USRE47414E1 - Probe for ultrasonic diagnostic apparatus - Google Patents

Probe for ultrasonic diagnostic apparatus Download PDF

Info

Publication number
USRE47414E1
USRE47414E1 US15/201,917 US201615201917A USRE47414E US RE47414 E1 USRE47414 E1 US RE47414E1 US 201615201917 A US201615201917 A US 201615201917A US RE47414 E USRE47414 E US RE47414E
Authority
US
United States
Prior art keywords
layer
backing layer
piezoelectric
piezoelectric layer
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US15/201,917
Inventor
Gil Ju Jin
Jae Yk Kim
Jin Woo JUNG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Medison Co Ltd
Original Assignee
Samsung Medison Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Medison Co Ltd filed Critical Samsung Medison Co Ltd
Priority to US15/201,917 priority Critical patent/USRE47414E1/en
Priority to US15/203,984 priority patent/USRE48051E1/en
Application granted granted Critical
Publication of USRE47414E1 publication Critical patent/USRE47414E1/en
Active legal-status Critical Current
Adjusted expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/42Details of probe positioning or probe attachment to the patient
    • A61B8/4272Details of probe positioning or probe attachment to the patient involving the acoustic interface between the transducer and the tissue
    • A61B8/4281Details of probe positioning or probe attachment to the patient involving the acoustic interface between the transducer and the tissue characterised by sound-transmitting media or devices for coupling the transducer to the tissue
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element
    • B06B1/0659Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element of U-shape
    • GPHYSICS
    • G10MUSICAL INSTRUMENTS; ACOUSTICS
    • G10KSOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/004Mounting transducers, e.g. provided with mechanical moving or orienting device

