on the transmitting side. Receiving the transmission clock, a sequence control circuit 47 for transmitting a transmission clock in accordance with a start signal from the control device 30 via the CPU connector 46, and receiving the transmission clock. It has a bandpass filter 48 for transmitting a transmission signal, and an amplifier 49 for amplifying the transmission signal and transmitting the amplified signal to the transmission connector.
  • the CPU memory control board 172 includes an amplifier 71 for amplifying a signal received from the receiving connector 55, a bandpass filter 72 for receiving the amplified signal, and a bandpass filter.
  • a full-wave rectifier / amplifier 73 that receives the received signal from the filter 2 and a two-stage mouthpiece that receives the received signal from the full-wave rectifier / amplifier 73 Filters 74a and 74b, and one mouth.
  • An AZD converter 75 that receives a received signal from the filter 74 b and sends digital data under the control of the sequence control circuit 47 to the bidirectional RAM 76, receives the digital data, and receives the digital data. 7 to write received data, and transmit the received data to the control device 30 via the CPU connector 46 in response to the read signal from the CPU connector 46. Have.
  • the bidirectional RAM 76 stores the position of the metal body as detection data of the detection unit 20a by each transmission line 22 and each reception line 26 based on a signal from the reception circuit 50. Memory.
  • the bidirectional RAM 76 has a counter inside, and all processing of metal matrix data is performed by the counter.
  • Contro Lonor Board 1 72 has a power supply unit 77.
  • the controller 30 reads the monitoring area data of the card 173, reads the bidirectional RAM76 detection data, and monitors the metal object by associating the detection data with the monitoring area data of the metal object. It is supposed to.
  • the address signal and the control signal from the control device 30 are transmitted to the game machine 10 via the CPU connector 46.
  • the sequence control circuit 47 on the transmission side starts. Receiving the clock signal, generates a transmission clock by dividing the 16 MHz original clock as necessary, and outputs this.
  • the transmission clock from the sequence control circuit 47 is waveform-shaped from a re-digital signal to an analog signal by a non-pass filter 48, then amplified by an amplifier 49, and then transmitted. Sent to 1.
  • the analog multiplexer 44 amplified by the amplifier 42 in the transmission circuit 40 is a channel switched by the channel switching logic 43 and a totem pole driver. 4 are operated sequentially, whereby the re-temp pole driver 45 sequentially outputs the signal amplified by the amplifier 42 to the transmission line 22 at a predetermined period (see FIG. 16). See page 91).
  • a plurality of folds are transmitted from the transmission circuit 40.
  • a signal of a predetermined frequency is sequentially transmitted to the return transmission line 22 to generate a magnetic field
  • an electromotive force is generated in the reception line 26 electromagnetically coupled to the transmission line 22 by mutual induction.
  • the metal body which is a metal
  • the surface of the metal body is swirled in a direction to cancel the magnetic flux by the matrix sensor 20.
  • An electric current is generated. For this reason, the magnitude of the induced current in the sparsely located receiving line 26 becomes smaller due to the eddy current.
  • the receiving circuit 50 synchronizes with the transmitting circuit 40 by the sequence control circuit 47 and receives a signal from each receiving line 26 via each CT sensor 51.
  • the induced current appearing on the plurality of receiving lines 26 is amplified 10 times by the CT sensor 51. Since amplification is performed by the CT sensor 51, it is not necessary to increase the amplification degree of the amplifier on the receiving side.
  • the CT sensor 51 insulates the receiving lines 26 of the matrix sensor 20 constituting the metal sensor from the analog multiplexer 52 of the receiving circuit 50, and separates the receiving circuit 50 from the game machine 10. It prevents noise from entering the receiver and amplifies the received signal.
  • the analog multiplexer 52 switches signals from the respective receiving lines 26 via the CT sensor 51 by the channel switching logic 54 and sequentially outputs the signals in a predetermined frequency.
  • the signal from the analog multiplexer 52 is amplified 100 times by the amplifier 53 (see step 92 in FIG. 16).
  • the received signal passes through a receiving connector 55, an amplifier 71, and a bandpass filter 72, and is amplified and detected.
  • the received signal from the band-pass filter 72 becomes an analog signal, and the analog signal is subjected to waveform shaping by the full-wave rectifier / amplifier 73.
  • the signal from the full-wave rectifier 7amplifier 73 is averaged by edge processing in the low-pass fi lters 74a and 74b.
  • the received signal is sent to the AZD converter 75.
  • the AD converter 75 converts a signal from the matrix sensor 20 into a digital signal in a predetermined bit unit, for example, 12 bits, and is controlled by the sequence control circuit 63 to detect data. Record on the bi-directional RAM 76 (see step 93 in Fig. 16). This processing speed is 25,000 times per second.
  • the bi-directional RAM 76 records the detection data in response to the write signal from the sequence control circuit 63, regardless of the operation of the control device 30, and then inputs one clock. Raise the rear dress +1 (see step 94 in Fig. 16).
  • the capacity of the bidirectional RAM 76 is, for example, 248 bytes.
  • the analog multiplexer 52 of the receiving circuit 50 switches the signal from each receiving line 26 (see step 95 in FIG. 16), and according to the two receiving lines 26, Repeat the steps 32 times (see step 96 in Fig. 16). 3 If this is repeated twice, the analog multiplexer 44 of the transmission circuit 40 switches the transmission line 22 (see step 97 in Fig. 16), and again, the signal processing Is repeated.
  • the receiving line 26 whose received signal has changed and the transmitting lines 22, 22,... Transmitted at that time are detected by scanning, and the matrix sensor is detected from the intersection position.
  • the position of the metal body at 20 can be grasped as coordinates. Since the number of detection units 20a is 32 for the transmission line 22 and 32 for the reception line 26, there are a total of 10 2 4 pieces. It can be detected even after passing through a and the hole 15.
  • the bidirectional RAM 76 determines the matrix sensor 20 from the intersection of the receiving line 26 where the receiving signal has changed and the transmitting line 22 that transmitted at that time.
  • the position of the metal body at the time is stored as detection data of the detection unit 20a by each transmission line 22 and each reception line 26.
  • the control device 30 reads the detection data on the position of the metal object recorded in the bidirectional RAM 76 by the read start signal as necessary, performs an arithmetic operation, and stores the detection data in the card. Monitor the metal object in correspondence with the monitoring data of the metal object stored in 173.
  • Control device 30 repeats this process.
  • the matrix sensor 20 can follow the movement, such as the insertion state of a metal object on the board 11 of the game machine 10, as a change in coordinates.
  • the progress of the game can be monitored by detecting the movement trajectory of the metal object put on the board by the matrix sensor 20.
  • detecting an abnormal trajectory of a metal object it can detect fraud.
  • the direction of movement of a metal body is intentionally bent by a magnet or the like from the outside.
  • by counting the number of metal objects entering the safe hole it is possible to detect the presence of a game machine in which the metal object has abnormally entered the safe hole. If such machines continue to operate, the operation of the amusement arcade will be adversely affected, so the operation must be stopped. Therefore, it is important to determine whether a metal body is abnormally easy to enter a safe hole.
  • the card 173 When monitoring the status of the metal body with the new game machine 10, the card 173 can be replaced accordingly.
  • the card 173 can be easily set for monitoring data simply by attaching it to the interface section 176 of the data processing device, and can be applied to various types of game machines by replacing game machines. In such cases, it is easy to change the monitoring data.
  • the card 173 can be manufactured by copying one force as long as it is used for the same type of game machine 10.
  • the card 173 When performing more complicated processing, the card 173 can cope with more complicated processing by freely selecting a control device having a data processing speed corresponding to the processing.
  • the controller 30 is sufficient if an inexpensive 8-bit CPU is used, and if a complicated algorithm is required, Select one that uses a 16-bit CPU for high-speed processing. It is good. In any case, the scanning speed of the metal body is not affected by the CPU because the scanning is not performed via the CPU.
  • the matrix I / O transmission board 17 1 having the transmission circuit 40 and the reception circuit 50 attached thereto is mounted on the lower end 38 a of the mounting frame 38, and the game machine It does not obstruct the board 11 of 10 and there is little discomfort in the game.
  • the matrix sensor 20 mates the inner glass body 17 even in the case of failure.
  • FIG. 17 shows a second embodiment of the present invention.
  • the matrix I / O transmission / reception board 17 1 is provided at the side end 38 b of the mounting frame 38 at the center of the board 1. It is attached vertically to the position that does not cover 1 (indicated by diagonal lines).
  • the matrix I / O transmission signal reception board 17 1 is not placed on the matrix sensor 20 because the weight of the matrix sensor 20 is not applied to the reception board 17 1. 1 to matrix sensor 20 Vibration is difficult to transmit, and transmission and reception are not affected by the vibration.
  • the matrix sensor 20 can be moved with respect to the board surface 11.
  • the position can be adjusted in the range of 0 to 20 mm. Also, in the game, since the metal body is hard to chrysanthemum on the side end 38b side of the brace frame 38, the matrix I / O transmission / reception board 17 1 is made of a metal body. Hardly affected by vibration.
  • FIG. 18 shows a third embodiment of the present invention.
  • the game machine of this embodiment is provided with a large number of receptacles 11a for receiving a metal body at the lower portion of the board surface 11.
  • the indicator lamp 11b corresponding to the receptacle 11a lights up, and the prize is given according to the combination of the lights.
  • the prize is given according to the combination of the lights.
  • the matrix I / O transmission / reception board 17 1 is attached to the lower end 38 a of the mounting frame 38 and both lower corners 38 c on the board surface.
  • the inner glass body provided with the matrix sensor is configured using two glass substrates, but the present invention is not limited to this.
  • a single glass substrate may be used.
  • the transmission line and the reception line are provided on one surface and the other surface of one glass substrate.
  • the present invention can be applied to a game machine in which a metal body is moved along a board surface.

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Abstract

A game machine is provided with a board having a surface (11) configuring the game region where a metallic body as a medium moves, a cover (10a) covering the surface (11) and holding a space in which the metallic body moves on the surface (11), a mounting frame (38) for mounting the board and the cover. Also, the machine is provided with a matrix sensor (20) which is mounted on the cover (10a) and having sensor units for sensing the metallic body in the form of a matrix, and a signal processing unit for sensing the position of the metallic body on the surface (11) by driving the matrix sensor (20). At least part of the signal processing unit including the portion being in connection with the matrix sensor (20) is disposed on the outside of the game region in the space surrounded by the mounting frame (38).

