USRE35203E - Electron beam array for surface treatment - Google Patents
Electron beam array for surface treatment Download PDFInfo
- Publication number
- USRE35203E USRE35203E US08/497,807 US49780795A USRE35203E US RE35203 E USRE35203 E US RE35203E US 49780795 A US49780795 A US 49780795A US RE35203 E USRE35203 E US RE35203E
- Authority
- US
- United States
- Prior art keywords
- electron beam
- window
- tubes
- stripe
- tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/02—Vessels; Containers; Shields associated therewith; Vacuum locks
- H01J5/18—Windows permeable to X-rays, gamma-rays, or particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
- B29C71/04—After-treatment of articles without altering their shape; Apparatus therefor by wave energy or particle radiation, e.g. for curing or vulcanising preformed articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J33/00—Discharge tubes with provision for emergence of electrons or ions from the vessel; Lenard tubes
- H01J33/02—Details
- H01J33/04—Windows
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
- B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
- B29C35/0866—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation
- B29C2035/0877—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation using particle radiation using electron radiation, e.g. beta-rays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/008—Wide strips, e.g. films, webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3462—Cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/164—Particle-permeable windows
Definitions
- the invention relates to an arrangement of electron beam tubes having stripe-like beam patterns and, in particular, such an arrangement which forms a linear electron beam pattern for treatment of a surface.
- electron beam tubes for treating and processing surfaces typically use 15 micron thick titanium foil as the electron beam window. This requires a minimum operating voltage of 150 kilovolts in order to just penetrate the foil thickness. Typical voltages of at least 175 kilovolts are thus used to allow for the additional energy to process the substrate material.
- An electron beam tube for surface treatment which avoids high voltages is a remote ion source type.
- Such a tube generates a stripe-like electron beam which impinges on a surface in a stripe pattern.
- the beam may be used for surface treatment of materials, such as curing of adhesives, and radiation chemistry in general.
- An example of this type of beam tube is found in U.S. Pat. No. 4,910,435 to G. Wakalopulos, assigned to the assignee of the present invention.
- a long electron beam source shown in FIG. 5 of the '435 patent, wherein a plurality of offset ion sources produce a plasma cloud at the center of a long chamber. The long plasma cloud generates a long electron beam.
- the present invention is concerned with this type of electron beam tube wherein a stripe-like beam is generated.
- An object of the invention was to provide surface treatment with wide electron beams, especially for polymer crosslinking applications, with minimum energy loss at the tube window.
- each beam tube generates a stripe-like electron beam which spans part of the width of material being treated at a relatively low beam voltage, i.e. as low as 15-30 kV.
- the remainder of the width is treated with stripe-like beams from other tubes, the arrangement of tubes having beams spanning the entire width of material.
- Thin tube windows being films or membranes strong enough to withstand atmospheric pressure, allow lower power consumption and more efficient energy coupling.
- Low-Z materials i.e. atomic number less than 20, scatter much fewer electrons than high-Z materials. Beam attenuation is consequently less.
- the window sizes practically available will be several millimeters wide, 1 to 4 inches long and only a few microns thick. This means that in order to get large beam widths for wide web processing, a staggered array is used where tubes of constant diameter are stacked in offset geometries in order to attain wide beam spans as the substrate moves relative to the array.
- a substrate may carry a substance to be cured, such as hot melt adhesive.
- a present day problem with electron beam curing is the necessity of making the beam environment inert in order to eliminate oxygen inhibition of surface cure.
- the beam tubes of the present invention can deliver sufficient energy for curing with low voltage electron beams delivered through thin window membranes. This reduces the requirement for inert environments and makes electron beam treatment through air much more cost competitive with ultraviolet light.
- Preliminary tests indicate that polymerization, cross-linking, and scission differ in low voltage exposure to that of high voltage irradiation. Early tests show a favorable trend towards polymerization at lower electron energies produced by beam tubes of the present invention.
- a tube to be used for the above purpose has a vacuum tube envelope with a base end through which electrodes are fed and a window end which is spaced oppositely from the base end.
- a thin, electron beam permeable, carbide or nitride film, gas impermeable window is disposed in the window end.
- the thin window is made using semiconductor thin film fabrication techniques.
- a silicon wafer is used as a substrate and a thin low pressure chemical vapor deposition (LPCVD) film or membrane of low-Z material, such as carbide or nitride or doped silicon, is deposited on the substrate as a layer and then a small portion of the silicon wafer is etched away leaving the thin carbide or nitride layer supported by the silicon wafer everywhere except where a window has been etched.
- LPCVD thin low pressure chemical vapor deposition
- a doped silicon membrane such as boron doped silicon could also be used.
- the wafer serves as a support for the film layer.
- the layer adheres to the silicon tenaciously so that a pressure difference of at least an atmosphere between the inside and the outside of the tube may be withstood.
- the wafer is trimmed so that only the window portion is used.
- An extended filament disposed near the base of the tube provides a source of thermionic electrons.
- An electron acceleration electrode in the form of a conductive frame surrounding the window has a high positive voltage relative to a beam forming electrode which removes electrons from the vicinity of the filament and propels them toward the thin window after forming and shaping a beam which corresponds in dimensions to the window.
- the beam forming electrode has a parabolic cylindrical shape, with the cylindrical axis parallel to the length of the extended filament. This electrode is negatively charged relative to the acceleration electrode, forcing electrons to form a cloud near the cylindrical axis from where they are extracted by the acceleration electrode.
- a plurality of similar tubes may be mounted with window ends of the tubes supported on a conductive plate in offset or staggered positions. Apertures in the plate correspond to windows of the tubes. The plate makes contact with a conductive rim of each window so that the plate can function as the beam acceleration electrode for each tube at a positive potential. Elongate, stripe-like beams are aligned such that the totality of beams from staggered tubes spans the width of material to be treated. Alternatively, the tubes may be arranged in the array so that the stripe-like beams form nodular beam segments of any desired beam pattern. Such material to be treated is moved beneath the array of beams, either on a table or on rollers. The stripe-like beams traverse an air atmosphere onto the surface of material to be treated.
- the material is moved beneath the beams in a direction so that the beams are transverse to the direction of motion of the material.
- the support plate for the tubes may accommodate a desired number of tubes so that a material of specified width may be treated by the addition or removal of tubes from the support structure.
- the beam tubes described herein are preferred for providing modular beam segments for a desired beam pattern, other types of tubes which generate stripe-like beam patterns and having thin, electron beam permeable, carbide or nitride film windows may be used, such as remote ion source tubes.
- FIG. 1 is a cross-sectional view of a compact electron beam tube in accord with the present invention.
- FIG. 2 is a cutaway orthogonal view of the electron beam tube of FIG. 1 taken along lines 2--2.
- FIG. 3 is a top view of the electron beam tube of FIG. 1.
- FIG. 4a and 4b are plan views of a method for making the thin windows for the electron beam tube of FIG. 1.