Definitions

  • the present disclosure relates to probes and, more particularly, to a probe for an ultrasonic diagnostic apparatus that generates internal images of a diagnosis object with ultrasound waves.
  • an ultrasonic diagnostic apparatus refers to a non-invasive apparatus that emits an ultrasound signal from a surface of a patient body towards a target internal organ beneath the body surface and obtains an image of a monolayer or blood flow in soft tissue from information in the reflected ultrasound signal (ultrasound echo-signal).
  • the ultrasonic diagnostic apparatus has been widely used for inspection of the heart, the abdomen, the urinary organs, and in obstetrics and gynecology due to various merits thereof such as small size, low price, real-time image display, and high stability through elimination of radiation exposure, as compared with other image diagnostic systems, such as X-ray diagnostic systems, computerized tomography scanners (CT scanners), magnetic resonance imagers (MRIs), nuclear medicine diagnostic apparatuses, and the like.
  • CT scanners computerized tomography scanners
  • MRIs magnetic resonance imagers
  • nuclear medicine diagnostic apparatuses nuclear medicine diagnostic apparatuses, and the like.
  • the ultrasonic diagnostic apparatus includes a probe which transmits an ultrasound signal to a diagnosis object and receives the ultrasound echo-signal reflected therefrom to obtain ultrasound images of the diagnosis object.
  • the probe includes a transducer, a case open at an upper end thereof, a cover coupled to the open upper end of the case to directly contact the surface of the diagnosis object, and the like.
  • the transducer includes a piezoelectric layer in which a piezoelectric material converts electrical signals into sound signals or vice versa while vibrating, a matching layer reducing a difference in sound impedance between the piezoelectric layer and a diagnosis object to allow as much of the ultrasound waves generated from the piezoelectric layer to be transferred to the diagnosis object as possible, a lens layer focusing the ultrasound waves, emitted from the piezoelectric layer, onto a predetermined point, and a backing layer preventing the ultrasound waves from traveling in a rearward direction of the piezoelectric layer to prevent image distortion.
  • the piezoelectric layer includes a piezoelectric member and electrodes provided to upper and lower ends of the piezoelectric member, respectively. Further, a printed circuit board (PCB) is bonded to the piezoelectric layer. The PCB is formed with wire electrodes connected to the electrodes of the piezoelectric layer to transfer a signal to the piezoelectric layer. The PCB is connected to the piezoelectric layer by connecting the wire electrodes of the PCB to the electrodes of the piezoelectric layer.
  • PCB printed circuit board
  • the probe for an ultrasonic diagnostic apparatus generally includes a planar piezoelectric layer and employs a curved lens.
  • the electrodes When manufacturing the probe for an ultrasonic diagnostic apparatus, the electrodes must be manually connected to the piezoelectric layer, thereby increasing manufacturing time and deteriorating performance of the probe due to low durability and non-uniformity at connected portions. Therefore, there is a need for an improved probe for an ultrasonic diagnostic apparatus.
  • the present disclosure provides a probe for an ultrasonic diagnostic apparatus which may employ a planar lens and is configured to prevent deterioration in performance caused by connection failure between a piezoelectric layer and electrodes.
  • a probe for an ultrasonic diagnostic apparatus includes: a backing layer; a piezoelectric layer disposed on one side of the backing layer; a matching layer disposed on one side of the piezoelectric layer; a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer; and a ground connector disposed outside the signal connector, wherein the backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer.
  • the piezoelectric layer may include a convex piezoelectric portion convexly formed towards the piezoelectric layer.
  • the backing layer may be provided with backing layer electrodes
  • the piezoelectric layer may be provided with a piezoelectric layer electrode contacting the backing layer electrodes
  • the matching layer may be provided with a matching layer electrode contacting the piezoelectric layer electrode
  • an insulator may be provided between the backing layer electrodes to divide the backing layer electrodes into first and second backing layer electrodes.
  • the signal connector and the ground connector may be connected to the first and second backing layer electrodes, respectively, and the signal connector and the ground connector may be disposed in the backing layer and extend in a different direction than the piezoelectric layer.
  • the backing layer may be provided with backing layer electrodes
  • the piezoelectric layer may be provided with a piezoelectric layer electrode, which surrounds the piezoelectric layer such that one side of the piezoelectric layer electrode contacts the backing layer electrodes and the other side of the piezoelectric layer electrode contacts the matching layer
  • an insulator may be provided between the backing layer electrodes to divide the backing layer electrodes into first and second backing layer electrodes.
  • the signal connector and the ground connector may be connected to the first and second backing layer electrodes, respectively, and the signal connector and the ground connector may be disposed in the backing layer and extend in a different direction than the piezoelectric layer.
  • the matching layer may include a convex matching portion convexly formed corresponding to a shape of the convex piezoelectric portion.
  • the probe may further include a lens disposed outside the matching layer and formed at one side thereof with a lens convex portion convexly formed corresponding to a shape of the convex matching portion.
  • the other side of the lens opposite the lens convex portion is a planar surface.
  • the other side of the lens opposite the lens convex portion is convex in a different direction from the lens convex portion.
  • the signal connector and the ground connector may be disposed only inside the backing layer.
  • FIG. 1 is a side sectional view of a probe for an ultrasonic diagnostic apparatus according to one exemplary embodiment of the present disclosure
  • FIG. 2 is a side sectional view of a lens mounted on the probe of FIG. 1 ;
  • FIG. 3 is a side sectional view of a different lens mounted on the probe of FIG. 1 ;
  • FIG. 4 is a side sectional view of a probe for an ultrasonic diagnostic apparatus according to another exemplary embodiment of the present disclosure
  • FIG. 5 is a side sectional view of a lens mounted on the probe of FIG. 4 ;
  • FIG. 6 is a side sectional view of a different lens mounted on the probe of FIG. 4 .
  • FIG. 1 is a side sectional view of a probe for an ultrasonic diagnostic apparatus according to one exemplary embodiment of the present disclosure.
  • a probe 100 for an ultrasonic diagnostic apparatus includes a backing layer 110 , a piezoelectric layer 120 , a matching layer 150 , a signal connector 160 , and a ground connector 170 .
  • the backing layer 110 is disposed on one side of the piezoelectric layer 120 described below.
  • the backing layer 110 suppresses vibration of the piezoelectric layer 120 to reduce the pulse width of ultrasound waves and blocks the ultrasound waves from traveling in a rearward direction of the piezoelectric layer 120 to prevent image distortion.
  • the backing layer 110 is formed with backing layer electrodes 111 , which are divided into first and second backing layer electrodes 112 , 114 by an insulator 125 described below.
  • the piezoelectric layer 120 generates ultrasound waves using a resonance phenomenon.
  • the piezoelectric layer 120 includes a piezoelectric convex portion 121 , which is convex towards the backing layer 110 .
  • the piezoelectric convex portion 121 may have the same width as that of the backing layer 110 or a smaller width than the backing layer 110 .
  • the piezoelectric convex portion 121 may be modified in various ways. In this manner, the piezoelectric layer 120 has a curvature, whereby a planar lens may be applied instead of a curved lens to the probe according to the embodiment. Consequently, a high frequency probe may also use a planar lens by adopting the structure of the probe according to the embodiment.
  • the piezoelectric layer 120 is formed with a piezoelectric layer electrode 122 which contact the backing layer electrodes 111 .
  • the matching layer 150 is disposed on the other side of the piezoelectric layer 120 .
  • the matching layer 150 matches sound impedances between the piezoelectric layer 120 and a diagnosis object to allow as much of the ultrasound signals generated from the piezoelectric layer 120 as possible to be transferred to the diagnosis object.
  • the matching layer 150 includes a first matching layer 130 and a second matching layer 140 , which are made of different materials such that sound impedance changes stepwise from the piezoelectric layer 120 to the diagnosis object.