Description

明 細 書 金属体を媒介物とするゲーム機 [技術分野]  Description Game machine using a metal body as a vehicle [Technical field]
本発明は、 金属体を媒介物と してゲーム を信号するゲーム 機に係 り 、 特に、 平行平面に挾まれる空間内での金属体を運 動させて、 特定の孔に金属体が入っ たと き ヒ ッ ト と なるゲ一 ム機に関する。  The present invention relates to a game machine that signals a game using a metal body as an intermediary, and in particular, moves a metal body in a space sandwiched between parallel planes so that the metal body enters a specific hole. A game machine that can be a hit.
[背景技術] [Background technology]
金属体を媒介物とするゲーム機には、 当該ゲーム機におい て設定される特定の空間内で、 金属体、 例えば、 金属球を移 動させ、 その移動先に応じて、 賞の有無を決めるものがある その代表的なもの と して、 例えば、 金属球からなるパチンコ 玉を、 多数の障害が設けてある、 平行平面に挾まれる空間内 を落下移動させて遊ぶパチンコゲーム機がある。  For a game machine that uses a metal object as a vehicle, a metal object, for example, a metal ball is moved in a specific space set in the game device, and a prize is determined according to the destination. As a typical example, there is a pachinko game machine in which a pachinko ball made of a metal ball is dropped and moved in a space sandwiched between parallel planes having many obstacles.
このパチンコゲーム機は、 パチンコ玉を移動させるための 空間 を構成する盤面と、 それを一定間隔を保っ て覆う ガラス 板と、 パチンコ玉を、 盤面の上部に投射するための投射機構 と を有する。 パチンコゲーム機は、 その盤面が、 鉛直方向に 実質的に平行と なる よ う に、 設置される。 盤面には、 パチン コ玉がそ こ に入っ て盤面から排出される と ヒ ッ ト と なる、 複 数個のセーフ孔と 、 セーフ孔に入 らなかっ たパチンコ玉が最 終的に集まって、 盤面から排出される 1つのァゥ ト孔とが設 けられている.。 This pachinko game machine has a board constituting a space for moving the pachinko balls, a glass plate covering the pachinko balls at regular intervals, and a projection mechanism for projecting the pachinko balls onto an upper portion of the board. Pachinko game machines are installed so that their board surfaces are substantially parallel to the vertical direction. On the board, a number of safe holes and pachinko balls that did not enter the safe hole are the most hit when a pachinko ball enters and is ejected from the board. One art hole that finally gathers and is discharged from the panel is provided.
また、 盤面には、 盤面に沿って落下するパチンコ玉が頻繁 に衝突して、 その運動方向に揺らぎを生じさせる障害物と し て、 多数のピン (釘) が、 パチンコ玉の直径相当の長さ分、 盤面から突出した状態で、 実質的に垂直に設けられている - これらのピンは、 衝突するパチンコ玉を、 その運動方向に対 して揺らぎを与えつつ、 ある場合には、 セーフ孔に向かう よ う に誘導し、 また、 ある場合には、 セーフ孔から外れるよう に誘導するよう に、 その分布が決定されて、 盤面に配置され ている。  In addition, a large number of pins (nails) are used as obstacles on the board, which often collide with pachinko balls falling along the board surface and cause fluctuations in the direction of movement. Now, protruding from the board, they are mounted substantially vertically-these pins give the impinging pachinko ball a wobble in the direction of its movement and, in some cases, a safe hole The distribution is determined and arranged on the board so as to guide the vehicle toward the center, and in some cases, to guide the vehicle out of the safe hole.
このよ うな構造を有するため、 パチンコゲーム機では、 そ れぞれのピンの配置や、 傾きの僅かな違いにょ リ、 ヒ ッ トの でやすい機械、 ヒ ッ トでにく い機械のよう に、 機械に個性が 生ずる。 また、 同じ機械においても、 ヒ ッ ト率の高いセーフ 孔、 ヒ ッ ト率の低いセーフ孔などの違いを生じる。 しかも、 この違い方も、 機械によって種々異なる。  Due to such a structure, pachinko game machines, such as machines that are easy to hit and machines that are difficult to hit, are slightly different in pin arrangement and inclination of each pin. , Individuality arises in the machine. In the same machine, there are differences between safe holes with high hit rates and safe holes with low hit rates. Moreover, this difference also varies depending on the machine.
この種のゲーム機を多数設置したゲームセンタ等において は、 各ゲーム機の個性を知っておく ことは、 ゲームセンタの 利益管理や、 顧客管理の上で、 経営上重要である。 例えば、 ヒ ッ トの出過ぎる機械が多いと、 ゲームセンタ側が損し、 一 方、 ヒ ッ トがでにくい機械ばかりであると、 客が興味を失つ て、 営業上好ま しく ない。 従って、 センタ に設置されて各ゲ ーム機の個性を知って、 対策をとる必要がある。 このよ う な 目的で、 パチンコ ゲーム機において、 ノ、。チンコ 玉の通過経路を検出する こ と が行われている。 このために用 い られるセンサと して、 例えば、 特公昭 6 4 — 3 5 6 0号公 報には、 接点対を構成する上側シー ト と下側シー ト と を設け たものが開示されている。 この技術は、 上側シー ト にパチン コ玉が載って押圧される こ と によ り 、 接点対が接触して、 ノヽ ° チンコ玉の存在を検知するものである。 In a game center where many game machines of this type are installed, it is important to know the individuality of each game machine in terms of profit management of the game center and customer management. For example, if there are too many machines with hits, the game center will be damaged, while if the machines are difficult to hit, customers will lose interest and are not favorable for business. Therefore, it is necessary to take measures by knowing the individuality of each game machine installed in the center. For such a purpose, in pachinko game machines, Detecting the path through which the ball passes. As a sensor used for this purpose, for example, Japanese Patent Publication No. 6-35060 discloses a sensor provided with an upper sheet and a lower sheet constituting a contact pair. I have. According to this technique, when a pachinko ball is placed on the upper sheet and pressed, the contact pair comes into contact with each other and the presence of the pinching ball is detected.
し かし、 この従来のセンサでは、 接点対を有するため、 シ 一卜の配置が制約され、 パチンコ玉の流路に沿っ て し か配置 できない。 このため、 盤面全体を見る視点からの玉の動き を 検出する こ と ができない。 こ のため、 例えば、 セーフ孔、 ァ ゥ ト孔へ玉がどのよ う に して入る かと いつ たこ と が検出 し に く い、 と いう 問題がある。  However, since this conventional sensor has a pair of contacts, the arrangement of the sheets is restricted, and the sensor can only be arranged along the flow path of the pachinko balls. Therefore, it is not possible to detect the movement of the ball from the viewpoint of viewing the entire board. For this reason, for example, there is a problem that it is difficult to detect how and when the ball enters the safe hole and the gate hole.
また、 接点対の物理的接触によ り検出が行われるので、 玉 の運動状態によっ ては、 シー ト に対する押圧が弱く な リ 、 接 点対が接触せず、 検出されない こ と が起こ り得る。 また、 接 点対の摩耗、 腐食等によ り 、 接触不良を起こすこ と があ り得 る。 さ ら に、 振動等によって、 または、 チャ タ リ ングによつ て、 接点対が誤接触する こ と が起こ り得る。 このため、 信頼 性に欠ける と い う 問題がある。  In addition, since the detection is performed by the physical contact of the contact pair, depending on the motion state of the ball, the pressure on the sheet is weak, and the contact pair does not contact and may not be detected. obtain. In addition, poor contact may occur due to wear, corrosion, etc. of the contact pair. Further, erroneous contact of the contact pair may occur due to vibration or the like or due to chattering. For this reason, there is a problem of lack of reliability.
さ らに、 玉によ る押圧力 を利用するので、 逆に、 玉の運動 に微妙に影響を与える と い う 問題もある。  Furthermore, since the pressing force of the ball is used, there is a problem that the movement of the ball is slightly affected.
このよ う な問題は、 パチンコゲーム機に限らず起こ り得る。 従っ て、 なんら かの対策を採る こ と が望まれている。 一方、 センサを、 盤面に沿って配置する場合、 金属体を検 出する部分と、 その駆動を行なう信号処理部とを、 ゲーム域 に対する悪影響、 例えば、 ゲーム域を狭める、 視野を妨げる 等の影響を与えずに、 限られた空間にどのよう に収容すれば よいかという こ とが問題となる。 この点については、 従来、 考えられていなかった。 Such problems can occur not only in pachinko game machines. Therefore, it is desirable to take some measures. On the other hand, when the sensors are arranged along the board surface, the part for detecting the metal body and the signal processing unit for driving the metal body have an adverse effect on the game area, for example, an influence such as narrowing the game area and obstructing the visual field. The problem is how to accommodate the space in a limited space without providing the space. This has not been considered before.
[発明の開示]  [Disclosure of the Invention]
本発明の目的は、 物理的接触を伴う接点を用いる ことな く 、 特定の空間内での金属体の任意の存在位置を、 金属体に对し て非接触で検出でき、 高い信頼性を有する検出結果が得られ る、 金属体を媒介物とするゲーム機を提供するこ と にある。  An object of the present invention is to be able to detect an arbitrary position of a metal body in a specific space without using a contact that involves physical contact without contact with the metal body, and has high reliability. An object of the present invention is to provide a game machine using a metal body as a vehicle that can obtain a detection result.
また、 本発明の他の目的は、 ゲーム域に対して悪影響を与 えずに、 金属体を検出する部分と、 その駆動を行なう信号処 理部とを取付枠内に収容することができる金属体を媒介物と するゲーム機を提供する こ と にある。  Further, another object of the present invention is to provide a metal component capable of housing a part for detecting a metal body and a signal processing part for driving the same in a mounting frame without adversely affecting a game area. It is to provide game machines that use the body as a vehicle.
上記目的を達成するため、 本発明の一態様によれば、 ゲ一 ムの媒介物である金属体を運動させるためのゲーム域を構成 する面を有する盤と、 この盤面上を金属体が蓮動する空間を 保持させた状態で該盤面を覆う蓋体と、 これらが取付けられ る敢付枠と、 蓋体に敢付けられ、 金属体を非接触で検知する ための検知単位をマ ト リ クス状に配置して構成されるマ ト リ クスセンサと、 このマ ト リ クスセンサを駆動して、 盤面上の 金属体の位置を検出する信号処理部と を備え、 信号処理部は、 上記マ トリ ク スセンサと接続される部分を含む、 少なく とも 一部分が、 取付枠で囲まれる空間内の、 上記ゲーム域の外側 に配置される こ と を特徴とする金属体を媒介物とするゲーム 機が提供される。 In order to achieve the above object, according to one embodiment of the present invention, a board having a surface constituting a game area for moving a metal body which is a medium of a game, and a metal body having a lotus on the board surface The cover that covers the board surface while holding the moving space, the attachment frame to which these are attached, and the detection unit that is attached to the cover and detects metal objects in a non-contact manner. A matrix sensor configured to be arranged in a matrix shape, and a signal processing unit that drives the matrix sensor to detect a position of a metal body on a board surface. At least including the part connected to the X sensor A game machine using a metal body as a medium is provided, wherein a part of the game machine is arranged outside the game area in a space surrounded by a mounting frame.
上記信号処理部は、 上記一部分と して、 マ ト リ ク スセンサ を駆動させるための信号を送信する送信回路と、 マ ト リ ク ス センサからの信号を受信する受信回路と を少な く と も搭載し た送信 · 受信ボー ドを有する こ と ができ る。  The signal processing unit includes at least a transmission circuit that transmits a signal for driving a matrix sensor and a reception circuit that receives a signal from the matrix sensor as the part. It can have onboard transmitting and receiving boards.
上記送信 · 受信ボー ドは、 上記取付枠の下端部、 上記取付 枠の側端部または上記取付枠の下端部の二つのコーナ一部に 取 り付ける こ と ができる。  The transmitting / receiving board can be attached to two lower corners of the lower end of the mounting frame, the side end of the mounting frame, or the lower end of the mounting frame.
上記蓋体は、 ゲーム機の表面に位置する表面ガラス体と、 その内側にある内側ガラス体と を有する構成とする こ と がで き る。 この場合、 表面ガラス体と内側ガラス体と は、 それら の間に空間を隔てて敢付枠に取 り付け られる こ と が好ま しい , 上記内側ガラス体は、 重ね合わされて上記内側ガラス体を構 成する第 1 および第 2 のガラス基板と を有する構造とする こ と ができる。  The lid may have a surface glass body located on the surface of the game machine and an inner glass body inside the glass body. In this case, it is preferable that the front glass body and the inner glass body are attached to a brace frame with a space between them, and the inner glass bodies are overlapped to form the inner glass body. A structure having the first and second glass substrates to be formed can be obtained.
上記送信 ' 受信ボー ドは、 表面ガラ ス体と 内側ガラス体と の間にある空間に配置される こ と ができる。  The transmitting and receiving boards can be arranged in a space between the surface glass body and the inner glass body.
上記マ ト リ ク スセンサは、 内側ガラス体に設ける こ と がで き る。  The matrix sensor can be provided on the inner glass body.
また、 上記マ ト リ ク スセンサは、 複数本を並列配置した折 り返し状の送信線と、 複数本を並列配置した折 り返し状の受 信線と ^有し、 送信線および受信線は、 内側ガラス体を挟ん で交差する方向に配置され、 各送信線と受信線との交差部分 に検知単位が形成される構成とすることができる。 Further, the matrix sensor has a folded transmission line in which a plurality of wires are arranged in parallel and a folded reception line in which a plurality of wires are arranged in parallel. , Sandwich the inner glass body , And a detection unit can be formed at the intersection of each transmission line and each reception line.