- FIG. 5 is a perspective view of a tube array with multiple voltage leads mounted on a support plate in accord with the present invention.
- FIG. 5a is a graph showing dose versus depth for a dual voltage tube array of the type shown in FIG. 5.
- FIGS. 6 and 7 are plan views of the tube arrays with movable material stages.
- FIG. 8 is a plan view of a triangular array for treating linear material, such as cable or wire.
- the electron beam tube 11 is shown having a vacuum tube envelope 13, which may be glass or ceramic, with a base end 15 and a window end 17, spaced apart and opposite from the base end.
- a vacuum tube envelope 13 which may be glass or ceramic, with a base end 15 and a window end 17, spaced apart and opposite from the base end.
- the entire tube is cylindrical, but the base end 15 has a larger circumference than the window end by approximately thirty percent.
- the larger circumference of the base end accommodates tube pins 19.
- a first pin 21 and a second hidden pin are connected to the tube envelope by means of a metal-to-glass seal or feed-through carrying the electrodes 23, 25 into the center of the tube. These electrodes are supported from a respective tube ends and provide mechanical support and electrical contact to a central extended filament 27.
- This filament is a thermionic electron emitter operating as a relatively low voltage, such as 24 volts.
- Tube pins 31, 33 provide mechanical support of an insulative sleeve 35 which provides support for an electron beam forming electrode 37.
- a negative voltage relative to the filament of approximately minus 50-80 kV is carried on a wire 39 running through the center of the tube to the electron beam forming electrode 37. Voltages as low as 15-30 kV may be used with very thin windows. The upper limit of desirable voltage is about 120 kV.
- This beam forming electrode has the function of directing electrons from the extended filament 27 into an elongated central region of the electrode, by repulsion from the electrode walls.
- the beam forming electrode is a parabolic cylinder so that a long stripe-like electron beam, parallel to the filament, is formed.
- the wire 39 is seen to be connected to a tube end 41 after exiting the tube envelope by means of a feed-through.
- the tube envelope is maintained in a vacuum after being pumped down and sealed off by means of a glass seal 43.
- the tube can be pumped down to a pressure of 10 -4 Torr prior to sealing.
- the tube may have an off-on control grid, not shown, for switching the beam off and on.
- a thermionic filament tube has been shown, an indirectly heated cathode tube could also be used.
- a tube window 51 Opposite the extended filament is a tube window 51, made of a thin low-Z layer which is electron beam permeable, but impermeable to gas.
- window 51 maintains a gas-tight seal, keeping the outside atmosphere from penetrating the interior of the tube.
- the window is seated atop an opening 53 in the tube envelope.
- the window could be mounted from the inside of the tube envelope.
- a rectangular conductive frame is joined to the window allowing a positive voltage relative to the beam forming electrode to extract the electron beam from the tube. This voltage, which is ground potential, a high positive potential relative to the beam forming electrode, accelerates electrons from the beam forming electrode toward the window.
- the conductive support frame connected to the periphery of the window carries ground voltage to boundary of window 51 providing an electric field through the window which attracts electrons from beam forming electrode 37.
- Local ground potential is supplied by a mounting plate, discussed below, or from any convenient source.
- the tube envelope 13 is glass or other dielectric, allowing penetration of the electric field from the boundary of window 51 into the vicinity of electrode 37.
- the ground voltage is about 50,000 volts positive relative to the beam forming electrode, thereby establishing an electric field between the interior of the beam forming electrode and the window. Since the window is electron permeable, electrons from electrode 37 are projected through the window.
- the conductive frame draws little current because substantially all electrons pass through the window.
- the entire length of the tube is about 15 cm. excluding pins outside of the tube. The largest circumferential dimension is about 8 cm.
- a 50 kV beam has little penetrating power through polymers. Most of the beam energy is used in polymers for crosslinking and curing of the polymer. Beam energies below 80 kV are preferred for good curing efficiency.
- the beam forming electrode 37 is seen to have a parabolic shape.
- the parabola is elongated parallel to extended filament 27, so that the solid body of electrode 37 is a cylindrical parabola.
- a pair of baffles 57 close a portion of the top of the electrode, but an elongated slit 59 exists, allowing egress of a stripe-like beam which is accelerated toward the window 51.
- the electron beam which is accelerated toward the window 51 is elongated in shape, parallel to extended filament 27.
- the electrons, in a stripe pattern are drawn to the high voltage coating on the window and strike the window with sufficient energy to pass through the window, without attenuation.
- the top face 52 of the tube is seen mounting window 51.
- the window In one direction the window has an elongated dimension 61 while at right angles there is a narrower widthwise dimension 63.
- the elongated dimension of the window is aligned with the corresponding dimension of the beam.
- the window consists of a support portion 65 mounted atop an opening in the end of the tube, surrounded by a conductive frame 75.
- the thin window 51 is in the central portion of the support 65 and has dimensions of several millimeters wide by 1 to 8 inches in length. More practical lengths will be 1-3 inches, which is better suited for mass production.
- the thickness of the thin window is in the range of 3 microns to 7 microns.
- Support 65 is made of silicon as described below. Metal and ceramic supports are also feasible.
- a silicon wafer 71 has a very thin silicon or nitride coating applied by low pressure chemical vapor deposition. Fabrication of a thin film electron window is described in an article entitle "Electron Window Cathode Ray Tube Applications" by L. Hanlon et al. in J. Vacuum Science Technology Bulletin, 4(1), Jan/Feb. 1986. In that article, coatings of silicon carbide, boron nitride and boron carbide are described. However, the windows contemplated in the present invention are much smaller in the lengthwise direction than the CRT windows described in the article. The boundary of the window is mounted in a conductive frame 75, seen in FIG.
- Frame 75 is maintained at ground potential which is nominally zero volts. This is a relatively high voltage compared to the beam forming electrode 37 and so electrons are accelerated toward the window and projected through it.
- Windows may also be made by doping a silicon wafer with a moderate amount of boron, then etching as above, leaving a boron doped silicon membrane, with a thickness less than 20 microns.
- FIG. 4a shows the construction of the thin window where a carbide or a nitride layer 73 is chemically vapor deposited on a silicon wafer 71 to a thickness of between 3 to 20 microns.
- Windows of boron nitride, silicon carbide, silicon nitride, boron carbide, and boron nitride hydride are preferred.
- films may be made by evaporation, etching and cathodic arc vapor deposition.
- FIG. 4b the silicon wafer 71 is etched with a groove 77. Through this groove, the electron beam passes and penetrates window 73 in the zone immediately adjacent to groove 77.
- Support 65 in FIG. 3 corresponds to a cut portion of wafer 71 with dimensions corresponding to the outer dimensions of the window.
- Other types of tubes, such as remote ion source tubes, having similar windows, may be used.
- a plurality of electron beam tubes in rows 81-84 are shown mounted to a support plate 91 in an array of 4 columns of 3 tubes per column. Neighboring columns are offset by one-half the distance between adjacent tubes in a column.