  • the matching layer 150 includes matching convex portions 131 , 141 , each of which is convexly formed corresponding to the shape of the piezoelectric convex portion 121 .
  • the matching layer 150 is provided with a matching layer electrode 135 which contact the piezoelectric layer electrode 122 .
  • the backing layer 110 , the piezoelectric layer 120 and the matching layer 150 are sequentially disposed adjacent to each other to prevent the signal connector 160 or ground connector 170 from being disposed therebetween. In this manner, the backing layer 110 , the piezoelectric layer 120 and the matching layer 150 are stacked on one another, so that interference from the signal connector 160 or ground connector 170 can be minimized, thereby improving performance of the probe 100 .
  • the signal connector 160 is disposed inside the backing layer 110 and transfers a signal to the piezoelectric layer 120 .
  • the signal connector 160 is electrically connected to the piezoelectric layer 120 at the other side of the piezoelectric layer 120 , as shown in FIG. 1 .
  • the signal connector 160 is connected to the first backing layer electrode 112 .
  • the signal connector 160 is disposed inside the backing layer 110 and extends in a different direction than the piezoelectric layer 120 .
  • the signal connector 160 extends from the first backing layer electrode 112 in a downward direction of the backing layer 110 with reference to FIG. 1 .
  • the ground connector 170 is disposed outside the signal connector 160 .
  • the ground connector 170 is disposed inside the backing layer 110 and extends in a different direction than the piezoelectric layer 120 .
  • the ground connector 170 is connected to the second backing layer electrode 114 and extends from the second backing layer electrode 114 in the downward direction of the backing layer 110 with reference to FIG. 1 .
  • the signal connector 160 and the ground connector 170 be disposed only inside the backing layer 110 so as not to interfere with ultrasound waves generated from the piezoelectric layer 120 .
  • the signal connector 160 and the ground connector 170 are disposed inside the backing layer 110 , thereby achieving improvement in performance of the probe 100 .
  • the signal connector 160 and the ground connector 170 may include printed circuit boards (PCB) or other components capable of supplying a signal or electric power.
  • PCB printed circuit boards
  • the signal connector 160 and the ground connector 170 may be modified in various manners. Operation and behavior of the signal connector 160 and the ground connector 170 are well known in the art, and a detailed description thereof will thus be omitted herein.
  • the insulator 125 is provided between the backing layer electrodes 111 to divide the backing layer electrodes 111 into the first and second backing layer electrodes 112 , 114 .
  • the signal connector 160 is connected to the first backing layer electrode 112 and the ground connector 170 is connected to the second backing layer electrode 114 .
  • the insulator 125 may consist of insulator members separated from each other to divide the backing layer electrodes 111 into the first backing layer electrode 112 connected to the signal connector 160 and the second backing layer electrode 114 connected to the ground connector 170 .
  • an insulation material for the insulator 112 may be interposed between the first and second backing layer electrodes 112 , 114 . As such, the insulator 125 may be modified in various manners.
  • FIG. 2 is a side sectional view of the probe of FIG. 1 , which includes a lens mounted thereon
  • FIG. 3 is a side sectional view of the probe for an ultrasonic diagnostic apparatus of FIG. 1 , which includes a lens different from the lens of FIG. 2
  • the probe 100 according to the embodiment further includes a lens 180 mounted on the matching layer 150 .
  • the lens 180 includes a lens convex portion 181 which is convexly formed corresponding to the shape of the matching convex portions 131 , 141 .
  • one side of the lens 180 is convex towards the matching layer 150 to form the lens convex portion 181 and the other side of the lens 180 opposite the lens convex portion 181 is a planar surface.
  • the probe 100 according to the embodiment enables application of the planar lens even in the case where a curved lens cannot be applied. Specifically, since the probe according to the embodiment can decrease the thickness of the lens, it is possible to improve sensitivity by inhibiting ultrasonic attenuation caused by the lens thickness and to prevent a problem of frequency drop. Consequently, the probe according to the embodiment may be used as a high frequency probe.
  • the other side 182 of the lens 180 opposite the lens convex portion 181 may be convex in a different direction from the lens convex portion 181 , as shown in FIG. 3 .
  • the lens 180 may be modified in various manners.
  • FIG. 4 is a side sectional view of a probe for an ultrasonic diagnostic apparatus according to another exemplary embodiment
  • FIG. 5 is a side sectional view of a lens mounted on the probe of FIG. 4
  • FIG. 6 is a side sectional view of a different lens mounted on the probe of FIG. 4 .
  • a backing layer 110 of a probe 200 for an ultrasonic diagnostic apparatus includes backing layer electrodes 111 .
  • a piezoelectric layer 120 is provided with a piezoelectric layer electrode 122 surrounding the piezoelectric layer 120 such that one side of the piezoelectric layer electrode 122 contacts the backing layer electrodes 111 and the other side of the piezoelectric layer electrode 122 contacts a matching layer 150 .
  • An insulator 125 is interposed between the backing layer electrodes 111 to divide the backing layer electrodes 111 into a first backing layer electrode 112 and a second backing layer electrode 114 .
  • a signal connector 160 is connected to the first backing layer electrode 112 and a ground connector 170 is connected to the second backing layer electrode 114 . Further, the signal connector 160 and the ground connector 170 are disposed inside the backing layer 110 and extend in a different direction than the piezoelectric layer 120 , as shown in FIG. 4 .
  • the backing layer 110 is provided with the signal connector 160 therein and has a curved surface to allow a curved piezoelectric layer 120 to be mounted on the backing layer 110 .
  • the piezoelectric layer electrode 122 surrounds the piezoelectric layer 120 and the insulator 125 is interposed to divide the piezoelectric layer electrode 122 from the backing layer electrodes 111 .
  • the signal connector 160 and the ground connector 170 may be disposed inside the backing layer 110 to permit electrical connection between components.
  • the piezoelectric layer electrode 122 surrounds the piezoelectric layer 120 , the probe may eliminate an operation for bonding electrodes to the matching layer 150 , thereby simplifying a manufacturing process.
  • the probe for an ultrasonic diagnostic apparatus includes a stack of a backing layer, a piezoelectric layer and a matching layer, in which the piezoelectric layer is formed to have a certain curvature, thereby achieving performance improvement by minimization of interference from a signal connector and a ground connector.
  • the probe in the case where a curved lens cannot be applied, the probe enables application of a planar lens and thus decreases the thickness of the lens, thereby improving sensitivity by inhibiting ultrasonic attenuation caused by the lens thickness, while preventing a problem of frequency drop. Accordingly, the probe according to the embodiment may be used as a high frequency probe.
  • the probe includes a piezoelectric layer electrode configured to surround the piezoelectric layer and thus eliminates an operation for bonding electrodes to the matching layer, thereby simplifying a manufacturing process.
  • a signal connector and a ground connector may be bonded inside the backing layer, thereby eliminating a delicate manual soldering process.
  • the probe allows easy connection of components, does not suffer from deterioration in performance caused by a connection failure between the components, and can prevent deterioration in performance of the piezoelectric layer caused by heat generation during manufacture of the probe.
  • the signal connector and the ground connector are bonded inside the backing layer and electrically connected to the piezoelectric layer, instead of being disposed between the backing layer and the piezoelectric layer, so that the probe can prevent deterioration in performance caused by a connection failure between the piezoelectric layer and the signal connector and prevent damage of the ground connector or the signal connector.
  • the signal connector and the ground connector are disposed inside the backing layer, thereby allowing separate manufacture or storage of the backing layer from other components of the probe. Accordingly, backing layers having various desired shapes and sizes may be manufactured and easily assembled with other components, thereby reducing manufacturing costs, facilitating manufacture of the probe, and improving uniformity of finished products.
  • the signal connector may be disposed near the ground connector, thereby reducing noise of the probe.