送信線および受信線は、 上記重ね合わされた第 1 および第 2のガラス基板の外側の面に、 第 1 および第 2のガラス基板 を挟んで交差する方向に配置することができる。  The transmission line and the reception line can be arranged on the outer surfaces of the superposed first and second glass substrates in a direction intersecting the first and second glass substrates.
上記送信線および受信線が設けられている第 1 および第 2 のガラス基板は、 送信線および受信線を含めて、 その上面を、 保護シー トで覆う こ と ができる。  The upper surfaces of the first and second glass substrates provided with the transmission lines and the reception lines, including the transmission lines and the reception lines, can be covered with protective sheets.
送信線に接続される送信コネクタ と、 受信線に接続される 受信コネクタ と、 これらのコネク タ を固定するためのコネク タ取付板と をさ らに有し、 コネク タ取付板を、 上記内側ガラ ス体の下端部に取り付ける構成とする ことができる。  A transmission connector connected to the transmission line, a reception connector connected to the reception line, and a connector mounting plate for fixing these connectors are further provided. It can be configured to be attached to the lower end of the body.
本発明は、 マ ト リ ク ス状に検知単位が配置されるマ ト リ ク スセンサを蓋体に取り付けている。 このため、 蓋体に覆われ る盤面の各所が、 マ 卜 リ クス状の検知単位によ リ監視される 状態となる。 特定の空間、 すなわち、 任意のゲーム域内での 金属体の存在位置を検出するこ と ができる。 レかも、 金属体 の接触を要しないで、 金属体検出ができる非接触のマ ト リ ク スセンサを用いているので、 物理的接触を伴う接点を用いる ことなく、 金属体に対して非接触で検出でき、 高い信頼性を 有する検出結果が得られる。  According to the present invention, the matrix sensor in which the detection units are arranged in a matrix shape is attached to the lid. For this reason, each part of the board surface covered with the lid is in a state of being monitored by the matrix-like detection unit. It is possible to detect the position of a metal object in a specific space, that is, in an arbitrary game area. Also, since a non-contact matrix sensor that can detect metal objects is used without requiring contact with metal objects, it does not need to be in contact with physical objects. Can be detected, and highly reliable detection results can be obtained.
また、 マ ト リ クスセンサを駆動する信号処理部のうち、 マ ト リ クスセンサに接続される部分は、 取付枠内の空間であつ て、 ゲーム域の外側、 例えば、 取付枠の下端部、 側端部、 コ ーナ一部等に配置される。 従って、 ゲーム域に対して、 それ を狭める こ と、 また、 遊技者の視野を制限する こ とはない。 Also, of the signal processing unit that drives the matrix sensor, the part connected to the matrix sensor is the space inside the mounting frame, which is outside the game area, for example, the lower end and side edges of the mounting frame. Department, Ko It is arranged in a part of the corner. Therefore, it does not narrow the game area or limit the player's field of view.
[図面の簡単な説明]  [Brief description of drawings]
第 1 図は本発明のゲーム機の第 1実施例の概要を示す説明 図。  FIG. 1 is an explanatory view showing an outline of a first embodiment of a game machine of the present invention.
第 2図は本発明のゲーム機と、 これに用い られる検知マ 卜 リ クスと を概念的に分解して示した斜視図。  FIG. 2 is a perspective view conceptually exploding and showing the game machine of the present invention and a detection matrix used for the game machine.
第 3 図はゲーム機の部分縦断面図。  Fig. 3 is a partial vertical sectional view of the game machine.
第 4図は検知マ ト リ クスの正面図。  Fig. 4 is a front view of the detection matrix.
第 5 A図は検知マ ト リ クスを有する内側ガラス体の拡大断 面図。  FIG. 5A is an enlarged cross-sectional view of the inner glass body having the detection matrix.
第 5 B図は第 5 A図において破線の円で示す部分の拡大断 面図。  FIG. 5B is an enlarged cross-sectional view of a portion indicated by a broken-line circle in FIG. 5A.
第 6 図は送信線の配置形態を示す詳細な正面図。  FIG. 6 is a detailed front view showing the arrangement of transmission lines.
第 7図はワイヤの接続状態を示す送信線の拡大断面図。 第 8 図は送信端子の拡大正面図。  FIG. 7 is an enlarged sectional view of a transmission line showing a connection state of a wire. Fig. 8 is an enlarged front view of the transmission terminal.
第 9 図は第 4図に示すマ ト リ ク スセンサの I一 I線靳面図。 第 1 0図は第 4図のマ ト リ ク スセンサの I I - I I線断面図。 第 1 1 図は本発明の金属体の存在位置を検出するためのセ ンサの一実施例で用いられるハー ドウェアの構成の一例を示 すブロ ッ ク図。  Fig. 9 is a cross-sectional view of the matrix sensor shown in Fig. 4 taken along the line I-I. FIG. 10 is a cross-sectional view of the matrix sensor of FIG. 4 taken along the line II-II. FIG. 11 is a block diagram showing an example of a hardware configuration used in an embodiment of the sensor for detecting the position of a metal body according to the present invention.
第 1 2 図は上記ハー ドウェアに含まれるマ ト リ ク ス I/O送 信 · 受信ボー ドの送信回路の構成を示すブロ ッ ク図。  FIG. 12 is a block diagram showing a configuration of a transmission circuit of a matrix I / O transmission / reception board included in the above hardware.
第 1 3図は上記ハー ドウェアに含まれるチヤ ンネル切替口 ジックの主要部を示すプロ ッ ク図。 Fig. 13 shows the channel switching port included in the above hardware. A block diagram showing the main parts of the trick.
第 1 4図は上記ハードウェアに含まれるマ ト リ クス I/O 送 信 · 受信ボ一ドの受信回路のブロ ッ ク図。  Fig. 14 is a block diagram of the receiving circuit of the matrix I / O sending / receiving board included in the above hardware.
第 1 5図は上記ハー ドウェアに含まれる C P Uメモ リ コ ン トロールボードの受信および送信回路のブロ ッ ク図。  Figure 15 is a block diagram of the receiving and transmitting circuits of the CPU memory control board included in the above hardware.
第 1 6図は本実施例における検知マ 卜リ クスのスキャ ン二 ングの手順を示すフロ一チヤ — ト。  FIG. 16 is a flowchart showing a procedure for scanning the detection matrix in the present embodiment.
第 1 7図は本発明のゲーム機の第 2実施例の概要を示す説 明図。  FIG. 17 is an explanatory view showing an outline of a second embodiment of the game machine of the present invention.
第 1 8図は本発明のゲーム機の第 3実施例の概要を示す説 明図。 FIG. 18 is an explanatory diagram showing an outline of a third embodiment of the game machine of the present invention.
[発明を実施するための最良の形態] [Best Mode for Carrying Out the Invention]
以下、 本発明のゲーム機の第 1実施例について、 図面を参 照して説明する。  Hereinafter, a first embodiment of the game machine of the present invention will be described with reference to the drawings.
本実施例のゲーム機 1 0 は、 第 1 図、 第 2 図および第 3 図 に示すよ う に、 金属体 B を移動させるための空間を構成する 盤面 1 1 と、 それを一定間隔を保っ て覆う ガラ ス蓋 1 0 a と 、 金属体 B を盤面 1 1 の上部に投射するための投射機構と、 こ れら を収容する敢付枠 3 8 と を有する。 ゲーム機 1 0 は、 そ の盤面 1 1 が、 鉛直方向に実質的に平行と なる よ う に設置さ れる。  As shown in FIG. 1, FIG. 2, and FIG. 3, the game machine 10 according to the present embodiment has a board 11 that forms a space for moving the metal body B and a fixed space between the board 11 and the board 11. It has a glass lid 10a for covering with a cover, a projection mechanism for projecting the metal body B onto the upper part of the board surface 11, and a bracing frame 38 for accommodating these. The game machine 10 is installed such that its board surface 11 is substantially parallel to the vertical direction.
ゲーム機 1 0 の盤面 1 1 には、 ゲーム域を決める案内 レー ル 1 2が設け られている。 案内 レール 1 2 の内側がゲーム域 である。 このゲーム域内の盤面 1 1 には、 金属体 B を弾く た めの多数の ピン (釘) 1 3, 1 3 …が打ち立て られている。 また、 諸所に、 複数のセーフ孔 1 4 a, 1 4 a …が開設され、 ゲーム域の下端に 1 つのァ ゥ ト孔 1 5 が開設されている。  A guide rail 12 for determining a game area is provided on a board 11 of the game machine 10. The inside of the guide rails 1 and 2 is the game area. On the board surface 11 in this game area, a number of pins 13, 13,... In addition, a plurality of safe holes 14a, 14a... Are opened in various places, and a single hole 15 is opened at the lower end of the game area.
各ピン 1 3 は、 図 3 に示すよ う に、 金属体 B の直径相当の 長さ分、 盤面 1 1 から突出 した状態で、 実質的に垂直に設け られている。 また、 これらの ピン 1 3 は、 盤面 1 1 に沿っ て ピン 1 3, 1 3 間を抜けて落下する金属体が、 進行経路に存 在する多く の ピン 1 3 に頻繁に衝突して、 その運動方向に揺 ら ぎを生ずる よ う に配置される。 よ り具体的には、 第 2 図に 示すよ う に、 これ らの ピン 1 3 は、 複数本が集合 して ピン列 ない し ピン群 1 3 a を形成している。 これ らの ピン列ない し ピン群 1 3 aは、 衝突する金属体を、 その運動方向に対して 揺らぎを与えつつ、 金属体の投射位置、 すなわち、 落下開始 点と、 その時の運動方向、 速度等に応じて、 ある場合には、 セーフ孔 1 4 a に向かう よう に誘導し、 また、 ある場合には、 セーフ孔 1 4 a から外れるよう に誘導するよう、 その分布が 決定されている。 As shown in FIG. 3, each of the pins 13 is provided substantially vertically so as to protrude from the board 11 by a length corresponding to the diameter of the metal body B. In addition, these pins 13 frequently fall along the board surface 11 and fall between the pins 13 and 13, and frequently collide with many pins 13 existing in the traveling path. It is arranged so as to cause fluctuation in the direction of movement. More specifically, as shown in FIG. 2, a plurality of these pins 13 collectively form a pin array or a pin group 13a. These pin arrays In some cases, the pin group 13a, depending on the projection position of the metal body, i.e., the drop starting point, the direction of movement, the speed, etc., while giving fluctuation to the colliding metal body in the direction of movement The distribution is determined so as to guide the vehicle toward the safe hole 14a, and in some cases, to guide the vehicle away from the safe hole 14a.
セーフ孔 1 4 a は、 金属体がそこに入って盤面 1 1 から排 出される と、 ヒ ッ ト となる孔である o —方、 アウ ト孔 1 5は、 セーフ孔 1 4 a に入らなかった金属体が最終的に集まって、 盤面 1 1 から排出される孔である。  The safe hole 14a is a hole that becomes a hit when a metal body enters and is discharged from the board surface 11 o. On the other hand, the out hole 15 does not enter the safe hole 14a. This is the hole from which the metal objects finally gather and are discharged from the board surface 11.
盤面 1 1 を覆っている前面ガラス蓋 1 0 a は、 第 3図に示 すよう に、 表面ガラス体 1 6 と内側ガラス体 1 7 とによる 2 重構成となっている。  As shown in FIG. 3, the front glass cover 10a covering the panel 11 has a double structure of a front glass body 16 and an inner glass body 17 as shown in FIG.
投射機構は、 打ち出しハン ドル 3 3 および図示していない 駆動機構を有している。 ハン ドル 3 3は、 ゲーム機 1 0 の前 面に設けられ、 金属体の打ち出し操作に用いられる。 打ち出 し操作は、 ハン ドル 3 3 を所望の角度、 回転させる こと によ り行なわれる。  The projection mechanism has a launch handle 33 and a drive mechanism (not shown). The handle 33 is provided on the front surface of the game machine 10 and is used for a punching operation of a metal body. The launching operation is performed by rotating the handle 33 by a desired angle.
また、 ゲーム機 1 0の前面には、 ゲーム機 1 0 から給付さ れる金属体を受け取る ト レ一 3 4が設けられている。 これは、 盤面 1 1 に投射された金属体が、 いずれかのセーフ孔 1 4 a に入ると、 賞と して予め定められた個数給付される。  In addition, a tray 34 for receiving a metal body supplied from the game machine 10 is provided on a front surface of the game machine 10. When a metal object projected on the board 11 enters any one of the safe holes 14a, a predetermined number of prizes are provided.
検知マ ト リ クス 2 0は、 第 3図に示すよう に、 盤面 1 1 に 沿って、 一定の空間を保持して配置される内側ガラス体 1 7 を基板と して構成されている。 第 4図に示すよう に、 検知マ ト リ ク ス 2 0は、 複数の送信線 2 2 および複数の受信線 2 6 を有する。 複数の送信線 2 2は、 一方向に並列して内側ガラ ス体 1 7 の片面に配置して取付けられている。 また、 複数の 受信線 2 6は、 一方向に並列して内側ガラス体 1 7 の反対面 に配置して取付けられている。 各送信線 2 2 は、 折返部 6 1 で Uターン した平行の折り返し状 (またはループ状) の形態 を有している。 各受信線 2 6 も、 同様に、 1本の受信線 2 6 が Uターン して平行の折り返し状 (またはループ状) の形態 を有している。 送信端子 2 3 および受信端子 2 7 は、 ゲーム 機に取り付けたときの内側ガラス体 1 7の上下関係で、 内側 ガラス体 1 7 の下端に集中して配置されている。 As shown in Fig. 3, the detection matrix 20 is an inner glass body 17 that is arranged along the board surface 11 while maintaining a certain space. As a substrate. As shown in FIG. 4, the detection matrix 20 has a plurality of transmission lines 22 and a plurality of reception lines 26. The plurality of transmission lines 22 are arranged and mounted on one side of the inner glass body 17 in parallel in one direction. The plurality of receiving wires 26 are arranged and mounted on the opposite surface of the inner glass body 17 in parallel in one direction. Each transmission line 22 has a parallel folded shape (or loop shape) that makes a U-turn at the folded portion 61. Similarly, each reception line 26 has a folded (or looped) form in which one reception line 26 makes a U-turn and is parallel. The transmitting terminal 23 and the receiving terminal 27 are arranged in a concentrated manner at the lower end of the inner glass body 17 in a vertical relationship with the inner glass body 17 when attached to the game machine.