- Support plate 91 is an insulative circuit board wherein each beam tube is electrically insulated from every other tube and is supported by the plate.
- a conductive trace 85 extends to each frame surrounding the thin window of each tube. By means of this trace, ground potential 86 is applied to the vicinity of the thin window of each tube. As mentioned above, the ground potential is a high voltage relative to the beam forming electrode of each tube.
- a current monitor 87 such as an ammeter, measures the amount of current drawn from ground to the tube.
- FIG. 5 shows the array divided into a first section consisting of rows 81 and 82 and the second section consisting of rows 83 and 84.
- the beam forming electrode of rows 81 and 82 has a first voltage applied through cable 88, say 30 kV.
- the second section has a higher negative voltage, say 60 kV applied by cable 89. Cables 88 and 89 carry appropriate voltages for all tube pins, not only the high voltage electrodes.
- the first high voltage, 30 kV being a lower voltage, will affect primarily the surface of the material being treated.
- the second high voltage, 60 kV being a higher voltage, will also affect the surface, but with a greater amount of penetrating power, will also affect a greater depth of material.
- a treatment gradient may be formed, with greater treatment being at the surface and lesser treatment below the surface. It is considered important to have the greatest amount of treatment at upper levels of the surface in applications such as curing of hot melt adhesives.
- the beams are projected through apertures in the plate, corresponding in size to each window.
- the beams are staggered so as to sweep a continuous track across the substrate as the substrate moves under the beam tubes.
- the track is a continuous swathe which will sweep the substrate as the substrate moves relative to the tube array as illustrated in FIGS. 6 and 7.
- the plot shows the penetration of a lower voltage beam, about 30 kV, in plot 80 and the penetration of a high voltage beam, about 60 kV, in plot 82.
- the two plots are summed to compute total dose in a material.
- the low voltage beam has a significant contribution at near zero depth and a rapidly diminishing contribution at just a few microns below the surface.
- the substrate 101 is mounted on a table 103 which may move by means of rollers 105 and 107 in the X and Y directions respectively.
- the beam tubes may be seen to be mounted face down on support plate 109 which is electrically grounded in order that the thin windows at the window end of each tube are at a high positive potential relative to the beam forming electrode.
- the substrate 101 may be seen to have beam exposure regions 113 and 115. These beam traces, if they were in a straight line, would span the width of substrate 101 in a single track. However, because the beam tubes from which these traces emanate are in two rows, the beam traces appear to be segmented stripes which are offset from each other by a distance equal to the lateral separation of the beam tubes.
- the entirety of the substrate may be treated with an electron beam having the width of a track established by beam segments 113 and 115.
- the treatment area is a swathe extending from one edge 117 of the substrate to the opposite end 119.
- the width of the swathe is equal to the length of the track established by segments 113 and 115. As shown in FIG. 6, the entire length and width of the substrate 101 could be treated with an electron beam exposure.
- a web 121 is shown passing beneath a plate 123 having a plurality of electron beam tubes mounted thereon, similar to those shown on plate 109 in FIG. 6.
- These electron beam tubes similar to the beam tubes of FIG. 1, generate offset linear beam segments, 125 and 127.
- These beam segments resemble offset stripes which, if placed in a single line would be a track extending across the width of the web 121.
- the beam segments or stripes if considered in a single track, would span the width of web 121 and allow the entire width of the web to be irradiated with an electron beam.
- the entire length of the web which passes under plate 123 may be irradiated by an electron beam. Several milliamperes beam current per linear inch are required for adequate curing. Such irradiation may be directed to a coating of hot melt which is applied to the web. Hot melt may be applied by a spray applicator, not shown, immediately prior to irradiation by the electron beam.
- a triangular support plate 151 is shown to have sides 153, 154 and 155. These sides mount three electron beam tubes 152, 156 and 158. These tubes are the same type as described with reference to FIG. 1.
- the array of tubes emit strip-like electron beams 163, 164 and 165 which circumscribe the circumference of a cable 170 having a generally circular circumference, which is the surface being treated. As the cable is advanced, its surface is subject to electron beam irradiation from the array of beam tubes.
- the dashed lines in the drawing indicate an exaggerated beam divergence from the tubes which are spaced apart, in air, from the cable surface to be treated. The beams are seen to form a triangle tangent with the surface of the cable. Other shapes which are extruded or linear in character may be similarly treated.
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Electron Sources, Ion Sources (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
- Electron Beam Exposure (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (25)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/497,807 USRE35203E (en) | 1993-05-26 | 1995-07-03 | Electron beam array for surface treatment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/068,052 US5414267A (en) | 1993-05-26 | 1993-05-26 | Electron beam array for surface treatment |
US08/497,807 USRE35203E (en) | 1993-05-26 | 1995-07-03 | Electron beam array for surface treatment |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/068,052 Reissue US5414267A (en) | 1993-05-26 | 1993-05-26 | Electron beam array for surface treatment |
Publications (1)
Publication Number | Publication Date |
---|---|
USRE35203E true USRE35203E (en) | 1996-04-09 |
Family
ID=22080124
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/068,052 Ceased US5414267A (en) | 1993-05-26 | 1993-05-26 | Electron beam array for surface treatment |