Abstract

The present disclosure provides a probe for an ultrasonic diagnostic apparatus. The probe includes a backing layer, a piezoelectric layer disposed on one side of the backing layer, a matching layer disposed on one side of the piezoelectric layer, a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer, and a ground connector disposed outside the signal connector. The backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer. The probe for an ultrasonic diagnostic apparatus includes a stack of the backing layer, the piezoelectric layer and the matching layer, in which the piezoelectric layer is formed to have a certain curvature, thereby achieving performance improvement through minimization of interference from a signal connector and a ground connector.

Description

More than one application for reissue has been filed for U.S. Pat. No. 8,773,002, issued Jul. 8, 2014. This reissue application and U.S. patent application Ser. No. 15/203,984, filed Jul. 7, 2017 are both reissues of U.S. Pat. No. 8,773,002. U.S. patent application Ser. No. 15/203,984 is a continuation reissue application of this reissue application. These applications claim benefit of Korean Patent Application No. 10-2010-0086838 filed on Sep. 6, 2010.
BACKGROUND
1. Technical Field
The present disclosure relates to probes and, more particularly, to a probe for an ultrasonic diagnostic apparatus that generates internal images of a diagnosis object with ultrasound waves.
2. Description of the Related Art
Generally, an ultrasonic diagnostic apparatus refers to a non-invasive apparatus that emits an ultrasound signal from a surface of a patient body towards a target internal organ beneath the body surface and obtains an image of a monolayer or blood flow in soft tissue from information in the reflected ultrasound signal (ultrasound echo-signal). The ultrasonic diagnostic apparatus has been widely used for inspection of the heart, the abdomen, the urinary organs, and in obstetrics and gynecology due to various merits thereof such as small size, low price, real-time image display, and high stability through elimination of radiation exposure, as compared with other image diagnostic systems, such as X-ray diagnostic systems, computerized tomography scanners (CT scanners), magnetic resonance imagers (MRIs), nuclear medicine diagnostic apparatuses, and the like.
The ultrasonic diagnostic apparatus includes a probe which transmits an ultrasound signal to a diagnosis object and receives the ultrasound echo-signal reflected therefrom to obtain ultrasound images of the diagnosis object.
The probe includes a transducer, a case open at an upper end thereof, a cover coupled to the open upper end of the case to directly contact the surface of the diagnosis object, and the like.
The transducer includes a piezoelectric layer in which a piezoelectric material converts electrical signals into sound signals or vice versa while vibrating, a matching layer reducing a difference in sound impedance between the piezoelectric layer and a diagnosis object to allow as much of the ultrasound waves generated from the piezoelectric layer to be transferred to the diagnosis object as possible, a lens layer focusing the ultrasound waves, emitted from the piezoelectric layer, onto a predetermined point, and a backing layer preventing the ultrasound waves from traveling in a rearward direction of the piezoelectric layer to prevent image distortion.
The piezoelectric layer includes a piezoelectric member and electrodes provided to upper and lower ends of the piezoelectric member, respectively. Further, a printed circuit board (PCB) is bonded to the piezoelectric layer. The PCB is formed with wire electrodes connected to the electrodes of the piezoelectric layer to transfer a signal to the piezoelectric layer. The PCB is connected to the piezoelectric layer by connecting the wire electrodes of the PCB to the electrodes of the piezoelectric layer.
It should be noted that the above description is provided for understanding of the background art and is not a description of a well-known conventional technique to which the present disclosure pertains.
The probe for an ultrasonic diagnostic apparatus generally includes a planar piezoelectric layer and employs a curved lens. When manufacturing the probe for an ultrasonic diagnostic apparatus, the electrodes must be manually connected to the piezoelectric layer, thereby increasing manufacturing time and deteriorating performance of the probe due to low durability and non-uniformity at connected portions. Therefore, there is a need for an improved probe for an ultrasonic diagnostic apparatus.
BRIEF SUMMARY
The present disclosure provides a probe for an ultrasonic diagnostic apparatus which may employ a planar lens and is configured to prevent deterioration in performance caused by connection failure between a piezoelectric layer and electrodes.
In accordance with one aspect, a probe for an ultrasonic diagnostic apparatus includes: a backing layer; a piezoelectric layer disposed on one side of the backing layer; a matching layer disposed on one side of the piezoelectric layer; a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer; and a ground connector disposed outside the signal connector, wherein the backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer.
The piezoelectric layer may include a convex piezoelectric portion convexly formed towards the piezoelectric layer.
The backing layer may be provided with backing layer electrodes, the piezoelectric layer may be provided with a piezoelectric layer electrode contacting the backing layer electrodes, the matching layer may be provided with a matching layer electrode contacting the piezoelectric layer electrode, and an insulator may be provided between the backing layer electrodes to divide the backing layer electrodes into first and second backing layer electrodes. The signal connector and the ground connector may be connected to the first and second backing layer electrodes, respectively, and the signal connector and the ground connector may be disposed in the backing layer and extend in a different direction than the piezoelectric layer.
The backing layer may be provided with backing layer electrodes, the piezoelectric layer may be provided with a piezoelectric layer electrode, which surrounds the piezoelectric layer such that one side of the piezoelectric layer electrode contacts the backing layer electrodes and the other side of the piezoelectric layer electrode contacts the matching layer, and an insulator may be provided between the backing layer electrodes to divide the backing layer electrodes into first and second backing layer electrodes. The signal connector and the ground connector may be connected to the first and second backing layer electrodes, respectively, and the signal connector and the ground connector may be disposed in the backing layer and extend in a different direction than the piezoelectric layer.
The matching layer may include a convex matching portion convexly formed corresponding to a shape of the convex piezoelectric portion. The probe may further include a lens disposed outside the matching layer and formed at one side thereof with a lens convex portion convexly formed corresponding to a shape of the convex matching portion. In one embodiment, the other side of the lens opposite the lens convex portion is a planar surface. In another embodiment, the other side of the lens opposite the lens convex portion is convex in a different direction from the lens convex portion.
The signal connector and the ground connector may be disposed only inside the backing layer.
BRIEF DESCRIPTION OF THE DRAWINGS
The above and other features and advantages of the present disclosure will become apparent from the following description of exemplary embodiments given in conjunction with the accompanying drawings, in which:
FIG. 1 is a side sectional view of a probe for an ultrasonic diagnostic apparatus according to one exemplary embodiment of the present disclosure;
FIG. 2 is a side sectional view of a lens mounted on the probe of FIG. 1;
FIG. 3 is a side sectional view of a different lens mounted on the probe of FIG. 1;
FIG. 4 is a side sectional view of a probe for an ultrasonic diagnostic apparatus according to another exemplary embodiment of the present disclosure;
FIG. 5 is a side sectional view of a lens mounted on the probe of FIG. 4; and
FIG. 6 is a side sectional view of a different lens mounted on the probe of FIG. 4.
DETAILED DESCRIPTION
Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that the drawings are not to precise scale and may be exaggerated in thickness of lines or size of components for descriptive convenience and clarity only. Furthermore, terms used herein are defined by taking functions of the present disclosure into account and can be changed according to the custom or intention of users or operators. Therefore, definition of the terms should be made according to the overall disclosures set forth herein.
FIG. 1 is a side sectional view of a probe for an ultrasonic diagnostic apparatus according to one exemplary embodiment of the present disclosure.
Referring to FIG. 1, a probe 100 for an ultrasonic diagnostic apparatus according to one exemplary embodiment includes a backing layer 110, a piezoelectric layer 120, a matching layer 150, a signal connector 160, and a ground connector 170.
The backing layer 110 is disposed on one side of the piezoelectric layer 120 described below. The backing layer 110 suppresses vibration of the piezoelectric layer 120 to reduce the pulse width of ultrasound waves and blocks the ultrasound waves from traveling in a rearward direction of the piezoelectric layer 120 to prevent image distortion. In this embodiment, the backing layer 110 is formed with backing layer electrodes 111, which are divided into first and second backing layer electrodes 112, 114 by an insulator 125 described below.
The piezoelectric layer 120 generates ultrasound waves using a resonance phenomenon. The piezoelectric layer 120 includes a piezoelectric convex portion 121, which is convex towards the backing layer 110. The piezoelectric convex portion 121 may have the same width as that of the backing layer 110 or a smaller width than the backing layer 110. As such, the piezoelectric convex portion 121 may be modified in various ways. In this manner, the piezoelectric layer 120 has a curvature, whereby a planar lens may be applied instead of a curved lens to the probe according to the embodiment. Consequently, a high frequency probe may also use a planar lens by adopting the structure of the probe according to the embodiment. The piezoelectric layer 120 is formed with a piezoelectric layer electrode 122 which contact the backing layer electrodes 111.
