USRE39628E1 - Stackable flex circuit IC package and method of making same - Google Patents
Stackable flex circuit IC package and method of making same Download PDFInfo
- Publication number
- USRE39628E1 USRE39628E1 US10/900,073 US90007304A USRE39628E US RE39628 E1 USRE39628 E1 US RE39628E1 US 90007304 A US90007304 A US 90007304A US RE39628 E USRE39628 E US RE39628E
- Authority
- US
- United States
- Prior art keywords
- conductive pattern
- frame
- flex circuit
- package
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
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Abstract
Description
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/900,073 USRE39628E1 (en) | 1999-05-05 | 2004-07-27 | Stackable flex circuit IC package and method of making same |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/305,584 US6323060B1 (en) | 1999-05-05 | 1999-05-05 | Stackable flex circuit IC package and method of making same |
US09/706,015 US6426549B1 (en) | 1999-05-05 | 2000-11-03 | Stackable flex circuit IC package and method of making same |
US10/900,073 USRE39628E1 (en) | 1999-05-05 | 2004-07-27 | Stackable flex circuit IC package and method of making same |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/706,015 Reissue US6426549B1 (en) | 1999-05-05 | 2000-11-03 | Stackable flex circuit IC package and method of making same |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE39628E1 true USRE39628E1 (en) | 2007-05-15 |
Family
ID=23181406
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/305,584 Expired - Lifetime US6323060B1 (en) | 1999-05-05 | 1999-05-05 | Stackable flex circuit IC package and method of making same |
US09/706,015 Ceased US6426549B1 (en) | 1999-05-05 | 2000-11-03 | Stackable flex circuit IC package and method of making same |
US09/888,792 Expired - Lifetime US6514793B2 (en) | 1999-05-05 | 2001-06-25 | Stackable flex circuit IC package and method of making same |
US10/900,073 Expired - Lifetime USRE39628E1 (en) | 1999-05-05 | 2004-07-27 | Stackable flex circuit IC package and method of making same |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US09/305,584 Expired - Lifetime US6323060B1 (en) | 1999-05-05 | 1999-05-05 | Stackable flex circuit IC package and method of making same |
US09/706,015 Ceased US6426549B1 (en) | 1999-05-05 | 2000-11-03 | Stackable flex circuit IC package and method of making same |
US09/888,792 Expired - Lifetime US6514793B2 (en) | 1999-05-05 | 2001-06-25 | Stackable flex circuit IC package and method of making same |
Country Status (6)
Country | Link |
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US (4) | US6323060B1 (en) |
EP (1) | EP1192658A4 (en) |
JP (1) | JP2002543618A (en) |
KR (1) | KR20020009605A (en) |
HK (1) | HK1045759A1 (en) |
WO (1) | WO2000067314A1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030164551A1 (en) * | 2002-03-04 | 2003-09-04 | Lee Teck Kheng | Method and apparatus for flip-chip packaging providing testing capability |
US20060067070A1 (en) * | 2004-09-28 | 2006-03-30 | Sharp Kabushiki Kaisha | Radio frequency module and manufacturing method thereof |
US20080157332A1 (en) * | 2006-12-29 | 2008-07-03 | Samsung Electronics Co., Ltd. | Stacked semiconductor packages and methods of manufacturing stacked semiconductor packages |
US8237275B2 (en) | 2010-06-21 | 2012-08-07 | Aeroflex Colorado Springs Inc. | Tungsten stiffener for flexible substrate assembly |
US8588017B2 (en) | 2010-10-20 | 2013-11-19 | Samsung Electronics Co., Ltd. | Memory circuits, systems, and modules for performing DRAM refresh operations and methods of operating the same |
US20140291002A1 (en) * | 2013-03-28 | 2014-10-02 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board module |
Families Citing this family (103)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5484959A (en) * | 1992-12-11 | 1996-01-16 | Staktek Corporation | High density lead-on-package fabrication method and apparatus |
US6351029B1 (en) * | 1999-05-05 | 2002-02-26 | Harlan R. Isaak | Stackable flex circuit chip package and method of making same |
US6323060B1 (en) * | 1999-05-05 | 2001-11-27 | Dense-Pac Microsystems, Inc. | Stackable flex circuit IC package and method of making same |
JP2001352035A (en) * | 2000-06-07 | 2001-12-21 | Sony Corp | Assembling jig for multilayer semiconductor device and manufacturing method therefor |
US6660561B2 (en) * | 2000-06-15 | 2003-12-09 | Dpac Technologies Corp. | Method of assembling a stackable integrated circuit chip |
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KR20020009605A (en) | 2002-02-01 |
JP2002543618A (en) | 2002-12-17 |
US6323060B1 (en) | 2001-11-27 |
US20020048849A1 (en) | 2002-04-25 |
EP1192658A1 (en) | 2002-04-03 |
US6426549B1 (en) | 2002-07-30 |
WO2000067314A1 (en) | 2000-11-09 |
HK1045759A1 (en) | 2002-12-06 |
US6514793B2 (en) | 2003-02-04 |
EP1192658A4 (en) | 2004-08-25 |
WO2000067314A9 (en) | 2002-06-06 |
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