US08/497,807 Expired - Lifetime USRE35203E (en) | 1993-05-26 | 1995-07-03 | Electron beam array for surface treatment |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US08/068,052 Ceased US5414267A (en) | 1993-05-26 | 1993-05-26 | Electron beam array for surface treatment |
Country Status (10)
Country | Link |
---|---|
US (2) | US5414267A (en) |
EP (1) | EP0704102B1 (en) |
JP (1) | JPH08510864A (en) |
KR (1) | KR100269911B1 (en) |
AT (1) | ATE169424T1 (en) |
CA (1) | CA2163554C (en) |
DE (1) | DE69412261T2 (en) |
DK (1) | DK0704102T3 (en) |
TW (1) | TW257892B (en) |
WO (1) | WO1994028573A1 (en) |
Cited By (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5968605A (en) | 1997-02-27 | 1999-10-19 | Acushnet Company | Electron beam radiation curable inks for game balls, golf balls and the like |
US6239543B1 (en) | 1999-08-23 | 2001-05-29 | American International Technologies, Inc. | Electron beam plasma formation for surface chemistry |
US6528127B1 (en) | 1999-03-08 | 2003-03-04 | Cryovac, Inc. | Method of providing a printed thermoplastic film having a radiation-cured overprint coating |
US6685883B2 (en) * | 1999-08-27 | 2004-02-03 | Tetra Laval Holdings & Finance S.A. | Method and unit for sterilizing packaging sheet material for manufacturing sealed packages of pourable food products |
US20040099817A1 (en) * | 2002-11-21 | 2004-05-27 | Demos Alexandros T. | Large area source for uniform electron beam generation |
US20040141886A1 (en) * | 2000-02-11 | 2004-07-22 | Daniel Py | Sealed containers and methods of making and filling same |
US20040244694A1 (en) * | 2001-01-10 | 2004-12-09 | Daisuke Hayashi | Processing unit and processing method |
US20050000591A1 (en) * | 2003-05-12 | 2005-01-06 | Daniel Py | Dispenser and apparatus and method for filling a dispenser |
US20050021066A1 (en) * | 2001-08-29 | 2005-01-27 | Hans-Juergen Kuhr | Analytical device with lancet and test element |
US20050019533A1 (en) * | 2000-06-06 | 2005-01-27 | Mossbrook Mendy J. | Printed thermoplastic film with radiation-cured overprint varnish |
US6881969B2 (en) | 2000-12-14 | 2005-04-19 | Ushiodenki Kabushiki Kaisha | Electron beam treatment device |
US20050173020A1 (en) * | 2002-06-19 | 2005-08-11 | Daniel Py | Sterile filling machine having needle filling station within E-Beam chamber |
US20050178462A1 (en) * | 2003-04-28 | 2005-08-18 | Daniel Py | Container with valve assembly for filling and dispensing substances, and apparatus and method for filling |
US20050189379A1 (en) * | 2004-01-27 | 2005-09-01 | Daniel Py | Dispenser having variable-volume storage chamber and depressible one-way valve assembly for dispensing creams and other substances |
US20050196712A1 (en) * | 2002-12-24 | 2005-09-08 | Tadashi Onishi | Film-processing method and film-processing apparatus |
US20050263543A1 (en) * | 2001-10-16 | 2005-12-01 | Daniel Py | Dispenser with sealed chamber, one-way valve and needle penetrable and laser resealable stopper |
US7000806B2 (en) | 2000-10-23 | 2006-02-21 | Medical Instill Technologies, Inc. | Fluid dispenser having a housing and flexible inner bladder |
US7032631B2 (en) | 2000-02-11 | 2006-04-25 | Medical Instill Technologies, Inc. | Medicament vial having a heat-sealable cap, and apparatus and method for filling the vial |
US7038364B2 (en) | 2000-09-07 | 2006-05-02 | Ushio Denki Kabushiki Kaisya | Processor and method for processing |
US20060254542A1 (en) * | 2005-05-10 | 2006-11-16 | Strickler Scott L | Hydraulic valve actuation system with valve lash adjustment |
US20070156102A1 (en) * | 2001-10-03 | 2007-07-05 | Daniel Py | Syringe and reconstitution syringe |
US7243689B2 (en) | 2000-02-11 | 2007-07-17 | Medical Instill Technologies, Inc. | Device with needle penetrable and laser resealable portion and related method |
US20080135130A1 (en) * | 2005-08-01 | 2008-06-12 | Daniel Py | Dispenser with Sealed Chamber, One-Way Valve and Needle Penetrable and Laser Resealable Stopper |
US20080197145A1 (en) * | 2000-10-23 | 2008-08-21 | Daniel Py | Method for Dispensing Ophthalmic Fluid |
US20090043325A1 (en) * | 2000-03-04 | 2009-02-12 | Michael Fritz | Blood lancet with hygienic tip protection |
US7608312B1 (en) | 2000-09-08 | 2009-10-27 | Cryovac, Inc. | Printed antifog film |
US8672195B2 (en) | 2002-08-13 | 2014-03-18 | Medical Instill Technologies, Inc. | Device with chamber and first and second valves in communication therewith, and related method |
US20140158886A1 (en) * | 2012-12-04 | 2014-06-12 | Samsung Electronics Co., Ltd. | Electron beam apparatus |
US9289522B2 (en) | 2012-02-28 | 2016-03-22 | Life Technologies Corporation | Systems and containers for sterilizing a fluid |
WO2019151998A1 (en) * | 2018-01-31 | 2019-08-08 | Hewlett-Packard Development Company, L.P. | Fracture detection in additive manufacturing |
Families Citing this family (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5612588A (en) * | 1993-05-26 | 1997-03-18 | American International Technologies, Inc. | Electron beam device with single crystal window and expansion-matched anode |
CA2126251A1 (en) * | 1994-02-18 | 1995-08-19 | Ronald Sinclair Nohr | Process of enhanced chemical bonding by electron beam radiation |
US5909032A (en) * | 1995-01-05 | 1999-06-01 | American International Technologies, Inc. | Apparatus and method for a modular electron beam system for the treatment of surfaces |
SE507282C2 (en) * | 1995-08-11 | 1998-05-04 | Tetra Laval Holdings & Finance | Ways to sterilize pre-filled packages and use of an electron gun in the method |
US5637953A (en) * | 1996-01-22 | 1997-06-10 | American International Technologies, Inc. | Cathode assembly for a line focus electron beam device |
EP0904594B9 (en) * | 1996-06-12 | 2003-09-10 | Ushio International Technologies, Inc. | Monolithic anode adapted for inclusion in an actinic radiation source and method of manufacturing the same |
US6002202A (en) * | 1996-07-19 | 1999-12-14 | The Regents Of The University Of California | Rigid thin windows for vacuum applications |
KR100488225B1 (en) * | 1996-09-04 | 2005-06-16 | 도요 잉키 세이조 가부시끼가이샤 | Electron beam irradiating method and object to be irradiated with electron beam |
US6407492B1 (en) | 1997-01-02 | 2002-06-18 | Advanced Electron Beams, Inc. | Electron beam accelerator |
US5962995A (en) * | 1997-01-02 | 1999-10-05 | Applied Advanced Technologies, Inc. | Electron beam accelerator |