The matching layer 150 is disposed on the other side of the piezoelectric layer 120. The matching layer 150 matches sound impedances between the piezoelectric layer 120 and a diagnosis object to allow as much of the ultrasound signals generated from the piezoelectric layer 120 as possible to be transferred to the diagnosis object. In this embodiment, the matching layer 150 includes a first matching layer 130 and a second matching layer 140, which are made of different materials such that sound impedance changes stepwise from the piezoelectric layer 120 to the diagnosis object. The matching layer 150 includes matching convex portions 131, 141, each of which is convexly formed corresponding to the shape of the piezoelectric convex portion 121. In this embodiment, the matching layer 150 is provided with a matching layer electrode 135 which contact the piezoelectric layer electrode 122.
The backing layer 110, the piezoelectric layer 120 and the matching layer 150 are sequentially disposed adjacent to each other to prevent the signal connector 160 or ground connector 170 from being disposed therebetween. In this manner, the backing layer 110, the piezoelectric layer 120 and the matching layer 150 are stacked on one another, so that interference from the signal connector 160 or ground connector 170 can be minimized, thereby improving performance of the probe 100.
The signal connector 160 is disposed inside the backing layer 110 and transfers a signal to the piezoelectric layer 120. The signal connector 160 is electrically connected to the piezoelectric layer 120 at the other side of the piezoelectric layer 120, as shown in FIG. 1. In this embodiment, the signal connector 160 is connected to the first backing layer electrode 112. The signal connector 160 is disposed inside the backing layer 110 and extends in a different direction than the piezoelectric layer 120. For example, the signal connector 160 extends from the first backing layer electrode 112 in a downward direction of the backing layer 110 with reference to FIG. 1.
The ground connector 170 is disposed outside the signal connector 160. In this embodiment, the ground connector 170 is disposed inside the backing layer 110 and extends in a different direction than the piezoelectric layer 120. For example, the ground connector 170 is connected to the second backing layer electrode 114 and extends from the second backing layer electrode 114 in the downward direction of the backing layer 110 with reference to FIG. 1.
It is desirable that the signal connector 160 and the ground connector 170 be disposed only inside the backing layer 110 so as not to interfere with ultrasound waves generated from the piezoelectric layer 120. As such, the signal connector 160 and the ground connector 170 are disposed inside the backing layer 110, thereby achieving improvement in performance of the probe 100. Further, the signal connector 160 and the ground connector 170 may include printed circuit boards (PCB) or other components capable of supplying a signal or electric power. As such, the signal connector 160 and the ground connector 170 may be modified in various manners. Operation and behavior of the signal connector 160 and the ground connector 170 are well known in the art, and a detailed description thereof will thus be omitted herein.
The insulator 125 is provided between the backing layer electrodes 111 to divide the backing layer electrodes 111 into the first and second backing layer electrodes 112, 114. The signal connector 160 is connected to the first backing layer electrode 112 and the ground connector 170 is connected to the second backing layer electrode 114. The insulator 125 may consist of insulator members separated from each other to divide the backing layer electrodes 111 into the first backing layer electrode 112 connected to the signal connector 160 and the second backing layer electrode 114 connected to the ground connector 170. Alternatively, an insulation material for the insulator 112 may be interposed between the first and second backing layer electrodes 112, 114. As such, the insulator 125 may be modified in various manners.
FIG. 2 is a side sectional view of the probe of FIG. 1, which includes a lens mounted thereon, and FIG. 3 is a side sectional view of the probe for an ultrasonic diagnostic apparatus of FIG. 1, which includes a lens different from the lens of FIG. 2. Referring to FIG. 2, the probe 100 according to the embodiment further includes a lens 180 mounted on the matching layer 150. The lens 180 includes a lens convex portion 181 which is convexly formed corresponding to the shape of the matching convex portions 131, 141. In one embodiment, one side of the lens 180 is convex towards the matching layer 150 to form the lens convex portion 181 and the other side of the lens 180 opposite the lens convex portion 181 is a planar surface. Thus, the probe 100 according to the embodiment enables application of the planar lens even in the case where a curved lens cannot be applied. Specifically, since the probe according to the embodiment can decrease the thickness of the lens, it is possible to improve sensitivity by inhibiting ultrasonic attenuation caused by the lens thickness and to prevent a problem of frequency drop. Consequently, the probe according to the embodiment may be used as a high frequency probe.
In another embodiment, the other side 182 of the lens 180 opposite the lens convex portion 181 may be convex in a different direction from the lens convex portion 181, as shown in FIG. 3. As such, the lens 180 may be modified in various manners.
FIG. 4 is a side sectional view of a probe for an ultrasonic diagnostic apparatus according to another exemplary embodiment, FIG. 5 is a side sectional view of a lens mounted on the probe of FIG. 4, and FIG. 6 is a side sectional view of a different lens mounted on the probe of FIG. 4.
For convenience of description, the same components as those of the embodiments shown in FIGS. 1 to 3 will be denoted by the same reference numerals, and a detailed description thereof will be omitted herein.
Referring to FIG. 4, a backing layer 110 of a probe 200 for an ultrasonic diagnostic apparatus according to this embodiment includes backing layer electrodes 111. A piezoelectric layer 120 is provided with a piezoelectric layer electrode 122 surrounding the piezoelectric layer 120 such that one side of the piezoelectric layer electrode 122 contacts the backing layer electrodes 111 and the other side of the piezoelectric layer electrode 122 contacts a matching layer 150. An insulator 125 is interposed between the backing layer electrodes 111 to divide the backing layer electrodes 111 into a first backing layer electrode 112 and a second backing layer electrode 114.
In this embodiment, a signal connector 160 is connected to the first backing layer electrode 112 and a ground connector 170 is connected to the second backing layer electrode 114. Further, the signal connector 160 and the ground connector 170 are disposed inside the backing layer 110 and extend in a different direction than the piezoelectric layer 120, as shown in FIG. 4.
According to this embodiment, the backing layer 110 is provided with the signal connector 160 therein and has a curved surface to allow a curved piezoelectric layer 120 to be mounted on the backing layer 110. Further, in this embodiment, the piezoelectric layer electrode 122 surrounds the piezoelectric layer 120 and the insulator 125 is interposed to divide the piezoelectric layer electrode 122 from the backing layer electrodes 111. As such, since the piezoelectric layer electrode 122 is formed to surround the piezoelectric layer 120, the signal connector 160 and the ground connector 170 may be disposed inside the backing layer 110 to permit electrical connection between components. Furthermore, since the piezoelectric layer electrode 122 surrounds the piezoelectric layer 120, the probe may eliminate an operation for bonding electrodes to the matching layer 150, thereby simplifying a manufacturing process.
As such, according to embodiments of the present disclosure, the probe for an ultrasonic diagnostic apparatus includes a stack of a backing layer, a piezoelectric layer and a matching layer, in which the piezoelectric layer is formed to have a certain curvature, thereby achieving performance improvement by minimization of interference from a signal connector and a ground connector.
In addition, in the case where a curved lens cannot be applied, the probe enables application of a planar lens and thus decreases the thickness of the lens, thereby improving sensitivity by inhibiting ultrasonic attenuation caused by the lens thickness, while preventing a problem of frequency drop. Accordingly, the probe according to the embodiment may be used as a high frequency probe.
Further, the probe includes a piezoelectric layer electrode configured to surround the piezoelectric layer and thus eliminates an operation for bonding electrodes to the matching layer, thereby simplifying a manufacturing process.
Further, in the probe for an ultrasonic diagnostic apparatus according to the embodiments, a signal connector and a ground connector may be bonded inside the backing layer, thereby eliminating a delicate manual soldering process. Thus, the probe allows easy connection of components, does not suffer from deterioration in performance caused by a connection failure between the components, and can prevent deterioration in performance of the piezoelectric layer caused by heat generation during manufacture of the probe.
Further, the signal connector and the ground connector are bonded inside the backing layer and electrically connected to the piezoelectric layer, instead of being disposed between the backing layer and the piezoelectric layer, so that the probe can prevent deterioration in performance caused by a connection failure between the piezoelectric layer and the signal connector and prevent damage of the ground connector or the signal connector.
Further, the signal connector and the ground connector are disposed inside the backing layer, thereby allowing separate manufacture or storage of the backing layer from other components of the probe. Accordingly, backing layers having various desired shapes and sizes may be manufactured and easily assembled with other components, thereby reducing manufacturing costs, facilitating manufacture of the probe, and improving uniformity of finished products.
Furthermore, the signal connector may be disposed near the ground connector, thereby reducing noise of the probe.
Although the present disclosure has been described with reference to the embodiments shown in the drawings, it should be understood by those skilled in the art that these embodiments are given by way of illustration only, and that various modifications, variations, and alternations can be made without departing from the spirit and scope of the present disclosure. The scope of the present disclosure should be limited only by the accompanying claims and equivalents thereof.