各受信線 2 6は、 各送信線 2 2 と電磁的に結合し、 金属体 の接近によ リ電磁特性が変化するよう各送信線 2 2 に対する 面平行位置に直角の交差方向で配置され、 内側ガラス体 1 7 を基板とする各送信線 2 2 と各受信線 2 6 とで面状の検知マ ト リ ク ス 2 0 が構成されている。  Each of the receiving lines 26 is electromagnetically coupled to each of the transmitting lines 22 and is arranged in a plane-parallel position with respect to each of the transmitting lines 22 in a direction perpendicular to the plane of the transmitting line 22 so that the electromagnetic characteristics change when the metal body approaches. Each transmission line 22 and each reception line 26 having the inner glass body 17 as a substrate constitute a planar detection matrix 20.
第 4 図の正面図で、 交差する各送信線 2 2 と各受信線 2 6 と によ リ囲まれる略正方形状の各包囲部は金属体を感知する 検知単位 2 0 a, 2 0 a …を構成している。  In the front view of FIG. 4, each of the substantially square enclosures surrounded by the intersecting transmission lines 22 and reception lines 26 detects metal objects. Detection units 20a, 20a ... Is composed.
第 5 A図に内側ガラス体 1 7 の拡大断面図を示し、 第 5 B 図に第 5 A図で破線によ り丸く 囲んだ部分の拡大図を示す。  FIG. 5A shows an enlarged cross-sectional view of the inner glass body 17, and FIG. 5B shows an enlarged view of a portion surrounded by a broken line in FIG. 5A.
内側ガラス体 1 7は、 受信線 2 6 (第 4 図に示す) のため の保護シー トである内部保護ガラス板 1 7 a 、 受信側ガラス ベース基板 1 7 b、 送信側ガラスべ一ス基板 1 7 c 、 送信線 2 2 (第 4図に示す) のための保護シー トである外側ガラス 板 1 7 d の 4層を積層した構成を有している。 内側ガラス体 (前面ガラス) 1 7は、 代表的に縦の長さ a が 3 6 7 ώιη± 1 0 mm, 横の長さ b が 4 0 5 mm± 1 0 mmの大きさの四角形状を 有すえるガラス基板であって、 3 . 0〜 3 . 5 mmの厚さ を有 している。 内部保護ガラス板 1 7 a と外側ガラス板 1 7 d と は、 受信側ガラスベース基板 1 7 b および送信側ガラスべ一 ス基板 1 7 c よ り縦の長さが短く 、 内側ガラス体 1 7 は、 下 端 1 7 p が露出している。 The inner glass body 17 is an inner protective glass plate 17a, which is a protective sheet for the receiving line 26 (shown in Fig. 4), the receiving glass. A configuration in which four layers of a base substrate 17b, a transmission-side glass base substrate 17c, and an outer glass plate 17d, which is a protective sheet for the transmission line 22 (shown in Fig. 4), are laminated. Have. The inner glass body (front glass) 17 typically has a square shape with a vertical length a of 367 ώιη ± 10 mm and a horizontal length b of 4.55 mm ± 10 mm. A glass substrate having a thickness of 3.0 to 3.5 mm. The inner protective glass plate 17a and the outer glass plate 17d are shorter than the receiving glass base substrate 17b and the transmitting glass base substrate 17c, and the inner glass body 17 Has the lower end 17p exposed.
内部保護ガラス板 1 7 a と受信側ガラスベース基板 1 7 b との間には、 複数の並列した折り返し状の受信線 2 6 が挟装 され、 送信側ガラスベース基板 1 7 c と外側ガラス板 1 7 d との間には、 複数の並列した折り返し状の送信線 2 2 が挾装 されている。 従って、 内側ガラス体 1 7は、 送信側ガラスべ ース基板 1 7 c の一 の面上に送信線 2 2 を透明接着剤層 1 8 a によリ貼リ合わせて配置し、 その上に外側ガラス板 1 7 d を透明接着剤曆 1 8 1> によ り貼り合わせ、 受信側ガラスべ —ス基板 1 Ί b の他方の面上に受信線 2 6 を透明接着剤層 1 8 C によ り貼り合わせて配置し、 その上に内部保護ガラス板 1 7 a を透明接着剤層 1 8 d によ り貼り合わせ、 送信側ガラ スペース基板 1 7 c の他方の面と、 受信側ガラスベース基板 1 7 b の他方の面と を透明接着剤層 1 8 e によ リ貼リ合わせ て構成される。 複数の送信線 2 2 の表側である外側ガラス板 1 7 d の表面 の全面上には、 シール ド用の透明導電膜が設け られている。 透明導電膜は、 酸化イ ンジウム ' スズ ( I . T . 0 . ) の膜 あるいは酸化スズの膜等によ り形成される。 Between the inner protective glass plate 17a and the receiving-side glass base substrate 17b, a plurality of parallel folded reception lines 26 are sandwiched, and the transmitting-side glass base substrate 17c and the outer glass plate are interposed. A plurality of parallel folded transmission lines 22 are sandwiched between 17d and 17d. Therefore, the inner glass body 17 is formed by disposing the transmission line 22 on one surface of the transmission-side glass base substrate 17c with the transparent adhesive layer 18a. The outer glass plate 17 d is bonded with a transparent adhesive 曆 1 8 1>, and the receiving wire 26 is attached to the transparent adhesive layer 18 C on the other side of the receiving glass base substrate 1 Ί b. The inner protective glass plate 17a is bonded on it with a transparent adhesive layer 18d, and the other side of the transmission side glass space board 17c and the reception side glass base The other side of the substrate 17b is bonded to the other side with a transparent adhesive layer 18e. A transparent conductive film for shielding is provided on the entire surface of the outer glass plate 17d which is the front side of the plurality of transmission lines 22. The transparent conductive film is formed by a film of indium oxide-tin (IT.O.) or a film of tin oxide.
第 4 図に示すよ う に、 四角形状の送信側ガラスベース基板 1 7 c は、 その縦方向の一辺に沿って細長い フ レキシブルプ リ ン ト基板 ( F P C ) から成る送信側折返基板 1 9 a ¾接着 し、 縦方向の反対側の辺と下端の辺の一部に治っ て同 じ く フ レ キシブル基板から成る L字状の送信側引回基板 1 9 b を接 着している。 送信側折返基板 1 9 a は、 第 6 図に示すよ う に 、 銅箔から成る導電体パタ ーンによ り複数、 具体的には 3 2 本の弧状の折返部 6 1 を一列に形成し、 第 7 図に示すよ う に 、 各折返部 6 1 の一端 6 1 a に ワイヤ 6 2 の一端 6 2 a を半 田 6 3 を用いた半田付けまたは溶接によ リ接続している。  As shown in FIG. 4, the rectangular transmission-side glass base substrate 17c is formed by a transmission-side folded substrate 19a formed of an elongated flexible print substrate (FPC) along one longitudinal side thereof. An L-shaped transmission side routing board 19b composed of a flexible board is bonded to the opposite side of the vertical direction and a part of the lower side in the same manner. As shown in FIG. 6, the transmitting-side folded substrate 19a is formed with a plurality of, specifically, 32 arc-shaped folded portions 61 in a row by a conductor pattern made of copper foil. Then, as shown in FIG. 7, one end 62 a of a wire 62 is connected to one end 61 a of each folded portion 61 by soldering or welding using a solder 63.
第 8 図は、 第 4 図で破線によ り丸く 囲んだ部分の拡大図を 示す。 第 8 図に示すよ う に、 反対側の送信側引回基板 1 9 b の下端には、 その緣上に、 辺の一部に沿っ て、 銅箔から成る 導電体パタ ーンによ り複数、 具体的には 6 4本の縦方向にの びる外部接続用の送信端子 2 3 が形成されている。  FIG. 8 is an enlarged view of a portion surrounded by a broken line in FIG. As shown in FIG. 8, a conductor pattern made of copper foil is formed on the lower end of the transmission side wiring board 19b on the opposite side along a part of the side. A plurality of, specifically, sixty-four vertically extending transmission terminals 23 for external connection are formed.
送信端子 2 3 は、 第 5 A図に示すよ う に、 内側ガラス体 1 7 の下端 1 7 p に配置され、 外側ガラス板 1 7 d に被覆され ず、 露出 している。 すなわち、 外側ガラス板 1 7 d は、 送信 側ガラスベース基板 1 Ί c 上で送信端子 2 3 を除く 送信線 2 2 の上に貼り合わせられている。 各送信線 2 2 の端子側は、 各送信線 2 2 の送信端子 2 3 と各送信端子 2 3への引回部 6 4 とを有している。 各送信端子 2 3への引回部 6 4は、 導電 体パターンによ り送信側引回基板 1 9 b に形成され、 各送信 端子 2 3 から送信側引回基板 1 9 b に沿ってのびている。 As shown in FIG. 5A, the transmission terminal 23 is disposed at the lower end 17 p of the inner glass body 17, is not covered by the outer glass plate 17 d, and is exposed. That is, the outer glass plate 17 d is bonded to the transmission line 22 except for the transmission terminal 23 on the transmission-side glass base substrate 1 Ί c. The terminal side of each transmission line 22 is It has a transmission terminal 23 of each transmission line 22 and a routing section 64 to each transmission terminal 23. The routing section 64 to each transmission terminal 23 is formed on the transmission side routing board 19b by a conductive pattern, and extends from each transmission terminal 23 along the transmission side routing board 19b. Is running.
各折返部 6 1 の一端 6 1 a からのびるワイヤ 6 2 の他端 6 2 b は、 ワイヤ 6 2 に張り を持たせ、 対応する端子側の引回 部 6 4の始点 6 4 a に、 半田 6 3 を用いた半田付けまたは溶 接によ り接続して、 引回部 6 4 を介して送信端子 2 3 に接続 されている。 なお、 引回部 6 4は、 高周波障害を除去するた め、 2本の直線部分を円弧部 S 4 Rで接続している。  The other end 6 2b of the wire 6 2 extending from one end 6 1 a of each turn-up portion 6 1 is provided with a tension on the wire 62, and is soldered to the starting point 6 4 a of the corresponding wire-side portion 6 4 on the terminal side. The connection is made by soldering or welding using 63, and connected to the transmission terminal 23 via the routing section 64. In addition, the routing portion 64 connects two straight portions with an arc portion S 4 R in order to remove high-frequency interference.
同様に、 四角形状の受信側ガラスベース基板 1 7 a は、 そ の横方向の上端の一辺に沿って受信側折返基板 2 9 a を接着 し、 横方向の下端の辺の一部に沿って細長い受信側引回基板 2 9 b を接着している。 受信側折返基板 2 9 a は、 送信側折 返基板 1 9 a と同様に、 銅箔から成る導電体パターンによ り 複数、 具体的には 3 2本の弧状の折返部 6 1 を形成し、 各折 返部の一端 6 1 a にワイヤ 6 2の一端 6 2 a を半田 6 3 を用 いた半田付けまたは溶接によ り接鏡している。  Similarly, the rectangular receiving-side glass base substrate 17a is bonded to the receiving-side folded substrate 29a along one side of the upper end in the horizontal direction, and is partially along the side of the lower end in the horizontal direction. The elongated receiving side routing board 29b is adhered. Similarly to the transmission-side folded substrate 19a, the reception-side folded substrate 29a has a plurality of, specifically, 32 arc-shaped folded portions 61 formed by a conductor pattern made of copper foil. In addition, one end 62 a of the wire 62 is mirrored to one end 61 a of each folded portion by soldering or welding using the solder 63.
反対側の受信側引回基板 2 9 b は、 第 9 図に示すよう に、 下端の一部が突出しており、 その突出部には、 その緣上に、 辺の一部に沿って、 送信側ガラスベース基板 1 7 c に受信側 ガラスべ一ス基板 1 7 b を貼り合わせたと き、 互いに重なら ない非対向位置に、 銅箔から成る導電体パターンによ り、 複 数の縦方向にのびる外部接続用の受信端子 2 7 が形成されて いる。 受信端子 2 7は、 具体的には 6 4本設けられる。 各受 信線 2 6 の端子側は、 各受信線 2 6 の受信端子 2 7 と各受信 端子 2 7への引回部 6 4 と を有している。 各受信端子 2 7 へ の引回部 6 4 は、 導電体パタ ーンによ り受信側引回基板 2 9 b に形成され、 各受信端子 2 7 から受信側引回墓板 2 9 b に 沿ってのびている。 As shown in FIG. 9, the other side of the receiving-side routing board 29b has a part protruding at the lower end, and the protruding part has a transmitting part on the side thereof and along part of the side. When the receiving glass base board 17b is bonded to the glass base board 17c on the side, the conductor pattern made of copper foil can be used in multiple vertical directions at non-facing positions that do not overlap each other. The extended receiving terminal 27 for external connection is formed. I have. Specifically, 64 receiving terminals 27 are provided. The terminal side of each reception line 26 has a reception terminal 27 of each reception line 26 and a routing section 64 to each reception terminal 27. The routing section 64 to each receiving terminal 27 is formed on the receiving side routing board 29b by a conductor pattern, and is connected from each receiving terminal 27 to the receiving side routing board 29b. Extending along.
各折返部 6 1 の一端 6 l a からのびる ワイヤ 6 2 の他端 6 2 b は、 ワイヤ 6 2 に張り を持たせ、 対応する端子側の引回 部 6 4 の始点 6 4 a に、 半田 6 3 を用いた半田付けまたは溶 接によ り接続して、 引回部 6 4 を介して受信端子 2 7 に接続 されている。  The other end 6 2b of the wire 6 2 extending from one end 6 la of each folded portion 6 1 is provided with a tension on the wire 6 2, and the solder 6 is connected to the starting point 6 4 a of the corresponding wire-side portion 6 4 on the terminal side. It is connected by soldering or welding using 3 and connected to the receiving terminal 27 via the routing section 6 4.