JP4003838B2 (en) * | 1997-03-18 | 2007-11-07 | ディーエスエム アイピー アセッツ ビー. ブイ | Optical fiber coating and ink curing by low power electron beam irradiation |
DE19816246C1 (en) * | 1998-04-11 | 1999-12-30 | Fraunhofer Ges Forschung | Process for electron irradiation of layers on surfaces of objects and device for carrying out the process |
US7264771B2 (en) * | 1999-04-20 | 2007-09-04 | Baxter International Inc. | Method and apparatus for manipulating pre-sterilized components in an active sterile field |
US6545398B1 (en) | 1998-12-10 | 2003-04-08 | Advanced Electron Beams, Inc. | Electron accelerator having a wide electron beam that extends further out and is wider than the outer periphery of the device |
AU5774800A (en) * | 1999-07-09 | 2001-01-30 | Advanced Electron Beams, Inc. | Electron beam accelerator |
JP2001089199A (en) * | 1999-09-28 | 2001-04-03 | Shin Etsu Chem Co Ltd | Electron beam irradiation equipment and hardening method |
US6653645B1 (en) * | 2000-05-15 | 2003-11-25 | Hsing-Yao Chen | Deflection lens device for electron beam lithography |
WO2002075747A2 (en) | 2001-03-20 | 2002-09-26 | Advanced Electron Beams, Inc. | Electron beam irradiation apparatus |
US6630774B2 (en) * | 2001-03-21 | 2003-10-07 | Advanced Electron Beams, Inc. | Electron beam emitter |
US6750461B2 (en) | 2001-10-03 | 2004-06-15 | Si Diamond Technology, Inc. | Large area electron source |
JP2004013953A (en) * | 2002-06-04 | 2004-01-15 | Toyo Ink Mfg Co Ltd | Optical disk and its manufacturing method |
WO2003103953A1 (en) * | 2002-06-05 | 2003-12-18 | 東洋インキ製造株式会社 | Shrink film, process for producing the same, printing ink, print produced therewith and process for producing print |
CN100380593C (en) * | 2002-12-27 | 2008-04-09 | 东京毅力科创株式会社 | Thin film processing method and system |
JP2004253749A (en) * | 2002-12-27 | 2004-09-09 | Tokyo Electron Ltd | Method and system for treating thin film |
JP2005195469A (en) * | 2004-01-07 | 2005-07-21 | Toyo Ink Mfg Co Ltd | Electron beam irradiation equipment and electron beam irradiation method |
JP2005195468A (en) * | 2004-01-07 | 2005-07-21 | Toyo Ink Mfg Co Ltd | Electron beam irradiation equipment and electron beam irradiation method |
US7075093B2 (en) * | 2004-05-12 | 2006-07-11 | Gorski Richard M | Parallel multi-electron beam lithography for IC fabrication with precise X-Y translation |
JP2006208104A (en) * | 2005-01-26 | 2006-08-10 | Toyo Ink Mfg Co Ltd | Electron beam irradiator and electron beam irradiation method |
DE102005028930A1 (en) * | 2005-06-22 | 2007-01-04 | Technische Universität München | Spectroscopic analyser with charged particles uses a separating membrane system to prevent drift |
DE102006012666A1 (en) * | 2006-03-20 | 2007-09-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device and method for changing the properties of three-dimensional molded parts by means of electrons |
WO2007107211A1 (en) * | 2006-03-20 | 2007-09-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device for altering the characteristics of three-dimensional shaped parts using electrons |
ITMO20060414A1 (en) * | 2006-12-21 | 2008-06-22 | Maria Prudenziati | COMPUTERIZED INNOVATIVE FLEXIBLE PLANT FOR STEP-BY-STEP POLYMERIZATION IN REAL TIME, DURING THE PROCESS OF REALIZATION, RESIN, COMPOSITE OR SIMILAR STRUCTURES |
EP1982920A1 (en) * | 2007-04-19 | 2008-10-22 | Krones AG | Device for sterilising containers |
US20090084574A1 (en) * | 2007-09-28 | 2009-04-02 | Kim Gene Balfour | Poly(arylene ether) composition and its use in the fabrication of extruded articles and coated wire |
JP5634052B2 (en) * | 2009-01-09 | 2014-12-03 | キヤノン株式会社 | Charged particle beam drawing apparatus and device manufacturing method |
WO2012158443A2 (en) | 2011-05-13 | 2012-11-22 | Sheperak Thomas J | Plasma directed electron beam wound care system apparatus and method |
US9240303B2 (en) | 2013-09-10 | 2016-01-19 | Moxtek, Inc. | Dual tube support for electron emitter |
DE102014001344B4 (en) * | 2014-02-02 | 2015-08-20 | Crosslinking AB | Electron beam unit with obliquely oriented to the transport direction Heizkathodendrähten and method for irradiation |
DE102014001342A1 (en) * | 2014-02-02 | 2015-08-06 | Crosslinking AB | Support structure with inclined cooling channels for an electron exit window |
RU2593302C2 (en) * | 2014-04-22 | 2016-08-10 | Общество с ограниченной ответственностью "Центр инноваций и кооперации" | Device for uv led irradiation |
CN109415611A (en) | 2016-06-29 | 2019-03-01 | 3M创新有限公司 | (methyl) acrylate (co) polymer contact adhesive of the crosslinkable thickening of ionising radiation with low acid content |
CN110199374B (en) * | 2016-12-29 | 2021-10-29 | 不列颠哥伦比亚大学 | Optically addressed, thermionic electron beam device |
KR101966794B1 (en) * | 2017-07-12 | 2019-08-27 | (주)선재하이테크 | X-ray tube for improving electron focusing |
EP3664121A1 (en) | 2018-12-05 | 2020-06-10 | ASML Netherlands B.V. | High voltage vacuum feedthrough |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3440466A (en) * | 1965-09-30 | 1969-04-22 | Ford Motor Co | Window support and heat sink for electron-discharge device |
US3617740A (en) * | 1968-10-08 | 1971-11-02 | High Voltage Engineering Corp | Modular electron source for uniformly irradiating the surface of a product |
US3746909A (en) * | 1970-10-26 | 1973-07-17 | Northrop Corp | Area electron flood gun |
US4020354A (en) * | 1975-05-22 | 1977-04-26 | The Goodyear Tire & Rubber Company | Treatment of tire making components |
US4246297A (en) * | 1978-09-06 | 1981-01-20 | Energy Sciences Inc. | Process and apparatus for the curing of coatings on sensitive substrates by electron irradiation |
US4468282A (en) * | 1982-11-22 | 1984-08-28 | Hewlett-Packard Company | Method of making an electron beam window |
US4499405A (en) * | 1981-05-20 | 1985-02-12 | Rpc Industries | Hot cathode for broad beam electron gun |
US4910435A (en) * | 1988-07-20 | 1990-03-20 | American International Technologies, Inc. | Remote ion source plasma electron gun |
US4957835A (en) * | 1987-05-15 | 1990-09-18 | Kevex Corporation | Masked electron beam lithography |
US5093602A (en) * | 1989-11-17 | 1992-03-03 | Charged Injection Corporation | Methods and apparatus for dispersing a fluent material utilizing an electron beam |
US5416440A (en) * | 1990-08-17 | 1995-05-16 | Raychem Corporation | Transmission window for particle accelerator |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2887599A (en) * | 1957-06-17 | 1959-05-19 | High Voltage Engineering Corp | Electron acceleration tube |