Claims (7)

What is claimed is:
1. A probe for an ultrasonic diagnostic apparatus, comprising:
a backing layer;
a piezoelectric layer disposed on one side of the backing layer;
a matching layer disposed on one side of the piezoelectric layer;
a signal connector disposed inside the backing layer to transfer a signal to the piezoelectric layer; and
a ground connector disposed outside the signal connector,
wherein the backing layer, the piezoelectric layer and the matching layer are sequentially disposed and the signal connector is electrically connected to the piezoelectric layer at the other side of the piezoelectric layer,
wherein the backing layer is provided with backing layer electrodes including a first backing layer electrode and a second backing layer electrodes electrode, the piezoelectric layer is provided with a first piezoelectric layer electrode contacting the first backing layer electrodes and a second piezoelectric layer electrode, the matching layer is provided with a matching layer electrode contacting the second piezoelectric layer electrode and the second backing layer electrode, and an insulator is provided between the backing layer electrodes to divide the backing layer electrodes into the first backing layer electrode and the second backing layer electrodes electrode,
wherein the first piezoelectric layer electrode contacts the first backing layer electrode,
wherein the signal connector is connected to the first backing layer electrode, and the ground connector are is connected to the first and second backing layer electrodes, respectively electrode, the signal connector and the ground connector being disposed inside the backing layer and extending in a different direction than a direction of the piezoelectric layer.
2. The probe according to claim 1, wherein the piezoelectric layer comprises a convex piezoelectric portion convexly formed towards the piezoelectric backing layer.
3. The probe according to claim 2, wherein the matching layer comprises a convex matching portion convexly formed corresponding to a shape of the convex piezoelectric portion.
4. The probe according to claim 3, further comprising: a lens disposed outside the matching layer and formed at one side thereof of the lens with a lens convex portion convexly formed corresponding to a shape of the convex matching portion.
5. The probe according to claim 4, wherein the other side of the lens opposite the lens convex portion is a planar surface.
6. The probe according to claim 4, wherein the other side of the lens opposite the lens convex portion is convex in a different direction from the lens convex portion.
7. The probe according to claim 1, wherein the signal connector and the ground connector are disposed only inside the backing layer.
US15/201,917 2010-09-06 2016-07-05 Probe for ultrasonic diagnostic apparatus Active 2031-08-29 USRE47414E1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US15/201,917 USRE47414E1 (en) 2010-09-06 2016-07-05 Probe for ultrasonic diagnostic apparatus
US15/203,984 USRE48051E1 (en) 2010-09-06 2016-07-07 Probe for ultrasonic diagnostic apparatus