送信線 2 2 と受信線 2 6 とは、 このよ う に、 各折返基板 1 9 a , 2 9 a に形成された各折返部 6 1 と、 各引回基板 1 9 b, 2 9 b に形成された各引回部 6 4 と、 各ワイヤ 6 2 と、 送信線 2 2 の端部をなす送信端子 2 3、 受信線 2 6 の端部を なす受信端子 2 7 と によ リ構成されている。  The transmission line 22 and the reception line 26 are thus connected to the folded portions 61 formed on the folded substrates 19a and 29a, and to the folded substrates 19b and 29b, respectively. Each of the formed wiring portions 6 4, each wire 62, a transmission terminal 23 forming an end of the transmission line 22, and a reception terminal 27 forming an end of the reception line 26. ing.
なお、 各ワイヤ 6 2 は、 遊技客に目立たなくするため、 そ の表面がつや消し処理を施した黒色であ り、 光の反射を防ぐ よ う に してある。  Note that each wire 62 has a matte-treated black surface to prevent light reflection in order to make it inconspicuous to the player.
ゲーム機 1 0 に好適なマ ト リ ク スセンサ 2 0 のパタ ーン と しては、 例えば、 送信線 2 2 が 3 2行、 受信線 2 6 が 3 2列 で、 検知単位 2 0 a の個数が合計 1 0 2 4個のパタ ーンがあ る。 なお、 第 4図では、 外側以外のパターンを省略して図示 している。 送信線 2 2 , 受信線 2 6 を構成するワイヤの太さは、 好適 に 2 5 ;« 111〜 3 0 111の値に設定される。 本実施例の場合、 第 4図に示すよう に、 送信端子 2 3および受信端子 2 7の全 体の幅 c, d は、 それぞれ 1 2 6 mmであ り、 また、 第 6図に 示すよう に、 送信側折返基板 1 9 aおよび送信側引回基板 1 9 b の縦方向に伸びる部分の幅 e , は、 それぞれ 1 ひ mm以 下に形成される。 As a pattern of the matrix sensor 20 suitable for the game machine 10, for example, the transmission line 22 is 32 rows, the reception line 26 is 32 columns, and the detection unit 20 a is There are a total of 102 4 patterns. In FIG. 4, patterns other than the outer patterns are omitted. The thickness of the wires constituting the transmission line 22 and the reception line 26 is preferably set to a value of 25; In the case of the present embodiment, as shown in FIG. 4, the entire widths c and d of the transmission terminal 23 and the reception terminal 27 are each 126 mm, and as shown in FIG. In addition, the widths e, of the vertically extending portions of the transmission-side folded substrate 19a and the transmission-side routing substrate 19b are each formed to be 1 mm or less.
また、 第 8図に示すよう に、 送信端子 2 3 および受信端子 2 7 のそれぞれ 1本の幅 gは、 1 . 5 mmである。  Further, as shown in FIG. 8, the width g of each of the transmission terminal 23 and the reception terminal 27 is 1.5 mm.
第 9図および第 1 0 図に示すよう に、 内側ガラス体 1 7に は、 内部保護ガラス板 1 7 a の下部に、 コネクタ取付板 6 6 が取り付けられている。 コネク タ敢付板 6 6は、 押え部 6 6 a によ り内側ガラス体 1 7 をその下端 1 7 Pで両側から挟ん で、 内側ガラス体 1 7 に一体的に固定されている。 コネクタ 取付板 6 6は、 プラスチッ クまたはステンレス製であって、 内側ガラス体 1 7の幅でそれに沿って下方に延びている。 コ ネクタ取付板 6 6 には、 第 4図に示すよう に、 送信端子 2 3 および受信端子 2 7 に対応する位置に送信コネク タ 6 7 a と 受信コネクタ 6 7 b とが固定されている e  As shown in FIGS. 9 and 10, a connector mounting plate 66 is mounted on the inner glass body 17 below the inner protective glass plate 17a. The connector attachment plate 66 is integrally fixed to the inner glass body 17 by sandwiching the inner glass body 17 from both sides at the lower end 17P thereof by a holding portion 66a. The connector mounting plate 66 is made of plastic or stainless steel, and extends downward along the width of the inner glass body 17. As shown in FIG. 4, the transmitting connector 67a and the receiving connector 67b are fixed to the connector mounting plate 66 at positions corresponding to the transmitting terminal 23 and the receiving terminal 27e, as shown in FIG.
送信コネクタ 6 7 a は、 各送信線の送信端子 2 3 に接続さ れる。 受信コネク タ 6 7 b 、 各受信線 2 6の受信端子 2 7 に 接続される。 コネクタ敢付板 6 6は、 送信コネク タ 6 7 a と 受信コネクタ 6 7 b と を備えた位置で最も厚く なつている。 この部分の厚さ h は、 外側ガラス板 1 7 d および内部保護ガ ラス板 1 7 a を含めた内側ガラス体 1 7 の厚さ i と ほぼ等し く なる か、 それよ り やや薄く なる よ う に設定される 。 従っ て 送信コネク タ 6 7 a と受信コネク タ 6 7 b と は、 この.条件を 満たすよ う な、 高さ の低いものが用い られる。 The transmission connector 67a is connected to the transmission terminal 23 of each transmission line. The reception connector 67 b is connected to the reception terminal 27 of each reception line 26. The connector attachment plate 66 is thickest at the position where the transmission connector 67a and the reception connector 67b are provided. The thickness h of this part depends on the outer glass plate 17 d and the inner protective The thickness is set so as to be substantially equal to or slightly smaller than the thickness i of the inner glass body 17 including the lath plate 17a. Therefore, the transmission connector 67a and the reception connector 67b used are low in height so as to satisfy this condition.
表面ガラス体 1 6 とマ ト リ ク スセンサ 2 0 と の間には、 マ ト リ ク ス I/O 送信 · 受信ボー ド 1 7 1 が配置されている。 マ ト リ ク ス I/O 送信 ' 受信ボー ド 1 7 1 は、 第 1 図に示すよ う に、 取付枠 3 8 の下端部 3 8 a 中央の、 盤面 1 1 を覆わない 位置 (斜線で示す) に横長に取付け られている。 本実施例に おいては、 マ ト リ ク ス I/O 送信 ' 受信ボー ド 1 7 1 は、 3 5 0 X 4 0 mmの大き さ を有している。  A matrix I / O transmission / reception board 171 is arranged between the surface glass body 16 and the matrix sensor 20. As shown in Fig. 1, the matrix I / O transmit / receive board 17 1 is located at the lower end 38 a of the mounting frame 38 at the center of the bottom of the mounting frame 38 where the panel 11 is not covered (shaded lines). (Shown). In the present embodiment, the matrix I / O transmission / reception board 171 has a size of 350 × 40 mm.
マ ト リ ク ス I/O 送信 ' 受信ボー ド 1 7 1 は、 プリ ン ト基板 から成る取付基板 1 7 1 a と、 取付基板 1 7 1 a を収容する マ ト リ ク ス I/O ケース 3 5 と を備えている。 取付基板 1 7 1 a には、 マ ト リ ク スセンサ 2 0 の複数の送信線 2 2へ送信す る送信回路 4 0 と、 複数の受信線 2 6 から受信する受信回路 5 0 と、 送信コネク タ 6 7 a および受信コネク タ 6 7 b と そ れぞれ接続する接合コネク タ 3 7 と が敢 リ付け られている。  Matrix I / O transmission and reception board 17 1 is a mounting board 17 1 a consisting of a printed circuit board and a matrix I / O case accommodating the mounting board 17 1 a. 3 5 and. The mounting board 17 1a includes a transmitting circuit 40 for transmitting to the plurality of transmitting lines 22 of the matrix sensor 20, a receiving circuit 50 for receiving from the plurality of receiving lines 26, and a transmitting connector. A connection connector 37 is connected to the connection connector 67a and the reception connector 67b, respectively.
送信コネク タ 6 7 a および受信コネク タ 6 7 b と接合コネ ク タ 3 7 と は、 互いに接続する こ と によ リ 、 送信端子 2 3 を 送信回路 4 0 に接続し、 受信端子 2 7 を受信回路 5 0 に接続 するよ う になつ ている。  The transmission connector 67a, the reception connector 67b, and the junction connector 37 are connected to each other so that the transmission terminal 23 is connected to the transmission circuit 40, and the reception terminal 27 is connected to the transmission circuit 40. It is connected to the receiving circuit 50.
なお、 マ ト リ ク スェ /0 送信 ' 受信ボー ド 1 7 1 は、 取付基 板 1 7 1 a を複数枚用いて構成 しても よい。 本実施例のゲーム機において、 金属体を検知するために用 いられる信号処理部は、 第 1 1 図〜第 1 6図に示すとおりで ある。 Note that the matrix / 0 transmission / reception board 1771 may be configured by using a plurality of mounting boards 1771a. In the game machine of the present embodiment, a signal processing unit used for detecting a metal body is as shown in FIGS. 11 to 16.
第 1 1 図に示すよう に、 マ ト リ クスセンサ 2 0は、 マ ト リ クス I/O 送信 ' 受信ボード 1 7 1 を介して C P Uメモリ コン トロ一ルボー ド 1 7 2 の制御下にある。 C P Uメモリ コン ト ロールボード 1 7 2は、 データ処理装置を構成し、 通信回線 1 7 9で通信可能となっている。 また、 C P Uメモリ コン ト ロールボー ド 1 7 2は、 制御装置 3 0 がカード 1 7 3 から監 視ポイン トを読込むためのインターフェース部 1 7 6 を有し ている。  As shown in FIG. 11, the matrix sensor 20 is under the control of the CPU memory control board 172 via the matrix I / O transmission and reception board 171. The CPU memory control board 172 constitutes a data processing device, and can communicate with a communication line 179. The CPU memory control board 172 has an interface 176 for the control device 30 to read a monitoring point from the card 173.
カー ド 1 7 3 は、 金属体の監視ポイ ン ト を読出し可能に記 億し、 イ ンタ一フ L—ス部 1 7 6に着脱可能な監視メモ リ の メモ リカー ドである。 カー ド 1 7 3 は、 ゲーム機 1 0の盤面 に設けられたセーフ孔 1 4 a, 1 4 a …およぴ打玉検出位置 やアウ ト孔 1 5 の位置のデータや、 セーフ孔 1 4 a, 1 4 a …およびァゥ ト孔 1 5 に入る金属体の検出アルゴリズム等が 監視データ と して記録されている。 なお、 カー ドと しては、 R AMカー ド、 マスク R〇 M、 E P R O M, ワンショ ッ ト R O M等を用いる ことができる。  The card 173 is a memory card of a monitoring memory which records a monitoring point of a metal body in a readable manner and is detachable from the interface L-176. The card 173 includes safe holes 14a, 14a, etc. provided on the board of the game machine 10 and data on the hit ball detection position and the positions of the out holes 15 and the safe holes 14a. a, 14 a… and the algorithm for detecting metal objects entering the art hole 15 are recorded as monitoring data. As the card, a RAM card, a mask R〇M, an EPROM, a one-shot ROM, or the like can be used.
C P Uメモ リ コ ン ト ロ一ルボー ド 1 7 2 に接続されている オプショ ン 1 7 4は、 ゲーム機 1 0の盤面 1 1 と内側ガラス 体 6 1 7 との間で動き回る金属体の軌跡を記録するための装 置である。 オプショ ン 1 7 4 と しては、 光ディ スク、 光 ' 磁 気ディ スク等のディ スク型記憶媒体を用いる記憶装置、 、 ァ ナロ グ式またはデジタル式テープレコーダ、 ビデオテープレ コーダ等のテープ状の記憶媒体を用いる記憶装置を用いる こ と ができ る。 また、 他のコ ン ピュータ システムを用いる こ と ができ る。 さ ら に、 半導体メモ リ等の固体記憶媒体を用いる 記憶装置を用いても よい。 なお、 本実施例をゲーム機に適用 する場合、 小型で記憶容量が大きいものが好ま しい。 これは、 遊技客が増える時間帯には、 ゲーム機 1 0 の稼動率が高 く な るため膨大な記憶容量を必要とするためである。 Option 174, which is connected to the CPU memory control board 172, traces the trajectory of a metal body moving between the board surface 11 of the game console 10 and the inner glass body 617. It is a device for recording. Options 1 7 4 include optical disc, optical A storage device using a disk-type storage medium such as a personal disk, a storage device using a tape-type storage medium such as an analog or digital tape recorder and a video tape recorder can be used. Other computer systems can also be used. Further, a storage device using a solid-state storage medium such as a semiconductor memory may be used. When the present embodiment is applied to a game machine, it is preferable that the embodiment be small and have a large storage capacity. This is because the operating rate of the game machine 10 increases during a time period when the number of gamers increases, requiring a huge storage capacity.
記録されたデータ は、 金属体の軌跡を解析するためのソ フ ト ウエ ア を組み込んだコ ン ピュータ にかけられて演算処理さ れ、 遊技場で必要なデータ を得る こ と ができ る。  The recorded data is applied to a computer that incorporates software for analyzing the trajectory of the metal body, and is processed by arithmetic processing to obtain the necessary data at the amusement arcade.
マ ト リ ク ス I/O 送信 ' 受信ボー ド 1 7 1 は、 送信回路 4 0 と、 受信回路 5 0 と を有している。 送信回路 4 0 は、 各送信 線 2 2 に所定の周波数の信号を順次送信する回路である。 受 信回路 5 0 は、 送信回路 4 0 と 同期して各受信線 2 6 から信 号を順次受信する回路である。 送信回路 4 0 によ る送信線 2 2への電圧波形と しては、 周波数 1 〜 1 . 3 M H z の 0 V を 中心と した連続のサイ ン波が好適である。  The matrix I / O transmission / reception board 17 1 has a transmission circuit 40 and a reception circuit 50. The transmission circuit 40 is a circuit for sequentially transmitting a signal of a predetermined frequency to each transmission line 22. The receiving circuit 50 is a circuit that sequentially receives a signal from each receiving line 26 in synchronization with the transmitting circuit 40. As the voltage waveform to the transmission line 22 by the transmission circuit 40, a continuous sin wave centered on 0 V having a frequency of 1 to 1.3 MHz is preferable.
送信回路 4 0 は、 第 1 2 図に示すよ う に、 送信コネク タ 4 1 と、 送信コネク タ 4 1 に接続した増幅器 4 2 およびチャ ン ネル切替ロ ジッ ク 4 3 と、 増幅器 4 2 およびチャ ンネル切替 ロ ジッ ク 4 3 に接続したアナロ グマルチプレクサ 4 4 と 、 ァ ナロ グマルチプレ クサ 4 4 に接続する と とも に、 送信コネク タ 6 7 a を介して複数、 具体的には 3 2回路の送信線 2 2側 にそれぞれ接続した 3 2個の Ρ Ν Ρ + Ν Ρ Νの ト一テムポー ルドライバ 4 5 とによ り構成されている。 As shown in FIG. 12, the transmission circuit 40 includes a transmission connector 41, an amplifier 42 connected to the transmission connector 41, a channel switching logic 43, an amplifier 42, and Connect to the analog multiplexer 44 connected to the channel switching logic 43 and the analog multiplexer 44, and , 送信 Ρ Ρ + Ρ Ν ト ポ ー ポ ー ポ ー ポ ー ポ ー 複数 複数 複数 構成 構成 構成 構成 構成 構成 構成 構成 構成 構成 構成 構成 構成Have been.