US4746909A (en) * | 1986-09-02 | 1988-05-24 | Marcia Israel | Modular security system |
US5254911A (en) * | 1991-11-22 | 1993-10-19 | Energy Sciences Inc. | Parallel filament electron gun |
-
1993
- 1993-05-26 US US08/068,052 patent/US5414267A/en not_active Ceased
-
1994
- 1994-05-23 WO PCT/US1994/005819 patent/WO1994028573A1/en active IP Right Grant
- 1994-05-23 EP EP94919218A patent/EP0704102B1/en not_active Expired - Lifetime
- 1994-05-23 AT AT94919218T patent/ATE169424T1/en not_active IP Right Cessation
- 1994-05-23 DK DK94919218T patent/DK0704102T3/en active
- 1994-05-23 DE DE69412261T patent/DE69412261T2/en not_active Expired - Lifetime
- 1994-05-23 JP JP7500891A patent/JPH08510864A/en active Pending
- 1994-05-23 CA CA002163554A patent/CA2163554C/en not_active Expired - Fee Related
- 1994-05-23 KR KR1019950705259A patent/KR100269911B1/en not_active IP Right Cessation
- 1994-06-04 TW TW083105109A patent/TW257892B/zh not_active IP Right Cessation
-
1995
- 1995-07-03 US US08/497,807 patent/USRE35203E/en not_active Expired - Lifetime
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3440466A (en) * | 1965-09-30 | 1969-04-22 | Ford Motor Co | Window support and heat sink for electron-discharge device |
US3617740A (en) * | 1968-10-08 | 1971-11-02 | High Voltage Engineering Corp | Modular electron source for uniformly irradiating the surface of a product |
US3746909A (en) * | 1970-10-26 | 1973-07-17 | Northrop Corp | Area electron flood gun |
US4020354A (en) * | 1975-05-22 | 1977-04-26 | The Goodyear Tire & Rubber Company | Treatment of tire making components |
US4246297A (en) * | 1978-09-06 | 1981-01-20 | Energy Sciences Inc. | Process and apparatus for the curing of coatings on sensitive substrates by electron irradiation |
US4499405A (en) * | 1981-05-20 | 1985-02-12 | Rpc Industries | Hot cathode for broad beam electron gun |
US4468282A (en) * | 1982-11-22 | 1984-08-28 | Hewlett-Packard Company | Method of making an electron beam window |
US4957835A (en) * | 1987-05-15 | 1990-09-18 | Kevex Corporation | Masked electron beam lithography |
US4910435A (en) * | 1988-07-20 | 1990-03-20 | American International Technologies, Inc. | Remote ion source plasma electron gun |
US5093602A (en) * | 1989-11-17 | 1992-03-03 | Charged Injection Corporation | Methods and apparatus for dispersing a fluent material utilizing an electron beam |
US5416440A (en) * | 1990-08-17 | 1995-05-16 | Raychem Corporation | Transmission window for particle accelerator |
Cited By (94)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5968605A (en) | 1997-02-27 | 1999-10-19 | Acushnet Company | Electron beam radiation curable inks for game balls, golf balls and the like |
US6001898A (en) | 1997-02-27 | 1999-12-14 | Acushnet Company | Electron beam radiation curable inks for game balls, golf balls and the like |
US6528127B1 (en) | 1999-03-08 | 2003-03-04 | Cryovac, Inc. | Method of providing a printed thermoplastic film having a radiation-cured overprint coating |
US6239543B1 (en) | 1999-08-23 | 2001-05-29 | American International Technologies, Inc. | Electron beam plasma formation for surface chemistry |
US6685883B2 (en) * | 1999-08-27 | 2004-02-03 | Tetra Laval Holdings & Finance S.A. | Method and unit for sterilizing packaging sheet material for manufacturing sealed packages of pourable food products |
US7967034B2 (en) | 2000-02-11 | 2011-06-28 | Medical Instill Technologies, Inc. | Device with needle penetrable and laser resealable portion and related method |
US7726352B2 (en) | 2000-02-11 | 2010-06-01 | Medical Instill Technologies, Inc. | Sealed containers and methods of making and filling same |
US9637251B2 (en) | 2000-02-11 | 2017-05-02 | Medinstill Development Llc | Sealed containers and methods of filling and resealing same |
US9549874B2 (en) | 2000-02-11 | 2017-01-24 | Medinstill Development Llc | Device with penetrable and resealable portion and related method |
US9051064B2 (en) | 2000-02-11 | 2015-06-09 | Medinstill Development Llc | Resealable containers and methods of making, filling and resealing same |
US8960242B2 (en) | 2000-02-11 | 2015-02-24 | Medinstill Development Llc | Sealed containers and methods of filling and resealing same |
US7243689B2 (en) | 2000-02-11 | 2007-07-17 | Medical Instill Technologies, Inc. | Device with needle penetrable and laser resealable portion and related method |
US8631838B2 (en) | 2000-02-11 | 2014-01-21 | Medical Instill Technologies, Inc. | Device with penetrable and resealable portion and related method |
US8347923B2 (en) | 2000-02-11 | 2013-01-08 | Medical Instill Technologies, Inc. | Device with penetrable and resealable portion and related method |
US7992597B2 (en) | 2000-02-11 | 2011-08-09 | Medical Instill Technologies, Inc. | Sealed containers and methods of filling and resealing same |
US7980276B2 (en) | 2000-02-11 | 2011-07-19 | Medical Instill Technologies, Inc. | Device with needle penetrable and laser resealable portion and related method |
US20080053561A1 (en) * | 2000-02-11 | 2008-03-06 | Daniel Py | Device with needle penetrable and laser resealable portion and related method |
US7810529B2 (en) | 2000-02-11 | 2010-10-12 | Medical Instill Technologies, Inc. | Device with needle penetrable and laser resealable portion |
US20100236193A1 (en) * | 2000-02-11 | 2010-09-23 | Daniel Py | Sealed Containers and Methods of Filing and Resealing Same |
US20100236659A1 (en) * | 2000-02-11 | 2010-09-23 | Daniel Py | Resealable Containers and Methods of Making, Filling and Resealing Same |
US20040141886A1 (en) * | 2000-02-11 | 2004-07-22 | Daniel Py | Sealed containers and methods of making and filling same |
US7032631B2 (en) | 2000-02-11 | 2006-04-25 | Medical Instill Technologies, Inc. | Medicament vial having a heat-sealable cap, and apparatus and method for filling the vial |
US20080066824A1 (en) * | 2000-02-11 | 2008-03-20 | Daniel Py | Device with needle penetrable and laser resealable portion and related method |
US7726357B2 (en) | 2000-02-11 | 2010-06-01 | Medical Instill Technologies, Inc. | Resealable containers and assemblies for filling and resealing same |
US20080072996A1 (en) * | 2000-02-11 | 2008-03-27 | Daniel Py | Device with Needle Penetrable and Laser Resealable Portion and Related Method |
US20090229702A1 (en) * | 2000-02-11 | 2009-09-17 | Daniel Py | Device with needle penetrable and laser resealable portion and related method |