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2010-0086838 2010-09-06
KR1020100086838A KR101196214B1 (en) 2010-09-06 2010-09-06 Probe for ultrasonic diagnostic apparatus
US13/196,562 US8773002B2 (en) 2010-09-06 2011-08-02 Probe for ultrasonic diagnostic apparatus
US15/201,917 USRE47414E1 (en) 2010-09-06 2016-07-05 Probe for ultrasonic diagnostic apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US13/196,562 Reissue US8773002B2 (en) 2010-09-06 2011-08-02 Probe for ultrasonic diagnostic apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/196,562 Continuation US8773002B2 (en) 2010-09-06 2011-08-02 Probe for ultrasonic diagnostic apparatus

Publications (1)

Publication Number Publication Date
USRE47414E1 true USRE47414E1 (en) 2019-06-04

Family

ID=44939051

Family Applications (3)

Application Number Title Priority Date Filing Date
US13/196,562 Ceased US8773002B2 (en) 2010-09-06 2011-08-02 Probe for ultrasonic diagnostic apparatus
US15/201,917 Active 2031-08-29 USRE47414E1 (en) 2010-09-06 2016-07-05 Probe for ultrasonic diagnostic apparatus
US15/203,984 Active 2031-08-29 USRE48051E1 (en) 2010-09-06 2016-07-07 Probe for ultrasonic diagnostic apparatus

Family Applications Before (1)

Application Number Title Priority Date Filing Date
US13/196,562 Ceased US8773002B2 (en) 2010-09-06 2011-08-02 Probe for ultrasonic diagnostic apparatus

Family Applications After (1)

Application Number Title Priority Date Filing Date
US15/203,984 Active 2031-08-29 USRE48051E1 (en) 2010-09-06 2016-07-07 Probe for ultrasonic diagnostic apparatus

Country Status (4)

Country Link
US (3) US8773002B2 (en)
EP (1) EP2425783B1 (en)
JP (1) JP2012060634A (en)
KR (1) KR101196214B1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101525336B1 (en) * 2011-01-06 2015-06-02 가부시키가이샤 히타치 메디코 Ultrasonic probe
JP5954773B2 (en) * 2012-03-13 2016-07-20 東芝メディカルシステムズ株式会社 Ultrasonic probe and method for manufacturing ultrasonic probe
WO2014010283A1 (en) * 2012-07-10 2014-01-16 オリンパスメディカルシステムズ株式会社 Ultrasonic endoscope
KR20150006519A (en) * 2013-07-08 2015-01-19 삼성메디슨 주식회사 Ultrasound Probe and Manufacturing Method thereof
KR102205505B1 (en) * 2014-03-04 2021-01-20 삼성메디슨 주식회사 Method for manufacturing ultrasonic probe and ultrasonic probe
KR102369731B1 (en) * 2014-12-26 2022-03-04 삼성메디슨 주식회사 Probe and manufacturing method thereof
KR102457217B1 (en) * 2014-12-26 2022-10-21 삼성메디슨 주식회사 Probe and manufacturing method thereof
CN106413563B (en) * 2015-08-25 2020-01-10 深圳迈瑞生物医疗电子股份有限公司 Ultrasonic transducer
KR102627726B1 (en) * 2016-05-10 2024-01-23 삼성메디슨 주식회사 Ultrasound Probe
KR20180056979A (en) * 2016-11-21 2018-05-30 서강대학교산학협력단 Ultrasound transducer having convex-concave surface by using non-stackable flexible printed circuit board and manufacturing method therefor
KR20180097285A (en) * 2017-02-23 2018-08-31 삼성메디슨 주식회사 The Ultrasonic Probe
JP6922300B2 (en) * 2017-03-22 2021-08-18 セイコーエプソン株式会社 Ultrasonic device unit, ultrasonic probe, and ultrasonic device
US11533558B2 (en) 2020-03-30 2022-12-20 Beijing Boe Technology Development Co., Ltd. Acoustic transducer and driving method thereof
KR102462697B1 (en) * 2020-06-18 2022-11-04 지멘스 메디컬 솔루션즈 유에스에이, 인크. Piezoelectric layer of ultrasound transducer, ultrasound transducer, and method of manufacturing piezoelectric layer of ultrasound transducer
CN114887863B (en) * 2022-05-19 2023-07-25 合肥曦合超导科技有限公司 Ultrasonic probe and preparation method thereof
KR102608457B1 (en) * 2022-10-17 2023-12-01 주식회사 소닉랩 Ultrasonic prove and the method of manufacturing the same