チャ ンネル切替ロジッ ク 4 3は、 第 1 3 図に示すよう に、 カウンタ I C 4 3 a を有効に利用 して、 ク ロ ック用と リセッ 卜用との 2本の制御線で動作を行なうものである。  As shown in FIG. 13, the channel switching logic 43 operates using two control lines, one for clock and one for reset, by effectively using the counter IC 43a. Things.
受信回路 5 0は、 第 1 4図に示すよう に、 受信コネク タ 6 The receiving circuit 50, as shown in FIG.
7 b を介して複数、 具体的には 3 2回路の受信線 2 6側にそ れぞれ接続した 3 2個の C T (変流器) 5 1 と、 C T 5 1 に 接続したアナロ グマルチプレクサ 5 2 と、 アナロ グマルチプ レクサ 5 2 に接続した増幅器 5 3およびチヤ ンネル切替ロジ ッ ク 5 4 と、 増幅器 5 3およびチャ ンネル切替ロジッ ク 5 4 に接続した受信コネクタ 5 5 とによ り構成されている。 従つ て、 受信回路 5 0 は、 各 C T 5 1 を介して各受信線 2 6 から 信号を受信するよう になっている。 7 Two CTs (current transformers) 51 connected to the receiving lines 26 of the two circuits, respectively, via the 7b, and an analog multiplexer connected to the CT 51 5 2, an amplifier 53 connected to the analog multiplexer 52 and the channel switching logic 54, and a receiving connector 55 connected to the amplifier 53 and the channel switching logic 54. ing. Therefore, the receiving circuit 50 receives a signal from each receiving line 26 via each CT 51.
C T 5 1 は、 各受信線 2 6 とアナロ グマルチプレクサ 5 2 と を絶緣する とともに、 各受信線 2 6 からの信号を 1 0倍に 増幅するものである。 アナロ グマルチプレクサ 5 2は各 C T 5 1 から信号を順次受信するものであ り、 増幅器 5 3 はアナ ログマルチプレクサ 5 2 からの信号を増幅するものである。 チャ ンネル切替ロ ジッ ク 5 4は、 送信回路 4 0のチャ ンネル 切替ロジッ ク 4 3 と同様のものである。  The CT 51 disconnects each of the receiving lines 26 and the analog multiplexer 52 and amplifies the signal from each of the receiving lines 26 by 10 times. The analog multiplexer 52 sequentially receives signals from the respective CTs 51, and the amplifier 53 amplifies the signal from the analog multiplexer 52. The channel switching logic 54 is the same as the channel switching logic 43 of the transmission circuit 40.
第 1 5図に示すよう に、 C P Uメモ リ コ ン ト ロールボード 1 7 2は、 送信側では、 制御装置 3 0 に接続した C P Uコネ ク タ 4 6 と、 C P Uコネク タ 4 6 を介 して制御装置 3 0 から のスタ ー ト信号に応じて送信ク ロ ッ ク を送るシーケンス制御 回路 4 7 と、 送信ク ロ ッ ク を受けて送信信号を送るバン ドパ スフィ ルタ 4 8 と 、 送信信号を増幅して送信コネク タ へ送る 増幅器 4 9 と を有している。 As shown in Fig. 15, the CPU memory control board 17 2 has a CPU connector connected to the controller 30 on the transmitting side. Receiving the transmission clock, a sequence control circuit 47 for transmitting a transmission clock in accordance with a start signal from the control device 30 via the CPU connector 46, and receiving the transmission clock. It has a bandpass filter 48 for transmitting a transmission signal, and an amplifier 49 for amplifying the transmission signal and transmitting the amplified signal to the transmission connector.
また、 C P Uメモ リ コ ン ト ロールボー ド 1 7 2 は、 受信側 では、 受信コネク タ 5 5 からの受信信号を増幅する増幅器 7 1 と、 増幅信号を受けるバン ドパスフィ ルタ 7 2 と、 バン ド パスフィ ルタ つ 2 からの受信信号を受ける全波整流 · 増幅器 7 3 と、 全波整流 · 増幅器 7 3 からの受信信号を受ける 2段 の 口 一 ノヽ。スフィ ルタ 7 4 a , 7 4 b と、 口 一 ノヽ。スフィ ルタ 7 4 b からの受信信号を受け、 シーケンス制御回路 4 7 によ り 制御されてデジタルデータ を双方向 R A M 7 6 に送る A Z D コ ンバータ 7 5 と 、 そのデジタルデータ を受け、 シーケンス 制御回路 4 7 によ り制御されて受信データ を書込み、 C P U コネク タ 4 6 からの読出信号に応じて受信データ を C P Uコ ネク タ 4 6 を介 して制御装置 3 0 に送る双方向 R A M 7 6 と を有している。  On the receiving side, the CPU memory control board 172 includes an amplifier 71 for amplifying a signal received from the receiving connector 55, a bandpass filter 72 for receiving the amplified signal, and a bandpass filter. A full-wave rectifier / amplifier 73 that receives the received signal from the filter 2 and a two-stage mouthpiece that receives the received signal from the full-wave rectifier / amplifier 73 Filters 74a and 74b, and one mouth. An AZD converter 75 that receives a received signal from the filter 74 b and sends digital data under the control of the sequence control circuit 47 to the bidirectional RAM 76, receives the digital data, and receives the digital data. 7 to write received data, and transmit the received data to the control device 30 via the CPU connector 46 in response to the read signal from the CPU connector 46. Have.
双方向 R A M 7 6は、 受信回路 5 0 からの信号に基づいて 、 金属体の位置を各送信線 2 2 と各受信線 2 6 と によ る検知 単位 2 0 a の検知データ と して記憶する メモ リ である。 この 双方向 R A M 7 6は、 内部にカ ウ ンタ を持ってお り 、 金属体 のマ ト リ ッ ク スデータ の処理は、 すべてそのカ ウ ンタ によ リ 行なっている さ ら に、 C P Uメモ リ コ ン ト ローノレボー ド 1 7 2は、 電源ュニッ ト 7 7 を有している。 The bidirectional RAM 76 stores the position of the metal body as detection data of the detection unit 20a by each transmission line 22 and each reception line 26 based on a signal from the reception circuit 50. Memory. The bidirectional RAM 76 has a counter inside, and all processing of metal matrix data is performed by the counter. Contro Lonor Board 1 72 has a power supply unit 77.
制御装置 3 0は、 カード 1 7 3 の監視領域データ を読込む とともに、 双方向 R AM 7 6の検知データ を読込み、 検知デ —タ を金属体の監視領域データ と対応させて金属体を監視す るよう になっている。  The controller 30 reads the monitoring area data of the card 173, reads the bidirectional RAM76 detection data, and monitors the metal object by associating the detection data with the monitoring area data of the metal object. It is supposed to.
次に作用を説明する。  Next, the operation will be described.
制御装置 3 0 からのア ド レス信号およびコ ン ト ロール信号 は、 C P Uコネクタ 4 6 を経て、 ゲーム機 1 0 に伝達される ゲーム機 1 0では、 送信側で、 シーケンス制御回路 4 7 が スター ト信号を受け、 1 6 MH z の原振ク ロ ッ ク を必要に応 じて分周して送信ク ロ ッ ク を生成し、 これを出力する。 シー ケンス制御回路 4 7 からの送信ク ロ ッ クは、 ノ ン ドパスフィ ルタ 4 8 によ リデジタル信号からアナログ信号へと波形整形 された後、 増幅器 4 9 によ り増幅され、 送信コネク タ 4 1 へ と送られる。  The address signal and the control signal from the control device 30 are transmitted to the game machine 10 via the CPU connector 46. In the game machine 10, the sequence control circuit 47 on the transmission side starts. Receiving the clock signal, generates a transmission clock by dividing the 16 MHz original clock as necessary, and outputs this. The transmission clock from the sequence control circuit 47 is waveform-shaped from a re-digital signal to an analog signal by a non-pass filter 48, then amplified by an amplifier 49, and then transmitted. Sent to 1.
さ らに、 送信信号ば、 送信回路 4 0で増幅器 4 2 によ り増 幅される a アナロ グマルチプレクサ 4 4は、 チャ ンネル切替 ロジッ ク 4 3 によ リ切替えられたチャ ンネルで, トーテムポ ールドライバ 4 5 を順次動作し、 それによ リ 卜一テムポール ドライバ 4 5 は、 増幅器 4 2 によ リ增幅された信号を所定の 周期で送信線 2 2 に順次出力するものである (第 1 6図ステ ップ 9 1参照) 。 Further, in the case of a transmission signal, the analog multiplexer 44 amplified by the amplifier 42 in the transmission circuit 40 is a channel switched by the channel switching logic 43 and a totem pole driver. 4 are operated sequentially, whereby the re-temp pole driver 45 sequentially outputs the signal amplified by the amplifier 42 to the transmission line 22 at a predetermined period (see FIG. 16). See page 91).
マ ト リ クスセンサ 2 0では、 送信回路 4 0 から複数の折り 返し状の送信線 2 2 に所定の周波数の信号を順次送信し磁界 を発生させる と、 その送信線 2 2 と電磁的に結合した受信線 2 6 には、 相互誘導作用によ り起電力が発生する。 この と き 、 金属である金属体がマ ト リ ク スセンサ 2 0の検知単位 2 0 a に接近する と、 金属体の表面にはマ ト リ ク スセンサ 2 0 に よ る磁束を打ち消す方向に渦電流が発生する。 こ のため、 疎 の位置にある受信線 2 6は、 その渦電流の影響で誘導電流の 大きさ が小さ く なる。 In the matrix sensor 20, a plurality of folds are transmitted from the transmission circuit 40. When a signal of a predetermined frequency is sequentially transmitted to the return transmission line 22 to generate a magnetic field, an electromotive force is generated in the reception line 26 electromagnetically coupled to the transmission line 22 by mutual induction. appear. At this time, when the metal body, which is a metal, approaches the detection unit 20a of the matrix sensor 20, the surface of the metal body is swirled in a direction to cancel the magnetic flux by the matrix sensor 20. An electric current is generated. For this reason, the magnitude of the induced current in the sparsely located receiving line 26 becomes smaller due to the eddy current.
受信側では、 受信回路 5 0は、 シーケンス制御回路 4 7 に よ り送信回路 4 0 と 同期し、 各 C Tセンサ 5 1 を介して各受 信線 2 6 から信号を受信する。 第 1 4 図に示すよ う に、 複数 の受信線 2 6 にあ らわれる誘導電流が、 C Tセンサ 5 1 によ リ 1 0倍に増幅される。 C Tセンサ 5 1 によ り増幅を行なう ため、 それだけ受信側の増幅器の増幅度を大き く する必要が な く なる。 C Tセンサ 5 1 は、 金属センサを構成するマ ト リ ク スセンサ 2 0 の各受信線 2 6 と受信回路 5 0 のアナロ グマ ルチプレ クサ 5 2 と を絶縁させ、 ゲーム機 1 0 から受信回路 5 0 に ノ イズが入るの を防止する と ともに、 受信信号を増幅 する。  On the receiving side, the receiving circuit 50 synchronizes with the transmitting circuit 40 by the sequence control circuit 47 and receives a signal from each receiving line 26 via each CT sensor 51. As shown in FIG. 14, the induced current appearing on the plurality of receiving lines 26 is amplified 10 times by the CT sensor 51. Since amplification is performed by the CT sensor 51, it is not necessary to increase the amplification degree of the amplifier on the receiving side. The CT sensor 51 insulates the receiving lines 26 of the matrix sensor 20 constituting the metal sensor from the analog multiplexer 52 of the receiving circuit 50, and separates the receiving circuit 50 from the game machine 10. It prevents noise from entering the receiver and amplifies the received signal.
アナロ グマルチプレ クサ 5 2 は、 C Tセンサ 5 1 を経た各 受信線 2 6 からの信号を、 チャ ンネル切替ロジッ ク 5 4 によ リ切替え、 所定の周斯で順次出力するものである。 アナロ グ マルチプレ クサ 5 2 からの信号は、 増幅器 5 3 によ り 1 0 0 倍に増幅される (第 1 6 図ステ ッ プ 9 2参照) 。 受信信号は、 受信コネク タ 5 5、 増幅器 7 1、 バン ドパス フィ ルタ 7 2 を経て、 増幅および検波が行なおれる。 バン ド パスフィルタ 7 2 からの受信信号は、 アナログ信号となって ぉリ、 このアナロ グ信号は、 全波整流 · 増幅器 7 3で波形整 形が行なおれる。 その全波整流 ' 増幅器 7 3 からの信号は、 ローパスフィフレタ 74 a, 7 4 bで稜分処理によ り平均化が 行なおれる。 The analog multiplexer 52 switches signals from the respective receiving lines 26 via the CT sensor 51 by the channel switching logic 54 and sequentially outputs the signals in a predetermined frequency. The signal from the analog multiplexer 52 is amplified 100 times by the amplifier 53 (see step 92 in FIG. 16). The received signal passes through a receiving connector 55, an amplifier 71, and a bandpass filter 72, and is amplified and detected. The received signal from the band-pass filter 72 becomes an analog signal, and the analog signal is subjected to waveform shaping by the full-wave rectifier / amplifier 73. The signal from the full-wave rectifier 7amplifier 73 is averaged by edge processing in the low-pass fi lters 74a and 74b.
次に、 受信信号は、 A Z Dコ ンバータ 7 5 に送られる。 A Dコンバータ 7 5は、 例えば、 1 2 ビッ ト等所定のビッ ト 単位でマ ト リ クスセンサ 2 0 からの信号をデジタル信号に変 換し、 シーケンス制御回路 6 3 によ り制御されて検知データ を双方向 R AM 7 6 に記録させる (第 1 6図ステップ 9 3参 照) 。 この処理スピー ドは、 1秒間に 2万 5千回の髙速であ る。 双方向 R A M 7 6は、 シーケンス制御回路 6 3 からの書 込信号にょ リ、 制御装置 3 0の動作とは無閧係に検知データ を記録した後、 1 ク ロ ッ ク を入力することによ リア ドレスを + 1 アップする (第 1 6図ステップ 9 4参照) 。 双方向 R A M 7 6の容量は、 例えば、 2 0 4 8バイ トである。  Next, the received signal is sent to the AZD converter 75. The AD converter 75 converts a signal from the matrix sensor 20 into a digital signal in a predetermined bit unit, for example, 12 bits, and is controlled by the sequence control circuit 63 to detect data. Record on the bi-directional RAM 76 (see step 93 in Fig. 16). This processing speed is 25,000 times per second. The bi-directional RAM 76 records the detection data in response to the write signal from the sequence control circuit 63, regardless of the operation of the control device 30, and then inputs one clock. Raise the rear dress +1 (see step 94 in Fig. 16). The capacity of the bidirectional RAM 76 is, for example, 248 bytes.
次に、 受信回路 5 0 のアナロ グマルチプレクサ 5 2 が、 各 受信線 2 6 からの信号を切り替え (第 1 6図ステップ 9 5參 照) 、 3 2本の受信線 2 6 に応じて、 上記ステップを 3 2回 繰返す (第 1 6 図ステップ 9 6参照) 。 3 2回繰返したなら ば、 送信回路 4 0のアナロ グマルチプレクサ 4 4が送信線 2 2 を切替え (第 1 6図ステップ 9 7参照) 、 再び、 信号処理 を繰返す。 Next, the analog multiplexer 52 of the receiving circuit 50 switches the signal from each receiving line 26 (see step 95 in FIG. 16), and according to the two receiving lines 26, Repeat the steps 32 times (see step 96 in Fig. 16). 3 If this is repeated twice, the analog multiplexer 44 of the transmission circuit 40 switches the transmission line 22 (see step 97 in Fig. 16), and again, the signal processing Is repeated.