US7500498B2 (en) | 2000-02-11 | 2009-03-10 | Medical Instill Technologies, Inc. | Device with needle penetrable and laser resealable portion and related method |
US7100646B2 (en) | 2000-02-11 | 2006-09-05 | Medical Instill Technologies, Inc. | Sealed containers and methods of making and filling same |
US7490639B2 (en) | 2000-02-11 | 2009-02-17 | Medical Instill Technologies, Inc. | Device with needle penetrable and laser resealable portion and related method |
US7445033B2 (en) | 2000-02-11 | 2008-11-04 | Medical Instill Technologies, Inc. | Device with needle penetrable and laser resealable portion and related method |
US20070000573A1 (en) * | 2000-02-11 | 2007-01-04 | Daniel Py | Sealed containers and methods of making and filling same |
US20090043325A1 (en) * | 2000-03-04 | 2009-02-12 | Michael Fritz | Blood lancet with hygienic tip protection |
US9901296B2 (en) | 2000-03-04 | 2018-02-27 | Roche Diabetes Care, Inc. | Blood lancet with hygienic tip protection |
US7063882B2 (en) | 2000-06-06 | 2006-06-20 | Cryovac, Inc. | Printed thermoplastic film with radiation-cured overprint varnish |
US20050019533A1 (en) * | 2000-06-06 | 2005-01-27 | Mossbrook Mendy J. | Printed thermoplastic film with radiation-cured overprint varnish |
US7038364B2 (en) | 2000-09-07 | 2006-05-02 | Ushio Denki Kabushiki Kaisya | Processor and method for processing |
US7608312B1 (en) | 2000-09-08 | 2009-10-27 | Cryovac, Inc. | Printed antifog film |
US8240521B2 (en) | 2000-10-23 | 2012-08-14 | Medical Instill Technologies, Inc. | Fluid dispenser having a one-way valve, pump, variable-volume storage chamber, and a needle penetrable and laser resealable portion |
US8757436B2 (en) | 2000-10-23 | 2014-06-24 | Medical Instill Technologies, Inc. | Method for dispensing ophthalmic fluid |
US7000806B2 (en) | 2000-10-23 | 2006-02-21 | Medical Instill Technologies, Inc. | Fluid dispenser having a housing and flexible inner bladder |
US20060131338A1 (en) * | 2000-10-23 | 2006-06-22 | Daniel Py | Fluid dispenser having a one-way valve, pump, variable-volume storage chamber, and a needle penetrable and laser resealable portion |
US20080197145A1 (en) * | 2000-10-23 | 2008-08-21 | Daniel Py | Method for Dispensing Ophthalmic Fluid |
US9668914B2 (en) | 2000-10-23 | 2017-06-06 | Dr. Py Institute Llc | Method for dispensing ophthalmic fluid |
US9725228B2 (en) | 2000-10-23 | 2017-08-08 | Dr. Py Institute Llc | Fluid dispenser having a one-way valve, pump, variable-volume storage chamber, and a needle penetrable and laser resealable portion |
US6881969B2 (en) | 2000-12-14 | 2005-04-19 | Ushiodenki Kabushiki Kaisha | Electron beam treatment device |
US20040244694A1 (en) * | 2001-01-10 | 2004-12-09 | Daisuke Hayashi | Processing unit and processing method |
US9215993B2 (en) | 2001-08-29 | 2015-12-22 | Roche Diagnostics Operations, Inc. | Analytical device with lancet and test element |
US20050021066A1 (en) * | 2001-08-29 | 2005-01-27 | Hans-Juergen Kuhr | Analytical device with lancet and test element |
US20100276035A1 (en) * | 2001-10-03 | 2010-11-04 | Daniel Py | Device with penetrable and resealable portion |
US20070156102A1 (en) * | 2001-10-03 | 2007-07-05 | Daniel Py | Syringe and reconstitution syringe |
US7779609B2 (en) | 2001-10-03 | 2010-08-24 | Medical Instill Technologies, Inc. | Method of filling a device |
US20050263543A1 (en) * | 2001-10-16 | 2005-12-01 | Daniel Py | Dispenser with sealed chamber, one-way valve and needle penetrable and laser resealable stopper |
US7290573B2 (en) | 2001-10-16 | 2007-11-06 | Medical Instill Technologies, Inc. | Dispenser with sealed chamber, one-way valve and needle penetrable and laser resealable stopper |
US8220507B2 (en) | 2001-10-16 | 2012-07-17 | Medical Instill Technologies, Inc. | Dispenser and method for storing and dispensing sterile product |
US9630755B2 (en) | 2001-10-16 | 2017-04-25 | Medinstill Development Llc | Dispenser and method for storing and dispensing sterile product |
US7111649B2 (en) | 2002-06-19 | 2006-09-26 | Medical Instill Technologies, Inc. | Sterile filling machine having needle filling station within e-beam chamber |
US20070079896A1 (en) * | 2002-06-19 | 2007-04-12 | Daniel Py | Sterile filling machine having needle filling station within e-beam chamber |
US9296498B2 (en) | 2002-06-19 | 2016-03-29 | Medinstill Development Llc | Methods of filling a sealed device |
US7556066B2 (en) | 2002-06-19 | 2009-07-07 | Medical Instill Technologies, Inc. | Sterile filling machine having needle filling station and conveyor |
US7905257B2 (en) | 2002-06-19 | 2011-03-15 | Daniel Py | Sterile filling machine having needle filling station and conveyor |
US8448674B2 (en) | 2002-06-19 | 2013-05-28 | Medical Instill Technologies, Inc. | Sterile filling machine having filling station and E-beam chamber |
US20050173020A1 (en) * | 2002-06-19 | 2005-08-11 | Daniel Py | Sterile filling machine having needle filling station within E-Beam chamber |
US6929040B2 (en) | 2002-06-19 | 2005-08-16 | Medical Instill Technologies, Inc. | Sterile filling machine having needle filling station within e-beam chamber |
US8672195B2 (en) | 2002-08-13 | 2014-03-18 | Medical Instill Technologies, Inc. | Device with chamber and first and second valves in communication therewith, and related method |
US20040099817A1 (en) * | 2002-11-21 | 2004-05-27 | Demos Alexandros T. | Large area source for uniform electron beam generation |
US6831284B2 (en) | 2002-11-21 | 2004-12-14 | Applied Materials, Inc. | Large area source for uniform electron beam generation |
US20050196712A1 (en) * | 2002-12-24 | 2005-09-08 | Tadashi Onishi | Film-processing method and film-processing apparatus |
US8272411B2 (en) | 2003-04-28 | 2012-09-25 | Medical Instill Technologies, Inc. | Lyophilization method and device |
US20050178462A1 (en) * | 2003-04-28 | 2005-08-18 | Daniel Py | Container with valve assembly for filling and dispensing substances, and apparatus and method for filling |
US20070084524A1 (en) * | 2003-04-28 | 2007-04-19 | Daniel Py | Container with valve assembly, and apparatus and method for filling |
US7077176B2 (en) | 2003-04-28 | 2006-07-18 | Medical Instill Technologies, Inc. | Container with valve assembly for filling and dispensing substances, and apparatus and method for filling |
US20060124197A1 (en) * | 2003-05-12 | 2006-06-15 | Medical Instill Technologies, Inc. | Dispenser and apparatus and method for filling a dispenser |