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5423220A (en) * 1993-01-29 1995-06-13 Parallel Design Ultrasonic transducer array and manufacturing method thereof
US6104126A (en) 1997-04-18 2000-08-15 Advanced Technology Laboratories, Inc. Composite transducer with connective backing block
WO2002040184A2 (en) 2000-11-15 2002-05-23 Koninklijke Philips Electronics N.V. Multidimensional ultrasonic transducer arrays
US20090034370A1 (en) * 2007-08-03 2009-02-05 Xiaocong Guo Diagnostic ultrasound transducer
KR20100056308A (en) 2008-11-19 2010-05-27 주식회사 메디슨 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
KR20100056309A (en) 2008-11-19 2010-05-27 주식회사 메디슨 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
KR20100083090A (en) 2009-01-12 2010-07-21 주식회사 메디슨 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
EP2226712A1 (en) 2007-12-28 2010-09-08 Hitachi Ltd. Information terminal device, information processing method, and information processing program
US20100324425A1 (en) * 2009-06-23 2010-12-23 Medison Co., Ltd. Transducer For Ultrasonic Diagnosis Device And Method For Manufacturing The Same
KR101137262B1 (en) 2009-03-18 2012-04-20 삼성메디슨 주식회사 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
KR101137261B1 (en) 2009-03-18 2012-04-20 삼성메디슨 주식회사 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04203994A (en) * 1990-11-29 1992-07-24 Matsushita Electric Ind Co Ltd Ultrasonic probe
JPH08275944A (en) * 1995-04-07 1996-10-22 Nippon Dempa Kogyo Co Ltd Arrangement type ultrasonic probe
JPH10112899A (en) * 1996-10-07 1998-04-28 Toshiba Iyou Syst Eng Kk Ultrasonic wave probe
JP2000350964A (en) * 1999-06-10 2000-12-19 Tokin Ceramics Corp Langevin type oscillator fastened by bolt
JP4426513B2 (en) * 2005-07-27 2010-03-03 アロカ株式会社 Ultrasonic probe and manufacturing method thereof
JP5179836B2 (en) * 2007-11-02 2013-04-10 富士フイルム株式会社 Ultrasonic probe
EP2206466A1 (en) * 2009-01-12 2010-07-14 Medison Co., Ltd. Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
JP5045679B2 (en) 2009-01-14 2012-10-10 株式会社豊田自動織機 Lubrication structure in piston type compressor

Patent Citations (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5423220A (en) * 1993-01-29 1995-06-13 Parallel Design Ultrasonic transducer array and manufacturing method thereof
US6038752A (en) 1993-01-29 2000-03-21 Parallel Design, Inc. Method for manufacturing an ultrasonic transducer incorporating an array of slotted transducer elements
US6104126A (en) 1997-04-18 2000-08-15 Advanced Technology Laboratories, Inc. Composite transducer with connective backing block
WO2002040184A2 (en) 2000-11-15 2002-05-23 Koninklijke Philips Electronics N.V. Multidimensional ultrasonic transducer arrays
US20100327698A1 (en) * 2007-08-03 2010-12-30 Mr Holdings (Hk) Ltd. Diagnostic ultrasound transducer
US20090034370A1 (en) * 2007-08-03 2009-02-05 Xiaocong Guo Diagnostic ultrasound transducer
EP2025414A1 (en) 2007-08-03 2009-02-18 MR Holdings (HK) Limited Diagnostic ultrasound transducer
US20110088248A1 (en) * 2007-08-03 2011-04-21 Mr Holdings (Hk) Ltd. Diagnostic ultrasound transducer
EP2226712A1 (en) 2007-12-28 2010-09-08 Hitachi Ltd. Information terminal device, information processing method, and information processing program
KR20100056308A (en) 2008-11-19 2010-05-27 주식회사 메디슨 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
KR20100056309A (en) 2008-11-19 2010-05-27 주식회사 메디슨 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
KR20100083090A (en) 2009-01-12 2010-07-21 주식회사 메디슨 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
KR101137262B1 (en) 2009-03-18 2012-04-20 삼성메디슨 주식회사 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
KR101137261B1 (en) 2009-03-18 2012-04-20 삼성메디슨 주식회사 Probe for ultrasonic diagnostic apparatus and manufacturing method thereof
US9073086B2 (en) 2009-03-18 2015-07-07 Samsung Medison Co., Ltd. Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
US9095879B2 (en) 2009-03-18 2015-08-04 Samsung Medison Co., Ltd. Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
EP2266712A1 (en) 2009-06-23 2010-12-29 Medison Co., Ltd. Transducer for ultrasonic diagnosis device and method for manufacturing the same
US20100324425A1 (en) * 2009-06-23 2010-12-23 Medison Co., Ltd. Transducer For Ultrasonic Diagnosis Device And Method For Manufacturing The Same

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
European Search Report issued in European Patent Application No. 11163291.5 dated Dec. 5, 2011.
Korean Office Action issued in Korean Patent Application No. 10-2010-0086838 dated Jan. 5, 2012.
U.S. Final Office Action dated Apr. 13, 2018 issued in U.S. Appl. No. 15/203,984.

Also Published As

Publication number Publication date
KR20120024130A (en) 2012-03-14
KR101196214B1 (en) 2012-11-05
EP2425783A1 (en) 2012-03-07
US20120056512A1 (en) 2012-03-08
JP2012060634A (en) 2012-03-22
USRE48051E1 (en) 2020-06-16
US8773002B2 (en) 2014-07-08
EP2425783B1 (en) 2015-07-01

Similar Documents

Publication Publication Date Title
USRE47414E1 (en) Probe for ultrasonic diagnostic apparatus
US9538986B2 (en) Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
US9073086B2 (en) Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
US9462996B2 (en) Printed circuit board and probe therewith
US9414809B2 (en) Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
US20100176688A1 (en) Probe for ultrasonic diagnostic apparatus and method of manufacturing the same
US20110074244A1 (en) Ultrasonic probe
US20110133604A1 (en) Ultrasonic diagnostic probe and method of manufacturing the same
US20100125208A1 (en) Probe For Ultrasound System And Method Of Manufacturing The Same
CN211534501U (en) Universal ultrasonic transducer
US11754534B2 (en) Ultrasonic probe and method of manufacturing the same
KR102623559B1 (en) Ultrasound prove

Legal Events

Date Code Title Description
MAFP Maintenance fee payment

Free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY

Year of fee payment: 8