こ う して、 受信信号が変化した受信線 2 6 と、 その と き送 信した送信線 2 2 , 2 2 … と を、 スキャ ンニングによ り検出 し、 その交差位置からマ ト リ ク スセンサ 2 0での金属体の位 置を座標と して把握する こ と ができる。 検知単位 2 0 a の個 数は、 送信線 2 2 が 3 2行、 受信線 2 6 が 3 2列で合計 1 0 2 4個であるため、 金属体が盤面 1 1 の どのセーフ孔 1 4 a およびァ ゥ ト孔 1 5 を通過しても検出する こ と ができ る。 双方向 R A M 7 6 は、 受信回路 5 0 からの信号に基づいて 、 受信信号が変化した受信線 2 6 と、 その と き送信 した送信 線 2 2 と の交差位置から、 マ ト リ クスセンサ 2 0での金属体 の位置を、 各送信線 2 2 と各受信線 2 6 と によ る検知単位 2 0 a の検知データ と して記憶する。  In this way, the receiving line 26 whose received signal has changed and the transmitting lines 22, 22,... Transmitted at that time are detected by scanning, and the matrix sensor is detected from the intersection position. The position of the metal body at 20 can be grasped as coordinates. Since the number of detection units 20a is 32 for the transmission line 22 and 32 for the reception line 26, there are a total of 10 2 4 pieces. It can be detected even after passing through a and the hole 15. Based on the signal from the receiving circuit 50, the bidirectional RAM 76 determines the matrix sensor 20 from the intersection of the receiving line 26 where the receiving signal has changed and the transmitting line 22 that transmitted at that time. The position of the metal body at the time is stored as detection data of the detection unit 20a by each transmission line 22 and each reception line 26.
制御装置 3 0 は、 必要に応じて、 読出スタ ー ト信号によ り 双方向 R A M 7 6 に記録された金属体の位置に関する検知デ —タ を読込み、 演算処理を行ない、 検知データ をカー ド 1 7 3 に記憶される金属体の監視データ と対応させて、 金属体を 監視する。  The control device 30 reads the detection data on the position of the metal object recorded in the bidirectional RAM 76 by the read start signal as necessary, performs an arithmetic operation, and stores the detection data in the card. Monitor the metal object in correspondence with the monitoring data of the metal object stored in 173.
制御装置 3 0 は、 この処理を繰返す。 マ ト リ ク スセンサ 2 0 は、 ゲーム機 1 0 の盤面 1 1 での金属体の投入状況等、 そ の動き を座標の変化と して追う こ と ができ る。 ゲーム機 1 0 では、 マ ト リ ク スセンサ 2 0 によ り 、 盤面に投入された金属 体の移動軌跡を検出 して、 ゲームの進行を監視する こ と がで きる。 例えば、 投入された金属体の異常な軌跡を検出する こ とにょ リ、 不正行為の検出を行なう ことができる。 不正行為 と しては、 例えば、 外部から磁石などで、 金属体の運動方向 を故意に曲げることがある。 また、 セーフ孔に入る金属体の 数を計数する こ と によ リ、 金属体がセーフ孔に異常に入リゃ すい状態となっ たゲーム機の存在を発見することができる。 このよ うな機械をそのまま稼働させておく と、 遊技場の経営 に悪影響を与えるため、 稼働を停止させる必要が有る。 従つ て、 金属体が異常にセーフ孔に入 りやすいか否かを調べる こ とは重要である。 Control device 30 repeats this process. The matrix sensor 20 can follow the movement, such as the insertion state of a metal object on the board 11 of the game machine 10, as a change in coordinates. In the game machine 10, the progress of the game can be monitored by detecting the movement trajectory of the metal object put on the board by the matrix sensor 20. For example, detecting an abnormal trajectory of a metal object Anyway, it can detect fraud. As cheating, for example, the direction of movement of a metal body is intentionally bent by a magnet or the like from the outside. In addition, by counting the number of metal objects entering the safe hole, it is possible to detect the presence of a game machine in which the metal object has abnormally entered the safe hole. If such machines continue to operate, the operation of the amusement arcade will be adversely affected, so the operation must be stopped. Therefore, it is important to determine whether a metal body is abnormally easy to enter a safe hole.
カード 1 7 3 は、 新機種のゲーム機 1 0で金属体の状況を 監視する場合には、 それに応じてカードを交換すればよい。 カード 1 7 3 は、 データ処理装置のインターフ —ス部 1 7 6 に揷着するだけで、 監視データのセッ トを容易に行なう こ とができ、 ゲーム機の入替などで多種のゲーム機に適用する 場合にも監視データの変更が容易である。 カード 1 7 3は、 同一機種のゲーム機 1 0 に用いるものであれば、 1 つの力一 ドをコ ビーして製造することができる。 カード 1 7 3は、 よ リ複雑な処理を行なう場合には、 その処理に応じたデ一タ処 理速度の制御装置を自由に選択することによってよ り複雑な 処理に対応することができる。  When monitoring the status of the metal body with the new game machine 10, the card 173 can be replaced accordingly. The card 173 can be easily set for monitoring data simply by attaching it to the interface section 176 of the data processing device, and can be applied to various types of game machines by replacing game machines. In such cases, it is easy to change the monitoring data. The card 173 can be manufactured by copying one force as long as it is used for the same type of game machine 10. When performing more complicated processing, the card 173 can cope with more complicated processing by freely selecting a control device having a data processing speed corresponding to the processing.
なお、 制御装置 3 0は、 金属体検出のアルゴリズムが箇単 なものであるならば、 安価な 8 ビッ 卜の C P Uを用いれば十 分であ り、 複雑なアルゴリズムを必要とする場合には、 高速 処理を行なう ため、 1 6 ビッ ト C P Uを用いるものを選択す る と よい。 いずれの場合にも、 金属体のスキャ ンニングの速 度は、 スキャ ンニングに C P Uを介していないため、 C P U の影響を受ける こ とはない。 In addition, if the algorithm of metal object detection is simple, the controller 30 is sufficient if an inexpensive 8-bit CPU is used, and if a complicated algorithm is required, Select one that uses a 16-bit CPU for high-speed processing. It is good. In any case, the scanning speed of the metal body is not affected by the CPU because the scanning is not performed via the CPU.
また、 送信回路 4 0 と受信回路 5 0 と を敢付けたマ ト リ ク ス I/O 送信 ' 受信ボー ド 1 7 1 は、 取付枠 3 8の下端部 3 8 a に取付け られ、 ゲーム機 1 0の盤面 1 1 を遮らず、 ゲーム にあた り違和感が少ない。  The matrix I / O transmission board 17 1 having the transmission circuit 40 and the reception circuit 50 attached thereto is mounted on the lower end 38 a of the mounting frame 38, and the game machine It does not obstruct the board 11 of 10 and there is little discomfort in the game.
マ ト リ ク スセンサ 2 0 は、 送信コネク タ 6 7 a および受信 コ ネク タ 6 7 b が接合コネク タ 3 7 と着脱可能であるため、 故障した場合にも、 内側ガラス体 1 7 をマ ト リ ク ス I/O 送信 - 受信ボー ド 1 7 1 から取り外して、 容易に交換や取付けを する こ と ができ、 また、 マ ト リ ク スセンサ 2 0 を搭載してい ないゲーム機にマ ト リ ク スセンサ 2 0 を取 り付ける こ と も容 易に行なう こ と ができ る。  Since the transmission connector 67a and the reception connector 67b can be attached to and detached from the junction connector 37, the matrix sensor 20 mates the inner glass body 17 even in the case of failure. RISK I / O SEND-Removable from the receive board 17 1 for easy replacement and installation, and for matrices that do not have a matrix sensor 20 Installation of the cross sensor 20 is also easy.
次に、 本発明の第 2実施例について説明する。 なお、 第 1 実施例と 同様の部位には同一の符号を付し、 重複した説明を 省略する。  Next, a second embodiment of the present invention will be described. The same parts as in the first embodiment are denoted by the same reference numerals, and redundant description will be omitted.
第 1 7図は、 本発明の第 2実施例を示している。 本実施例 では、 第 1 7図に示すよ う に、 マ ト リ ク ス I/O 送信 ' 受信ボ — ド 1 7 1 は、 取付枠 3 8 の側端部 3 8 b 中央の、 盤面 1 1 を覆わない位置 (斜線で示す) に縦長に敢付けられている。 本実施例では、 マ ト リ ク ス I/O 送信 ' 受信ボー ド 1 7 1 に マ ト リ クスセンサ 2 0 の重量がかからないため、 マ ト リ ク ス I/O ^信 ' 受信ボー ド 1 7 1 にマ ト リ ク スセンサ 2 0 からの 振動が伝おリ にく く 、 送受信に振動による影響を受けること がない。 また.、 マ ト リ クス I/O 送信 · 受信ボ一ド 1 7 1 を敢 付枠 3 8 a 内で横方向に移動させることによ り、 マ ト リ クス センサ 2 0の盤面 1 1 に対する位置を、 0〜 2 0 mmの範囲で 調整することができる。 また、 ゲームに際し、 敢付枠 3 8の 側端部 3 8 b側には、 金属体が菊びにく いので、 マ ト リ クス I/O 送信 · 受信ボー ド 1 7 1 は、 金属体による振動の影響を 受けにく い。 FIG. 17 shows a second embodiment of the present invention. In this embodiment, as shown in FIG. 17, the matrix I / O transmission / reception board 17 1 is provided at the side end 38 b of the mounting frame 38 at the center of the board 1. It is attached vertically to the position that does not cover 1 (indicated by diagonal lines). In the present embodiment, the matrix I / O transmission signal reception board 17 1 is not placed on the matrix sensor 20 because the weight of the matrix sensor 20 is not applied to the reception board 17 1. 1 to matrix sensor 20 Vibration is difficult to transmit, and transmission and reception are not affected by the vibration. In addition, by moving the matrix I / O transmission / reception board 17 1 in the horizontal direction within the attachment frame 38 a, the matrix sensor 20 can be moved with respect to the board surface 11. The position can be adjusted in the range of 0 to 20 mm. Also, in the game, since the metal body is hard to chrysanthemum on the side end 38b side of the brace frame 38, the matrix I / O transmission / reception board 17 1 is made of a metal body. Hardly affected by vibration.
次に、 本発明の第 3実施例について説明する。 なお、 第 1 実施例と同様の部位には同一の符号を付し、 重複した説明を 省略する。  Next, a third embodiment of the present invention will be described. The same parts as those in the first embodiment are denoted by the same reference numerals, and redundant description will be omitted.
第 1 8図は、 本発明の第 3実施例を示している。 第 1 8図 に示すよう に、 本実施例のゲーム機は、 盤面 1 1 の下部に金 属体を受ける多数の受け口 1 1 a が設けられている。 このゲ ーム機は、 受け口 1 1 a のいずれかに金属体が入ると、 その 受け口 1 1 a に対応する表示ランプ 1 1 b が点灯し、 その点 灯の組み合おせに応じて賞出を行う よ う になっている。  FIG. 18 shows a third embodiment of the present invention. As shown in FIG. 18, the game machine of this embodiment is provided with a large number of receptacles 11a for receiving a metal body at the lower portion of the board surface 11. In this game machine, when a metal object enters one of the receptacles 11a, the indicator lamp 11b corresponding to the receptacle 11a lights up, and the prize is given according to the combination of the lights. Out.
本実施例では、 マ ト リ クス I/O 送信 ' 受信ボー ド 1 7 1 は 、 取付枠 3 8 の下端部 3 8 aおよぴ両下隅部 3 8 c に、 盤面 In this embodiment, the matrix I / O transmission / reception board 17 1 is attached to the lower end 38 a of the mounting frame 38 and both lower corners 38 c on the board surface.
1 1 を覆わない位置 (斜線で示す) に取付けられている。 本実施例では、 マ ト リ ク ス I/O 送信 ' 受信ボード 1 7 1 の 大部分を雨下隅部 3 8 c に配置したため、 下端部 3 8 a の面 積を少なくする こと ができる。 このため、 下端部 3 8 a の高 さ を低くする こ とができ、 ゲーム機の盤面 1 1 の下部に設け られた金属体の受け口 1 1 a な どのゲーム領域を遮る こ と が ない。 また、 ゲームに際し、 取付枠 3 8 の雨下鹋部 3 8 c 側 には、 金属体が飛びに く いので、 マ ト リ ク ス I/O 送信 , 受信 ボー ド 1 7 1 は、 金属体によ る振動の影響を受けに く い。 1 Installed in a position that does not cover 1 (indicated by diagonal lines). In the present embodiment, most of the matrix I / O transmission / reception board 171 is arranged in the lower corner 38c, so that the area of the lower end 38a can be reduced. For this reason, the height of the lower end 38 a can be reduced, and the lower end 38 a is provided at the lower portion of the game console 11. It does not obstruct the game area such as the metal receptacle 1 1a. In addition, when playing the game, the metal body is hard to fly on the lower side 38c side of the mounting frame 38, so the matrix I / O transmission / reception board 17 1 Hardly affected by vibration due to
なお、 上記各実施例では、 マ ト リ ク スセンサが設けられる 内側ガラス体を、 2枚のガラス基板を用いて構成している が、 本発明は、 これに限られない。 例えば、 1 枚のガラス基板を 用いてもよい。 この場合、 送信線および受信線は、 1 枚のガ ラス基板の一方の面と他方の面と に設け られる。  In each of the above embodiments, the inner glass body provided with the matrix sensor is configured using two glass substrates, but the present invention is not limited to this. For example, a single glass substrate may be used. In this case, the transmission line and the reception line are provided on one surface and the other surface of one glass substrate.
[産業上の利用可能性]  [Industrial applicability]
本発明は、 盤面に沿っ て金属体を運動させる形式のゲーム 機に適用する こ と ができ る。  INDUSTRIAL APPLICABILITY The present invention can be applied to a game machine in which a metal body is moved along a board surface.