US6997219B2 (en) | 2003-05-12 | 2006-02-14 | Medical Instill Technologies, Inc. | Dispenser and apparatus and method for filling a dispenser |
US9963288B2 (en) | 2003-05-12 | 2018-05-08 | Maej Llc | Dispenser and apparatus and method for filling a dispenser |
US7328729B2 (en) | 2003-05-12 | 2008-02-12 | Medical Instill Technologies, Inc. | Dispenser and apparatus and method for filling a dispenser |
US8627861B2 (en) | 2003-05-12 | 2014-01-14 | Medical Instill Technologies, Inc. | Dispenser and apparatus and method for filling a dispenser |
US7861750B2 (en) | 2003-05-12 | 2011-01-04 | Medical Instill Technologies, Inc. | Dispenser and apparatus and method of filling a dispenser |
US20050000591A1 (en) * | 2003-05-12 | 2005-01-06 | Daniel Py | Dispenser and apparatus and method for filling a dispenser |
US8413854B2 (en) | 2004-01-27 | 2013-04-09 | Medical Instill Technologies, Inc. | Dispenser with variable-volume storage chamber, one-way valve, and manually-depressible actuator |
US7886937B2 (en) | 2004-01-27 | 2011-02-15 | Medical Instill Technologies, Inc. | Dispenser with variable-volume storage chamber, one-way valve, and manually-depressible actuator |
US20050189379A1 (en) * | 2004-01-27 | 2005-09-01 | Daniel Py | Dispenser having variable-volume storage chamber and depressible one-way valve assembly for dispensing creams and other substances |
US9377338B2 (en) | 2004-01-27 | 2016-06-28 | Medinstill Development Llc | Dispenser with variable-volume storage chamber, one-way valve, and manually-depressible actuator |
US8919614B2 (en) | 2004-01-27 | 2014-12-30 | Medinstill Development Llc | Dispenser with variable-volume storage chamber, one-way valve, and manually-depressible actuator |
US7644842B2 (en) | 2004-01-27 | 2010-01-12 | Medical Instill Technologies, Inc. | Dispenser having variable-volume storage chamber and depressible one-way valve assembly for dispensing creams and other substances |
US20060254542A1 (en) * | 2005-05-10 | 2006-11-16 | Strickler Scott L | Hydraulic valve actuation system with valve lash adjustment |
US7798185B2 (en) | 2005-08-01 | 2010-09-21 | Medical Instill Technologies, Inc. | Dispenser and method for storing and dispensing sterile food product |
US20080135130A1 (en) * | 2005-08-01 | 2008-06-12 | Daniel Py | Dispenser with Sealed Chamber, One-Way Valve and Needle Penetrable and Laser Resealable Stopper |
US9289522B2 (en) | 2012-02-28 | 2016-03-22 | Life Technologies Corporation | Systems and containers for sterilizing a fluid |
US9737624B2 (en) | 2012-02-28 | 2017-08-22 | Life Technologies Corporation | Systems and containers for sterilzing a fluid |
US10166306B2 (en) | 2012-02-28 | 2019-01-01 | Life Technologies Corporation | Containers and systems for processing a fluid |
US10821197B2 (en) | 2012-02-28 | 2020-11-03 | Life Technologies Corporation | Containers and systems for processing a fluid |
US11833259B2 (en) | 2012-02-28 | 2023-12-05 | Life Technologies Corporation | Containers and systems for processing a fluid |
US20140158886A1 (en) * | 2012-12-04 | 2014-06-12 | Samsung Electronics Co., Ltd. | Electron beam apparatus |
WO2019151998A1 (en) * | 2018-01-31 | 2019-08-08 | Hewlett-Packard Development Company, L.P. | Fracture detection in additive manufacturing |
Also Published As
Publication number | Publication date |
---|---|
EP0704102A1 (en) | 1996-04-03 |
TW257892B (en) | 1995-09-21 |
DK0704102T3 (en) | 1999-05-03 |
EP0704102A4 (en) | 1996-06-12 |
DE69412261T2 (en) | 1999-04-01 |
KR100269911B1 (en) | 2000-10-16 |
WO1994028573A1 (en) | 1994-12-08 |
CA2163554A1 (en) | 1994-12-08 |
JPH08510864A (en) | 1996-11-12 |
CA2163554C (en) | 2003-08-19 |
KR960702672A (en) | 1996-04-27 |
ATE169424T1 (en) | 1998-08-15 |
EP0704102B1 (en) | 1998-08-05 |
US5414267A (en) | 1995-05-09 |
DE69412261D1 (en) | 1998-09-10 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
USRE35203E (en) | Electron beam array for surface treatment | |
US6407399B1 (en) | Uniformity correction for large area electron source | |
TWI416574B (en) | X-ray tube and the use of this X-ray irradiation device | |
US4450031A (en) | Ion shower apparatus | |
US6882095B2 (en) | Electron accelerator having a wide electron beam | |
JPH0132627B2 (en) | ||
US6881969B2 (en) | Electron beam treatment device | |
US3617740A (en) | Modular electron source for uniformly irradiating the surface of a product | |
US3925670A (en) | Electron beam irradiation of materials using rapidly pulsed cold cathodes | |
US10806018B2 (en) | Apparatus for generating accelerated electrons | |
US4079328A (en) | Area beam electron accelerator having plural discrete cathodes | |
US4100450A (en) | Method of and apparatus for generating longitudinal strips of energetic electron beams | |
US3588565A (en) | Low dose rate high output electron beam tube | |
Livesay | Large‐area electron‐beam source | |
JP2005127800A (en) | Electron beam irradiation device, irradiation method, and electron beam lithography system | |
US5175436A (en) | Method of producing high-energy electron curtains with high performance | |
CA2398870A1 (en) | Electron beam array for surface treatment | |
US6774381B2 (en) | Electron beam system for treating filamentary workpiece, and method of fabricating optical fibers | |
JPH07318698A (en) | Electron beam emitter | |
US6877344B2 (en) | Preparation of optical fiber | |
JP2002341100A (en) | Electron beam irradiation device | |
US11901153B2 (en) | X-ray machine | |
KR20010102258A (en) | Electron emitter and method for producing the same | |
SU819850A1 (en) | X-ray pulse sorce | |
JP2002022898A (en) | Electron beam irradiator |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FPAY | Fee payment |
Year of fee payment: 4 |
|
AS | Assignment |
Owner name: USHIO INTERNATIONAL TECHNOLOGIES, INC., CALIFORNIA Free format text: CHANGE OF NAME;ASSIGNOR:AMERICAN INTERNATIONAL TECHNOLOGIES, INC.;REEL/FRAME:012435/0586 Effective date: 20010606 |
|
FPAY | Fee payment |
Year of fee payment: 8 |
|
SULP | Surcharge for late payment |
Year of fee payment: 7 |
|
AS | Assignment |
Owner name: USHIO, INCORPORATED, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:USHIO INTERNATIONAL TECHNOLOGIES, INC.;REEL/FRAME:015251/0575 Effective date: 20040326 |
|
REMI | Maintenance fee reminder mailed | ||
FPAY | Fee payment |
Year of fee payment: 12 |
|
SULP | Surcharge for late payment |
Year of fee payment: 11 |