Claims

請求の範囲 The scope of the claims
1 . ゲームの媒介物である金属体を蓮動させるためのゲ一 ム域を構成する面を有する盤と、 この盤面上を金属体が運動 する空間を保持させた状態で該盤面を覆う蓋体と、 これらが 取付けられる取付枠と、 蓋体に取付けられ、 金属体を非接触 で検知するための検知単位をマ ト リ ク ス状に配置して構成さ れるマ ト リ ク スセンサと、 このマ ト リ ク スセンサを駆動して、 盤面上の金属体の位置を検出する信号処理部と を備え、 1. A board that has a surface that constitutes a game area for rotating a metal body that is a medium of the game, and a lid that covers the board surface while holding a space on the board surface where the metal body moves. A body, a mounting frame to which these are mounted, a matrix sensor that is mounted on the lid, and is configured by arranging a detection unit for detecting a metal body in a non-contact manner in a matrix. A signal processing unit for driving the matrix sensor to detect the position of the metal body on the panel surface.
信号処理部は、 上記マ ト リ クスセンサと接続される部分を 含む、 少なく とも一部分が、 取付枠で囲まれる空間内の、 上 記ゲーム域の外側に配置されるこ とを特徵とする金属体を媒 介物とするゲーム機。  The signal processing unit is a metal body characterized in that at least a part including a part connected to the matrix sensor is disposed outside the game area in a space surrounded by the mounting frame. A game machine that uses as a medium.
2 . 上記信号処理部は、 上記一部分と して、 マ ト リ クスセ ンサを駆動させるための信号を送信する送信回路と、 マ ト リ クスセンサからの信号を受信する受信回路と を少な く とも搭 载した送信 · 受信ボードを有する請求項 1記載の金属体を媒 介物とするゲーム機。  2. The signal processing unit includes at least a transmitting circuit for transmitting a signal for driving the matrix sensor and a receiving circuit for receiving a signal from the matrix sensor as the above-mentioned parts. The game machine according to claim 1, further comprising a transmission / reception board.
3 . 上記送信 ' 受信ボー ドは、 上記取付枠の下端部に取り 付けられる請求項 2記載の金属体を媒介物とするゲーム機。 3. The game machine according to claim 2, wherein the transmitting and receiving boards are attached to a lower end of the mounting frame.
4 . 上記送信 ' 受信ボー ドは、 上記取付枠の側端部に取り . 付けられる請求項 2記載の金属体を媒介物とするゲーム機 =4. The game machine according to claim 2, wherein the transmission and reception boards are attached to side ends of the mounting frame.
5 . 上記送信 ' 受信ボードは、 上記敢付枠の下端部の二つ のコーナー部に取 り付け られる請求項 2記載の金属体を媒介 物とするゲーム機。 5. The above transmitting and receiving boards are the lower two 3. A game machine using the metal body according to claim 2 attached to a corner of the game machine.
6 . 上記蓋体は、 ゲーム機の表面に位置する表面ガラス体 と、 その内側にある内側ガラス体と を有し、 表面ガラス体と 内側ガラス体とは、 それ らの間に空間を隔てて取付枠に取 り 付け られる請求項 2記載の金属体を媒介物とするゲーム機。 6. The lid has a surface glass body located on the surface of the game machine and an inner glass body inside the surface glass body, and the surface glass body and the inner glass body are separated by a space between them. 3. A game machine using the metal body according to claim 2 mounted on a mounting frame.
7 . 上記マ ト リ ク スセンサは、 内側ガラス体に設け られる 請求項 6記載の金属体を媒介物とするゲーム機。 7. The game machine according to claim 6, wherein the matrix sensor is provided on an inner glass body.
8 . 上記送信 · 受信ボー ドは、 表面ガラス体と内側ガラス 体と の間にある空間に配置される請求項 7記載の金属体を媒 介物とするゲーム機。  8. The game machine according to claim 7, wherein the transmitting / receiving board is disposed in a space between the surface glass body and the inner glass body.
9 . 上記マ ト リ ク スセンサは、 複数本を並列配置した折 り 返し状の送信線と、 複数本を並列配置した折 り返し状の受信 線と を有し、 送信線および受信線は、 内側ガラス体を挟んで 交差する方向に配置され、 各送信線と受信線と の交差部分に 検知単位が形成される請求項 8記載の金属体を媒介物とする ゲーム機。  9. The matrix sensor has a folded transmission line in which a plurality of lines are arranged in parallel and a folded reception line in which a plurality of lines are arranged in parallel. 9. The game machine according to claim 8, wherein the game machine is arranged in a direction intersecting the inner glass body and a detection unit is formed at an intersection of each transmission line and each reception line.
1 0 . 上記内側ガラス体は、 重ね合わされて上記内側ガラ ス体を構成する第 1 および第 2 のガラス基板と を有し、 送信線および受信線は、 上記重ね合わされた第 1 および第 2 のガラス基板の外側の面に、 第 1 およぴ第 2 のガラス基板 を挟んで交差する方向に配置される請求項 9 記載の金属体を 媒介物とするゲーム機。 10. The inner glass body has first and second glass substrates that are overlapped to form the inner glass body, and the transmission line and the reception line are overlapped with the first and second glass substrates. 10. The game machine according to claim 9, wherein the metal body is disposed on an outer surface of the glass substrate in a direction intersecting the first and second glass substrates.
1 1 . 上記送信線および受信線が設けられている第 1 およ ぴ第 2のガラス基板は、 送信線および受信線を含めて、 その 上面に、 保護シー 卜で覆われている請求項 1 0記載の金属体 を媒介物とするゲーム機。 11. The first and second glass substrates provided with the transmission line and the reception line are covered with a protective sheet on the upper surface, including the transmission line and the reception line. A game machine using the metal body according to 0 as a vehicle.
1 2 . 送信線に接続される送信コネク タ と、 受信線に接続 される受信コネク タ と、 これらのコネク タ を固定するための コネク タ取付板と をさ ら に有し、 コネク タ敢付板は、 上記内 側ガラス体の下端部に取 り付け られる請求項 9 記載の金属体 を媒介物とするゲーム機。  1 2. The transmission connector connected to the transmission line, the reception connector connected to the reception line, and a connector mounting plate for fixing these connectors are further provided. The game machine according to claim 9, wherein the plate is attached to a lower end of the inner glass body.
PCT/JP1991/001612 1990-11-24 1991-11-25 Game machine using metallic body as medium WO1992009345A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1019920701713A KR920703163A (en) 1990-11-24 1991-11-25 Game machine using metal body
MC91JP9101612D MC2238A1 (en) 1990-11-24 1991-11-25 GAME MACHINE USING METAL BODIES AS MEANS
EP92902499A EP0513399B1 (en) 1990-11-24 1991-11-25 Game machine using metallic body as medium
DE69126128T DE69126128T2 (en) 1990-11-24 1991-11-25 PLAYER WITH A METAL BODY AS A MEDIUM

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP32036890A JP2700215B2 (en) 1990-11-24 1990-11-24 Pachinko game machine
JP2/320368 1990-11-24

Publications (1)

Publication Number Publication Date
WO1992009345A1 true WO1992009345A1 (en) 1992-06-11

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KR (1) KR920703163A (en)
AT (1) ATE152926T1 (en)
AU (1) AU643345B2 (en)
CA (1) CA2074468C (en)
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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2161646A1 (en) * 1993-04-28 1994-11-10 Takatoshi Takemoto Metallic body detecting apparatus
AU675135B2 (en) * 1993-05-18 1997-01-23 Kabushiki Kaisha Ace Denken Computer system in amusement place

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119379B2 (en) * 1973-10-01 1976-06-17
JPS5215354A (en) * 1975-07-25 1977-02-04 Canon Inc Digitizer
JPS6020276U (en) * 1983-07-20 1985-02-12 オムロン株式会社 Metal ball detection device
JPS60114283A (en) * 1983-11-28 1985-06-20 株式会社ソフィア Pinball game machine
JPS60188393U (en) * 1984-05-22 1985-12-13 ソニー株式会社 Metal object detection device
JPS61181480A (en) * 1985-02-07 1986-08-14 株式会社大一商会 Board for detecting pinball behavior data in pinball machine
JPS63210689A (en) * 1987-02-27 1988-09-01 Yamatake Honeywell Co Ltd Detector for magnetic spherical body

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3868589A (en) * 1972-10-10 1975-02-25 Univ California Thin film devices and lasers
US4058316A (en) * 1976-11-17 1977-11-15 The Seeburg Corporation Electronic control and test circuit for pinball type games
JPS5883328A (en) * 1981-11-12 1983-05-19 Fuji Photo Film Co Ltd Magnetic recording medium
US4378953A (en) * 1981-12-02 1983-04-05 Advanced Semiconductor Products Thin, optical membranes and methods and apparatus for making them
US4927145A (en) * 1988-10-11 1990-05-22 Davis George M Board game apparatus
ATE153251T1 (en) * 1990-10-04 1997-06-15 Ace Denken Kk DEVICE WITH A FUNCTION FOR DETERMINING THE POSITION OF A METAL PART

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5119379B2 (en) * 1973-10-01 1976-06-17
JPS5215354A (en) * 1975-07-25 1977-02-04 Canon Inc Digitizer
JPS6020276U (en) * 1983-07-20 1985-02-12 オムロン株式会社 Metal ball detection device
JPS60114283A (en) * 1983-11-28 1985-06-20 株式会社ソフィア Pinball game machine
JPS60188393U (en) * 1984-05-22 1985-12-13 ソニー株式会社 Metal object detection device
JPS61181480A (en) * 1985-02-07 1986-08-14 株式会社大一商会 Board for detecting pinball behavior data in pinball machine
JPS63210689A (en) * 1987-02-27 1988-09-01 Yamatake Honeywell Co Ltd Detector for magnetic spherical body

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DE69126128D1 (en) 1997-06-19
AU643345B2 (en) 1993-11-11
DE69126128T2 (en) 1998-01-08
EP0513399A4 (en) 1994-03-23
KR920703163A (en) 1992-12-17
AU8913391A (en) 1992-06-25
CA2074468C (en) 1996-12-17
JP2700215B2 (en) 1998-01-19
JPH04189382A (en) 1992-07-07
EP0513399A1 (en) 1992-11-19
EP0513399B1 (en) 1997-05-14

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